CN112230452B - Substrate sampling inspection method - Google Patents
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- CN112230452B CN112230452B CN201910637499.XA CN201910637499A CN112230452B CN 112230452 B CN112230452 B CN 112230452B CN 201910637499 A CN201910637499 A CN 201910637499A CN 112230452 B CN112230452 B CN 112230452B
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- 239000000758 substrate Substances 0.000 title claims abstract description 268
- 238000000034 method Methods 0.000 title claims abstract description 184
- 238000007689 inspection Methods 0.000 title claims abstract description 48
- 238000005070 sampling Methods 0.000 title claims abstract description 42
- 238000005259 measurement Methods 0.000 claims abstract description 69
- 238000005530 etching Methods 0.000 claims description 20
- 238000009826 distribution Methods 0.000 abstract description 5
- 239000011521 glass Substances 0.000 description 12
- 230000002159 abnormal effect Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- 238000001514 detection method Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
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Abstract
The invention discloses a substrate sampling inspection method, which comprises the following steps: performing spot inspection and pre-value measurement on a substrate according to preset spot inspection parameters to obtain a first measurement result of the substrate; binding the substrate to a target processing machine according to a preset sequence and executing a corresponding process; performing post-value measurement on the substrate to obtain a second measurement result; and determining the processing capacity of the target processing machine according to the first measurement result and the second measurement result. According to the substrate sampling inspection method, the substrates subjected to the previous value measurement are distributed to the target processing machines according to the preset sequence, so that the processing capacities of all the processing machines can be monitored in real time, and the risk that some processing machines are not monitored regularly due to uneven distribution is effectively avoided.
Description
Technical Field
The invention belongs to the technical field of display panels, and particularly relates to a substrate sampling inspection method.
Background
At present, the liquid crystal display device is widely used due to the advantages of thin body, power saving, no radiation and the like. The liquid crystal display device generally includes a housing, a liquid crystal display panel disposed in the housing, and a Backlight module (Backlight module) disposed in the housing, wherein the liquid crystal display panel generally comprises a color film substrate, an array substrate, a liquid crystal disposed between the color film substrate and the array substrate, and a sealant frame.
The quality of the glass substrate as an important component of the liquid crystal display panel is critical to the display effect of the display panel. In the manufacturing process of the substrate, in order to ensure the quality of the substrate, the manufacturing process quality of the substrate needs to be subjected to spot check, the spot check method of the substrate in the prior art comprises the steps of firstly providing a detection device, presetting a spot check frequency on the detection device, and detecting the substrate through a detection machine after the number of the substrates passing through the detection machine reaches the preset spot check frequency; and then distributing the qualified product detected by the detector to a subsequent processing machine for further detection.
However, in the mass production process of the substrate, in order to improve the production and the spot inspection efficiency, a plurality of process chambers (chambers) or a plurality of process machines are usually disposed in the equipment of the process, and the plurality of process chambers or the plurality of process machines operate simultaneously, so that the process capability of all the process machines must be detected in real time to ensure that the produced product has no quality problem. However, for the conventional spot check method, the products with the measured values before being measured on the inspection machine of the previous step are then randomly distributed to different subsequent process machines, and some of the process machines may not be distributed to the products to be spot checked all the time, so that the monitoring of the process capability of all the process machines cannot be fully satisfied.
Disclosure of Invention
In order to solve the above problems in the prior art, the present invention provides a substrate sampling inspection method. The technical problems to be solved by the invention are realized by the following technical scheme:
the invention provides a substrate sampling inspection method, which comprises the following steps:
performing spot inspection and pre-value measurement on a substrate according to preset spot inspection parameters to obtain a first measurement result of the substrate;
binding the substrate to a target processing machine according to a preset sequence, and executing a corresponding process;
performing post-value measurement on the substrate to obtain a second measurement result;
and determining the processing capacity of the target processing machine according to the first measurement result and the second measurement result.
In one embodiment of the present invention, performing spot inspection and pre-measurement on a substrate according to a preset spot inspection parameter to obtain a first measurement result of the substrate includes:
providing a detector and presetting the sampling frequency of the detector;
performing spot check and front value measurement on the substrate to be spot checked on the detector according to the spot check frequency so as to obtain the first measurement result;
and sequentially placing the substrates into corresponding substrate containers after the substrates are qualified according to the first measurement result.
