CN111987068B - Lead wire structure and lead frame using same - Google Patents
Lead wire structure and lead frame using same Download PDFInfo
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- CN111987068B CN111987068B CN202010803895.8A CN202010803895A CN111987068B CN 111987068 B CN111987068 B CN 111987068B CN 202010803895 A CN202010803895 A CN 202010803895A CN 111987068 B CN111987068 B CN 111987068B
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- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title description 6
- 229920003023 plastic Polymers 0.000 claims abstract description 21
- 239000004033 plastic Substances 0.000 claims abstract description 21
- 239000002184 metal Substances 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 238000003780 insertion Methods 0.000 claims description 15
- 230000037431 insertion Effects 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 8
- 229910010293 ceramic material Inorganic materials 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 18
- 238000005516 engineering process Methods 0.000 abstract description 17
- 238000003466 welding Methods 0.000 abstract description 14
- 239000000243 solution Substances 0.000 description 8
- 238000004806 packaging method and process Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- -1 polybutylene terephthalate Polymers 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000012966 insertion method Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002577 polybenzoxazole Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
- H01L23/4952—Additional leads the additional leads being a bump or a wire
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49565—Side rails of the lead frame, e.g. with perforations, sprocket holes
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention relates to a lead structure and a lead frame using the same, comprising a lead module A and a lead module B which have the same structure, a chip carrying unit, a connecting frame and an insulating plastic package structure, wherein the lead module consists of a plurality of lead structures; according to the scheme, the technology that the lead and the lead frame are electrically connected by using a welding method is not used any more when the chip is packaged is realized.
Description
Technical Field
The invention relates to the technical field of chip conductive packaging, in particular to the field of semiconductor chip connecting equipment, and specifically relates to a lead structure and a lead frame using the same.
Background
The lead frame is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electrical connection between a circuit leading-out end inside a chip and an external lead by means of bonding materials to form an electrical circuit, plays a role of a bridge connected with an external lead, needs to be used in most semiconductor integrated blocks, and is an important basic material in the electronic information industry.
Lead frames typically require injection molding of the conductive sheet and plastic as a single piece to achieve a rigid connection. In the injection molding process of the lead frame, in order to ensure that the insert and the conductive sheet do not deviate or leak, a layer of plastic is usually additionally injected on the insert, and the insert is ensured not to be displaced during secondary injection molding through the layer of plastic.
In the prior art, when a semiconductor chip is packaged, a lead frame and a lead are firstly installed, the chip is installed after the installation is finished, and then, the secondary injection molding is further carried out. In the prior art, when a lead structure and a lead frame are mounted or fixed, welding methods are adopted, which causes technical defects of infirm welding and the like when the lead structure and the lead frame are welded. With the progress of the technology, the demand of the society for the chip technology is more and more extensive, which leads to the higher technical requirement for the comprehensive technology of the chip, and in order to further perfect the chip technology, the invention develops a lead structure and a lead frame using the lead structure, thereby solving the technical defect that the lead frame of the chip is fixed with the lead through welding.
Disclosure of Invention
The invention aims to: the lead structure and the lead frame using the lead structure are provided for solving the technical defect that the lead frame and the lead of the existing chip are fixed through welding. The invention realizes the technology of electrically connecting the lead and the lead frame without using a welding method when packaging the chip by arranging the lead structure, the lead frame and other structures. The invention can effectively realize the technology of electrically connecting the lead and the lead frame without using a welding method when packaging the chip.
In order to realize the technical scheme, the invention is realized by the following technical scheme:
a lead structure comprises a lead and self-destruction units, wherein the self-destruction units are arranged at two ends of the lead;
the self-destruction unit comprises a plug-in part and a plurality of self-destruction parts, and the self-destruction parts are arranged on the plug-in part.
In order to better implement the present invention, as a further description of the above technical solution, the self-destruction part has a plurality of barbs, and the barbs are annularly arrayed on the insertion part.
