CN112242316A - Wire bonding equipment and wire bonding method - Google Patents
Wire bonding equipment and wire bonding method Download PDFInfo
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- CN112242316A CN112242316A CN201910640293.2A CN201910640293A CN112242316A CN 112242316 A CN112242316 A CN 112242316A CN 201910640293 A CN201910640293 A CN 201910640293A CN 112242316 A CN112242316 A CN 112242316A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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Abstract
本发明提供一种焊线设备及焊线方法。焊线设备包括劈刀、焊线夹、第一驱动装置及焊线垫；劈刀为中空结构且具有进线口和出线口，焊线通过进线口进入劈刀内并经出线口延伸至与待封装器件相连接；焊线夹与进线口相邻，用于夹持焊线与进线口相邻的一端；第一驱动装置与劈刀相连接，用于驱动劈刀移动；焊线垫位于劈刀一侧，用于在劈刀移动至预设位置时承载焊线。本发明的焊线设备通过优化的结构设计，可以将焊线过程中的第二焊点设置在芯片以外的区域，从而可以有效避免芯片表面污染和焊点之间相互接触，以及减小焊线的弯曲度，有利于焊线的后续拉直。本发明的焊线方法有利于形成垂直焊线。
The invention provides a wire bonding equipment and a wire bonding method. The wire bonding equipment includes a rivet, a wire clip, a first driving device and a wire pad; the rib is a hollow structure and has a wire inlet and a wire outlet, and the wire enters the rivet through the wire inlet and extends to the It is connected with the device to be packaged; the welding wire clip is adjacent to the wire inlet, which is used to clamp the end of the welding wire adjacent to the wire inlet; the first driving device is connected with the captive knife, and is used to drive the captive knife to move; The wire pad is located on one side of the rivet and is used to carry the bonding wire when the rivet moves to a preset position. Through the optimized structural design of the wire bonding equipment of the present invention, the second solder joint in the wire bonding process can be arranged in an area outside the chip, thereby effectively avoiding chip surface contamination and mutual contact between the solder joints, and reducing the number of wire bonding The bending degree is favorable for the subsequent straightening of the welding wire. The wire bonding method of the present invention facilitates the formation of vertical bonding wires.
Description
Technical Field
The invention belongs to the field of semiconductor chip packaging, and particularly relates to wire bonding equipment and a wire bonding method.
Background
Wire bonding is one of the key processes in the semiconductor chip packaging process, and is a circuit connection between a chip and a package substrate or a lead frame, etc. to realize the function of electronic signal transmission. As shown in FIGS. 1 and 2, a wire bonding process is performed by passing a wire 11 through a chopper 12, leading the wire from one end of the chopper 12 to the surface of a chip 13, and forming a first pad 14 (1) on the surface of the chip 13stbond, i.e., bond ball), after which the riving knife 12 is lifted to stretch the wire 11 to a predetermined arc and then is drawn to the surface of the chip 13 again to form the secondTwo welding spots 15 (2)ndbond, i.e., wedge), after which the wire 11 is cut and the wire 11 is pulled up from the end of the second pad 15 to draw it to the desired shape and connect to an external electrical connection. There are a number of problems with this conventional wire bonding process. For example, due to the structural limitation of the existing wire bonding equipment, the second solder joint 15 needs to be formed on the surface of the chip 13 or the lead frame, so the position of the second solder joint 15 needs to be reserved on the chip 13 or the lead frame, which affects the further miniaturization of the device; after the bonding wire 11 is pulled up from the second bonding pad 15, an imprint (usually crescent-shaped) is inevitably left at the second bonding pad 15 (due to the stress applied in the process of cutting the bonding ball), which causes surface contamination of the device; in addition, as the size of the chip 13 continues to be miniaturized, the distance between the first pad 14 and the second pad 15 is continuously compressed, which not only easily causes contact between the pads, but also causes difficulty in completely straightening the pad due to the increased bending of the bonding wire. With the continuous reduction of the critical dimension of the chip and the continuous increase of the packaging density of the device, especially the continuous increase of the demand for the vertical bonding wire in the stacked package, the problems caused by the deficiency of the existing bonding wire equipment and bonding wire method are more and more prominent, and a solution is needed.
Disclosure of Invention
In view of the above drawbacks of the prior art, an object of the present invention is to provide a wire bonding apparatus, which is used to solve the problems in the prior art that due to limitations of the wire bonding apparatus, a second pad needs to be formed on a chip surface, which easily causes contamination of the chip surface and mutual contact between pads, and that it is difficult to completely straighten the chip surface due to increased bending of the bonding wire.
