CN111716444A - PCB drilling method - Google Patents
PCB drilling method Download PDFInfo
- Publication number
- CN111716444A CN111716444A CN202010595907.2A CN202010595907A CN111716444A CN 111716444 A CN111716444 A CN 111716444A CN 202010595907 A CN202010595907 A CN 202010595907A CN 111716444 A CN111716444 A CN 111716444A
- Authority
- CN
- China
- Prior art keywords
- pcb
- drilling
- cover plate
- drill
- cold punching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005553 drilling Methods 0.000 title claims abstract description 71
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000004080 punching Methods 0.000 claims abstract description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- 239000010949 copper Substances 0.000 claims abstract description 8
- 239000012212 insulator Substances 0.000 claims abstract description 5
- 239000002390 adhesive tape Substances 0.000 claims description 4
- 239000002023 wood Substances 0.000 claims description 3
- 230000003213 activating effect Effects 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 13
- 229910052782 aluminium Inorganic materials 0.000 description 13
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/16—Perforating by tool or tools of the drill type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The embodiment of the invention discloses a PCB drilling method, and relates to the technical field of PCB production. The PCB drilling method comprises the following steps: sequentially stacking a base plate and a PCB on the working table; controlling the drill to descend to a copper surface tightly attached to the surface of the PCB, and taking the position of the drill at the moment as the initial position of drilling; controlling the drill cutter to ascend, and placing a cold punching cover plate on the PCB, wherein the cold punching cover plate is an insulator; and starting the drill cutter, and drilling according to preset drilling parameters. The invention adopts the cold punching cover plate (non-conductive substance), and the drilling depth of the cold punching cover plate is calculated from the copper surface of the cutter face of the drilling cutter contacting the PCB surface, so that the negative difference in the middle of the cold punching cover plate is reduced, and the depth control is more accurate.
Description
Technical Field
The invention relates to the technical field of PCB production, in particular to a PCB drilling method.
Background
With the development of high-density packaging and the trend of miniaturization of circuit boards, high-density multilayer wiring has become a practice of printed circuit boards. In order to improve the wiring density, the conductive blind buried holes are used for local three-dimensional connection, which is also a common method in the manufacturing process of the printed circuit board, and the design is difficult to achieve the requirement through a laser blind hole technology, so the design is only completed through a mechanical depth control blind drill technology. The mechanical deep drilling of blind holes is strictly controlled in depth during drilling. At present, the depth of a mechanical depth control drill is calculated from the contact surface of a lower cutter point, the traditional drilling method uses an aluminum sheet as a cover plate, the thickness uniformity and the flexibility of the aluminum sheet are easy to be uneven, and the depth tolerance of the depth control drill can be controlled within +/-0.125 mm due to the existence of objective factors such as the fact that the drill bit is easy to incline when the drill bit is shallower.
Disclosure of Invention
The embodiment of the invention provides a PCB drilling method, aiming at solving the problem of low precision of mechanical depth control drilling in the technical problem.
In order to solve the above problem, an embodiment of the present invention provides a PCB drilling method, where the PCB drilling method includes:
sequentially stacking a base plate and a PCB on the working table;
controlling the drill to descend to a copper surface tightly attached to the surface of the PCB, and taking the position of the drill at the moment as the initial position of drilling;
controlling the drill cutter to ascend, and placing a cold punching cover plate on the PCB, wherein the cold punching cover plate is an insulator;
and starting the drill cutter, and drilling according to preset drilling parameters.
According to a further technical scheme, before the drill cutter is started and drilling is carried out according to preset drilling parameters, the method further comprises the following steps:
and fixing the base plate, the PCB and the cold punching cover plate together.
The further technical scheme is that the base plate, the PCB and the cold punching cover plate are fixed together, and the method comprises the following steps:
and fixing the base plate, the PCB and the cold punching cover plate together through adhesive tapes.
