CN111717882B - Micro-electrofluidic device module - Google Patents
Micro-electrofluidic device module Download PDFInfo
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- CN111717882B CN111717882B CN201910220716.5A CN201910220716A CN111717882B CN 111717882 B CN111717882 B CN 111717882B CN 201910220716 A CN201910220716 A CN 201910220716A CN 111717882 B CN111717882 B CN 111717882B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/007—Interconnections between the MEMS and external electrical signals
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/05—Microfluidics
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- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
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Abstract
A microelectromechanical fluid device module includes a package carrier, a plurality of microelectromechanical fluid device chips, and a plurality of wires. The package carrier is a cuboid, has a long carrier side and a short carrier side, and comprises a plurality of carrier electrodes. The micro-electromechanical fluid device chip is disposed on the package carrier. Each micro electro mechanical fluid device chip is a cuboid, has a chip long side and a chip short side, and comprises a chip body and a plurality of micro electro mechanical fluid devices. The micro-electromechanical fluid device is arranged on the chip body and is respectively provided with a plurality of chip electrodes. Two ends of each wire are respectively connected with the corresponding carrier electrode and the corresponding chip electrode.
Description
Technical Field
The present disclosure relates to a microelectromechanical module, and more particularly, to a microelectromechanical fluid device module that improves the efficiency of the microelectromechanical fluid device by using a novel packaging method.
Background
With the technological trend, conventional fluid delivery devices have been directed toward miniaturization of devices and maximization of flow. The applications are also becoming more and more diverse, and zong shadows are seen in industrial applications, biomedical applications, medical care, and electronic heat dissipation to recently popular wearable devices.
In recent years, the MEMS related process is integrated into a chip for the fluid delivery device. As shown in fig. 1A and 1B, conventional microelectromechanical fluid device chips 10a, 10B each include a plurality of microelectromechanical fluid devices 11. However, the flow rate, the lift and the pressure of the above-mentioned fluid conveying device are inferior to those of the conventional fluid conveying device, and in addition, the corner portions of the conventional micro electro mechanical system chips 10a and 10b are deformed due to vibration during operation, so that the production yield is poor and the production cost is increased.
Therefore, how to use a novel packaging method to increase the flow, lift and pressure of the fluid conveying device and reduce the production cost is a problem to be solved at present.
Disclosure of Invention
The main purpose of the present invention is to provide a micro-electro-mechanical fluid device module, which uses a novel packaging method to increase the flow, lift and pressure of the micro-electro-mechanical fluid device module and reduce the production cost.
To achieve the above object, a broader aspect of the present invention provides a microelectromechanical fluid device module, which includes a package carrier, a plurality of microelectromechanical fluid device chips, and a plurality of wires. The package carrier is a cuboid, has a long carrier side and a short carrier side, and comprises a plurality of carrier electrodes. The micro-electromechanical fluid device chip is disposed on the package carrier. Each micro electro mechanical fluid device chip is a cuboid, has a chip long side and a chip short side, and comprises a chip body and a plurality of micro electro mechanical fluid devices. The micro-electromechanical fluid device is arranged on the chip body and is respectively provided with a plurality of chip electrodes. Two ends of each wire are respectively connected with the corresponding carrier electrode and the corresponding chip electrode.
Drawings
Fig. 1A is a schematic diagram of a conventional micro-electromechanical fluidic device chip.
FIG. 1B is another schematic diagram of a conventional MEMS fluid device chip.
Fig. 2 is a schematic diagram of a first embodiment of a mems module.
Fig. 3 is a schematic diagram of a second embodiment of a mems module.
Fig. 4 is a schematic diagram of a third embodiment of a mems module.
Fig. 5 is a schematic diagram of a fourth embodiment of a mems chip.
Fig. 6 is a schematic diagram of a fifth embodiment of a mems module.
Fig. 7 is a schematic diagram of a sixth embodiment of a mems module.
