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CN112464358A - Method, device, terminal and medium for evaluating environmental temperature of carrier rocket equipment - Google Patents

Method, device, terminal and medium for evaluating environmental temperature of carrier rocket equipment Download PDF

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CN112464358A
CN112464358A CN202011166871.2A CN202011166871A CN112464358A CN 112464358 A CN112464358 A CN 112464358A CN 202011166871 A CN202011166871 A CN 202011166871A CN 112464358 A CN112464358 A CN 112464358A
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CN112464358B (en
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丁晨
李炳蔚
张子骏
余慕春
牛智玲
王尧
孙静怡
马靓
徐子健
王亮
年永尚
丛恩博
孙晓峰
龚旻
张东
刘凯
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China Academy of Launch Vehicle Technology CALT
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Abstract

本申请实施例提供一种运载火箭设备的环境温度的评估方法、装置、终端及介质，涉及火箭装备环境工程技术。所述运载火箭设备的环境温度的评估方法，包括：获取运载火箭飞行时舱外热环境参数；根据所述舱外热环境参数及预先建立的热网络模型确定设备内等效模块的模块内节点环境温度；根据元器件降额要求及所述模块内节点温度对设备的环境温度进行评估。本申请能降低全箭热网络建模与求解复杂程度，加快温升预示速度，提高研制效率，节约研制成本。

Figure 202011166871

Embodiments of the present application provide a method, device, terminal and medium for evaluating the ambient temperature of launch vehicle equipment, which relate to rocket equipment environmental engineering technology. The method for evaluating the ambient temperature of the launch vehicle equipment includes: acquiring extravehicular thermal environment parameters during flight of the launch vehicle; determining in-module nodes of equivalent modules in the equipment according to the extravehicular thermal environment parameters and a pre-established thermal network model Ambient temperature: Evaluate the ambient temperature of the device according to the derating requirements of the components and the node temperature within the module. The present application can reduce the complexity of modeling and solution of the full-rocket thermal network, speed up the prediction speed of temperature rise, improve the development efficiency, and save the development cost.

Figure 202011166871

Description

Method, device, terminal and medium for evaluating environmental temperature of carrier rocket equipment
Technical Field
The application relates to a rocket equipment environmental engineering technology, in particular to an evaluation method, a device, a terminal and a medium for the environmental temperature of a carrier rocket equipment, which can be applied to the evaluation and design improvement of the environmental adaptability of the carrier rocket equipment.
Background
The rocket is subjected to environments such as vibration, impact, high temperature, low temperature, temperature impact, low air pressure and the like from launching to satellite orbit entering, the environment is complex and changes violently, the rocket equipment has the risk that the temperature exceeds the design temperature range, and the rocket reliability can be influenced if the temperature of the rocket equipment exceeds the design temperature range. In order to ensure the reliability of the rocket, the environmental adaptability of the rocket equipment needs to be evaluated in the rocket development process so as to facilitate the improvement and elimination of risks. Therefore, in the rocket development process, how to predict the equipment temperature in each cabin section becomes a problem to be solved urgently in the industry.
Disclosure of Invention
In order to solve one of the technical defects, embodiments of the present application provide a method, an apparatus, a terminal, and a medium for estimating an ambient temperature of a launch vehicle device.
An embodiment of a first aspect of the present application provides a method for evaluating an ambient temperature of a launch vehicle device, including:
acquiring the parameters of the extravehicular thermal environment during the flight of the carrier rocket;
determining the intra-module node environment temperature of an equivalent module in the equipment according to the extravehicular thermal environment parameters and a pre-established thermal network model;
and evaluating the ambient temperature of the equipment according to the derating requirement of the components and the temperature of the node in the module.
An embodiment of a second aspect of the present application provides an evaluation system for an ambient temperature of a launch vehicle device, comprising:
the acquiring module is used for acquiring the extravehicular thermal environment parameters when the carrier rocket flies;
the first processing module is used for determining the intra-module node environment temperature of the equivalent module in the equipment according to the extravehicular thermal environment parameters and a pre-established thermal network model;
and the second processing module is used for evaluating the environmental temperature of the equipment according to the derating requirement of the components and the node temperature in the module.
An embodiment of a third aspect of the present application provides a terminal, including:
a memory;
a processor; and
a computer program;
wherein the computer program is stored in the memory and configured to be executed by the processor to implement a method as claimed in any preceding claim.
A fourth aspect of the present application provides a computer-readable storage medium having a computer program stored thereon; the computer program is executed by a processor to implement a method as claimed in any preceding claim.
The embodiment of the application provides an evaluation method, an evaluation device, a terminal and a medium for the environmental temperature of a carrier rocket device. Therefore, the method and the device can reduce complexity of modeling and solving of the full rocket heat network, accelerate temperature rise prediction speed, improve development efficiency and save development cost.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
FIG. 1 is a schematic flow diagram of a method for estimating an ambient temperature of a launch vehicle apparatus according to an exemplary embodiment;
FIG. 2 is a schematic flow diagram of a method for estimating an ambient temperature of a launch vehicle apparatus according to another exemplary embodiment;
fig. 3 is a schematic structural diagram of an evaluation system for the ambient temperature of a launch vehicle device according to an exemplary embodiment.
