CN111880268A - Laser assembly, optical module and optical fiber communication equipment - Google Patents
Laser assembly, optical module and optical fiber communication equipment Download PDFInfo
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- CN111880268A CN111880268A CN202010836638.4A CN202010836638A CN111880268A CN 111880268 A CN111880268 A CN 111880268A CN 202010836638 A CN202010836638 A CN 202010836638A CN 111880268 A CN111880268 A CN 111880268A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
- H01S5/0071—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for beam steering, e.g. using a mirror outside the cavity to change the beam direction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02218—Material of the housings; Filling of the housings
- H01S5/0222—Gas-filled housings
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
本发明公开了一种激光组件、光模块及光纤通讯设备。该激光组件包括:底座;激光模块,设置在底座上;管帽,管帽密封罩设在底座上,并将激光模块容置其内;管帽具有正对底座的第一侧壁,第一侧壁呈平板设置;以及透镜,透镜设置于第一侧壁的外表面上,用于改变射入激光模块或者激光模块射出光线的角度。本发明的激光组件可以应用于工业级的工作环境。
The invention discloses a laser assembly, an optical module and an optical fiber communication device. The laser assembly includes: a base; a laser module arranged on the base; a tube cap, the tube cap sealing cover is arranged on the base and accommodates the laser module in it; the tube cap has a first side wall facing the base, the first The side wall is arranged as a flat plate; and the lens is arranged on the outer surface of the first side wall, and is used for changing the angle of the light entering the laser module or the light emitted by the laser module. The laser assembly of the present invention can be applied to an industrial-grade working environment.
Description
技术领域technical field
本发明涉及光纤通信领域,特别涉及一种激光组件、光模块及光纤通讯设备。The invention relates to the field of optical fiber communication, in particular to a laser assembly, an optical module and an optical fiber communication device.
背景技术Background technique
目前,随着5G应用场景的多样化,工业级交换机以及基站上使用多模光纤传输的场景逐渐增多,需要可部署于室外基站和工业级交换机中等严苛环境的光模块。At present, with the diversification of 5G application scenarios, the use of multi-mode optical fiber transmission on industrial switches and base stations has gradually increased, requiring optical modules that can be deployed in harsh environments such as outdoor base stations and industrial switches.
而传统光模块大多应用于数据中心,由于数据中心具有温度控制系统且工作环境稳定,传统光模块中激光组件采用COB(Chip on board)非气密性封装。而COB封装的激光组件容易受到灰尘、水汽及传播介质不稳定等环境因素影响,所以无法应用于工业级的工作环境,且传统光模块散热性能差,无法满足工业级的温度要求,以及传统光模块仅支持特定速率距离进行短传输,无法应用于多种场景。Traditional optical modules are mostly used in data centers. Since the data center has a temperature control system and a stable working environment, the laser components in traditional optical modules use COB (Chip on board) non-airtight packaging. However, COB-packaged laser components are easily affected by environmental factors such as dust, water vapor, and unstable propagation media, so they cannot be used in industrial-grade working environments, and traditional optical modules have poor heat dissipation performance and cannot meet industrial-grade temperature requirements. The module only supports short transmission at a specific rate and distance, and cannot be used in various scenarios.
发明内容SUMMARY OF THE INVENTION
本发明的主要目的是提出一种激光组件,旨在实现应用于工业级的工作环境。The main purpose of the present invention is to propose a laser assembly, which is intended to be applied to an industrial-grade working environment.
为实现上述目的,本发明提出一种激光组件。所述激光组件包括:To achieve the above objective, the present invention provides a laser assembly. The laser assembly includes:
底座;base;
激光模块,设置在所述底座上;a laser module, arranged on the base;
管帽,所述管帽密封罩设在所述底座上,并将所述激光模块容置其内;a tube cap, the tube cap sealing cover is arranged on the base and accommodates the laser module therein;
所述管帽具有正对所述底座的第一侧壁,所述第一侧壁呈平板设置;以及The pipe cap has a first side wall facing the base, and the first side wall is arranged as a flat plate; and
透镜,所述透镜设置于所述第一侧壁的外表面上,用于改变射入所述激光模块或者所述激光模块射出光线的角度。and a lens, which is arranged on the outer surface of the first side wall and is used to change the angle of the light entering the laser module or the light emitted by the laser module.
