CN111693547A - Wafer cutting tool detection system and method - Google Patents
Wafer cutting tool detection system and method Download PDFInfo
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- CN111693547A CN111693547A CN202010571875.2A CN202010571875A CN111693547A CN 111693547 A CN111693547 A CN 111693547A CN 202010571875 A CN202010571875 A CN 202010571875A CN 111693547 A CN111693547 A CN 111693547A
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- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
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Abstract
The invention relates to the technical field of wafer cutting, in particular to a wafer cutting tool detection system and a wafer cutting tool detection method, wherein the wafer cutting tool detection system comprises an image pickup module, a data acquisition module and a data acquisition module, wherein the image pickup module is used for acquiring an image of the circumferential surface of a wheel shaft to be detected; and the image comparison module is used for comparing the image acquired by the image pickup module with a preset image feature library to obtain the defect feature position and the defect feature type of the detected wheel shaft circumferential image. The invention realizes the detection of the defects of the circumferential surface of the wheel shaft, the image of the circumferential surface of the wheel shaft to be detected is obtained through the image pickup module and is transmitted to the image comparison module, and the image comparison module compares the obtained image with the preset image feature library, thereby obtaining whether the wheel shaft to be detected has defect features or not and being beneficial to improving the efficiency and the accuracy of the detection of the wheel shaft; and in the detection process, the detected wheel shaft is vertically placed, so that the damage caused by collision between the circumferential surface of the wheel shaft and the placing platform when the wheel shaft is horizontally placed can be avoided.
Description
Technical Field
The invention relates to the technical field of wafer cutting, in particular to a wafer cutting tool detection system and a wafer cutting tool detection method.
Background
The steel wire groove wheel axle is an important device in semiconductor crystal production, and before production, the wire grooves on the steel wire groove wheel axle must be inspected to prevent the wire breakage phenomenon in the production process caused by the groove position defects (such as the ectopic position of a groove peak, the loss of the groove peak and the like) of the steel wire groove wheel axle from causing wafer loss.
At present, the detection of the steel wire groove wheel shaft is manual visual detection, visual detection is very difficult to detect microstructure images of local steel wires and the wheel shaft circumferential surface, defect characteristics are difficult to observe, the defect of the steel wire groove wheel shaft easily causes damage of production equipment, for example, a groove peak between two groove positions of the steel wire groove wheel shaft is lost, after a steel wire is wound, the steel wire is laminated at the position and is difficult to find, after the steel wire continuously runs for a period of time, the laminated steel wire can jump wires, and finally causes serious wire breakage, but sometimes the position of the wire breakage can not be determined once due to wrong opening of the wire groove because of displacement after the wire jumping, so that the wire breakage is often caused again after the machine is adjusted to rewind, even the loss of a wafer is serious, the loss of tens of thousands to hundreds of thousands of each time seriously affects the production efficiency, and improves the production cost.
Disclosure of Invention
The invention aims to provide a wafer cutting tool detection system and method which can detect the circumferential surface of a steel wire groove wheel shaft, obtain the defect characteristic position of the steel wire groove wheel shaft, improve the production efficiency and reduce the production cost.
In order to achieve the above object, the present invention provides a wafer cutting tool inspection system, comprising:
the image shooting module is used for obtaining an image of the circumferential surface of the wheel shaft to be detected;
the image comparison module is used for comparing the image acquired by the image pickup module with a preset image feature library to obtain the defect feature position and the defect feature type of the circumferential image of the detected wheel shaft;
the preset image feature library comprises images of qualified axles and/or images of unqualified axles.
Optionally, the image capturing module includes a CCD camera and a zoom lens, and the zoom lens is mounted at a camera end of the CCD camera.
Optionally, the image comparison module includes a storage module for storing the preset image feature library, an analysis module for comparing the preset image feature library with the image acquired by the image capturing module, and a calibration module for marking a defect feature position on the image acquired by the image capturing module and outputting a defect feature type.