Detailed Description
In order to make the technical solutions and advantages of the embodiments of the present application more apparent, the following further detailed description of the exemplary embodiments of the present application with reference to the accompanying drawings makes it clear that the described embodiments are only a part of the embodiments of the present application, and are not exhaustive of all embodiments. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
The rocket is subjected to environments such as vibration, impact, high temperature, low temperature, temperature impact, low air pressure and the like from launching to satellite orbit entering, the environment is complex and changes violently, and the rocket equipment has the risk that the temperature exceeds the designed temperature range, so that the reliability of the rocket is influenced. Therefore, in order to ensure the reliability of the rocket, the temperature of equipment in each cabin section needs to be predicted in the rocket development process, the environmental adaptability of the equipment on the rocket is evaluated, and the risk is eliminated through design improvement.
Because the arrow equipment integrates the degree height, and equipment kind is many, and the module is more in the equipment, and the cabin space is big to components and parts size span, adopts thermal environment analysis software to carry out equipment temperature and indicates calculation cycle length, and is with high costs, need re-modeling after the design modification, influences the development progress.
The heat network method is characterized in that typical components such as heating elements and structural parts are equivalent to nodes (the nodes have the properties of mass, specific heat capacity, heat productivity and the like), the thermal resistance between the nodes is equivalent to resistance, an interconnected heat network is established, each node can establish an energy conservation equation, and the change of the temperature of each node along with time can be predicted by solving the equation set.
The traditional heat network method has the problems of large number of heat network nodes, complex heat transfer process among the nodes, complex established heat network model, high solving difficulty, long calculation time and the like, is difficult to meet the design requirements of low cost, high reliability, rapid development and rapid iteration of the carrier rocket, and is not beneficial to the carrier rocket to quickly occupy the market.
In order to overcome the technical problems and meet the requirements of a carrier rocket for quickly predicting the temperature of equipment on the rocket in the flight process and evaluating the environmental adaptability of the equipment, the embodiment of the application provides an evaluation method, a device, a terminal and a medium of the environmental temperature of the carrier rocket equipment. Therefore, the method and the device can reduce the complexity of modeling and solving of the whole rocket heat network, accelerate the temperature evaluation speed, improve the development efficiency and save the development cost.
The function and implementation process of the method for estimating the ambient temperature of a launch vehicle device provided in this embodiment of the drawings are described as examples.
As shown in fig. 1, the method for estimating the ambient temperature of a launch vehicle device provided in this embodiment includes:
s101, acquiring extravehicular thermal environment parameters during carrier rocket flight;
s102, determining the intra-module node environment temperature of an equivalent module in the equipment according to the extravehicular thermal environment parameters and a pre-established thermal network model;
and S103, evaluating the environmental temperature of the equipment according to the derating requirement of the components and the node temperature in the module.
In step S101, the extravehicular thermal environment parameters include: the ambient heat flux density and the ambient air recovery enthalpy. The obtained extravehicular thermal environment parameters can be used as boundary conditions for determining the environment temperature of the equivalent node of the equipment. The parameters of the extravehicular thermal environment can be obtained by a conventional method, and the details of the embodiment are not repeated herein.
Before step S102, as shown in fig. 2, a thermal network model from the module layer to the whole cabin layer is established.
That is, before determining the environment temperature of the equivalent node of the device, the environment temperature of the equivalent node of the module, and the environment temperature of the node in the module, the method further includes:
and respectively establishing a module layer heat network model, an equipment layer heat network model and a whole cabin layer heat network model.
Establishing a module layer heat network model, comprising the following steps:
determining each heat network node in the module, and establishing an energy conservation equation of each node according to the heat transfer relationship and node attributes between each heat network node and other nodes; wherein the node attributes include: heat capacity, mass, surface area and heating power;
identifying thermal resistance parameters in the modular thermal network;
and (4) obtaining a module layer heat network model according to the thermal resistance parameters in the module heat network and the discretization equation of all the nodes in the module.
Establishing an equipment layer heat network model, comprising:
establishing a module equivalent node, and determining the heating power, equivalent heat capacity and equivalent heat resistance of the module equivalent node;
and taking the module equivalent node as a heat network node in the equipment, and establishing an equipment layer heat network model according to the identified thermal resistance parameter in the equipment heat network.
Establishing a whole cabin layer heat network model, comprising the following steps:
establishing an equipment equivalent node, and determining the heating power, equivalent heat capacity and equivalent heat resistance of the equipment equivalent node;
and taking the equipment equivalent node as a heat network node in the whole cabin, and establishing a heat network model of the whole cabin layer according to the identified thermal resistance parameter in the whole heat network.