As a further description of the above technical solution, the lead includes a metal wire body, an insulating housing, and a clamping node, the metal wire body is fixedly connected to the insertion portion, the insulating housing is sleeved on the metal wire body, and the clamping node is disposed at a connection position of the insertion portion and the metal wire body, and is electrically connected to the insertion portion.
A lead frame comprises a lead module A and a lead module B which have the same structure, a chip carrying unit, a connecting frame and an insulating plastic package structure, wherein the lead module consists of a plurality of lead structures, one end of the lead module A is fixedly connected with the chip carrying unit, the other end of the lead module A is fixedly connected with the connecting frame, one end of the lead module B is fixedly connected with the connecting frame, the other end of the lead module B is fixedly connected with a circuit board, a chip is placed on the chip carrying unit and is electrically connected with the chip, the chip is arranged on the inner side of the connecting frame, and the insulating plastic package structure carries out insulating plastic package on the chip carrying unit and the connecting frame which are connected through the lead structures;
the chip carrying unit comprises a chip containing area, a plurality of chip circuit connectors, a plurality of metal wires and a plurality of first lead connectors, wherein the chip circuit connectors are uniformly distributed at the edge position of the chip containing area and are respectively and electrically connected with one ends of the metal wires, the other ends of the metal wires are respectively and electrically connected with the first lead connectors, the first lead connectors are arranged at the outer sides of the chip circuit connectors and are inseparably inserted with one ends of the self-destruction units of the lead structures;
the first lead joint comprises a first slot and a plurality of first anti-drop rings, the first slot is arranged on the chip containing area, and the first anti-drop rings are arranged in the first slot.
In order to better realize the invention, the connecting frame comprises a frame body, a plurality of second lead connectors and a plurality of third lead connectors, the second lead connectors are uniformly distributed on the frame body close to one side of the chip carrying unit and are inseparably inserted with the other end of the self-destruction unit of the lead structure, and the third lead connectors are arranged on the frame body far away from one side of the chip carrying unit.
The connecting frame comprises a frame body, the second lead joint comprises a second slot and a plurality of second anti-slip rings, the second slot is arranged on the chip containing area, the second anti-slip rings are arranged in the second slot, the third lead joint is the same as the second lead joint in structure, and the third lead joint is electrically connected with the second lead joint.
The connecting frame comprises a frame body, one end of the lead module B is fixedly connected with the third lead connector, and the other end of the lead module B is fixedly connected with the circuit board.
The connecting frame comprises a frame body, and the insulating plastic package structure is made of insulating organic molecular materials or ceramic materials.
Compared with the prior art, the invention has the following advantages and beneficial effects:
1. the lead structure solves the problem of improving the conventional lead in the prior art by arranging the lead, the self-destruction unit and other structures, and further realizes the technology of fixing the lead without applying a welding method.
2. This lead frame has realized no longer carrying out the fixed technology to the lead wire through welding technique when encapsulating the chip through setting up lead structure, chip carries on the unit, and connection frame, insulating plastic envelope structure isotructure.
3. The invention finally realizes the technology of electrically connecting the packaged chip and the circuit board by using the lead structure and the lead frame twice without using a welding method when the packaged chip is placed on the circuit board.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic plan view of the present invention;
FIG. 2 is a schematic plan view of a lead structure according to the present invention;
FIG. 3 is a schematic diagram of a planar structure of a lead frame according to the present invention;
FIG. 4 is a schematic view of the cross-sectional structure A-A of the present invention.
In the figure, the mark 1-lead module, 2-chip carrying unit, 3-connection frame, 4-insulating plastic package structure, 101-lead module A, 102-lead module B, 11-lead structure, 21-chip containing area, 22-chip circuit connector, 23-metal wire, 24-first lead connector, 31-frame body, 32-second lead connector, 33-third lead connector, 111-lead, 112-self-destruction unit, 241-first slot, 242-first anti-detachment ring, 321-second slot, 322-second anti-detachment ring, 1111-metal wire body, 1112-insulating shell, 1113-clamp node, 1121-insertion part, 1122-self-destruction part.
