CN112004378A - Heat dissipation back splint and mobile terminal - Google Patents
Heat dissipation back splint and mobile terminal Download PDFInfo
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- CN112004378A CN112004378A CN202010812313.2A CN202010812313A CN112004378A CN 112004378 A CN112004378 A CN 112004378A CN 202010812313 A CN202010812313 A CN 202010812313A CN 112004378 A CN112004378 A CN 112004378A
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- heat dissipation
- clip
- control circuit
- mobile terminal
- temperature resistor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20518—Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Theoretical Computer Science (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Telephone Function (AREA)
Abstract
The invention discloses a heat dissipation back splint and a mobile terminal, wherein the heat dissipation back splint comprises: the heat dissipation shell is arranged in a working circuit inside the heat dissipation shell and a master control circuit electrically connected with the working circuit, wherein at least two heat dissipation areas electrically connected with the working circuit are divided on at least one outer surface of the heat dissipation shell, and each heat dissipation area is provided with at least one temperature resistor electrically connected with the master control circuit. The humanized heat dissipation back splint is realized, and the heat dissipation back splint can be independently regulated and controlled in a partitioned mode according to the actual heating condition of the terminal equipment, so that the heat dissipation efficiency is improved, the heat dissipation energy consumption is reduced, and the user experience is enhanced.
Description
Technical Field
The invention relates to the field of mobile communication, in particular to a heat dissipation back clip and a mobile terminal.
Background
In the prior art, with the rapid development of the intelligent terminal device technology, the data processing requirement of a user on an intelligent terminal is higher and higher, for example, a graphic image processing operation is performed by using the intelligent terminal, or a large two-dimensional or three-dimensional game is performed, and the like, such operations have a higher resource processing requirement on the intelligent terminal, and are limited by the power consumption control technology of the current chip, and when the above task is performed, a bad experience that the back shell of the device is scalded may be brought to the user.
Among the prior art, a batch of heat dissipation back splint that release in order to solve intelligent terminal backshell and scald have appeared, and this type of heat dissipation back splint comprises a fan and fin usually, and this type of heat dissipation back splint is because single structure and fixed, and the radiating effect that brings is limited, and can't carry out the adaptability adjustment according to the source and the state of generating heat of smart machine, and user experience is not good.
Disclosure of Invention
In order to solve the technical defects in the prior art, the invention provides a heat dissipation back clip, which comprises: the heat dissipation shell is arranged in a working circuit inside the heat dissipation shell and a master control circuit electrically connected with the working circuit, wherein at least two heat dissipation areas electrically connected with the working circuit are divided on at least one outer surface of the heat dissipation shell, and each heat dissipation area is provided with at least one temperature resistor electrically connected with the master control circuit.
Optionally, the heat dissipation back splint includes that the heat dissipation surface of laminating in the terminal equipment back contains four heat dissipation areas.
Optionally, the heat dissipation back clip includes four temperature resistors disposed in the four heat dissipation areas.
Optionally, the four temperature resistors are respectively a first temperature resistor corresponding to the heating center of the processing element, a second temperature resistor corresponding to the heating center of the charging element, a third temperature resistor corresponding to the heating center of the battery element, and a fourth temperature resistor corresponding to the heating center of the radio frequency element.
Optionally, the main control circuit is provided with four signal input pins, and the four signal input pins are respectively connected with the first temperature resistor, the second temperature resistor, the third temperature resistor and the fourth temperature resistor.
Optionally, the main control circuit is provided with four signal output pins, which are respectively connected with four input pins of the working circuit.
Optionally, the four heat dissipation areas are respectively provided with one refrigeration piece, the working circuit is provided with four signal output pins, and the four signal output pins are respectively connected to the four refrigeration pieces.
Optionally, the heat dissipation back splint further includes a power input interface, and the power input interface is electrically connected with the working circuit and the main control circuit respectively.