Establishing a module layer thermal network model: determining thermal network nodes in the modules by taking each module of the equipment as a research object according to the design characteristics of the module structure, the circuit board and components, and establishing an energy conservation equation of each thermal network node according to the heat transfer relationship between each thermal network node and other nodes and the node attributes (including heat capacity, heating power, mass and surface area); the energy conservation equation of a certain heat network node in the module is shown as the following formula:
Figure RE-GDA0002918492240000051
in the formula, cpcRepresenting the specific heat capacity of a certain node c in the module layer; m iscRepresenting the quality of the node; t isc(t) represents the temperature value at time t of the node; t isi(t) is the temperature of the surrounding node i; rciIs the thermal conduction resistance (k/W) of the node and the node i, WcThe node generates heat power (W).
On the basis, energy conservation equations of all the nodes are connected to form a module layer heat network model.
Alternatively, taking the first thermal network node in the module as an example, the node energy conservation equation can be discretized to obtain:
Figure RE-GDA0002918492240000061
where Δ t is a time step, and Tc (t + Δ t) represents a temperature value at the (t + Δ t) th time.
And (3) obtaining a module layer heat network model by connecting discretization equations of all nodes in the module.
Thermal resistance parameters in the modular thermal network are identified. Identifying the thermal conductivity resistance may include: the heat conduction thermal resistance takes the area of the minimum cross section area on the heat conduction path as the heat conduction area, and takes the shortest heat conduction path length as the heat conduction length, thereby calculating the heat conduction thermal resistance.
And substituting the identified thermal resistance parameters in the module thermal network into the module layer thermal network model to form a module layer thermal network model capable of being solved.
And establishing module equivalent nodes. The equivalent node heating power is the sum of all the node heating powers in the module
Figure RE-GDA0002918492240000062
The heat capacity of the equivalent node is the mass-weighted heat capacity, i.e.
Figure RE-GDA0002918492240000063
Wherein N is the number of nodes, cp,i、miAnd WiThe specific heat capacity, the mass and the heating power of the ith node are respectively.
And establishing an equipment layer heat network model. And establishing an equipment layer heat network model by taking the equipment as a research object and taking each module equivalent node as a node.
Figure RE-GDA0002918492240000064
In the formula, CpsRepresenting specific heat capacity of a module node; m issRepresenting the quality of the node; t isi(T) and Ts(t) respectively representing the temperature values of the ith and the s-th nodes at the t moment; epsilon is the surface emissivity of the s node; sigma is Boltzmann constant; a. thesRepresents the surface area (m) of the node s2)；XsiRepresenting the angular coefficient, R, of the surface of node s to the surface of node isiRepresenting the thermal conductivity resistance of the node i and the node s; wsRepresenting the node heating power.
On the basis, energy conservation equations of all the nodes are connected to form an equipment layer heat network model.
A thermal resistance parameter in the device thermal network is identified. Thermal resistance parameters in the modular thermal network are identified. Wherein, identifying the thermal radiation resistance may include: the surface area of the equipment participating in radiation can be set as the sum of the surface areas exposed in the air, and the thermal radiation emissivity of the surface of the equipment is obtained by the surface material properties of the equipment. Identifying the thermal conductivity resistance may include: the heat conduction thermal resistance takes the area of the minimum cross section area on the heat conduction path as the heat conduction area, and takes the shortest heat conduction path length as the heat conduction length, thereby calculating the heat conduction thermal resistance.
And substituting the identified thermal resistance parameters in the equipment thermal network into the equipment layer thermal network model to form a solvable equipment layer thermal network model.
And establishing the equivalent nodes of the equipment layer. The process of establishing the device layer equivalent node is similar to the process of establishing the module equivalent node, and is not described herein again.
And establishing a whole-cabin heat network model of the carrier rocket.
And establishing a whole cabin layer heat network model. And establishing a whole cabin layer heat network model by taking the cabin as a research object and taking each equipment equivalent node as a node.
Figure RE-GDA0002918492240000071
In the formula, CpzRepresenting the specific heat capacity of the equipment nodes; m iszRepresenting the quality of the node; ti (t), tz (t) and Tair (t) respectively represent the temperature values of the ith node, the zth node and the air node at the t moment; ε is the surface emissivity; sigma is Boltzmann constant; a. thezRepresents the node z surface area (m 2); xziRepresenting the angular coefficient, R, of the surface of node z to the surface of node iziRepresenting the thermal conductivity resistance of the node i and the node z; h represents the convective heat transfer coefficient between equipment and the environment; wzRepresenting node heating power; n represents the number of device equivalent nodes.
And establishing a whole cabin layer heat network model by taking each equipment equivalent node as a node. The boundary of the whole cabin layer heat network model is the wall temperature.
