CN112272966B - Transfer device, method of use and adjustment method - Google Patents

Abstract

The present invention provides transfer devices, methods of use and methods of adjustment. While maintaining high transfer position accuracy, the acceptor substrate of the transfer device can be enlarged and refined, and the cycle time can be shortened. Each stage group that moves while holding the donor substrate and/or the beam shaping optical system and the reduction projection optical system on which the transfer target object is placed, and the stage group that holds the acceptor substrate that is the transfer target object, are constructed on separate platforms. The mechanism configured as above minimizes vibrations caused by the relative scanning of each substrate with respect to the laser and abnormalities in the synchronization position accuracy of the stage responsible for the scanning.

Description

Transfer devices, methods of use and adjustments

Technical field

The present invention relates to a device that uses laser irradiation to transfer an object located on a donor substrate to a recipient substrate with high precision (LIFT: Laser Induced Forward Transfer).

Background technique

There has been a technique in which an organic EL (electroluminescence) layer on a donor substrate is irradiated with laser light and transferred to an opposing circuit substrate. As this technology, Patent Document 1 discloses a technology in which one laser beam is converted into a plurality of rectangular laser beams having a rectangular shape with uniform intensity distribution, and they are arranged in series at equal intervals so that they are separated by a certain time or more and overlap. A plurality of rectangular lasers are irradiated to a predetermined area of the donor substrate a predetermined number of times, so that the laser light is absorbed by the metal foil located between the donor substrate and the organic EL layer to generate an elastic wave, and the organic EL layer peeled off thereby is transferred to the opposite side. placed on the circuit substrate.

This technology uses a structure in which a spacer with an appropriate value of 80 to 100 [μm] is sandwiched between a donor substrate and a circuit substrate, and the distance between the donor substrate and the circuit substrate is maintained in a fixed state. The integrated component is placed on a stage and scanned relative to the laser. However, in this case, in addition to a separate step of integrating the opposing donor substrate and the circuit substrate, a donor substrate having the same size as the circuit substrate is also required, and as the circuit substrate becomes larger, additional steps are required. Manufacturing costs and device size increase.

Similarly, as a technology for transferring an organic EL layer on a donor substrate to an opposing circuit substrate, Patent Document 2 discloses a technology in which a light-absorbing layer is provided between the donor substrate and the organic EL layer. This light-absorbing layer absorbs the irradiated laser light and generates a shock wave, thereby transferring the organic EL layer on the donor substrate to the opposing circuit substrate with a gap of 10 to 100 [μm]. However, Patent Document 2 does not disclose a laser scanning method or a stage structure for realizing it, nor does it disclose a transfer device. Therefore, Patent Document 2 cannot be referred to as a technology for maintaining and improving transfer position accuracy that can cope with the increase in size of circuit boards.

Furthermore, Patent Document 3 discloses a technology related to the step scanning method in an exposure apparatus used for semiconductor device manufacturing. The basic thinking method is as follows: while skipping several irradiation areas in the middle, a row of irradiation areas along the scanning exposure direction of the wafer stage is intermittently exposed, and the wafer stage is not stopped in the middle. That is, Patent Document 3 discloses an exposure apparatus including: a reticle stage that holds the reticle; a wafer stage that holds the wafer; and a projection optical system that projects the pattern of the reticle onto the wafer while causing the reticle to The film stage and the wafer stage are exposed together while scanning with respect to the projection optical system, and the patterns of the reticle are sequentially projected to multiple irradiation areas of the wafer, wherein the wafer stage is moved while scanning without making the wafer stage stationary. Multiple irradiation areas on the wafer arranged in the scanning direction are exposed intermittently. Therefore, in response to the demand for larger wafers and faster processing speeds, it is possible to reduce vibrations and wobbling caused by scanning of the wafer stage compared to the step and repeat method in which the wafer stage is repeatedly accelerated and decelerated. Effect on exposure accuracy.

However, the technology disclosed in the above-mentioned Patent Document 3 is a technology of a semiconductor exposure device based on reduction projection exposure, and its technical field is different from the transfer technology of the present invention. That is, the structure and scanning technology of the reticle stage and wafer stage of the exposure device are completely different from the stage structure and scanning technology of the present invention, which are used to apply the mask pattern of the present invention with high positional accuracy. method to reduce the object projected onto the donor substrate, and then transfer the object to the acceptor substrate with the same high positional accuracy. Therefore, the technology disclosed in the above-mentioned Patent Document 3 cannot be referred to as the specific stage structure and its scanning technology of the present invention.

existing technical documents

Patent document 1: Japanese Patent Publication No. 2014-67671

Patent document 2: Japanese Patent Publication No. 2010-40380

Patent document 3: Japanese Patent Publication No. 2000-21702

Contents of the invention

By configuring the donor stage holding the donor substrate, the two stages of the optical stage holding the optical system placed on the donor stage, and the acceptor stage holding the acceptor substrate as independent mechanisms, and not using the optical stage The structure of placing them directly on the donor stage and installing them independently on highly rigid platforms minimizes the impact of vibrations and various errors caused by scanning of each stage on the synchronization position accuracy between stages. As a result, an object of the present invention is to provide a transfer device that contributes to the enlargement and refinement of the receptor substrate and shortens the cycle time while maintaining the accuracy of the transfer position.

The first invention is a transfer device that irradiates a pulse laser from the back surface of a donor substrate to an object located on the surface of the moving donor substrate to selectively peel off the object and transfer the object The object is transferred to a receptor substrate that moves opposite to the donor substrate. The transfer device includes: a pulsed oscillation laser device; a telescope that converts the pulsed laser light emitted from the laser device into parallel light; and shaping optics. A system that shapes the spatial intensity distribution of the pulse laser that has passed through the telescope into a uniform distribution; a mask that allows the pulse laser that has been shaped by the shaping optical system to pass in a prescribed pattern; a field lens that is located in the shaping optics Between the system and the mask; a projection lens, which shrinks and projects the pulsed laser pattern that has passed through the mask on the surface of the donor substrate; a mask stage, which holds the field lens and the mask; an optical table that holds the shaping optical system, the mask table, and the projection lens; a donor table that holds the donor substrate in an orientation such that the back surface of the donor substrate becomes the incident side of the pulse laser; a receptor stage that holds the receptor substrate; and a programmable multi-axis control device that has a trigger output function and a stage control function for the pulse laser oscillation, and the receptor stage has Y when the horizontal plane is used as the XY plane axis, the Z axis in the vertical direction, and the θ axis in the XY plane, the donor stage has an X axis, a Y axis, and a θ axis, and the projection lens and the Z axis stage for the projection lens are held on the On the optical table, the telescope, the shaping optical system, the field lens, the mask and the projection lens constitute a reduction projection optical system, and the reduction projection optical system reduces the pattern of the mask and projects it on On the surface of the donor substrate, the X-axis of the donor stage is set on the first platform, and the Y-axis of the acceptor stage is set on a second platform that is different from the first platform, and the donor The Y-axis of the table is suspended from the X-axis of the donor table.

Here, the "moving" substrate includes a pulse laser (shown as "LS" in FIG. 1A. However, although FIG. 1A shows the main structural parts of the second invention, it contains common structural parts with the structure of the first invention. For reference (the same below), the case of moving without stopping during irradiation and the case of stopping and repeating movement and stopping during irradiation of pulsed laser light are selected based on the transfer process performed by the transfer device of the present invention and the required tact time, etc. the situation described. In addition, the structure in which the donor substrate (D) repeatedly moves and stops, but the acceptor substrate (R) does not stop, and the opposite situation are also included. When only one irradiation is used for peeling off the object from the donor substrate and a high tact time is required, it is appropriate to select a structure in which the donor substrate and the acceptor substrate move at the same or different speeds without stopping. On the other hand, when the object is to be laminated to a certain thickness, a structure may be selected in which the donor substrate moves without stopping and the acceptor substrate stops during a certain number of irradiations.

In addition, the "object" is not particularly limited, and is a transfer object that is provided on the donor substrate or is provided in one piece on the donor substrate via a light-absorbing layer (not shown in FIG. 1A ), including those described in the patent. Thin films represented by organic EL layers described in literature and objects in which a plurality of fine units are regularly arranged are not limited to these objects. In addition, the transfer mechanism includes the following: the light-absorbing layer irradiated with laser light generates a shock wave, whereby the object is peeled off from the donor substrate and transferred toward the recipient substrate; or the light-absorbing layer is not provided and the object is transferred directly to the object. It is peeled off by laser irradiation; however, it is not limited to these cases.