可选地,所述激光组件还包括:Optionally, the laser assembly further includes:
引脚组件,所述引脚组件的一端与所述激光模块连接,所述引脚组件的另一端背向所述管帽自所述底座穿出设置。A pin assembly, one end of the pin assembly is connected to the laser module, and the other end of the pin assembly is disposed away from the cap and protruding from the base.
可选地,所述激光模块包括:Optionally, the laser module includes:
导电片,设置在所述底座上,并与所述引脚组件连接;以及a conductive sheet, disposed on the base, and connected with the pin assembly; and
激光器,设置在所述导电片上。A laser is arranged on the conductive sheet.
可选地,所激光模块还包括:Optionally, the laser module further includes:
光探测器,设置在所述底座上,并与所述引脚组件连接。The light detector is arranged on the base and connected with the pin assembly.
可选地,所述激光器为激光发射器或者为激光接收器。Optionally, the laser is a laser transmitter or a laser receiver.
本发明还提出一种光模块,所述光模块包括:The present invention also provides an optical module, the optical module includes:
电接口;electrical interface;
激光组件,为如上所述的激光组件,所述激光组件与所述电接口电连接;以及A laser assembly, which is the laser assembly described above, the laser assembly is electrically connected to the electrical interface; and
主控装置,与所述激光组件电连接。The main control device is electrically connected with the laser assembly.
可选地,所述激光组件的数量为两个,一个为激光发射组件,另一个为激光接收组件;Optionally, the number of the laser components is two, one is a laser emitting component, and the other is a laser receiving component;
所述激光发射组件用于将所述电接口接入的电信号转换为光信号后输出;The laser emitting component is used to convert the electrical signal connected to the electrical interface into an optical signal and then output it;
所述激光接收组件用于接收光信号,并用于将接收到的光信号转换为电信号后输出至所述电接口;The laser receiving component is used for receiving an optical signal, and is used for converting the received optical signal into an electrical signal and outputting it to the electrical interface;
所述光模块还包括:The optical module further includes:
激光驱动器,分别与所述电接口、所述主控装置及所述激光发射组件电连接;所述激光驱动器用于在所述主控器的控制下,根据所述电接口接入的电信号驱动所述激光发射组件工作;以及a laser driver, which is respectively electrically connected to the electrical interface, the main control device and the laser emitting component; the laser driver is used for, under the control of the main controller, according to the electrical signal connected to the electrical interface driving the laser emitting assembly to work; and
限幅放大器,所述限幅放大器分别与所述主控装置、所述电接口及所述激光接收组件电连接;所述限幅放大器用于在所述主控装置的控制下,将所述激光接收组件输出的电信号经限幅放大后输出至所述电接口。Limiting amplifier, the limiting amplifier is respectively electrically connected with the main control device, the electrical interface and the laser receiving component; the limiting amplifier is used for, under the control of the main control device, the The electrical signal output by the laser receiving component is output to the electrical interface after being limited and amplified.
可选地,所述光模块还包括:Optionally, the optical module further includes:
第一壳体及第一散热台,所述激光发射组件、所述激光驱动器及所述第一散热台容置于所述第一壳体内;所述第一散热台与所述第一壳体的内表侧贴合设置,所述第一散热台背离所述第一壳体的一侧上对应所述激光发射组件、所述激光驱动器分别设置有高导散热片,所述激光发射组件、所述激光驱动器与各自对应的高导散热片贴合设置,以将热量经所述高导散热片及所述散热台传递至所述第一壳体;a first casing and a first heat sink, the laser emitting component, the laser driver and the first heat sink are accommodated in the first casing; the first heat sink and the first casing The inner surface side of the first heat dissipation table is attached and arranged on the side of the first heat sink away from the first casing. The laser emitting assembly and the laser driver are respectively provided with high-conductivity heat sinks, and the laser emitting assembly, The laser drivers are attached to their corresponding high-conductivity heat sinks, so as to transfer heat to the first casing through the high-conductivity heat sinks and the heat sink;
第二壳体及第二散热台,所述激光接收组件、所述限幅放大器及所述第二散热台容置于所述第二壳体内;所述第二散热台与所述第二壳体的内表侧贴合设置,所述第二散热台背离所述第二壳体的一侧上对应所述激光接收组件、所述限幅放大器分别设置有高导散热片,所述激光接收组件、所述限幅放大器与各自对应的高导散热片贴合设置,以将热量经所述高导散热片及所述散热台传递至所述第二壳体;A second casing and a second heat dissipation stage, the laser receiving assembly, the limiting amplifier and the second heat dissipation stage are accommodated in the second shell; the second heat dissipation stage and the second shell The inner surface side of the body is attached and arranged, and the side of the second heat dissipation table facing away from the second shell is provided with a high-conductivity heat sink corresponding to the laser receiving component and the limiting amplifier, respectively. The component, the limiting amplifier and the corresponding high-conductivity heat sink are attached and disposed, so as to transfer heat to the second casing through the high-conductivity heat sink and the heat sink;
外壳,所述第一壳体与所述第二壳体容置于所述外壳内,所述外壳对应所述第一壳体与所述第二壳体分别凸伸有连接部,且所述第一壳体及所述第二壳体的外表侧与各自对应的连接部贴合设置,以传递热量至所述外壳。an outer casing, the first casing and the second casing are accommodated in the outer casing, the outer casing respectively protrudes a connecting portion corresponding to the first casing and the second casing, and the outer casing The outer surfaces of the first casing and the second casing are fitted with their corresponding connecting parts, so as to transmit heat to the outer casing.