To achieve the above and other related objects, the present invention provides a wire bonding apparatus, comprising:
the cleaver is of a hollow structure and is provided with a wire inlet and a wire outlet, and the bonding wire enters the cleaver through the wire inlet and extends to be connected with a device to be packaged through the wire outlet;
the welding wire clamp is adjacent to the wire inlet and used for clamping one end of the welding wire adjacent to the wire inlet;
the first driving device is connected with the riving knife and used for driving the riving knife to move;
and the welding wire pad is positioned on one side of the riving knife and used for bearing the welding wire when the riving knife moves to a preset position.
Optionally, the wire bonding apparatus further comprises a sparking rod located at one side of the riving knife, the sparking rod being configured to sinter the bonding wire into a ball.
Optionally, the wire bonding apparatus further comprises a first gas supply device, the first gas supply device comprises a first gas supply pipeline and a first gas nozzle, one end of the first gas supply pipeline is connected with a gas source, and the other end of the first gas supply pipeline is connected with the first gas nozzle; the gas sprayed out of the first gas nozzle faces the wire outlet of the riving knife.
Optionally, the first gas supply device is a plurality of first gas supply devices, and the gas supplied by the plurality of first gas supply devices is directed to the outlet of the riving knife from different directions.
Optionally, the wire bonding apparatus further includes a second driving device connected to the wire pad for driving the wire pad to move.
Optionally, the wire pad surface has a groove for carrying the bonding wire.
Optionally, the wire bonding apparatus further includes a second gas supply device, the second gas supply device includes a second gas supply pipeline and a second gas nozzle, one end of the second gas supply pipeline is connected to a gas source, the other end of the second gas supply pipeline is connected to the second gas nozzle, and gas ejected from the second gas nozzle faces the groove to protect the wire in the groove from being contaminated.
The invention also provides a wire welding method, which comprises the following steps:
providing the wire bonding equipment in any one of the previous schemes, and placing a device to be packaged below the cleaver;
placing a bonding wire into a wire inlet of the cleaver, and then drawing the bonding wire to the surface of the device to be packaged from a wire outlet of the cleaver and stretching to the required radian;
placing a bonding wire adjacent to the wire outlet and far away from the device to be packaged on the bonding wire pad;
and cutting off the welding wire.
Optionally, the process of cutting the bonding wire includes:
after a bonding wire which is adjacent to the outlet and far away from the device to be packaged is placed on the bonding wire pad, applying pressure to form a notch at the joint of the bonding wire and the bonding wire pad;
the riving knife is lifted upward to completely sever the wire.
Optionally, the wire bonding method further includes a step of straightening a bonding wire connected to the device to be packaged after cutting the bonding wire.
As described above, the wire bonding equipment provided by the invention has the advantages that through the optimized structural design, the second welding points in the wire bonding process can be arranged in the area outside the chip, so that the surface pollution of the chip and the mutual contact between the welding points can be effectively avoided, the bending degree of the bonding wires is reduced, and the subsequent straightening of the bonding wires is facilitated. The wire bonding equipment has simple structure and convenient use, and is particularly suitable for packaging devices with high vertical degree of welding wires, such as stacked packaging. The wire bonding method is beneficial to forming vertical bonding wires, reducing contact short circuit among the bonding wires and improving the production yield.
Drawings
Fig. 1 and 2 are schematic views illustrating a wire bonding process in the prior art.
Fig. 3 is a schematic structural diagram of the wire bonding apparatus of the present invention.
Fig. 4 is a schematic top view of a wire bonding pad of the wire bonding apparatus of the present invention.
Fig. 5 is a flow chart of the wire bonding method of the present invention.
Fig. 6 and 7 are schematic views illustrating a wire bonding method according to an embodiment of the present invention.
Description of component reference numerals
11 welding wire
12 cleaver
13 chip
14 first welding point
15 second welding point
21 cleaver
22 bonding wire
221 wire bonding source
23 device to be packaged
24 wire clamp
25 first drive means
26 welding wire pad
261 bonding pad body
262 recess
263 channel
27 striking rod
28 first gas supply device
281 first gas supply line
282 first gas nozzle
29 second drive device
30 carrying platform
31 control device
32 gas source
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
Please refer to fig. 3 to 7. It should be noted that the drawings provided in the present embodiment are only schematic and illustrate the basic idea of the present invention, and although the drawings only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation, the form, quantity and proportion of the components in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated. In order to make the drawings as concise as possible, the same structures in the same drawings are not repeated as much as possible in the present specification.