The material of the donor substrate only needs to have transmittance properties for the wavelength of the laser light, and it is ideally a material that has a small amount of bending due to enlargement of the substrate. In addition, when the amount of bending is large enough to not satisfy the uniformity of the gap between the donor substrate and the acceptor substrate, the method of holding the donor substrate on the donor stage (Yd, θd) is, for example, the following method: Mechanical correction is performed by providing an adsorption area or the like near the center of the donor substrate. In addition, correction is performed using a gap sensor formed by a combination of height sensors described later.

In the present invention, in order to transfer the object located near the edge of the donor substrate to the acceptor substrate, the movable range of the donor stage includes the XY plane area where the donor substrate should move, and refers to the area that depends on the acceptor substrate. range of sizes. As an example, when the size of the donor substrate in the XY plane is 200 × 200 [mm] and the same acceptor substrate is 400 × 400 [mm], the regulations on how the donor stage (Xd, Yd) should move The range is roughly 800×800[mm]. Figure 4 shows this situation. In addition, this area is also included when further movement is required to remove the donor substrate.

In addition, the material of the "platform" is not particularly limited, but it must be a material with extremely high rigidity. In order to provide rigidity to the platform 1 (first platform) (G1), it is desirable to have a "U"-shaped or "□"-shaped shape when viewed from above. In addition, in FIG. 1A , the stage 2 (second stage) is shown as a single stage. However, specifically, the following structure may be used: two stages are provided along the Y-axis direction, and a middle stage may be used. Place the linear scale and linear motor. In addition, platform 1 and platform 2 may be structures fixed on the same base platform (G). Furthermore, G1 may be composed of a combination of platform 11 (G11) and platform 12 (G12).

In addition, the material of any platform requires the use of highly rigid components such as steel, stone or ceramic materials. For example, a stone represented by granite can be used as the stone, but it is not limited thereto. Additionally, all platforms do not need to be constructed from the same material.

In the embodiments described below, the movement of each station will be described in detail, but the following operations are generally performed. First, the X-axis (Xd) of the donor table is set on G1 in a state where the Y-axis (Yd) of the donor table is suspended, and moves in the X-axis direction. Furthermore, this movement changes the relative position along the X-axis between the donor and acceptor substrates. Figure 1B shows the movement. In addition, detailed structures such as the movable table and the linear guide rail of the table are not shown in any figure.

There is no limit to how the optical table (Xo) is placed on a table, etc., and various mechanisms can be selected, such as a state where it is placed on Xd, a state where it is placed on the same stage as the stage on which Xd is placed, or a state where it is placed on a different stage from Xd. Status on the platform, etc. Xo and Xd are parallel and move in the X-axis direction. The relative positions of the shaping optical system (H), field lens (F), mask (M) and projection lens (Pl) do not change, so that they move together. On the other hand, the movement of Xo along the X-axis will change the relative positional relationship between the donor substrate and the projection lens. Figure 1C shows this movement.

In addition, when there is no need to change the relative position of the donor substrate and the projection lens in the X-axis direction, a structure may be adopted that always moves together with the X-axis of the donor stage, that is, the optical stage, homogenizer, and A structure in which the field lens, mask and projection lens are all arranged on the X-axis of the donor stage or fixed on another platform.

The mask is held on a mask stage, which has at least a W axis that moves in the X-axis direction together with the field lens. In addition, preferably, it may also have: a U-axis in the Y-axis direction, and a U-axis that moves in the Z-axis direction. The V axis, the R axis which is the rotation axis in the YZ plane, the TV axis which adjusts the inclination with respect to the V axis, and the TU axis which adjusts the inclination with respect to the U axis. In addition, in order to suppress the injection of heat generated by irradiating the mask with laser light, an aperture mask may be provided on the front side of the mask, and the aperture mask may be provided with a pattern that is one circle larger than the mask pattern, and may be different from the mask pattern. The films cooperate to form a double mask structure.

The Y-axis (Yd) of the donor stage and the Y-axis (Yr) of the acceptor stage are arranged in the same or Move at different speeds. In addition, according to the above-mentioned structure of the moving method of each stage group and the platform that supports them, by limiting the moving mechanism of the receptor substrate to the Y-axis and being separated from the moving mechanism of the donor substrate, it is possible to suppress the movement areas of each other's substrates. The interaction caused by interference and vibration can cope with the enlargement and refinement of the size of the receptor substrate.

The second invention is based on the first invention. The X-axis of the donor table is placed on the platform 1, and the optical table is placed on the X-axis of the donor table.

FIG. 1A shows the main structural part (side view) of the transfer device of the second invention. FIG. 1B shows a state where Xd is placed on Xo and moved from the state of FIG. 1A (side view). FIG. 1C shows a state where Xo has moved on Xd from the state of FIG. 1B (side view). Figure 1D shows a top view of Figure 1C.

The third invention is based on the first invention. The optical table is placed on the platform 1 , and the X-axis of the donor table is suspended from the platform 1 .

FIG. 2A shows the main structural part (side view) of the transfer device of the third invention. FIG. 2B shows a case where Xd and Xo have moved the same distance on G1 (Xd is suspended from G1) from the state of FIG. 2A (side view). FIG. 2C shows a case where only Xo has moved on G1 from the state of FIG. 2B (side view).

The fourth invention is based on the first invention. The X-axis of the donor table is installed on the platform 1, and the optical table is placed on a platform 3 that is different from both the platform 1 and the platform 2 ( on the third platform).

Here, "installed on the platform 1" includes a state of being placed on the platform 1 and a state of being suspended from the platform 1, but is not limited to these states.

The fifth invention is based on the first invention. There is a rotation adjustment mechanism between the X axis of the donor table and the platform 1 for finely adjusting the installation angle in the XY plane between the two. A rotation adjustment mechanism for finely adjusting the installation angle in the XY plane between the X axis of the donor table and the Y axis of the donor table is provided.

Here, FIG. 3A shows an example of the rotation adjustment mechanism (RP) provided between the X-axis (Xd) of the donor table and the stage 1 (G1). In FIG. 3A , the left figure shows a top view, and the right figure shows a side view viewed from the X-axis direction. In addition, in the top view, the holes in the outer row are used for fixing to G1 and have "play" (allowance, room) in order to have a rotation adjustment function. In addition, in the top view, the holes located in the second row on the inner side are holes for passing screws for fixing the linear guide rails of the RP and Xd. In addition, the side with "play" can also be used as the hole for the linear guide of Xd. However, when two linear guides are independently and parallelly fixed, the installation process may become more difficult. sex.

On the other hand, FIG. 3B shows an example of RP provided between Xd and the Y-axis (Yd) of the donor table suspended from Xd. In the top view, the two rows of holes located on the outside are used for fixing to Xd, and have "play" in order to have a rotation adjustment function. In addition, two rows of holes arranged along the Y-axis direction are used for fixing to Yd.

In addition, as the RP set between G1 and Xd, an RP different from the aforementioned RP may be used. For example, a fulcrum (the rotation axis in the Z-axis direction) is set on the contact surface between the RP and G1. The fulcrum is used to rotate the RP placed Xd in the XY plane relative to G1 (not shown). The side (vertical plane) of RP away from the fulcrum sets a point of force relative to the fulcrum. A large screw is installed on G1 near the force point to push it horizontally toward the force point. Likewise, set large screws on the side of the RP on the opposite side. Thus, the RP with Xd placed thereon can be rotated relative to G1 in the XY plane in the order of [μrad] with the fulcrum as the center.

The sixth invention is based on the second invention. There is a rotation adjustment mechanism between the X axis of the donor table and the platform 1 for finely adjusting the installation angle in the XY plane between the two. Between the X-axis of the donor table and the optical table, there is a rotation adjustment mechanism for finely adjusting the installation angle in the XY plane between the two. There is a rotation adjustment mechanism between the Y axes of the donor table for finely adjusting the installation angle in the XY plane between the two.

As the above-mentioned RP, for example, the RP used between G1 and Xd shown in FIG. 3A , the RP used between Xd and Xo shown in FIG. 3C , and the RP used between Xd and Yd shown in FIG. 3B can be used. between RP.

