CN112435918A - Semiconductor material's belt cleaning device - Google Patents
Semiconductor material's belt cleaning device Download PDFInfo
- Publication number
- CN112435918A CN112435918A CN202011457576.2A CN202011457576A CN112435918A CN 112435918 A CN112435918 A CN 112435918A CN 202011457576 A CN202011457576 A CN 202011457576A CN 112435918 A CN112435918 A CN 112435918A
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- cleaning
- semiconductor material
- driving
- circulating
- shaft
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- 238000004140 cleaning Methods 0.000 title claims abstract description 165
- 239000000463 material Substances 0.000 title claims abstract description 132
- 239000004065 semiconductor Substances 0.000 title claims abstract description 83
- 239000007788 liquid Substances 0.000 claims abstract description 36
- 238000003756 stirring Methods 0.000 claims abstract description 24
- 238000003860 storage Methods 0.000 claims abstract description 13
- 230000000737 periodic effect Effects 0.000 claims abstract description 6
- 238000005086 pumping Methods 0.000 claims abstract description 4
- 238000005096 rolling process Methods 0.000 claims abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 42
- 230000005540 biological transmission Effects 0.000 claims description 27
- 238000005406 washing Methods 0.000 claims description 13
- 239000007921 spray Substances 0.000 claims description 6
- 230000007306 turnover Effects 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 4
- 238000005201 scrubbing Methods 0.000 claims description 4
- 230000003116 impacting effect Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 5
- 239000002245 particle Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The invention discloses a cleaning device for semiconductor materials, which comprises: the cleaning box can clean the semiconductor materials in a layered manner in the height direction; the bottom of the cleaning box is provided with a vibrating plate; the vibrating plate is elastically arranged at the bottom of the cleaning box; the liquid storage tank is used for storing cleaning liquid and pumping the cleaning liquid into the cleaning tank through the pump body so as to realize that the semiconductor material is washed by the circumferential array in a layered manner; the circulating material shifting cylinder is in a thin plate-shaped cylindrical shape, the top and the bottom of the circulating material shifting cylinder are open, and a plurality of material shifting rods are arranged on the circumferential inner side wall of the circulating material shifting cylinder; the cleaning pipeline components are distributed on the inner side wall of the cleaning box in an annular array; the cleaning roller assembly is positioned at the bottom of the cleaning box and is used for realizing rolling cleaning on the semiconductor material; the driving part can simultaneously control the circulating material poking cylinder and the cleaning roller assembly to synchronously rotate; a vibration unit generating periodic vibration to the vibration plate; the overturning and position replacement of the semiconductor material are realized by matching with the material stirring rod; the semiconductor material is washed more cleanly and more thoroughly, and the cleaning efficiency and the cleaning effect are improved.
Description
Technical Field
The invention relates to the field of cleaning devices, in particular to a cleaning device for semiconductor materials.
Background
In the existing semiconductor material manufacturing process, various organic compounds, metal impurities, particles and the like are attached to the surface of a semiconductor material, the cleanliness of the surface of the semiconductor material is one of important factors influencing the reliability of a semiconductor device, and the performance and the qualification rate of the semiconductor device are greatly reduced if the semiconductor material is not cleaned, so that 20% of steps in the semiconductor device manufacturing process are cleaning of the semiconductor material, removing pollutants such as the organic compounds, the metal impurities, the particles and the like attached to the surface of the semiconductor material, and improving the performance and the qualification rate of the semiconductor device.
However, in the process of implementing the technical solution of the invention in the embodiments of the present application, the inventors of the present application find that the above-mentioned technology has at least the following technical problems:
in the existing cleaning process, a wafer is usually soaked or washed by using liquid chemicals such as acid-base organic matters and the like to achieve the purposes of cleaning surface particles, removing reaction polymers, etching surface film layers and the like, and after the chemical liquid is used for cleaning the surface particles of the wafer, the chemical liquid is usually washed and removed by using deionized water.