Optionally, the heat dissipation back splint further includes a battery, and a power output interface of the battery is electrically connected to the working circuit and the main control circuit, respectively.
The invention also provides a mobile terminal, at least one part of area of the mobile terminal shell comprises the heat dissipation clip.
The heat dissipation back splint and the mobile terminal are implemented by arranging the heat dissipation shell, the working circuit arranged in the heat dissipation shell and the main control circuit electrically connected with the working circuit, wherein at least one outer surface of the heat dissipation shell is divided into at least two heat dissipation areas electrically connected with the working circuit, and each heat dissipation area is provided with at least one temperature resistor electrically connected with the main control circuit. The humanized heat dissipation back splint is realized, and the heat dissipation back splint can be independently regulated and controlled in a partitioned mode according to the actual heating condition of the terminal equipment, so that the heat dissipation efficiency is improved, the heat dissipation energy consumption is reduced, and the user experience is enhanced.
Drawings
The invention will be further described with reference to the accompanying drawings and examples, in which:
fig. 1 is a schematic diagram of a hardware structure of a mobile terminal according to the present invention;
fig. 2 is a communication network system architecture diagram provided by an embodiment of the present invention;
FIG. 3 is a block diagram of a first embodiment of a heat sink clip according to the present invention;
fig. 4 is a block diagram of a heat-dissipating back clip according to a second embodiment of the present invention.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the following description, suffixes such as "module", "component", or "unit" used to denote elements are used only for facilitating the explanation of the present invention, and have no specific meaning in itself. Thus, "module", "component" or "unit" may be used mixedly.
The terminal may be implemented in various forms. For example, the terminal described in the present invention may include a mobile terminal such as a mobile phone, a tablet computer, a notebook computer, a palmtop computer, a Personal Digital Assistant (PDA), a Portable Media Player (PMP), a navigation device, a wearable device, a smart band, a pedometer, and the like, and a fixed terminal such as a Digital TV, a desktop computer, and the like.
The following description will be given by way of example of a mobile terminal, and it will be understood by those skilled in the art that the construction according to the embodiment of the present invention can be applied to a fixed type terminal, in addition to elements particularly used for mobile purposes.
Referring to fig. 1, which is a schematic diagram of a hardware structure of a mobile terminal for implementing various embodiments of the present invention, the mobile terminal 100 may include: RF (Radio Frequency) unit 101, WiFi module 102, audio output unit 103, a/V (audio/video) input unit 104, sensor 105, display unit 106, user input unit 107, interface unit 108, memory 109, processor 110, and power supply 111. Those skilled in the art will appreciate that the mobile terminal architecture shown in fig. 1 is not intended to be limiting of mobile terminals, which may include more or fewer components than those shown, or some components may be combined, or a different arrangement of components.
The following describes each component of the mobile terminal in detail with reference to fig. 1:
the radio frequency unit 101 may be configured to receive and transmit signals during information transmission and reception or during a call, and specifically, receive downlink information of a base station and then process the downlink information to the processor 110; in addition, the uplink data is transmitted to the base station. Typically, radio frequency unit 101 includes, but is not limited to, an antenna, at least one amplifier, a transceiver, a coupler, a low noise amplifier, a duplexer, and the like. In addition, the radio frequency unit 101 can also communicate with a network and other devices through wireless communication. The wireless communication may use any communication standard or protocol, including but not limited to GSM (Global System for Mobile communications), GPRS (General Packet Radio Service), CDMA2000(Code Division Multiple Access 2000), WCDMA (Wideband Code Division Multiple Access), TD-SCDMA (Time Division-Synchronous Code Division Multiple Access), FDD-LTE (Frequency Division duplex Long Term Evolution), and TDD-LTE (Time Division duplex Long Term Evolution).
WiFi belongs to short-distance wireless transmission technology, and the mobile terminal can help a user to receive and send e-mails, browse webpages, access streaming media and the like through the WiFi module 102, and provides wireless broadband internet access for the user. Although fig. 1 shows the WiFi module 102, it is understood that it does not belong to the essential constitution of the mobile terminal, and may be omitted entirely as needed within the scope not changing the essence of the invention.