可选地,所述光模块还包括发射信号整形电路及接收信号整形电路;Optionally, the optical module further includes a transmit signal shaping circuit and a receive signal shaping circuit;
所述发射信号整形电路分别与所述电接口、所述激光驱动器及所述主控装置电连接;所述发射信号整形电路用于在所述主控装置的控制下,对所述电接口接入的电信号进行整形,以锁定预设速率区间的电信号,并将相应的电信号经整形后输出至所述激光驱动器;The transmission signal shaping circuit is respectively electrically connected with the electrical interface, the laser driver and the main control device; the transmission signal shaping circuit is used to connect the electrical interface under the control of the main control device The incoming electrical signal is shaped to lock the electrical signal in the preset rate range, and the corresponding electrical signal is shaped and output to the laser driver;
所述接收信号整形电路分别与所述限幅放大器、所述电接口及所述主控装置电连接;所述接收信号整形电路用于在所述主控装置的控制下,对所述限幅放大器限幅放大后输出的电信号进行整形,以锁定预设速率区间的电信号,并将相应的电信号经整形后输出至所述电接口。The received signal shaping circuit is respectively electrically connected with the limiting amplifier, the electrical interface and the main control device; the received signal shaping circuit is used for limiting the amplitude under the control of the main control device The electric signal output by the amplifier is limited and amplified to be shaped to lock the electric signal in the preset rate range, and the corresponding electric signal is output to the electric interface after being shaped.
本发明还提出一种光纤通讯设备,所述光纤通讯设备包括如上所述的激光组件;The present invention also provides an optical fiber communication device, the optical fiber communication device includes the above-mentioned laser assembly;
或者,所述光纤通讯设备包括如上所述的光模块。Alternatively, the optical fiber communication device includes the above-mentioned optical module.
本发明激光组件通过设置底座、激光模块、管帽以及透镜,并通过将激光模块设置于管帽与底座形成密闭空腔中,以使得激光模块工作时可以不受灰尘及水汽等环境因素的影响,且密封空腔中可相应的填充有惰性气体,以保证激光传播介质的温度,以及通过设置透镜可将激光模块发射/接收的激光进行相应的角度偏转,以保证本发明激光组件在工业级环境下可进行正常工作。本发明激光组件相较于传统COB封装的激光组件,通过将激光模块设置于底座与管帽形成的密闭空腔中,以使得激光模块可以避免受到灰尘、水汽及传播介质不稳定等环境因素影响,从而实现应用于工业级的工作环境。The laser assembly of the present invention is provided with a base, a laser module, a tube cap and a lens, and the laser module is arranged in a closed cavity formed by the tube cap and the base, so that the laser module can work without being affected by environmental factors such as dust and water vapor. , and the sealed cavity can be filled with inert gas correspondingly to ensure the temperature of the laser propagation medium, and by setting the lens, the laser emitted/received by the laser module can be deflected correspondingly to ensure that the laser assembly of the present invention is industrial-grade. The environment can work normally. Compared with the traditional COB packaged laser assembly, the laser module of the present invention is arranged in a closed cavity formed by the base and the cap, so that the laser module can be prevented from being affected by environmental factors such as dust, water vapor, and unstable propagation medium. , so as to realize the application in industrial-grade working environment.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图示出的结构获得其他的附图。In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can also be obtained according to the structures shown in these drawings without creative efforts.