Thermal resistance parameters in the modular thermal network are identified. Wherein, identifying the thermal radiation resistance may include: the surface area of the equipment participating in radiation can be set as the sum of the surface areas exposed in the air, and the thermal radiation emissivity of the surface of the equipment is obtained by the surface material properties of the equipment. Convective thermal resistance identification may include: the convective heat transfer coefficient of the air and the wall surface is calculated according to a formula of the natural convective heat transfer coefficient, and the convective heat transfer coefficient of the air outside the missile and the missile is obtained by a pneumatic heat calculation result. Identifying the thermal conductivity resistance may include: the heat conduction thermal resistance takes the area of the minimum cross section area on the heat conduction path as the heat conduction area, and takes the shortest heat conduction path length as the heat conduction length, thereby calculating the heat conduction thermal resistance.
In step S102, the method may specifically include:
determining the environment temperature of the equivalent node of the equipment according to the extravehicular thermal environment parameters and a pre-established whole cabin layer thermal network model;
determining the environment temperature of the equivalent node of the module according to the environment temperature of the equivalent node of the equipment and a pre-established equipment layer heat network model;
and determining the intra-module node ambient temperature of the equivalent module in the equipment according to the module equivalent node ambient temperature and a pre-established module layer thermal network model.
Optionally, determining the environment temperature of the equivalent node of the device according to the extravehicular thermal environment parameter and a pre-established whole-cabin layer thermal network model, including:
the time variation T of the temperature of the inner wall surface is determined according to the following formulawb(t)，
Figure RE-GDA0002918492240000081
Figure RE-GDA0002918492240000082
Wherein Q (t) represents the heat flux density (W/m) of the heat transfer between the external environment and the rocket cabin section in the rocket flying process2)；QC(t) representsCold wall heat flux density (W/m)2) I.e. the wall temperature is the cold wall temperature Tw(0K here) heat flux density of the environment transferring heat to the rocket pod section; h isr(t) represents the enthalpy of air recovery (J/kg); c. CpRepresents the specific heat at constant pressure of air (J/(kg. K)); t iswb(t) represents the temperature of the inner wall surface (K) at time t; t iswo(t) represents the outer wall surface temperature (K) at time t; c. CpwThe specific heat capacity (J/(kg. K)) of the wall surface structure of the cabin section is represented; rhowThe structural density of the wall surface of the cabin section; lwRepresenting the wall structure thickness (m) of the cabin section; lambda is the heat conductivity coefficient (W/(m.K)) of the wall surface of the cabin section; x is the wall thickness (m). Under thermal environmental conditions (Q)C(t)、hr(T)) is an outer boundary condition, the inner wall surface is an adiabatic boundary condition, and a value T of the change of the temperature of the inner wall surface along with time is calculated by adopting a numerical heat transfer methodwb(t)。
And determining the environment temperature of the equivalent node of the equipment by taking the time variation of the temperature of the inner wall surface as the boundary condition of the whole cabin layer heat network model.
That is, the obtained temperature of the inner wall surface is changed with time by the amount TwbAnd (t) substituting the model into a pre-established whole cabin layer heat network model so as to obtain the environment temperature of the equivalent node of the equipment.
Determining the module equivalent node environment temperature according to the equipment equivalent node environment temperature and a pre-established equipment layer heat network model, wherein the method comprises the following steps:
and determining the environment temperature of the equivalent node of each module by taking the environment temperature of the equivalent node of the equipment as the boundary condition of the equipment layer heat network model.
And substituting the obtained equipment equivalent node environment temperature into a pre-established equipment layer heat network model so as to obtain the equivalent node environment temperature of each module.
Determining the intra-module node ambient temperature of the equivalent module in the equipment according to the module equivalent node ambient temperature and a pre-established module layer thermal network model, comprising the following steps:
and determining the environment temperature of the nodes in each module by taking the environment temperature of the equivalent nodes of the module as the boundary condition of the module layer thermal network model.
And substituting the obtained equivalent node environmental temperature of each module into a pre-established module layer thermal network model so as to obtain the node environmental temperature in the module.
In step S103, environmental suitability evaluation is performed based on the obtained intra-module node temperature. Specifically, the temperature of the node in the module is analyzed, when the temperature of the node in the module is higher than the temperature corresponding to the derating requirement of the component, the abnormal environment temperature (namely the abnormal temperature rise) of the equipment is determined, and prompt information is generated and used for triggering corresponding prompts. Specifically, the prompt information may be used to trigger a visual prompt or an audio prompt, so that the relevant personnel can know the situation of the excessive temperature rise of the launch vehicle device in time, and it is beneficial to take corresponding measures to optimize in time, for example, take heat dissipation measures such as reducing thermal resistance and dispersing heating elements or heat reduction measures. Wherein the visual cue may include: the display screen displays the temperature rise condition, and concretely can prompt through color prompt or temperature rise value and the like; and the audio prompt can specifically prompt through playing the temperature rise condition by an audio player or send a sound prompt by a buzzer and the like.
