CN112034929B - Folding display screen, manufacturing method of folding display screen and terminal equipment - Google Patents

Abstract

The application provides a folding display screen, a manufacturing method of the folding display screen and terminal equipment, and relates to the field of display screens. The foldable display screen comprises a flexible optical module layer, a CPI film, a glue joint layer, a bottoming layer and an anti-fingerprint film, wherein the glue joint layer is positioned between the flexible optical module layer and the CPI film, the bottoming layer is arranged on the CPI film, and the anti-fingerprint film is arranged on the bottoming layer. The anti-fingerprint film is a fluoride film layer, the priming layer is made of silicide, the priming layer is physically embedded and/or chemically combined with the CPI film, and the priming layer is chemically combined with the anti-fingerprint film and/or is physically combined among molecules. Therefore, the CPI film and the AF film can be firmly connected through the binding force of the bottom layer, the CPI film and the AF film, the AF film is prevented from falling off, and therefore the fingerprint and dirt resistance of the folding display screen is improved.

Description

A folding display screen, a method for making a folding display screen, and a terminal device

This application claims the priority of the Chinese patent application with the application number of 201910476850.1 submitted to the State Intellectual Property Office of China on June 3, 2019. The entire contents of which are incorporated herein by reference.

technical field

The present application relates to the technical field of display screens, and in particular, to a folding display screen, a method for making a folding display screen, and a terminal device.

Background technique

In order to increase the display area of the terminal device without changing the space occupied by the terminal device, the folding display screen came into being. Since the folding display needs to be bent many times, the conventional non-extensible inorganic glass cover may not meet the specification requirements of the folding display.

SUMMARY OF THE INVENTION

The embodiments of the present application provide a folding display screen, a method for manufacturing a folding display screen, and a terminal device, so as to solve the problem that the anti-fingerprint film on the display screen is easy to fall off and the anti-fingerprint effect is poor.

In a first aspect, the technical solution of the present application provides a folding display screen, comprising: a flexible optical module layer and a Colorless Polyimide (CPI) film, located on the flexible optical module layer and the CPI The adhesive layer between the films, the adhesive layer connects the flexible optical module layer and the CPI film, a primer layer arranged on the CPI film, and an anti-fingerprint (anti-fingerprint) layer arranged on the primer layer. Anti-Fingerprint, AF) film; the AF film is a fluoride film layer, the primer layer is physically embedded and/or chemically combined with the CPI film, and the primer layer is chemically combined with the AF film and/or or intermolecular physical bonding.

According to the above-mentioned folding display screen, a primer layer is provided between the CPI film and the AF film. Compared with other display screens with AF film, the additional primer layer added to the folding display screen of the technical solution of the present application can chemically react with the CPI film. Bonding and/or physical chimera, and chemical bonding and/or intermolecular physical bonding with the AF film at the same time, so as to ensure that the AF film is firmly adhered to the folding display screen and is not easy to fall off. Therefore, the folding display screen provided by the technical solution of the present application has a better anti-fingerprint effect. When the foldable display screen of the technical solution of the present application is applied to terminal devices such as a foldable mobile phone and a foldable computer, the problem of the AF film falling off can be avoided, and the terminal device maintains an excellent anti-fingerprint effect.

In an implementation manner, the primer layer is an inorganic primer layer containing at least three layers of inorganic silicides, or an organic primer layer containing one layer of organic silicides, or an inorganic primer layer connected to the CPI film with inorganic silicides - an organic composite primer, the inorganic-organic composite primer comprises at least five layers of alternately stacked inorganic silicides and organic silicides, or an organic-inorganic composite primer with an organic silicide connecting the CPI film, the The organic-inorganic composite primer layer comprises at least four layers of alternately stacked inorganic silicides and organic silicides.

As a result, the inorganic primer layer achieves a firm bond with the CPI film through chemical bonding and physical chimerism with the CPI film; through chemical bonding with the AF film, a firm bond with the AF film is achieved, and then the CPI film is realized. Strong connection with AF membrane. The organic bottom layer realizes a firm bond with the CPI film through chemical bonding with the CPI film; through the chemical bonding and intermolecular physical bonding with the AF film, the firm bonding with the AF film is realized, and then the CPI film and the AF film are realized. Strong connection between membranes. The inorganic-organic composite primer realizes a firm bond with the CPI film through chemical bonding and physical chimera between the inorganic silicide and the CPI film; through the chemical bonding between the inorganic silicide and the AF film, it realizes the chemical bonding with the AF film. A firm bond between the CPI film and the AF film is achieved. The organic-inorganic composite bottom layer realizes a strong bond with the CPI film through the chemical bonding between the organic silicide and the CPI film; through the chemical bonding between the inorganic silicide and the AF film, the firmness with the AF film is realized Combination, and then achieve a firm connection between the CPI film and the AF film.

In an implementation manner, the inorganic primer layer includes: a base layer disposed on the surface of the CPI film, the base layer is made of a material containing incompletely acidified silicon; an intermediate layer disposed on the base layer, The intermediate layer includes at least one layer of inorganic silicide material, and a surface layer disposed between the intermediate layer and the AF film, and the surface layer is made of silicon dioxide.

Wherein, at least one layer of inorganic silicide may be a high-hardness inorganic silicide material, wherein the high hardness in the high-hardness inorganic silicide material refers to Mohs hardness. The Mohs hardness of the high-hard inorganic silicide material may range from 4 to 8, for example, the Mohs hardness of the inorganic silicide material is 6 or 7.

Therefore, the CPI film and the base layer containing the incompletely acidified silicon material have stronger chemical bonding force to ensure the bonding effect between the inorganic primer layer and the CPI film. At the same time, the inorganic silicide material can provide a certain supporting force and fixing force for the CPI film to prevent the CPI film from wrinkling and other harmful deformation during the bending and use process. The silica material has a silanol group that chemically reacts with the AF film, which can ensure the bonding force between the inorganic primer layer and the AF film. Moreover, the silica material can further interfere with the light transmitted by the high-hardness inorganic silicide material, so that the overall light transmittance of the folding display screen will not be affected by the high-hardness inorganic silicide material with a high refractive index.

In an implementation manner, the inorganic-organic composite primer layer includes a base layer disposed on the surface of the CPI film, the base layer is made of incompletely acidified silicon material, and is disposed in the middle of the base layer. layer, the intermediate layer comprises alternately stacked organic silicides and inorganic silicides, the inorganic silicides of the intermediate layer comprise at least one layer of inorganic silicides, and a film disposed between the intermediate layer and the AF film The surface layer, the material of the surface layer is the surface layer of silicon dioxide.

Or, the organic-inorganic composite primer layer includes a base layer disposed on the surface of the CPI film, the base layer is made of organic silicide, and an intermediate layer disposed on the base layer, the intermediate layer includes alternating Stacked inorganic silicide and organic silicide, the inorganic silicide of the intermediate layer includes at least one layer of inorganic silicide, and a surface layer disposed between the intermediate layer and the AF film, the surface layer is The material is silica.

Wherein, at least one layer of inorganic silicide may be a high-hardness inorganic silicide material, wherein the high hardness in the high-hardness inorganic silicide material refers to Mohs hardness. The Mohs hardness of the high-hard inorganic silicide material may range from 4 to 8, for example, the Mohs hardness of the inorganic silicide material is 6 or 7.

Therefore, the composite primer layer has two types of plating, in which the base layer, whether it is an inorganic silicide material or an organic silicide material, can be firmly combined with the CPI film; the surface layer made of silicon dioxide can be combined with the AF film. Firmly combined, so as to ensure the binding force between the CPI film and the AF film. The inorganic-organic composite primer and the organic silicide material in the intermediate layer of the organic-inorganic composite primer can play a good buffer role, eliminate the coating stress of each layer of inorganic silicide materials, and improve the quality of the composite primer. In addition, silicon dioxide can be chemically combined with the AF film, and the silanol group can further interfere with the light transmitted by the inorganic silicide material in the composite primer, so that the overall light transmittance of the display screen will not be affected by the inorganic silicide with high refractive index. influence of material.

In an implementation manner, the inorganic silicide in the inorganic primer layer is a combination of one or more materials represented by the chemical formula SiO _x N _y Al _z , wherein the value of x ranges from 0 to 2, The value range of y is 0-1.5, and the value range of z is 0-0.5.

In an implementation manner, the organosilicon compound in the organic primer layer is a combination of one or more materials represented by the chemical formula Si(OR) _m R _n , wherein R represents an alkyl group or a heteroalkyl group, The sum of m and n is 4.

In an implementation manner, the inorganic-organic composite primer layer and the inorganic silicide in the organic-inorganic composite primer layer are all made of one or more materials represented by the chemical formula SiO _x N _y Al _z combination, wherein the value range of x is 0-2, the value range of y is 0-1.5, the value range of z is 0-0.5, the inorganic-organic composite primer layer and the organic-inorganic composite primer layer The organosilicon compounds in are a combination of one or more materials represented by the chemical formula Si(OR) _m R _n , wherein R represents an alkyl group or a heteroalkyl group, and the sum of m and n is 4.

In an implementation manner, the total thickness of the inorganic primer layer ranges from 5 nm to 1000 nm, wherein the thickness of each layer of inorganic silicide in the inorganic primer layer ranges from 0.1 nm to 500 nm.

In this way, the problems of wear resistance and uneven coverage caused by too thin a total thickness of the plating can be avoided, and at the same time, the problems of easy bending and cracking caused by an excessively thick total thickness of the plating can be avoided. In addition, poor plating operability or failure of plating caused by too thin a single layer of plating can be avoided, and at the same time, it can be avoided that the thickness of a single layer of plating is too thick to cause bending and cracking of the single layer.

In an implementation manner, the total thickness of the organic primer layer ranges from 5 nm to 200 nm.

In this way, it is possible to avoid the problem that the total thickness of the coating is too thin and cause the failure of the coating, and at the same time, it can avoid the problems of poor adhesion of the organic primer layer and poor overall light transmittance of the display screen caused by the too thick total thickness of the coating. .

In an implementation manner, the total thicknesses of the inorganic-organic composite primer and the organic-inorganic composite primer are both in the range of 5 nm to 1000 nm, wherein the inorganic-organic composite primer and the organic - The thickness of each layer of inorganic silicide in the inorganic composite primer is in the range of 0.1 nm to 500 nm, and the thickness of each layer of the organic silicide in the inorganic-organic composite primer and the organic-inorganic composite primer The thickness ranges from 5nm to 200nm.

In this way, the problems of uneven coating and coating failure caused by the total thickness of the coating being too thin can be avoided, and at the same time, bending and cracking caused by the total thickness of the coating being too thick can be avoided, and the overall light transmission of the display screen can be avoided. Sexual issues. Wherein, the thickness of each layer of inorganic silicide can range from 0.1 nm to 500 nm, which can effectively prevent the single-layer inorganic silicide material from being too thin and cause the plating failure, and at the same time avoid the single-layer inorganic silicide material being too thick and causing the failure of plating. Bending is prone to cracking, and it is difficult to control the overall thickness of the composite primer.

In an implementation manner, the Mohs hardness of at least one layer of inorganic silicide in the inorganic primer layer and at least one layer of inorganic silicide in the composite primer layer may range from 4 to 8.

In this way, the overall hardness of the inorganic primer layer, the inorganic-organic composite primer layer, and the organic-inorganic composite primer layer can be prevented from being too low, and the supporting and fixing functions of the flexible CPI film can be lost, and the overall hardness can be avoided. Reduces the overall bending effect of the folded display.