However, the existing cleaning container has a relatively simple structure, the cleaning quality of many existing cleaning devices is not high, the cleaning efficiency is low, and the cost is increased. The mode of only relying on circulating water to wash is comparatively single, and it is located inside semiconductor material and can not get good washing after range upon range of the placing for the lower cleaning performance of cleaning efficiency is poor defect such as. Therefore, effective solutions to solve the above problems need to be proposed.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a cleaning device for semiconductor materials, which is relatively simple in structure, low in cleaning quality and low in cleaning efficiency and increases cost. The mode of only relying on the circulating water to wash is comparatively single, and it is located inside semiconductor material and can not get good washing after range upon range of the placing for the problem of the lower cleaning performance of cleaning efficiency subalternation defect.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides a cleaning device for semiconductor materials, which comprises:
a cleaning tank capable of cleaning the semiconductor material in layers in a height direction; the bottom of the cleaning box is provided with a vibrating plate; the vibration plate is elastically arranged at the bottom of the cleaning box;
the liquid storage tank is used for storing cleaning liquid and pumping the cleaning liquid into the cleaning tank through the pump body so as to realize that the semiconductor material is washed by the circumferential array in a layered manner;
the circulating material shifting cylinder is in a thin plate-shaped cylindrical shape, the top and the bottom of the circulating material shifting cylinder are open, and a plurality of material shifting rods are arranged on the circumferential inner side wall of the circulating material shifting cylinder;
the cleaning pipeline components are distributed on the inner side wall of the cleaning box in an annular array;
the cleaning roller assembly is positioned at the bottom of the cleaning box and is used for realizing rolling cleaning on the semiconductor material;
the driving part can simultaneously control the circulating material poking cylinder and the cleaning roller assembly to synchronously rotate;
a vibration unit that generates periodic vibration of the vibration plate; the material poking rod is matched to realize the overturning and position replacement of the semiconductor material;
the cleaning liquid passes through the liquid storage tank and the cleaning pipeline assembly to realize the comprehensive covering and cleaning of the semiconductor materials in the circulating material stirring barrel, meanwhile, high-pressure water flow plays a role in impacting and scrubbing through the surface in contact with the semiconductor materials, the cleaning roller assembly and the vibration assembly are matched to enable the semiconductor materials in the circulating material stirring barrel to shake, and when the semiconductor materials are washed, the semiconductor materials in the circulating material stirring barrel can turn over and slide to a certain extent by utilizing the circulating impact of water and combining the regular vibration of the vibration assembly, so that the high-speed cleaning of the semiconductor materials is completed.
In this embodiment, the pump body is arranged between the cleaning tank and the liquid storage tank;
the bottom of liquid reserve tank just is close to the one end of the pump body is equipped with the outlet pipe, the one end of outlet pipe is passed through the flange and is fixed on the outer wall of liquid reserve tank, the other end of outlet pipe with the end fixed connection that intakes of the pump body, the pipeline of the play water end of the pump body with wash incasement portion wash the pipeline subassembly and link up mutually.
In this embodiment, the cleaning pipeline assembly comprises a water inlet pipe and high-pressure nozzles arranged on the water inlet pipe at equal intervals;
the inner diameter of the water inlet pipe is distributed in a step shape along the water outlet direction;
the high-pressure spray head is arranged at the water outlet of each section of the water inlet pipe.
In this embodiment, the driving part includes a fixing seat disposed outside the cleaning box, a driving motor fixed on the fixing seat, a cleaning shaft fixedly connected to a transmission shaft of the driving motor, a driving transmission gear sleeved on the cleaning shaft, a driven transmission gear sleeved on the driven shaft and engaged with the driving transmission gear, and a gear driving assembly for driving the circulating material-stirring cylinder to rotate;
the driving motor drives the driving transmission gear and is meshed with the driven transmission gear to rotate, and then the gear driving assembly is driven to rotate and drives the circulating material stirring cylinder and the cleaning roller assembly to synchronously rotate.