Description of the reference numerals
1A, 1b, 2a, 2b, 1a ', 2a': microelectromechanical fluid device module
A1, A2, A3, B1, B2, B3, 10a, 10B microelectromechanical fluid device chip
21 Packaging Carrier
21A carrier long side
21B short side of carrier
21P carrier electrode
211P carrier auxiliary electrode
22 Chip body
22A chip long side
22B chip short side
22P chip electrode
221P chip auxiliary electrode
11. 23 Microelectromechanical fluid device
24 Wire guide
25 Auxiliary wire
Detailed Description
Embodiments that exhibit the features and advantages of the present disclosure will be described in detail in the following description. It will be understood that various changes can be made in the above-described embodiments without departing from the scope of the invention, and that the description and illustrations herein are to be taken in an illustrative and not a limiting sense.
Referring to fig. 2, in a first embodiment of the present disclosure, a mems module 1a includes a package carrier 21, a plurality of mems chips A1, A2, A3, and a plurality of wires 24. The package carrier 21 is a rectangular parallelepiped shape having a long carrier side 21a and a short carrier side 21b, and includes a plurality of carrier electrodes 21p. The carrier electrodes 21p are disposed on opposite sides of the micro-electromechanical fluid device chips A1, A2, A3, and along the extending direction of the carrier long side 21a of the package carrier 21. In the first embodiment of the present disclosure, the mems module 1a includes three mems chips A1, A2, A3, but not limited thereto, and the number of the mems chips can be changed according to the design requirement. In the first embodiment of the present disclosure, the mems chips A1, A2, A3 are disposed on the package carrier 21 and are serially connected along the extending direction of the carrier long side 21a of the package carrier 21. Each of the mems chips A1, A2, A3 is a rectangular parallelepiped shape, has a chip long side 22a and a chip short side 22b, and includes a chip body 22 and a plurality of mems devices 23. In the first embodiment, the chip long sides 22a of the micro electro mechanical device chips A1, A2, A3 are arranged parallel to the carrier long sides 21a of the package carrier 21. The mems 23 is provided on the chip body 22 along the extending direction of the chip long sides 22a of the mems chips A1, A2, A3, and has a plurality of chip electrodes 22p, respectively. The chip electrodes 22p are disposed on opposite sides of the mems 23 and along the extending direction of the chip long sides 22a of the mems chips A1, A2, A3. Both ends of each wire 24 are connected to the corresponding carrier electrode 21p and the corresponding chip electrode 22p, respectively. It should be noted that, in the first embodiment of the present disclosure, the configuration of the mems chips A1, A2, A3 can increase the flow rate, the lift and the pressure of the mems module 1a, increase the space utilization and reduce the volume of the package carrier 21.
Referring to fig. 3, in a second embodiment of the present disclosure, the mems module 1b includes a package carrier 21, mems chips A1, A2, A3, and wires 24. The package carrier 21 is a rectangular parallelepiped shape, has a carrier long side 21a and a carrier short side 21b, and includes a carrier electrode 21p. The carrier electrodes 21p are disposed on opposite sides of the micro-electromechanical fluid device chips A1, A2, A3, and along the extending direction of the carrier long side 21a of the package carrier 21. In the second embodiment of the present disclosure, the mems module 1b includes three mems chips A1, A2, A3, but not limited thereto, and the number of the mems chips can be changed according to the design requirement. In the second embodiment of the present disclosure, the mems device chips A1, A2, A3 are disposed on the package carrier 21 and are staggered along the extending direction of the carrier long side 21a of the package carrier 21. Each of the mems chips A1, A2, A3 is a rectangular parallelepiped, has a long chip side 22a and a short chip side 22b, and includes a chip body 22 and a mems device 23. In the second embodiment, the chip long sides 22a of the micro electro mechanical device chips A1, A2, A3 are arranged parallel to the carrier long sides 21a of the package carrier 21. The mems 23 is provided on the chip body 22 along the extending direction of the chip long sides 22a of the mems chips A1, A2, A3, and has a plurality of chip electrodes 22p, respectively. The chip electrodes 22p are disposed on opposite sides of the mems 23 and along the extending direction of the chip long sides 22a of the mems chips A1, A2, A3. Both ends of each wire 24 are connected to the corresponding carrier electrode 21p and the corresponding chip electrode 22p, respectively. It should be noted that, in the second embodiment of the present disclosure, the configuration of the mems chips A1, A2, A3 can increase the flow, the lift and the pressure of the mems module 1b, and the intersection of the mems chips A1, A2, A3 has an overlapping portion, so that the total length of the package carrier 21 can be reduced.