In one embodiment of the present invention, the binding the substrate to the target process tool according to a predetermined sequence includes:
acquiring product information of the substrate and processing information entering in the next step;
and sequentially binding the substrate to the target processing machine in sequence by taking the substrate container as a unit according to the processing information.
In one embodiment of the present invention, sequentially binding the substrates to the target process tool in units of the substrate container according to the process information, includes:
sequentially numbering a plurality of substrate containers and a plurality of target processing machines respectively;
binding the substrates in each substrate container to a corresponding target processing machine according to the sequence numbers.
In one embodiment of the present invention, binding each of the substrate containers to a corresponding target process tool according to the serial number includes:
acquiring the operation parameters of the target processing machine;
judging whether the target processing machine operates normally, if so, binding, otherwise, binding the substrate in the substrate container to another processing machine of the same type as the target processing machine according to the sequence label;
and recording and storing the binding information of the substrate and the processing machine.
In one embodiment of the present invention, after the substrate is bound to the target processing machine in a predetermined order, the method further includes:
intermediate measurement is performed on the pre-measured substrate before the substrate is transferred to a corresponding target processing tool.
In one embodiment of the present invention, performing a corresponding process includes:
judging whether the substrates in the same substrate container are bound to the same target processing machine or not;
if yes, the substrate container is transmitted to the target processing machine;
if not, the substrate container is transmitted to the target processing machine which is bound with the most substrates in the substrate container.
In one embodiment of the present invention, transferring the substrate container to the target process tool bound corresponding to the largest number of substrates in the substrate container includes:
and when the target substrates with the same number of target process machines with different binding exists in the same substrate container, the substrate container is transmitted to the position of the target process machine corresponding to the target substrate positioned at the lower layer in the substrate container.
In one embodiment of the present invention, the target processing tool is an etcher, the front-end measurement is used to obtain a first film thickness of the substrate before entering the etcher, and the back-end measurement is used to obtain a second film thickness of the substrate after passing through the etcher.
In one embodiment of the present invention, determining the process capability of the target process tool according to the first measurement result and the second measurement result includes:
obtaining the etching thickness of the etching machine on the substrate according to the first film thickness and the second film thickness;
comparing the etching thickness with a set etching threshold to determine the process capability of the etching machine.
Compared with the prior art, the invention has the beneficial effects that:
according to the substrate spot check method, the substrates subjected to the previous value measurement are distributed to the target processing machine according to the preset sequence, so that the processing capacity of all the processing machines can be monitored in real time, and the risk that some processing machines are not monitored regularly due to uneven distribution is effectively avoided.
The present invention will be described in further detail with reference to the accompanying drawings and examples.
Drawings
FIG. 1 is a schematic diagram of a prior art substrate spot inspection method;
FIG. 2 is a flowchart of a method for sampling inspection of a substrate according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a binding process of a substrate spot inspection method according to an embodiment of the present invention;
FIG. 4 is a schematic diagram illustrating a binding process of another substrate sampling inspection method according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a target process tool allocation process according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of another process for assigning target process tools according to an embodiment of the present invention;
fig. 7 is a detailed flowchart of a substrate sampling inspection method according to an embodiment of the present invention.
Detailed Description
In order to further illustrate the technical means and effects adopted by the invention to achieve the preset aim, the invention provides a substrate sampling inspection method according to the invention, which is described in detail below with reference to the accompanying drawings and the detailed description.
The foregoing and other features, aspects, and advantages of the present invention will become more apparent from the following detailed description of the preferred embodiments when taken in conjunction with the accompanying drawings. The technical means and effects adopted by the present invention to achieve the intended purpose can be more deeply and specifically understood through the description of the specific embodiments, however, the attached drawings are provided for reference and description only, and are not intended to limit the technical scheme of the present invention.
It should be noted that in this document relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in an article or apparatus that comprises the element.