The seventh invention is based on the third invention. There is a rotation adjustment mechanism between the X axis of the donor table and the platform 1 for finely adjusting the installation angle in the XY plane between the two. There is a rotation adjustment mechanism between the optical table and the platform 1 for finely adjusting the installation angle in the XY plane between the two. Between the X axis of the donor table and the There is a rotation adjustment mechanism between the Y axes for finely adjusting the installation angle in the XY plane between them.

Here, for example, RP shown in FIG. 3A is used as the rotation adjustment mechanism between Xo and G1 and between Xd and G1. On the other hand, as the rotation adjustment mechanism between Xd and Yd, RP shown in FIG. 3B is used. RP. The RP of the former has holes for passing the screws for fixing the linear guides Xo and

The eighth invention is based on the fourth invention. There is a rotation adjustment mechanism between the X axis of the donor table and the platform 1 for finely adjusting the installation angle in the XY plane between the two. There is a rotation adjustment mechanism between the optical table and the platform 3 for finely adjusting the installation angle in the XY plane between the two. Between the X axis of the donor table and the There is a rotation adjustment mechanism between the Y axes for finely adjusting the installation angle in the XY plane between them.

A ninth invention is based on any one of the first to eighth inventions, wherein the laser device is an excimer laser.

Here, the oscillation wavelength of the excimer laser is mainly 193 [nm], 248 [nm], 308 [nm], or 351 [nm], and is appropriately selected from among them according to the material of the light absorption layer and the light absorption characteristics of the object. .

A tenth invention is based on the ninth invention, in which the transfer device includes a pulse shutter that cuts off any pulse train of laser pulses emitted from the excimer laser.

It is known to the public that the pulsed oscillation laser device receives a trigger signal from the programmable multi-axis control device and starts to oscillate, but the energy of the pulses after a certain number of times or a certain period of time after the oscillation is unstable due to application are different and cannot be used. Therefore, in order to eliminate this unstable pulse group, it is necessary to eliminate the above-mentioned pulse group through a mechanical shutter operation. Specifically, for example, in the case of an excimer laser oscillating at 1 [kHz], the time window between adjacent laser pulses is approximately 1 [ms], and it is necessary to be able to move (traverse) a certain distance within this time. High-speed shutter function. This certain distance depends on the size of the laser space where the shutter is operated. If the distance is 5 [mm], the required shutter operating speed is 5 [m/s], and a voice coil needs to be used. Such as the ultra-high-speed optical gate that allows optical elements to enter and exit the optical path. In addition, even if the size of the space is reduced by molding the optical system or the like to shorten the distance that the shutter member traverses, it will be easily damaged due to the energy density of the laser light.

The eleventh invention is based on the tenth invention. The programmable multi-axis control device has the function of simultaneously controlling at least the Y-axis of the recipient table and the Y-axis of the donor table, and includes the use of A device for correcting the movement position error using two-dimensional distribution correction value data prepared in advance for correcting the movement position error of the stage.

For example, using the simulated two-dimensional distribution correction value data information in the XY plane of any combination of Xd or Xo and Yr or Yd, the position correction of the acceptor substrate and the donor substrate during laser irradiation is performed. The main causes of the corrected position error include, but are not limited to, pitching, yawing, and rolling caused by the movement of each station. In addition, the parameters for determining the correction value include, in addition to the position information of each station, the moving speeds of Yr and Yd and their ratios.

The twelfth invention is based on the eleventh invention, and a high-magnification camera for monitoring the position of the donor substrate is disposed on the Z-axis of the acceptor stage, or a high-magnification camera for monitoring the position of the acceptor substrate. The camera is disposed on the X-axis of the donor table or a part that moves together with the X-axis of the donor table, or on the optical table or a part that moves together with the optical table.

Here, the “portion that moves together with the X-axis of the donor table” also includes Yd that is suspended from Xd. In the present invention, the parallelism between the Y-axis of each stage and the parallelism between the X-axis and the perpendicularity of the Y-axis and the X-axis of each stage are important parameters for the left and right transfer position accuracy. In addition, during the inspection of parallelism and perpendicularity when assembling each stage, a high-magnification and high-resolution camera is used to monitor the amount of deviation in the direction perpendicular to the movement distance of each stage holding the alignment substrate. And use the rotation adjustment mechanism to adjust the verticality. In addition, during the adjustment of the parallelism between Yr and Yd, the two stages were moved synchronously (parallel) by the same distance, and pattern matching was performed by observing the pattern attached to the opposite stage through a high-magnification camera installed on one stage. Check whether the position of the alignment mark image (cross mark, etc.) has not moved but is still. In this case, the movement in the Y-axis direction indicates an abnormality in the synchronization of Yd and Yr, and the movement in the X-axis direction indicates an adjustment error in the parallelism of Yd and Yr.

In addition, a CCD camera is generally used as a high-magnification camera. The magnification and the like depend on the transfer position accuracy, but as an example, when a deviation of the order of [μrad] is detected, that is, when a deviation of 1 [μm] is detected with respect to a stage movement distance of 1 [m], Below, a camera with a resolution of 1 [μm] and a magnification of about 20x to 50x can be used

The thirteenth invention is based on the twelfth invention. The donor stage and the acceptor stage include a gap sensor, and the gap sensor measures the relationship between the surface (lower surface) of the donor substrate and the acceptor. Gaps on the surface of the substrate.

Here, the gap sensor refers to a sensor that combines height sensors respectively installed on the donor and acceptor tables. The height sensor installed on the donor table measures the distance to the acceptor substrate, and the height sensor installed on the acceptor table measures the distance to the acceptor substrate. The sensor measures the distance to the donor substrate, and based on the two measurements and the height information from the height sensor, the gap between the donor substrate and the acceptor substrate is calculated.

The fourteenth invention is based on the thirteenth invention, and includes position measuring devices using laser interferometers for the Y-axis of the recipient table and the Y-axis of the donor table, respectively.

As the structure of the laser interferometer for the Y-axis (Yr) of the receptor stage, a structure including the following components can be used: the reflector (Ic), which is held on the part that moves together with Yr; the interferometer laser (IL), which is fixed For example, on a platform that is not easily affected by vibration caused by the movement, such as platform 2 (G2); and a quarter-wavelength plate (not shown). In addition, as the reflecting mirror, a three-axis corner cube prism (retro-reflector) is suitably used, and it is preferable that the position (height) is as close as possible to the receptor substrate. An overview is shown in FIG. 5A (the Z-axis and θ-axis of the donor stage group and the recipient stage are omitted).

Based on the position information from the linear encoder, Yr is controlled by a programmable multi-axis control device, and the laser interferometer is used for correction of the linear encoder and for Yr and Yd to be described later. Correction for gear mode actions when finely adjusting their gear ratios.

As the structure of the laser interferometer for the Y-axis (Yd) of the donor stage, a structure including the following components can be used: Ic, which is held on a surface that moves together with Yd suspended from Xd; IL, which is fixed on Xd in the same way on; and 1/4 wavelength plate, etc. (illustration omitted). Here, as the reflecting mirror, a three-axis corner cube (retroreflector) is suitably used, and it is preferable that the position (height) of the reflecting mirror is as close as possible to the donor substrate. An overview is shown in Figure 5B. (The receptor stage group is not shown in the figure.) In addition, regarding the selection of any detection method of the laser for the interferometer, it is only necessary to select the most suitable method according to the required transfer position accuracy.

The fifteenth invention is based on the fourteenth invention. The transfer device includes a confocal beam profiler. The confocal beam profiler reduces and projects the pattern of the mask through the projection lens. The imaged position is conjugate to the position having the focal plane.

With this confocal beam profiler, the position and spatial intensity distribution of the laser beam projected onto the surface of the donor substrate can be monitored in real time with the same accuracy as the imaging resolution of the reduced imaging optical system, as well as its imaging state.

The sixteenth invention is a method of using a transfer device, which is the transfer device of the thirteenth invention, using the gap sensor to pre-measure the bending amount of the donor substrate together with the XY position information of the donor substrate, Based on the two-dimensional distribution data of the amount of bending obtained by the measurement, the donor substrate and the receptor are aligned using the Z-axis (Zr) of the receptor stage or the Z-axis stage of the projection lens. The gap between the substrates is corrected.