In this embodiment, the vibration assembly includes a fixing base having a groove, a power member, a cam in power connection with a driving shaft of the power member, and a driving link having one end hinged to the other end of the fixing base through a pin;
and a screw bearing is arranged at one end of the driving connecting rod, which is attached to the cam.
In this embodiment, be equipped with trapezoidal breach on the fixing base, the bottom of drive connecting rod be equipped with diapire fixed connection's in the trapezoidal breach spring.
In this embodiment, be equipped with the drain pipe on the lateral wall of washing case.
In this embodiment, a box door is arranged above the opening, and the box door is hinged to the cleaning box through a hinge.
In this embodiment, the gear driving assembly includes a first gear sleeved on the driven shaft and a second gear sleeved on a fixed shaft connected to the circulating material shifting cylinder.
In this embodiment, the cleaning roller assembly comprises a cleaning brush roller sleeved on the cleaning shaft and a bracket roller fixedly connecting the cleaning brush roller and the cleaning shaft;
the cleaning brush roller is fixed with a rotary brush.
The invention has the beneficial effects that:
the invention provides a cleaning device for semiconductor materials; the method at least has the following beneficial effects:
(1) the pump body rapidly pumps water in the liquid storage tank into the cleaning tank through a pipeline, and as the water pipe is communicated with the cleaning pipeline assembly, water flow enters the cleaning pipeline assembly and is uniformly sprayed into the circulating material stirring barrel through the high-pressure spray head; further, a vibration assembly generating periodic vibration to the vibration plate; the overturning and position replacement of the semiconductor material are realized by matching with the material stirring rod; furthermore, the vibration component comprises a fixed seat with a groove, a power part, a cam in power connection with a driving shaft of the power part, and a driving connecting rod, wherein one end of the driving connecting rod is hinged to the other end of the fixed seat through a pin shaft; one end of the driving connecting rod, which is attached to the cam, is provided with a screw bearing; in addition, a trapezoidal notch is arranged on the fixed seat, and a spring fixedly connected with the inner bottom wall of the trapezoidal notch is arranged at the bottom of the driving connecting rod; the purpose of the spring is to improve the stability and the safety of the circulating material poking cylinder;
(2) in addition, one end of the cam is rotatably arranged on the fixed seat through a rotating shaft, one end of the rotating shaft protrudes out of the fixed seat and is fixedly connected with an output shaft of the motor through a coupler, the other end of the rotating shaft penetrates through the fixed seat and extends to one side wall of the cleaning box, and is fixed on the side wall through a bearing seat, the rotating shaft is fixed on the bearing seat and is fixedly connected with an internal bearing, and the transmission stability of the driving cam when the rotating shaft rotates is ensured; the driving motor drives the driving transmission gear and is meshed with the driven transmission gear to rotate, so that the gear driving assembly is driven to rotate and the circulating material stirring barrel and the cleaning roller assembly are driven to synchronously rotate; the cam continuously rotates to transmit motion to the screw bearing moving close to the edge of the cam, the drive connecting rod is driven to swing along the pin shaft, when the cam rotates, the drive connecting rod is forced to swing, semiconductor materials in the circulating material stirring barrel are made to shake along with the drive connecting rod, when the cam washes the semiconductor materials, the circulating impact of water is utilized to combine the regular vibration of the filtering roller, the semiconductor materials inside the cam can be made to overturn and slide to a certain degree, the semiconductor materials are made to wash cleaner, the cleaning is more thorough, and the cleaning efficiency and the cleaning effect are improved.
Drawings
Fig. 1 is a schematic front view of a semiconductor material cleaning apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic perspective view of a cleaning roller assembly provided in accordance with an embodiment of the present invention;
fig. 3 is a schematic top view of a cleaning roller assembly according to an embodiment of the present invention.
