Disclosure of Invention
The invention mainly aims to provide a wiring structure of a circuit board, which aims to improve the space utilization rate of the circuit board and the arrangement precision of circuit devices on the circuit board.
In order to achieve the above object, a circuit board wiring structure according to the present invention includes:
a substrate; and
The circuit device comprises a substrate, a plurality of conductive pieces, a plurality of connecting terminals and a plurality of circuit devices, wherein the conductive pieces are arranged on the substrate, each conductive piece is in an annular shape, two adjacent conductive pieces are electrically connected, each conductive piece is provided with the plurality of connecting terminals, and the connecting terminals are used for connecting the circuit devices.
In an embodiment of the present invention, a center position of the substrate is defined as a center;
the plurality of conductive pieces are all arranged around the circle center.
In an embodiment of the present invention, each of the conductive members includes a first ring member and a second ring member, and the first ring member is disposed around an outer edge of the second ring member;
the first ring-shaped part is provided with a plurality of first electrodes, the second ring-shaped part is provided with a second electrode corresponding to each first electrode, and one first electrode and one second electrode are matched to form one connecting terminal.
In an embodiment of the invention, the first ring member includes a plurality of first arc-shaped plate bodies, the plurality of first arc-shaped plate bodies are disposed on the substrate, and the plurality of first arc-shaped plate bodies are sequentially arranged and are enclosed to form a ring shape, and each first arc-shaped plate body is provided with a plurality of first electrodes;
and/or, the second annular piece includes a plurality of second arc plate bodies, and is a plurality of the second arc plate body is located the base plate, a plurality of the second arc plate body is arranged in proper order to enclose and close and form annular arrangement, every the second arc plate body is provided with a plurality of the second electrode.
In an embodiment of the present invention, the circuit board wiring structure further includes a first metal member and a second metal member disposed on the substrate, where the first metal member and the second metal member are located in a middle portion of the substrate and are electrically connected to the plurality of conductive members.
In an embodiment of the present invention, the first metal member is electrically connected to the conductive member adjacent to the center of the circle, and the second metal member is electrically connected to the conductive member away from the center of the circle.
In an embodiment of the present invention, each of the conductive members is provided with a yielding port, and a connecting line of the yielding ports coincides with the circle center;
the second metal piece penetrates through the plurality of abdicating openings and is electrically connected with the conducting piece far away from the circle center.
In an embodiment of the present invention, a wire through hole is disposed in the middle of the substrate;
and/or the substrate is provided with a plurality of mounting holes;
and/or the substrate is a circular circuit board, and the circle centers of the plurality of conductive pieces are coincident with the axis of the substrate.
The invention also provides electronic equipment, which comprises a plurality of circuit devices and the circuit board wiring structure, wherein the circuit devices are electrically connected with a plurality of connecting terminals of the circuit board wiring structure.
According to the technical scheme, the plurality of annular conductive pieces are arranged on the substrate, each conductive piece is provided with the plurality of connecting terminals, and the connecting terminals are used for connecting circuit devices, so that the substrate is provided with the connecting terminals arranged at a plurality of angles, and the circuit devices can be arranged at any angle conveniently; meanwhile, the installation of the circuit device is realized by matching with intelligent equipment of the machine, the loading and the installation of any angle between the substrate and the circuit device can be realized, and the flexibility of arranging the circuit device on the substrate is effectively improved. The wiring structure of the circuit board improves the space utilization rate of the circuit board and improves the arrangement precision of circuit devices on the circuit board.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present invention, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" as it appears throughout is meant to include three side-by-side schemes, for example, "a and/or B", including a scheme, or B scheme, or a scheme that is satisfied by both a and B. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
The invention provides a wiring structure of a circuit board. Referring to fig. 1, a schematic structure of an embodiment of a circuit board wiring structure according to the present invention is shown; referring to fig. 2, a schematic structural diagram of the conductive member in fig. 1 is shown.
In an embodiment of the present invention, as shown in fig. 1, and in combination with fig. 2, the circuit board wiring structure includes: the circuit device comprises a substrate 1 and a plurality of conductive pieces 2, wherein the plurality of conductive pieces 2 are arranged on the substrate 1, each conductive piece 2 is in an annular arrangement, two adjacent conductive pieces 2 are electrically connected, a plurality of connecting terminals 21 are arranged on each conductive piece 2, and the connecting terminals 21 are used for connecting circuit devices.