The seventeenth invention is a method for adjusting a transfer device. The transfer device is the transfer device according to any one of the fifth invention to the eighth invention. The method for adjusting the transfer device is assembling the transfer device. The method for adjusting the parallelism between the Y-axis of the recipient table and the Y-axis of the donor table during the process, and the method for adjusting the transfer device are performed together with the Z-axis and θ-axis of the recipient table. The adjustment of linearity takes the Y-axis of the recipient table as a reference and includes the following steps: adjusting the recipient table through a rotation adjustment mechanism located between the first platform and the X-axis of the donor table. The verticality of the Y-axis of the table and the X-axis of the donor table is adjusted; the Y-axis of the donor table and the X-axis of the recipient table are suspended from the adjusted verticality of the X-axis of the donor table. The Y-axis travels parallel to each other synchronously, and the alignment mark on the Y-axis of the opposite donor table is observed through a high-magnification camera installed on a part that moves together with the Y-axis of the recipient table; and based on the observation As a result, the parallelism between the Y-axis of the recipient table and the Y-axis of the donor table is adjusted through the rotation adjustment mechanism between the X-axis of the donor table and the Y-axis of the donor table. Adjustment.

In addition, in order to confirm and adjust the parallelism between Yd and Yr with high accuracy, it is preferable that the high-magnification camera is located at the highest position among the stages, plates, etc. placed on Yr, and is mounted on a part with high rigidity.

The present invention is capable of enlarging the acceptor substrate of the transfer device and shortening the cycle time while maintaining high transfer position accuracy on the basis of high synchronization position accuracy of the donor substrate and the acceptor substrate.

Description of the drawings

FIG. 1A shows the main structural parts of the transfer device of the present invention (side view). (Second invention)

FIG. 1B shows a state where the X-axis of the donor table is placed on the optical table and moved from the state of FIG. 1A (side view).

FIG. 1C shows a state where the optical table is moved on the X-axis of the donor table from the state of FIG. 1B (side view).

Figure 1D is a top view of Figure 1C.

FIG. 2A shows the main structural parts of the transfer device of the present invention (side view). (Third invention)

FIG. 2B shows a state where the X-axis of the donor table and the optical table have moved the same distance on the stage 1 from the state of FIG. 2A (side view).

FIG. 2C shows a state where only the X-axis of the optical table has moved on the stage 1 from the state of FIG. 2B (side view).

Figure 3A shows an example of the rotation adjustment mechanism used between G1 and Xd.

Figure 3B shows an example of a rotation adjustment mechanism for use between Xd and Yd.

Figure 3C shows an example of a rotation adjustment mechanism for use between Xd and Xo.

Figure 4 shows the range within which the donor stage should move depending on the size of the acceptor substrate.

FIG. 5A shows a Y-axis laser interferometer equipped with a receptor stage.

FIG. 5B shows a Y-axis laser interferometer equipped with a donor stage.

FIG. 6 shows an example of a pattern formed on the mask.

FIG. 7 shows a transfer process using a multi-column mask pattern.

Figure 8 shows the monitoring situation of the confocal beam profiler.

FIG. 9A shows the first irradiation in the transfer step.

FIG. 9B shows the second irradiation in the transfer step.

FIG. 9C shows the third irradiation in the transfer step.

Figure 10 shows the situation of the receptor substrate after scanning once with a gear ratio of 1:2.

FIG. 11 shows the step scanning of the X-axis of the donor table.

Fig. 12 shows the synchronization position error when the Y-axis of the recipient table and the Y-axis of the donor table are moved in parallel.

FIG. 13A shows the first irradiation in the transfer step using a matrix-shaped donor substrate.

FIG. 13B shows the second irradiation in the transfer step using a matrix-shaped donor substrate.

FIG. 13C shows the third irradiation in the transfer step using a matrix-shaped donor substrate.

Explanation of reference signs

AD Adjustment base plate for donor table

Adjustment substrate for AR receptor table

BP Confocal Beam Profiler

CCD high magnification camera

D Donor substrate

F field lens

G basic platform

G1 Platform 1

G11 Platform 11

G12 Platform 12

G2 Platform 2

G3 Platform 3

H shaping optical system

IC laser interferometer corner cube prism

IL laser for laser interferometer

LS laser

M mask

Pl projection lens

R receptor substrate

RP rotation adjustment mechanism

S object

TE telescope

Xd X-axis of donor table

Xo optical table (X axis)

Yd Y axis of donor table

Yl projection lens and camera switcher

Yr Y-axis of the receptor platform

Zl Z axis stage of projection lens

Zr Z axis of the receptor platform

θd θ axis of donor table

θr θ axis of the receptor platform

Detailed ways

Next, the specific structure of the transfer device of the present invention will be described in detail with reference to the accompanying drawings.

[Example 1]

This Example 1 shows an example in which a layered (solid film) object is formed into one piece on a donor substrate with a size of 200 × 200 [mm] with a light absorbing layer interposed therebetween. The unit-shaped transfer object of 10×10 [μm] is transferred to a receptor substrate with a size of 400×400 [mm] in a matrix of a total of 144 million units with a length of 12000×12000. The above-mentioned 144 million transfer positions have a positional accuracy of ±1 [μm], and the vertical and horizontal pitches are 30 [μm].

First, FIG. 1A shows the main structural parts of the transfer device related to the implementation of the present invention. In addition, the laser device, the control device, other monitors, etc. are not shown in FIG. 1A , and the X-axis, Y-axis, and Z-axis directions are as shown in the figure. Platform 1 (G1), platform 11 (G11), platform 12 (G12), and platform 2 (G2) are all stone platforms using granite. In addition, the base platform (G) uses highly rigid iron. In addition, this embodiment is an embodiment based on the structure of the above-mentioned sixth invention.

The structure of the transfer device according to Embodiment 1 of the present invention will be described in order according to the transmission sequence of the laser beam from the laser device to the target object on the donor substrate. First, the laser device used in Example 1 is an excimer laser with an oscillation wavelength of 248 [nm]. The spatial distribution of the emitted laser is approximately 8×24 [mm], and the beam divergence angle is 1×3 [mrad]. The above are all described in (vertical × horizontal), and the numerical value is FWHM.

In addition, there are various specifications of excimer lasers. Depending on the difference in output, repetition frequency, beam size, beam divergence angle, etc., the length of the emitted laser light may vary vertically (inverting the longitudinal and transverse directions). However, there are many kinds of excimer lasers that can be used in this embodiment 1 by adding, omitting, or changing the design of the optical system. In addition, although the laser device depends on its size, it is generally installed on a base (laser platform) different from the base of the stage group on which the transfer device is installed.

The emitted light from the excimer laser enters the telescope optics and is transmitted to the shaping optics in front of it. Here, as shown in FIG. 1A , the shaping optical system is held on an optical table (Xo) disposed on the X-axis (Xd) of the donor table that moves the donor substrate so that the optical axis is along the X-axis. superior. In addition, the laser beam immediately before entering the shaping optical system is adjusted by the telescope optical system so that it becomes substantially parallel light at any position within the movement range of the X-axis of the donor stage. Therefore, regardless of the movement of Xd and/or Xo in the X-axis direction, the laser light always enters the shaping optical system with substantially the same size and the same angle (vertical). In this embodiment 1, the size is approximately 25×25 [mm] (length×width).

The shaping optical system (H) of this embodiment 1 combines two sets of uniaxial cylindrical lens arrays into two sets of right angles in a plane perpendicular to the optical axis direction. The configuration is as follows: the front-stage lens array in each group forms an image on the mask (M) through the rear-stage lens array and the condenser lens (not shown) located behind it.

The laser light that has passed through the shaping optical system enters the mask via a field lens (F) that constitutes an image-side telecentric reduction projection optical system in combination with the projection lens (P1). The size of the laser on the mask is 1×50 [mm] (FWHM), and the size of the area where the spatial intensity distribution uniformity is within ±5% is maintained at 0.5×45 [mm] or more.

The mask is fixed on the mask stage. As mentioned above, the mask stage has a total of six-axis adjustment mechanisms. The six axes are: the W axis that moves along the X-axis direction together with the field lens, and the U-axis in the Y-axis direction. , the V axis that moves in the Z-axis direction, the R axis that is the rotation axis in the YZ plane, the TV axis that adjusts the inclination with respect to the V axis, and the TU axis that adjusts the inclination with respect to the U axis.

