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CN112125298A - A kind of substrate rapid screening method of vertical structure graphene - Google Patents

A kind of substrate rapid screening method of vertical structure graphene Download PDF

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CN112125298A
CN112125298A CN202010843466.3A CN202010843466A CN112125298A CN 112125298 A CN112125298 A CN 112125298A CN 202010843466 A CN202010843466 A CN 202010843466A CN 112125298 A CN112125298 A CN 112125298A
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substrate
vertical structure
graphene
plasma
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王俊杰
叶继春
邬苏东
杨熹
廖明墩
盛江
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Ningbo Institute of Material Technology and Engineering of CAS
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Abstract

本发明公开一种垂直结构石墨烯的衬底快速筛选方法,包括以下步骤:1)在衬底表面划分区域并对其不同区域分别采用不同材料沉积预处理;2)将预处理后的衬底置于喷射式等离子体的反应腔室内的样品台上;3)将反应腔室抽至真空后通入Ar气,调节反应腔室压力达到200‑1500 Pa后,激发等离子体,随后通入H2和含碳反应气体;本发明可以在多种材料预处理后的衬底区域上一次性生长相同等离子体环境下的垂直结构石墨烯,也可以通过微区多点的方式生长不同等离子体条件下的垂直结构石墨烯。

Figure 202010843466

The invention discloses a method for rapidly screening a substrate of vertical structure graphene. Placed on the sample stage in the reaction chamber of the jet plasma; 3) After the reaction chamber was evacuated to a vacuum, Ar gas was introduced, and after the pressure of the reaction chamber was adjusted to 200-1500 Pa, the plasma was excited, and then H was introduced 2 and carbon-containing reactive gas; the present invention can grow vertical structure graphene under the same plasma environment at one time on the substrate area after pretreatment of various materials, and can also grow different plasma conditions by means of micro-region multi-point The vertical structure of graphene under.

Figure 202010843466

Description

一种垂直结构石墨烯的衬底快速筛选方法A kind of substrate rapid screening method of vertical structure graphene

技术领域technical field

本发明涉及垂直结构石墨烯制备技术领域,具体讲是一种垂直结构石墨烯的衬底快速筛选方法。The invention relates to the technical field of vertical structure graphene preparation, in particular to a substrate rapid screening method for vertical structure graphene.

背景技术Background technique

垂直结构石墨烯(vertical-oriented graphene)是碳材料家族中的一员,也被称作碳纳米片(carbon nanoflakes),是由几层石墨烯组成的石墨烯纳米片在衬底上垂直生长形成的有着丰富边缘的3D材料,单个纳米片宽度高度可达0.1到数十微米,但是厚度一般只有几个纳米或者小于1nm。作为一种原子厚度的层状材料,垂直结构石墨烯具有较大的比表面积、丰富的锐利边缘、较高的电子迁移率以及对电子扰动的高灵敏度等,被广泛应用于电催化、储能、传感器等领域。Vertical-oriented graphene (vertical-oriented graphene) is a member of the carbon material family, also known as carbon nanoflakes, which is formed by vertical growth of graphene nanoflakes composed of several layers of graphene It is a 3D material with rich edges, and the width and height of a single nanosheet can reach 0.1 to tens of micrometers, but the thickness is generally only a few nanometers or less than 1nm. As a layered material with atomic thickness, vertical structure graphene has large specific surface area, abundant sharp edges, high electron mobility, and high sensitivity to electron perturbation, etc., and is widely used in electrocatalysis, energy storage, etc. , sensors, etc.