Example one
As shown in fig. 3 and 4, the present invention provides a wire bonding apparatus. The wire bonding apparatus comprises a riving knife 21, a wire clamp 24, a first drive device 25 and a wire pad 26; the chopper 21 is of a hollow structure and is provided with a wire inlet and a wire outlet, and a bonding wire 22 enters the chopper 21 through the wire inlet and extends to be connected with a device to be packaged 23 through the wire outlet; the welding wire clamp 24 is adjacent to the wire inlet and used for clamping one end of the welding wire 22 adjacent to the wire inlet; the first driving device 25 is connected with the riving knife 21 and used for driving the riving knife 21 to move; the wire bonding pad 26 is located at one side of the riving knife 21 and is used for bearing the bonding wire 22 when the riving knife 21 moves to a preset position. According to the wire welding equipment, through the optimized structural design, the second welding points in the wire welding process can be arranged in the area outside the device to be packaged, so that the surface pollution of the device to be packaged and the mutual contact between the welding points can be effectively avoided, the curvature of the welding wires is reduced, and the subsequent straightening of the welding wires is facilitated.
Illustratively, the wire bonding apparatus further includes a striking rod 27 located on one side of the riving knife 21, and the striking rod 27 is used for performing spark discharge to sinter the bonding wire 22 into a ball. The sparking pin 27 may be connected to a drive mechanism (not shown) to move the sparking pin 27 to a predetermined position for high temperature ball burning of the wire 22 when desired.
The chopper 21 is preferably a ceramic chopper having an annular side wall with a height such that the bonding wire 22 is protected from external contamination and the bonding wire 22 maintains a straight shape in the chopper 21 as much as possible. The wire outlet of the riving knife 21 is generally conical, which not only can reduce the pollution caused by the external air entering the riving knife 21, but also is beneficial to applying pressure on the welding wire in the subsequent welding wire (bonding) operation process so as to facilitate cutting.
By way of example, the first driving device 25 includes a horizontal driving module (e.g., rodless cylinder, horizontal motor, etc.) and a vertical driving module (e.g., liftable cylinder, vertical motor, etc.) or a device having both horizontal movement and up-and-down movement to drive the riving knife 21 to move in the horizontal direction and/or the vertical direction, thereby stretching the bonding wire 22 to a desired shape and position (including a desired length, height, curvature, etc.).
The wire 22 is typically pulled from the wire source 221 and fed into the riving knife 21, and the wire source 221 typically includes a core and the wire 22 wound onto the core, with the core being unwound to pull the wire 22 to a desired length. The bonding wires 22 may be gold wires, copper wires, aluminum wires or other metal wires.
Illustratively, the wire bonding apparatus further comprises a first gas supply device 28, wherein the first gas supply device 28 comprises a first gas supply pipe 281 and a first gas nozzle 282, and the first gas supply pipe 281 is connected with the gas source 32 at one end and is connected with the first gas nozzle 282 at the other end; the gas emitted from the first gas nozzle 282 is directed toward the outlet of the riving knife 21.
In a further example, the first gas supply device 28 is plural, and the gas supplied by the plural first gas supply devices 28 is directed toward the outlet of the riving knife 21 from different directions. Gas source 32 includes, but is not limited to, nitrogen, helium, or other inert gases; a plurality of the first gas supplies 28 may be connected to the same or different gas sources 32. The first gas supply device 28 can also be provided with a driving device to move or change the spraying direction as required to carry out all-around protection on the welding wire 22, so as to avoid the welding wire 22 from being oxidized and polluted. For example, a diversion device connected to the first gas nozzle 282 may be provided to divert the gas from the first gas nozzle 282 toward the outlet of the riving knife 21 initially, and the gas from the first gas nozzle 282 is synchronously diverted toward the junction of the wire 22 and the device 23 as the wire 22 is pulled to the surface of the device 23. Of course, in other examples, a separate gas supply device may be provided to inject the shielding gas toward the surface of the device 23 to be packaged, and this embodiment is not limited to this.
The position of the wire bonding pads 26 may be defined, e.g. fixed at a predetermined position, typically above the level of the device 23 to be packaged, but the wire bonding pads 26 are more preferably movable to adjust the distance between the wire bonding pads 26 and the device 23 to be packaged according to different packaging requirements. Thus, as a further example, the wire bonding apparatus further includes a second driving device 29 connected to the wire pad 26 for driving the wire pad 26 to move, and the structure of the second driving device 29 may be the same as that of the first driving device 25.
