CN112596316B - Array substrate and its preparation method, display panel and its preparation method, and display device - Google Patents
Array substrate and its preparation method, display panel and its preparation method, and display device Download PDFInfo
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Abstract
Description
技术领域technical field
本申请涉及显示技术领域,尤其涉及阵列基板及制备方法、显示面板及制备方法、显示装置。The present application relates to the field of display technology, in particular to an array substrate and a manufacturing method, a display panel and a manufacturing method, and a display device.
背景技术Background technique
无边框大尺寸拼接产品为实现超窄边框技术,需要通过研磨、银胶转印和侧向焊接等工艺减少周边尺寸。侧向焊接工艺中,银胶和信号走线截面接触。但是将银胶与信号走线截面绑定之前,需要进行侧面研磨工艺,而在侧面研磨工艺中,容易出现信号走线局部破损、翘起断裂等问题,信号走线破损,会导致信号路径阻抗变大或开路,信号无法正常传输,出现严重线不良和信赖性问题,影响产品良率。In order to realize ultra-narrow bezel technology for borderless large-size splicing products, it is necessary to reduce the peripheral size through processes such as grinding, silver glue transfer printing, and lateral welding. In the side soldering process, the silver glue is in contact with the cross-section of the signal traces. However, before the silver glue is bound to the cross-section of the signal traces, a side grinding process is required, and in the side grinding process, problems such as local damage to the signal traces, lifting and fracture are prone to occur, and the damage of the signal traces will cause the impedance of the signal path If it becomes larger or open circuit, the signal cannot be transmitted normally, and serious line defects and reliability problems will occur, which will affect the product yield.
发明内容Contents of the invention
本申请实施例提供了阵列基板及制备方法、显示面板及制备方法、显示装置,用以避免引线电极大面积损伤、翘起断裂。Embodiments of the present application provide an array substrate and a preparation method, a display panel and a preparation method, and a display device, so as to avoid large-area damage, warping and fracture of lead electrodes.
本申请实施例提供的一种阵列基板,所述阵列基板包括:衬底基板;所述衬底基板包括:显示区以及所述显示区之外的周边区;所述周边区包括:去除区,以及位于所述去除区靠近所述显示区一侧的第一保留区;An array substrate provided in an embodiment of the present application, the array substrate includes: a base substrate; the base substrate includes: a display area and a peripheral area outside the display area; the peripheral area includes: a removal area, and a first reserved area located on a side of the removal area close to the display area;
所述阵列基板还包括:位于所述衬底基板之上的多个从所述显示区延伸到所述去除区的引线电极;The array substrate further includes: a plurality of lead electrodes extending from the display area to the removal area on the base substrate;
在所述第一保留区以及与所述第一保留区相邻的至少部分所述去除区,每一所述引线电极包括:交替阵列排布的多个第一电极部和多个第二电极部;所述第一电极部和所述第二电极部电连接;In the first reserved area and at least part of the removed area adjacent to the first reserved area, each of the lead electrodes includes: a plurality of first electrode parts and a plurality of second electrodes arranged in an alternate array part; the first electrode part is electrically connected to the second electrode part;
所述第一电极部和所述第二电极部的表面剥离力不同。The first electrode part and the second electrode part have different surface peeling forces.
在一些实施例中,多个所述第一电极部在所述衬底基板上的正投影的图案与多个所述第二电极部在所述衬底基板上的正投影的图案互补。In some embodiments, the pattern of the orthographic projection of the plurality of first electrode portions on the base substrate is complementary to the pattern of the orthographic projection of the plurality of second electrode portions on the substrate.
在一些实施例中,在所述衬底基板上,所述第一电极部的正投影的形状和所述第二电极部的正投影的形状均为矩形。In some embodiments, on the base substrate, the shape of the orthographic projection of the first electrode portion and the shape of the orthographic projection of the second electrode portion are both rectangular.
在一些实施例中,各所述矩形的长度相等,各所述矩形的宽度相等。In some embodiments, the lengths of the rectangles are equal, and the widths of the rectangles are equal.
在一些实施例中,在所述引线电极的排列方向上,每一所述引线电极的宽度为70微米~100微米,每一所述第一电极部以及每一所述第二电极部的宽度均为5微米~10微米。In some embodiments, in the arrangement direction of the lead electrodes, the width of each of the lead electrodes is 70 microns to 100 microns, and the width of each of the first electrode parts and each of the second electrode parts Both are 5 microns to 10 microns.