Example 1
As described above, for the conventional spot check method, the substrate with the measured front value on the inspection machine of the previous step is then randomly distributed to different subsequent process machines, and some process machines may not be distributed to the substrate to be spot checked all the time, so that the real-time monitoring of the process capability of all the process machines cannot be fully satisfied. Specifically, referring to fig. 1, fig. 1 is a schematic diagram of a conventional substrate sampling inspection method. Fig. 1 includes A, B, C, D four substrate containers (commonly known as clips) each loaded with a substrate for which a pre-metrology value has been performed, the four clips being randomly assigned to a process tool, and the prior art assignment method cannot ensure that each process tool can be assigned to a clip for spot inspection. As shown in fig. 1, the A, B, D clamp is assigned to process tool 1 at the same time, the C clamp is assigned to process tool 3, and process tool 2 is not assigned to the clamp, so that the etching capability of process tool 2 cannot be monitored. If the No. 2 processing machine is abnormal, the abnormal products cannot be found in a short time, and a large quantity of abnormal products are likely to be caused. Therefore, the conventional substrate spot inspection method cannot ensure that each processing machine can be monitored, if the processing machine has a problem, the abnormal product cannot be found in time, the yield of the product is reduced, and the productivity, manpower and material resources are wasted.
In order to solve the technical problem, the embodiment provides a substrate sampling inspection method, which can sequentially distribute the substrate subjected to the previous value measurement to the target processing machine, thereby controlling the processing capacity of all subsequent processing machines and effectively avoiding the risk that some processing machines are not regularly monitored due to uneven distribution.
Referring to fig. 2, fig. 2 is a flowchart of a substrate sampling inspection method according to an embodiment of the invention. The substrate sampling inspection method comprises the following steps:
s1: performing spot inspection and pre-value measurement on a substrate according to preset spot inspection parameters to obtain a first measurement result of the substrate;
generally, in the array process of a glass substrate, the steps of cleaning, film formation, yellow light plate making, etching, film stripping and the like are generally performed, wherein the cleaned glass substrate is firstly conveyed to a sputtering machine to be plated with a layer of ITO indium tin oxide semiconductor transparent conductive film, then yellow light and etching are used for preparing a region pattern, and then the glass substrate is stripped and cleaned by photoresist to complete the preparation process. In each step, the film quality of the glass substrate on the production line needs to be subjected to spot check so as to ensure the yield of subsequent or even finished products. In this embodiment, the user may set the spot inspection parameters (spot inspection frequency) of the glass substrate in advance in the control interface of the manufacturing execution system, so as to facilitate unified management and centralized control.
Specifically, the S1 includes:
s11: providing a detector and presetting the sampling frequency of the detector;
in this embodiment, the sampling parameters of the glass substrate are set on the manufacturing execution system of the display panel, and the sampling parameters are transmitted to the pipeline control system, which can accept and store the sampling parameters. The sampling inspection parameters are determined according to the manufacturing link of the glass substrate, and mainly comprise sampling inspection frequency. And the assembly line control system generates a sampling control signal according to the sampling parameter and sends the sampling control signal to the detector so that the detector can execute sampling operation according to the sampling control signal, namely sampling the selected glass substrate.
S12: performing spot check and front value measurement on the substrate to be spot checked on the detector according to the spot check frequency so as to obtain a first measurement result;
specifically, after the detection machine receives the sampling inspection control signal, sampling inspection operation is executed, and sampling inspection operation is executed on the glass substrate according to the corresponding sampling inspection rate. That is, the substrate in the process is subjected to the sampling inspection and the front value measurement according to the preset sampling inspection parameters, so as to obtain the front value measurement result, for example, the front value measurement is performed on the film thickness of the substrate, so as to obtain the film thickness value.
S13: and sequentially placing the substrates into corresponding substrate containers after the substrates are qualified according to the first measurement result.
Specifically, whether the substrate is qualified or not is judged according to the first measurement result, if not, the unqualified substrate is removed, and if yes, the qualified substrates are sequentially placed into corresponding substrate containers for the next process.
In each step of panel preparation, the film quality of the glass substrate on the production line needs to be subjected to spot check so as to ensure the yield of subsequent or even finished products. Specifically, according to the result of previous value measurement, for example, the film thickness of the substrate, whether the substrate is qualified in the previous preparation process can be judged, if the substrate is judged to be unqualified, the unqualified product does not need to be subjected to subsequent detection, otherwise, the judgment of the result of the subsequent detection can be influenced, and therefore, the unqualified product is removed, so that the accuracy of the subsequent detection process and the yield of finished products are ensured; and if the substrate is judged to be a qualified product, sequentially placing the qualified products into corresponding substrate containers for the next process. In this embodiment, the substrate container is a dedicated clip for accommodating substrates, in each clip, a plurality of substrates may be placed in parallel, and adjacent substrates are spaced apart from each other to prevent knocks and wear.