In the second aspect, the technical solution of the present application provides a method for manufacturing a display screen, including: connecting a flexible optical module layer and a CPI film by an adhesive layer; /or a chemically bonded silicide primer layer; an AF film chemically combined with the silicide primer layer and/or physically combined with the silicide layer is arranged on the silicide primer layer.

Therefore, the folding display screen produced by the method of the technical solution of the present application is provided with a primer layer between the CPI film and the AF film. Compared with other folding display screens with the AF film, the folding display screen of the technical solution of the present application has a The bottom layer can be chemically combined and/or physically embedded with the flexible CPI film, and chemically combined and/or physically combined with the AF film, thereby ensuring that the AF film is firmly adhered to the folding display screen and is not easy to fall off. Therefore, the folding display screen provided by the technical solution of the present application has a better anti-fingerprint effect. When the foldable display screen of the technical solution of the present application is applied to terminal devices such as a foldable mobile phone and a foldable computer, the problem of the AF film falling off can be avoided, and the terminal device maintains an excellent anti-fingerprint effect.

In an implementation manner, before disposing the silicide primer layer that is physically embedded and/or chemically combined with the CPI film on the surface of the CPI film, it includes: placing the CPI film in a vacuum chamber; after evacuating the vacuum chamber , clean the CPI membrane.

In this way, the cleanliness of the surface of the CPI film can be effectively ensured, thereby ensuring the quality of the connection between the CPI film and the underlying layer.

In an implementation manner, the cleaning of the CPI film includes: cleaning the CPI film by using a plasma cleaning method or a glow discharge cleaning method.

In an implementation manner, the disposing a silicide primer layer that is physically embedded and/or chemically combined with the CPI film on the surface of the CPI film includes: disposing an inorganic primer layer containing at least three layers of inorganic silicide on the surface of the CPI film , or an organic primer layer comprising a layer of organic silicide is provided, or an inorganic-organic composite primer layer is provided that connects the CPI film with an inorganic silicide, and the inorganic-organic composite primer layer comprises at least five layers of alternately stacked inorganic silicide layers or an organic-inorganic composite primer layer connecting the CPI film with an organic silicide, the organic-inorganic composite primer layer comprising at least four layers of alternately stacked inorganic silicides and organic silicides.

In an implementation manner, the inorganic sparger is magnetron sputtered on the CPI film through a silicon target, an aluminum target or a silicon-aluminum composite target in a mixed atmosphere of O ₂ , N ₂ or O ₂ and N ₂ . The bottom layer, the inorganic-organic composite primer layer or each layer of inorganic silicide in the organic-inorganic composite primer layer, wherein the mass ratio of silicon element and aluminum element in the silicon-aluminum composite target is between 99:1 and 40:60. between.

In this way, inorganic primer materials such as silicon dioxide, silicon nitride, silicon oxynitride, and silicon oxynitride are plated by magnetron sputtering. And by the method of magnetron sputtering, each layer of inorganic silicide in the inorganic primer layer or two types of composite primer layers is plated on the surface of the CPI film and on the material of the previous primer layer. Magnetron sputtering can make the coating material form. The high-energy sputtering particles make the inorganic silicide material physically fit with the CPI film and the previous primer material, and then through the force generated by the physical fit, the bonding force between the primer layer and the CPI film is enhanced.

In an implementation manner, each organic layer of the organic primer layer, the inorganic-organic composite primer layer, or the organic-inorganic composite primer layer is deposited on the CPI film by thermally evaporating an organic silicide film material. silicide.

In an implementation manner, the step of disposing an inorganic primer layer containing at least three layers of inorganic silicides on the surface of the CPI film includes: disposing a base layer made of an incompletely acidified silicon material on the surface of the CPI film, on the base layer An intermediate layer containing at least one layer of inorganic silicide material is disposed on the layer, and a surface layer made of silicon dioxide is disposed between the intermediate layer and the AF film.

Wherein, at least one layer of inorganic silicide may be a high-hardness inorganic silicide material, wherein the high hardness in the high-hardness inorganic silicide material refers to Mohs hardness. The Mohs hardness of the high-hard inorganic silicide material may range from 4 to 8, for example, the Mohs hardness of the inorganic silicide material is 6 or 7.

In an implementation manner, the setting of the inorganic-organic composite primer layer connecting the CPI film with an inorganic silicide comprises: setting a base layer made of an incompletely acidified silicon material on the surface of the CPI film; An intermediate layer comprising alternately stacked organic silicides and inorganic silicides is arranged on the base layer, and the intermediate layer includes at least one layer of inorganic silicides; a surface layer made of silicon dioxide is arranged on the intermediate layer.

Wherein, at least one layer of inorganic silicide may be a high-hardness inorganic silicide material, wherein the high hardness in the high-hardness inorganic silicide material refers to Mohs hardness. The Mohs hardness of the high-hard inorganic silicide material may range from 4 to 8, for example, the Mohs hardness of the inorganic silicide material is 6 or 7.

In a possible manner, the setting of the organic-inorganic composite primer layer connecting the CPI film with an organosilicon compound includes: disposing a base layer made of organosilicon compound on the surface of the CPI film; An intermediate layer comprising alternately stacked inorganic silicides and organic silicides is arranged on the upper layer, and the intermediate layer includes at least one layer of inorganic silicides; a surface layer made of silicon dioxide is arranged on the intermediate layer.

Wherein, at least one layer of inorganic silicide may be a high-hardness inorganic silicide material, wherein the high hardness in the high-hardness inorganic silicide material refers to Mohs hardness. The Mohs hardness of the high-hard inorganic silicide material may range from 4 to 8, for example, the Mohs hardness of the inorganic silicide material is 6 or 7.

In an implementation manner, the inorganic silicide in the inorganic primer layer is a combination of one or more materials represented by the chemical formula SiO _x N _y Al _z , wherein the value of x ranges from 0 to 2, The value range of y is 0-1.5, and the value range of z is 0-0.5.

In an implementation manner, the organosilicon compound in the organic primer layer is a combination of one or more materials represented by the chemical formula Si(OR) _m R _n , wherein R represents an alkyl group or a heteroalkyl group, And the sum of m and n is 4.

In an implementation manner, the inorganic-organic composite primer layer and the inorganic silicide in the organic-inorganic composite primer layer are all made of one or more materials represented by the chemical formula SiO _x N _y Al _z combination, wherein the value range of x is 0-2, the value range of y is 0-1.5, the value range of z is 0-0.5, the inorganic-organic composite primer layer and the organic-inorganic composite primer layer The organosilicon compounds in are a combination of one or more materials represented by the chemical formula Si(OR) _m R _n , wherein R represents an alkyl group or a heteroalkyl group, and the sum of m and n is 4.

In an implementation manner, the total thickness of the inorganic primer layer ranges from 5 nm to 1000 nm, wherein the thickness of each layer of inorganic silicide in the inorganic primer layer ranges from 0.1 nm to 500 nm.

In an implementation manner, the total thickness of the organic primer layer ranges from 5 nm to 200 nm.

In an implementation manner, the total thicknesses of the inorganic-organic composite primer and the organic-inorganic composite primer are both in the range of 5 nm to 1000 nm, wherein the inorganic-organic composite primer and the organic - The thickness of each layer of inorganic silicide in the inorganic composite primer is in the range of 0.1 nm to 500 nm, and the thickness of each layer of the organic silicide in the inorganic-organic composite primer and the organic-inorganic composite primer The thickness ranges from 5nm to 200nm.

In an implementation manner, the Mohs hardness of at least one layer of inorganic silicide in the inorganic primer layer, the inorganic-organic composite primer layer, and the at least one layer of inorganic silicide in the organic-inorganic composite primer layer Values range from level 4 to level 8.

In a third aspect, the technical solution of the present application provides a terminal device, the terminal device includes the display screen provided by the technical solution of the present application, and the display screen is a foldable display screen.

Wherein, the folding display screen can be set in the operation area of the terminal device. The AF film and the CPI film of the folding display screen provided by the technical solution of the present application have strong bonding force and are not easy to fall off. During the use process, the AF film and the bottom layer will not affect the bending effect and light transmission effect of the display screen itself, which can prevent users from Fingerprints, dirt and other traces are left on the display screen when operating the terminal device, which further improves the user experience.

Description of drawings

In order to illustrate the technical solutions of the present application more clearly, the accompanying drawings that need to be used in the embodiments will be briefly introduced below. Other drawings can also be obtained from these drawings.

Figure 1 shows a schematic structural diagram of a terminal device with a foldable display screen;

Figure 2 shows a schematic structural diagram of a terminal device with a foldable display screen from another angle;

FIG. 3 shows a schematic structural diagram of a foldable terminal device;

FIG. 4 shows a schematic diagram of the cross-sectional structure of the first non-deformed region at A before coating the AF film;

FIG. 5 shows a schematic diagram of the cross-sectional structure of the second non-deformed region at B before coating the AF film;

Figure 6 shows a schematic diagram of the cross-sectional structure of the deformation region at C before coating the AF film;

FIG. 7 shows a schematic structural diagram of a foldable terminal device with an anti-fingerprint display screen;

FIG. 8 shows a schematic diagram of the coating process of a primer layer and an AF film;

FIG. 9 shows a schematic diagram of the cross-sectional structure of the first non-deformed region at A after the AF film is coated;

FIG. 10 shows a schematic diagram of the cross-sectional structure of the second non-deformed region at B after the AF film is coated;

Figure 11 shows a schematic diagram of the cross-sectional structure of the deformation region at C after coating the AF film;

Figure 12 shows a schematic diagram of the structure of an inorganic primer layer separation and amplification;

Figure 13 shows a schematic structural diagram of an inorganic primer layer comprising three layers of inorganic silicide;

Figure 14 shows a schematic structural diagram of the separation and enlargement of an organic bottom layer;

Figure 15 shows a schematic structural diagram of an inorganic-organic composite primer layer separation and amplification;

Figure 16 shows a schematic structural diagram of an inorganic-organic composite primer comprising five layers of primer materials;

Figure 17 shows a schematic structural diagram of an organic-inorganic composite primer layer separation and amplification;

FIG. 18 shows a schematic structural diagram of an organic-inorganic composite primer layer comprising four layers of primer materials;

FIG. 19 shows a flow chart of a method for fabricating a display screen.

Illustration description:

Among them, 1-first non-deformation area, 2-second non-deformation area, 3-deformation area, 4-CPI film, 5-adhesive layer, 6-flexible optical module layer, 7-AF film, 8-th A body, 9-bending connecting piece, 10-priming layer, 11-inorganic priming layer, 11-1～11-(n+2)-inorganic silicide of each layer in inorganic priming layer, 12-organic priming layer, 13 -Inorganic-organic composite primer, 13-1～13-(2n+3)-Inorganic-organic composite primer for each layer of primer, 14-Organic-inorganic composite primer, 14-1～14-(2n +2)- Each layer of primer material in the organic-inorganic composite primer layer, 15- the second body, 16- display screen.

Detailed ways

Before describing the technical solutions of the embodiments of the present application, the technical scenarios of the embodiments of the present application are first described with reference to the accompanying drawings.