Detailed Description
The present invention will be described in detail and with reference to preferred embodiments thereof, but the present invention is not limited thereto.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "first", "second", "third", etc. are used only for distinguishing the description, and are not intended to indicate or imply relative importance.
The terms "upper", "lower", "left", "right", "inner", "outer", and the like, refer to orientations or positional relationships based on orientations or positional relationships illustrated in the drawings or orientations and positional relationships that are conventionally used in the practice of the products of the present invention, and are used for convenience in describing and simplifying the invention, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the invention.
Furthermore, the terms "vertical" and the like do not require absolute perpendicularity between the components, but may be slightly inclined. Such as "vertical" merely means that the direction is relatively more vertical and does not mean that the structure must be perfectly vertical, but may be slightly inclined.
In the description of the present invention, it is also to be noted that the terms "disposed," "mounted," "connected," and the like are to be construed broadly unless otherwise specifically stated or limited. For example, the connection can be fixed, detachable or integrated; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1:
as a preferred embodiment, it is shown in FIGS. 1 to 2 and 4;
a lead structure comprises a lead 111 and a self-destruction unit 112, wherein the self-destruction unit 112 is arranged at two ends of the lead 111;
the self-destruction unit 112 includes a plug part 1121 and a plurality of self-destruction parts 1122, and the self-destruction parts 1122 are disposed on the plug part 1121.
In order to more clearly and clearly illustrate the present invention, in this embodiment, as a preferred embodiment, the self-destruct unit 112 is disposed at two ends of the lead 111, so that a technique of fixing the lead 111 without using a soldering method when the lead structure 11 is used in a chip packaging technology is realized.
In order to further clearly and clearly illustrate the present invention, in the present embodiment, as a preferred embodiment, by providing the insertion portion 1121, the plurality of self-destruction portions 1122, and the like, a technology capable of mounting the lead 111 by a fast insertion method when the lead structure 11 is used in a chip packaging process is realized. Meanwhile, the self-destruction units 1122 are arranged on the self-destruction unit 112, so that the conductive efficiency of the lead structure 11 is effectively guaranteed.
In order to better implement the present invention, as further described in the above technical solution, the self-destructing part 1122 has a plurality of barbs annularly arrayed on the inserting part 1121.
In order to more clearly and clearly illustrate the present invention, the self-destruct portion 1122 described in this embodiment is a barb, which has the following advantages: when the lead wire 111 having the aforementioned structure is mounted, the lead wire 111 may function as a technique for preventing the lead wire 111 from falling off through the barb structure.
As a further description of the above technical solution, the lead 111 includes a wire body 1111, an insulating housing 1112, and a clamping segment 1113, the wire body 1111 is fixedly connected to the insertion part 1121, the insulating housing 1112 is sleeved on the wire body 1111, and the clamping segment 1113 is disposed at a connection position between the insertion part 1121 and the wire body 1111 and electrically connected to the insertion part 1121.
In order to more clearly and clearly illustrate the present invention, as a preferred embodiment, the lead 111 described in this embodiment is provided with the wire body 1111, the insulating housing 1112, the clamping joint 1113, and the like, so that the lead 111 is protected during the installation process, and the risk that the lead 111 is broken during the use process can be reduced.
In order to more clearly and clearly illustrate the present invention, as a preferred embodiment, the metal wire body 1111 in this embodiment is made of copper, gold, silver, an alloy of copper, an alloy of gold, and an alloy of silver, which have the advantage that the resistivity of these three types of pure metal materials or an alloy material composed of only any two or three of these three metals is relatively low, which greatly helps the working efficiency of the chip.
Through the scheme, the problem that the conventional lead in the prior art is transformed is solved, and the technology that the lead is not fixed by using a welding method is further realized.
Example 2:
as a preferred embodiment, it is shown in FIG. 1 to FIG. 4;
this example is a further clear and definite illustration of the present invention based on example 1.