In the figure:
Detailed Description
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
1-2, an apparatus for cleaning semiconductor material, comprising:
a cleaning tank 1, wherein the cleaning tank 1 can perform layered cleaning on the semiconductor material in the height direction; the bottom of the cleaning box 1 is provided with a vibrating plate 11; the vibrating plate 11 is elastically arranged at the bottom of the cleaning box 1;
the liquid storage tank 2 is used for storing cleaning liquid and pumping the cleaning liquid into the cleaning tank 1 through the pump body 3 to realize that the semiconductor material is washed by the circumferential array in a layered manner;
the circulating material shifting cylinder 4 is in a thin plate cylindrical shape, the top and the bottom of the circulating material shifting cylinder are open, and a plurality of material shifting rods 41 are arranged on the circumferential inner side wall of the circulating material shifting cylinder;
the cleaning pipeline components 5 are distributed on the inner side wall of the cleaning box 1 in an annular array;
the cleaning roller assembly 6 is positioned at the bottom of the cleaning box 1 and is used for realizing rolling cleaning on the semiconductor material;
the driving part 7 can simultaneously control the circulating material poking cylinder 4 and the cleaning roller assembly 6 to synchronously rotate;
a vibration unit 8 that generates periodic vibration of the vibration plate 11; and the material stirring rod 41 is matched to realize the turnover and position replacement of the semiconductor material;
cleaning liquid is through liquid reserve tank 2 and through washing pipeline subassembly 5 realize dialling the semiconductor material in the material barrel 4 to the circulation and cover the washing comprehensively, high-pressure rivers play the effect of impact and scrubbing through the surface with the semiconductor material contact simultaneously, and cooperation cleaning roller subassembly 6 and vibration subassembly 8 make the semiconductor material in the material barrel 4 is dialled in the circulation also shake thereupon, when washing, the circulation striking of utilizing water combines the regular vibration of vibration subassembly 8, make inside semiconductor material can produce certain upset and slide, and then accomplish semiconductor material's high-speed washing.
Further, a pump body 3 is arranged between the cleaning tank 1 and the liquid storage tank 2;
the bottom of liquid reserve tank 2 and the one end that is close to the pump body 3 are equipped with outlet pipe 21, and the flange is passed through to the one end of outlet pipe 21 and is fixed on the outer wall of liquid reserve tank 2, and the other end of outlet pipe 21 and the end fixed connection that intakes of the pump body 3, the pipeline of the play water end of the pump body 3 link up with the washing pipeline subassembly 5 of wasing 1 inside mutually.
Further, the cleaning pipeline assembly 5 comprises a water inlet pipe 51 and high-pressure nozzles 52 which are arranged on the water inlet pipe 51 at equal intervals;
the inner diameter of the water inlet pipe 51 is distributed in a step shape along the water outlet direction;
the water outlet of each section of the water inlet pipe 51 is provided with a high-pressure spray nozzle 52.
Specifically, the flow rate of the high-pressure water flow in the water inlet pipe 51 can be ensured to be relatively uniform, the speed of the flushing liquid at the high-pressure nozzle 52 is ensured to be approximately the same, and the cleaning effect is improved.
Further, the driving part 7 comprises a fixed seat 71 arranged outside the cleaning box 1, a driving motor 72 fixed on the fixed seat 71, a cleaning shaft 73 fixedly connected with a transmission shaft of the driving motor 72, a driving transmission gear 74 sleeved on the cleaning shaft 73, a driven shaft 75, a driven transmission gear 76 sleeved on the driven shaft 75 and meshed with the driving transmission gear 74, and a gear driving component 77 for driving the circulating material-stirring cylinder 4 to rotate;
the driving motor 72 drives the driving transmission gear 74 and engages the driven transmission gear 76 to rotate, so as to drive the gear driving assembly 77 to rotate and drive the circulating material poking cylinder 4 and the cleaning roller assembly 6 to synchronously rotate.