In order to satisfy the two use effects of a larger-sized operation interface and a smaller-sized carrying volume at the same time, terminal devices with foldable display screens have emerged as the times require. Figures 1 and 2 respectively show schematic structural diagrams of a terminal device with a foldable display screen at two angles. According to whether deformation occurs, the foldable display screen is divided into two non-deformable areas and one deformation area, wherein FIG. 1 shows the first non-deformation area 1 of the foldable display screen, and FIG. 2 shows the foldable display screen. The second non-deformable area 2 and the deformation area 3 of the display screen. As shown in Figures 1 and 2, the bending deformation of the terminal device does not affect normal display and operation. The display screen of the terminal device includes an optical module layer, an inorganic glass layer, and an adhesive layer for connecting the optical module layer and the inorganic glass layer. However, according to the material properties of inorganic glass, although the ultra-thin inorganic glass material can be folded, its mechanical properties are poor, it is not resistant to falling, and it is easy to be punctured, which may not meet the needs of normal display and operation after the display screen is bent.

In order to achieve the above requirements, CPI film can be used to replace the inorganic glass layer, because CPI film has excellent creep resistance, and at the same time has sufficient physical and mechanical strength and optical properties, so it can replace inorganic glass as a cover for foldable displays Material. FIG. 3 shows a schematic structural diagram of a foldable terminal device. As shown in FIG. 3 , the foldable terminal device includes a display screen 16 , a first body 8 , a bending connector 9 and a second body 15 . The display screen 16 is disposed above the first body 8 , the curved connecting member 9 and the second body 15 . The area of the display screen 16 corresponding to the first body 8 corresponds to the first non-deformable area 1 , the area of the display screen 16 corresponding to the second body 15 corresponds to the second non-deformable area 2 , and the bending connector 9 The corresponding area of the display screen 16 corresponds to the deformation area 3 . Specifically, the display screen 16 includes the flexible optical module layer 6 , the adhesive layer 5 and the CPI film 4 . Wherein, the flexible optical module layer 6 may have bending properties. The flexible optical module layer 6 can provide light-emitting and display functions for the display screen 16 . The flexible optical module layer 6 may be an OLED (Organic Light-Emitting Diode, organic light-emitting diode). The display screen 16 may be a full screen visible in all areas, commonly known as a full screen, or may be a non-full screen visible in some areas, for example, there is a frame in the length direction of the display screen. The first body 8 and the second body 15 provide support for the display screen 16. The bending connector 9 is arranged between the first body 8 and the second body 15 to realize the bending movement between the first body 8 and the second body 15 .

It can be understood that the first body 8 and the second body 15 can be support plates. The bendable connection member 9 may be a bendable connection mechanism such as a folding structure, a rotating shaft mechanism, or the like. The support plates are connected by a folding mechanism, and the display screen 16 can be fixed on the support plate by means of bonding. The display screen 16 can also be fixed on the folding mechanism by means of bonding.

Specifically, FIGS. 4-6 show schematic cross-sectional structures of the first non-deformation area 1 , the second non-deformation area 2 , and the deformation area 3 at the terminal devices A, B, and C, respectively. As shown in FIG. 4 , for the first non-deformation area 1, a flexible optical module layer 6 is provided on the first body 8, and a CPI film 4 is provided on the flexible optical module layer 6, wherein the flexible optical module layer 6 is connected with the CPI film 4 through the adhesive layer 5 . As shown in FIG. 5 , for the second non-deformable area 2 , a flexible optical module layer 6 is provided on the second body 15 , and a CPI film 4 is provided on the flexible optical module layer 6 , wherein the flexible optical module layer 6 is connected with the CPI film 4 through the adhesive layer 5 . As shown in FIG. 6 , a bending connector 9 is arranged corresponding to the position of the deformation area 3 , a flexible optical module layer 6 is arranged on the bending connector 9 , and a CPI film 4 is arranged on the flexible optical module layer 6 , wherein, The flexible optical module layer 6 and the CPI film 4 are connected by an adhesive layer 5 .

During the use of the foldable display screen, the CPI film will come into contact with the outside world, thereby adhering to fingerprints, dirt, etc., affecting the operation sensitivity and visual experience of the display screen. In order to alleviate the problem of easy adhesion of fingerprints and dirt on the display screen, an anti-fingerprint (AF) film can be directly plated on the CPI film. The chemical composition of the AF film is perfluoropolyether siloxane, the molecular weight is 300-8000g/mol, and it has a low surface energy. The surface energy represents the intermolecular force on the surface of the object. The surface energy of the AF film is low. It shows that the force between the surface of the AF film and other molecules is small, so it can reduce the adhesion between fingerprints and dirt due to the force between molecules, so that the adhesion of fingerprints and dirt can be effectively avoided. The following two methods can be used to coat the AF film. For example, adding a fluorinated additive to the CPI film to reduce the surface energy of the CPI film, so that the AF film material migrates to the surface of the CPI film to form an AF film. However, in the process of migration, the AF film material is easily encapsulated by the resin of the hardened layer in the CPI film, which makes it difficult for the AF film material to combine with the CPI film, and the plating effect is not good; or, directly wet-coating AF on the surface of the CPI film However, since the active ingredient in the AF drug solution does not have a substance that can physically or chemically react with the CPI membrane, it is also difficult for the AF drug solution to bind to the CPI membrane. It can be seen that the binding force between the AF film obtained by the above method and the CPI film is small, the AF film is easy to fall off, and the function of anti-fingerprint and dirt may not be realized.

In order to alleviate the problem that the AF film is easy to fall off, as shown in FIG. 7 , an embodiment of the present application provides a display screen, including: a flexible optical module layer 6 , an adhesive layer 5 , and a CPI film 4 , and the adhesive layer 5 connects the flexible Optical module layer 6 and CPI film 4 . The display screen 16 further includes a primer layer 10 arranged on the CPI film 4 and an AF film 7 arranged on the primer layer 10 .

FIG. 8 shows a schematic diagram of a plating process of the primer layer 10 and the AF film 7 . It can be seen that a primer layer 10 is set on the CPI film 4 first, and then an AF film 7 is plated on the primer layer 10 to obtain a folding display screen with an AF film. 9-11 respectively show the schematic cross-sectional structures of the first non-deformation area 1 , the second non-deformation area 2 and the deformation area 3 at the terminal devices A, B, and C after the AF film is coated. It can be seen that for the first non-deformation area 1, the second non-deformation area 2 and the deformation area 3, based on the structure of the display screen, a primer layer 10 is added on the CPI film 4, and the primer layer 10 is plated with AF Membrane 7.

The primer layer 10 provided in the embodiments of the present application is equivalent to a transition material between the CPI film 4 and the AF film 7 .

Since the silicide itself has optical properties as the raw material of the display screen, and at the same time, the silicide also has the molecular structure and chemical composition to react with the CPI film 4 and the AF film 7, therefore, in an implementation manner, the material of the bottom layer 10 can be silicide. It can be understood that the primer layer can also be referred to as a primer layer, a transition layer, an adhesive layer, a primer layer, and the like.

In an implementation manner, the bonding force generated by the chemical bonding and/or the force generated by physical fitting between the primer layer 10 and the CPI film 4 can make the primer layer 10 and the flexible CPI film 4 firmly bonded . The bonding force generated by chemical bonding between the primer layer 10 and the AF film 7 and/or the mechanical force generated by the physical bonding between molecules can make the primer layer 10 and the AF film 7 firmly bonded. Therefore, through the combination between the bottom layer 10 and the flexible CPI film 4 and the AF film 7 respectively, the CPI film 4 and the AF film 7 are firmly bonded to effectively prevent the AF film 7 from falling off, thereby ensuring the anti-fingerprint and dirt resistance of the display screen. dirty effect.

Figure 12 shows a schematic structural diagram of an inorganic primer layer.

The primer layer 10 may be an inorganic primer layer 11 including at least three layers of inorganic silicides. As shown in FIG. 12 , (n+2) layers of inorganic silicides are arranged between the CPI film 4 and the AF film 7 , where 1≤n ≤100. First, a first layer of inorganic silicide 11-1 is plated on the CPI film 4, then a second layer of inorganic silicide 11-2 is plated on the inorganic silicide 11-1, and then the former layer of inorganic silicide is The inorganic silicide is basically plated until the (n+2)th layer of the inorganic silicide 11-(n+2) is plated on the (n+1)th layer of the inorganic silicide 11-(n+1). Finally, the AF film 7 is plated on the inorganic silicide 11-(n+2) to obtain an anti-fingerprint folding display screen.

Among them, the inorganic silicide can provide a chemical grafting active functional group, such as a silanol group, which is chemically combined with the CPI film 4 and the AF film 7, so that the inorganic silicide can chemically graft the active functional group with the free radicals in the CPI film 4 and Active functional groups, etc. are chemically combined. In addition, the inorganic silicide and the CPI film 4 can be made of the same material. According to the principle that the same material is easy to combine, the inorganic base layer is easy to react with the CPI film 4, so that the two can be firmly combined.

Inorganic silicides can chemically combine with activated end groups such as siloxane in the AF film 7 by chemically grafting active functional groups. In this way, the inorganic primer layer and the AF film 7 can be firmly bonded.

In addition, the method of magnetron sputtering can be used to coat the inorganic primer layer on the CPI film. Similarly, the method of magnetron sputtering can be used to realize the plating between each layer of inorganic silicide in the inorganic primer layer. The process of magnetron sputtering will make the inorganic silicide particles have higher energy. When the inorganic silicide particles reach the surface of the material to be plated, it will impact the material to be plated, so that the sputtered inorganic silicide particles are physically embedded. It is suitable for the surface of the material to be plated. At this time, a huge force will be generated between the inorganic silicide particles and the material to be plated, so that the inorganic silicide particles and the material to be plated are firmly combined, which can strengthen the inorganic silicide layer 11 and the material to be plated. The bonding force between the CPI films 4 is further enhanced, thereby further enhancing the bonding force between the AF film 7 and the CPI film 4 and preventing the AF film 7 from falling off.

Figure 14 shows a schematic structural diagram of an organic base layer.

The primer layer 10 can be an organic primer layer 12 including a layer of organic silicide. As shown in FIG. 14 , a layer of organic silicide is arranged between the CPI film 4 and the AF film 7 .

In an implementation manner, a layer of organic silicide is plated on the CPI film 4, and then an AF film 7 is plated on the organic silicide to obtain an anti-fingerprint display screen.

Among them, the organosilicon compound can provide a chemical grafting active functional group, such as siloxane, which is chemically combined with the CPI film 4 and the AF film 7, so that the organosilicon compound can chemically graft the active functional group with the free radicals and the free radicals in the CPI film 4. The active functional groups and the like are chemically combined to realize the firm combination of the organic primer layer 12 and the CPI film 4 .

At the same time, the organosilicon compound can chemically bond with the activated end groups such as siloxane in the AF film 7 through chemical grafting of active functional groups, so that the organic primer layer is firmly bonded to the AF film 7 . In addition, the (hetero)alkane chain in the organosilicon compound can entangle the molecular chain with the fluoroether chain in the AF film 7, thereby generating a mechanical force of physical bonding between molecules, and the organosilicon compound is firmly bonded to the AF film 7, The bonding force between the AF film 7 and the CPI film 4 is further strengthened to prevent the AF film 7 from falling off.

Figure 15 shows a schematic structural diagram of an inorganic-organic composite primer; Figure 17 shows a schematic structural diagram of an organic-inorganic composite primer.

The primer layer 10 can be a composite primer layer comprising alternately stacked inorganic silicides and organic silicides. As shown in FIG. 15 and FIG. 17 , alternately stacked inorganic silicides and organic silicides are arranged between the CPI film 4 and the AF film 7 thing.

