CN112071777B

CN112071777B - Semiconductor packaging equipment

Info

Publication number: CN112071777B
Application number: CN202010824174.5A
Authority: CN
Inventors: 马春游
Original assignee: Rongtai Semiconductor Jiangsu Co ltd
Current assignee: Rongtai Semiconductor Jiangsu Co ltd
Priority date: 2020-08-17
Filing date: 2020-08-17
Publication date: 2025-08-15
Anticipated expiration: 2040-08-17
Also published as: CN112071777A

Abstract

The present invention discloses a semiconductor packaging device, comprising a packaging box, a mounting cabinet fixedly mounted on the lower surface of the packaging box, a packaging upper mold movably mounted inside the packaging box, a No. 2 hydraulic pump fixedly mounted on the upper surface of the inner portion of the packaging box, a heated packaging lower mold fixedly mounted on the lower surface of the packaging box, an injection molding machine fixedly mounted on one side of the heated packaging lower mold inside the packaging box, and a filter box fixedly mounted on the upper surface of the packaging box. The semiconductor packaging device described in the present invention can reduce the need for further de-burdening, making the entire packaging device more functional and improving work efficiency. It can also allow airflow to carry away the temperature on the surface of the heated packaging lower mold and the packaging upper mold through the heat dissipation fins, thereby quickly achieving the cooling and solidification effect, and can filter and remove odorous gases generated when the plastic is heated inside the packaging box.

Description

Semiconductor packaging equipment

Technical Field

The invention relates to the field of packaging equipment, in particular to semiconductor packaging equipment.

Background

The semiconductor chip packaging is characterized in that a film technology and a micro-processing technology are utilized to lay out, paste and connect a chip and other elements on a frame or a substrate, a wiring terminal is led out and is encapsulated and fixed through a plastic insulating medium to form a process of an integral three-dimensional structure, the concept is a narrow-definition packaging definition, the broader packaging is a packaging engineering, a packaging body and the substrate are connected and fixed, a complete system or electronic equipment is assembled, the engineering of the comprehensive performance of the whole system is ensured, the two definitions are combined to form a broader packaging concept, the purpose and the function of the semiconductor packaging are protection, support, connection and reliability guarantee, wherein the connection function is to connect an electrode of the chip with an external circuit, a pin is used for being communicated with the external circuit, a gold wire is used for connecting the pin with the circuit of the chip, a slide table is used for bearing the chip, an epoxy resin adhesive is used for pasting the chip on the slide table, the pin is used for supporting the whole device, the plastic package body plays a role of fixing and protecting, the practical effect is better, and the packaging cost is lower;

However, the existing semiconductor packaging equipment has certain defects when in use, when in packaging, more overflows exist between pins of a packaged molded product, and the molded product is often required to be removed in a weak acid soaking or high-pressure water flushing mode, so that the operation is very time-consuming and labor-consuming, resources are wasted, in addition, the cooling speed of a processed molded semiconductor packaging structure is low, and peculiar smell gas generated in the molded semiconductor packaging structure overflows very bad smell, so that the physical and mental health of personnel is easily caused.

Disclosure of Invention

The invention mainly aims to provide a semiconductor packaging device which can effectively solve the problems in the background technology.

In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:

The utility model provides a semiconductor packaging equipment, includes the encapsulation box, the lower fixed surface of encapsulation box installs the installation cabinet body, the inside movable mounting of encapsulation box has the encapsulation to go up the mould, the inside upper surface fixed mounting of encapsulation box has No. two hydraulic pumps, the lower fixed surface of encapsulation box installs the heat-seal installation lower mould, the inside of encapsulation box is located one side fixed mounting who heats the heat-seal installation lower mould and has the injection molding machine, the upper surface fixed mounting of encapsulation box has the filtration box.

Preferably, the front surface of the packaging box body is provided with an operation port, a sealing box door is movably mounted on the edge of one side of the front surface of the packaging box body, a fixing clamp is fixedly mounted on the other side of the sealing box door, a fixing clamp pin is movably mounted on the front surface of the packaging box body on the other side of the operation port, and a control panel is fixedly mounted on the front surface of the packaging box body on the side, far away from the operation port, of the fixing clamp pin.

Preferably, the sealed chamber door is movably connected with the packaging box body through a hinge, toughened glass is fixedly embedded in the middle of the sealed chamber door, and the sealed chamber door is clamped on the fixing clamp through the fixing clamp pin and is fixed with the packaging box body.