图1为本发明激光组件一实施例的结构示意图;FIG. 1 is a schematic structural diagram of an embodiment of a laser assembly of the present invention;
图2为本发明光模块一实施例的功能模块示意图。FIG. 2 is a schematic diagram of functional modules of an embodiment of an optical module of the present invention.
附图标号说明:Description of reference numbers:
本发明目的的实现、功能特点及优点将结合实施例,参照附图做进一步说明。The realization, functional characteristics and advantages of the present invention will be further described with reference to the accompanying drawings in conjunction with the embodiments.
具体实施方式Detailed ways
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明的一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
需要说明,本发明实施例中所有方向性指示(诸如上、下、左、右、前、后……)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等,如果该特定姿态发生改变时,则该方向性指示也相应地随之改变。It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relationship between various components under a certain posture (as shown in the accompanying drawings). The relative positional relationship, the movement situation, etc., if the specific posture changes, the directional indication also changes accordingly.
在本发明中,除非另有明确的规定和限定,术语“连接”、“固定”等应做广义理解,例如,“固定”可以是固定连接,也可以是可拆卸连接,或成一体;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系,除非另有明确的限定。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本发明中的具体含义。In the present invention, unless otherwise expressly specified and limited, the terms "connected", "fixed" and the like should be understood in a broad sense, for example, "fixed" may be a fixed connection, a detachable connection, or an integrated; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be an internal communication between two elements or an interaction relationship between the two elements, unless otherwise explicitly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.
另外,在本发明中如涉及“第一”、“第二”等的描述仅用于描述目的,而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外,各个实施例之间的技术方案可以相互结合,但是必须是以本领域普通技术人员能够实现为基础,当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在,也不在本发明要求的保护范围之内。In addition, descriptions such as "first", "second", etc. in the present invention are only for descriptive purposes, and should not be construed as indicating or implying their relative importance or implicitly indicating the number of indicated technical features. Thus, a feature delimited with "first", "second" may expressly or implicitly include at least one of that feature. In addition, the technical solutions between the various embodiments can be combined with each other, but must be based on the realization by those of ordinary skill in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered that the combination of such technical solutions does not exist. , is not within the scope of protection required by the present invention.
本发明提出一种激光组件。The present invention provides a laser assembly.
参照图1至图2,在本发明一实施例中,所述激光组件包括:1 to 2, in an embodiment of the present invention, the laser assembly includes:
底座110;base 110;
激光模块120,设置在所述底座110上;The
管帽130,所述管帽130密封罩设在所述底座110上,并将所述激光模块120容置其内;a
所述管帽130具有正对所述底座110的第一侧壁,所述第一侧壁呈平板设置;以及The
透镜140,所述透镜140设置于所述第一侧壁的外表面上,用于改变射入所述激光模块120或者所述激光模块120射出光线的角度。The
本实施例中,底座110形状根据实际需要可以为圆柱体、长方体或棱柱中一种,在此不做限定。底座110中可设置有用于走线布置的通道结构,以使激光模块120的相关端口或引脚可与底座110中布置的走线连接,以用于接入相应的电信号或者输出相应的电信号;可以理解的是,激光模块120可以根据接收到的电信号发出相应的激光,或者根据接收到的激光输出相应的电信号。In this embodiment, the shape of the base 110 may be one of a cylinder, a rectangular parallelepiped or a prism according to actual needs, which is not limited herein. The base 110 may be provided with a channel structure for wiring arrangement, so that the relevant ports or pins of the