在一些实施例中,所述周边区还包括:位于所述第一保留区和所述显示区之间的第二保留区;In some embodiments, the peripheral area further includes: a second reserved area located between the first reserved area and the display area;
在所述第二保留区,所述引线电极包括与所述第一电极部和所述第二电极部接触的第三电极部。In the second reserved area, the lead electrode includes a third electrode portion in contact with the first electrode portion and the second electrode portion.
在一些实施例中,所述第一电极部的材料包括的导电材料与所述第二电极部包括的导电材料不相同;In some embodiments, the material of the first electrode portion comprises a different conductive material than the second electrode portion;
所述第三电极部包括的导电材料与所述第一电极部包括的导电材料相同。The conductive material included in the third electrode portion is the same as the conductive material included in the first electrode portion.
本申请实施例提供的一种阵列基板的制备方法,所述方法包括:An embodiment of the present application provides a method for preparing an array substrate, the method comprising:
提供衬底基板,所述衬底基板包括:显示区以及所述显示区之外的周边区;所述周边区包括:去除区,以及位于所述去除区靠近所述显示区一侧的第一保留区;A base substrate is provided, and the base substrate includes: a display area and a peripheral area outside the display area; the peripheral area includes: a removal area, and a first reserved area;
在所述衬底基板之上形成从所述显示区延伸到所述去除区的引线电极;其中,在所述第一保留区以及与所述第一保留区相邻的至少部分所述去除区,每一所述引线电极包括:交替排列的多个第一电极部和多个第二电极部;所述第一电极部和所述第二电极部电连接;所述第一电极部和所述第二电极部的表面剥离力不同。A lead electrode extending from the display area to the removal area is formed on the base substrate; wherein, in the first reserved area and at least part of the removed area adjacent to the first reserved area , each of the lead electrodes includes: a plurality of first electrode parts and a plurality of second electrode parts arranged alternately; the first electrode parts and the second electrode parts are electrically connected; the first electrode parts and the The surface peeling force of the second electrode part is different.
在一些实施例中,在所述衬底基板之上形成从所述显示区延伸到所述去除区的引线电极,具体包括:In some embodiments, a lead electrode extending from the display area to the removal area is formed on the base substrate, specifically comprising:
在所述衬底基板之上沉积第一导电材料,形成第一导电层;Depositing a first conductive material on the base substrate to form a first conductive layer;
对所述第一导电层进行图形化工艺,在所述第一保留区以及与所述第一保留区相邻的至少部分所述去除区形成多个所述第一电极部的图案;其中,相邻所述第一电极部之间具有第一开口;performing a patterning process on the first conductive layer, forming a plurality of patterns of the first electrode part in the first reserved area and at least part of the removed area adjacent to the first reserved area; wherein, There is a first opening between adjacent first electrode parts;
沉积第二导电材料,并在所述第一开口形成所述第二电极部的图案。Depositing a second conductive material, and forming a pattern of the second electrode part in the first opening.
本申请实施例提供的一种液晶显示面板的制备方法,所述方法包括:A method for preparing a liquid crystal display panel provided in an embodiment of the present application, the method comprising:
提供对向基板以及本申请实施例提供的阵列基板;Provide the opposite substrate and the array substrate provided by the embodiment of the present application;
采用对盒工艺将所述对向基板和所述阵列基板对盒,并在所述阵列基板和所述对向基板之间填充液晶;aligning the opposing substrate and the array substrate using a cell alignment process, and filling liquid crystals between the array substrate and the opposing substrate;
采用切割工艺和研磨工艺去除所述去除区的阵列基板和所述对向基板。The array substrate and the opposite substrate in the removal area are removed by using a cutting process and a grinding process.
本申请实施例提供的一种液晶显示面板,所述液晶显示面板包括:相对设置的阵列基板和对向基板,以及位于所述阵列基板和所述对向基板之间的液晶层;An embodiment of the present application provides a liquid crystal display panel, the liquid crystal display panel comprising: an array substrate and an opposing substrate disposed opposite to each other, and a liquid crystal layer located between the array substrate and the opposing substrate;
所述阵列基板包括:衬底基板;所述衬底基板包括:显示区以及所述显示区之外的周边区;The array substrate includes: a base substrate; the base substrate includes: a display area and a peripheral area outside the display area;
所述阵列基板还包括多个从所述显示区延伸至所述周边区边缘的引线电极;The array substrate further includes a plurality of lead electrodes extending from the display area to the edge of the peripheral area;
在所述阵列基板的边缘,所述引线电极包括交替阵列排布的多个第一电极部和多个第二电极部;On the edge of the array substrate, the lead electrodes include a plurality of first electrode parts and a plurality of second electrode parts arranged in an alternate array;
所述第一电极部和所述第二电极部电连接;所述第一电极部和所述第二电极部的表面剥离力不同。The first electrode part and the second electrode part are electrically connected; the surface peeling forces of the first electrode part and the second electrode part are different.