Preferably, the upper surface of the upper packaging die is close to the two side surfaces and is connected with a first hydraulic pump, an upper die groove is formed in the lower surface of the upper packaging die, pin grooves are formed in the periphery of the lower surface of the upper packaging die, and shearing ports are formed in the positions, located between the pin grooves, of the surface of the upper packaging die.

Preferably, the number of the pin grooves is set according to the number of the pins of the semiconductor, and the first hydraulic pump is fixedly arranged on the upper surface inside the packaging box body.

Preferably, the output end of the second hydraulic pump is fixedly connected with a mounting panel, the lower surface of the mounting panel is fixedly provided with a shearing structure, and the shearing structure is correspondingly arranged with a shearing port in the upper packaging die.

Preferably, the injection molding channel is formed in the lower heating packaging die, the injection molding port is formed in the port of the injection molding channel on the surface of the lower heating packaging die, the lower die groove is formed in the upper surface of the lower heating packaging die, the injection molding channel is communicated with the lower die groove through a vertical channel, the upper packaging die is matched with the lower heating packaging die, the total number of the upper die groove and the lower die groove is three, and the upper die groove is matched with the lower die groove.

Preferably, the inside surface fixed mounting of filter box has inlays establishes the slide, the inside of filter box is located the fixed active carbon filter screen of inlaying and establishing, the inside of filter box is located the fixed HEPA high-efficient particulate filter screen of inlaying of below of active carbon filter screen and establishing of installation, the inside of filter box is located the fixed super high-efficient glass fiber filter screen of inlaying of below of HEPA high-efficient particulate filter screen and establishing of below, the equal fixed mounting in surface edge of active carbon filter screen, HEPA high-efficient particulate filter screen and super high-efficient glass fiber filter screen has the installation frame, the last fixed surface of filter box is connected and is installed the air duct, the other end fixed connection of air duct is installed and is taken out the cigarette machine, the outside surface fixed mounting of installation frame has the pull handle of taking out

Preferably, the lower port of the filter box body is communicated with the packaging box body, the sealing rings are fixedly installed on the upper surface and the lower surface of the installation frame close to the edge positions, the installation frame is in sealing structure with the inner side surface of the packaging box body through the sealing rings and embedded sliding ways, the upper surface of the filter box body is communicated with the smoke extractor through an air duct, the smoke extractor is fixedly connected with a smoke exhaust pipeline at the discharge port of the smoke extractor, and the heat radiating fins are fixedly installed on the surfaces of the lower heating packaging die and the upper packaging die.

Compared with the prior art, the invention has the following beneficial effects:

According to the invention, through the second hydraulic pump, after the injection molding plastic is cooled, a worker can start the second hydraulic pump, so that the output rod of the second hydraulic pump pushes the mounting panel downwards to push the connected shearing structure to be quickly inserted into the shearing port, and the flash between pins can be cut off, thus the procedure of continuing to remove the flash can be reduced, the functionality of the whole packaging equipment is stronger, and the working efficiency is improved;

Through the filter box that sets up and the smoke extractor on its connection structure, when cooling and exhaust, start the smoke extractor, open a little gap with sealed chamber door simultaneously, outside cooling gas inhales this moment, make the air current take away the temperature that adds on heat sealing lower mould surface and the encapsulation upper mould through radiating fin, thereby can reach the effect of cooling solidification fast, and take away the gas in the case and pass the inside super high-efficient fine filter screen of glass of filter box, HEPA high-efficient particulate filter screen and active carbon filter screen in proper order, the peculiar smell gas that produces when alright with the inside heating plastics of encapsulation box like this filters the removal, the gas after the removal will pass the smoke extractor outdoor along the air duct, like this alright make to play certain purifying effect to gas.

Drawings

Fig. 1 is a schematic view showing the overall structure of a semiconductor package apparatus according to the present invention;

Fig. 2 is a partial sectional view of a package upper mold and a heating package lower mold of a semiconductor package apparatus according to the present invention;

fig. 3 is a partial view of a package upper die of a semiconductor package apparatus according to the present invention;

Fig. 4 is a partial sectional view showing a package upper mold, a heating package lower mold and a shear structure of a semiconductor package apparatus according to the present invention;

fig. 5 is a partial cross-sectional view of a filter housing of a semiconductor package apparatus according to the present invention.