The audio output unit 103 may convert audio data received by the radio frequency unit 101 or the WiFi module 102 or stored in the memory 109 into an audio signal and output as sound when the mobile terminal 100 is in a call signal reception mode, a call mode, a recording mode, a voice recognition mode, a broadcast reception mode, or the like. Also, the audio output unit 103 may also provide audio output related to a specific function performed by the mobile terminal 100 (e.g., a call signal reception sound, a message reception sound, etc.). The audio output unit 103 may include a speaker, a buzzer, and the like.
The a/V input unit 104 is used to receive audio or video signals. The a/V input Unit 104 may include a Graphics Processing Unit (GPU) 1041 and a microphone 1042, the Graphics processor 1041 Processing image data of still pictures or video obtained by an image capturing device (e.g., a camera) in a video capturing mode or an image capturing mode. The processed image frames may be displayed on the display unit 106. The image frames processed by the graphic processor 1041 may be stored in the memory 109 (or other storage medium) or transmitted via the radio frequency unit 101 or the WiFi module 102. The microphone 1042 may receive sounds (audio data) via the microphone 1042 in a phone call mode, a recording mode, a voice recognition mode, or the like, and may be capable of processing such sounds into audio data. The processed audio (voice) data may be converted into a format output transmittable to a mobile communication base station via the radio frequency unit 101 in case of a phone call mode. The microphone 1042 may implement various types of noise cancellation (or suppression) algorithms to cancel (or suppress) noise or interference generated in the course of receiving and transmitting audio signals.
The mobile terminal 100 also includes at least one sensor 105, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor includes an ambient light sensor that can adjust the brightness of the display panel 1061 according to the brightness of ambient light, and a proximity sensor that can turn off the display panel 1061 and/or a backlight when the mobile terminal 100 is moved to the ear. As one of the motion sensors, the accelerometer sensor can detect the magnitude of acceleration in each direction (generally, three axes), can detect the magnitude and direction of gravity when stationary, and can be used for applications of recognizing the posture of a mobile phone (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer and tapping), and the like; as for other sensors such as a fingerprint sensor, a pressure sensor, an iris sensor, a molecular sensor, a gyroscope, a barometer, a hygrometer, a thermometer, and an infrared sensor, which can be configured on the mobile phone, further description is omitted here.
The display unit 106 is used to display information input by a user or information provided to the user. The Display unit 106 may include a Display panel 1061, and the Display panel 1061 may be configured in the form of a Liquid Crystal Display (LCD), an Organic Light-Emitting Diode (OLED), or the like.
The user input unit 107 may be used to receive input numeric or character information and generate key signal inputs related to user settings and function control of the mobile terminal. Specifically, the user input unit 107 may include a touch panel 1071 and other input devices 1072. The touch panel 1071, also referred to as a touch screen, may collect a touch operation performed by a user on or near the touch panel 1071 (e.g., an operation performed by the user on or near the touch panel 1071 using a finger, a stylus, or any other suitable object or accessory), and drive a corresponding connection device according to a predetermined program. The touch panel 1071 may include two parts of a touch detection device and a touch controller. The touch detection device detects the touch direction of a user, detects a signal brought by touch operation and transmits the signal to the touch controller; the touch controller receives touch information from the touch sensing device, converts the touch information into touch point coordinates, sends the touch point coordinates to the processor 110, and can receive and execute commands sent by the processor 110. In addition, the touch panel 1071 may be implemented in various types, such as a resistive type, a capacitive type, an infrared ray, and a surface acoustic wave. In addition to the touch panel 1071, the user input unit 107 may include other input devices 1072. In particular, other input devices 1072 may include, but are not limited to, one or more of a physical keyboard, function keys (e.g., volume control keys, switch keys, etc.), a trackball, a mouse, a joystick, and the like, and are not limited to these specific examples.