The further technical proposal is that the diameter of the drill bit is 0.25-0.5 mm.
The further technical scheme is that the drilling parameters comprise a rotating speed which is 80-120 Krpm/min.
The further technical scheme is that the drilling parameters comprise the feed speed, and the feed speed is 1.0 m/min.
The further technical scheme is that the drilling parameters comprise the cutter returning speed, and the cutter returning speed is 18 m/min.
The further technical scheme is that the drilling parameters comprise a hole limit, and the hole limit is 1500.
The further technical scheme is that the thickness of the cold punching cover plate is 0.3-0.5 mm.
The further technical scheme is that the backing plate is a wood backing plate.
Compared with the prior art, the embodiment of the invention can achieve the following technical effects:
because the depth control drill is conducted by contacting with the conductive substance and then transmitted back to the host, the machine control system automatically calculates the required drilling depth. In the prior art, an aluminum sheet is used as a cover plate, and the drilling depth is calculated from the contact of a cutter face of a drill cutter with the aluminum sheet because the aluminum sheet is a conductive substance (the uniformity and the unevenness of the thickness of the aluminum sheet are increased to influence the negative difference). The invention adopts the cold punching cover plate (non-conductive substance), and the drilling depth of the cold punching cover plate is calculated from the copper surface of the cutter surface of the drilling cutter in contact with the PCB surface, so that the negative difference in the middle of the cold punching cover plate is reduced, and the depth control is more accurate and can reach +/-0.05 mm.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a flowchart of a PCB drilling method according to an embodiment of the present invention.
Fig. 2 is a working scene diagram of a PCB drilling method according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, wherein like reference numerals represent like elements in the drawings. It is apparent that the embodiments to be described below are only a part of the embodiments of the present invention, and not all of them. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the embodiments of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of the invention. As used in the description of embodiments of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
Referring to fig. 1, the embodiment of the present invention provides a PCB drilling method, which includes the following steps S1-S4.
And S1, sequentially stacking a backing plate and a PCB on the working table.
In specific implementation, the base plate and the PCB are sequentially stacked on the working table.
And S2, controlling the drill to descend to the copper surface tightly attached to the surface of the PCB, and taking the position of the drill at the moment as the initial position of drilling.
In specific implementation, the drill is controlled to descend to a position just close to the copper surface of the PCB, and the position of the drill at the moment is used as the initial position of drilling. The depth of the borehole is calculated from the initial position.
And S3, controlling the drill to ascend, and placing a cold punching cover plate on the PCB, wherein the cold punching cover plate is an insulator.
In specific implementation, the drill is controlled to ascend (to ascend for a certain distance so as to place a cold punching cover plate), and the cold punching cover plate is placed on the PCB and is an insulator.
And S4, starting the drill cutter and drilling according to preset drilling parameters.
In specific implementation, the drill cutter is started, and drilling is carried out according to preset drilling parameters.
In the embodiment of the invention, the cold punching cover plate is made of non-conductive substances, has the functions of preventing burr at the outlet of the drilled hole and preventing scratching, and has good flatness and difficult crease.
In the prior art, the cover plate is an aluminum sheet, the aluminum is a conductive substance and is used for preventing drill hole outlet burrs and preventing scratching, but the aluminum sheet has certain flexibility and is easy to crease to cause unevenness, and the depth tolerance of the depth control drill can be controlled to be +/-0.125 mm at most.
Because the depth control drill is conducted by contacting with the conductive substance and then transmitted back to the host, the machine control system automatically calculates the required drilling depth. In the prior art, an aluminum sheet is used as a cover plate, and the drilling depth is calculated from the contact of a cutter face of a drill cutter with the aluminum sheet because the aluminum sheet is a conductive substance (the uniformity and the unevenness of the thickness of the aluminum sheet are increased to influence the negative difference). The invention adopts the cold punching cover plate (non-conductive substance), and the drilling depth of the cold punching cover plate is calculated from the copper surface of the cutter surface of the drilling cutter in contact with the PCB surface, so that the negative difference in the middle of the cold punching cover plate is reduced, and the depth control is more accurate and can reach +/-0.05 mm.