In the figure, 1, a packaging box body; 101, sealing box door, 102, control panel, 103, fixing clamp, 104, fixing clamp pin, 2, installation cabinet, 3, packaging upper die, 301, hydraulic pump number one, 302, upper die groove, 303, pin groove, 304, shearing port, 4, hydraulic pump number two, 401, installation panel, 402, shearing structure, 5, heating lower die, 501, injection channel, 502, injection port, 503, lower die groove, 6, injection machine, 7, filtering box, 701, embedded slideway, 702, active carbon filter screen, 703, HEPA high-efficiency particle filter screen, 704, ultra-high-efficiency glass fiber filter screen, 705, installation frame, 706, air duct, 707, smoke extractor, 708, and pull handle.

Detailed Description

The invention is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the invention easy to understand.

In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, unless explicitly stated or limited otherwise, the terms "mounted," "configured to," "connected," and the like are to be construed broadly as, for example, "connected" may be fixedly connected, may be detachably connected, or integrally connected, may be mechanically connected or electrically connected, may be directly connected or indirectly connected through an intermediate medium, and may be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.

As shown in fig. 1 to 5, a semiconductor packaging device comprises a packaging box body 1, wherein a mounting cabinet body 2 is fixedly arranged on the lower surface of the packaging box body 1, a packaging upper die 3 is movably arranged in the packaging box body 1, a second hydraulic pump 4 is fixedly arranged on the upper surface of the interior of the packaging box body 1, a heating sealing lower die 5 is fixedly arranged on the lower surface of the packaging box body 1, an injection molding machine 6 is fixedly arranged on one side of the heating sealing lower die 5 in the interior of the packaging box body 1, and a filtering box body 7 is fixedly arranged on the upper surface of the packaging box body 1;

An operation port is formed in the front surface of the packaging box body 1, a sealing box door 101 is movably mounted on the edge of one side, located at the operation port, of the front surface of the packaging box body 1, a fixing clamp 103 is fixedly mounted on the other side of the sealing box door 101, a fixing clamp 104 is movably mounted on the other side, located at the operation port, of the front surface of the packaging box body 1, and a control panel 102 is fixedly mounted on one side, located at the operation port, of the fixing clamp 104; the sealing box door 101 is movably connected with the packaging box body 1 through a hinge, toughened glass is fixedly embedded in the middle of the sealing box door 101, the sealing box door 101 is fixedly clamped on a fixing clamp 103 through a fixing clamp 104 and is fixedly connected with the packaging box body 1, a first hydraulic pump 301 is fixedly arranged on the upper surface of the upper sealing die 3 close to two side surfaces, an upper die groove 302 is formed in the lower surface of the upper sealing die 3, pin grooves 303 are formed in the periphery of the upper die groove 302, shearing ports 304 are formed in the surfaces of the upper sealing die 3 between the pin grooves 303, the number of the pin grooves 303 is set according to the number of semiconductor pins, the first hydraulic pump 301 is fixedly arranged on the upper surface inside the packaging box body 1, a mounting panel 401 is fixedly connected to the output end of the second hydraulic pump 4, a shearing structure 402 is fixedly arranged on the lower surface of the mounting panel 401, the shearing structure 402 is correspondingly arranged with the shearing ports 304 in the upper sealing die 3, after plastic is cooled, a worker can start the second hydraulic pump 4, the output rod of the second hydraulic pump 4 pushes the mounting panel 401 downwards, thereby the shearing ports 304 are pushed downwards, the overflow of the whole shearing device can be cut off, the overflow can be further, the overflow of the whole packaging device can be cut off, the overflow can be reduced, and the overflow can be cut off, the working efficiency is improved, an injection molding channel 501 is formed in the lower heating and packaging die 5, an injection molding port 502 is formed in the port of the injection molding channel 501 on the surface of the lower heating and packaging die 5, a lower die groove 503 is formed in the upper surface of the lower heating and packaging die 5, the injection molding channel 501 is communicated with the lower die groove 503 through a vertical channel, the upper heating and packaging die 3 is matched with the lower heating and packaging die 5, the number of upper die groove 302 and the number of lower die groove 503 are three, the upper die groove 302 is matched with the lower die groove 503, an embedding slideway 701 is fixedly arranged on the inner surface of the filter box 7, an activated carbon filter screen 702 is fixedly embedded and arranged in the inner part of the filter box 7, a HEPA high-efficiency particle filter screen 703 is fixedly embedded and arranged below the activated carbon filter screen 702, an ultra-efficiency glass fiber filter screen 704 is fixedly embedded and arranged below the HEPA high-efficiency particle filter screen 703 in the inner part of the filter box 7, and the activated carbon filter screen 702 is fixedly embedded and arranged below the high-efficiency glass fiber filter screen 704, The HEPA high-efficiency particle filter screen 703 and the ultra-efficiency glass fiber filter screen 704 are fixedly arranged on the edges of the outer surfaces of the HEPA high-efficiency particle filter screen 703 and the ultra-efficiency glass fiber filter screen 704, an air duct 706 is fixedly connected and arranged on the upper surface of the filter box 7, a smoke extractor 707 is fixedly connected and arranged on the other end of the air duct 706, a pull-out handle 708 is fixedly arranged on the outer side surface of the installation frame 705, a lower port of the filter box 7 is communicated with the packaging box 1, sealing rings are fixedly arranged on the upper surface and the lower surface of the installation frame 705 close to the edges, the installation frame 705 forms a sealing structure with the inner side surface of the packaging box 1 through the sealing rings and an embedded slideway 701, the upper surface of the filter box 7 is communicated with the smoke extractor 707 through the air duct 706, a smoke exhaust pipeline is fixedly connected and arranged on the discharge port of the smoke extractor 707, the smoke extractor 707 is started, a small gap is opened simultaneously when the smoke extractor 707 is cooled and exhausted, at the same time, the external cooling air is sucked into the box door 101, the temperature of the air is taken away by the sealing fins, the temperature of the surface of the lower mould 5 and the upper mould 3 is cooled, the temperature of the inner surface of the filter box can be quickly solidified, and the ultra-efficiency glass filter screen 7 can be taken away, and the ultra-high-efficiency filter screen 7 can be achieved HEPA high-efficiency particle filter screen 703 and active carbon filter screen 702, the peculiar smell gas that produces when just so can filter the inside heating plastics of encapsulation box 1 and get rid of, and the gas after getting rid of will pass the smoke extractor 707 outdoor along air duct 706, just so can make to gas play certain purifying action.