Further, the touch panel 1071 may cover the display panel 1061, and when the touch panel 1071 detects a touch operation thereon or nearby, the touch panel 1071 transmits the touch operation to the processor 110 to determine the type of the touch event, and then the processor 110 provides a corresponding visual output on the display panel 1061 according to the type of the touch event. Although the touch panel 1071 and the display panel 1061 are shown in fig. 1 as two separate components to implement the input and output functions of the mobile terminal, in some embodiments, the touch panel 1071 and the display panel 1061 may be integrated to implement the input and output functions of the mobile terminal, and is not limited herein.
The interface unit 108 serves as an interface through which at least one external device is connected to the mobile terminal 100. For example, the external device may include a wired or wireless headset port, an external power supply (or battery charger) port, a wired or wireless data port, a memory card port, a port for connecting a device having an identification module, an audio input/output (I/O) port, a video I/O port, an earphone port, and the like. The interface unit 108 may be used to receive input (e.g., data information, power, etc.) from external devices and transmit the received input to one or more elements within the mobile terminal 100 or may be used to transmit data between the mobile terminal 100 and external devices.
The memory 109 may be used to store software programs as well as various data. The memory 109 may mainly include a storage program area and a storage data area, wherein the storage program area may store an operating system, an application program required by at least one function (such as a sound playing function, an image playing function, etc.), and the like; the storage data area may store data (such as audio data, a phonebook, etc.) created according to the use of the cellular phone, and the like. Further, the memory 109 may include high speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other volatile solid state storage device.
The processor 110 is a control center of the mobile terminal, connects various parts of the entire mobile terminal using various interfaces and lines, and performs various functions of the mobile terminal and processes data by operating or executing software programs and/or modules stored in the memory 109 and calling data stored in the memory 109, thereby performing overall monitoring of the mobile terminal. Processor 110 may include one or more processing units; preferably, the processor 110 may integrate an application processor, which mainly handles operating systems, user interfaces, application programs, etc., and a modem processor, which mainly handles wireless communications. It will be appreciated that the modem processor described above may not be integrated into the processor 110.
The mobile terminal 100 may further include a power supply 111 (e.g., a battery) for supplying power to various components, and preferably, the power supply 111 may be logically connected to the processor 110 via a power management system, so as to manage charging, discharging, and power consumption management functions via the power management system.
Although not shown in fig. 1, the mobile terminal 100 may further include a bluetooth module or the like, which is not described in detail herein.
In order to facilitate understanding of the embodiments of the present invention, a communication network system on which the mobile terminal of the present invention is based is described below.
Referring to fig. 2, fig. 2 is an architecture diagram of a communication Network system according to an embodiment of the present invention, where the communication Network system is an LTE system of a universal mobile telecommunications technology, and the LTE system includes a UE (User Equipment) 201, an E-UTRAN (Evolved UMTS Terrestrial Radio Access Network) 202, an EPC (Evolved Packet Core) 203, and an IP service 204 of an operator, which are in communication connection in sequence.
Specifically, the UE201 may be the terminal 100 described above, and is not described herein again.
The E-UTRAN202 includes eNodeB2021 and other eNodeBs 2022, among others. Among them, the eNodeB2021 may be connected with other eNodeB2022 through backhaul (e.g., X2 interface), the eNodeB2021 is connected to the EPC203, and the eNodeB2021 may provide the UE201 access to the EPC 203.
The EPC203 may include an MME (Mobility Management Entity) 2031, an HSS (Home Subscriber Server) 2032, other MMEs 2033, an SGW (Serving gateway) 2034, a PGW (PDN gateway) 2035, and a PCRF (Policy and Charging Rules Function) 2036, and the like. The MME2031 is a control node that handles signaling between the UE201 and the EPC203, and provides bearer and connection management. HSS2032 is used to provide registers to manage functions such as home location register (not shown) and holds subscriber specific information about service characteristics, data rates, etc. All user data may be sent through SGW2034, PGW2035 may provide IP address assignment for UE201 and other functions, and PCRF2036 is a policy and charging control policy decision point for traffic data flow and IP bearer resources, which selects and provides available policy and charging control decisions for a policy and charging enforcement function (not shown).