A lead frame comprises a lead module A101 and a lead module B102 which are identical in structure, a chip carrying unit 2, a connecting frame 3 and an insulating plastic package structure 4, wherein the lead module 1 is composed of lead structures 11 in a plurality of embodiments, one end of the lead module A101 is fixedly connected with the chip carrying unit 2, the other end of the lead module A101 is fixedly connected with the connecting frame 3, one end of the lead module B102 is fixedly connected with the connecting frame 3, the other end of the lead module B102 is fixedly connected with a circuit board, a chip is placed on the chip carrying unit 2 and is electrically connected with the chip, the chip is arranged on the inner side of the connecting frame 3, and the insulating plastic package structure 4 carries out insulating plastic package on the chip carrying unit 2 and the connecting frame 3 after the lead modules 11 are connected;
the chip carrying unit 2 comprises a chip containing area 21, a plurality of chip circuit connectors 22, a plurality of metal wires 23 and a plurality of first lead connectors 24, wherein the chip circuit connectors 22 are uniformly distributed at the edge position of the chip containing area 21 and are respectively and electrically connected with one ends of the metal wires 23, the other ends of the metal wires 23 are respectively and electrically connected with the first lead connectors 24, and the first lead connectors 24 are arranged at the outer side of the chip circuit connectors 22 and are inseparably inserted with one ends of the self-destruction units 112 of the lead structures 11;
the first lead tab 24 includes a first slot 241 and a plurality of first anti-slip rings 242, the first slot 241 is disposed on the chip holding area 21, and the first anti-slip rings 242 are disposed in the first slot 241.
In order to more clearly and clearly illustrate the present invention, as a preferred embodiment, the lead frame described in this embodiment is provided with two sets of lead modules 1, chip mounting units 2, connecting frames 3, insulating plastic-sealed structures 4 and the like, which are formed by the lead structures 11 described in embodiment 1, and the lead 111 is inserted into the lead frame, so that the chip packaging technology is realized, and the technical defect that the chip can be electrically connected only by fixing the lead 111 on the lead frame by using a welding method in the chip packaging process in the prior art is solved.
In order to further clearly and clearly illustrate the present invention, as a preferred embodiment, the chip mounting unit 2 in the present embodiment further clearly illustrates the connection structure between the lead structure 11 and the lead frame by providing the chip holding area 21, the chip circuit connectors 22, the circuits, the first lead connectors 24, and the like. The operability of the invention is effectively ensured.
In order to further clearly and clearly illustrate the present invention, as a preferred embodiment, the first lead connector 24 in this embodiment effectively ensures that the lead 111 in the present invention has a strong anti-falling effect after being inserted into the first slot 241 by arranging a plurality of first anti-falling rings 242 and other structures in the first slot 241.
It should be particularly and clearly noted that, as a preferred embodiment, the manufacturing method of the chip holding area 21 described in the present embodiment is manufactured by an etching method.
In order to better implement the present invention, as a further description of the above technical solution, the connection frame 3 includes a frame body 31, a plurality of second lead connectors 32, and a plurality of third lead connectors 33, the second lead connectors 32 are uniformly distributed on the frame body 31 near one side of the chip mounting unit 2, and are non-detachably inserted with the other end of the self-destruction unit 112 of the lead structure 11, and the third lead connectors 33 are disposed on the frame body 31 far from one side of the chip mounting unit 2.
In order to more clearly and clearly illustrate the present invention, as a preferred embodiment, the connecting frame 3 in this embodiment effectively implements a technology of electrically connecting the chip and the lead frame by providing the frame body 31, the second lead connectors 32, and the third lead connectors 33, and electrically connecting the chip placed on the chip placing unit to the first lead connectors 24 and the second lead connectors 32 by plugging. And a third lead joint 33 which is the same as the second lead joint 32 is arranged on the frame body 31, so that a reserved interface is provided for the subsequent installation of the packaged chip.
As a further description of the above technical solution, the connection frame 3 includes a frame body 31, the second lead connector 32 includes a second slot 321, and a plurality of second anti-slip rings 322, the second slot 321 is disposed on the chip holding area 21, the second anti-slip rings 322 are disposed in the second slot 321, and the third lead connector 33 has the same structure as the second lead connector 32 and is electrically connected to the second lead connector 32.