本申请实施例提供的一种显示装置,包括本申请实施例提供的液晶显示面板,导电部,以及驱动芯片;A display device provided in an embodiment of the present application includes the liquid crystal display panel provided in the embodiment of the present application, a conductive part, and a driving chip;
所述导电部在所述液晶显示面板的边缘与所述阵列基板的引线电极接触;The conductive part is in contact with the lead electrode of the array substrate at the edge of the liquid crystal display panel;
所述驱动芯片与所述引线电极通过所述导电部电连接。The driving chip is electrically connected to the lead electrode through the conductive part.
综上所述,本申请实施例提供的阵列基板及其制备方法、显示面板及其制备方法、显示装置,在第一保留区以及与第一保留区相邻的部分去除区设置交替阵列排布的第一电极部和第二电极部,第一电极部和第二电极部电连接,从而可以保证引线电极在该区域有效导通。并且,在去除阵列基板去除区的过程中,由于第一电极部和第二电极部交替排列,并且第一电极部和第二电极部的表面剥离力不同,研磨侧向剪切力仅会导致研磨到的位置的小块的电极部剥离脱落,从而可以避免第一保留区的引线电极发生大面积剥离脱落,还可以避免引线电极翘起、断裂,从而避免引线电极路径阻抗变大或开路导致的信号无法传输,提高产品良率。To sum up, in the array substrate and its manufacturing method, display panel and its manufacturing method, and display device provided by the embodiments of the present application, an alternate array arrangement is set in the first reserved area and the partially removed area adjacent to the first reserved area. The first electrode part and the second electrode part are electrically connected to each other, so as to ensure effective conduction of the lead electrodes in this area. Moreover, in the process of removing the removal area of the array substrate, since the first electrode part and the second electrode part are arranged alternately, and the surface peeling forces of the first electrode part and the second electrode part are different, the grinding lateral shearing force will only cause The electrode part of the small piece at the ground position is peeled off, so as to avoid large-scale peeling off of the lead electrode in the first reserved area, and to avoid the lead electrode from being lifted and broken, thereby avoiding the increase of lead electrode path impedance or open circuit. The signal cannot be transmitted, improving product yield.
附图说明Description of drawings
为了更清楚地说明本申请实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简要介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域的普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings that need to be used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For Those of ordinary skill in the art can also obtain other drawings based on these drawings without making creative efforts.
图1为本申请实施例提供的一种阵列基板的结构示意图;FIG. 1 is a schematic structural diagram of an array substrate provided in an embodiment of the present application;
图2为本申请实施例提供的沿图1中AA’的截面图;Fig. 2 is the sectional view along AA' in Fig. 1 that the embodiment of the application provides;
图3为本申请实施例提供的一种阵列基板的制备方法的示意图;FIG. 3 is a schematic diagram of a method for preparing an array substrate provided in an embodiment of the present application;
图4为本申请实施例提供的另一种阵列基板的制备方法的示意图;FIG. 4 is a schematic diagram of another method for preparing an array substrate provided in an embodiment of the present application;
图5为本申请实施例提供的一种显示面板的制备方法的示意图;FIG. 5 is a schematic diagram of a method for manufacturing a display panel provided in an embodiment of the present application;
图6为本申请实施例提供的另一种显示面板的制备方法的示意图;FIG. 6 is a schematic diagram of another method for manufacturing a display panel provided in an embodiment of the present application;
图7为本申请实施例提供的一种显示面板的结构示意图;FIG. 7 is a schematic structural diagram of a display panel provided by an embodiment of the present application;
图8为本申请实施例提供的一种显示装置的结构示意图。FIG. 8 is a schematic structural diagram of a display device provided by an embodiment of the present application.
具体实施方式detailed description
为使本申请实施例的目的、技术方案和优点更加清楚,下面将结合本申请实施例的附图,对本申请实施例的技术方案进行清楚、完整地描述。显然,所描述的实施例是本申请的一部分实施例,而不是全部的实施例。并且在不冲突的情况下,本申请中的实施例及实施例中的特征可以相互组合。基于所描述的本申请的实施例,本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例,都属于本申请保护的范围。In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be clearly and completely described below in conjunction with the drawings of the embodiments of the present application. Apparently, the described embodiments are some of the embodiments of the present application, but not all of them. And in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. Based on the described embodiments of the present application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.