目前,垂直结构石墨烯的合成方法主要采用等离子体增强化学气相沉积(plasma-enhanced chemical vapor deposition)技术,提供碳源的物质(一般是含碳气体)在等离子体环境中分解,并在应力和电场的共同作用下在衬底表面逐渐生长成垂直结构的石墨烯,整个生长过程一般分为成核、生长、终止三个阶段。PECVD在纳米结构生长方面具有很多优点:相对低的衬底温度,高度自由的生长选择性以及良好的纳米结构模式控制。这些优点使得PECVD成为最适合用来生长垂直结构石墨烯的方法,由于等离子体激发方式不同又可以分为:平面式电感耦合等离子体化学气相沉积(ICP-PECVD)、射频等离子体增强化学气相沉积(RF-PECVD)、微波等离子体增强化学气相沉积(MW-PECVD)、电子束激发等离子体增强化学气相沉积(EBE-PECVD)、电容耦合等离子体增强化学气相沉积(CCPE-PECVD)、螺旋波等离子体化学气相沉积。也有人采用热丝化学气相沉积(HF-CVD)和一些自搭建的装置如专利号CN202465870U公开的装置等。At present, the synthesis method of vertical structure graphene mainly adopts plasma-enhanced chemical vapor deposition (plasma-enhanced chemical vapor deposition). Under the combined action of the electric field, graphene with a vertical structure gradually grows on the surface of the substrate. The whole growth process is generally divided into three stages: nucleation, growth and termination. PECVD has many advantages in nanostructure growth: relatively low substrate temperature, highly free growth selectivity, and good nanostructure mode control. These advantages make PECVD the most suitable method for growing vertical structure graphene. Due to the different plasma excitation methods, it can be divided into: planar inductively coupled plasma chemical vapor deposition (ICP-PECVD), radio frequency plasma enhanced chemical vapor deposition (RF-PECVD), Microwave Plasma Enhanced Chemical Vapor Deposition (MW-PECVD), Electron Beam Excited Plasma Enhanced Chemical Vapor Deposition (EBE-PECVD), Capacitively Coupled Plasma Enhanced Chemical Vapor Deposition (CCPE-PECVD), Helical Wave Plasma Chemical Vapor Deposition. Some people also use hot wire chemical vapor deposition (HF-CVD) and some self-built devices such as the device disclosed in Patent No. CN202465870U.

虽然垂直结构石墨烯的生长不像普通二维石墨烯的生长那样苛刻需要催化物质,但是由于在衬底材料与垂直石墨烯之间存在的晶格错配程度等,衬底材料的种类会对垂直结构石墨烯的实际生长过程产生较大影响,进而影响制备的形貌结构,涉及最初的形核以及生长过程。而传统的垂直结构石墨烯的制备过程中,一次实验只能实现一种衬底的工艺条件探究,在多种衬底条件下的工艺探究时间成本大,效率低下,因此需要开发一种能对衬底进行快速、高效筛选的方法。Although the growth of vertical graphene is not as demanding as the growth of ordinary two-dimensional graphene, which requires catalytic substances, due to the degree of lattice mismatch between the substrate material and the vertical graphene, the type of substrate material will affect the The actual growth process of vertical structure graphene has a great influence, which in turn affects the prepared morphology and structure, involving the initial nucleation and growth process. In the traditional preparation process of vertical structure graphene, one experiment can only realize the process condition exploration of one substrate. The process exploration time under various substrate conditions is expensive and inefficient. Therefore, it is necessary to develop a method that can A method for rapid and efficient screening of substrates.

发明内容SUMMARY OF THE INVENTION

本发明所要解决的技术问题是,克服以上现有技术的缺点:提供一种垂直结构石墨烯的衬底快速筛选方法。The technical problem to be solved by the present invention is to overcome the above shortcomings of the prior art: to provide a substrate rapid screening method for vertical structure graphene.

本发明的技术解决方案如下:一种垂直结构石墨烯的衬底快速筛选方法,包括以下步骤:The technical solution of the present invention is as follows: a substrate rapid screening method of vertical structure graphene, comprising the following steps:

1)在衬底表面划分区域并对其不同区域分别采用不同材料沉积预处理;1) Divide areas on the substrate surface and use different material deposition pretreatments for different areas;

2)将预处理后的衬底置于喷射式等离子体的反应腔室内的样品台上;2) Place the pretreated substrate on the sample stage in the reaction chamber of the jet plasma;

3)将反应腔室抽至真空后通入Ar气,调节反应腔室压力达到200-1500 Pa后,激发等离子体炬,随后通入H2和含碳反应气体;3) After the reaction chamber is evacuated to a vacuum, Ar gas is introduced, and after adjusting the pressure of the reaction chamber to 200-1500 Pa, the plasma torch is excited, and then H 2 and carbon-containing reaction gas are introduced;

4)通过喷射式等离子体的等离子体炬在采用不同材料沉积预处理后的衬底区域沉积垂直结构石墨烯,即可根据不同区域垂直结构石墨烯的生长特性快速筛选符合要求的衬底材料。4) By using the plasma torch of jet plasma to deposit vertical structure graphene in the substrate area after deposition pretreatment with different materials, the substrate material that meets the requirements can be quickly screened according to the growth characteristics of vertical structure graphene in different regions.