Optionally, the device further comprises a rotating platform, and the rotating platform is used for driving the measured axle to rotate axially when the image capturing module acquires the image of the measured axle, so that the image capturing module acquires images of different positions of the circumferential surface of the measured axle.
Optionally, the device further comprises a rotation control module connected to the rotation platform, and configured to control a rotation rate and an angle of each rotation of the rotation platform when the image capturing module obtains images of different positions of the circumferential surface of the measured wheel axle.
Optionally, the device further comprises a lifting mechanism for driving the image capturing module to move along the axial direction of the wheel shaft.
Based on the above object, the present invention further provides a wafer cutting tool detection method based on the above method, comprising the following steps:
s1, vertically placing the wheel axle to be measured;
s2, obtaining the size parameter of the tested wheel shaft, and selecting a preset image feature library of the corresponding wheel shaft;
s3, acquiring an image A of the circumferential surface of the detected wheel shaft;
s4, comparing the image A with a preset image feature library to obtain whether defect features exist, if so, obtaining the defect feature position and the defect feature type of the detected wheel axle, and performing step S5, otherwise, repeating the step S3 or executing the step S7;
s5, marking the defect characteristic position in the image A;
s6, marking the defect characteristic position of the measured wheel axle;
s7, finishing detection;
the preset image feature library comprises images of qualified wheel shafts and images of unqualified wheel shafts.
Optionally, the image of the unqualified axle includes historical defect features of the axle and corresponding axle defect types, and in step S4, after the image a is compared with the image of the qualified axle to obtain the defect feature position of the measured axle, the image a is compared with the image of the unqualified axle to obtain the defect feature type of the image a.
Optionally, the dimension parameters of the measured axle in step S2 include an outer diameter dimension, a length dimension, a slot width and a slot depth.
Optionally, the step S3 includes:
s3.1, moving along the axial direction of the measured wheel shaft to obtain an image A, wherein the image A is a cambered surface image corresponding to a central angle beta of the measured wheel shaft, and beta is more than 0 degree and less than 180 degrees;
s3.2, rotating the measured wheel shaft by a angle gamma in the vertical direction, and repeating the step S3.1, wherein the gamma is less than or equal to beta;
s3.3, repeating the step S3.2 for n times until n gamma is more than or equal to 360 degrees;
when the image A is compared with a preset image feature library to obtain defect features of the image A and the positions of the defect features are marked in the image A, stopping rotation of the detected wheel shaft, implementing step S6, judging whether n gamma is greater than or equal to 360 degrees, if yes, executing step S7, and if not, repeating step S3.2;
and when the image A is compared with a preset image feature library to obtain that the image A has no defect features, judging whether n gamma is more than or equal to 360 degrees, if so, executing the step S7, otherwise, repeating the step S3.2.
The embodiment of the invention has the following technical effects:
the invention realizes the detection of the defects of the circumferential surface of the wheel shaft, the image of the circumferential surface of the wheel shaft to be detected is obtained through the image pickup module and is transmitted to the image comparison module, and the image comparison module compares the obtained image with the preset image, thereby obtaining whether the wheel shaft to be detected has defect characteristics or not, and being beneficial to improving the efficiency and the accuracy of the detection of the wheel shaft; and in the detection process, the detected wheel shaft is vertically placed, so that the damage caused by collision between the circumferential surface of the wheel shaft and the placing platform when the wheel shaft is horizontally placed can be avoided.
Drawings
FIG. 1 is a schematic diagram of a rotary platform and lift mechanism in accordance with a preferred embodiment of the present invention;
FIG. 2 is a schematic block diagram of a preferred embodiment of the present invention;
fig. 3 is a flow chart of the detection method of the preferred embodiment of the present invention.
Description of reference numerals:
1. the device comprises an image shooting module 11, a CCD camera 12, a zoom lens 2, an image comparison module 21, a storage module 22, an analysis module 23, a calibration module 3, a rotary platform 4, a lifting mechanism 5, a rotary control module 6 and an alarm module.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
Referring to fig. 1-2, one embodiment of the present invention provides a wafer cutting tool inspection system, comprising:
the image shooting module 1 is used for obtaining an image of the circumferential surface of the wheel shaft to be detected;
the image comparison module 2 is used for comparing the image acquired by the image pickup module 1 with a preset image feature library to obtain the defect feature position and the defect feature type of the detected wheel axle circumferential surface image;
the preset image feature library comprises images of qualified axles and/or images of unqualified axles.