Further, in some embodiments, before step S4, the method further comprises:
and fixing the base plate, the PCB and the cold punching cover plate together. Specifically, the backing plate, the PCB and the cold punching cover plate are fixed together by adhesive tape. Namely, the adhesive tape is sequentially pasted on the base plate, the PCB and the cold punching cover plate so as to fix the base plate, the PCB and the cold punching cover plate together.
Further, the diameter of the drill bit is 0.25-0.5 mm.
Further, the drilling parameters comprise a rotating speed which is 80-120 Krpm/min.
Further, the drilling parameters comprise a feed speed, and the feed speed is 1.0 m/min.
Further, the drilling parameters comprise a tool retracting speed, and the tool retracting speed is 18 m/min.
Further, the drilling parameters include a hole limit, the hole limit being 1500.
Referring to table 1, table 1 is a drilling parameter table. Which illustrate the drilling parameters of various embodiments of the present invention.
TABLE 1 drilling parameter table
Further, the thickness of the cold punching cover plate is 0.3-0.5 mm.
Further, the backing plate is a wood backing plate.
Referring to fig. 2, fig. 2 is a working scene diagram of a PCB drilling method according to an embodiment of the present invention. Fig. 2 shows the position relationship of the backing plate 1, the PCB board 2, the cold punching cover plate 3 and the drill 4 during drilling. Wherein in this embodiment, the depth of the drilled hole is H.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, while the invention has been described with respect to the above-described embodiments, it will be understood that the invention is not limited thereto but may be embodied with various modifications and changes.
While the invention has been described with reference to specific embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A PCB drilling method, comprising:
sequentially stacking a base plate and a PCB on the working table;
controlling the drill to descend to a copper surface tightly attached to the surface of the PCB, and taking the position of the drill at the moment as the initial position of drilling;
controlling the drill cutter to ascend, and placing a cold punching cover plate on the PCB, wherein the cold punching cover plate is an insulator;
and starting the drill cutter, and drilling according to preset drilling parameters.
2. The PCB drilling method of claim 1, wherein before the activating the drill bit and drilling according to the preset drilling parameters, the method further comprises:
and fixing the base plate, the PCB and the cold punching cover plate together.
3. The PCB drilling method of claim 2, wherein the fixing the pad plate, the PCB board and the cold stamped cover plate together comprises:
and fixing the base plate, the PCB and the cold punching cover plate together through adhesive tapes.
4. The PCB drilling method of claim 1, wherein the drill bit has a diameter of 0.25-0.5 mm.
5. The PCB drilling method of claim 1, wherein the drilling parameters comprise a rotational speed, the rotational speed being 80-120 Krpm/min.
6. The PCB drilling method of claim 1, wherein the drilling parameters comprise a feed speed, the feed speed being 1.0 m/min.
7. The PCB drilling method of claim 1, wherein the drilling parameters comprise a backcutting speed, the backcutting speed being 18 m/min.