除非另外定义,本申请使用的技术术语或者科学术语应当为本申请所属领域内具有一般技能的人士所理解的通常意义。本申请中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性,而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同,而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接,而是可以包括电性的连接,不管是直接的还是间接的。Unless otherwise defined, the technical terms or scientific terms used in the application shall have the ordinary meanings understood by those skilled in the art to which the application belongs. "First", "second" and similar words used in this application do not indicate any order, quantity or importance, but are only used to distinguish different components. "Comprising" or "comprising" and similar words mean that the elements or items appearing before the word include the elements or items listed after the word and their equivalents, without excluding other elements or items. Words such as "connected" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.
需要注意的是,附图中各图形的尺寸和形状不反映真实比例,目的只是示意说明本申请内容。并且自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。It should be noted that the size and shape of each figure in the drawings does not reflect the actual scale, and the purpose is only to illustrate the content of the application. And the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout.
本申请实施例提供了一种阵列基板,如图1、图2所示,所述阵列基板包括:衬底基板1;所述衬底基板1包括:显示区2以及所述显示区2之外的周边区3;所述周边区3包括:去除区4,以及位于所述去除区4靠近所述显示区2一侧的第一保留区5;The embodiment of the present application provides an array substrate. As shown in FIG. 1 and FIG. 2, the array substrate includes: a
所述阵列基板还包括:位于所述衬底基板1之上的多个从所述显示区2延伸到所述去除区4的引线电极7;The array substrate further includes: a plurality of
在所述第一保留区5以及与所述第一保留区5相邻的至少部分所述去除区4,每一所述引线电极7包括:交替阵列排布的多个第一电极部8和多个第二电极部9;所述第一电极部8和所述第二电极部9电连接;In the first
所述第一电极部8和所述第二电极部9的表面剥离力不同。The surface peeling forces of the
其中,图2为沿图1中AA’的截面图。Wherein, Fig. 2 is a sectional view along AA' in Fig. 1 .
需要说明的是,在具体实施时,当阵列基板应用于显示产品时,在显示产品制作过程中需要采用切割工艺以及侧面研磨工艺依次去除阵列基板的去除区。It should be noted that, in actual implementation, when the array substrate is applied to a display product, the removal area of the array substrate needs to be sequentially removed by a cutting process and a side grinding process during the manufacturing process of the display product.
本申请实施例提供的阵列基板,在第一保留区以及与第一保留区相邻的部分去除区设置交替阵列排布的第一电极部和第二电极部,第一电极部和第二电极部电连接,从而可以保证引线电极在该区域有效导通。并且,在去除阵列基板去除区的过程中,由于第一电极部和第二电极部交替排列,并且第一电极部和第二电极部的表面剥离力不同,研磨侧向剪切力仅会导致研磨到的位置的小块的电极部剥离脱落,从而可以避免第一保留区的引线电极发生大面积剥离脱落,还可以避免引线电极翘起、断裂,从而避免引线电极路径阻抗变大或开路导致的信号无法传输,提高产品良率。In the array substrate provided by the embodiment of the present application, the first electrode part and the second electrode part arranged in an alternate array are arranged in the first reserved area and the partially removed area adjacent to the first reserved area, and the first electrode part and the second electrode The internal electrical connection can ensure the effective conduction of the lead electrodes in this area. Moreover, in the process of removing the removal area of the array substrate, since the first electrode part and the second electrode part are arranged alternately, and the surface peeling forces of the first electrode part and the second electrode part are different, the grinding lateral shearing force will only cause The electrode part of the small piece at the ground position is peeled off, so as to avoid large-scale peeling off of the lead electrode in the first reserved area, and to avoid the lead electrode from being lifted and broken, thereby avoiding the increase of lead electrode path impedance or open circuit. The signal cannot be transmitted, improving product yield.
在一些实施例中,如图1所示,多个所述第一电极部8在所述衬底基板上的正投影的图案与多个所述第二电极部9在所述衬底基板上的正投影的图案互补。具体实施时第一电极部和第二电极部可以位于同一层。In some embodiments, as shown in FIG. 1 , the pattern of the orthographic projection of the plurality of
在一些实施例中,如图1所示,在所述衬底基板上,所述第一电极部8的正投影的形状和所述第二电极部9的正投影的形状均为矩形。In some embodiments, as shown in FIG. 1 , on the base substrate, the shape of the orthographic projection of the
在一些实施例中,如图1所示,各所述矩形的长度相等,各所述矩形的宽度相等。In some embodiments, as shown in FIG. 1 , the lengths of the rectangles are equal, and the widths of the rectangles are equal.