The mask of Example 1 uses a mask having a pattern drawn (formed) on a synthetic quartz plate by chromium plating. Figure 6 shows its outline. In this mask, the white window portion (a) that is not chromed is transmitted through the laser, and the colored portion (b) that is chromed blocks the laser. The shape (a) of one window is 50×50 [μm], and a total of 300 windows are continuously arranged at intervals of 150 [μm] and 43.85 [mm] along the X-axis direction (one row). In addition, the chromium-plated surface is the emission side of the laser, and on the other hand, an anti-reflection film for 248 [nm] is provided on the incident side. Furthermore, instead of chromium plating, aluminum evaporation or dielectric multilayer film can be used.

In addition, when switching the transfer process using multiple patterns on one mask, if the size of the laser beam irradiated from the shaping optical system to the mask is within the range of the movable range of the mask stage, Within, masks depicting different patterns can be used.

In addition, in FIG. 7 , when a transfer process of scanning the donor substrate (D) at the same speed multiple times or back and forth is used while the acceptor substrate (R) is scanned once (including stopping in the middle), etc. , the mask pattern shown in Figure 6 may not be one column, but may adopt a multi-column pattern (but the laser irradiation is intermittently and selectively irradiated in the mask pattern. It is represented as a 3×2 column matrix in Figure 7) . This makes it possible to use a donor substrate smaller in size than the acceptor substrate.

The laser light that has passed through the mask pattern has its transmission direction changed to vertically downward (-Z direction) by the epi-mirror and then enters the projection lens. This projection lens is equipped with an anti-reflection film for 248nm and has a reduction magnification of 1/5. Details are shown in Table 1 below.

[Table 1]

The laser beam emitted from the projection lens is incident from the back surface of the donor substrate, and is accurately projected to a predetermined position of the light absorbing layer formed on the surface (lower surface) of the mask pattern at a reduced size of 1/5. Here, after adjusting the X-axis (Xd), Y-axis (Yd), and θ-axis (θd) of the donor stage based on the alignment marks etc. previously added to the donor substrate, the prescribed position in the XY plane is determined. Location.

In order to adjust the image plane of the mask pattern generated by the projection lens to focus on the boundary surface between the surface of the donor substrate and the light-absorbing layer, adjust the Z-axis stage (Zl) of the projection lens and the mask stage on which the field lens (F) is placed. The position of the W axis. In addition, although the Z-axis direction adjustment function of the donor substrate (Z-axis stage) can be added, it is necessary to consider the decrease in transfer position accuracy caused by adding a weighted load to the X-axis (Xd) of the donor stage.

When adjusting the imaging position of the boundary surface between the donor substrate surface and the light-absorbing layer, real-time monitoring using a confocal beam profiler (BP) that has a plane in a conjugate relationship with the image plane on the focal plane is effective. FIG. 8 shows this adjustment screen. In this Embodiment 1, the spatial intensity distribution of laser light imaged on the boundary surface of the donor substrate surface and the light absorbing layer is monitored in real time and with high resolution.

The above is the function achieved by the device structure of the first embodiment regarding the transmission of pulse laser light emitted from the laser device.

Next, a brief description will be given of how to use the structure of Embodiment 1 to mechanically achieve parallelism between the Y-axis (Yr) of the recipient table and the Y-axis (Yd) of the donor table in the device of the present invention.

Each stage is as shown in Figure 1A. The X-axis (Xd) of the donor stage is placed on the stone platform 1 (G1), and the optical stage (Xo) is placed on it. The receptor platform group (Yr, θr, Zr) is placed on the stone platform 2 (G2). In addition, the whole is built on the basic platform (G). Furthermore, a rotation adjustment mechanism (RP) is provided between G1 and Xd, between Xo and Xd, and between Xd and Yd (illustration omitted).

In addition, in order to adjust the verticality and parallelism of the axis of each stage, an adjustment substrate AD held on the donor stage is used instead of the donor substrate, and an adjustment substrate AR placed on the receptor stage is used instead of the acceptor substrate. Lines representing the X-axis (Alignment Line mark.

1) Parallelism between Yr and AR(Y) (perpendicularity between Yr and AR(X))

In order to adjust the parallelism between the Y-axis (Yr) of the receptor table and the alignment line Y on the adjustment substrate AR, the adjustment substrate AR placed on the Z-axis (Zr) of the receptor table is observed through a high-magnification CCD camera, as described The high-magnification CCD camera is fixed on the optical table (Xo) or on the Z-axis table for the projection lens installed on the optical table (Xo). The Yr axis is moved by 400 [mm], and the θ axis (θr) of the receptor table is adjusted so that the deviation amount in the X axis direction of the alignment line Y is within 1 [μm]. In addition, the movement distance of the stage at this time is within the range of the effective stroke of the stage, and the amount of deviation that should be allowed changes depending on the required transfer accuracy. (Same below)

2) Parallelism between AR(X) and Xd (perpendicularity between Yr and Xd)

Next, using the alignment line The high-magnification CCD camera is also fixed on the optical table (Xo) or on the Z-axis table for the projection lens of the optical table (Xo). Move the Xd axis by 400 [mm], and use the rotation adjustment mechanism between G1 and Xd to adjust the installation angle between them so that the deviation in the Y axis direction of the alignment line X is within 1 [μm]. , and adjust G1 and Xd, that is, the installation angle of Xd relative to Yr.

3) Parallelism between AR(X) and Xo (perpendicularity between Yr and Xo, parallelism between Xd and Xo)

Using the alignment line It is fixed on the optical table (Xo) or on the Z-axis table for the projection lens installed on the optical table (Xo). Move the Xo axis by 200 [mm], and adjust the optical table (Xo) relative to the donor through the rotation adjustment mechanism between the alignment line X and the Y axis direction so that the deviation amount is within 0.5 [μm]. Parallelism of the X-axis (Xd) of the table.

4) Parallelism between Yd and AD(Y)

In order to adjust the parallelism between the Y axis (Yd) of the donor stage and the alignment line Y on the adjustment substrate AD, the adjustment substrate AD held on the θ axis (θd) of the donor stage is observed through a high-magnification CCD camera, as described The high-magnification CCD camera is fixed on the optical table (Xo) or on the Z-axis table for the projection lens installed on the optical table (Xo). The Yd axis was moved by 200 [mm], and the θ axis (θd) of the donor stage was adjusted so that the deviation amount in the X axis direction of the alignment line Y was within 0.5 [μm].

5) Parallelism between AD(X) and Xo (parallelism between AD(X) and Xd, perpendicularity between Xd and Yd)

In order to adjust the perpendicularity between the X-axis (Xd) of the donor table and the Y-axis (Yd) of the donor table, the alignment line X on the substrate AD is observed and adjusted through a high-magnification CCD camera fixed on the already installed On an optical table (Xo) whose parallelism with the X-axis (Xd) of the donor table has been adjusted, or on a Z-axis table for a projection lens installed on the optical table (Xo). The optical table (Xo) is moved 200 [mm], and is adjusted and suspended on the donor through the rotation adjustment mechanism between the alignment line X and the Y-axis direction so that the deviation amount is within 0.5 [μm]. Verticality of the Y-axis (Yd) of the donor table on the X-axis (Xd) of the table.

6) Parallelism between AD(Y) and Yr (parallelism between Yd and Yr)

Finally, in order to confirm the parallelism between the Y-axis (Yd) of the donor table and the Y-axis (Yr) of the recipient table, a high-magnification CCD camera was installed on the Y-axis (Yd) of the donor table, and the objects placed opposite each other were observed. Adjust the alignment line Y of the substrate AR on the receptor stage. At this time, the adjustment substrate AD is removed in advance. The X-axis (Xd) of the donor table is moved so that the high-magnification CCD camera can observe either end of the recipient table. Next, the Y-axis (Yd) of the donor stage is moved by 400 [mm], and it is confirmed whether the deviation amount in the X-axis direction of the alignment line Y is within 1 [μm]. In addition, in order to make the same confirmation at the other end of the receptor table, after moving Xd to the other end, Yd was moved by 400 [mm], and it was confirmed that the deviation amount of the alignment line Y in the X-axis direction was within 1 [mm]. μm] within. In addition, you can also move Yd and Yr in parallel and observe the position change of the alignment mark.