管帽130可采用透明材质制成,且可以采用圆柱型帽体结构、长方体型帽体结构或者棱柱型帽体结构来实现。本领域的技术人员可以在管帽130与底座110的连接部位采取嵌入式结构或者胶封措施等工艺手段,以使得管帽130罩设在底座110上形成密闭空腔,从而隔绝工业级工作环境带来的灰尘、水汽及传播介质对激光模块120的影响;且密闭空腔中可根据实际需要,相应的填充有高纯氮气或其它惰性气体,为激光模块120提供稳定可靠的工作环境。管帽130的第一侧壁为帽体结构的顶部侧面,第一侧壁的外表面上设置有透镜140,透镜140可以为球透镜或者非球透镜,透镜140用于将激光模块120输出的激光进行相应的角度偏转,以使后续组件可以正确的接收到激光;或者,透镜140还用于将输入的激光经相应的角度偏转后输出至激光模块120。The
在一可选实施例中,底座110为圆柱形结构,管帽130为圆柱型帽体结构;且在底座110上还具有一圆柱形凸起的平台,以用于管帽130嵌套形成密闭空腔。激光模块120的激光发射端口/接收端口与底座110的圆心的位置,以及与透镜140的中心在同一直线上。In an optional embodiment, the
本发明激光组件通过设置底座110、激光模块120、管帽130以及透镜140,并通过将激光模块120设置于管帽130与底座110形成密闭空腔中,以使得激光模块120工作时可以不受灰尘及水汽等环境因素的影响,且密封空腔中可相应的填充有惰性气体,以保证激光传播介质的温度,以及通过设置透镜140可将激光模块120发射/接收的激光进行相应的角度偏转,以保证本发明激光组件在工业级环境下可进行正常工作。本发明激光组件相较于传统COB封装的激光组件,通过将激光模块120设置于底座110与管帽130形成的密闭空腔中,以使得激光模块120可以避免受到灰尘、水汽及传播介质不稳定等环境因素影响,从而实现应用于工业级的工作环境。The laser assembly of the present invention is provided with the
参照图1至图2,在本发明一实施例中,所述激光组件还包括:引脚组件150,所述引脚组件150的一端与所述激光模块120连接,所述引脚组件150的另一端背向所述管帽130自所述底座110穿出设置。1 to 2, in an embodiment of the present invention, the laser assembly further includes: a
所述激光模块120包括:The
导电片121,设置在所述底座110上,并与所述引脚组件150连接;以及The
激光器122,设置在所述导电片121上。The
所述激光器122为激光发射器或者为激光接收器。The
本实施中,引脚组件150中包括多个独立设置的引脚,引脚数量根据实际需要设置,在此不做限制。每一引脚都穿出底座110,与设于底座110上的相关器件连接,以用于实现相关器件与外部的电连接;可以理解的是,本领域的技术人员可在引脚位置的设计上,将相关引脚穿出底座110后直接与相关器件电连接,或者通过打线的方式与非直接接触的相关器件进行电连接。In this implementation, the
在本实施例中,激光器122分为激光接收器及激光发射器两类。当激光器122为激光发射器时,可以采用垂直腔面激光发射器来实现,由于该激光器122的激光发射端口在激光器122的侧面,因此通过设置导电片121,并将激光器122通过,例如,焊接的方式,设置于导电片121上,以保证将其侧面发射的激光可以穿过透镜140;由于激光接收器的结构构造与激光发射器相同,因此设计原理也与之相同,在此不做赘述;本实施例以激光器122为激光发射器为例进行说明。可以理解的是,在其他可选实施例中,激光器122还可以采用FP激光器122和DFP激光器122来实现,由于FP激光器122和DFP激光器122为垂直发光,激光器122可直接设置于底座110之上,可无需设置导电片121来调整激光的角度。在一可选实施例中,导电片121为长方体形,且垂直设置于水平底座110上;激光器122为垂直腔面激光发射器,其激光发射端口设置于背离底座110的侧面上,以使其输出的激光与垂直于底座110,并穿出透镜140。在另一可选实施例中,导电片121与底座110的角度以及激光发射的角度还可以为其他任意角度,通过在密闭空腔中设置相应的光学组件以进行角度校正。如此设置,不仅使得激光器122可在密封空腔中与外界电连接,还使得激光器122可以在密封空腔中输出/接收相应角度的激光,从而使得激光组件可在工业级环境下正常工作。In this embodiment, the
参照图1至图2,在本发明一实施例中,所激光模块120还包括:光探测器123,设置在所述底座110上,并与所述引脚组件150连接。Referring to FIGS. 1 to 2 , in an embodiment of the present invention, the
本实施例中,光探测器123可以采用光电光转换器件来实现。光探测器123用于检测激光器122发出或接收的激光,并可以根据的检测到激光输出相应的电信号,通过设置光探测器123,可以实时获取激光组件的工作参数,从而实现对激光组件的实时监测。In this embodiment, the
本发明还提供一种光模块,所述光模块包括:The present invention also provides an optical module, the optical module comprising:
电接口210;
激光组件,为权利要求1-5任一项所述的激光组件,所述激光组件与所述电接口210电连接;以及A laser assembly, which is the laser assembly described in any one of claims 1-5, the laser assembly is electrically connected to the
主控装置220,与所述激光组件电连接。The
由于该光模块包括上述激光组件;所述激光组件的详细结构可参照上述实施例,此处不再赘述;可以理解的是,由于在光模块中使用了上述激光组件,因此,该光模块的实施例包括上述激光组件的全部实施例的全部技术方案,且所达到的技术效果也完全相同,在此不再赘述。Since the optical module includes the above-mentioned laser assembly; the detailed structure of the laser assembly can refer to the above-mentioned embodiments, which will not be repeated here; it can be understood that since the above-mentioned laser assembly is used in the optical module, the The embodiments include all the technical solutions of all the embodiments of the above-mentioned laser components, and the technical effects achieved are also the same, which will not be repeated here.