8. The PCB drilling method of claim 1, wherein the drilling parameters include a hole limit, the hole limit being 1500.
9. The PCB drilling method of claim 1, wherein the cold stamped cover plate has a thickness of 0.3-0.5 mm.
10. The PCB drilling method of claim 1, wherein the pad is a wood pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010595907.2A CN111716444A (en) | 2020-06-24 | 2020-06-24 | PCB drilling method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010595907.2A CN111716444A (en) | 2020-06-24 | 2020-06-24 | PCB drilling method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111716444A true CN111716444A (en) | 2020-09-29 |
Family
ID=72569261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010595907.2A Pending CN111716444A (en) | 2020-06-24 | 2020-06-24 | PCB drilling method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111716444A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114845470A (en) * | 2022-04-29 | 2022-08-02 | 龙南骏亚电子科技有限公司 | PCB drilling bakelite plate saving method |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4765784A (en) * | 1984-12-06 | 1988-08-23 | Advanced Controls, Inc. | Electronic depth control for drill |
| CN101342604A (en) * | 2008-08-08 | 2009-01-14 | 东莞生益电子有限公司 | Drilling method using single-side copper clad plate as back drilling cover plate |
| CN101352858A (en) * | 2008-08-13 | 2009-01-28 | 东莞生益电子有限公司 | Back drilling method of PCB (printed circuit board) |
| CN102036492A (en) * | 2010-12-28 | 2011-04-27 | 东莞生益电子有限公司 | Drilling method of PCB board |
| US20110134597A1 (en) * | 2009-12-03 | 2011-06-09 | International Business Machines Corporation | Printed circuit board having a non-plated hole with limited drill depth |
| CN103889151A (en) * | 2012-12-19 | 2014-06-25 | 深南电路有限公司 | Depth control blind hole processing technology |
| CN103889166A (en) * | 2012-12-19 | 2014-06-25 | 深南电路有限公司 | Mechanical controlled deep blind hole processing technology |
| CN104385363A (en) * | 2014-09-16 | 2015-03-04 | 深圳市景旺电子股份有限公司 | Drilling method of PCB with high-thermal conductivity PTFE material and PCB |
| CN106851989A (en) * | 2017-03-20 | 2017-06-13 | 汕头超声印制板（二厂）有限公司 | It is a kind of to leak the heavy processing method for boring backboard |
| CN110370374A (en) * | 2019-07-26 | 2019-10-25 | 惠州市星创宇实业有限公司 | A kind of method of circuit board substrate capillary processing |
-
2020
- 2020-06-24 CN CN202010595907.2A patent/CN111716444A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4765784A (en) * | 1984-12-06 | 1988-08-23 | Advanced Controls, Inc. | Electronic depth control for drill |
| CN101342604A (en) * | 2008-08-08 | 2009-01-14 | 东莞生益电子有限公司 | Drilling method using single-side copper clad plate as back drilling cover plate |
| CN101352858A (en) * | 2008-08-13 | 2009-01-28 | 东莞生益电子有限公司 | Back drilling method of PCB (printed circuit board) |
| US20110134597A1 (en) * | 2009-12-03 | 2011-06-09 | International Business Machines Corporation | Printed circuit board having a non-plated hole with limited drill depth |
| CN102036492A (en) * | 2010-12-28 | 2011-04-27 | 东莞生益电子有限公司 | Drilling method of PCB board |
| CN103889151A (en) * | 2012-12-19 | 2014-06-25 | 深南电路有限公司 | Depth control blind hole processing technology |
| CN103889166A (en) * | 2012-12-19 | 2014-06-25 | 深南电路有限公司 | Mechanical controlled deep blind hole processing technology |
| CN104385363A (en) * | 2014-09-16 | 2015-03-04 | 深圳市景旺电子股份有限公司 | Drilling method of PCB with high-thermal conductivity PTFE material and PCB |
| CN106851989A (en) * | 2017-03-20 | 2017-06-13 | 汕头超声印制板（二厂）有限公司 | It is a kind of to leak the heavy processing method for boring backboard |
| CN110370374A (en) * | 2019-07-26 | 2019-10-25 | 惠州市星创宇实业有限公司 | A kind of method of circuit board substrate capillary processing |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114845470A (en) * | 2022-04-29 | 2022-08-02 | 龙南骏亚电子科技有限公司 | PCB drilling bakelite plate saving method |
| CN114845470B (en) * | 2022-04-29 | 2023-07-21 | 龙南骏亚电子科技有限公司 | PCB drilling circuit board saving method |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200929 |
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| RJ01 | Rejection of invention patent application after publication |