In addition, when a high-magnification CCD camera is installed on the Y-axis (Yd) of the donor table, there are differences between the high-magnification CCD camera and the X-axis position of the donor table and the shape (opening) of the stone table 1. the possibility of their contact. In this case, it is possible to observe by mounting the high-magnification CCD camera not on Yd but on the Z-axis (Zr) of the receptor table and moving the Y-axis (Yr) of the receptor table by 200 [mm]. Adjust the alignment line Y of the substrate AD and confirm the amount of deviation in the X-axis direction.

Since the stone platform 1 (G1) and the stone platform 2 independently support each platform, and Yd is suspended from Xd provided on G1, although the parallelism between Yr and Yd cannot be directly adjusted, it can be adjusted step by step as described above. Adjust the parallelism of Yr and Yd on the order of [μrad]. In addition, since errors in parallelism (perpendicularity) are accumulated by following the adjustment steps in the order of 1) to 6), it is desirable to perform the adjustment so that the allowable deviation amount in the initial stage is suppressed as small as possible. In addition, although the adjustment steps 1) to 6) described above describe the adjustment of the parallelism and perpendicularity of each stage in the XY plane, adjustment of other axes (X-axis and Y-axis) is also required.

Next, scanning of the donor substrate and the acceptor substrate during transfer in Example 1 will be described with reference to FIGS. 9A to 9C . Here, the top view of FIGS. 9A to 9C is a view in which the operator is located on the left side of these figures and the donor substrate (D) and the acceptor substrate (R) are scanned in the front and rear directions relative to the operator.

First, the amount of curvature of the donor substrate adsorbed and placed on the θ axis (θd) of the donor stage is measured over the entire surface of the donor substrate and mapped as two-dimensional data together with the position information. This information is used as a correction amount for the Z-axis (Zr) of the recipient table corresponding to the X-axis (Xd) and Y-axis (Yd) of the donor table that moves in the transfer process.

In addition, in the following description, for convenience of explanation, a predetermined position in front of the left eye of the receptor substrate (R) and the donor substrate (D) when viewed from the operator is defined as the origin of each substrate. In addition, the positions of the optical table (Xo) and the receptor table (Yr, θr) when the origin of the receptor substrate is irradiated with laser light are respectively defined as the origin. In addition, in the donor substrate, the positions of the donor stages (Xd, Yd, θd) during irradiation with the laser light (LS) are also defined as respective origins. However, the origin of each stage is not limited to one end of its stroke range, but is the position of the stroke portion left for subsequent transfer steps and removal of the substrate.

FIG. 9A shows a state in which the first pulse of laser light (LS) is irradiated to the donor substrate (D) and the acceptor substrate (R) located at the origin position. Here, both a side view (side view) and a top view (top view) are illustrated. The one-dot chain line represents the case where laser light is irradiated to the object (S) through the reduction projection optical system, and the light-absorbing layer (not shown) in the 10 × 10 [μm] area that received the irradiation absorbs the laser light and ablates it. A shock wave is generated, whereby objects in the same area are transferred to the opposite receptor substrate. Although the number of objects shown in the figure is three, in the case of Example 1, a total of 300 objects are transferred to the receptor substrate at one time.

In the present Example 1, the laser device oscillates at 200 [Hz], and since the transfer is performed by one irradiation, the receptor stage (Yr) moves at a speed of 6 [Hz] without stopping the receptor substrate until the next irradiation position. mm/s] to scan in the -Y direction.

On the other hand, the Y-axis (Yd) of the donor stage is synchronized with the position of the Y-axis (Yr) of the acceptor stage, and moves in the same direction at a speed of 3 [mm/s] without stopping the donor substrate. Scan in the -Y direction. That is, the moving speed ratio (gear ratio) of Yd and Yr is 1:2. FIG. 9B shows the second irradiation after each substrate has been moved.

With Yr as the reference (master) and Yd as the slave (slave), the positions of Yr and Yd are synchronized by using the gear command of the stage system to cause the two stages to perform gear pattern synchronization operations. Use programmable multi-axis controls in the control system.

Furthermore, to determine the gear ratio of the gear command, actual measurements of the stage position measured by a laser interferometer are used. Install the corner cube (Ic), and set the He-Ne laser (IL) with a wavelength of 632.8 [nm] and the light receiving part (not shown in Figure 5A) on the stone platform 2 (or an equivalent fixed position). The corner cube (Ic) moves together with the moving stage of Yr and forms a laser interferometer in the vicinity of the receptor substrate. Similarly, a corner cube is installed on the side of the moving stage of Yd, and the interferometer laser and the light receiving unit (not shown in FIG. 5B ) are installed on Xd. This enables accurate position synchronization of each station.

As described above, the position of each stage at the origin starts to accelerate from the position in front of the origin in such a manner that it moves at a stable constant speed. During this acceleration time and the time until the stage reaches the origin, the laser pulse needs to be cut off so that the laser light does not irradiate the donor substrate. Therefore, an external oscillation trigger signal or a high-speed shutter action start trigger signal and a stage drive signal are sent to the laser device with high precision from the programmable multi-axis control device.

In addition, FIG. 9C shows the situation of the third irradiation. It can be seen from the figure that the acceptor substrate (R) moves twice as far as the donor substrate (D). Thereafter, the acceptor substrate and the donor substrate continue to move in the same manner.

When the donor substrate scans 180 [mm] in the -Y direction and ends, and similarly when the acceptor substrate scans 360 [mm] in the -Y direction and ends, the oscillation of the laser device is temporarily stopped, or the laser is cut off with a high-speed shutter. of exposure. By scanning at this distance, 300 objects arranged in the X-axis direction are transferred along the Y-axis direction of the receptor substrate in 12,000 rows, totaling 3.6 million objects. Figure 10 shows this situation.

During the stop time, both the Y-axis (Yr) of the recipient table and the Y-axis (Yd) of the donor table return to the origin. (However, consider the acceleration distance for the next scan. The same applies to the following.) On the other hand, the X-axis (Xd) of the donor table returns to the position of -9 [mm] compared with the previous origin. In addition, the transfer process is started again from the new area. Hereafter, the above operation is repeated.

Figure 11 shows that after the movement of -9 [mm] × 20 steps of (line diagram), use this point as the new origin and start the same action. After that, the steps of Y-axis scanning (180 [mm] (Yd) and 360 [mm] (Yr)) and Xd of -9 [mm] × 20 times are repeated for the two stages. As a result, during the first 180 [mm] scan of By irradiating laser light to the planned irradiation area of LS), more objects on the donor substrate can be transferred to the acceptor substrate without waste.

In addition, the approximate processing time is 360[mm]/6[mm/s]×40[times]=2400[s]. In addition, this time does not include the time for the Y-axis (Yr) of the receptor platform to move the distance required for acceleration and deceleration and the time for each Y-axis scan to return to the origin. In addition, by increasing the repetition frequency of the excimer laser to 1 [kHz], the above-mentioned processing time can be shortened by 1/5.

Figure 12 illustrates how the device structure of the first embodiment moves the receptor platform 400 [mm] at a moving speed of 150 [mm/s] in a synchronous manner using the Y-axis (Yr) of the receptor platform as the reference (main). The synchronization position error of the two stages when the donor stage is moved a distance of 200 [mm] at a moving speed of 75 [mm/s] with the Y-axis (Yd) of the donor stage as a slave. Specifically, the difference (ΔYdr=δYd−δYr) between the error amount (δYr) and the error amount (δYd), which is plotted on the horizontal axis as the elapsed time corresponding to the moving speed of the receptor table, is plotted. The error amount (δYd) between the position information obtained from its linear encoder and the position information measured by the laser interferometer on Yr as the reference (master) is synchronized at the above-mentioned 1/2 speed The amount of error between the position information obtained from its linear encoder on Yd of the moving slave (slave) and the position information measured by the laser interferometer. As can be seen from the results, position synchronization accuracy within ±1 [μm] was achieved within a movement distance of 400 mm.

As described above, the transfer pattern of the object to the receptor substrate in Example 1 is a matrix of 10×10 [μm] with an interval of 30 [μm]. However, if the interval is set to 60, for example [μm], one donor substrate can be used to transfer four acceptor substrates.