In the present embodiment, by providing a plurality of conductive members 2 arranged in a ring shape on the substrate 1, each conductive member 2 is provided with a plurality of connection terminals 21, the connection terminals 21 are used for connecting circuit devices, so that the substrate 1 has connection terminals 21 arranged in a plurality of angles, so that the circuit devices can be arranged at any angle; meanwhile, the installation of the circuit device is realized by matching with intelligent equipment of the machine, the loading and the installation of any angle between the substrate 1 and the circuit device can be realized, and the flexibility of arranging the circuit device on the substrate 1 is effectively improved. The wiring structure of the circuit board improves the space utilization rate of the circuit board and improves the arrangement precision of circuit devices on the circuit board.
In an alternative embodiment of the invention, two adjacent conductive elements 2 are spaced apart.
In an alternative embodiment of the present invention, a plurality of conductive elements 2 may be arranged on the substrate 1 in an array; that is, the centers of the plural conductive members 2 are located at different positions of the substrate 1.
In an alternative embodiment of the present invention, a plurality of conductive elements 2 may be arranged on the substrate 1 in an array, and centers of at least two conductive elements 2 in the plurality of conductive elements 2 are coincident. That is, there are cases where two or more conductive members 2 are arranged in a collar structure; that is, the two or more conductive members 2 are sequentially arranged outside from the same center, and the radius of the plurality of conductive members 2 gradually increases from the center to the direction away from the center.
In an alternative embodiment of the present invention, the centers of the circles of the plurality of conductive elements 2 are all coincident. That is, the plurality of conductive members 2 have different radii, and the plurality of conductive members 2 are provided on the substrate 1 and are sequentially sleeved.
In an alternative embodiment of the invention, the substrate 1 is a circuit board.
In an alternative embodiment of the present invention, the conductive member 2 may be electrically connected to the substrate 1; that is, the circuit board is provided with a conductive layer electrically connected to the plurality of conductive members 2.
In an alternative embodiment of the invention, two adjacent conductive elements 2 are connected by a wire.
In an embodiment of the present invention, the middle position of the substrate 1 is defined as a center, and the plurality of conductive members 2 are all disposed around the center.
In this embodiment, the middle position of the substrate 1 is set as the center of a circle, so that the plurality of conductive members 2 are located in the middle of the substrate 1, so as to improve the space utilization rate of the substrate 1; meanwhile, the intelligent equipment of the machine is convenient to identify the substrate 1 and the conductive piece 2.
In an alternative embodiment of the present invention, the conductive member 2 may be a circuit board structure, that is, the conductive member 2 is a small arc-shaped or ring-shaped circuit board, and a solder joint is provided on the conductive member 2 to form the connection terminal 21.
In one embodiment of the present invention, each conductive member 2 includes a first ring member 3 and a second ring member 4, and the first ring member 3 is disposed around the outer edge of the second ring member 4; the first ring member 3 is provided with a plurality of first electrodes 31, the second ring member 4 is provided with a second electrode 41 corresponding to each first electrode 31, and a first electrode 31 and a second electrode 41 cooperate to form a connection terminal 21.
In the present embodiment, the conductive member 2 is a member including a pair of first and second ring members 3 and 4; wherein the first ring member 3 and the second ring member 4 serve as two polarity members, respectively, such that two pins of the circuit device are connected to the first electrode 31 of the first ring member 3 and the second electrode 41 of the second ring member 4, respectively, such that an electrical connection path is formed between the circuit device and the first ring member 3 and the second ring member 4. On the other hand, by adopting the structure that the conductive member 2 comprises the first annular member 3 and the second annular member 4, a gap is formed between the first annular member 3 and the second annular member 4, and heat dissipation of the circuit device is improved. Simultaneously, the materials of the conductive element 2 in the process can be reduced, and the cost is further saved.
In an alternative embodiment of the invention, a first electrode 31 is arranged opposite a second electrode 41 and forms a connection terminal 21.
In an alternative embodiment of the invention, the first electrode 31 may be a welding spot provided on the first ring member 3. Alternatively, the first electrode 31 may be a metal through hole provided on the first ring member 3. Wherein the plurality of first electrodes 31 are connected in series with each other; that is, the adjacent two first electrodes 31 are electrically conductive.
In alternative embodiments of the invention, the second electrode 41 may be a weld provided on the second ring member 4. Alternatively, the second electrode 41 may be a metal through hole provided on the second ring member 4. Wherein the plurality of second electrodes 41 are connected in series with each other; that is, the adjacent two second electrodes 41 are electrically conductive.