Referring to fig. 4, in a third embodiment of the present disclosure, the mems module 2a includes a package carrier 21, a plurality of mems chips B1, B2, B3, and wires 24. The package carrier 21 is a rectangular parallelepiped shape, has a carrier long side 21a and a carrier short side 21b, and includes a carrier electrode 21p. The carrier electrodes 21p are disposed on opposite sides of the micro-electromechanical fluid device chips B1, B2, B3, and along the extending direction of the carrier long side 21a of the package carrier 21. In the third embodiment of the present disclosure, the mems module 2a includes three mems chips B1, B2, and B3, but not limited thereto, and the number of the mems chips can be changed according to the design requirement. In the third embodiment of the present disclosure, the micro electro mechanical device chips B1, B2, and B3 are disposed on the package carrier 21 and are serially disposed along the extending direction of the carrier long side 21a of the package carrier 21. Each of the micro electro mechanical fluid device chips B1, B2, B3 is a rectangular parallelepiped, has a chip long side 22a and a chip short side 22B, and includes a chip body 22 and a micro electro mechanical fluid device 23. In the third embodiment, the chip long sides 22a of the micro electro mechanical device chips B1, B2, B3 are arranged parallel to the carrier short sides 21B of the package carrier 21. The mems 23 is provided on the chip body 22 along the extending direction of the chip long sides 22a of the mems chips B1, B2, and B3, and has a plurality of chip electrodes 22p, respectively. The chip electrodes 22p are disposed on opposite sides of the mems 23 and along the extending direction of the chip short sides 22B of the mems chips B1, B2, B3. Both ends of each wire 24 are connected to the corresponding carrier electrode 21p and the corresponding chip electrode 22p, respectively. It should be noted that, in the third embodiment of the present disclosure, the configuration of the mems device chips B1, B2, B3 can increase the flow rate, the lift and the pressure of the mems device module 2a, increase the space utilization and reduce the volume of the package carrier 21.
Referring to fig. 5, in a fourth embodiment of the present disclosure, the mems module 2B includes a package carrier 21, mems chips B1, B2, B3, and wires 24. The package carrier 21 is a rectangular parallelepiped shape, has a carrier long side 21a and a carrier short side 21b, and includes a carrier electrode 21p. The carrier electrodes 21p are disposed on opposite sides of the micro-electromechanical fluid device chips B1, B2, B3, and along the extending direction of the carrier long side 21a of the package carrier 21. In the fourth embodiment of the present disclosure, the mems module 2B includes three mems chips B1, B2, and B3, but not limited thereto, and the number of the mems chips can be changed according to the design requirement. In the fourth embodiment of the present disclosure, the micro-electro-mechanical device chips B1, B2, and B3 are disposed on the package carrier 21 and are staggered along the extending direction of the carrier long side 21a of the package carrier 21. Each of the micro electro mechanical fluid device chips B1, B2, B3 is a rectangular parallelepiped, has a chip long side 22a and a chip short side 22B, and includes a chip body 22 and a micro electro mechanical fluid device 23. In the fourth embodiment, the chip long sides 22a of the micro electro mechanical device chips B1, B2, B3 are arranged parallel to the carrier short sides 21B of the package carrier 21. The mems 23 is provided on the chip body 22 along the extending direction of the chip long sides 22a of the mems chips B1, B2, and B3, and has chip electrodes 22p, respectively. The chip electrodes 22p are disposed on opposite sides of the mems 23 and along the extending direction of the chip short sides 22B of the mems chips B1, B2, B3. Both ends of each wire 24 are connected to the corresponding carrier electrode 21p and the corresponding chip electrode 22p, respectively. It should be noted that, in the fourth embodiment, the configuration of the mems chips B1, B2, B3 can increase the flexibility of the configuration of the mems chips B1, B2, B3, in addition to the flow, the lift and the pressure of the mems module 2B.