所述喷射式等离子体是通过螺旋线圈方式产生的电感耦合式喷射等离子体或直流电弧产生的喷射等离子体。The jet plasma is an inductively coupled jet plasma generated by a helical coil method or a jet plasma generated by a direct current arc.

步骤1)中,在衬底表面沉积预处理的方法为热蒸发、E-beam或磁控溅射等真空薄膜沉积设备中的一种。In step 1), the method of deposition pretreatment on the surface of the substrate is one of vacuum thin film deposition equipment such as thermal evaporation, E-beam or magnetron sputtering.

步骤1)中,在衬底表面沉积预处理的材料为金属或金属氧化物。In step 1), the pre-processed material deposited on the surface of the substrate is metal or metal oxide.

步骤1)中的衬底在置于样品台之前进行抛光和清洗。The substrate in step 1) is polished and cleaned before being placed on the sample stage.

所述衬底清洗方式具体为分别在丙酮、乙醇、去离子水中超声清洗5-15分钟。Specifically, the substrate cleaning method is ultrasonic cleaning in acetone, ethanol, and deionized water for 5-15 minutes, respectively.

步骤3)中样品台与等离子体炬喷射出口的距离为20-60mm。In step 3), the distance between the sample stage and the jetting outlet of the plasma torch is 20-60 mm.

步骤2)中通入气体的流量分别为Ar:10-25 slm,H2:0-0.9 slm,含碳反应气体:10-200sccm。The flow rates of the gases introduced in step 2) are respectively Ar: 10-25 slm, H 2 : 0-0.9 slm, and carbon-containing reaction gas: 10-200 sccm.

所述含碳反应气体为CH4 、C2H2、C2H4、乙醇、CO2中的一种或几种。The carbon-containing reaction gas is one or more of CH 4 , C 2 H 2 , C 2 H 4 , ethanol, and CO 2 .

步骤4)中不同区域沉积的垂直结构石墨烯可以是在同一种生长条件等离子体下的沉积,也可以是通过微区多点方式实现的不同生长条件的等离子体下的沉积。The vertical structure graphene deposited in different regions in step 4) can be deposited under the same growth condition plasma, or can be deposited under the plasma of different growth conditions realized by the micro-area multi-point method.

本发明的有益效果是:本发明首先在衬底不同区域进行多种材料沉积预处理,然后采用等离子体喷射沉积来实现不同区域的同一或者不同生长条件的沉积。衬底的预处理可以采用电子束蒸发、磁控溅射、热蒸发等真空薄膜沉积方法来实现。The beneficial effects of the present invention are as follows: the present invention firstly performs deposition pretreatment of various materials in different regions of the substrate, and then uses plasma spray deposition to achieve deposition of the same or different growth conditions in different regions. The pretreatment of the substrate can be realized by vacuum thin film deposition methods such as electron beam evaporation, magnetron sputtering, thermal evaporation, etc.

本发明可以在多种材料预处理后的衬底区域上一次性生长相同等离子体环境下的垂直结构石墨烯,也可以通过微区多点的方式生长不同等离子体条件下的垂直结构石墨烯。The invention can grow the vertical structure graphene under the same plasma environment at one time on the substrate area pretreated with various materials, and can also grow the vertical structure graphene under different plasma conditions by means of micro-region multi-point.

通过一次实验即可实现多个工艺组合条件的探究,实现具有晶体生长催化作用处理衬底的快速筛选,大大加快了实验效率,加快新材料和工艺的开发研究。Through one experiment, the exploration of multiple process combination conditions can be realized, and the rapid screening of substrates with crystal growth catalytic effect can be realized, which greatly speeds up the experimental efficiency and accelerates the development and research of new materials and processes.

提高了衬底材料的利用率,节省了物质成本和时间成本。The utilization rate of the substrate material is improved, and the material cost and time cost are saved.

附图说明Description of drawings

图1 为实施例1的衬底表面工艺组合示意图。FIG. 1 is a schematic diagram of a substrate surface process combination in Embodiment 1. FIG.

