CN112118670A - Transparent flexible PVB composite structure high-frequency transmission line and preparation method thereof - Google Patents
Transparent flexible PVB composite structure high-frequency transmission line and preparation method thereof Download PDFInfo
- Publication number
- CN112118670A CN112118670A CN202010908336.3A CN202010908336A CN112118670A CN 112118670 A CN112118670 A CN 112118670A CN 202010908336 A CN202010908336 A CN 202010908336A CN 112118670 A CN112118670 A CN 112118670A
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- China
- Prior art keywords
- pvb
- transmission line
- frequency transmission
- transparent flexible
- composite structure
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- 230000005540 biological transmission Effects 0.000 title claims abstract description 36
- 239000002131 composite material Substances 0.000 title claims abstract description 19
- 238000002360 preparation method Methods 0.000 title abstract description 5
- 229920000642 polymer Polymers 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 6
- 230000003287 optical effect Effects 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 30
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 15
- 239000005057 Hexamethylene diisocyanate Substances 0.000 claims description 13
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 claims description 13
- 239000011521 glass Substances 0.000 claims description 12
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 238000003756 stirring Methods 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 239000002042 Silver nanowire Substances 0.000 claims description 5
- 239000008367 deionised water Substances 0.000 claims description 5
- 229910021641 deionized water Inorganic materials 0.000 claims description 5
- 239000006185 dispersion Substances 0.000 claims description 5
- 239000003960 organic solvent Substances 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 4
- 125000005442 diisocyanate group Chemical group 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- 238000005245 sintering Methods 0.000 claims description 2
- 239000007921 spray Substances 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 abstract 5
- 229920006352 transparent thermoplastic Polymers 0.000 abstract 1
- 238000000206 photolithography Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a high-frequency transmission line with a transparent flexible PVB composite structure and a preparation method thereof, wherein the high-frequency transmission line takes polyvinyl butyral (PVB) as a support polymer, and is a transparent thermoplastic polymer with optical transparency, strong bonding capability, good mechanical flexibility and strong adhesion capability to a plurality of surfaces. The transparent flexible high-frequency conductive transmission line is prepared by adopting a reverse layer treatment technology, and the method enables the conductive wire to be completely embedded below the surface of the PVB, so that the contact area between the conductive wire and the PVB is greatly increased, and the high-frequency transmission line with stable machinery is obtained. In addition, the high-frequency transmission line prepared by the invention has high flexibility, and the transmission characteristic of the high-frequency transmission line is not obviously reduced even if the high-frequency transmission line bears repeated sliding.
Description
Technical Field
The invention relates to the technical field of high-frequency transmission lines, in particular to a transparent flexible PVB composite structure high-frequency transmission line and a preparation method thereof.
Background
The fabrication of high-frequency antennas and transmission lines is usually done by laminating metal sheets onto a substrate or by sputtering/plating and subsequent patterning followed by metal deposition; these designs are prone to creasing and even fail to work properly when subjected to mechanical deformation such as bending, folding, twisting and stretching. Furthermore, the opacity of the metal layers prevents their use in the manufacture of transparent conductors; however, to obtain a transparent and flexible high-frequency transmission line, a transparent, flexible and highly conductive material is required.
Disclosure of Invention
The invention aims to provide a transparent flexible PVB composite structure high-frequency transmission line and a preparation method thereof.
The invention provides the following technical scheme:
a transparent flexible PVB composite structure high-frequency transmission line is characterized by being prepared by the following method: the glass substrate is sequentially cleaned by deionized water, IPA and acetone, then the dispersion liquid of the silver nanowires is sprayed on the glass substrate, and then the glass substrate is heated at a certain temperature to remove the organic solvent in the coating. The coating was then exposed to a few intense light pulses of an optical sintering system with an input voltage of 3.0 kV. The layer is then patterned by photolithography into a specially designed CPW circuit that includes a signal line and two parallel ground signal return layers. The width of the signal line is 100 μm, and the distance between the signal line and the signal return layer is 130 μm.