The IP services 204 may include the internet, intranets, IMS (IP Multimedia Subsystem), or other IP services, among others.
Although the LTE system is described as an example, it should be understood by those skilled in the art that the present invention is not limited to the LTE system, but may also be applied to other wireless communication systems, such as GSM, CDMA2000, WCDMA, TD-SCDMA, and future new network systems.
Based on the above mobile terminal hardware structure and communication network system, the present invention provides various embodiments of the method.
Example one
Fig. 3 is a block diagram of a heat-dissipating back clip according to a first embodiment of the present invention. This embodiment provides a heat dissipation back splint, and this heat dissipation back splint includes: the heat dissipation casing 100, set up in the inside working circuit 10 of heat dissipation casing, with working circuit 10 electric connection's main control circuit 20, wherein, at least one surface of heat dissipation casing 100 divide at least two with working circuit electric connection's heat dissipation district 30, each heat dissipation district 30 set up at least one with main control circuit 20 electric connection's temperature resistance 40.
In this embodiment, the heat dissipation surface of the heat dissipation casing 100 is disposed opposite to the heat generation surface of the terminal device, or the back surface of the terminal device, so that the heat of the heat generation surface of the terminal device can be taken away by the heat dissipation surface of the heat dissipation casing 100. Specifically, at least two heat dissipation areas 30 are divided on an outer surface of the heat dissipation housing 100, and the two heat dissipation areas 30 can independently execute a heat dissipation or cooling command. Also, in order to control the operation states of the two heat dissipation areas 30, in the present embodiment, an operation circuit 10 is provided, which is used to control the on and off of the heat dissipation areas 30, or to adjust the heat dissipation efficiency of the heat dissipation areas 30. In this embodiment, a main control circuit 20 is further connected to the working circuit 10, the main control circuit 20 is configured to send a working instruction to the working circuit 10 according to the temperature control information, and a signal input end of the main control circuit 20 is connected to the temperature resistor 40 and configured to perform analog-to-digital conversion and input on a temperature signal of the temperature resistor 40. Similarly, as described in the above example, in order to independently execute the heat dissipation or cooling command, the present embodiment provides two heat dissipation areas 30, and correspondingly, each heat dissipation area 30 is provided with one temperature resistor 40, so as to obtain the current temperature of each heat dissipation area 30, so as to independently regulate and control the temperature of each area.
The beneficial effect of this embodiment lies in, through setting up heat dissipation casing 100, set up in the inside working circuit 10 of heat dissipation casing, with working circuit 10 electric connection's main control circuit 20, wherein, at least one surface of heat dissipation casing 100 divide at least two with working circuit electric connection's heat dissipation district 30, each heat dissipation district 30 set up at least one with main control circuit 20 electric connection's temperature resistance 40. The humanized heat dissipation back splint is realized, and the heat dissipation back splint can be independently regulated and controlled in a partitioned mode according to the actual heating condition of the terminal equipment, so that the heat dissipation efficiency is improved, the heat dissipation energy consumption is reduced, and the user experience is enhanced.
Example two
Fig. 4 is a block diagram of a heat-dissipating back clip according to a second embodiment of the present invention. Based on the above embodiments, in order to further determine a more independent heat dissipation or refrigeration mechanism, in the heat dissipation back clip of the present embodiment, the heat dissipation surface attached to the back surface of the terminal device includes four heat dissipation areas 30.