In order to more clearly and clearly illustrate the present invention, as a preferred embodiment, the second lead connector 32 in this embodiment effectively ensures that the lead 111 in the present invention has a strong anti-separation effect after being inserted into the second slot 321 by arranging a plurality of second anti-separation rings 322 and the like in the second slot 321.
As a further description of the above technical solution, the connection frame 3 includes a frame body 31, one end of the lead module B102 is fixedly connected to the third lead connector 33, and the other end is fixedly connected to the circuit board.
As a further description of the above technical solution, the connection frame 3 includes a frame body 31, and the insulating plastic package structure 4 is made of an insulating organic molecular material or a ceramic material.
In order to more clearly and clearly illustrate the present invention, the insulating plastic package structure 4 described in this embodiment is made of organic molecular material or ceramic material, which is advantageous in that both the insulating technology and the heat generated by the chip can be transmitted.
It should be specifically and clearly noted that, as a preferred embodiment, the organic molecular material described in this embodiment may be a material such as an epoxy resin, a polyimide resin, a benzocyclobutene resin, a polybenzoxazole resin, polybutylene terephthalate, polycarbonate, polyethylene terephthalate, polyethylene, polypropylene, polyolefin, polyurethane, polyolefin, polyethersulfone, polyamide, polyurethane, an ethylene-vinyl acetate copolymer, or polyvinyl alcohol.
It should be further specifically and explicitly stated that, as a preferred embodiment, the first lead tab 24, the second lead tab 32 and the third lead tab 33 described in the present embodiment are all of the same specification structure, and thus the design is advantageous in that: the applicability of the lead structure 11 designed in the invention can be effectively improved, and the production cost of the product can be reduced.
Through the scheme, the lead is not fixed any more through a welding technology when the chip is packaged.
Example 3:
as a preferred embodiment, combine fig. 1-4 to show;
this example is a further clear and clear illustration of the invention based on example 1 and example 2.
In order to more clearly and clearly illustrate the present invention, as a preferred embodiment, the lead structure 11 described in the embodiment and the lead frame of the embodiment described in this embodiment use two sets of the lead structures 11 described in several embodiments 1 and the lead frames described in examples 2, so that when a packaged chip is mounted on a circuit board, the packaged chip and the circuit board are not soldered by using a soldering method as in the prior art, and a technology for electrically connecting the packaged chip and the circuit board without using a soldering method when the packaged chip is placed on the circuit board is realized.
In order to better implement the present invention, as a preferred embodiment, as shown in fig. 1 to 4, the working process of the present invention is as follows: firstly, manufacturing a chip, a lead frame and a lead structure 11, further, placing the chip on a chip containing area 21 of the lead frame and fixing the chip, further, respectively inserting two ends of a lead 111 on the first lead connector 24 and the second lead connector 32 and electrically connecting the chip contained in the chip containing area 21 with a connecting frame 3, further, performing plastic packaging on the structure formed in the previous step by using an insulating plastic packaging structure 4 to form a packaged chip body, further, inserting one end of the lead 111 in a third lead connector 33 and inserting the other end of the lead 111 on a circuit board during use, and finally, forming a complete and completely packaged chip. Through the scheme, the technology that the packaged chip is electrically connected with the circuit board without using a welding method when the packaged chip is placed on the circuit board is finally realized.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. A lead structure, characterized by: the self-destruction type battery lead comprises a lead (111) and self-destruction units (112), wherein the self-destruction units (112) are arranged at two ends of the lead (111);
the self-destruction unit (112) comprises an insertion part (1121) and a plurality of self-destruction parts (1122), wherein the self-destruction parts (1122) are arranged on the insertion part (1121);
the self-destruction part (1122) is provided with a plurality of barbs, and the barbs are annularly arrayed on the insertion part (1121).