S2: binding the substrate to a target processing machine according to a preset sequence, and executing a corresponding process;
as described above, after the measurement of the pre-process values is completed in the previous process, the qualified substrate is placed in the chuck for transportation to the target process tool of the next process. In this step, the substrate is sequentially bound to a target process tool in units of clips.
Specifically, the specific steps of binding the substrate to the target processing machine according to a preset sequence include:
a1: acquiring product information of a substrate subjected to previous value measurement and processing information entering in the next step;
a2: and sequentially binding the substrate to the target processing machine in sequence by taking the substrate container as a unit according to the processing information.
Further, step a2 includes:
sequentially numbering a plurality of substrate containers and a plurality of target processing machines respectively; binding the substrates in each substrate container to a corresponding target processing machine according to the sequence numbers.
Referring to fig. 3, fig. 3 is a schematic process diagram of a substrate sampling inspection method according to an embodiment of the invention. As shown in fig. 3, it is assumed that the substrate on which the pre-measurement has been performed is placed in four clips A, B, C, D, each of which is loaded with a plurality of substrates, and the process stations on which the same process is to be performed include a process station No. 1, a process station No. 2, and a process station No. 3, at this time, the substrates are sequentially bound with the process stations in units of the clips by the line control system according to the serial numbers, specifically, the substrates of the clips a are all bound to the process station No. 1, the substrates of the clips B are all bound to the process station No. 2, the substrates of the clips C are all bound to the process station No. 3, and the substrates of the clips D are all bound to the process station No. 1, so that each process station has a clip input. Therefore, if one of the processing machines is abnormal, the abnormal processing machine can be found out to stop using or maintain in a short time, so that a large quantity of abnormal products are avoided.
Further, binding the substrate in each substrate container to a corresponding target processing machine according to the sequence number, including:
acquiring the operation parameters of the target processing machine;
judging whether the target processing machine operates normally or not, if so, binding, otherwise, binding the substrate in the substrate container to another processing machine of the same type as the target processing machine according to the sequence label;
and recording and storing the binding information of the substrate and the processing machine.
Specifically, referring to fig. 4, fig. 4 is a schematic diagram illustrating a binding process of another substrate sampling inspection method according to an embodiment of the present invention. As shown, it is assumed that the substrate on which the pre-measurement has been performed is placed in four clips A, B, C, D, each of which is loaded with a plurality of substrates, and the process tools to be performed include a process tool 1, a process tool 2, and a process tool 3. In the binding process, firstly, the operation parameters and records of the processing machines are respectively acquired, and the processing machine No. 2 is stopped or abnormal in operation is found, so that the processing machine No. 2 is eliminated in the binding process. In actual operation, the assembly line control system binds all substrates of the clamp A to the process machine table No. 1, all substrates of the clamp B are bound to the process machine table No. 3 around the process machine table No. 2 in sequence, all substrates of the clamp C are bound to the process machine table No. 1, and all substrates of the clamp D are bound to the process machine table No. 3, so that the substrates cannot be bound and transmitted to abnormal process machine tables, and each normal process machine table has clamp input.
In this embodiment, other intermediate measurements may be performed on the substrate measured by the pre-process values before the substrate is transferred to the corresponding target processing tool.
In the actual process, the substrate, which is measured before being finished and is bound to the target process machine, may not be immediately transferred to the target process machine for processing, but may be transferred to other spot check tasks, i.e. some intermediate measurements are performed, and then the process on the target process machine is performed, at this time, the substrate, which is previously bound to the same target process machine and placed in the same chuck, may be placed in different chucks, in other words, the substrate in the same chuck may be bound to different process machines.
Further, the step S2 of executing the corresponding process specifically includes:
judging whether the substrates in the same substrate container are bound to the same target processing machine or not; if yes, the substrate container is transmitted to the target processing machine; if not, the substrate container is transmitted to the target processing machine which is bound with the most substrates in the substrate container.