Optionally, the four heat dissipation areas 30 are arranged in a rectangular shape, four heating points of the terminal device are determined, and the geometric centers of the four heat dissipation areas 30 correspond to the four heating points of the terminal device one by one;
optionally, the four heat dissipation areas 30 are arranged in a circle, four heating points of the terminal device are determined, and the circle centers of the four heat dissipation areas 30 correspond to the four heating points of the terminal device one by one;
optionally, four heating areas of the terminal device are determined, the area ranges of the four heat dissipation areas 30 are determined according to the heating values of the four heating areas, and each heat dissipation area 30 can cover the corresponding heating area;
optionally, four heating areas of the terminal device are determined, the heat dissipation efficiency of the four heat dissipation areas 30 is determined according to the heat productivity of the four heating areas, and each heat dissipation area 30 can meet the heat dissipation requirement of the corresponding heating area;
optionally, four heating areas of the terminal device are determined, and the positions of the four heat dissipation areas 30 are determined according to the heating requirements of the four heating areas, that is, the heat dissipation area of the heat dissipation back clip is an adjustable structure, and the corresponding layout of the four heat dissipation areas 30 can be manually configured according to different terminal devices.
In the present embodiment, the heat dissipation back clip includes four temperature resistors 40 disposed in four of the heat dissipation areas 30. The four temperature resistors 40 are respectively a first temperature resistor R1 corresponding to the heating center of the processing element, a second temperature resistor R2 corresponding to the heating center of the charging element, a third temperature resistor R3 corresponding to the heating center of the battery element, and a fourth temperature resistor R4 corresponding to the heating center of the rf element.
In this embodiment, the main control circuit 20 is provided with four signal input pins ADC1, ADC2, ADC3 and ADC4, which are respectively connected to the first temperature resistor R1, the second temperature resistor R2, the third temperature resistor R3 and the fourth temperature resistor R4.
In the present embodiment, the main control circuit 20 has four signal output pins P01, P02, P03 and P04, which are respectively connected to four input pins EN1, EN2, EN3 and EN4 of the working circuit 10.
Optionally, in this embodiment, the main control circuit 20 is further electrically connected to the mobile terminal (not shown in the figure), the heat dissipation control center of the mobile terminal monitors the working state of the main control circuit 20 in real time, provides a visual graphical interface of the four temperature resistors 40 and the heat dissipation area 30, and determines the current states of the four temperature resistors 40 and the heat dissipation area 30 through different colors, and/or marks. Meanwhile, temperature control adjustment parameter selection corresponding to the four temperature resistors 40 and the heat dissipation area 30 is provided, so that the control scheme of the main control circuit 20 is subjected to adaptive fine adjustment.
In this embodiment, four heat dissipation areas 30 are respectively provided with a refrigeration piece, that is, are provided with a refrigeration piece 31, a refrigeration piece 32, a refrigeration piece 33 and a refrigeration piece 34, and the working circuit 10 is provided with four signal output pins OUT1, OUT2, OUT3 and OUT4, wherein the four signal output pins OUT1, OUT2, OUT3 and OUT4 are respectively connected to the refrigeration piece 31, the refrigeration piece 32, the refrigeration piece 33 and the refrigeration piece 34.
Optionally, the heat dissipation back clip further includes a power supply 50, and the power supply 50 is electrically connected to the working circuit 10 and the main control circuit 20, respectively;
optionally, the heat dissipation back clip further includes a power supply 50 connected to a power interface of the terminal device, and the power supply 50 is electrically connected to the working circuit 10 and the main control circuit 20, respectively;
optionally, the heat dissipation back clip further includes a power supply 50 connected to an earphone interface of the terminal device, and the power supply 50 is electrically connected to the working circuit 10 and the main control circuit 20, respectively;
optionally, the heat dissipation back clip further includes a power supply 50 connected to a metal contact interface of an external device of the terminal device, and the power supply 50 is electrically connected to the working circuit 10 and the main control circuit 20, respectively;
optionally, the heat dissipation back clip further includes a power output interface (not shown in the figure), and the power output interface is used for providing power for an external device of the terminal device;
optionally, the heat dissipation back clip further includes a power output/data transmission interface (not shown in the figure), where the power output/data transmission interface is used to provide power to an external device of the terminal device or perform data transmission;
optionally, the heat dissipation back clip further comprises a control button or a control knob (not shown in the figure), and the control button or the control knob is used for controlling the temperature control amplitude of the main control circuit 20 and/or the working circuit 10;
optionally, the heat dissipation back clip further includes a port connected to the data transmission interface of the terminal device, and is associated to the relevant interactive interface and the volume control key, and controls the temperature control amplitude of the main control circuit 20 and/or the working circuit 10 through the volume control key;
optionally, the heat dissipation back clip further includes a bluetooth control interface, and is associated with an interactive interface and a volume control key of a terminal device or a portable device such as an intelligent bracelet, and the temperature control range of the main control circuit 20 and/or the working circuit 10 is controlled by the volume control key or the intelligent bracelet knob.