Then preparing polymer, dissolving PVB in solvent, stirring at a certain temperature until the PVB is completely dissolved, and then adding a certain amount of hexamethylene diisocyanate and stirring until the hexamethylene diisocyanate is completely dissolved. The PVB solution was then sprayed onto substrates coated with CPW circuitry, the speed of the spray and the speed of movement of the substrate were controlled, the thickness of the PVB polymer was controlled, then cured overnight at 80 ℃, then immersed in water to allow the sample to fall off the substrate, and finally dried for 60min at 40 ℃.
A transparent flexible PVB composite construction high frequency transmission line which characterized in that: the exposure time to a strong light pulse of a photosintering system with an input voltage of 3.0kV is 0.001 μ s to 60 s.
A transparent flexible PVB composite construction high frequency transmission line which characterized in that: the number of exposures to intense light pulses of a photosintering system with an input voltage of 3.0kV is 1-10.
The high-frequency transmission line with the transparent flexible PVB composite structure is characterized in that a solvent for dissolving the PVB is one or more of dimethylformamide, ethyl acetate, ethanol and the like.
The high-frequency transmission line with the transparent flexible PVB composite structure is characterized in that the mass ratio of diisocyanate to PVB is 0.01-10.
The high-frequency transmission line with the transparent flexible PVB composite structure is characterized in that the flow speed of PVB solution is 0.01-100m3/min。
The high-frequency transmission line with the transparent flexible PVB composite structure is characterized in that the moving speed of the substrate is 0.001-100 m/s.
Compared with the prior art, the invention has the beneficial effects that: the method is simple and convenient, has low cost and is suitable for large-scale production, and in addition, the PVB is used as a main polymer raw material and is mixed with certain specific polymers, so that the optical transparency, the bonding capability, the mechanical flexibility and the adhesion capability to a plurality of surfaces of the high-frequency transmission line can be effectively improved. The transparent flexible high-frequency conductive transmission line is prepared by adopting a reverse layer treatment technology, and the method enables the conductive wire to be completely embedded below the surface of the PVB, so that the contact area between the conductive wire and the PVB is greatly increased, and the high-frequency transmission line with stable machinery is obtained. In addition, the high-frequency transmission line prepared by the invention has high flexibility, and the transmission characteristic of the high-frequency transmission line is not obviously reduced even if the high-frequency transmission line bears repeated sliding.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1 a glass substrate was sequentially washed with deionized water, IPA, and acetone, and then a dispersion of silver nanowires was sprayed on the glass substrate, followed by heating at a certain temperature to remove the organic solvent in the coating. The coating was then exposed to 3 intense light pulses of a photosintering system at an input voltage of 3.0kV for 1ms each. The layer is then patterned by photolithography into a specially designed CPW circuit that includes a signal line and two parallel ground signal return layers. The width of the signal line is 100 μm, and the distance between the signal line and the signal return layer is 130 μm.
Then preparing a polymer, dissolving PVB in dimethylformamide, stirring at a certain temperature until the PVB is completely dissolved, then adding a certain amount of hexamethylene diisocyanate, and stirring until the hexamethylene diisocyanate is completely dissolved, wherein the mass ratio of the hexamethylene diisocyanate to the PVB is 0.15. The PVB solution was then sprayed onto the CPW circuit-coated substrate at a speed of 1m3Min, moving speed of the substrate is 1m/s, thickness of PVB polymer is controlled, and curing is carried out at 80 DEG CAfter overnight, the sample was immersed in water to detach from the substrate and finally dried at 40 ℃ for 60 min.