The invention realizes the detection of the defects of the circumferential surface of the wheel shaft, the image of the circumferential surface of the wheel shaft to be detected is obtained through the image pickup module 1 and is transmitted to the image comparison module 2, and the image comparison module 2 compares the obtained image with the preset image feature library, thereby obtaining whether the wheel shaft to be detected has defect features or not, being beneficial to improving the efficiency and the accuracy of the wheel shaft detection, avoiding the occurrence of faults in the wafer cutting process, reducing the loss of wafers and lowering the production cost.
Further, the image capturing module 1 in this embodiment includes a CCD camera 11 (the CCD camera 11 is in a security system, and the image generation is mainly from the CCD camera 11 at present, and the CCD is a short for charge coupled device (charge coupled device), which can change light into charges and store and transfer the charges, and can also take out the stored charges to change the voltage, so that the image capturing module is an ideal CCD camera 11 component, and the CCD camera 11 formed by the zoom lens has a small volume, a light weight, is not affected by a magnetic field, has characteristics of vibration and impact resistance and is widely used), and a zoom lens 12, the zoom lens 12 is installed at the image capturing end of the CCD camera 11, and the multiple zooming of the CCD camera 11 is realized by the arrangement of the zoom lens 12, and meanwhile, the CCD camera 11 with higher pixels, such as 3800-4500 ten thousand pixels, is matched with the zoom lens 12 of the multiple zooming, so as to realize the definition and rich details of the image captured by the circumferential surface of the grooved wheel, and the judgment and identification of defect characteristics are facilitated.
The image comparison module 2 comprises a storage module 21 for storing a preset image feature library, an analysis module 22 for comparing an image acquired by the image pickup module with the preset image feature library, and a calibration module 23 for marking a defect feature position and outputting a defect feature type on the image acquired by the image pickup module, wherein the image acquired by the image pickup module 1 is transmitted to the analysis module 22, the analysis module 22 compares the acquired image with the image stored in the storage module 21, so that the defect feature position of the acquired image is obtained, and the calibration module 23 is used for marking, so that a worker can conveniently mark the defect position of the tested grooved pulley according to the mark on the image.
In order to facilitate the placement of the measured axle and the change of the position of the axle in the detection process, the embodiment further comprises a rotating platform 3, which is used for driving the measured axle to rotate axially when the image capturing module 1 acquires the image a, so that the image capturing module 1 acquires images of different positions of the circumferential surface of the measured axle; further, when the axial length of the wheel axle is long, in order to obtain images at different positions of the wheel axle in the axial direction, the embodiment further includes a lifting mechanism 4 for driving the image capturing module 1 to move along the axial direction of the wheel axle.
Further, still include the rotation control module 5 of being connected with rotary platform 3 for when image capture module 1 acquires the global different position image of being surveyed the wheel axle, the rate of 3 rotations of control rotary platform and the angle of rotation at every turn, thereby accessible rotation control module 5 control rotary platform 3 is rotatory to be driven and is surveyed the wheel axle and rotate around vertical direction, be convenient for image capture module 1 acquires the complete image of being surveyed the wheel axle circumference, carry out comprehensive detection to the wheel axle the circumference.
In addition, still include alarm module 6 for the image contrast module 2 reachs and sends out the police dispatch newspaper when being surveyed the wheel spindle circumference image and having the defect characteristic, and the convenience is when discovering the defect characteristic, and the workman in time marks the wheel spindle that is surveyed, improves the efficiency of work, simultaneously, through setting up display and image contrast module 2 communication connection, makes the workman can more audio-visually acquire the position of being surveyed the wheel spindle defect characteristic.