在一些实施例中,如图1所示,在所述衬底基板上,所述第一电极部8的正投影的形状和所述第二电极部9的正投影的形状均为正方形。In some embodiments, as shown in FIG. 1 , on the base substrate, the shape of the orthographic projection of the
在一些实施例中,在所述引线电极的排列方向上,每一所述引线电极的宽度为70微米~100微米,每一所述第一电极部以及每一所述第二电极部的宽度均为5微米~10微米。In some embodiments, in the arrangement direction of the lead electrodes, the width of each of the lead electrodes is 70 microns to 100 microns, and the width of each of the first electrode parts and each of the second electrode parts Both are 5 microns to 10 microns.
在一些实施例中,如图1、图2所示,所述周边区3还包括:位于所述第一保留区5和所述显示区2之间的第二保留区6;In some embodiments, as shown in FIG. 1 and FIG. 2 , the
在所述第二保留区6,所述引线电极7包括与所述第一电极部8和所述第二电极部9接触的第三电极部10。In the second
在一些实施例中,所述第一电极部的材料包括的导电材料与所述第二电极部包括的导电材料不相同;In some embodiments, the material of the first electrode portion comprises a different conductive material than the second electrode portion;
所述第三电极部包括的导电材料与所述第一电极部包括的导电材料相同。The conductive material included in the third electrode portion is the same as the conductive material included in the first electrode portion.
在一些实施例中,阵列基板显示区包括薄膜晶体管,除第二电极部之外的引线电极可以与薄膜晶体管的栅极金属层同层设置,即第一电极部、第三电极部以及栅极包括相同的导电材料。In some embodiments, the display area of the array substrate includes a thin film transistor, and the lead electrodes other than the second electrode part can be arranged on the same layer as the gate metal layer of the thin film transistor, that is, the first electrode part, the third electrode part and the gate electrode part. including the same conductive material.
在一些实施例中,第二电极部的材料包括氧化铟锡(ITO)。当阵列基板应用于液晶显示时,阵列基板显示区还包括像素电极、公共电极,第二电极部例如可以与像素电极或公共电极同层设置。In some embodiments, the material of the second electrode portion includes indium tin oxide (ITO). When the array substrate is applied to a liquid crystal display, the display area of the array substrate further includes a pixel electrode and a common electrode, and the second electrode part can be disposed on the same layer as the pixel electrode or the common electrode, for example.
在一些实施例中,如图1、图2所示,去除区包括第一去除区11以及位于第一去除区和第一保留区之间的第二去除区12,图1、图2中,第二去除区包括交替排列的第一电极部8和第二电极部9,而第一去除区未设置两种电极部。第一去除区为一种导电材料形成的完整电极图案。In some embodiments, as shown in FIG. 1 and FIG. 2 , the removal area includes a
在具体实施时,第二去除区包括切割区以及研磨区,即切割线位于第二去除区内,切割工艺中沿切割线切割去除切割线背离显示区一侧的部分,之后对余下的第二去除区的部分进行研磨工艺。In specific implementation, the second removal area includes a cutting area and a grinding area, that is, the cutting line is located in the second removal area, and in the cutting process, the part on the side away from the display area of the cutting line is cut along the cutting line, and then the remaining second A portion of the removal zone is subjected to a grinding process.
当然在具体实施时,也可以整个去除区均设置交替排列的第一电极部和第二电极部。Of course, in actual implementation, alternately arranged first electrode parts and second electrode parts may also be provided in the entire removal area.
基于同一发明构思,本申请实施例还提供了一种阵列基板的制备方法,如图3所示,所述方法包括:Based on the same inventive concept, an embodiment of the present application also provides a method for preparing an array substrate, as shown in FIG. 3 , the method includes:
S101、提供衬底基板,所述衬底基板包括:显示区以及所述显示区之外的周边区;所述周边区包括:去除区,以及位于所述去除区靠近所述显示区一侧的第一保留区;S101. Provide a base substrate, the base substrate includes: a display area and a peripheral area outside the display area; the peripheral area includes: a removal area, and a side of the removal area close to the display area the first reserved area;
S102、在所述衬底基板之上形成从所述显示区延伸到所述去除区的引线电极;其中,在所述第一保留区以及与所述第一保留区相邻的至少部分所述去除区,每一所述引线电极包括:交替排列的多个第一电极部和多个第二电极部;所述第一电极部和所述第二电极部电连接;所述第一电极部和所述第二电极部的表面剥离力不同。S102. Form a lead electrode extending from the display area to the removal area on the base substrate; wherein, in the first reserved area and at least part of the first reserved area adjacent to the first reserved area The removal area, each of the lead electrodes includes: a plurality of first electrode parts and a plurality of second electrode parts arranged alternately; the first electrode parts and the second electrode parts are electrically connected; the first electrode parts Different from the surface peeling force of the second electrode part.