It should be noted that the configuration modes of the first embodiment to the fourth embodiment have different application levels, and the configuration mode used in actual production is not limited to this, and may be changed according to actual requirements.
Referring to fig. 6, the fifth embodiment extends from the first embodiment of the present application, but is not limited thereto. Unlike the first embodiment, the mems device module 1a' of the fifth embodiment further comprises a plurality of auxiliary wires 25, the package carrier 21 further comprises a plurality of carrier auxiliary electrodes 211p, and the mems device chips A1, A2, A3 further comprise a plurality of chip auxiliary electrodes 221p. The carrier auxiliary electrodes 211p are connected to the chip auxiliary electrodes 221p through auxiliary wires 25, respectively. In the fifth embodiment, the carrier auxiliary electrode 211p and the chip auxiliary electrode 221p are disposed at the corners of the package carrier 21, so that the corner portions of the micro-electro-mechanical device chips A1, A2, A3 are not deformed due to vibration by fixing the carrier auxiliary electrode 211p and the chip auxiliary electrode 221p during operation, thereby improving the production yield and reducing the production cost.
Referring to fig. 7, the sixth embodiment extends from the third embodiment, but is not limited to this. Unlike the third embodiment, the micro electro mechanical device module 2a' of the sixth embodiment further includes an auxiliary wire 25, the package carrier 21 further includes a carrier auxiliary electrode 211p, and the micro electro mechanical device chips B1, B2, and B3 further include a chip auxiliary electrode 221p. The carrier auxiliary electrodes 211p are connected to the chip auxiliary electrodes 221p through auxiliary wires 25, respectively. In the sixth embodiment, the carrier auxiliary electrode 211p and the chip auxiliary electrode 221p are disposed at the corners of the package carrier 21, so that the corner portions of the micro-electro-mechanical device chips B1, B2, and B3 are not deformed due to vibration by fixing the carrier auxiliary electrode 211p and the chip auxiliary electrode 221p during operation, thereby improving the production yield and reducing the production cost.
It should be noted that the carrier auxiliary electrode 211p and the chip auxiliary electrode 221p may be configured in conjunction with various micro-electro-mechanical devices and are not limited to the above disclosed manner.
Referring back to fig. 2, in the embodiments of the present disclosure, the mems device modules 1a, 1B, 1a ', 2a' further include a control unit (not shown) for driving the mems device chips A1, A2, A3, B1, B2, B3, wherein the mems device chips A1, A2, A3, B1, B2, B3 can be driven in different manners. Taking the first embodiment as an example, the control unit may drive the mems chips A1, A2, A3 simultaneously, and the control unit may also drive one of the mems chips A1, A2, A3 individually. Or the mems chips A1, A2, A3 may be divided into a driving group and a standby group, and the control unit may drive the driving groups of the mems chips A1, A2, A3 at the same time, but not limited thereto, the driving modes of the mems chips A1, A2, A3 may be changed according to the total required flow and the required flow rate. In the embodiments of the present disclosure, the control unit is a microcontroller (Microcontroller Unit, MCU) or an Application SPECIFIC INTEGRATED Circuit (ASIC), but not limited thereto, and the Application of the control unit may be changed according to the design requirement.
In summary, the present disclosure provides a micro-electro-mechanical device module, which uses a novel packaging method to increase the flow, lift and pressure of the micro-electro-mechanical device module and reduce the production cost.
The present invention is modified in this way by those skilled in the art without departing from the scope of the appended claims.
Claims (8)
1. A microelectromechanical fluid device module, comprising:
A packaging carrier which is a cuboid shape, has a carrier long side and a carrier short side, and comprises a plurality of carrier electrodes;
A plurality of MEMS fluid device chips arranged on the packaging carrier, each MEMS fluid device chip is in a cuboid shape, has a long side and a short side, and comprises a chip body and a plurality of MEMS fluid devices arranged on the chip body and respectively provided with a plurality of chip electrodes, a plurality of wires, two ends of each wire are respectively connected with the corresponding carrier electrode and the corresponding chip electrode, and
The carrier auxiliary electrodes are respectively connected with the chip auxiliary electrodes through the auxiliary wires, the carrier auxiliary electrodes and the chip auxiliary electrodes are arranged at the corners adjacent to the packaging carrier, and the chip auxiliary electrodes are not connected with the micro-electromechanical fluid device.