Specifically, referring to fig. 5, fig. 5 is a schematic diagram illustrating a target process tool allocation process according to an embodiment of the present invention. As described above, before entering the target process tool, the substrate may be transferred to perform other spot checks, so that the substrate in the same chuck may be bound to a different process tool, and therefore, before entering the process tool, it is first determined whether the substrate in the current chuck is bound to the same target process tool, if so, the current substrate container is transferred to the bound target process tool. If the substrate in the current clamp is bound to a different target process tool, as shown in fig. 5, the process tools to be executed include a process tool No. 1 and a process tool No. 2, and there are 3 substrates bound to a process tool No. 1 and 2 substrates bound to a process tool No. 2 in the current clamp a, the clamp is transferred to a process tool No. 1 under the control of the pipeline control system because the number of shifts bound to a process tool No. 1 is large.
Further, transferring the substrate container to the target process tool bound corresponding to the largest number of substrates in the substrate container, includes:
and when the target substrates with the same number of target process machines with different binding exists in the same substrate container, the substrate container is transmitted to the position of the target process machine corresponding to the target substrate positioned at the lower layer in the substrate container.
Specifically, referring to fig. 6, fig. 6 is a schematic diagram illustrating another allocation process of a target process tool according to an embodiment of the invention. Before entering a processing machine, firstly judging whether the substrate in the current clamp is bound to the same target processing machine, and if so, transmitting the current substrate container to the bound target processing machine. The substrates in the current clamp are bound to different target process machines, the target process machine with the most substrates bound in the current substrate container is checked according to the stored binding information, if the number of the target process machines with the most substrates bound in the current substrate container is the same as the number of the substrates bound in the process machine with the most substrates bound in the number 2, if the process machines to be executed include the process machines 3 1, the process machines 2 and the process machines 3, as shown in fig. 6, the current clamp a is provided with the 2 substrates bound in the process machine with the number 1, the 2 substrates bound in the process machine with the number 2 and the 1 substrates bound in the process machine with the number 3, i.e. the number of the substrates bound in the process machine with the number 1 is the same as the number of the substrates bound in the process machine with the number 2, and the corresponding to the substrates bound in the lower layer, i.e. the substrates bound in the process machine with the number 2 are transmitted to the corresponding target process machines with the number of the same process machine with the number of the substrate bound in the process machine with the number 2, i.e. the clamp control system is controlled, because the substrates bound in the process machine with the number 2 and the substrate bound in the process machine with the number 2 are located in the lower layer. Typically, the process tool withdraws substrates from the bottom up while withdrawing the substrate in the clamp, so the clamp is transferred to the lower substrate-bound process tool No. 2.
S4: performing post-value measurement on the substrate passing through the target processing machine to obtain a second measurement result;
in this embodiment, the target processing machine is an etching machine for etching the surface of the substrate in the array process of the glass substrate. The front value measurement is used to obtain a first film thickness of the substrate before entering the etcher, and the back value measurement is used to obtain a second film thickness of the substrate after passing through the etcher.
S5: and analyzing the process capability of the target process machine according to the first measurement result and the second measurement result.
Specifically, the etching thickness of the etching machine on the substrate is obtained according to the first film thickness and the second film thickness; and comparing the etching thickness with a set etching threshold value, and analyzing the processing capability of the etching machine.
In practice, the thickness of the substrate etched in the etcher can be obtained by subtracting the thickness of the second film from the thickness of the first film, and then the process capability of the current etcher can be analyzed according to experience or a previously set threshold range to stop and repair the abnormal etcher. Because the substrate method of the embodiment can sequentially bind the clips to all the processing machines, the processing capability of each processing machine can be detected by the method, and the risk that some processing machines are not monitored regularly due to uneven distribution is effectively avoided.
Next, referring to fig. 7, fig. 7 is a detailed flowchart of a substrate sampling inspection method according to an embodiment of the invention. In the specific process of the substrate, firstly, performing sampling inspection on the substrate according to a preset sampling inspection frequency, and performing front value measurement on the sampling inspected substrate; and sequentially binding the substrate subjected to the previous value measurement to a target processing machine by taking a substrate container, namely a clamp as a unit, firstly judging whether the target processing machine is abnormal in the binding process, if so, sequentially binding the substrate in the same clamp to another processing machine of the same type as the target processing machine, and if not, directly binding the substrate in the same clamp in sequence. Then, the substrates need to be conveyed to a target processing machine in a clamping mode for processing, at the moment, whether the substrates in the clamping mode are bound to the same processing machine is judged, if yes, the substrates are directly conveyed to the bound processing machine, if not, whether the number of different substrates of the target processing machine is the same, if not, the most substrates bound to the same target processing machine exist, the clamping mode is conveyed to the target processing machine bound to the most substrates in the clamping mode, if not, the clamping mode is conveyed to the target processing machine bound to the most substrates of the two target processing machines, namely, the two groups of substrates respectively bound to the most substrates of the two target processing machines exist, the clamping mode is conveyed to the target processing machine corresponding to the substrate bound to the same processing machine, the number of the substrates is the most and located at the lower layer, then, processing is executed on the target processing machine, and then, after-value measurement is conducted, the processing capacity of the target processing machine can be analyzed according to the results of front-value measurement and after-value measurement.