According to the assessment method for the environmental temperature of the carrier rocket equipment, through establishment of the cross-scale layering heat network model, firstly, each cabin section of the carrier rocket is divided into a whole cabin layer, an equipment layer and a module layer, and the heat network models from the module layer to the whole cabin layer are respectively established; then, carrying out thermal resistance parameter identification between nodes; on the basis, forecasting the temperature on the arrow, and respectively solving a thermal network model from the whole cabin layer to the module layer by taking the external environment and the equipment heating power as input conditions to forecast the node temperature of each module on the arrow; and finally, according to the environmental adaptability of the equipment evaluated by the environmental temperature of the equipment on the arrow, a basis is provided for the optimization design of the equipment. The method can reduce the complexity of modeling and solving the whole-rocket thermal network, accelerate the temperature evaluation speed, improve the development efficiency and save the development cost.
In addition, it is understood that: the embodiment can be implemented by the conventional technical means in the field.
The present embodiment further provides an evaluation system for an ambient temperature of a launch vehicle device, which is a product embodiment corresponding to the foregoing embodiment, and the implementation process thereof is the same as that of the foregoing embodiment, and is not repeated herein.
As shown in fig. 3, the system for estimating the ambient temperature of a launch vehicle device provided in this embodiment includes:
the acquiring module 31 is used for acquiring the extravehicular thermal environment parameters when the carrier rocket flies;
the first processing module 32 is configured to determine an intra-module node ambient temperature of an intra-equipment equivalent module according to the extravehicular thermal environment parameter and a pre-established thermal network model;
and the second processing module 33 is configured to evaluate the ambient temperature of the device according to the derating requirement of the component and the node temperature in the module.
In one possible implementation, the extravehicular thermal environment parameter includes: ambient heat flux density and wall temperature.
In one possible implementation manner, the first processing module 32 is specifically configured to:
determining the environment temperature of the equivalent node of the equipment according to the extravehicular thermal environment parameters and a pre-established whole cabin layer thermal network model;
determining the environment temperature of the equivalent node of the module according to the environment temperature of the equivalent node of the equipment and a pre-established equipment layer heat network model;
and determining the intra-module node ambient temperature of the equivalent module in the equipment according to the module equivalent node ambient temperature and a pre-established module layer thermal network model.
In one possible implementation manner, the first processing module 32 is specifically configured to:
the amount of time-dependent change in the temperature of the inner wall surface is determined according to the following formula,
Figure RE-GDA0002918492240000101
Figure RE-GDA0002918492240000111
wherein Q (t) represents a rocketHeat flux density (W/m) of heat transfer between external environment and rocket cabin section in flight process2)；QC(t) represents the cold wall heat flux density (W/m)2) I.e. the wall temperature is the cold wall temperature Tw(0K here) heat flux density of the environment transferring heat to the rocket pod section; h isr(t) represents the enthalpy of air recovery (J/kg); c. CpRepresents the specific heat at constant pressure of air (J/(kg. K)); t iswb(t) represents the temperature of the inner wall surface (K) at time t; t iswo(t) represents the outer wall surface temperature (K) at time t; c. CpwThe specific heat capacity (J/(kg. K)) of the wall surface structure of the cabin section is represented; lwRepresenting the wall structure thickness (m) of the cabin section; rhowThe structural density of the wall surface of the cabin section; lambda is the heat conductivity coefficient (W/(m.K)) of the wall surface of the cabin section; x is the wall thickness (m). Under thermal environmental conditions (Q)C(t)、hr(T)) is an outer boundary condition, the inner wall surface is an adiabatic boundary condition, and a value T of the change of the temperature of the inner wall surface along with time is calculated by adopting a numerical heat transfer methodwb(t)。
And determining the environment temperature of the equivalent node of the equipment by taking the time variation of the temperature of the inner wall surface as the boundary condition of the whole cabin layer heat network model.
In one possible implementation manner, the first processing module 32 is specifically configured to:
and determining the environment temperature of the equivalent node of each module by taking the environment temperature of the equivalent node of the equipment as the boundary condition of the equipment layer heat network model.
In one possible implementation manner, the first processing module 32 is specifically configured to:
and determining the environment temperature of the nodes in each module by taking the environment temperature of the equivalent nodes of the module as the boundary condition of the module layer thermal network model.
In one possible implementation manner, the system further includes a third processing module, configured to:
and respectively establishing a module layer heat network model, an equipment layer heat network model and a whole cabin layer heat network model.
In one possible implementation manner, the third processing module is specifically configured to:
determining each heat network node in the module, and establishing an energy conservation equation of each node according to the heat transfer relationship and node attributes between each heat network node and other nodes; discretizing the energy conservation equation of the node to obtain a discretization equation of the node; wherein the node attributes include: heat capacity and heating power;
identifying thermal resistance parameters in the modular thermal network;
and (4) obtaining a module layer heat network model according to the thermal resistance parameters in the module heat network and the discretization equation of all the nodes in the module.