Further, the vibration assembly 8 comprises a fixed seat 81 with a groove, a power piece 82, a cam 83 in power connection with a driving shaft of the power piece 82, and a driving connecting rod 84 with one end hinged to the other end of the fixed seat 81 through a pin shaft;
one end of the driving connecting rod 84, which is attached to the cam 82, is provided with a screw bearing 9.
Furthermore, a trapezoidal notch 811 is disposed on the fixing seat 81, and a spring 10 fixedly connected with the bottom wall of the trapezoidal notch 811 is disposed at the bottom of the driving link 84. The purpose of the spring 10 is to improve the stability and safety of the circulating stripping cylinder 4.
Further, a drain pipe 11 is provided on one side wall of the cleaning tank 1. The drain pipe 11 may discharge the water remaining in the washing tank 1 to the external drain pipe.
Furthermore, a box door 12 is arranged above the opening, and the box door 12 is hinged with the cleaning box 1 through a hinge.
Further, the gear driving assembly 77 includes a first gear 771 disposed on the driven shaft 75, and a second gear 772 disposed on the fixed shaft connected to the material circulating and stirring cylinder 4.
Further, the cleaning roller assembly 6 comprises a cleaning brush roller 61 sleeved on the cleaning shaft 73 and a bracket roller 62 fixedly connecting the cleaning brush roller 61 and the cleaning shaft 73;
the cleaning brush roller 61 is fixed with a rotating brush. The semiconductor material is washed by covering the whole surface, so that residues attached to the semiconductor material are thoroughly washed, and the quality of the semiconductor material is ensured.
In the above embodiment, specifically, the box door 12 is firstly opened to lay the semiconductor material in the circulating material shifting cylinder 4, wherein the box door 12 can add the semiconductor material into the cleaning box 1 for cleaning, and the hinge connection mode is adopted, so that the structure is simple and reliable. Wherein the liquid storage tank 2 is fixed on the mobile cart, the pump body 3 is also fixed on the fixing plate on the mobile cart, the pump body 3 is positioned between the liquid storage tank 2 and the cleaning water tank 1 when viewed from the horizontal direction, and meanwhile, the pump body 3 and the motor (not shown in the drawing) are communicated, so that the pump body 3 and the motor both work normally, the pump body 3 pumps the water in the liquid storage tank 2 to the cleaning tank 1 rapidly through a pipeline, as the water pipe is communicated with the cleaning pipeline assembly 5, the fed water flow enters the cleaning pipeline assembly 5 and is uniformly sprayed to the circulating material stirring barrel 4 through the high-pressure spray head 52, as the material stirring rods 41 distributed in a circular array are arranged on the outer circular wall of the circulating material stirring barrel 4 and along the length direction of the circulating material stirring barrel 4, the semiconductor material in the circulating material stirring barrel 4 can be completely covered, stirred and returned, and simultaneously, the high-pressure water flow plays a role of impacting and scrubbing through the surface contacted with the semiconductor material, thereby completing the high-speed cleaning of the semiconductor material; a vibration unit 8 for generating periodic vibration to the vibration plate 11; and the material stirring rod 41 is matched to realize the turnover and position replacement of the semiconductor material; more specifically, the vibration assembly 8 includes a fixing seat 81 having a groove, a power member 82, a cam 83 in power connection with a driving shaft of the power member 82, and a driving link 84 having one end hinged to the other end of the fixing seat 81 through a pin; one end of the driving connecting rod 84, which is attached to the cam 82, is provided with a screw bearing 9. In addition, a trapezoidal notch 811 is formed on the fixing seat 81, and a spring 10 fixedly connected with the inner bottom wall of the trapezoidal notch 811 is arranged at the bottom of the driving link 84. The purpose of the spring 10 is to improve the stability and safety of the circulating stripping cylinder 4.