The wire pad 26 may be any structure having a bearing surface, such as a rectangular pad, a circular pad, or any other shape, and the material thereof is preferably a hard material having a smooth surface, impact resistance, and being not easily oxidized and contaminated, such as stainless steel, tempered glass, tempered ceramic, etc.
As shown in fig. 4, wire pad 26 includes a rectangular wire pad body 261 having a groove 262 on a surface thereof, and groove 262 is used for carrying wire 22 to prevent wire 22 from moving in wire pad 26 and even falling off wire pad 26. The groove 262 is preferably hemispherical, the size of the upper opening thereof is preferably slightly larger than the size of the outlet of the riving knife 21, for example, 1.2 to 3 times, preferably 1.5 to 2 times, and the depth is preferably 0.1 to 1cm, because the inventor repeatedly verifies that in this interval, the riving knife 21 can be easily placed in the groove 262 without worrying about alignment problem, and can not easily slip out of the groove 262. The number of the grooves 262 may be one or more, the grooves 262 are uniformly distributed on the wire pad body 261 at intervals to simultaneously bear a plurality of bonding wires 22, and the number of the cleavers 21 may also be multiple, so that synchronous packaging of the bonding wires 22 can be realized, which is not only beneficial to improving production efficiency, but also beneficial to better controlling the spacing and height of the bonding wires in the synchronous process (for example, in stacked packaging, the spacing and height of the bonding wires between two packaging bodies are generally required to be uniform), and beneficial to improving packaging yield.
Illustratively, the wire bonding apparatus further includes a second gas supply device (not shown) including a second gas supply line and a second gas nozzle, wherein the second gas supply line is connected to the gas source 32 at one end and to the second gas nozzle at the other end, and the gas emitted from the second gas nozzle is directed toward the groove 262 to protect the wire 22 in the groove 262 from contamination.
In a further example, a channel 263 connected to the groove 262 may be further disposed on the wire pad body 261, and the gas supplied by the second gas supplying device may be smoothly supplied into the groove 262 along the channel 263 to prevent the gas from blowing up the bonding wire 22; the second gas supply line and the second gas nozzle may also be disposed within the channel 263 to facilitate securing of the second gas supply line and the second gas nozzle and to reduce the possibility of collisions between the second gas supply line and the second gas nozzle and other devices.
As an example, the wire bonding apparatus further includes a carrier 30 located below the riving knife 21 for carrying the device to be packaged 23. The carrier 30 may be connected to a driving device to adjust its position as needed, thereby adjusting the distance of the device to be packaged 23 from the riving knife 21.
The wire bonding apparatus further includes a bonding device (not shown), such as an ultrasonic bonding device (ultrasonic generation device) or a thermal bonding device (heating device), etc., which is connected to the cleaver 21 to bond the bonding wire 22 and the device to be packaged 23.
As an example, the wire bonding apparatus further includes a control device 31, such as a computer, wherein the control device 31 is connected to at least the first driving device 25 and the second driving device 29 to move the riving knife 21 and the wire bonding pad 26 according to a predetermined process flow to complete a desired wire bonding packaging process.
The main difference between the wire bonding operation performed by the wire bonding equipment and the wire bonding operation performed by the traditional wire bonding equipment is that a second welding point is required to be formed on the surface of a chip or a lead frame in the process of performing the wire bonding operation by the traditional wire bonding equipment; when the wire bonding apparatus of the present invention is used to perform a wire bonding operation, a second bond pad is formed on bond pad 26. This will be further explained with reference to fig. 5 to 7.
As shown in fig. 5, the present invention further provides a wire bonding method, comprising the steps of:
s01: providing the wire bonding apparatus as described in any of the previous solutions, placing the device to be packaged 23 below the cleaver 21;
s02: placing a bonding wire 22 into a wire inlet of the riving knife 21, and then drawing the bonding wire 22 to the surface of the device to be packaged 23 from a wire outlet of the riving knife 21 and stretching to a required radian;
s03: placing bonding wires 22 adjacent to the outlet and remote from the device to be packaged 23 onto the bonding wire pads 26;
s04: the bonding wire 22 is cut.