In one possible implementation manner, the third processing module is specifically configured to:
establishing a module equivalent node, and determining the heating power, equivalent heat capacity and equivalent heat resistance of the module equivalent node;
and taking the module equivalent node as a heat network node in the equipment, and establishing an equipment layer heat network model according to the identified thermal resistance parameter in the equipment heat network.
In one possible implementation manner, the third processing module is specifically configured to:
establishing an equipment equivalent node, and determining the heating power, equivalent heat capacity and equivalent heat resistance of the equipment equivalent node;
and taking the equipment equivalent node as a heat network node in the whole cabin, and establishing a heat network model of the whole cabin layer according to the identified thermal resistance parameter in the whole heat network.
In one possible implementation manner, the second processing module 33 is specifically configured to determine that the ambient temperature of the device is abnormal when the temperature of the node in the module is higher than the temperature corresponding to the derating requirement of the component, and generate a prompt message, where the prompt message is used to trigger a corresponding prompt.
According to the system for evaluating the environmental temperature of the carrier rocket equipment, through establishing the cross-scale layered heat network model, firstly, each cabin section of the carrier rocket is divided into a whole cabin layer, an equipment layer and a module layer, and the heat network models from the module layer to the whole cabin layer are respectively established; then, carrying out thermal resistance parameter identification between nodes; on the basis, forecasting the temperature on the arrow, and respectively solving a thermal network model from the whole cabin layer to the module layer by taking the external environment and the equipment heating power as input conditions to forecast the node temperature of each module on the arrow; and finally, according to the environmental adaptability of the equipment evaluated by the environmental temperature of the equipment on the arrow, a basis is provided for the optimization design of the equipment. The system can reduce the complexity of modeling and solving the whole-rocket heat network, accelerate the temperature evaluation speed, improve the development efficiency and save the development cost.
The present embodiment provides a terminal device, including:
a memory;
a processor; and
a computer program;
wherein the computer program is stored in the memory and configured to be executed by the processor to implement the respective method. For specific implementation, reference may be made to the method embodiments, which are not described herein again.
The memory is used for storing a computer program, and the processor executes the computer program after receiving the execution instruction, and the method executed by the apparatus defined by the flow process disclosed in the foregoing corresponding embodiments can be applied to or implemented by the processor.
The Memory may comprise a Random Access Memory (RAM) and may also include a non-volatile Memory, such as at least one disk Memory. The memory can implement communication connection between the system network element and at least one other network element through at least one communication interface (which may be wired or wireless), and the internet, a wide area network, a local network, a metropolitan area network, and the like can be used.
The processor may be an integrated circuit chip having signal processing capabilities. In implementation, the steps of the method disclosed in the first embodiment may be implemented by hardware integrated logic circuits in a processor or instructions in the form of software. The Processor may be a general-purpose Processor, and includes a Central Processing Unit (CPU), a Network Processor (NP), and the like; but may also be a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), an off-the-shelf programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components. The corresponding methods, steps, and logic blocks disclosed in the embodiments of the present invention may be implemented or performed. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.
The steps of the method disclosed in connection with the embodiments of the present invention may be directly implemented by a hardware decoding processor, or implemented by a combination of hardware and software elements in the decoding processor. The software elements may be located in ram, flash, rom, prom, or eprom, registers, among other storage media that are well known in the art. The storage medium is located in a memory, and a processor reads information in the memory and completes the steps of the method in combination with hardware of the processor.
The present embodiment provides a computer-readable storage medium having stored thereon a computer program; the computer program is executed by a processor in a corresponding method. For specific implementation, reference may be made to the method embodiments, which are not described herein again.
As will be appreciated by one skilled in the art, embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The present application is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the application. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
While the preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all alterations and modifications as fall within the scope of the application.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.