本申请实施例提供的阵列基板制备方法,在第一保留区以及与第一保留区相邻的部分去除区设置交替阵列排布的第一电极部和第二电极部,第一电极部和第二电极部电连接,从而可以保证引线电极在该区域有效导通。并且,在后续去除阵列基板去除区的过程中,由于第一电极部和第二电极部交替排列,并且第一电极部和第二电极部的表面剥离力不同,研磨侧向剪切力仅会导致研磨到的位置的小块的电极部剥离脱落,从而可以避免第一保留区的引线电极发生大面积剥离脱落,还可以避免引线电极翘起、断裂,从而避免引线电极路径阻抗变大或开路导致的信号无法传输,提高产品良率。In the method for preparing an array substrate provided in an embodiment of the present application, the first electrode part and the second electrode part arranged in an alternate array are arranged in the first reserved area and the partially removed area adjacent to the first reserved area, and the first electrode part and the second electrode part are arranged in an alternate array. The two electrode parts are electrically connected, so that the effective conduction of the lead electrodes in this area can be ensured. Moreover, in the subsequent process of removing the removal area of the array substrate, since the first electrode parts and the second electrode parts are arranged alternately, and the surface peeling forces of the first electrode parts and the second electrode parts are different, the grinding lateral shearing force will only increase The electrode part of the small piece that is ground to the position is peeled off, so that the lead electrode in the first reserved area can be prevented from peeling off in a large area, and the lead electrode can also be avoided from lifting and breaking, so as to avoid the lead electrode path impedance becoming large or open circuit The resulting signal cannot be transmitted, which improves the product yield.
在一些实施例中,在所述衬底基板之上形成从所述显示区延伸到所述去除区的引线电极,具体包括:In some embodiments, a lead electrode extending from the display area to the removal area is formed on the base substrate, specifically comprising:
在所述衬底基板之上沉积第一导电材料,形成第一导电层;Depositing a first conductive material on the base substrate to form a first conductive layer;
对所述第一导电层进行图形化工艺,在所述第一保留区以及与所述第一保留区相邻的至少部分所述去除区形成多个所述第一电极部的图案;其中,相邻所述第一电极部之间具有第一开口;performing a patterning process on the first conductive layer, forming a plurality of patterns of the first electrode part in the first reserved area and at least part of the removed area adjacent to the first reserved area; wherein, There is a first opening between adjacent first electrode parts;
沉积第二导电材料,并在所述第一开口形成所述第二电极部的图案。Depositing a second conductive material, and forming a pattern of the second electrode part in the first opening.
在具体实施时,形成第二电极部的图案,例如包括:沉积第二导电材料形成第二导电层,对第二导电层进行图形化工艺,在第一开口形成第二电极部的图案。During specific implementation, forming the pattern of the second electrode portion includes, for example, depositing a second conductive material to form a second conductive layer, performing a patterning process on the second conductive layer, and forming a pattern of the second electrode portion in the first opening.
在具体实施时,形成每一种导电层后,例如可以通过曝光、显影、刻蚀等工艺形成每一种导电部的图案。In a specific implementation, after each conductive layer is formed, the pattern of each conductive portion can be formed, for example, through processes such as exposure, development, and etching.
接下来,以第一导电部和第三导电部包括相同导电材料为例,对本申请实施例提供的阵列基板的制备方法进行举例说明。如图4所示;Next, the method for preparing the array substrate provided by the embodiment of the present application will be illustrated by taking the example that the first conductive part and the third conductive part include the same conductive material. As shown in Figure 4;
S201、提供衬底基板1,并在衬底基板1之上沉积第一导电材料,形成第一导电层13;S201, providing a
其中,如图4所示,第一导电层从显示区2延伸到去除区4的边缘;Wherein, as shown in FIG. 4, the first conductive layer extends from the
S202、对第一导电层13进行图形化工艺,在第一保留区5以及第二去除区12形成多个第一电极部8的图案;S202, performing a patterning process on the first
其中,相邻第一电极部之间具有第一开口14。Wherein, there is a
S203、沉积第二导电材料,并在第一开口14形成第二电极部9的图案。S203 , depositing a second conductive material, and forming a pattern of the
本申请实施例提供的一种液晶显示面板的制备方法,如图5所示,所述方法包括:A method for preparing a liquid crystal display panel provided in an embodiment of the present application, as shown in FIG. 5 , the method includes:
S301、提供对向基板以及本申请实施例提供的阵列基板;S301, providing a counter substrate and the array substrate provided by the embodiment of the present application;
S302、采用对盒工艺将所述对向基板和所述阵列基板对盒,并在所述阵列基板和所述对向基板之间填充液晶;S302, aligning the opposing substrate and the array substrate using a cell alignment process, and filling liquid crystal between the array substrate and the opposing substrate;
S303、采用切割工艺和研磨工艺去除所述去除区的阵列基板和所述对向基板。S303 , removing the array substrate and the opposite substrate in the removal region by using a cutting process and a grinding process.