本实施例中,电接口210可以采用金手指等通讯接口来实现,电接口210用于接入622M、10G、25G等多种速率的电信号,以及还用于输出同样622M、10G、25G等多种速率的电信号。In this embodiment, the
主控装置220可以采用MCU、DSP或FPGA等微处理器来实现,本领域的技术人员可以在主控装置220中集成有相关的硬件电路和软件程序或算法,利用相关端口和引脚可以与光模块中其他的功能电路和模块连接,通过运行主控装置220内的相关电路和软件程序,以及调用相关数据,执行光模块的各项功能和处理数据,可对光模块进行DDM监控和实时调整。例如,主控装置220的相关端口和引脚可以与光探测器123电连接,以接收光探测器123输出的电信号;并可以通过运行软件程序或算法可对电信号进行相应的分析处理,以得到激光的各种参数,并通过将各种激光参数与相应的参考参数进行比较,从而可以实时判断出激光组件的工作状态。通过在本发明的光模块中使用上述激光组件,从而使得本发明的光模块也可应用于工业级应用环境,且通过设置主控装置220进行整体监控及调整,以使本发明的光模块可以更好的应用于工业级环境。The
参照图1至图2,在本发明一实施例中,所述激光组件的数量为两个,一个为激光发射组件230,另一个为激光接收组件240;1 to 2, in an embodiment of the present invention, the number of the laser components is two, one is the
所述激光发射组件230用于将所述电接口210接入的电信号转换为光信号后输出;The
所述激光接收组件240用于接收光信号,并用于将接收到的光信号转换为电信号后输出至所述电接口210;The
所述光模块还包括:The optical module further includes:
激光驱动器250,分别与所述电接口210、所述主控装置220及所述激光发射组件230电连接;所述激光驱动器250用于在所述主控器的控制下,根据所述电接口210接入的电信号驱动所述激光发射组件230工作;以及The
限幅放大器260,所述限幅放大器260分别与所述主控装置220、所述电接口210及所述激光接收组件240电连接;所述限幅放大器260用于在所述主控装置220的控制下,将所述激光接收组件240输出的电信号经限幅放大后输出至所述电接口210。A
本实施例中,当激光组件为激光发射组件230时,激光器122可以采用上述三种激光发射器中的一种来实现,在此不再赘述;当激光组件为激光接收组件240时,激光器122可以采用雪崩光电二极管来实现;本实施例以SFP28-SR光模块为例进行说明;可以理解的是,在其他可选的光模块类型中,本领域技术人员可以根据实际需要设置多个本发明的激光组件。主控装置220可用于检测输入激光驱动器250的电信号速率,并输出相应的控制信号至激光驱动器250,以使激光驱动器250中相应的电子器件工作在相应的工作区间中,从而可以根据电接口210不同时刻接入电信号驱动激光发射器发出激光形式的光信号,以实现电信号到光信号的转换。In this embodiment, when the laser component is the
限幅放大电器用于在主控装置220的控制下将激光接收器转换得到的电信号经限幅放大处理后输出。具体为,主控装置220通过相应的检测端口检测输入至限幅放大器260的电信号的速率,同时可通过相应的控制端口调节限幅放大器260的放大倍数以及上限电平,以使限幅放大器260的工作状态与电信号的速率相匹配。当限幅放大器260接收到的电信号的信号幅度正常时,限幅放大器260工作于线性工作区,将电信号进行相应的放大后输出;当电信号的信号幅度超出上限电平时,限幅放大器260工作于非线性工作区,限幅放大器260输出一上限电信号。通过设置激光接收组件240及激光发射组件230,使得本发明光模块具有收发一体的功能,且通过主控装置220配置激光驱动器250及限幅放大器260的工作状态可以使得光模块处于最佳工作状态。The limiting and amplifying electrical appliance is used to output the electrical signal converted by the laser receiver after limiting and amplifying processing under the control of the
参照图1至图2,在本发明一实施例中,所述光模块还包括:1 to 2, in an embodiment of the present invention, the optical module further includes:
第一壳体及第一散热台,所述激光发射组件230、所述激光驱动器250及所述第一散热台容置于所述第一壳体内;所述第一散热台与所述第一壳体的内表侧贴合设置,所述第一散热台背离所述第一壳体的一侧上对应所述激光发射组件230、所述激光驱动器250分别设置有高导散热片,所述激光发射组件230、所述激光驱动器250与各自对应的高导散热片贴合设置,以将热量经所述高导散热片及所述散热台传递至所述第一壳体;A first casing and a first heat sink, the
第二壳体及第二散热台,所述激光接收组件240、所述限幅放大器260及所述第二散热台容置于所述第二壳体内;所述第二散热台与所述第二壳体的内表侧贴合设置,所述第二散热台背离所述第二壳体的一侧上对应所述激光接收组件240、所述限幅放大器260分别设置有高导散热片,所述激光接收组件240、所述限幅放大器260与各自对应的高导散热片贴合设置,以将热量经所述高导散热片及所述散热台传递至所述第二壳体;The second casing and the second heat dissipation stage, the