In an implementation manner, as shown in FIG. 15 , a (2n+3) layer of primer material is arranged between the CPI film 4 and the AF film 7 , where 1≦n≦100. First, a first layer of inorganic silicide 13-1 is plated on the CPI film 4, then a second layer of organic silicide 13-2 is plated on the inorganic silicide 13-1, and a second layer of organic silicide 13-2 is plated on the organic silicide 13-2 A third layer of inorganic silicide 13-3 is applied, and then another primer material is alternately plated on the basis of the previous layer of primer material until the (2n+2)th layer of organic silicide 13-(2n+2) The (2n+3)th layer of inorganic silicide 13-(2n+3) is plated on it. Inorganic-organic composite primer layer forming an inorganic-organic-inorganic-organic-…-organic-inorganic structure. Finally, the AF film 7 is plated on the inorganic silicide 13-(2n+3) to obtain an anti-fingerprint display screen.

In another implementation manner, as shown in FIG. 17 , a (2n+2) layer of primer material is provided between the CPI film 4 and the AF film 7 , where 1≦n≦100. First, a first layer of organic silicide 14-1 is plated on the CPI film 4, then a second layer of inorganic silicide 14-2 is plated on the organic silicide 14-1, and a second layer of inorganic silicide 14-2 is plated on the inorganic silicide 14-2 A third layer of organosilicon compound 14-3 is applied, and then another base material is alternately plated on the basis of the previous layer of primer material until the (2n+1)th layer of organosilicon compound 14-(2n+1) The (2n+2)th layer of inorganic silicide 14-(2n+2) is plated on it. An organic-inorganic composite primer layer that forms an organic-inorganic-organic-…-organic-inorganic structure. Finally, the AF film 7 is plated on the inorganic silicide 14-(2n+2) to obtain an anti-fingerprint display screen.

It can be seen from the above that both inorganic silicides and organic silicides can activate the CPI film 4 through the chemical grafting active functional groups, and chemically combine with the free radicals and active functional groups in the CPI film 4, so that the inorganic silicides Or the organosilicon compound can be firmly bonded with the CPI film 4 , thereby ensuring the firm bonding between the composite primer layer and the CPI film 4 . At the same time, the inorganic silicide can be physically embedded into the CPI film 4 by the sputtering force generated during the plating process, which further enhances the bonding force between the composite primer layer and the CPI film 4 . Since the inorganic silicide and the CPI film 4 can be made of the same material, the bonding force with the CPI film 4 can be further enhanced.

In an implementation manner, the inorganic silicides and the organic silicides can be chemically bonded through respective chemical graft activation functional groups, so that the primer materials of each layer in the composite primer layer can be firmly bonded. At the same time, the inorganic silicide can be physically embedded with the organic silicide material of the previous layer through the sputtering force generated in the plating process, which further strengthens the bonding force between the primer materials of each layer in the composite primer layer.

In addition, inorganic silicides and organic silicides can be chemically bonded to activated end groups such as siloxane in the AF film 7 through chemical grafting of active functional groups, so that the composite primer layer can be firmly bonded to the AF film 7 . At the same time, the (hetero)alkane chain in the organosilicon compound can entangle the molecular chain with the fluoroether chain in the AF film 7, thereby generating a mechanical force of physical bonding between molecules, so that the organosilicon compound can be firmly attached to the AF film 7. combine.

It can be seen that the composite primer material can effectively prevent the AF film 7 from falling off through the firm binding force between the AF film 7 and the CPI film 4.

Further, for the inorganic primer layer 11, FIG. 13 shows a schematic structural diagram of an inorganic primer layer containing three layers of inorganic silicides. As shown in FIG. 13, the inorganic primer layer 11 includes a base layer, an intermediate layer and a surface layer, wherein , the base layer is set on the CPI film 4 , the intermediate layer is set on the base layer, and the surface layer is set between the intermediate layer and the AF film 7 .

Specifically, the base layer may use a material containing incompletely acidified silicon, such as silicon dioxide. The incompletely acidified silicon can chemically react with the hardened layer molecules in the CPI film 4 . Plasma is usually used to activate the CPI film 4, so that the CPI film 4 will generate activated hardened layer molecules, such as C, Si, N molecules, at this time, Si-O-X reaction can occur between the base layer and the CPI film 4, wherein X is C, Si, N molecules. If the plasma is oxygen plasma, the CPI film 4 will be oxidized after being activated by oxygen plasma, thereby generating active functional groups such as hydroxyl group, carbonyl group and amino group, which can react with the incompletely acidified silicon material. Therefore, the base layer containing the incompletely acidified silicon material can be firmly bonded to the flexible CPI film 4 .

The intermediate layer may use a high-hardness inorganic silicide material, wherein the high hardness in the high-hardness inorganic silicide material refers to Mohs hardness. The Mohs hardness of the high-hard inorganic silicide material may range from 4 to 8, for example, the Mohs hardness of the inorganic silicide material is 6 or 7. In practical applications, the CPI film 4 needs to be stretched and deformed in a specified folded and bent direction, while avoiding deformation in other directions. The excellent creep resistance of the CPI film 4 can meet the requirements of the expansion deformation of the CPI film 4, but it may be difficult to ensure that the deformation occurs only in a specified direction. The inorganic primer layer 11 and the AF film 7 plated on the CPI film 4 are relatively low in creep resistance, so they will not produce large deformations in other directions. This deformation difference will cause the CPI film 4 to be in other directions. Displacement deviation occurs between the top and inorganic primer layer 11 and the AF film 7, and a tearing force is generated. The high-hard inorganic silicide material as an intermediate layer can provide a certain supporting force and fixing force for the CPI film 4, reduce the deformation of the CPI film 4 in other directions, thereby reducing the contact between the CPI film 4 and the inorganic bottom layer 11 and AF in other directions. The tearing force between the films 7 ensures the bonding force between the CPI film 4 and the inorganic primer layer 11 .

In addition, since there is a base layer between the intermediate layer and the CPI film 4, the material modulus of the base layer is between the high-hardness inorganic silicide material and the flexible CPI film 4. Therefore, the effect of the high-hardness inorganic silicide material on the CPI can be effectively reduced. The higher deformation resistance generated when the membrane 4 acts directly.

The surface layer can be made of silicon dioxide, and silicon dioxide has silicon hydroxyl groups, which can be chemically combined with the siloxane in the AF film 7 to ensure that the surface layer and the CPI film 4 are firmly combined.

In addition, since the high-hardness inorganic silicide material in the intermediate layer has the characteristics of high refractive index, it will affect the normal propagation of light and reduce the display quality of the folding display screen. Silica has an interference effect on light, which can improve the light refracted by the high-hard inorganic silicide material, and can enhance the transmittance of the inorganic base layer 11. Therefore, using silica as the surface layer can ensure the display quality of the display screen. .

In addition, the plating method of inorganic silicide can use magnetron sputtering. It can be seen from the above that using this plating method, the molecules of inorganic silicide will have higher energy and can be embedded in the surface of the material to be plated. Thus, a huge force is generated, which further ensures the binding force between the CPI film 4 and the AF film 7 .

In an implementation manner, if the intermediate layer is more than one layer of inorganic silicide, as shown in FIG. 12 , the inorganic silicide 11-1 is used as the base layer, and a material containing incompletely acidified silicon can be used. Inorganic silicide 11-2-organic silicide 11-3~inorganic silicide 11-(n+1) are intermediate layers, which at least contain one layer of inorganic silicide material, and the inorganic silicide material can be a high-hard inorganic silicide material. Silicide material. The inorganic silicide 11-(n+2) is the surface layer, and silicon dioxide is used.

It should be noted that the base layer cannot be directly selected from inorganic silicide materials with higher hardness, such as Si ₃ N ₄ . Since the CPI film 4 is flexible and needs to exert this kind of performance in the foldable terminal, if the inorganic silicide material with higher hardness is used as the base layer to directly contact the CPI film 4, due to the bending of the inorganic silicide material The performance is relatively poor, which will limit the normal bending deformation of the CPI film 4, and may even damage the CPI film 4 due to the difference in the deformation amount. On the other hand, the inorganic silicide containing incompletely acidified silicon material still has good bending properties, and the deformation difference between the inorganic silicide and the CPI film 4 is small, and the normal bending deformation of the CPI film 4 is not excessively restricted.

As for the organic primer layer 12 , as shown in FIG. 14 , the organic primer layer 12 is a layer of organic silicide, and the organic primer layer 12 is disposed between the CPI film 4 and the AF film 7 . Among them, the organosilicon compound can provide a chemical grafting active functional group, such as siloxane, which is chemically combined with the CPI film 4 and the AF film 7, so that the organosilicon compound can chemically graft the active functional group with the free radicals and radicals in the CPI film 4. The active functional groups and the like are chemically combined to realize the firm combination of the organic primer layer 12 and the CPI film 4 .

The organosilicon compound can chemically combine with activated end groups such as siloxane in the AF film 7 through chemical grafting of active functional groups, so that the organic primer layer is firmly combined with the AF film 7 . In addition, the (hetero)alkane chain in the organosilicon compound can entangle the molecular chain with the fluoroether chain in the AF film 7, thereby generating a mechanical force of physical bonding between molecules, and the organosilicon compound is firmly bonded to the AF film 7, The bonding force between the AF film 7 and the CPI film 4 is further strengthened to prevent the AF film 7 from falling off.

For the inorganic-organic composite primer layer 13, FIG. 16 shows a schematic structural diagram of an inorganic-organic composite primer layer comprising five layers of primer materials. As shown in FIG. 16 , the inorganic-organic composite primer 13 includes a base layer, an intermediate layer and a surface layer, wherein the base layer is arranged on the CPI film 4, the intermediate layer is arranged on the base layer, and the surface layer is arranged on the intermediate layer and the AF between membranes 7.

Specifically, the base layer employs an inorganic silicide material containing incompletely acidified silicon, such as silicon dioxide. It can be seen from the above that the incompletely acidified silicon can chemically react with the hardened layer molecules in the CPI film 4, so that the base layer can be firmly combined with the CPI film 4.

The middle layer includes three layers of primer materials, which are the first layer of primer material using organic silicide material, the second layer of primer material using inorganic silicide material, and the third layer of primer material using organic silicide material. Wherein, the first layer of primer material is arranged on the base layer, and the third layer of primer material is arranged between the second layer of primer material and the surface layer. Wherein, the second layer of the primer material can be a high-hard inorganic silicide material. It can be seen from the above that the high-hard inorganic silicide material can provide a supporting force and a fixing force for the CPI film 4 . Due to the large sputtering stress generated by inorganic silicide materials during the plating process, if multiple layers of inorganic silicide materials are stacked together, bending cracks are prone to occur. The first layer of primer material and the third layer of primer material can effectively reduce this sputtering stress. At the same time, the amount of deformation generated by the organic silicide during bending is between the inorganic silicide and the CPI film 4, and also between the inorganic silicide and the AF film 7. Therefore, the first layer of primer material and the third layer of When the bottom material is bent, it can play a buffering role and reduce the tearing force caused by the large difference between the deformation amount of the inorganic silicide and the CPI film 4 and the deformation amount of the inorganic silicide and the AF film 7 .

The surface layer is made of silicon dioxide. As can be seen from the above, silicon dioxide can chemically bond with the AF film 7 to ensure the firm bond between the inorganic-organic composite primer 13 and the AF film 7, and at the same time, it can enhance the inorganic-organic The transmittance of the composite primer layer 13 .

In addition, each layer of inorganic silicide in the inorganic-organic composite primer layer 13 can be coated by magnetron sputtering. It can be seen from the above that using this coating method, the molecules of the inorganic silicide will have higher The energy can be embedded in the surface of the material to be plated, thereby generating a huge force, and further ensuring the bonding force between the CPI film 4 and the AF film 7 . At the same time, the organic silicide and the inorganic silicide can be chemically combined by their respective chemical grafting and activated functional groups, for example, the siloxane provided by the organic silicide and the silanol group provided by the inorganic silicide are chemically combined, This chemical combination can also ensure the firm combination of primer materials of each layer in the inorganic-organic composite primer layer 13 .