Referring to fig. 6 and 7, the device 23 to be packaged is placed on the carrier 30 (if the carrier 30 is not provided, it can be placed on another horizontal table). In order to ensure sufficient contact between the bonding wire 22 and the surface of the device 23 to be packaged, before the end of the bonding wire 22 is bonded to the surface of the device 23 to be packaged, a step of sintering the bonding wire 22 at a high temperature into a solder ball by using the striking rod 27 is further included, after the ball is formed, the chopper 21 is moved to the surface of the device 23 to be packaged so that the solder ball is in contact with the device 23 to be packaged, and then the chopper 21 applies a certain pressure to perform bonding (thermal compression bonding, ultrasonic bonding or thermo-acoustic bonding can be used, which is different according to the bonding device). In order to avoid the oxidation contamination of the solder ball during this process, an inert gas may be injected toward the bonding wire 22 before the ball formation so that the ball formation process is performed in an inert gas atmosphere; after the solder balls are brought into contact with the device to be packaged 23, the inert gas is continuously sprayed toward the bonding positions of the solder balls and the device to be packaged 23.
As an example, the process of cutting off the bonding wire 22, i.e., the step S04, includes:
after placing the bonding wire 22 adjacent to the outlet and far away from the device to be packaged 23 on the bonding wire pad 26, applying pressure to form a notch at the joint of the bonding wire 22 and the bonding wire pad 26;
the riving knife 21 is lifted upward to completely sever the wire 22.
Since the bond is on the wire bond pad 26 during this process, there is no concern that the resulting mark may cause contamination of the device 23 to be packaged. Of course, to improve the cleanliness of the next wire bonding process, the wire pad 26 may be cleaned after the current wire bonding process is completed, for example, by gas purging, such as by injecting gas from the first gas supply 28.
As an example, the wire bonding method further includes a step of straightening the bonding wire 22 connected to the device to be packaged 23 after cutting the bonding wire 22. Because the wire bonding equipment is adopted, the second welding points do not need to be formed on the surface of the device 23 to be packaged or the lead frame, the bending degree of the bonding wires can be greatly reduced, and the process of straightening the bonding wires is extremely easy, so that the wire bonding method adopting the wire bonding equipment is particularly suitable for packaging devices with high requirements on the verticality of the bonding wires, such as laminated packaging. Meanwhile, under the background that the critical dimension of the chip is continuously reduced and the packaging density of the device is continuously increased, the advantages of the wire bonding equipment and the wire bonding method are more and more prominent.
In summary, the present invention provides a wire bonding apparatus and a wire bonding method. The wire welding equipment comprises a cleaver, a wire welding clamp, a first driving device and a wire welding pad; the cleaver is of a hollow structure and is provided with a wire inlet and a wire outlet, and a bonding wire enters the cleaver through the wire inlet and extends to be connected with a device to be packaged through the wire outlet; the welding wire clamp is adjacent to the wire inlet and used for clamping one end of the welding wire adjacent to the wire inlet; the first driving device is connected with the riving knife and used for driving the riving knife to move; the welding wire pad is positioned on one side of the riving knife and used for bearing the welding wire when the riving knife moves to a preset position. According to the wire bonding equipment, through the optimized structural design, the second welding point in the wire bonding process can be arranged in the area outside the chip, so that the surface pollution of the chip and the mutual contact between the welding points can be effectively avoided, the flexibility of the bonding wire is reduced, and the subsequent straightening of the bonding wire is facilitated. The wire bonding equipment has simple structure and convenient use, and is particularly suitable for packaging devices with high vertical degree of welding wires, such as stacked packaging. The wire bonding method is beneficial to forming vertical bonding wires, reducing contact short circuit among the bonding wires and improving the production yield. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (10)
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| CN201910640293.2A CN112242316B (en) | 2019-07-16 | 2019-07-16 | Wire bonding equipment and wire bonding method |
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| CN201910640293.2A CN112242316B (en) | 2019-07-16 | 2019-07-16 | Wire bonding equipment and wire bonding method |
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| CN112242316A true CN112242316A (en) | 2021-01-19 |
| CN112242316B CN112242316B (en) | 2025-06-17 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113257714A (en) * | 2021-05-12 | 2021-08-13 | 广州飞虹微电子有限公司 | Copper-aluminum hybrid welding method and device for chip welding |
| CN114566456A (en) * | 2022-04-29 | 2022-05-31 | 深圳市铨天科技有限公司 | Packaging equipment for multilayer stacked storage chips |
| CN118248595A (en) * | 2024-04-02 | 2024-06-25 | 容泰半导体(江苏)有限公司 | A bonding machine with positioning function for semiconductor processing |
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| CN112242316B (en) | 2025-06-17 |
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