图2为实施例2的衬底表面工艺组合示意图。FIG. 2 is a schematic diagram of a substrate surface process combination in Embodiment 2. FIG.

图3为实施例2生长区域1扫描电镜图。FIG. 3 is a scanning electron microscope image of growth area 1 in Example 2. FIG.

图4为实施例2样品的拉曼图谱。FIG. 4 is the Raman spectrum of the sample of Example 2. FIG.

图5为实施例2样品的扫描电镜图。FIG. 5 is a scanning electron microscope image of the sample of Example 2. FIG.

图6为实施例2样品的扫描电镜图。FIG. 6 is a scanning electron microscope image of the sample of Example 2. FIG.

图7为实施例2生长区域2扫描电镜图。FIG. 7 is a scanning electron microscope image of growth area 2 in Example 2. FIG.

图8为实施例2生长区域2扫描电镜图。FIG. 8 is a scanning electron microscope image of growth region 2 in Example 2. FIG.

图9为实施例2生长区域2的拉曼图谱。FIG. 9 is the Raman spectrum of the growth region 2 of Example 2. FIG.

图10为实施例2生长区域2扫描电镜图。FIG. 10 is a scanning electron microscope image of growth area 2 in Example 2. FIG.

具体实施方式Detailed ways

下面用具体实施例对本发明做进一步详细说明,但本发明不仅局限于以下具体实施例。The present invention will be described in further detail below with specific examples, but the present invention is not limited to the following specific examples.

实施例1Example 1

喷射式等离子体设备具体可以为专利CN104867801A公开的电感耦合等离子体喷枪及等离子体设备或者文献【Carbon Volume 147, June 2019, Pages 341-347】所公开的设备。The jet plasma equipment may specifically be the inductively coupled plasma spray gun and the plasma equipment disclosed in the patent CN104867801A or the equipment disclosed in the document [Carbon Volume 147, June 2019, Pages 341-347].

使用电感耦合产生的高密度喷射等离子体制备,等离子体喷射出口距离样品台约30mm。将硅片衬底依次在丙酮、乙醇、去离子水中清洗10-20min后,在其表面使用电子束E-Beam装置通过掩膜板进行不同金属蒸镀预处理,如图1所示,衬底被分为4个区域,编号1为电子束镀镍(Ni)区域,编号2为镀铝(Al)区域,编号3为镀钯(Pd)区域,编号4为镀金(Au)区域,然后,将预处理后的衬底置于反应腔室内的样品台上,向反应腔室通入等离子体气源,将其激发产生等离子体。所用气体流量分别为氩气 21 slm,H2 0.9slm,CH4 50sccm,并将反应腔室压力调节至800(±5)Pa,所加射频电源功率为18kw,衬底上进行同一生长条件的垂直结构石墨烯沉积。It was prepared using a high-density jet plasma generated by inductive coupling, and the plasma jet outlet was about 30 mm away from the sample stage. After cleaning the silicon wafer substrate in acetone, ethanol, and deionized water for 10-20min in turn, use an electron beam E-Beam device to perform different metal evaporation pretreatment on its surface through a mask, as shown in Figure 1, the substrate It is divided into 4 areas, number 1 is the electron beam nickel (Ni) area, number 2 is aluminum (Al) area, number 3 is palladium (Pd) area, number 4 is gold (Au) area, and then, The pretreated substrate is placed on the sample stage in the reaction chamber, and a plasma gas source is introduced into the reaction chamber to excite it to generate plasma. The gas flow rates used were 21 slm for argon, 0.9 slm for H 2 and 50 sccm for CH 4 , respectively, and the pressure of the reaction chamber was adjusted to 800 (±5) Pa, and the applied RF power was 18 kw. The same growth conditions were carried out on the substrate. Vertical structure graphene deposition.