Referring to fig. 3, based on the above-mentioned detection system, the present invention further provides a wafer cutting tool detection method, including the following steps:
s1, vertically placing the wheel axle to be measured;
s2, obtaining the size parameter of the tested wheel shaft, and selecting a preset image feature library of the corresponding wheel shaft;
s3, acquiring an image A of the circumferential surface of the detected wheel shaft;
s4, comparing the image A with a preset image feature library to obtain whether defect features exist, if so, obtaining the defect feature position and the defect feature type of the detected wheel axle, and performing step S5, otherwise, repeating the step S3 or executing the step S7;
s5, marking the defect characteristic position in the image A;
s6, marking the defect characteristic position of the measured wheel axle;
s7, finishing detection;
the preset image feature library comprises images of qualified wheel shafts and images of unqualified wheel shafts.
In addition, the image of the unqualified wheel axle comprises historical defect characteristics of the wheel axle and corresponding wheel axle defect types, in the step S4, after the image A is compared with the image of the qualified wheel axle to obtain the defect characteristic position of the detected wheel axle, the image A is compared with the image of the unqualified wheel axle to obtain the defect characteristic type of the image A, the detected wheel axle can be conveniently classified according to different defect types, and therefore an analysis detection report is formed.
In order to facilitate comparison by selecting the wheel axle gallery corresponding to the preset image according to the wheel axles with different size parameters, the detection method of the embodiment includes that the size parameters of the measured wheel axle in step S2 include an outer diameter size, a length size, a slot width and a slot depth of the slot, so that the corresponding wheel axle gallery can be quickly selected for comparison, and the comparison efficiency and accuracy are improved.
In order to further realize complete detection of the circumferential surface of the detected axle, step S3 of the present embodiment includes:
s3.1, moving along the axial direction of the measured wheel shaft to obtain an image A, wherein the image A is a cambered surface image corresponding to the central angle beta of the measured wheel shaft, and the angle beta is more than 0 degree and less than 180 degrees;
s3.2, rotating the measured wheel shaft by a angle gamma in the vertical direction, and repeating the step S3.1, wherein the gamma is less than or equal to beta;
s3.3, repeating the step S3.2 for n times until n gamma is more than or equal to 360 degrees;
when the image A is compared with a preset image feature library to obtain defect features of the image A and the defect feature position of the image A is marked, stopping rotation of the wheel shaft to be detected, implementing step S6, judging whether n gamma is greater than or equal to 360 degrees, if yes, executing step S7, otherwise, repeating step S3.2, thereby obtaining an image of 360 degrees of the circumferential surface of the wheel shaft to be detected for detection, and timely marking the defect features of the wheel shaft to be detected;
and when the image A is compared with a preset image feature library to obtain that the image A has no defect features, judging whether n gamma is more than or equal to 360 degrees, if so, executing the step S7, otherwise, repeating the step S3.2, and forming a detection report after the detection is finished.
In conclusion, the invention realizes the detection of the defects of the circumferential surface of the wheel shaft, the image of the circumferential surface of the wheel shaft to be detected is obtained through the image pickup module 1 and is transmitted to the image comparison module 2, and the image comparison module 2 compares the obtained image with the preset image, so as to obtain whether the wheel shaft to be detected has defect characteristics or not, thereby being beneficial to improving the efficiency and the accuracy of the detection of the wheel shaft; and in the detection process, the detected wheel shaft is vertically placed, so that the damage caused by collision between the circumferential surface preset image feature library of the wheel shaft and the placing platform when the wheel shaft is horizontally placed can be avoided.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and substitutions can be made without departing from the technical principle of the present invention, and these modifications and substitutions should also be regarded as the protection scope of the present invention.
Claims (10)
1. A wafer cutting tool inspection system, comprising:
the image shooting module is used for obtaining an image of the circumferential surface of the wheel shaft to be detected;
the image comparison module is used for comparing the image acquired by the image pickup module with a preset image feature library to obtain the defect feature position and the defect feature type of the circumferential image of the detected wheel shaft;
the preset image feature library comprises images of qualified axles and/or images of unqualified axles.