2. A lead structure according to claim 1, wherein: the lead (111) comprises a metal wire body (1111), an insulating shell (1112) and a clamping node (1113), wherein the metal wire body (1111) is fixedly connected with the insertion part (1121), the insulating shell (1112) is sleeved on the metal wire body (1111), and the clamping node (1113) is arranged at the connection position of the insertion part (1121) and the metal wire body (1111) and is electrically connected with the insertion part (1121).
3. A lead frame, characterized by: comprises a lead module A (101) and a lead module B (102) which have the same structure, a chip carrying unit (2), a connecting frame (3) and an insulating plastic package structure (4), the lead module (1) is composed of a plurality of lead structures (11) as claimed in any one of claims 1 to 2, wherein one end of the lead module A (101) is fixedly connected with the chip carrying unit (2), the other end is fixedly connected with the connecting frame (3), one end of the lead module B (102) is fixedly connected with the connecting frame (3), the other end is fixedly connected with the circuit board, a chip is placed on the chip carrying unit (2), the chip carrying unit is electrically connected with a chip and arranged on the inner side of the connecting frame (3), and the insulating plastic package structure (4) is used for insulating plastic package of the chip carrying unit (2) and the connecting frame (3) which are connected through the lead structure (11);
the chip carrying unit (2) comprises a chip containing area (21), a plurality of chip circuit connectors (22), a plurality of metal wires (23) and a plurality of first lead connectors (24), wherein the chip circuit connectors (22) are uniformly distributed at the edge position of the chip containing area (21) and are respectively electrically connected with one ends of the metal wires (23), the other ends of the metal wires (23) are respectively electrically connected with the first lead connectors (24), and the first lead connectors (24) are arranged on the outer side of the chip circuit connectors (22) and are inseparably inserted with one end of a self-destruction unit (112) of the lead structure (11);
the first lead connector (24) comprises a first slot (241) and a plurality of first anti-slip rings (242), the first slot (241) is arranged on the chip containing area (21), and the first anti-slip rings (242) are arranged in the first slot (241).
4. A lead frame according to claim 3, characterized in that: the connecting frame (3) comprises a frame body (31), a plurality of second lead connectors (32) and a plurality of third lead connectors (33), wherein the second lead connectors (32) are uniformly distributed on the frame body (31) close to one side of the chip carrying unit (2), the second lead connectors and the other end of a self-destruction unit (112) of the lead structure (11) are connected in an undetachable and inserting mode, and the third lead connectors (33) are arranged on the frame body (31) far away from one side of the chip carrying unit (2).
5. A lead frame according to claim 4, characterized in that: the second lead connector (32) comprises a second slot (321) and a plurality of second anti-drop rings (322), the second slot (321) is arranged on the chip containing area (21), the second anti-drop rings (322) are arranged in the second slot (321), and the third lead connector (33) is identical to the second lead connector (32) in structure and is electrically connected with the second lead connector (32).
6. A lead frame according to claim 4, characterized in that: one end of the lead module B (102) is fixedly connected with the third lead connector (33), and the other end of the lead module B is fixedly connected with the circuit board.
7. A lead frame according to claim 3, characterized in that: the insulating plastic package structure (4) is made of insulating organic molecular materials or ceramic materials.
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| CN202010803895.8A CN111987068B (en) | 2020-08-11 | 2020-08-11 | Lead wire structure and lead frame using same |
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| CN110753997A (en) * | 2017-06-21 | 2020-02-04 | 三菱电机株式会社 | Semiconductor device, power conversion device, and method for manufacturing semiconductor device |
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| CN101459153A (en) * | 2007-12-10 | 2009-06-17 | 英飞凌科技股份有限公司 | Electronic device |
| CN102237332A (en) * | 2010-04-28 | 2011-11-09 | 三菱电机株式会社 | Semiconductor device and method of manufacturing the same |
| CN102456652A (en) * | 2010-10-20 | 2012-05-16 | 三菱电机株式会社 | Power semiconductor device |
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| CN111987068A (en) | 2020-11-24 |
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