2. The micro-electro-mechanical fluid device module of claim 1, wherein the plurality of micro-electro-mechanical fluid device chips are arranged in series along an extending direction of the carrier long side of the package carrier, the plurality of micro-electro-mechanical fluid devices of each micro-electro-mechanical fluid device chip are arranged along an extending direction of the chip long side of the micro-electro-mechanical fluid device chip, the plurality of chip electrodes are arranged on opposite sides of the plurality of micro-electro-mechanical fluid devices and are also arranged along an extending direction of the chip long side of the micro-electro-mechanical fluid device chip, and the plurality of carrier electrodes are arranged on opposite sides of the plurality of micro-electro-mechanical fluid device chips and are also arranged along an extending direction of the carrier long side of the package carrier.
3. The micro-electro-mechanical fluid device module of claim 1, wherein the plurality of micro-electro-mechanical fluid device chips are staggered along the extending direction of the carrier long side of the package carrier, the plurality of micro-electro-mechanical fluid devices of each micro-electro-mechanical fluid device chip are arranged along the extending direction of the chip long side of the micro-electro-mechanical fluid device chip, the plurality of chip electrodes are arranged on opposite sides of the plurality of micro-electro-mechanical fluid devices and also along the extending direction of the chip long side of the micro-electro-mechanical fluid device chip, and the plurality of carrier electrodes are arranged on opposite sides of the plurality of micro-electro-mechanical fluid device chips and also along the extending direction of the carrier long side of the package carrier.
4. The microelectromechanical fluidic device module of claim 1, wherein the plurality of microelectromechanical fluidic device chips are arranged in series along an extension of the carrier long side of the package carrier, the plurality of microelectromechanical fluidic devices of each microelectromechanical fluidic device chip are arranged along an extension of the chip long side of the microelectromechanical fluidic device chip, the plurality of chip electrodes are arranged on opposite sides of the plurality of microelectromechanical fluidic devices and along an extension of the chip short side of the microelectromechanical fluidic device chip, and the plurality of carrier electrodes are arranged on opposite sides of the plurality of microelectromechanical fluidic device chips and also along an extension of the carrier long side of the package carrier.
5. The microelectromechanical fluidic device module of claim 1, wherein the plurality of microelectromechanical fluidic device chips are staggered along the direction of extension of the carrier long side of the package carrier, the plurality of microelectromechanical fluidic devices of each microelectromechanical fluidic device chip are disposed along the direction of extension of the chip long side of the microelectromechanical fluidic device chip, the plurality of chip electrodes are disposed on opposite sides of the plurality of microelectromechanical fluidic devices and along the direction of extension of the chip short side of the microelectromechanical fluidic device chip, and the plurality of carrier electrodes are disposed on opposite sides of the plurality of microelectromechanical fluidic device chips and also along the direction of extension of the carrier long side of the package carrier.
6. The microelectromechanical fluidic device module of claim 1, further comprising a control unit for driving the plurality of microelectromechanical fluidic device chips, the control unit driving the plurality of microelectromechanical fluidic device chips simultaneously.
7. The microelectromechanical fluidic device module of claim 1, further comprising a control unit for driving the plurality of microelectromechanical fluidic device chips, the control unit driving one of the plurality of microelectromechanical fluidic device chips individually.
8. The mems module of claim 1, further comprising a control unit for driving the mems chips, the mems chips being divided into a driving group and a standby group, the control unit driving the driving groups of the mems chips simultaneously.
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| CN201910220716.5A CN111717882B (en) | 2019-03-22 | 2019-03-22 | Micro-electrofluidic device module |
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| CN201910220716.5A CN111717882B (en) | 2019-03-22 | 2019-03-22 | Micro-electrofluidic device module |
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| CN111717882B true CN111717882B (en) | 2025-07-01 |
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