[Example 2]

This Example 2 is different from the layer state in which the object on the surface of the donor substrate is one piece in Example 1, and is the following example: a donor substrate with the same size of 200 × 200 [mm] is formed into A total of 144 million objects in a matrix shape with a shape of 10 × 10 [μm] and an interval of 15 [μm], with a density of 1/2 of the donor substrate, that is, an interval of 30 [μm] and an interval of 15 [μm]. The same matrix shape was transferred to a receptor substrate with dimensions of 400 × 400 [mm].

Finally, the arrangement of the objects transferred to the acceptor substrate is the same as in Example 1, but the difference is that in this Example 2, the objects are also arranged on the donor substrate in advance at twice the density, and It is transferred to the acceptor substrate with a positional accuracy of ±1[μm]. In addition, in this case, compared with Example 1, the positional synchronization accuracy of the Y-axis (Yd) of the donor table and the Y-axis (Yr) of the recipient table is required to be more stringent.

13A to 13C show the steps from the irradiation of the first pulse of laser light (LS) to the third irradiation on the donor substrate (D) and the acceptor substrate (R) at the origin position in the same manner as in Example 1. Case.

[Example 3]

In this Embodiment 3, the method of transferring the object on the surface of the donor substrate to the acceptor substrate is the same as that in Embodiment 1 or 2. On the other hand, the adjustment method of the parallelism of the Y-axis and the X-axis of each stage and the perpendicularity of the Y-axis and the X-axis is different from the above-mentioned embodiment. That is, the adjustment method described in Example 1 is as follows: in order to adjust the parallelism between the Y-axis (Yr) of the recipient table and the Y-axis (Yd) of the donor table, the adjustment steps 1) to 6) are performed. Here, in the third embodiment, the parallelism between Yr and Yd is adjusted in the early stage of the adjustment step.

1) Straightness of Yr, θr, Zr

This adjustment step is an adjustment step that is a premise common to the first and second embodiments. Use a laser interferometer or the like to adjust the Y-axis (Yr) of the receptor table provided on the stone platform 2 (G2) and the θ-axis (θr) provided thereon, as well as the Z-axis (Zr) and the receptor substrate. Straightness of the bracket (straightness with respect to the Z-axis, which is the vertical direction when the horizontal plane is regarded as the XY plane). In addition, basically after this adjustment, no adjustment that may affect the verticality of the receptor table group is performed, and all other table adjustments are performed based on, for example, the uppermost surface of the receptor table group.

2) Parallelism between Yr and AR(Y) (perpendicularity between Yr and AR(X))

Similar to the adjustment step 1) of Example 1, the parallelism between the Y-axis (Yr) of the receptor table and the alignment line Y on the adjustment substrate AR is adjusted. Thus, the perpendicularity between Yr and the alignment line X is also adjusted. In addition, when the adjustment substrate AR is not used and an alignment line or an alignment mark obtained by drawing directly on Yr or the like is used, the adjustment step 1) can be omitted.

3) Parallelism between AR(X) and Xd (perpendicularity between Yr and Xd)

Next, the alignment line X of the adjustment substrate AR is observed with a high-magnification CCD camera installed on an optical table (Xo) placed on the X-axis (Xd) of the donor table. The position of the high-magnification CCD camera in the Z-axis direction is determined by the design of the projection optical system. However, in the third embodiment, a Z-axis stage (Zl) that holds the projection lens is used and is fixed near the position of the projection lens (Pl). . Move Xd 400 [mm], and use the rotation adjustment mechanism to adjust the installation angle of Xd relative to the stone platform 1 so that the deviation in the Y-axis direction of the alignment line Spend.

4) Parallelism of Yr and Yd in the YZ plane

In the description of Embodiment 1, the description of the adjustment procedures of other axis systems (X-axis and Y-axis) is omitted. Here, the adjustment procedures of the parallelism in the X-axis system, that is, the YZ plane, will be briefly described. Observe the lower surface of the Y-axis (Yd) of the donor stage using a height sensor installed on the Z-axis (Zr) or other parts of the recipient stage. Make Yr and Yd move simultaneously and synchronously (move in parallel) by the same distance of 200 [mm] or more, and observe the change in the measured value of the gap sensor (the distance between Zr and Yd). Insert the backing plate between the rotation adjustment mechanism provided between Xd and Yd and Yd or between Yr and Yd to adjust the parallelism in the YZ plane.

5) Parallelism between Yr and Yd

Use a high-magnification CCD camera installed on Zr or other locations to observe the alignment marks for pattern matching provided on the lower surface of Yd. When Yr and Yd are moved synchronously (in parallel) by the same distance and the position of the alignment mark image (cross mark, etc.) that matches the pattern is moved in the X-axis direction, the rotation adjustment mechanism provided between Xd and Yd is used for adjustment. , to correct it. In addition, instead of the alignment mark, the alignment line Y of the adjustment substrate AD mounted on the Y-axis of the donor stage may be used.

6) Perpendicularity between Yr and Xo

The alignment line X of the adjustment substrate AR whose perpendicularity to the Y-axis (Yr) of the receptor table has been adjusted in the adjustment step 1) is observed with a high-magnification CCD camera installed on the optical table (Xo). Move Xo 400 [mm], and adjust the installation angle of Xo relative to Xd using a rotation adjustment mechanism provided between them so that the deviation amount in the Y-axis direction of the alignment line X is within 0.3 [μm].

[Example 4]

FIG. 2A shows the main structural parts of the transfer device according to the fourth embodiment. This is an embodiment using the seventh aspect of the present invention as a basic structure. In addition, in FIGS. 2A to 2C , illustration of the laser device, control device, other monitors, etc. (all of which are the same as in Embodiment 1) is omitted, and the X-axis, Y-axis, and Z-axis directions are shown in the drawings. In addition, the arrangement of the donor substrate, the acceptor substrate, and the transfer object on the donor substrate and the arrangement after transfer to the acceptor substrate used in Example 4 are the same as those in Example 2.

The optical system until the pulsed laser is emitted from the excimer laser device and irradiates the transfer object on the donor substrate is as described below, except for differences in the construction of each stage group shown in FIG. 1A and FIG. 2A . Except for the generated parts, it is the same as Example 1. That is, in the case of the transfer device of the sixth invention shown in FIGS. 1A to 1C , the X-axis (Xd) of the donor table is sequentially arranged on the stone platform 1 (G1) and the optical table (Xo) is arranged thereon, On the other hand, in the case of the transfer device of the seventh invention shown in FIGS. 2A to 2C , the construction of these sets differs in that Xo is placed on G1 and Xd is suspended below G1.

The emitted light from the excimer laser enters the telescope optics and propagates toward the shaping optics in front of it. As shown in FIG. 2A , the above-mentioned shaping optical system is installed parallel to its optical axis on an optical table (Xo) that moves in the X-axis direction. In addition, Xo is placed on a granite stone platform 1 (G1), with a rotation adjustment mechanism (RP) between them. Here, Xo is at right angles to the Y-axis (Yr) of the recipient table placed on the stone platform 2 (G2) different from G1, and is parallel to the X-axis (Xd) of the donor table. In addition, the laser light before entering the shaping optical system is adjusted by the telescope optical system into substantially the same shape (roughly 25×25 [mm] (vertical×horizontal, FWHM)) regardless of the movement of Xo.

The X-axis (Xd) of the donor table is suspended below G1, and the Y-axis (Yd) of the donor table is also suspended. In addition, there is a rotation adjustment mechanism between them. In FIG. 2B , the side view shows the case where Xo and Xd move the same distance relative to G1. Thereby, the position of Xo and Xd in the X-axis direction with respect to Yd can be changed without changing the relative position of Xo and Xd on the X-axis. In addition, in FIG. 2C , a side view shows a case where only Xo moves relative to G1 . Thereby, the relative positions of Xd and Xo on the X-axis can be changed.

The details of the field lens (F), the mask (M) and the projection lens (Pl) as other reduction projection optical systems are the same as those in Embodiment 1. The laser light emitted from the projection lens is incident from the back surface of the donor substrate, and is The reduced size of 1/5 of the pattern drawn on the mask is accurately projected toward the transfer object formed on the surface (lower surface) of the mask. In addition, imaging on the surface of the donor substrate was performed with a confocal beam profiler in the same manner as in Example 1.