In an implementation manner, if the intermediate layer is more than three layers of base material, as shown in FIG. 15 , the inorganic silicide 13-1 is used as the base layer, and a material containing incompletely acidified silicon is used. Then, organic silicide and inorganic silicide are alternately plated on the inorganic silicide 13-1 to obtain a structure of organic silicide 13-2-inorganic silicide 13-3-...-organic silicide 13-(2n+2) The intermediate layer, wherein the intermediate layer contains at least one layer of inorganic silicide material, and the inorganic silicide material can be a high-hardness inorganic silicide material. The inorganic silicide 13-(2n+3) is the surface layer, and silicon dioxide is used.

It should also be noted that the inorganic silicide material with higher hardness cannot be directly selected for the base layer, for the reasons mentioned above, and will not be repeated here.

For the organic-inorganic composite primer 14, FIG. 18 shows a schematic structural diagram of an organic-inorganic composite primer containing four layers of primer materials. As shown in FIG. 18, the organic-inorganic composite primer 14 includes a base layer, an intermediate layer layer and surface layer, wherein the base layer is arranged on the CPI film 4 , the intermediate layer is arranged on the base layer, and the surface layer is arranged between the intermediate layer and the AF film 7 .

Specifically, the base layer is made of organic silicide. As can be seen from the above, the organic silicide can be chemically combined with the CPI film 4 so as to be firmly combined, which will not be repeated here.

The intermediate layer includes two layers of primer materials, which are sequentially a first layer of primer material using inorganic silicide material and a second layer of primer material using organic silicide material. The first layer of primer material is arranged on the base layer, and a high-hardness inorganic silicide material can be used, and the second layer of primer material is arranged between the first layer of primer material and the surface layer. It can be seen from the above that the high-hard inorganic silicide material can provide support and fixing force for the CPI film 4, and the second layer of primer material can reduce the sputtering stress and at the same time buffer during the bending process.

The surface layer is made of silicon dioxide. As can be seen from the above, silicon dioxide can chemically bond with the AF film 7 to ensure the firm bond between the organic-inorganic composite bottom layer 14 and the AF film 7, and at the same time, it can enhance the organic-inorganic The transmittance of the composite primer layer 14 .

In addition, each layer of inorganic silicide in the organic-inorganic composite primer layer 14 can be coated by magnetron sputtering. It can be seen from the above that using this coating method, the molecules of the inorganic silicide will have higher The energy can be embedded in the surface of the material to be plated, thereby generating a huge force and further ensuring the bonding force between the CPI film 4 and the AF film 7 . At the same time, as can be seen from the above, the organic silicide and the inorganic silicide can be chemically bonded through their respective chemical graft activation functional groups, so as to ensure the firm bonding of the primer materials of each layer in the organic-inorganic composite primer layer 14 .

In one implementation, if the intermediate layer is more than two layers of base material, as shown in FIG. 17 , the organosilicon compound 14-1 is used as the base layer. Then, the inorganic silicide and the organic silicide are alternately plated on the organic silicide 14-1 to obtain the structure of the inorganic silicide 14-2-organic silicide 14-3-...-organic silicide 14-(2n+1) The intermediate layer, wherein the intermediate layer contains at least one layer of inorganic silicide material, and the inorganic silicide material can be a high-hardness inorganic silicide material. The inorganic silicide 14-(2n+2) is the surface layer, and silicon dioxide is used.

In an implementation manner, the chemical formula of the materials used in each layer of the base layer 10 is as follows:

The inorganic silicide in the inorganic base layer 11 is a combination of one or more materials represented by the chemical formula SiO _x N _y Al _z , wherein the value range of x is 0-2, and the value range of y is 0- 1.5, the value range of z is 0-0.5.

For example: silicon dioxide, Si ₃ O ₄ , SiO _0.73 N _0.9 Al _0.05 , SiO _0.5 N _0.76 Al _0.1 , SiO _0.3 N _1.26 Al _0.06 and so on.

The organosilicon compound in the organic primer layer 12 is a combination of one or more materials represented by the chemical formula Si(OR) _m R _n , wherein R represents an alkyl group or a heteroalkyl group, and the sum of m and n is 4.

For example: octadecyltrimethoxysiloxane (C ₂₁ H ₄₆ O ₃ Si), isobutyl trimethoxy silane (C ₇ H ₁₈ O ₃ Si), dodecyl trimethoxysiloxane (C ₁₅ H ₃₄ O ₃ Si) and the like.

The inorganic silicide in the inorganic-organic composite primer layer 13 or the organic-inorganic composite primer layer 14 is a combination of one or more materials represented by the chemical formula SiO _x N _y Al _z , wherein the value range of x is 0 -2, the value range of y is 0-1.5, the value range of z is 0-0.5, the organic silicide in the inorganic-organic composite primer 13 and the organic-inorganic composite primer 14 is the chemical formula Si ( OR) a combination of one or more materials represented by _m R _n , wherein R represents an alkyl group or a heteroalkyl group, and the sum of m and n is 4.

For details, please refer to the examples in inorganic silicides and organic silicides, which will not be repeated here.

Further, in order to ensure the coating quality of the primer layer and the usability of the folding display screen, it is necessary to limit the total thickness of the primer layer 10, the single-layer thickness of each layer of primer material in the primer layer 10, and the hardness of the primer layer 10.

Specifically, for the inorganic primer layer 11, if the total thickness of the inorganic primer layer 11 is too thin, it may cause problems of wear resistance and uneven coverage; if the total thickness of the inorganic primer layer 11 is too thick, it may cause the display screen The problem of easy cracking when bending. In order to solve the above problem, in an implementation manner, the value range of the total thickness of the inorganic primer layer 11 in the embodiment of the present application is 5 nm-1000 nm.

At the same time, if the thickness of each layer of inorganic silicide in the inorganic primer layer 11 is too thin, it may cause plating failure; if the thickness of the single layer is too thick, it may cause the single layer of inorganic silicide to be easily cracked when it is bent, and at the same time, it may cause The total plating thickness of the inorganic primer 11 is difficult to control, resulting in the problem that the total plating thickness is too thick. In order to solve the above problem, in an implementation manner, in the technical solution of the present application, the thickness of each layer of inorganic silicide in the inorganic underlying layer 11 may range from 0.1 nm to 500 nm.

For the organic primer layer 12, if the total thickness of the organic primer layer 12 is too thin, it may cause the problem of plating failure; if the total thickness of the organic primer layer 12 is too thick, it may cause poor adhesion of the organic primer layer 12, and display The overall light transmittance of the screen is poor. In order to solve the above problem, in an implementation manner, the value range of the total thickness of the organic primer layer 12 in the technical solution of the present application may be 5 nm-200 nm.

For the composite primer layer, if the total thickness of the composite primer layer is too thin, it may cause problems of uneven coating and coating failure; And the problem of poor overall light transmittance of the display. In order to solve the above problem, in an implementation manner, the value range of the total thickness of the inorganic-organic composite primer layer 13 and the organic-inorganic composite primer layer 14 in the technical solution of the present application may be 5nm-1000nm.

Among them, if the single layer thickness of each layer of inorganic silicide and organic silicide in the composite base layer is too thin, the plating may fail; if the single layer thickness of each layer of inorganic silicide and organic silicide is too thick, it may affect the single layer thickness. Bending properties of layer base material. In order to solve the above problem, in an implementation manner, in the technical solution of the present application, the thickness of each layer of inorganic silicide in the inorganic-organic composite primer layer 13 and the organic-inorganic composite primer layer 14 may range from 0.1 nm to 500nm, the thickness of each layer of organic silicide can range from 5nm to 200nm.

In addition, it can be seen from the above that the inorganic silicides in the inorganic primer layer 11 , the inorganic-organic composite primer layer 13 and the organic-inorganic composite primer layer 14 can provide support and fixation force for the CPI film 4 through higher hardness. However, if the overall hardness is too low, the supporting effect and fixing effect on the CPI film 4 may be lost; if the overall hardness is too high, the overall bending effect of the display screen may be reduced. In order to solve the above problems, in an implementation manner, the Mohs hardness of each layer of inorganic silicide in the inorganic primer layer 11 , the inorganic-organic composite primer layer 13 , and the organic-inorganic composite primer layer 14 in the technical solution of the present application is equal to The value range can be from level 4 to level 8.

An embodiment of the present application also provides a method for manufacturing a display screen, and the method is used for manufacturing the display screen shown in the above embodiments.

FIG. 19 shows a flow chart of a method for fabricating a display screen.

As shown in Figure 19, the method includes the following steps:

Step A, using the adhesive layer 5 to connect the flexible optical module layer 6 and the CPI film 4 .

First of all, according to the actual needs, the size and outline of the display screen are formulated. The display screen can be a full screen visible in all areas, commonly known as a full screen, or it can be a non-full screen visible in some areas. frame. The size of the display screen is the size of the outermost edge of the display screen. The outline of the display screen may be a curved screen or a flat screen, and of course other outlines may also be used. According to the size and outline of the display screen, a CPI film with a corresponding thickness is selected, and the CPI film is cut into a CPI film 4 of a corresponding size.

Then, a contact circuit is printed on the back side of the CPI film 4 by ink printing, such as a silk-screen process.

Finally, the flexible optical module layer 6 is connected with the printed CPI film 4 by the adhesive layer 5 . Wherein, the adhesive layer 5 may use OCA (Optically Clear Adhesive) optical adhesive. Among them, the OCA optical adhesive has double-sided adhesiveness, is colorless and transparent, and has good light transmittance. While connecting the flexible optical module layer 6 and the CPI film 4, the display quality of the folding display screen will not be affected.

In addition, the flexible optical module layer 6 can be made of OLED (Organic Light-Emitting Diode, organic light emitting diode). OLED has the advantages of self-illumination, wide viewing angle, high contrast, low power consumption, extremely high response speed, etc., and can provide excellent display and operation functions for folding display screens.

The flexible optical module layer 6 and the CPI film 4 provide a physical basis for the display screen to be foldable.

In step B, a silicide primer layer 10 that is physically embedded and/or chemically combined with the flexible CPI film 4 is provided on the surface of the CPI film 4 .

As shown in FIG. 8 , first, a silicide primer layer 10 that can physically fit and/or chemically bond with the CPI film 4 is disposed on the surface of the CPI film 4 , so that the primer layer 10 and the CPI film 4 can be firmly combined.

In step C, the AF film 7 chemically combined with the silicide primer 10 and/or physically combined with the molecules is arranged on the silicide primer layer 10 .

The AF film 7 is arranged on the primer layer 10 , and the AF film 7 and the primer layer 10 can be firmly combined by chemical bonding and/or intermolecular physical bonding between the primer layer 10 and the AF film 7 .

By laying the bottom layer 10, the connection between the CPI film 4 and the AF film 7 can be realized, so that the AF film 7 can be effectively prevented from falling off from the CPI film 4, and the anti-fingerprint and dirt-proof effect of the display screen can be ensured.

In an implementation manner, before step B, the CPI film 4 is first placed in a vacuum chamber to be cleaned. And according to different process requirements, choose different cleaning parameters, such as vacuum pressure, gas atmosphere, cleaning time, etc. There are many ways to clean the surface of the CPI film 4, for example, a plasma cleaning method or a glow discharge cleaning method is used.