Taking a mobile terminal as an example, specifically, the mobile terminal has a heat dissipation back clip working circuit module, a heat dissipation back clip, a main control circuit module, and a temperature resistance module. And the external Power supply Power supplies Power to the heat dissipation back splint working circuit and the main control circuit. The temperature resistor R1 is connected to the ADC1 pin of the main control circuit, the temperature resistor R2 is connected to the ADC2 pin of the main control circuit, the temperature resistor R3 is connected to the ADC3 pin of the main control circuit, and the temperature resistor R4 is connected to the ADC4 pin of the main control circuit. The pin P01 of the main control circuit module is connected to the pin En1 of the heat dissipation back splint working circuit module, the pin P02 of the main control circuit module is connected to the pin En2 of the heat dissipation back splint working circuit module, the pin P03 of the main control circuit module is connected to the pin En3 of the heat dissipation back splint working circuit module, and the pin P04 of the main control circuit module is connected to the pin En4 of the heat dissipation back splint working circuit module. The pin of a heat dissipation back clip working circuit OUT1 is connected to the heat dissipation back clip 1, the pin of a heat dissipation back clip working circuit OUT1 is connected to the heat dissipation back clip 1, the pin of a heat dissipation back clip working circuit OUT3 is connected to the heat dissipation back clip 3, and the pin of a heat dissipation back clip working circuit OUT4 is connected to the heat dissipation back clip 4.
Specifically, the heat dissipation back splint consists of 4 heat dissipation back splint modules. The temperature resistor R1 is placed in the area of the heat dissipation back clip 1, the temperature resistor R2 is placed in the area of the heat dissipation back clip 2, the temperature resistor R3 is placed in the area of the heat dissipation back clip 3, and the temperature resistor R4 is placed in the area of the heat dissipation back clip 4. When the heat dissipation back splint is powered on, the power-on reset of the main control circuit module sets output pins EN1, EN2, EN and EN4 to be low level, and meanwhile, the temperatures of the mobile terminals in the areas of the heat dissipation back splint module 1, the heat dissipation back splint module 2, the heat dissipation back splint module 3 and the heat dissipation back splint module 4 are obtained in real time through temperature resistors R1, R2, R3 and R4. If the main control circuit module obtains that the temperature of the mobile terminal in the area of the heat dissipation back clamp module 1 is greater than T, the main control module outputs a high level to an EN1 pin, at the moment, an OUT1 channel of the heat dissipation back clamp working circuit is conducted to start working, namely, the heat dissipation back clamp 1 starts working to cool the mobile terminal; if the main control circuit module obtains that the temperature of the mobile terminal in the area of the heat dissipation back clamp module 2 is greater than T, the main control module outputs a high level to an EN2 pin, at the moment, an OUT2 channel of the heat dissipation back clamp working circuit is conducted to start working, namely, the heat dissipation back clamp 2 starts working to cool the mobile terminal; if the main control circuit module obtains that the temperature of the mobile terminal in the area of the heat dissipation back clamp module 3 is greater than T, the main control module outputs a high level to an EN3 pin, at the moment, an OUT3 channel of the heat dissipation back clamp working circuit is conducted to start working, namely, the heat dissipation back clamp 3 starts working to cool the mobile terminal; if the main control circuit module obtains that the temperature of the mobile terminal in the area of the heat dissipation back clamp module 4 is greater than T, the main control module outputs a high level to the EN4 pin, at this time, the OUT4 channel of the heat dissipation back clamp working circuit is turned on to start working, that is, the heat dissipation back clamp 4 starts working to cool the mobile terminal.