Based on the mask pattern that reduces the projection of the transfer target object arranged on the surface of the donor substrate as described above, when the transfer target object is transferred to the opposite acceptor substrate, the donor substrate and the acceptor How the substrate is scanned and how the transfer object is transferred to the receptor substrate are the same as in Figures 6, 10, 11 and 13A to 13C. In addition, the Y-axis (Yr) of the receptor stage and the supply The position synchronization accuracy of the movement of the Y-axis (Yd) of the body table is the same as that shown in FIG. 12 described in the first embodiment.

In addition, the method for adjusting the parallelism between the Y axes and the parallelism between the X axes of each stage and the perpendicularity between the Y axes and the X axes is the same as in the third embodiment. That is, the Y-axis (Yr) of the receptor table with linearity adjustment is used as the reference for adjustment, and the relationship between Yr and the slave platform 1 (G1) is observed using a high-magnification CCD camera fixed on the Z-axis (Zr) of the receptor table. ) The verticality of the X-axis (Xd) of the suspended donor table is adjusted through the rotation adjustment mechanism (RP) between G1 and Xd. In addition, the parallelism between the Y axis (Yd) and Yr of the donor table suspended on the adjusted Xd was observed with the same high-magnification CCD camera, and adjusted by the RP between Xd and Yd. Finally, the perpendicularity of the optical table (Xo) and Yr is observed through the high-magnification CCD that moves together with Xo, and adjusted through the RP between G1 and Xo.

[Industrial Applicability]

The present invention can be utilized as a display manufacturing device.

Claims (17)

1. A transfer device selectively peels an object on a surface of a moving donor substrate by irradiating the object on the surface with a pulsed laser from a back surface of the donor substrate, and transfers the object onto a recipient substrate moving on an opposite side to the donor substrate,

The transfer device is characterized in that,

the transfer device includes:

a pulsed laser device;

the length of the telescope is chosen to be the same, the pulse laser emitted from the laser device is made to be parallel light;

a shaping optical system for shaping the spatial intensity distribution of the pulse laser passing through the telescope into uniform distribution;

a mask for passing the pulse laser beam shaped by the shaping optical system in a predetermined pattern;

a field lens located between the shaping optical system and the mask;

a projection lens for reducing and projecting the pulse laser light having passed through the pattern of the mask on the surface of the donor substrate;

a mask table for holding the field lens and the mask;

an optical stage holding the shaping optical system, the mask stage, and the projection lens;

a donor stage for holding the donor substrate with an orientation such that a back surface of the donor substrate is an incident side of the pulse laser;

a receptor stage holding the receptor substrate; and

a programmable multi-axis control device having a trigger output function and a stage control function for the pulse laser oscillation,

the receptor table has a Y axis when the horizontal plane is an XY plane, a Z axis in the vertical direction, and a theta axis in the XY plane,

The donor station has an X-axis, a Y-axis and a theta-axis,

the projection lens is held on the optical stage together with a Z-axis stage for the projection lens,

the telescope, the shaping optical system, the field lens, the mask and the projection lens constitute a reduction projection optical system which reduces and projects a pattern of the mask on a surface of the donor substrate,

the X-axis of the donor station is disposed on a first stage,

the Y-axis of the receptor stage is disposed on a second stage different from the first stage,

the Y-axis of the donor table is suspended and arranged on the X-axis of the donor table.

2. The transfer device of claim 1, wherein the transfer device comprises a plurality of sensors,

the X-axis of the donor station is placed on the first stage,

the optical stage is placed on the X-axis of the donor stage.

3. The transfer device of claim 1, wherein the transfer device comprises a plurality of sensors,

the optical bench is placed on the first stage,

the X-axis of the donor table is suspended and arranged on the first platform.

4. The transfer device of claim 1, wherein the transfer device comprises a plurality of sensors,

the X-axis of the donor station is mounted on the first stage,

the optical bench is placed on a third platform different from both the first platform and the second platform.

5. The transfer device according to claim 1, wherein a rotation adjustment mechanism for fine-adjusting a setting angle in an XY plane between the X axis of the donor stage and the first stage is provided between the X axis of the donor stage and the first stage, A rotation adjustment mechanism for finely adjusting a setting angle in an XY plane between an X axis of the donor table and a Y axis of the donor table is provided between the two.

6. The transfer apparatus according to claim 2, wherein a rotation adjustment mechanism for fine-adjusting a setting angle in an XY plane between the X axis of the donor table and the first stage is provided between the X axis of the donor table and the optical stage, a rotation adjustment mechanism for fine-adjusting a setting angle in an XY plane between the X axis of the donor table and the optical stage is provided between the X axis of the donor table and the Y axis of the donor table, and a rotation adjustment mechanism for fine-adjusting a setting angle in an XY plane between the two is provided between the X axis of the donor table and the Y axis of the donor table.

7. A transfer device according to claim 3, wherein a rotation adjustment mechanism for fine-adjusting a setting angle in an XY plane between the X axis of the donor table and the first stage is provided between the optical table and the first stage, a rotation adjustment mechanism for fine-adjusting a setting angle in an XY plane between the two is provided between the X axis of the donor table and the Y axis of the donor table, and a rotation adjustment mechanism for fine-adjusting a setting angle in an XY plane between the two is provided between the X axis of the donor table and the Y axis of the donor table.

8. The transfer apparatus according to claim 4, wherein a rotation adjustment mechanism for fine-adjusting a setting angle in an XY plane between the X axis of the donor table and the first stage is provided between the optical table and the third stage, and a rotation adjustment mechanism for fine-adjusting a setting angle in an XY plane between the X axis of the donor table and the Y axis of the donor table is provided between the X axis of the donor table and the Y axis of the donor table.

9. Transfer device according to any one of claims 1 to 8, wherein the laser device is an excimer laser.

10. The transfer device of claim 9, wherein the transfer device comprises a pulse shutter that cuts off any pulse train of laser pulses emitted from the excimer laser.

11. The transfer apparatus according to claim 10, wherein the programmable multi-axis control device has a function of simultaneously controlling at least a Y-axis of the acceptor station and a Y-axis of the donor station, and includes a device for correcting the movement position error using two-dimensional distribution correction value data prepared in advance for correcting the movement position error of the station.

12. The transfer device of claim 11, wherein the transfer device comprises a plurality of sensors,

a high magnification camera to monitor the position of the donor substrate is disposed on the Z axis of the acceptor station,

the high magnification camera that monitors the position of the acceptor substrate is either provided on the X-axis of the donor stage or a portion that moves with the X-axis of the donor stage, or provided on the optical stage or a portion that moves with the optical stage.

13. The transfer device of claim 12, wherein the donor and acceptor stations include a gap sensor that measures a gap of a surface of the donor substrate from a surface of the acceptor substrate.

14. The transfer apparatus according to claim 13, wherein the Y-axis of the acceptor station and the Y-axis of the donor station each include a position measuring device using a laser interferometer.

15. The transfer device of claim 14, wherein the transfer device comprises a confocal beam profiler having a focal plane at a location conjugate to a location where the pattern of the mask is demagnified projected and imaged by the projection lens.

16. A method for using a transfer device is characterized in that,

the transfer device is the transfer device of claim 13,

the gap sensor is used to measure the bending amount of the donor substrate in advance together with the XY position information of the donor substrate, and the gap between the donor substrate and the acceptor substrate is corrected while adjusting the Z axis of the acceptor stage or the Z axis stage of the projection lens based on the two-dimensional distribution data of the bending amount obtained by the measurement.

17. A method for adjusting a transfer device according to any one of claims 5 to 8, wherein the transfer device is a method for adjusting parallelism between a Y-axis of the acceptor station and a Y-axis of the donor station in a step of assembling the transfer device,

the adjustment method of the transfer device includes the following steps in order, based on the Y axis of the receptor table, in which the straightness adjustment is performed together with the Z axis and the θ axis of the receptor table:

adjusting the perpendicularity between the Y axis of the acceptor station and the X axis of the donor station by a rotation adjusting mechanism positioned between the first stage and the X axis of the donor station;

Synchronizing and advancing the Y-axis of the donor stage and the Y-axis of the acceptor stage suspended from the X-axis of the donor stage with the verticality adjusted, and observing an alignment mark on the Y-axis of the opposing donor stage by a high magnification camera mounted on a position moving together with the Y-axis of the acceptor stage; and

based on the observation result, the parallelism of the Y axis of the acceptor station and the Y axis of the donor station is adjusted by a rotation adjustment mechanism between the X axis of the donor station and the Y axis of the donor station.