It should be noted that, when the semiconductor packaging device is used, firstly, a worker needs to place a semi-finished semiconductor structure frame into a lower die cavity 503 on a lower heating and packaging die 5, and at the same time, pins of the semi-finished semiconductor structure frame are put into corresponding pin grooves 303, then the sealing box door 101 is closed, and is fixed through a fixing clamp 103 and a fixing clamp 104, then the control panel 102 is controlled to enable a hydraulic pump 301 to extend out of the hydraulic rod, the lower surface of an upper packaging die 3 is matched with the lower heating and packaging die 5, so as to achieve a die clamping state, at the moment, the lower heating and packaging die 5 and an injection molding machine 6 are simultaneously started to heat, so that the temperature is raised to a temperature of a plastic melting state, after the plastic melting state, the injection molding machine 6 can extrude the melted plastic into an injection molding channel 501 in a high pressure mode, and the rear injection molding channel 501 encapsulates the semiconductor structure in a space formed by the lower die cavity 503 and an upper die cavity 302 respectively through a vertical channel, after injection, the heating lower die 5 is closed to heat the power supply, the smoke extractor 707 is started, meanwhile, the sealing box door 101 is opened to a small gap, at the moment, external cooling gas is sucked, so that the gas flow takes away the temperature on the surface of the heating lower die 5 and the sealing upper die 3 by the radiating fins, the cooling solidification effect can be quickly achieved, the gas in the taking away box sequentially passes through the ultra-efficient glass fiber filter screen 704, the HEPA high-efficient particle filter screen 703 and the activated carbon filter screen 702 in the filter box 7, so that peculiar smell gas generated when plastic is heated in the sealing box 1 can be filtered and removed, the removed gas passes through the smoke extractor 707 along the gas guide pipe 706 to be discharged out of the room, the gas can be purified to a certain extent, the environment is protected, and after cooling, staff can start the hydraulic pump No. 4, the output rod of the second hydraulic pump 4 is pushed downwards to push the mounting panel 401, so that the push shearing structure 402 is quickly inserted into the shearing port 304, and the flash between pins can be cut off, so that the procedure of continuing to remove the flash can be reduced, the functionality of the whole packaging equipment is stronger, and the working efficiency is improved.