实施例2Example 2

使用直流电弧产生高密度喷射等离子体制备,等离子体喷射出口距离样品台约40mm。本实施例与实施例1基本相同,不同之处在于,将衬底材料分为25个区域,如图2所示,对其不同区域使用热蒸发进行不同材料的蒸镀预处理,单次沉积试验即可探究不同的表面工艺处理对垂直结构石墨烯成核以及生长的作用。通过微区多点方式,对不同区域进行不同生长条件的沉积:1-5区域所用气体流量分别为氩气 21 slm,H2 0.9slm,CH4 50sccm,6-10区域所用气体流量分别为氩气20slm,H2 0.6slm,CH4 60sccm,11-15区域所用气体流量分别为氩气21slm,H2 0.3slm,CH4 50sccm,16-20区域所用气体流量分别为氩气20slm,H2 0.3slm,CH4 90sccm,21-25区域所用气体流量分别为氩气21slm,H2 0.9slm,CH4 30sccm。The high-density jet plasma was prepared using a DC arc, and the plasma jet outlet was about 40 mm away from the sample stage. This embodiment is basically the same as Embodiment 1, the difference is that the substrate material is divided into 25 areas, as shown in FIG. 2 , different areas are pretreated by thermal evaporation for evaporation of different materials, and a single deposition is performed. The experiment can explore the effect of different surface treatments on the nucleation and growth of vertical graphene. Through the micro-area multi-point method, different regions are deposited with different growth conditions: the gas flow rates used in regions 1-5 are argon 21 slm, H 2 0.9slm, CH 4 50sccm, and the gas flow used in regions 6-10 are argon Gas 20slm, H 2 0.6slm, CH 4 60sccm, the gas flow rates used in the 11-15 areas are argon 21slm, H 2 0.3slm, CH 4 50sccm, and the gas flows used in the 16-20 areas are argon 20slm, H 2 0.3 slm, CH 4 90sccm, the gas flow rates used in 21-25 areas are argon 21slm, H 2 0.9slm, CH 4 30sccm.

对于实施例1,以编号1、2区域为例,生长参数设置一致:氩气21slm,氢气0.9slm,甲烷气体50sccm,样品台距等离子体腔口约30mm ,射频电源的功率为18kw。For Example 1, taking the areas numbered 1 and 2 as an example, the growth parameters were set the same: argon gas 21slm, hydrogen 0.9slm, methane gas 50sccm, the sample stage was about 30mm from the plasma cavity mouth, and the power of the radio frequency power supply was 18kw.

对于生长区域1(衬底表面未进行蒸镀预处理),沉积时间为5s时,非晶态石墨和α-C的混合缓冲层已经形成,且此时缓冲层上已有一些成核位点及纳米岛,扫描电镜图片如图3所示。For growth region 1 (the substrate surface is not pretreated by evaporation), when the deposition time is 5s, the mixed buffer layer of amorphous graphite and α-C has been formed, and there are some nucleation sites on the buffer layer at this time And the nano-island, the scanning electron microscope picture is shown in Figure 3.

沉积时间为7s时,通过样品的拉曼图谱以及扫描电镜图分析可知衬底表面已形成一层完整的垂直结构石墨烯层,如图4和图5所示。When the deposition time is 7s, it can be seen that a complete vertical structure graphene layer has been formed on the surface of the substrate according to the Raman pattern and scanning electron microscope analysis of the sample, as shown in Figure 4 and Figure 5.

随着沉积时间进一步增加,衬底上生长的垂直石墨烯纳米片的密度变大,表面微观形貌相近,如图6所示。With the further increase of the deposition time, the density of the vertical graphene nanosheets grown on the substrate became larger, and the surface micromorphology was similar, as shown in Figure 6.

对于生长区域2(衬底表面镀镍约100nm),沉积时间为3s时,非晶态石墨和α—C的混合缓冲层已经形成,且此时缓冲层上已可观察到大量成核位点和生长的纳米岛,扫面电镜图片如图7和图8所示。For growth region 2 (nickel plating on the surface of the substrate is about 100 nm), when the deposition time is 3 s, a mixed buffer layer of amorphous graphite and α-C has been formed, and a large number of nucleation sites can be observed on the buffer layer at this time. and the grown nano-islands, the scanning electron microscope images are shown in Fig. 7 and Fig. 8.

沉积时间为5s时,通过样品的拉曼图谱以及扫描电镜图分析可知衬底表面已形成一层完整的垂直结构石墨烯层,如图9和图10所示。When the deposition time is 5s, it can be seen that a complete vertical structure graphene layer has been formed on the surface of the substrate according to the Raman pattern and scanning electron microscope analysis of the sample, as shown in Figure 9 and Figure 10.