2. The wafer cutting tool inspection system of claim 1, wherein the image capture module comprises a CCD camera and a zoom lens mounted to an image capture end of the CCD camera.
3. The wafer cutting tool inspection system of claim 1, wherein the image comparison module comprises a storage module for storing the predetermined image feature library, an analysis module for comparing the predetermined image feature library with the image obtained by the image capture module, and a calibration module for marking a defect feature location on the image obtained by the image capture module and outputting a defect feature type.
4. The wafer cutting tool inspection system of claim 1, further comprising a rotation platform for driving the axis of the wheel to be inspected to rotate axially when the image capturing module captures the image of the axis of the wheel to be inspected, so that the image capturing module captures images of different positions of the circumference of the axis of the wheel to be inspected.
5. The wafer cutting tool detection system of claim 4, further comprising a rotation control module connected to the rotation platform for controlling the rotation speed and the rotation angle of the rotation platform when the image capturing module obtains the images of different positions of the circumference of the measured wheel shaft.
6. The wafer cutting tool inspection system of claim 1, further comprising a lifting mechanism for moving the image capture module in an axial direction of the wheel shaft.
7. A wafer cutting tool inspection method according to any one of claims 1 to 6, comprising the steps of:
s1, vertically placing the wheel axle to be measured;
s2, obtaining the size parameter of the tested wheel shaft, and selecting a preset image feature library of the corresponding wheel shaft;
s3, acquiring an image A of the circumferential surface of the detected wheel shaft;
s4, comparing the image A with a preset image feature library to obtain whether defect features exist, if so, obtaining the defect feature position and the defect feature type of the detected wheel axle, and performing step S5, otherwise, repeating the step S3 or executing the step S7;
s5, marking the defect characteristic position in the image A;
s6, marking the defect characteristic position of the measured wheel axle;
s7, finishing detection;
the preset image feature library comprises images of qualified wheel shafts and images of unqualified wheel shafts.
8. The method as claimed in claim 7, wherein the image of the defective axle includes historical defect features of the axle and corresponding defect types of the axle, and the step S4 is performed by comparing the image a with the image of the defective axle to obtain the defect feature position of the tested axle, and then comparing the image a with the image of the defective axle to obtain the defect feature type of the image a.
9. The wafer cutting tool inspection method of claim 7, wherein the dimensional parameters of the tested wheel spindle in step S2 include an outer diameter dimension, a length dimension, a wire groove width and a wire groove depth.
10. The wafer cutting tool inspection method according to claim 7, wherein the step S3 includes:
s3.1, moving along the axial direction of the measured wheel shaft to obtain an image A, wherein the image A is a cambered surface image corresponding to a central angle beta of the measured wheel shaft, and beta is more than 0 degree and less than 180 degrees;
s3.2, rotating the measured wheel shaft by a angle gamma in the vertical direction, and repeating the step S3.1, wherein the gamma is less than or equal to beta;
s3.3, repeating the step S3.2 for n times until n gamma is more than or equal to 360 degrees;
when the image A is compared with a preset image feature library to obtain defect features of the image A and the positions of the defect features are marked in the image A, stopping rotation of the detected wheel shaft, implementing step S6, judging whether n gamma is greater than or equal to 360 degrees, if yes, executing step S7, and if not, repeating step S3.2;
and when the image A is compared with a preset image feature library to obtain that the image A has no defect features, judging whether n gamma is more than or equal to 360 degrees, if so, executing the step S7, otherwise, repeating the step S3.2.
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Effective date of registration: 20230627 Address after: 511500 workshop a, No. 16, Chuangxing Third Road, high tech Zone, Qingyuan City, Guangdong Province Applicant after: Guangdong lead Microelectronics Technology Co.,Ltd. Address before: 511517 area B, no.27-9 Baijia Industrial Park, Qingyuan high tech Zone, Guangdong Province Applicant before: FIRST SEMICONDUCTOR MATERIALS Co.,Ltd. |
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Application publication date: 20200922 |