Claims (14)

1.一种运载火箭设备的环境温度的评估方法，其特征在于，包括：1. an evaluation method of the ambient temperature of a launch vehicle equipment, is characterized in that, comprises: 获取运载火箭飞行时舱外热环境参数；Obtain the parameters of the extravehicular thermal environment during the flight of the launch vehicle; 根据所述舱外热环境参数及预先建立的热网络模型确定设备内等效模块的模块内节点环境温度；Determine the ambient temperature of the node in the module of the equivalent module in the equipment according to the thermal environment parameters outside the cabin and the pre-established thermal network model; 根据元器件降额要求及所述模块内节点温度对设备的环境温度进行评估。The ambient temperature of the device is evaluated based on the derating requirements of the components and the node temperature within the module. 2.根据权利要求1所述的方法，其特征在于，所述舱外热环境参数，包括：外界热流密度及壁面温度。2 . The method according to claim 1 , wherein the external thermal environment parameters include: external heat flux density and wall surface temperature. 3 . 3.根据权利要求1所述的方法，其特征在于，所述根据所述舱外热环境参数及预先建立的热网络模型确定设备内等效模块的模块内节点环境温度，包括：3 . The method according to claim 1 , wherein the determining the ambient temperature of an in-module node of an equivalent module in the device according to the out-of-vehicle thermal environment parameters and a pre-established thermal network model, comprises: 3 . 根据所述舱外热环境参数及预先建立的整舱层热网络模型确定设备等效节点环境温度；Determine the ambient temperature of the equipment equivalent node according to the external thermal environment parameters and the pre-established thermal network model of the entire cabin; 根据所述设备等效节点环境温度及预先建立的设备层热网络模型确定模块等效节点环境温度；Determine the ambient temperature of the module equivalent node according to the device equivalent node ambient temperature and the pre-established device layer thermal network model; 根据所述模块等效节点环境温度及预先建立的模块层热网络模型确定设备内等效模块的模块内节点环境温度。According to the module equivalent node ambient temperature and the pre-established module layer thermal network model, the intra-module node ambient temperature of the equivalent module in the device is determined. 4.根据权利要求3所述的方法，其特征在于，所述根据所述舱外热环境参数及预先建立的整舱层热网络模型确定设备等效节点环境温度，包括：4. The method according to claim 3, wherein the determining the ambient temperature of the equipment equivalent node according to the external thermal environment parameters and the pre-established thermal network model of the entire cabin layer, comprising: 根据如下公式确定内壁面温度Twb随时间变化量，Determine the variation of the inner wall surface temperature Twb with time according to the following formula:
Figure RE-FDA0002918492230000011
Figure RE-FDA0002918492230000011
Figure RE-FDA0002918492230000012
Figure RE-FDA0002918492230000012
Figure RE-FDA0002918492230000013
Figure RE-FDA0002918492230000013
 其中，Q(t)表示火箭飞行过程中外界环境与火箭舱段传热的热流密度(W/m2)；QC(t)表示冷壁热流密度(W/m2)，即壁面温度为冷壁温度Tw时环境向火箭舱段传热的热流密度；hr(t)表示空气恢复焓；cp表示空气定压比热；Twb(t)表示t时刻内壁面温度(K)；Two(t)表示t时刻外壁面温度(K)；cpw表示舱段壁面结构比热容(J/(kg·K))；lw表示舱段壁面结构厚度；ρw为舱段壁面结构密度；λ为舱段壁面导热系数；x为壁面厚度；Among them, Q(t) represents the heat flux density (W/m 2 ) between the external environment and the rocket cabin during the rocket flight; Q C (t) represents the cold wall heat flux density (W/m 2 ), that is, the wall temperature is When the cold wall temperature Tw is the heat flux density from the environment to the rocket cabin ; h r ( t) represents the air recovery enthalpy; c p represents the constant pressure specific heat of the air; Twb (t) represents the inner wall surface temperature (K) at time t ; T wo (t) is the outer wall temperature (K) at time t; c pw is the specific heat capacity of the cabin wall structure (J/(kg·K)); l w is the thickness of the cabin wall structure; ρ w is the cabin wall structure Density; λ is the thermal conductivity of the cabin wall; x is the wall thickness; 将所述内壁面温度随时间变化量作为整舱层热网络模型的边界条件，初始温度为T0，确定设备等效节点环境温度。The temperature change of the inner wall surface with time is used as the boundary condition of the thermal network model of the whole cabin, and the initial temperature is T 0 , and the ambient temperature of the equipment equivalent node is determined. 5.根据权利要求3所述的方法，其特征在于，所述根据所述设备等效节点环境温度及预先建立的设备层热网络模型确定模块等效节点环境温度，包括：5 . The method according to claim 3 , wherein the determining the ambient temperature of the module equivalent node according to the device equivalent node ambient temperature and a pre-established device layer thermal network model comprises: 5 . 将所述设备等效节点环境温度作为设备层热网络模型的边界条件，确定各模块等效节点环境温度。The ambient temperature of the equivalent node of the device is used as the boundary condition of the thermal network model of the device layer, and the ambient temperature of the equivalent node of each module is determined. 6.根据权利要求3所述的方法，其特征在于，根据所述模块等效节点环境温度及预先建立的模块层热网络模型确定设备内等效模块的模块内节点环境温度，包括：6 . The method according to claim 3 , wherein determining the intra-module node ambient temperature of an equivalent module in the device according to the module equivalent node ambient temperature and a pre-established module-level thermal network model, comprising: 6 . 将所述模块等效节点环境温度作为模块层热网络模型的边界条件，确定各模块内节点环境温度。