One end of the cam 83 is rotatably disposed on the fixing seat 81 through a rotating shaft, wherein one end of the rotating shaft protrudes out of the fixing seat 81 and is fixedly connected with the output shaft of the motor through a coupler, the other end of the rotating shaft penetrates through the fixing seat 81 and extends to one side wall of the cleaning box 1, the driving part 7 comprises a fixed seat 71 arranged outside the cleaning box 1, a driving motor 72 fixed on the fixed seat 71, a cleaning shaft 73 fixedly connected with a transmission shaft of the driving motor 72, a driving transmission gear 74 sleeved on the cleaning shaft 73, a driven shaft 75, a driven transmission gear 76 sleeved on the driven shaft 75 and meshed with the driving transmission gear 74, and a gear driving component 77 for driving the circulating material stirring cylinder 4 to rotate; the driving motor 72 drives the driving transmission gear 74 and engages the driven transmission gear 76 to rotate, so as to drive the gear driving assembly 77 to rotate and drive the circulating material poking cylinder 4 and the cleaning roller assembly 6 to synchronously rotate. The cam 83 continuously rotates to transmit motion to the screw bearing 9 moving close to the edge of the cam, 84 driving connecting rods are driven to swing along the pin shaft, when the cam 83 rotates, the driving connecting rods 84 are forced to swing, semiconductor materials in the circulating material stirring barrel body 1 can shake along with the driving connecting rods, when the semiconductor materials are washed, the circulating impact of water is combined with the regular vibration of the filtering roller 4, the semiconductor materials inside the semiconductor materials can turn over and slide to a certain degree, the semiconductor materials are washed more cleanly, the washing is more thorough, and the washing efficiency and the washing effect are improved.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the invention. The present invention is not to be limited by the specific embodiments disclosed herein, and other embodiments that fall within the scope of the claims of the present application are intended to be within the scope of the present invention.
Claims (10)
1. A cleaning device for semiconductor materials is characterized in that: the method comprises the following steps:
a cleaning tank (1), wherein the cleaning tank (1) can clean semiconductor materials in a layered manner in the height direction; the bottom of the cleaning box (1) is provided with a vibrating plate (11); the vibration plate (11) is elastically arranged at the bottom of the cleaning box (1);
the liquid storage tank (2) is used for storing cleaning liquid and pumping the cleaning liquid into the cleaning tank (1) through the pump body (3) to realize that the semiconductor material is washed by the circumferential array in a layered manner;
the circulating material shifting cylinder (4) is in a thin plate-shaped cylindrical shape, the top and the bottom of the circulating material shifting cylinder are open, and a plurality of material shifting rods (41) are arranged on the circumferential inner side wall of the circulating material shifting cylinder;
the cleaning pipeline components (5) are distributed on the inner side wall of the cleaning box (1) in an annular array;
the cleaning roller assembly (6) is positioned at the bottom of the cleaning box (1) and is used for realizing rolling cleaning on the semiconductor materials;
the driving part (7) can simultaneously control the circulating material poking cylinder (4) and the cleaning roller assembly (6) to synchronously rotate;
a vibration unit (8) that generates periodic vibration to the vibration plate (11); the material poking rod (41) is matched to realize the turnover and position replacement of the semiconductor material;
cleaning liquid passes through the liquid storage tank (2) and passes through the cleaning pipeline assembly (5) to realize that the semiconductor material in the circulating material stirring barrel (4) is comprehensively covered and cleaned, high-pressure water flow plays a role in impacting and scrubbing through the surface in contact with the semiconductor material, the cleaning roller assembly (6) and the vibration assembly (8) are matched to enable the semiconductor material in the circulating material stirring barrel (4) to shake, and the cleaning liquid utilizes the circulating impact of water to combine the regular vibration of the vibration assembly (8) during washing so that the semiconductor material in the cleaning roller assembly can turn over and slide to a certain extent, and further the high-speed cleaning of the semiconductor material is completed.