Example 2 a glass substrate was sequentially washed with deionized water, IPA, and acetone, and then a dispersion of silver nanowires was sprayed on the glass substrate, followed by heating at a certain temperature to remove the organic solvent in the coating. The coating was then exposed to 2 intense light pulses of a photosintering system at an input voltage of 3.0kV for 10ms each. The layer is then patterned by photolithography into a specially designed CPW circuit that includes a signal line and two parallel ground signal return layers. The width of the signal line is 100 μm, and the distance between the signal line and the signal return layer is 130 μm.
Then preparing a polymer, dissolving PVB in dimethylformamide, stirring at a certain temperature until the PVB is completely dissolved, then adding a certain amount of hexamethylene diisocyanate, and stirring until the hexamethylene diisocyanate is completely dissolved, wherein the mass ratio of the hexamethylene diisocyanate to the PVB is 0.10. The PVB solution was then sprayed onto the CPW circuit-coated substrate at a speed of 10m3The thickness of the PVB polymer was controlled at a speed of 10m/s for the substrate to move, then cured overnight at 80 deg.C, then immersed in water to allow the sample to fall off the substrate, and finally dried for 60min at 40 deg.C.
Example 3 a glass substrate was sequentially washed with deionized water, IPA, and acetone, and then a dispersion of silver nanowires was sprayed on the glass substrate, followed by heating at a certain temperature to remove the organic solvent in the coating. The coating was then exposed to 5 intense light pulses of a photosintering system at an input voltage of 3.0kV for 0.1ms each. The layer is then patterned by photolithography into a specially designed CPW circuit that includes a signal line and two parallel ground signal return layers. The width of the signal line is 100 μm, and the distance between the signal line and the signal return layer is 130 μm.
Then preparing a polymer, dissolving PVB in dimethylformamide, stirring at a certain temperature until the PVB is completely dissolved, then adding a certain amount of hexamethylene diisocyanate, and stirring until the hexamethylene diisocyanate is completely dissolved, wherein the mass ratio of the hexamethylene diisocyanate to the PVB is 0.3. The PVB solution was then sprayed onto the CPW circuit-coated substrate at a speed of 0.1m3The thickness of the PVB polymer was controlled at 0.1m/s for the substrate to move, then cured overnight at 80 deg.C, then submerged in water to allow the sample to fall off the substrate, and finally dried for 60min at 40 deg.C.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
1. A transparent flexible PVB composite structure high-frequency transmission line is characterized by being prepared by the following method: the glass substrate is sequentially cleaned by deionized water, IPA and acetone, then the dispersion liquid of the silver nanowires is sprayed on the glass substrate, and then the glass substrate is heated at a certain temperature to remove the organic solvent in the coating. The coating was then exposed to a few intense light pulses of an optical sintering system with an input voltage of 3.0 kV. The layer is then patterned by a photolithographic process into a specially designed CPW circuit that includes a signal line and two parallel ground signal return layers. The width of the signal line is 100 μm, and the distance between the signal line and the signal return layer is 130 μm. Then preparing polymer, dissolving PVB in solvent, stirring at a certain temperature until the PVB is completely dissolved, and then adding a certain amount of hexamethylene diisocyanate and stirring until the hexamethylene diisocyanate is completely dissolved. The PVB solution was then sprayed onto substrates coated with CPW circuitry, the speed of the spray and the speed of movement of the substrate were controlled, the thickness of the PVB polymer was controlled, then cured overnight at 80 ℃, then immersed in water to allow the sample to fall off the substrate, and finally dried for 60min at 40 ℃.
2. The transparent flexible PVB composite high frequency transmission line of claim 1, wherein: the exposure time to a strong light pulse of a photosintering system with an input voltage of 3.0kV is 0.001 μ s to 60 s.
3. The transparent flexible PVB composite high frequency transmission line of claim 1, wherein: the number of exposures to intense light pulses of a photosintering system with an input voltage of 3.0kV is 1-10.
4. The transparent flexible PVB composite structure high-frequency transmission line according to claim 1, wherein the solvent in which the PVB is dissolved is one or more of dimethylformamide, ethyl acetate, ethanol, etc.