Further, as shown in FIGS. 12-18 , an inorganic primer layer containing at least three layers of inorganic silicide is provided on the surface of the CPI film 4, or an organic primer layer containing one layer of organic silicide is provided, or an inorganic silicide layer is provided. The inorganic-organic composite primer layer is connected to the CPI film 4, or the organic-inorganic composite primer layer is provided to connect the CPI film 4 with an organic silicide.

Among them, the inorganic primer layer can be chemically combined and physically embedded with the CPI film 4 to achieve a firm combination with the CPI film 4; by chemically combined with the AF film 7, the combination with the AF film 7 can be achieved, and then The connection between the CPI film 4 and the AF film 7 is achieved.

The organic bottom layer can realize the combination with the CPI film 4 through chemical combination with the CPI film 4; through the chemical combination and intermolecular physical combination with the AF film 7, the combination with the AF film 7 can be realized, and then the CPI can be realized Connection between membrane 4 and AF membrane 7.

The inorganic-organic composite bottom layer realizes a firm bond with the CPI film through chemical bonding and physical chimera between the inorganic silicide and the CPI film; through the chemical bonding between the inorganic silicide and the AF film, the AF film is realized by chemical bonding. A firm bond between the CPI film and the AF film is achieved.

The organic-inorganic composite bottom layer is chemically bonded between the organic silicide and the CPI film to achieve a firm bond with the CPI film; through the chemical bond between the inorganic silicide and the AF film, a firm bond with the AF film is achieved Combination, and then achieve a firm connection between the CPI film and the AF film.

In an implementation manner, the CPI film 4 can be magnetron sputtered on the CPI film 4 through a silicon target, an aluminum target or a silicon-aluminum composite target in a mixed atmosphere of O ₂ , N ₂ or O ₂ and N ₂ . Each layer of inorganic silicide in the inorganic primer layer, the inorganic-organic composite primer layer or the organic-inorganic composite primer layer, wherein the mass ratio of silicon element and aluminum element in the silicon-aluminum composite target is 99:1 and 99:1. Between 40:60.

Inorganic silicides can be plated by CVD (Chemical Vapor Deposition), thermal evaporation, magnetron sputtering, etc. However, compared with other plating methods, inorganic silicides formed by magnetron sputtering The clarity of the material is higher, and the sputtering parameter adjustment is more accurate and simple, and it is easy to control the thickness of the single layer and the overall thickness of the coating, which can effectively ensure the quality of the bottom layer. In an implementation manner, a low-power magnetron sputtering method can be used, which has higher plating quality and will not damage the CPI film 4 .

Among them, O ₂ and/or N ₂ , silicon target, aluminum target or silicon-aluminum composite target can provide a material basis for the formation of various inorganic silicides, wherein aluminum element can reduce the sputtering of inorganic silicides during sputtering. shot stress.

The organic primer layer, the inorganic-organic composite primer layer, or each layer of organic silicide in the organic-inorganic composite primer layer can be deposited on the CPI film 4 by thermally evaporating an organic silicide film material.

Organosilicon compounds can be coated by methods such as CVD and thermal evaporation. However, compared with other plating methods, thermal evaporation methods can fully utilize the physicochemical properties of organosilicon compounds and obtain better coating quality. At the same time, the thermal evaporation method has lower cost and is suitable for mass production.

Further, for the inorganic primer layer 11 , as shown in FIG. 12 , the inorganic primer layer 11 containing at least three layers of inorganic silicides is arranged on the surface of the CPI film 4 , which specifically includes: setting the material on the surface of the CPI film 4 to contain incomplete A base layer of acidified silicon material, an intermediate layer containing at least one layer of inorganic silicide material is disposed on the base layer, and a surface layer made of silicon dioxide is disposed between the intermediate layer and the AF film.

Wherein, at least one layer of inorganic silicide may be a high-hardness inorganic silicide material, wherein the high hardness in the high-hardness inorganic silicide material refers to Mohs hardness. The Mohs hardness of the high-hard inorganic silicide material may range from 4 to 8, for example, the Mohs hardness of the inorganic silicide material is 6 or 7.

Among them, the base layer containing the incompletely acidified silicon material has stronger bonding force with the CPI film 4, and the intermediate layer containing the high-hard inorganic silicide material can provide support and fixing force for the CPI film 4, and the material is silicon dioxide The surface layer can enhance the light transmittance of the folding display screen on the basis of being closely combined with the AF film 7.

For the inorganic-organic composite primer layer 13, as shown in FIG. 15, an inorganic-organic composite primer layer 13 connected to the CPI film 4 by an inorganic silicide is arranged on the surface of the CPI film 4, and the inorganic-organic composite primer layer 13 is provided. The bottom layer 13 includes at least five layers of alternately stacked inorganic silicides and organic silicides, and specifically includes: a base layer disposed on the surface of the CPI film 4 , and the base layer is made of incompletely acidified silicon material. An intermediate layer disposed on the base layer, the intermediate layer comprising alternately stacked organic silicides and inorganic silicides, the intermediate layer comprising at least one layer of inorganic silicide materials, wherein the at least one layer of inorganic silicide can be High-hardness inorganic silicide material, wherein the high hardness in the high-hardness inorganic silicide material refers to Mohs hardness. The Mohs hardness of the high-hard inorganic silicide material can range from 4 to 8, for example, the Mohs hardness of the inorganic silicide material is 6 or 7. The surface layer disposed on the intermediate layer is made of silicon dioxide.

Or, for the organic-inorganic composite primer layer 14, as shown in FIG. 17, an organic-inorganic composite primer layer 14 connected to the CPI film 4 with an organic silicide is arranged on the surface of the CPI film 4, and the organic-inorganic composite primer layer 14 is arranged on the surface of the CPI film 4. The composite primer layer 14 includes at least four layers of alternately stacked inorganic silicides and organic silicides, and specifically includes: a base layer disposed on the surface of the CPI film 4 , and the base layer is made of organic silicides. An intermediate layer disposed on the base layer, the intermediate layer comprising alternately stacked inorganic silicides and organic silicides, the intermediate layer comprising at least one layer of inorganic silicide materials, wherein the at least one layer of inorganic silicide can be High-hardness inorganic silicide material, wherein the high hardness in the high-hardness inorganic silicide material refers to Mohs hardness. The Mohs hardness of the high-hard inorganic silicide material may range from 4 to 8, for example, the Mohs hardness of the inorganic silicide material is 6 or 7. The surface layer disposed on the intermediate layer is made of silicon dioxide.

The above two types of composite primer layers respectively realize a firm combination between the composite primer layer and the CPI film 4 through inorganic silicides and organic silicides. Then, the CPI film 4 is provided with a supporting force and a fixing force through the alternately stacked layers of inorganic silicide, while the sputtering stress formed by the multilayered inorganic silicide material is relieved by the layers of the organic silicide. Finally, the combination between the composite primer layer and the AF film 7 is realized by the silicon dioxide material, thereby realizing the firm combination between the CPI film 4 and the AF film 7 . In addition, the light refracted by the composite bottom layer is improved by the silica material, the light transmittance of the folding display screen is enhanced, and the display effect of the folding display screen is improved.

In an implementation manner, the material of the underlying layer 10 can be summarized by a chemical formula, and the inorganic silicide can be a combination of one or more of the materials represented by the chemical formula SiO _x N _y Al _z , where x is taken as The value range can be 0-2, the value range of y can be 0-1.5, the value range of z can be 0-0.5; the organic silicide can be in the material represented by the chemical formula Si(OR) _m R _n The combination of one or more, wherein R represents an alkyl group or a heteroalkyl group, and the sum of m and n is 4; the inorganic silicide in the inorganic-organic composite bottom layer and the organic-inorganic composite bottom layer can be It is a combination of one or more materials represented by the chemical formula SiO _x N _y Al _z , where the value range of x can be 0-2, the value range of y can be 0-1.5, and the value range of z It can be 0-0.5, and the organic silicide in the inorganic-organic composite primer and the organic-inorganic composite primer can be one or more of the materials represented by the chemical formula Si(OR) _m R _n . A combination where R represents alkyl or heteroalkyl and the sum of m and n is 4.

Further, in order to ensure the coating quality of the primer layer 10 and the quality of use, when the primer layer 10 is coated, the following plating parameters are preferred.

The value range of the total thickness of the inorganic primer layer can be 5nm-1000nm, wherein the value range of the thickness of each layer of inorganic silicide in the inorganic primer layer can be 0.1nm-500nm; The value range of the total thickness can be 5nm-200nm; the value range of the total thickness of the composite primer layer can be 5nm-1000nm, wherein each of the inorganic-organic composite primer layer and the organic-inorganic composite primer layer. The value range of the thickness of one layer of inorganic silicide can be 0.1nm-500nm, and the value range of the thickness of each layer of organic silicide in the inorganic-organic composite primer layer and the organic-inorganic composite primer layer can be 5nm-200nm.

The value range of the Mohs hardness of each layer of inorganic silicide in the inorganic primer layer, as well as the inorganic-organic composite primer layer and each layer of inorganic silicide in the organic-inorganic composite primer layer can be 4 grades -8 level.

Regarding the technical solutions provided by the embodiments of the present application, the following six embodiments are provided. However, the following embodiments are only presented as examples and do not constitute a limitation to the present application.

Example 1:

The display screen in this embodiment is obtained by the following methods:

According to the size and outline of the display screen, a flexible CPI film of corresponding size is obtained by cutting, and a contact circuit is printed on the back of the flexible CPI film.

The above flexible CPI film was put into a vacuum chamber, evacuated to 5.0×10 ^-2 Pa, and subjected to a 120s plasma cleaning treatment with an RF radio frequency ion source in a 600sccmO ₂ atmosphere to obtain a cleaned flexible CPI film.

The vacuum degree of the vacuum chamber was stabilized at 3.0 × 10 ^-2 Pa, and a silicon dioxide film was magnetron sputtered on the cleaned flexible CPI film through a silicon target (purity: 91 wt% ₎ under an O atmosphere. The coating parameters were selected as the coating temperature of -25°C, the deposition rate of the coating as 0.1 nm/s, and the thickness of the coating as 3 nm to obtain a silicon dioxide film.

The vacuum degree of the vacuum chamber was stabilized at 2.0×10 ^-2 Pa, and the silicon target (purity: 91wt%) and aluminum target (purity: 92wt%) were magnetron sputtered on the silicon dioxide film under _O2 and _N2 atmosphere A SiO _0.73 N _0.9 Al _0.05 film was shot, and the coating parameters at this time were selected as the coating temperature of 25 °C, the coating deposition rate of 2 nm/s, and the coating thickness of 8 nm, to obtain a SiO _0.73 N _0.9 Al _0.05 film.

The vacuum degree of the vacuum chamber was stabilized at 2.0 × 10 ^-2 Pa, and a silicon dioxide film was magnetron sputtered on a SiO _0.73 N _0.9 Al _0.05 film through a silicon target (purity: 91 wt% ₎ under an O atmosphere. At this time, the The coating parameters are selected as the coating temperature of 25 ℃, the deposition rate of the coating is 0.2 nm/s, and the thickness of the coating is 60 nm to obtain a silicon dioxide film, and finally a silicon dioxide-SiO _0.73 N _0.9 Al _0.05 -silica inorganic base layer is formed. .

The vacuum degree of the vacuum chamber was stabilized at 9.0×10 ^-3 Pa, the AF film material was heated, and the AF film 7 was evaporated on the inorganic base layer. And the coating thickness is 35nm.

The flexible CPI film after coating is taken out from the vacuum chamber.