Taking the module equivalent node ambient temperature as the boundary condition of the module layer thermal network model, the node ambient temperature in each module is determined. 7.根据权利要求3所述的方法，其特征在于，在确定设备等效节点环境温度、模块等效节点环境温度及模块内节点环境温度之前，还包括：7. The method according to claim 3, characterized in that before determining the device equivalent node ambient temperature, the module equivalent node ambient temperature and the intra-module node ambient temperature, the method further comprises: 分别建立所述模块层热网络模型、设备层热网络模型及整舱层热网络模型。The module layer thermal network model, the equipment layer thermal network model and the whole cabin layer thermal network model are established respectively. 8.根据权利要求7所述的方法，其特征在于，建立所述模块层热网络模型，包括：8. The method according to claim 7, wherein establishing the module layer thermal network model comprises: 确定模块内的各热网络节点，根据每个热网络节点与其他节点间的传热关系、节点属性，建立各节点的能量守恒方程；将所述节点的能量守恒方程离散化，得到所述节点的离散化方程；其中，节点属性包括：热容及发热功率；Determine each thermal network node in the module, establish the energy conservation equation of each node according to the heat transfer relationship and node attributes between each thermal network node and other nodes; discretize the energy conservation equation of the node to obtain the node The discretization equation of ; among them, the node properties include: heat capacity and heating power; 辨识模块热网络中的热阻参数；Identify the thermal resistance parameters in the thermal network of the module; 根据所述模块热网络中的热阻参数，且连立模块内所有节点的离散化方程，得出模块层热网络模型。According to the thermal resistance parameters in the module thermal network, and the discrete equations of all nodes in the module are connected, a module layer thermal network model is obtained. 9.根据权利要求8所述的方法，其特征在于，建立设备层热网络模型，包括：9. The method according to claim 8, wherein establishing a device layer thermal network model, comprising: 建立模块等效节点，确定所述模块等效节点的发热功率及等效热容及等效热阻；establishing a module equivalent node, and determining the heating power, equivalent thermal capacity and equivalent thermal resistance of the module equivalent node; 将所述模块等效节点作为设备内的热网络节点，且根据辨识的设备热网络中的热阻参数，建立设备层热网络模型。The module equivalent node is used as a thermal network node in the device, and a device layer thermal network model is established according to the identified thermal resistance parameters in the device thermal network. 10.根据权利要求9所述的方法，其特征在于，建立整舱层热网络模型，包括：10. The method according to claim 9, characterized in that, establishing a thermal network model of the entire cabin layer, comprising: 建立设备等效节点，确定所述设备等效节点的发热功率及等效热容及等效热阻；Establishing equipment equivalent nodes, and determining the heating power, equivalent thermal capacity and equivalent thermal resistance of the equipment equivalent nodes; 将所述设备等效节点作为整舱内的热网络节点，且根据辨识的整热网络中的热阻参数，建立整舱层热网络模型。The equivalent node of the equipment is taken as the thermal network node in the whole cabin, and the thermal network model of the whole cabin is established according to the identified thermal resistance parameters in the whole thermal network. 11.根据权利要求1所述的方法，其特征在于，所述根据元器件降额要求及所述模块内节点温度对设备的环境温度进行评估，包括：11 . The method according to claim 1 , wherein the evaluating the ambient temperature of the device according to the component derating requirements and the node temperature in the module, comprises: 11 . 在所述模块内节点温度高于元器件降额要求对应的温度时，确定所述设备的环境温度异常，生成提示信息，所述提示信息用于触发相应提示。When the node temperature in the module is higher than the temperature corresponding to the component derating requirement, it is determined that the ambient temperature of the device is abnormal, and prompt information is generated, and the prompt information is used to trigger a corresponding prompt. 12.一种运载火箭设备的环境温度的评估装置，其特征在于，包括：12. A device for evaluating the ambient temperature of a launch vehicle equipment, characterized in that it comprises: 获取模块，用于获取运载火箭飞行时舱外热环境参数；The acquisition module is used to acquire the parameters of the extravehicular thermal environment during the flight of the launch vehicle; 第一处理模块，用于根据所述舱外热环境参数及预先建立的热网络模型确定设备内等效模块的模块内节点环境温度；a first processing module, configured to determine the in-module node ambient temperature of an equivalent module in the equipment according to the outboard thermal environment parameters and a pre-established thermal network model; 第二处理模块，用于根据元器件降额要求及所述模块内节点温度对设备的环境温度进行评估。The second processing module is configured to evaluate the ambient temperature of the device according to the derating requirements of the components and the node temperature in the module. 13.一种终端，其特征在于，包括：13. A terminal, characterized in that, comprising: 存储器；memory; 处理器；以及processor; and 计算机程序；Computer program; 其中，所述计算机程序存储在所述存储器中，并被配置为由所述处理器执行以实现如权利要求1-11任一项所述的方法。wherein the computer program is stored in the memory and configured to be executed by the processor to implement the method of any one of claims 1-11. 14.一种计算机可读存储介质，其特征在于，其上存储有计算机程序；所述计算机程序被处理器执行以实现如权利要求1-11任一项所述的方法。14. A computer-readable storage medium, characterized in that a computer program is stored thereon; the computer program is executed by a processor to implement the method according to any one of claims 1-11.
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