对比编号1(衬底表面未进行金属蒸镀预处理)区域和编号2(衬底表面进行电子束镀镍约100nm)区域可知,衬底表面镀镍预处理后,垂直结构石墨烯成核时间由5s左右缩短到3s左右,显著加快了垂直结构石墨烯在衬底表面的成核,提高了垂直结构石墨烯的制备效率。Comparing the area No. 1 (no metal evaporation pretreatment on the substrate surface) and No. 2 (electron beam nickel plating about 100 nm on the substrate surface) area, it can be seen that after the nickel plating pretreatment on the substrate surface, the vertical structure graphene nucleation time It is shortened from about 5s to about 3s, which significantly accelerates the nucleation of vertical structure graphene on the surface of the substrate and improves the preparation efficiency of vertical structure graphene.

对于实施例2For Example 2

对于不同材料预处理的25个微区,设置的生长条件不同,通过多点沉积即可在衬底不同区域内进行不同条件下的垂直结构石墨烯沉积,即单次沉积实验完成了多种材料对垂直结构石墨烯生长影响的探索,实现衬底的快速筛选。For the 25 micro-regions pretreated with different materials, the growth conditions are different, and the vertical structure graphene deposition under different conditions can be carried out in different regions of the substrate through multi-point deposition, that is, a single deposition experiment has completed a variety of materials. Exploration of the effect of vertical structure graphene growth, enabling rapid screening of substrates.

以上仅是本发明的特征实施范例,对本发明保护范围不构成任何限制。凡采用同等交换或者等效替换而形成的技术方案,均落在本发明权利保护范围之内。The above are only characteristic implementation examples of the present invention, and do not constitute any limitation to the protection scope of the present invention. All technical solutions formed by equivalent exchange or equivalent replacement fall within the protection scope of the present invention.

Claims (10)

1. A method for rapidly screening a substrate of graphene with a vertical structure is characterized by comprising the following steps:
1) dividing regions on the surface of the substrate and respectively adopting different materials for deposition pretreatment on different regions;
2) placing the pretreated substrate on a sample table in a reaction chamber of the jet plasma;
3) pumping the reaction chamber to vacuum, introducing Ar gas, adjusting the pressure of the reaction chamber to 200-1500 Pa, exciting plasma, and introducing H2And a carbon-containing reaction gas;
4) the vertical-structure graphene is deposited in the substrate area after deposition pretreatment of different materials through the jet plasma, and the substrate material meeting the requirements can be rapidly screened according to the growth characteristics of the vertical-structure graphene in different areas.
2. The method for rapidly screening the substrate with the vertical structure graphene according to claim 1, wherein the jet plasma is an inductively coupled jet plasma generated by a spiral coil method or a jet plasma generated by a direct current arc.
3. The method for rapidly screening the substrate with the vertical structure graphene according to claim 1, wherein in the step 1), the method for deposition pretreatment on the surface of the substrate is one of thermal evaporation, E-beam or magnetron sputtering vacuum thin film deposition.
4. The method for rapidly screening the substrate with the vertical structure graphene according to claim 1, wherein in the step 1), the material deposited and pretreated on the surface of the substrate is an elemental metal or an alloy.
5. The method for rapidly screening the substrate of the vertical structure graphene according to claim 1, wherein the substrate in the step 1) is cleaned before being placed on a sample stage.
6. The method for rapidly screening the substrate of the graphene with the vertical structure according to claim 5, wherein the substrate is cleaned by ultrasonic cleaning in acetone, ethanol and deionized water for 5-15 minutes.
7. The method for rapidly screening the substrate of the vertical structure graphene according to claim 1, wherein the distance between the sample stage and the plasma torch jet outlet in the step 3) is 20-60 mm.
8. The method for rapidly screening the substrate of the graphene with the vertical structure according to claim 1, wherein the flow rates of the gas introduced in the step 3) are Ar: 10-25 slm, H2: 0-0.9 slm, carbon-containing reactant gas: 10-200 sccm.
9. The method for rapidly screening the substrate of the graphene with the vertical structure according to claim 1 or 8, wherein the carbon-containing reaction gas is CH4 、C2H2、C2H4Ethanol, CO2One or more of them.
10. The method for rapidly screening the substrate of the vertical structure graphene according to claim 1, wherein the vertical structure graphene deposited in different areas in the step 4) can be deposited under the same growth condition plasma, or can be deposited under different growth conditions plasma by a micro-area multi-point mode.
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