外壳,所述第一壳体与所述第二壳体容置于所述外壳内,所述外壳对应所述第一壳体与所述第二壳体分别凸伸有连接部,且所述第一壳体及所述第二壳体的外表侧与各自对应的连接部贴合设置,以传递热量至所述外壳。an outer casing, the first casing and the second casing are accommodated in the outer casing, the outer casing respectively protrudes a connecting portion corresponding to the first casing and the second casing, and the outer casing The outer surfaces of the first casing and the second casing are fitted with their corresponding connecting parts, so as to transmit heat to the outer casing.
本实施例中,第一壳体、第二壳体及外壳均可采用高导热材料制成,第一散热台及第二散热台可以为金属散热台。由于光模块中激光驱动器250、激光发射组件230、限幅放大器260及激光接收组件240均为发热量大且对温度敏感的器件,因此需要加强上述器件的散热能力。高导散热片用于将其贴合器件的热量传递至散热台,并通过散热台传递至第一壳体或第二壳体;在一可选实施例中,高导散热片的厚度为1mm,高导散热片的厚度根据实际需要确定,在此不做限定。第一壳体及第二壳体用于将接收到的热量通过对应的连接部导出至外壳上,最终由外壳散出。在其他可选实施例中,还可以在上述器件中的封装结构中使用EMI(电磁干扰)材料,以保证上述器件EMI特性的稳定,且上述器件中的电子元件可以设置于高TG值的印刷电路板上,以在高温时保证电气性能稳定。通过设置高导散热片及散热台,以及外壳结构针对性的加强相关器件的散热,以保证光模块中各功能电路能在高温时正常工作。In this embodiment, the first shell, the second shell and the outer shell can be made of high thermal conductivity materials, and the first heat sink and the second heat sink can be metal heat sinks. Since the
参照图1至图2,在本发明一实施例中,所述光模块还包括发射信号整形电路270及接收信号整形电路280;1 to 2, in an embodiment of the present invention, the optical module further includes a transmit
所述发射信号整形电路270分别与所述电接口210、所述激光驱动器250及所述主控装置220电连接;所述发射信号整形电路270用于在所述主控装置220的控制下,对所述电接口210接入的电信号进行整形,以锁定预设速率区间的电信号,并将相应的电信号经整形后输出至所述激光驱动器250;The transmission
所述接收信号整形电路280分别与所述限幅放大器260、所述电接口210及所述主控装置220电连接;所述接收信号整形电路280用于在所述主控装置220的控制下,对所述限幅放大器260限幅放大后输出的电信号进行整形,以锁定预设速率区间的电信号,并将相应的电信号经整形后输出至所述电接口210。The received
本实施例中,发射信号整形电路270及接收信号整形电路280均可采用CDR时钟数据恢复电路来实现。发射信号整形电路270及接收信号整形电路280可分别根据主控装置220输出的参考时钟,对相应的速率的电信号以数据对齐的方式进行相位调整,降低抖动等整形处理,以提高电信号的质量,并使其符合后续功能模块的传输要求。可以理解的是,主控装置220可以通过控制输出至控制发射信号整形电路270及接收信号整形电路280的参考时钟,以使其只对相应速率区间的电信号进行整形;而在其他速率区间,主控装置220可以控制发射信号整形电路270及接收信号整形电路280旁路,速率区间的设置根据实际需要确定,在此不做限定。当然在其可选实施例中,主控装置220还可以输出其他的控制信号来实现速率区间选择。In this embodiment, both the transmit
在一可选实施例中,在检测到电信号速率小于10G时,主控装置220控制发射信号整形电路270及接收信号整形电路280旁路;在检测到电信号速率处于24G~28G区间时,主控装置220输出相应的参考时钟至发射信号整形电路270或接收信号整形电路280,以驱动其工作,可使得25G信号传输距离延长至300M,相较于传统光模块传输距离的100M而言,无疑是大大延长了25G信号的传输距离。In an optional embodiment, when detecting that the electrical signal rate is less than 10G, the
在另一可选实施例中,电接口210上设置有速率选择位RS0和RS1,以用于分别识别输入电信号的速率及输出电信号的速率,并将识别结果输出至主控装置220。通过主控装置220控制发射信号整形电路270及接收信号整形电路280的开启和旁路,使得本发明光模块可支持622Mbps~28.05Gbps范围内的CPRI、eCPRI、Ethernet、Fibre-Channel和SDH等多种速率协议规范的信号传输,并通过对25G信号进行整形调整,以提高其稳定性,从而可以增加25G信号传输的有效的距离。In another optional embodiment, the