The coated flexible CPI film and the flexible optical module are pasted using the existing bonding process to form a fingerprint-proof foldable display screen. Finally, an anti-fingerprint foldable terminal device is formed through the whole machine assembly process.

In order to test the coating quality of the display screen obtained above, the water drop angle test and the dynamic bending test were respectively performed on the AF film and the overall bending performance of the display screen. Specifically, the initial water drop angle is 110°-115°, and the water drop angle after rubbing with a 500g load rubber for 2500 turns is 103°-109°; the dynamic friction coefficient is 0.024-0.042; there is no crack after 100,000 dynamic bending times. The above test results all exceed the average test results of directly coating AF films on flexible CPI films, and reach the average test results of coating AF films on ordinary inorganic glass.

Example 2:

The display screen in this embodiment is obtained by the following methods:

According to the size and outline of the display screen, a flexible CPI film of corresponding size is obtained by cutting, and a contact circuit is printed on the back of the flexible CPI film.

The above flexible CPI film was put into a vacuum chamber, evacuated to 3.0×10 ^-2 Pa, and subjected to plasma cleaning treatment with a Hall ion source for 60s in a 500sccmO ₂ atmosphere to obtain a cleaned flexible CPI film.

The vacuum degree of the vacuum chamber was stabilized at 2.0 × 10 ^-2 Pa, through a silicon-aluminum composite target (silicon content: 92 wt%, aluminum content: 8 wt%), on the cleaned flexible CPI film under _O2 and _N2 atmosphere The SiO _0.5 N _0.76 Al _0.1 film was magnetron sputtered, the coating parameters at this time were -24°C, the coating temperature was -24°C, the coating deposition rate was 0.15 nm/s, and the coating thickness was 3 nm to obtain a SiO _0.5 N _0.76 Al _0.1 film.

The vacuum degree of the vacuum chamber was stabilized at 1.5× ₁₀ ⁻² Pa, and the Si3N4 film was magnetron sputtered _on the _{SiO0.5N0.76Al0.1} film through a silicon target (purity: _{92wt %} ) under _N2 atmosphere, at this time As the coating parameters, the coating temperature is 24°C, the deposition rate of the coating is 0.02 nm/s, and the thickness of the coating is 8 nm to obtain a Si ₃ N ₄ film.

The vacuum degree of the vacuum chamber was stabilized at 1.3 × 10 ^-2 Pa, and the silicon dioxide film was magnetron sputtered on the Si ₃ N ₄ film through a silicon target (purity: 91 wt%) in an O ₂ atmosphere, and the plating at this time As parameters, the coating temperature is 24℃, the coating deposition rate is 0.1nm/s, and the coating thickness is 120nm to obtain a silicon dioxide film, and finally a SiO _0.5 N _0.76 Al _0.1 -Si ₃ N ₄ -silica inorganic bottom layer is formed.

The vacuum degree of the vacuum chamber was stabilized at 8.0×10 ^-3 Pa, the AF film material was heated, and the AF film 7 was evaporated on the inorganic base layer. And the coating thickness is 25nm.

The flexible CPI film after coating is taken out from the vacuum chamber.

The coated flexible CPI film and the flexible optical module are pasted using the existing bonding process to form a fingerprint-proof foldable display screen. Finally, an anti-fingerprint foldable terminal device is formed through the whole machine assembly process.

In order to test the coating quality of the display screen obtained above, the water drop angle test and the dynamic bending test were respectively performed on the AF film and the overall bending performance of the display screen. Specifically, the initial water drop angle is 112°-115°, and the water drop angle after rubbing with a 500g load rubber for 2,500 turns is 106°-108°; the dynamic friction coefficient is 0.021-0.035; there is no crack after 100,000 dynamic bending times. The above test results all exceed the average test results of directly coating AF films on flexible CPI films, and reach the average test results of coating AF films on ordinary inorganic glass.

Example 3:

The display screen in this embodiment is obtained by the following methods:

According to the size and outline of the display screen, a flexible CPI film of corresponding size is obtained by cutting, and a contact circuit is printed on the back of the flexible CPI film.

The above flexible CPI film was put into a vacuum chamber, evacuated to 2.0×10 ^-2 Pa, and subjected to plasma cleaning treatment with a glow discharge ion source for 100s in a 300sccmO ₂ atmosphere to obtain a cleaned flexible CPI film.

The vacuum degree of the vacuum chamber was stabilized at 1.0 × 10 ^-2 Pa, passed through a silicon-aluminum composite target (silicon content: 94wt%, aluminum content: 6wt%) on the cleaned flexible CPI film under _O2 and _N2 atmosphere The SiO _0.3 N _1.26 Al _0.06 film was magnetron sputtered, and the coating parameters at this time were the coating temperature of 23°C, the coating deposition rate of 0.1 nm/s, and the coating thickness of 10 nm, to obtain a SiO _0.3 N _1.26 Al _0.06 film.

According to the above steps again, a second layer of SiO _0.3 N _1.26 Al _0.06 film is obtained.

The vacuum degree of the vacuum chamber was stabilized at 1.0 × 10 ^-2 Pa, and a silicon dioxide film was magnetron sputtered on the SiO _0.3 N _1.26 Al _0.06 film through a silicon target (purity: 91 wt%) under an O ₂ atmosphere. At this time, the The coating parameters are selected as the coating temperature of 23 °C, the deposition rate of the coating is 0.09 nm/s, and the thickness of the coating is 100 nm to obtain a silicon dioxide film, and finally SiO _0.3 N _1.26 Al _0.06 -SiO _0.3 N _1.26 Al _0.06 -silicon dioxide is formed No bottom layer.

The vacuum degree of the vacuum chamber was stabilized at 7.0×10 ^-3 Pa, the AF film material was heated, and the AF film was evaporated on the inorganic base layer. The coating thickness is 20nm.

The flexible CPI film after coating is taken out from the vacuum chamber.

The coated flexible CPI film and the flexible optical module are pasted using the existing bonding process to form a fingerprint-proof foldable display screen. Finally, an anti-fingerprint foldable terminal device is formed through the whole machine assembly process.

In order to test the coating quality of the display screen obtained above, the water drop angle test and the dynamic bending test were respectively performed on the AF film and the overall bending performance of the display screen. Specifically, the initial water drop angle is 111°-114°, the water drop angle after 2500 laps of rubber friction with a 1000g load is 104°-108°; the dynamic friction coefficient is 0.025-0.034; there is no crack after 100,000 dynamic bending times. The above test results all exceed the average test results of directly coating AF films on flexible CPI films, and reach the average test results of coating AF films on ordinary inorganic glass.

Example 4:

The display screen in this embodiment is obtained by the following methods:

According to the size and outline of the display screen, a flexible CPI film of corresponding size is obtained by cutting, and a contact circuit is printed on the back of the flexible CPI film.

The above flexible CPI film was put into a vacuum chamber, evacuated to 5.0×10 ^-2 Pa, and subjected to plasma cleaning for 90s using an RF radio frequency ion source in a 600sccmO ₂ atmosphere to obtain a cleaned flexible CPI film.

Stabilize the vacuum degree of the vacuum chamber at 3.0×10 ^-2 Pa, heat the octadecyltrimethoxysiloxane organic film material, and deposit an organic primer layer on the cleaned flexible CPI film. The coating parameters at this time are selected. The coating temperature is 25° C., the deposition rate of the coating is 0.1 nm/s, and the thickness of the coating is 10 nm to obtain an octadecyltrimethoxysiloxane film.

The vacuum degree of the vacuum chamber was stabilized at 9.0×10 ^-3 Pa, the AF film material was heated, and the AF film was evaporated on the organic base layer. The coating thickness is 25nm.

The flexible CPI film after coating is taken out from the vacuum chamber.

The coated flexible CPI film and the flexible optical module are pasted using the existing bonding process to form a fingerprint-proof foldable display screen. Finally, an anti-fingerprint foldable terminal device is formed through the whole machine assembly process.

In order to test the coating quality of the display screen obtained above, the water drop angle test and the dynamic bending test were respectively performed on the AF film and the overall bending performance of the display screen. Specifically, the initial water drop angle was 110°-113°, and the water drop angle after rubbing with a 500g load rubber for 2,500 cycles was 78°-92°; the coefficient of kinetic friction was 0.02-0.04; there was no crack after 100,000 dynamic bending times. The above test results all exceed the average test results of directly coating AF films on flexible CPI films, and reach the average test results of coating AF films on ordinary inorganic glass.

Example 5:

The display screen in this embodiment is obtained by the following methods:

According to the size and outline of the display screen, a flexible CPI film of corresponding size is obtained by cutting, and a contact circuit is printed on the back of the flexible CPI film.

The above flexible CPI film was put into a vacuum chamber, evacuated to 3.0×10 ^-2 Pa, and subjected to plasma cleaning treatment with a Hall ion source for 50s in a 500sccmO ₂ atmosphere to obtain a cleaned flexible CPI film.

The vacuum degree of the vacuum chamber was stabilized at 2.0×10 ^-2 Pa, the isobutyltrimethoxysilane organic film material was heated, and the organic silicide was deposited on the cleaned flexible CPI film. The coating parameters at this time were selected as the coating temperature. At 25° C., the deposition rate of the coating film is 0.2 nm/s, and the thickness of the coating film is 20 nm to obtain an isobutyltrimethoxysilane film.

The vacuum degree of the vacuum chamber was stabilized at 2.0 × 10 ^-2 Pa, through a silicon-aluminum composite target (silicon content: 92 wt%, aluminum content: 8 wt%) under an _O2 and _N2 atmosphere in an isobutyltrimethoxysilane film A SiO _0.5 N _0.76 Al _0.1 film was magnetron sputtered, and the coating parameters at this time were the coating temperature of 24° C., the coating deposition rate of 0.15 nm/s, and the coating thickness of 8 nm, to obtain a SiO _0.5 N _0.76 Al _0.1 film.

The vacuum degree of the vacuum chamber was stabilized at 1.5×10 ^-2 Pa, the isobutyltrimethoxysilane organic film material was heated, and the organic silicide was deposited on the SiO _0.5 N _0.76 Al _0.1 film. The coating parameters at this time were the coating temperature. is 25° C., the deposition rate of the coating film is 0.2 nm/s, and the thickness of the coating film is 18 nm to obtain an isobutyltrimethoxysilane film.

The vacuum degree of the vacuum chamber was stabilized at 1.5 × 10 ^-2 Pa, and a silicon dioxide film was magnetron sputtered on the isobutyltrimethoxysilane film through a silicon target (purity: 92 wt% ₎ under an O atmosphere, at this time The coating parameters are selected as the coating temperature of 24 ° C, the deposition rate of the coating is 0.3 nm/s, and the thickness of the coating is 90 nm to obtain a silicon dioxide film, and finally the formation of isobutyltrimethoxysilane-SiO _0.5 N _0.76 Al _0.1 -isobutyl trimethoxysilane Butyltrimethoxysilane-silica composite primer.

The vacuum degree of the vacuum chamber was stabilized at 8.0×10 ^-3 Pa, the AF film material was heated, and the AF film was evaporated on the inorganic base layer. The coating thickness is 25nm.

The flexible CPI film after coating is taken out from the vacuum chamber.

The coated flexible CPI film and the flexible optical module are pasted using the existing bonding process to form a fingerprint-proof foldable display screen. Finally, an anti-fingerprint foldable terminal device is formed through the whole machine assembly process.