5. The transparent flexible PVB composite structure high frequency transmission line of claim 1 wherein the mass ratio of diisocyanate to PVB is from 0.01 to 10.
6. The transparent flexible PVB composite structure high-frequency transmission line of claim 1 wherein the flow rate of the PVB solution is from 0.01 m to 100m3/min。
7. The transparent flexible PVB composite high frequency transmission line of claim 1 wherein the substrate is moved at a speed of 0.001-100 m/s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010908336.3A CN112118670A (en) | 2020-09-01 | 2020-09-01 | Transparent flexible PVB composite structure high-frequency transmission line and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010908336.3A CN112118670A (en) | 2020-09-01 | 2020-09-01 | Transparent flexible PVB composite structure high-frequency transmission line and preparation method thereof |
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| CN112118670A true CN112118670A (en) | 2020-12-22 |
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| CN202010908336.3A Pending CN112118670A (en) | 2020-09-01 | 2020-09-01 | Transparent flexible PVB composite structure high-frequency transmission line and preparation method thereof |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87102318A (en) * | 1987-03-28 | 1987-12-23 | 刘俊泉 | The flexible composite foil-coating material for printed circuits making method |
| JP2007039567A (en) * | 2005-08-03 | 2007-02-15 | Kri Inc | COMPOSITE MOLDED ARTICLE FOR HIGH FREQUENCY ELECTRONIC COMPONENT AND COMPOSITION FOR PRODUCING COMPOSITE MOLDED ARTICLE FOR HIGH FREQUENCY ELECTRONIC COMPONENT |
| US20150042420A1 (en) * | 2013-08-06 | 2015-02-12 | The United States Government As Represented By The | Optically transparent, radio frequency, planar transmission lines |
| KR20160136605A (en) * | 2015-05-20 | 2016-11-30 | 재단법인대구경북과학기술원 | Method for manufacturing transparent electrode |
| CN108648857A (en) * | 2018-05-17 | 2018-10-12 | 天津宝兴威科技股份有限公司 | A kind of illumination sintering processing method of transparent conductive film |
| CN110544553A (en) * | 2018-09-09 | 2019-12-06 | 浙江精一新材料科技有限公司 | Flexible transparent electrode and its preparation method and light transmission control device containing the transparent electrode |
| CN110691469A (en) * | 2019-08-23 | 2020-01-14 | 李龙凯 | Coating forming method of novel material layer structure of high-frequency circuit board and product thereof |
-
2020
- 2020-09-01 CN CN202010908336.3A patent/CN112118670A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87102318A (en) * | 1987-03-28 | 1987-12-23 | 刘俊泉 | The flexible composite foil-coating material for printed circuits making method |
| JP2007039567A (en) * | 2005-08-03 | 2007-02-15 | Kri Inc | COMPOSITE MOLDED ARTICLE FOR HIGH FREQUENCY ELECTRONIC COMPONENT AND COMPOSITION FOR PRODUCING COMPOSITE MOLDED ARTICLE FOR HIGH FREQUENCY ELECTRONIC COMPONENT |
| US20150042420A1 (en) * | 2013-08-06 | 2015-02-12 | The United States Government As Represented By The | Optically transparent, radio frequency, planar transmission lines |
| KR20160136605A (en) * | 2015-05-20 | 2016-11-30 | 재단법인대구경북과학기술원 | Method for manufacturing transparent electrode |
| CN108648857A (en) * | 2018-05-17 | 2018-10-12 | 天津宝兴威科技股份有限公司 | A kind of illumination sintering processing method of transparent conductive film |
| CN110544553A (en) * | 2018-09-09 | 2019-12-06 | 浙江精一新材料科技有限公司 | Flexible transparent electrode and its preparation method and light transmission control device containing the transparent electrode |
| CN110691469A (en) * | 2019-08-23 | 2020-01-14 | 李龙凯 | Coating forming method of novel material layer structure of high-frequency circuit board and product thereof |
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