Optionally, the heat dissipation back clip further includes a battery (not shown in the figure), and a power output interface of the battery is electrically connected to the working circuit 10 and the main control circuit 20, respectively.
The beneficial effect of this embodiment lies in, through setting up four groups of radiating module and the subassembly of mutually supporting. The heat dissipation back splint is more humanized, independent heat dissipation regulation and control can be carried out through the mode of zoning according to the actual condition of generating heat of terminal equipment, the heat dissipation efficiency is improved, the heat dissipation energy consumption is reduced, and the user experience is enhanced.
The invention also provides a mobile terminal, at least one part of area of the mobile terminal shell comprises the heat dissipation clip.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solutions of the present invention may be embodied in the form of a software product, which is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling a terminal (such as a mobile phone, a computer, a server, an air conditioner, or a network device) to execute the method according to the embodiments of the present invention.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. A heat sink clip, comprising: the heat dissipation shell is arranged in a working circuit inside the heat dissipation shell and a master control circuit electrically connected with the working circuit, wherein at least two heat dissipation areas electrically connected with the working circuit are divided on at least one outer surface of the heat dissipation shell, and each heat dissipation area is provided with at least one temperature resistor electrically connected with the master control circuit.
2. The heat dissipation clip as defined in claim 1, wherein the heat dissipation clip comprises four heat dissipation areas attached to the heat dissipation surface of the back side of the terminal device.
3. The heat dissipating clip of claim 2, wherein said heat dissipating clip comprises four temperature resistors disposed in four of said heat dissipating regions.
4. The heat dissipation clip as recited in claim 3, wherein the four temperature resistors are a first temperature resistor corresponding to a heating center of the processing component, a second temperature resistor corresponding to a heating center of the charging component, a third temperature resistor corresponding to a heating center of the battery component, and a fourth temperature resistor corresponding to a heating center of the rf component.
5. The heat dissipation clip as defined in claim 4, wherein the master control circuit includes four signal input pins respectively connected to the first temperature resistor, the second temperature resistor, the third temperature resistor, and the fourth temperature resistor.
6. The heat dissipation clip as defined in claim 4, wherein the master control circuit has four signal output pins respectively connected to four input pins of the operating circuit.
7. The heat dissipation back clip of claim 4, wherein each of the four heat dissipation areas is provided with a cooling fin, and the operating circuit is provided with four signal output pins, wherein the four signal output pins are respectively connected to the four cooling fins.
8. The heat dissipation back clip of claim 1, further comprising a power input interface, wherein the power input interface is electrically connected to the operating circuit and the main control circuit, respectively.
9. The heat dissipation back clip of claim 1, further comprising a battery, wherein a power output interface of the battery is electrically connected to the operating circuit and the main control circuit, respectively.
10. A mobile terminal characterized in that at least a part of the area of the mobile terminal housing comprises a heat sink clip according to any of claims 1-9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010812313.2A CN112004378A (en) | 2020-08-13 | 2020-08-13 | Heat dissipation back splint and mobile terminal |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010812313.2A CN112004378A (en) | 2020-08-13 | 2020-08-13 | Heat dissipation back splint and mobile terminal |
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| CN112004378A true CN112004378A (en) | 2020-11-27 |
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| CN202010812313.2A Pending CN112004378A (en) | 2020-08-13 | 2020-08-13 | Heat dissipation back splint and mobile terminal |
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Application publication date: 20201127 |