本申请实施例提供的显示面板的制备方法,由于利用本申请实施例提供的阵列基板,阵列基板在第一保留区以及与第一保留区相邻的部分去除区设置交替阵列排布的第一电极部和第二电极部,在去除阵列基板去除区的工艺过程中,由于第一电极部和第二电极部交替排列,并且第一电极部和第二电极部的表面剥离力不同,研磨侧向剪切力仅会导致研磨到的位置的小块的电极部剥离脱落,从而可以避免第一保留区的引线电极发生大面积剥离脱落,还可以避免引线电极翘起、断裂,从而避免引线电极路径阻抗变大或开路导致的信号无法传输,提高产品良率。In the manufacturing method of the display panel provided by the embodiment of the present application, since the array substrate provided by the embodiment of the present application is used, the array substrate is provided with alternately arranged first The electrode part and the second electrode part, during the process of removing the removal area of the array substrate, since the first electrode part and the second electrode part are arranged alternately, and the surface peeling forces of the first electrode part and the second electrode part are different, the grinding side The shearing force will only lead to the peeling off of the small piece of the electrode at the position where it is ground, thereby avoiding the large-area peeling off of the lead electrode in the first reserved area, and avoiding the lead electrode from warping and breaking, thereby avoiding the lead electrode The signal cannot be transmitted due to the increase of path impedance or open circuit, which improves the product yield.
在具体实施时,如图6所示,采用切割工艺和研磨工艺去除所述去除区的阵列基板和所述对向基板,具体包括:In specific implementation, as shown in Figure 6, the array substrate and the opposite substrate in the removal area are removed by cutting and grinding processes, specifically including:
S3031、沿切割线16对阵列基板和对盒基板15进行切割工艺,去除切割线16背离显示区一侧的部分;S3031, performing a cutting process on the array substrate and the
S3032、利用研磨轮17对阵列基板和对盒基板15进行研磨工艺,将去除区4剩余部分完全去除。S3032 , using the
基于同一发明构思,本申请实施例还提供了一种液晶显示面板,如图7所示,所述液晶显示面板包括:相对设置的阵列基板18和对向基板15,以及位于所述阵列基板18和所述对向基板15之间的液晶层19;Based on the same inventive concept, the embodiment of the present application also provides a liquid crystal display panel. As shown in FIG. and the
所述阵列基板18包括:衬底基板1;所述衬底基板1包括:显示区2以及所述显示区2之外的周边区3;The
所述阵列基板18还包括多个从所述显示区2延伸至所述周边区3边缘的引线电极7;The
在所述阵列基板18的周边区3边缘,所述引线电极7包括交替阵列排布的多个第一电极部8和多个第二电极部9;On the edge of the
所述第一电极部8和所述第二电极部9电连接;所述第一电极部8和所述第二电极部9的表面剥离力不同。The
本申请实施例提供的液晶显示面板例如可以采用上述液晶显示面板的制备方法制得;在第一保留区第一电极部和第二电极部交替排列,从而研磨侧向剪切力仅会导致研磨到的位置的小块的电极部剥离脱落,可以避免第一保留区的引线电极发生大面积剥离脱落,还可以避免引线电极翘起、断裂,从而避免引线电极路径阻抗变大或开路导致的信号无法传输,提高产品良率。The liquid crystal display panel provided in the embodiment of the present application can be manufactured by, for example, the above-mentioned preparation method of the liquid crystal display panel; the first electrode part and the second electrode part are arranged alternately in the first reserved area, so that the grinding lateral shear force will only cause grinding The electrode part of the small piece at the position is peeled off, which can prevent the lead electrode in the first reserved area from peeling off in a large area, and can also avoid the lead electrode from lifting and breaking, thereby avoiding the signal caused by the increase of the lead electrode path impedance or open circuit. Unable to transmit, improve product yield.
在具体实施时,本申请实施例提供的液晶显示面板可以应用于大尺寸拼接显示产品。In specific implementation, the liquid crystal display panel provided in the embodiment of the present application can be applied to large-size spliced display products.