In order to test the coating quality of the display screen obtained above, the water drop angle test and the dynamic bending test were respectively performed on the AF film and the overall bending performance of the display screen. Specifically, the initial water drop angle is 110°-114°, the water drop angle after rubbing with a 500g load rubber for 2,500 cycles is 96°-103°; the dynamic friction coefficient is 0.02-0.03; there is no crack after 100,000 dynamic bending times. The above test results all exceed the average test results of directly coating AF films on flexible CPI films, and reach the average test results of coating AF films on ordinary inorganic glass.

Example 6:

The display screen in this embodiment is obtained by the following methods:

According to the size and outline of the display screen, a flexible CPI film of corresponding size is obtained by cutting, and a contact circuit is printed on the back of the flexible CPI film.

The above flexible CPI film was put into a vacuum chamber, evacuated to 2.0×10 ^-2 Pa, and subjected to plasma cleaning with a glow discharge ion source for 70s in a 300sccmO ₂ atmosphere to obtain a cleaned flexible CPI film.

The vacuum degree of the vacuum chamber was stabilized at 1.0 × 10 ^-2 Pa, and the cleaned flexible CPI film was magnetized through a silicon-aluminum composite target (silicon content: 94 wt%, aluminum content: ₆ wt% ₎ under O and N atmospheres. Controlled sputtering of SiO _0.6 N _1.26 Al _0.06 film, the coating parameters at this time were selected as the coating temperature of 23° C., the coating deposition rate of 0.1 nm/s, and the coating thickness of 5 nm, to obtain a SiO _0.6 N _1.26 Al _0.06 film.

The vacuum degree of the vacuum chamber was stabilized at 1.0×10 ^-2 Pa, the dodecyltrimethoxysiloxane organic film material was heated, and the organic silicide was deposited on the SiO _0.6 N _1.26 Al _0.06 film. The coating parameters at this time were selected The coating temperature is 25° C., the coating deposition rate is 0.2 nm/s, and the coating thickness is 18 nm to obtain a dodecyltrimethoxysiloxane film.

The vacuum degree of the vacuum chamber was stabilized at 1.0 × 10 ^-2 Pa, and a silicon dioxide film was magnetron sputtered on a dodecyltrimethoxysilicon oxide film through a silicon target (purity: 91 wt% ₎ under an O atmosphere, At this time, the coating parameters are selected as the coating temperature of 23 ° C, the deposition rate of the coating is 0.09 nm/s, and the thickness of the coating is 125 nm to obtain a silicon dioxide film, and finally SiO _0.6 N _1.26 Al _0.06 -dodecyltrimethoxy is formed. Silica-silica composite primer.

The vacuum degree of the vacuum chamber was stabilized at 7.0×10 ^-3 Pa, the AF film material was heated, and the AF film 7 was evaporated on the inorganic base layer. And the coating thickness is 20nm.

The flexible CPI film after coating is taken out from the vacuum chamber.

The coated flexible CPI film and the flexible optical module are pasted using the existing bonding process to form a fingerprint-proof foldable display screen. Finally, an anti-fingerprint foldable terminal device is formed through the whole machine assembly process.

In order to test the coating quality of the display screen obtained above, the water drop angle test and the dynamic bending test were respectively performed on the AF film and the overall bending performance of the display screen. Specifically, the initial water drop angle is 111°-114°, and the water drop angle after rubbing with a 500g load rubber for 2,500 cycles is 94°-101°; the coefficient of kinetic friction is 0.02-0.03; there is no crack after 100,000 dynamic bending times. The above test results all exceed the average test results of directly coating AF films on flexible CPI films, and reach the average test results of coating AF films on ordinary inorganic glass.

It can be seen from the above embodiments that the display screen obtained by using the technical solution provided by the present application has low surface energy, therefore, the adhesion of fingerprints, dirt, etc. on the display screen surface can be greatly reduced, and the folding requirements of the display screen can be guaranteed at the same time.

The present application also provides a terminal device.

The terminal device may specifically be a device with a foldable display screen such as a mobile phone and a tablet computer.

It can be seen from the above technical solutions that, in the terminal device provided by the embodiments of the present application, since the foldable display screen has a firmly bonded AF film, it can better ensure that the AF film does not fall off, thereby ensuring the anti-fingerprint and contamination effect of the display screen. , to improve the user experience.

It should be noted that, herein, the terms "comprising", "comprising" or any other variation thereof are intended to encompass non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements, It also includes other elements not expressly listed or inherent to such a process, method, article or apparatus.

Other embodiments of the present application will readily occur to those skilled in the art upon consideration of the specification and practice of the application disclosed herein. This application is intended to cover any variations, uses or adaptations of this application that follow the general principles of this application and include common knowledge or conventional techniques in the technical field not disclosed in this application . The specification and examples are to be regarded as exemplary only, with the true scope of the application being indicated by the following claims.

It should be understood that the present application is not limited to the structures that have been described above and shown in the accompanying drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.

Claims (15)

1. A folding display screen, characterized in that, comprising: Flexible optical module layer and Colorless Polyimide (CPI) film; an adhesive layer between the flexible optical module layer and the CPI film, the adhesive layer connects the flexible optical module layer and the CPI film; a primer layer disposed on the CPI film; and an anti-fingerprint film arranged on the bottom layer; Wherein, the anti-fingerprint film is a fluoride film layer, the material of the primer layer is silicide, the primer layer is physically embedded and/or chemically combined with the CPI film, and the primer layer and the anti-fingerprint film are Membrane chemical binding and/or intermolecular physical binding; The primer layer is an inorganic primer layer, and the inorganic primer layer includes: a base layer arranged on the surface of the CPI film, and the material of the base layer is a material containing incompletely acidified silicon; a middle layer arranged on the base layer layer, the intermediate layer includes at least one layer of inorganic silicide material; and a surface layer disposed between the intermediate layer and the anti-fingerprint film, the surface layer is made of silicon dioxide; Alternatively, the primer layer is an inorganic-organic composite primer layer, and the inorganic-organic composite primer layer includes: a base layer disposed on the surface of the CPI film, and the material of the base layer is a material containing incompletely acidified silicon, which is set An intermediate layer on the base layer, the intermediate layer includes alternately stacked organic silicides and inorganic silicides, the inorganic silicides of the intermediate layer include at least one layer of inorganic silicides, and the intermediate layer is disposed on the intermediate layer The surface layer between the anti-fingerprint film and the surface layer is made of silicon dioxide. 2. The folding display screen according to claim 1, wherein the organic-inorganic composite bottom layer comprises: The base layer arranged on the surface of the CPI film, the material of the base layer is an organic silicide, an intermediate layer disposed on the base layer, the intermediate layer comprising alternately stacked inorganic silicides and organic silicides, the inorganic silicides of the intermediate layer comprising at least one layer of inorganic silicides, and a surface layer disposed between the intermediate layer and the anti-fingerprint film, and the material of the surface layer is silicon dioxide. 3 . The folding display screen according to claim 1 , wherein the inorganic silicide in the inorganic underlying layer is a combination of one or more materials represented by the chemical formula SiO _x N _y Al _z , wherein The value range of x is 0-2, the value range of y is 0-1.5, and the value range of z is 0-0.5. 4 . The folding display screen according to claim 1 , wherein the organic silicide in the organic bottom layer is a combination of one or more materials represented by the chemical formula Si(OR) _m R _n , 5 . wherein R represents alkyl or heteroalkyl, and the sum of m and n is 4. 5. The folding display screen according to claim 1 or 2, wherein the inorganic-organic composite primer layer and the inorganic silicide in the organic-inorganic composite primer layer are all with the chemical _{formula SiOxNyAl} The combination of one or more materials represented by _z , wherein the value range of x is 0-2, the value range of y is 0-1.5, the value range of z is 0-0.5, the inorganic-organic The composite primer layer and the organosilicon compound in the organic-inorganic composite primer layer are all combinations of one or more of the materials represented by the chemical formula Si(OR) _m R _n , wherein R represents an alkyl group or a heteroalkyl group , the sum of m and n is 4. 6 . The folding display screen according to claim 1 or 3 , wherein the total thickness of the inorganic underlying layer ranges from 5 nm to 1000 nm, wherein the thickness of each layer of inorganic silicide in the inorganic underlying layer is 5 nm to 1000 nm. 7 . The thickness ranges from 0.1 nm to 500 nm. 7 . The folding display screen according to claim 1 or 4 , wherein the total thickness of the organic bottom layer ranges from 5 nm to 200 nm. 8 . 8 . The folding display screen according to claim 1 , wherein the total thickness of the inorganic-organic composite primer layer and the organic-inorganic composite primer layer is in the range of 5 nm to 1000 nm, wherein The thickness of each layer of inorganic silicide in the inorganic-organic composite primer layer and the organic-inorganic composite primer layer ranges from 0.1 nm to 500 nm, and the inorganic-organic composite primer layer and the organic-inorganic composite primer layer The thickness of each layer of organic silicide in the composite primer layer ranges from 5nm to 200nm. 9 . The folding display screen according to claim 1 , wherein at least one layer of inorganic silicide, the inorganic-organic composite layer and the organic-inorganic composite layer are included in the inorganic primer layer. 10 . The Mohs hardness of at least one layer of inorganic silicide in the primer layer ranges from 4 to 8. 10. A method for manufacturing a folding display screen, comprising: The flexible optical module layer and the colorless polyimide (CPI) film are connected by an adhesive layer; A silicide primer layer that is physically embedded and/or chemically combined with the CPI film is provided on the surface of the CPI film; An anti-fingerprint film chemically combined and/or physically combined with the silicide primer is arranged on the silicide primer; The primer layer is an inorganic primer layer, and the inorganic primer layer includes: a base layer arranged on the surface of the CPI film, and the material of the base layer is a material containing incompletely acidified silicon; a middle layer arranged on the base layer layer, the intermediate layer includes at least one layer of inorganic silicide material; and a surface layer disposed between the intermediate layer and the anti-fingerprint film, the surface layer is made of silicon dioxide; Alternatively, the primer layer is an inorganic-organic composite primer layer, and the inorganic-organic composite primer layer includes: a base layer disposed on the surface of the CPI film, and the material of the base layer is a material containing incompletely acidified silicon, which is set An intermediate layer on the base layer, the intermediate layer includes alternately stacked organic silicides and inorganic silicides, the inorganic silicides of the intermediate layer include at least one layer of inorganic silicides, and the intermediate layer is disposed on the intermediate layer The surface layer between the anti-fingerprint film and the surface layer is made of silicon dioxide. 11. The method according to claim 10, characterized in that, before disposing the silicide layering layer that is physically embedded or chemically combined with the CPI film on the surface of the CPI film, the method further comprises: placing the CPI film in a vacuum chamber; After the vacuum chamber is evacuated, the CPI membrane is cleaned. 12. The method of claim 11, wherein the cleaning the CPI membrane comprises: The CPI film is cleaned using a plasma cleaning method or a glow discharge cleaning method. 13. The method of claim 10, wherein the method further comprises: The inorganic primer layer, the inorganic-organic layer are magnetron sputtered on the CPI film through a silicon target, an aluminum target or a silicon-aluminum composite target in a mixed atmosphere of O ₂ , N ₂ or O ₂ and N ₂ Each layer of inorganic silicide in a composite primer layer or an organic-inorganic composite primer layer, wherein the mass ratio of silicon element to aluminum element in the silicon-aluminum composite target is between 99:1 and 40:60. 14. The method of claim 10, wherein the method further comprises: The organic primer layer, the inorganic-organic composite primer layer, or the organic silicide layers in the organic-inorganic composite primer layer are deposited on the CPI film by thermally evaporating an organic silicide film material. 15. A terminal device, characterized by comprising the folding display screen according to any one of claims 1-9.

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