本发明光模块在一可选实施例中还可以具有电源管理电路290,电源管理电路290可以采用多路DC-DC电路或者电源管理集成电路来实现。电接口210还用于接入直流电压,以为光模块工作提供供电电压。在该可选实施例中,主控装置220、发射信号整形电路270及接收信号整形电路280的供电端分别与电接口210连接,由电接口210接入的直流电压直接进行供电。主控装置220可以根据其他功能电路的监测结果,控制电源管理电路290输出至合适的供电电压至相应的功能电路,以为该功能模块或电路中的元件提供合适工作电压,从而降低光模块整体损耗。在另一可选实施例中,电源管理电路290中还具有上电缓启动功能,以用于在光模块上电初期,控制光模块中各功能电路的上电时序,以避免上电冲击电流对各电路产生损害。可以理解的是,主控装置220还可以用于检测光模块中各功能电路的工作电压,并在检测到各功能电路的工作电压过压或欠压时,输出相应的控制信号至电源管理电路290,以控制电源管理电路290断开该路供电。在另一可选实施例中,本发明光模块具有FEC(前向纠错:Forward Error Correction)功能,在FEC功能配合下可实现25G信号在OM3光纤中200m传输和在OM4光纤中300m传输;不开启FEC功能,可在OM3光纤中150m传输和在OM4光纤中200m传输,从而拓展了其应用场景。In an optional embodiment, the optical module of the present invention may further have a
本发明还提供一种光纤通讯设备,所述光纤通讯设备包括如上所述的激光组件;The present invention also provides an optical fiber communication device, the optical fiber communication device includes the above-mentioned laser assembly;
或者,所述光纤通讯设备包括如上所述的光模块。Alternatively, the optical fiber communication device includes the above-mentioned optical module.
该光纤通讯设备包括上述激光组件;所述激光组件的详细结构可参照上述实施例,此处不再赘述;可以理解的是,由于在光纤通讯设备中使用了上述激光组件,因此,该光纤通讯设备的实施例包括上述激光组件全部实施例的全部技术方案,且所达到的技术效果也完全相同,在此不再赘述。光纤通讯设备还可以包括上述光模块,光模块已在上文中进行说明,此处不再赘述。The optical fiber communication equipment includes the above-mentioned laser assembly; the detailed structure of the laser assembly can refer to the above-mentioned embodiments, which will not be repeated here; it can be understood that since the above-mentioned laser assembly is used in the optical fiber communication equipment, the The embodiments of the device include all the technical solutions of all the above embodiments of the laser assembly, and the technical effects achieved are also the same, which will not be repeated here. The optical fiber communication device may further include the above-mentioned optical module, which has been described above and will not be repeated here.
以上所述仅为本发明的可选实施例,并非因此限制本发明的专利范围,凡是在本发明的发明构思下,利用本发明说明书及附图内容所作的等效结构变换,或直接/间接运用在其他相关的技术领域均包括在本发明的专利保护范围内。The above descriptions are only optional embodiments of the present invention, and are not intended to limit the scope of the present invention. Under the inventive concept of the present invention, any equivalent structural transformations made by using the contents of the description and drawings of the present invention, or direct/indirect Applications in other related technical fields are included in the scope of patent protection of the present invention.
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