The foregoing has shown and described the basic principles and main features of the present invention and the advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The semiconductor packaging equipment is characterized by comprising a packaging box body (1), wherein a mounting cabinet body (2) is fixedly arranged on the lower surface of the packaging box body (1), a packaging upper die (3) is movably arranged in the packaging box body (1), a second hydraulic pump (4) is fixedly arranged on the upper surface of the interior of the packaging box body (1), a heating sealing mounting lower die (5) is fixedly arranged on the lower surface of the packaging box body (1), an injection molding machine (6) is fixedly arranged on one side of the heating sealing mounting lower die (5) in the interior of the packaging box body (1), and a filtering box body (7) is fixedly arranged on the upper surface of the packaging box body (1);

An operation port is formed in the front surface of the packaging box body (1), a sealing box door (101) is movably mounted on the edge of one side, located at the operation port, of the front surface of the packaging box body (1), a fixing clamp (103) is fixedly mounted on the other side of the sealing box door (101), a fixing clamp pin (104) is movably mounted on the other side, located at the operation port, of the front surface of the packaging box body (1), and a control panel (102) is fixedly mounted on one side, located at the front surface, of the packaging box body (1), of the fixing clamp pin (104) and far away from the operation port;

the sealing box door (101) is movably connected with the packaging box body (1) through a hinge, toughened glass is fixedly embedded in the middle of the sealing box door (101), and the sealing box door (101) is clamped on the fixing clamp (103) through the fixing clamp pin (104) and is fixed with the packaging box body (1);

The inside surface fixed mounting of filtration box (7) has inlays establishes slide (701), the inside of filtration box (7) is located the fixed active carbon filter screen (702) of inlaying of establishing, the inside of filtration box (7) is located the fixed HEPA high-efficient particulate filter screen (703) of inlaying of installing of below of active carbon filter screen (702), the inside of filtration box (7) is located the fixed super high-efficient glass fiber filter screen (704) of inlaying of below of HEPA high-efficient particulate filter screen (703), the surface edge of active carbon filter screen (702), HEPA high-efficient particulate filter screen (703) and super high-efficient glass fiber filter screen (704) all fixed mounting has installation frame (705), the upper surface fixed connection of filtration box (7) is installed air duct (706), the other end fixed connection of air duct (706) is installed smoke exhauster (707), the outside surface fixed mounting of installation frame (705) has pull handle (708);

The lower port of the filter box body (7) is communicated with the packaging box body (1), sealing rings are fixedly installed on the upper surface and the lower surface of the installation frame (705) close to the edge, the installation frame (705) is in a sealing structure with the inner side surface of the packaging box body (1) through the sealing rings and embedded sliding ways (701), the upper surface of the filter box body (7) is communicated with a smoke extractor (707) through an air duct (706), a smoke exhaust pipeline is fixedly connected with the discharge port of the smoke extractor (707), and radiating fins are fixedly installed on the surfaces of the lower heating packaging die (5) and the upper packaging die (3).

2. The semiconductor packaging equipment according to claim 1, wherein the upper surface of the upper packaging die (3) is adjacent to two side surfaces and is provided with a first hydraulic pump (301), the lower surface of the upper packaging die (3) is provided with an upper die groove (302), the periphery of the lower surface of the upper packaging die (3) located in the upper die groove (302) is provided with pin grooves (303), and the surface of the upper packaging die (3) located between the pin grooves (303) is provided with shear ports (304).

3. A semiconductor packaging apparatus according to claim 2, wherein the number of the pin grooves (303) is set according to the number of semiconductor pins, and the first hydraulic pump (301) is fixedly mounted on the upper surface inside the packaging box (1).

4. The semiconductor packaging equipment according to claim 2, wherein the output end of the second hydraulic pump (4) is fixedly connected and provided with a mounting panel (401), the lower surface of the mounting panel (401) is fixedly provided with a shearing structure (402), and the shearing structure (402) is correspondingly arranged with a shearing port (304) in the upper packaging die (3).

5. The semiconductor packaging equipment according to claim 2, wherein an injection molding channel (501) is formed in the lower heating packaging die (5), an injection molding port (502) is formed in a port of the injection molding channel (501) on the surface of the lower heating packaging die (5), a lower die groove (503) is formed in the upper surface of the lower heating packaging die (5), the injection molding channel (501) is communicated with the lower die groove (503) through a vertical channel, the upper packaging die (3) is matched with the lower heating packaging die (5), the number of the upper die grooves (302) and the number of the lower die grooves (503) are three in total, and the upper die grooves (302) and the lower die grooves (503) are matched.