2. A cleaning apparatus for semiconductor material as claimed in claim 1, wherein:
the pump body (3) is arranged between the cleaning tank (1) and the liquid storage tank (2);
the bottom of liquid reserve tank (2) just is close to the one end of the pump body (3) is equipped with outlet pipe (21), the one end of outlet pipe (21) is passed through the flange and is fixed on the outer wall of liquid reserve tank (2), the other end of outlet pipe (21) with the end fixed connection of intaking of the pump body (3), the pipeline of the play water end of the pump body (3) with wash inside case (1) wash pipeline subassembly (5) and link up mutually.
3. A cleaning apparatus for semiconductor material as claimed in claim 1, wherein:
the cleaning pipeline assembly (5) comprises a water inlet pipe (51) and high-pressure spray heads (52) which are arranged on the water inlet pipe (51) at equal intervals;
the inner diameter of the water inlet pipe (51) is distributed in a stepped manner along the water outlet direction;
the high-pressure spray head (52) is arranged at the water outlet of each section of the water inlet pipe (51).
4. A cleaning apparatus for semiconductor material as claimed in claim 1, wherein:
the driving part (7) comprises a fixed seat (71) arranged on the outer side of the cleaning box (1), a driving motor (72) fixed on the fixed seat (71), a cleaning shaft (73) fixedly connected with a transmission shaft of the driving motor (72), a driving transmission gear (74) sleeved on the cleaning shaft (73), a driven shaft (75), a driven transmission gear (76) sleeved on the driven shaft (75) and meshed with the driving transmission gear (74), and a gear driving assembly (77) for driving the circulating material stirring barrel (4) to rotate;
the driving motor (72) drives the driving transmission gear (74) and is meshed with the driven transmission gear (76) to rotate, and then the gear driving assembly (77) is driven to rotate and drive the circulating material poking cylinder body (4) and the cleaning roller assembly (6) to synchronously rotate.
5. A cleaning apparatus for semiconductor material as claimed in claim 1, wherein:
the vibration component (8) comprises a fixed seat (81) with a groove, a power part (82), a cam (83) in power connection with a driving shaft of the power part (82), and a driving connecting rod (84) with one end hinged to the other end of the fixed seat (81) through a pin shaft;
and a screw bearing (9) is arranged at one end of the driving connecting rod (84) which is attached to the cam (82).
6. An apparatus for cleaning semiconductor material as defined in claim 5, wherein:
the fixing seat (81) is provided with a trapezoidal notch (811), and the bottom of the driving connecting rod (84) is provided with a spring (10) fixedly connected with the inner bottom wall of the trapezoidal notch (811).
7. A cleaning apparatus for semiconductor material as claimed in claim 1, wherein:
a drain pipe (11) is arranged on one side wall of the cleaning box (1).
8. A cleaning apparatus for semiconductor material as claimed in claim 1, wherein:
a box door (12) is arranged above the opening, and the box door (12) is hinged to the cleaning box (1) through a hinge.
9. An apparatus for cleaning semiconductor material as defined in claim 5, wherein:
the gear driving assembly (77) comprises a first gear (771) sleeved on the driven shaft (75) and a second gear (772) sleeved on a fixed shaft connected with the circulating material shifting cylinder (4).
10. A cleaning apparatus for semiconductor material as claimed in claim 1, wherein:
the cleaning roller assembly (6) comprises a cleaning brush roller (61) sleeved on the cleaning shaft (73) and a bracket roller (62) fixedly connecting the cleaning brush roller (61) and the cleaning shaft (73);
the cleaning brush roller (61) is fixed with a rotating brush.
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| CN202011457576.2A CN112435918A (en) | 2020-12-10 | 2020-12-10 | Semiconductor material's belt cleaning device |
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| CN202011457576.2A CN112435918A (en) | 2020-12-10 | 2020-12-10 | Semiconductor material's belt cleaning device |
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| CN112435918A true CN112435918A (en) | 2021-03-02 |
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| CN202011457576.2A Pending CN112435918A (en) | 2020-12-10 | 2020-12-10 | Semiconductor material's belt cleaning device |
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