本申请实施例提供的一种显示装置,如图8所示,包括本申请实施例提供的液晶显示面板20,导电部21,以及驱动芯片(未示出);A display device provided in an embodiment of the present application, as shown in FIG. 8 , includes a liquid
所述导电部21在所述液晶显示面板20的边缘与所述阵列基板18的引线电极7接触;The
所述驱动芯片与所述引线电极7通过所述导电部21电连接。The driving chip is electrically connected to the
在具体实施时,导电部例如可以是导电银胶。In a specific implementation, the conductive part may be, for example, conductive silver glue.
本申请实施例提供的显示装置,由于在阵列基板周边区的边缘,即第一保留区第一电极部和第二电极部交替排列,避免第一保留区的引线电极发生大面积剥离脱落,还可以避免引线电极翘起、断裂,从而可以避免引线电极路径阻抗变大或引线电极与导电部开路导致的信号无法传输。In the display device provided by the embodiment of the present application, since the first electrode part and the second electrode part are alternately arranged on the edge of the peripheral area of the array substrate, that is, the first reserved area, large-area peeling off of the lead electrode in the first reserved area is avoided, and Lifting and breakage of the lead electrode can be avoided, thereby avoiding the signal failure caused by the increase of the path impedance of the lead electrode or the open circuit between the lead electrode and the conductive part.
在具体实施时,即便研磨工艺中出现第一保留区的电极部被研磨到导致部分小块电极脱落,由于引线电极并非大面积脱落,并且后续在绑定导电银胶的工艺中,导电银胶还可以填充至小块电极脱落区域,从而可以避免引线电极路径阻抗变大或引线电极与导电部开路导致的信号无法传输。In the specific implementation, even if the electrode part of the first reserved area is ground in the grinding process to cause some small pieces of electrodes to fall off, since the lead electrodes do not fall off in a large area, and in the subsequent process of binding the conductive silver glue, the conductive silver glue It can also be filled to a small area where the electrode falls off, so as to avoid the failure of signal transmission caused by the increase of the impedance of the lead electrode path or the open circuit between the lead electrode and the conductive part.
本申请实施例提供的显示装置为:手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。对于该显示装置的其它必不可少的组成部分均为本领域的普通技术人员应该理解具有的,在此不做赘述,也不应作为对本申请的限制。该显示装置的实施可以参见上述阵列基板、显示面板的实施例,重复之处不再赘述。The display device provided in the embodiment of the present application is any product or component with a display function such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, and the like. The other essential components of the display device should be understood by those of ordinary skill in the art, and will not be repeated here, nor should they be used as limitations on the present application. For the implementation of the display device, reference may be made to the embodiments of the above-mentioned array substrate and display panel, and repeated descriptions will not be repeated.
综上所述,本申请实施例提供的阵列基板及其制备方法、显示面板及其制备方法、显示装置,在第一保留区以及与第一保留区相邻的部分去除区设置交替阵列排布的第一电极部和第二电极部,第一电极部和第二电极部电连接,从而可以保证引线电极在该区域有效导通。并且,在去除阵列基板去除区的过程中,由于第一电极部和第二电极部交替排列,并且第一电极部和第二电极部的表面剥离力不同,研磨侧向剪切力仅会导致研磨到的位置的小块的电极部剥离脱落,从而可以避免第一保留区的引线电极发生大面积剥离脱落,还可以避免引线电极翘起、断裂,从而避免引线电极路径阻抗变大或开路导致的信号无法传输,提高产品良率。To sum up, in the array substrate and its manufacturing method, display panel and its manufacturing method, and display device provided by the embodiments of the present application, an alternate array arrangement is set in the first reserved area and the partially removed area adjacent to the first reserved area. The first electrode part and the second electrode part are electrically connected to each other, so as to ensure effective conduction of the lead electrodes in this area. Moreover, in the process of removing the removal area of the array substrate, since the first electrode parts and the second electrode parts are arranged alternately, and the surface peeling forces of the first electrode parts and the second electrode parts are different, the grinding lateral shearing force will only cause The electrode part of the small piece at the ground position is peeled off, so as to avoid large-scale peeling and falling off of the lead electrode in the first reserved area, and to avoid the lead electrode from lifting and breaking, thereby avoiding the lead electrode path impedance becoming large or open circuit. The signal cannot be transmitted, improving product yield.
显然,本领域的技术人员可以对本申请进行各种改动和变型而不脱离本申请的精神和范围。这样,倘若本申请的这些修改和变型属于本申请权利要求及其等同技术的范围之内,则本申请也意图包含这些改动和变型在内。Obviously, those skilled in the art can make various changes and modifications to the application without departing from the spirit and scope of the application. In this way, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application is also intended to include these modifications and variations.
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