According to the substrate spot inspection method, the substrates subjected to the previous value measurement are distributed to the target processing machine in a sequential binding mode, so that the processing capacity of all subsequent processing machines can be monitored in real time, and the risk that some processing machines are not monitored regularly due to uneven distribution is effectively avoided.
The foregoing is a further detailed description of the invention in connection with the preferred embodiments, and it is not intended that the invention be limited to the specific embodiments described. It will be apparent to those skilled in the art that several simple deductions or substitutions may be made without departing from the spirit of the invention, and these should be considered to be within the scope of the invention.
Claims (8)
1. A method of sampling a substrate, comprising:
performing spot inspection and pre-value measurement on a substrate according to preset spot inspection parameters to obtain a first measurement result of the substrate;
binding the substrate to a target processing machine according to a preset sequence, and executing a corresponding process;
performing post-value measurement on the substrate to obtain a second measurement result;
determining the process capability of the target process tool based on the first measurement result and the second measurement result,
performing spot check and pre-value measurement on the substrate according to preset spot check parameters to obtain a first measurement result of the substrate, including:
providing a detector and presetting the sampling frequency of the detector;
performing spot check and front value measurement on the substrate to be spot checked on the detector according to the spot check frequency so as to obtain the first measurement result;
sequentially placing the substrates into corresponding substrate containers after the substrates are qualified according to the first measurement result,
further, a corresponding process is performed, including:
judging whether the substrates in the same substrate container are bound to the same target processing machine or not;
if yes, the substrate container is transmitted to the target processing machine;
if not, the substrate container is transmitted to the target processing machine which is bound with the most substrates in the substrate container.
2. The method of claim 1, wherein binding the substrate to a target processing tool in a predetermined order, comprises:
acquiring product information of the substrate and processing information entering in the next step;
and sequentially binding the substrate to the target processing machine in sequence by taking the substrate container as a unit according to the processing information.
3. The method of claim 2, wherein sequentially binding the substrate to the target process tool in units of the substrate container according to the process information, comprises:
sequentially numbering a plurality of substrate containers and a plurality of target processing machines respectively;
binding the substrates in each substrate container to a corresponding target processing machine according to the sequence numbers.
4. The method of claim 3, wherein binding each substrate container to a corresponding target processing tool according to the serial number, comprising:
acquiring the operation parameters of the target processing machine;
judging whether the target processing machine operates normally, if so, binding, otherwise, binding the substrate in the substrate container to another processing machine of the same type as the target processing machine according to the sequence number;
and recording and storing the binding information of the substrate and the processing machine.
5. The method of claim 1, further comprising, after binding the substrate to a target process tool in a predetermined order:
intermediate measurement is performed on the pre-measured substrate before the substrate is transferred to a corresponding target processing tool.
6. The method of claim 1, wherein transferring the substrate container to the target process tool bound corresponding to the largest number of substrates in the substrate container comprises:
and when the target substrates with the same number of target process machines with different binding exists in the same substrate container, the substrate container is transmitted to the position of the target process machine corresponding to the target substrate positioned at the lower layer in the substrate container.
7. The method of claim 1, wherein the target processing tool is an etcher, the front-end measurement is used to obtain a first film thickness of the substrate before entering the etcher, and the back-end measurement is used to obtain a second film thickness of the substrate after passing through the etcher.
8. The method of claim 7, wherein determining the process capability of the target process tool based on the first measurement result and the second measurement result comprises:
obtaining the etching thickness of the etching machine on the substrate according to the first film thickness and the second film thickness;
comparing the etching thickness with a set etching threshold to determine the process capability of the etching machine.
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Citations (6)
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