In an embodiment of the present invention, the first ring member 3 includes a plurality of first arc-shaped plate bodies 32, the plurality of first arc-shaped plate bodies 32 are disposed on the substrate 1, and the plurality of first arc-shaped plate bodies 32 are sequentially arranged and are enclosed to form a ring shape, and each first arc-shaped plate body 32 is provided with a plurality of first electrodes 31.
In this embodiment, the first ring member 3 includes a plurality of first arcuate plate bodies 32, and the first ring member 3 is integrally divided into a plurality of smaller first arcuate plate bodies 32, so as to facilitate the production and processing of the first ring member 3. On the other hand, a plurality of first arc-shaped plate bodies 32 are adopted to form an annular structure in a surrounding manner, so that the first annular piece 3 is convenient to mount on the base plate 1; meanwhile, when damaged first arc plate bodies 32 exist in the plurality of first arc plate bodies 32, the first arc plate bodies 32 can be independently replaced, and maintenance efficiency of the wiring structure of the circuit board is improved.
In one embodiment of the present invention, two adjacent first arcuate plate bodies 32 are electrically connected.
In an embodiment of the present invention, the second ring member 4 includes a plurality of second arc-shaped plate bodies 42, the plurality of second arc-shaped plate bodies 42 are disposed on the substrate 1, the plurality of second arc-shaped plate bodies 42 are sequentially arranged and enclose to form an annular arrangement, and each second arc-shaped plate body 42 is provided with a plurality of second electrodes 41.
In the present embodiment, the second ring member 4 includes a plurality of second arcuate plate bodies 42, and the second ring member 4 is integrally divided into a plurality of smaller second arcuate plate bodies 42, so as to facilitate the production and processing of the second ring member 4. On the other hand, a plurality of second arc-shaped plate bodies 42 are adopted to form an annular structure in a surrounding manner, so that the second annular piece 4 is convenient to install on the base plate 1; meanwhile, when the damaged second arc plate bodies 42 exist in the plurality of second arc plate bodies 42, the second arc plate bodies 42 can be independently replaced, and maintenance efficiency of the circuit board wiring structure is improved.
In one embodiment of the present invention, two adjacent second arcuate plate bodies 42 are electrically connected.
Optionally, the second arcuate plate 42 and the first arcuate plate 32 are arcuate circuit boards of identical construction. That is, an arc-shaped circuit board is provided on the substrate 1, and after a plurality of arc-shaped circuit boards are mounted according to predetermined positions, the plurality of arc-shaped circuit boards are enclosed to form an annular conductive member 2 of a corresponding diameter size.
In an embodiment of the present invention, the circuit board wiring structure further includes a first metal member 5 and a second metal member 6 disposed on the substrate 1, where the first metal member 5 and the second metal member 6 are located in the middle of the substrate 1 and electrically connected to the plurality of conductive members 2.
In this embodiment, the first metal member 5 and the second metal member 6 are disposed in the middle of the substrate 1, and the first metal member 5 and the second metal member 6 are used to form a bus electrically connected to the plurality of conductive members 2, so as to facilitate the electrical connection between the plurality of conductive members 2 and an external circuit.
In an embodiment of the present invention, the first metal piece 5 and the second metal piece 6 may be electrically connected to each conductive piece 2. That is, the first metal member 5 is electrically connected to the first ring member 3, and the second metal member 6 is electrically connected to the second ring member 4.
In one embodiment of the present invention, the first metal member 5 is electrically connected to the conductive member 2 adjacent to the center of the circle, and the second metal member 6 is electrically connected to the conductive member 2 away from the center of the circle.
In an embodiment of the present invention, each conductive element 2 is provided with a yielding port 22, a connecting line of the yielding ports 22 coincides with the circle center, and the second metal element 6 is disposed through the yielding ports 22 and electrically connected to the conductive element 2 far from the circle center.
In this embodiment, each conductive member 2 is provided with a yielding port 22, so that the second metal member 6 can pass through the yielding port 22 to be electrically connected with the outermost conductive member 2, thereby improving implementation efficiency and avoiding the use of a grooved or hole-digging mode to realize the electrical connection between the second metal member 6 and the outermost conductive member 2.
In an embodiment of the present invention, the middle portion of the substrate 1 is provided with the via hole 11, and the middle portion is provided with the via hole 11, so as to avoid the wire from being connected to the conductive member 2 from the edge, avoid interfering with the operation of the circuit device on the conductive member 2, and improve the structural stability of the wiring structure of the circuit board. On the other hand, the middle via hole 11 may also be used as a positioning hole to facilitate positioning of the substrate 1.
In an embodiment of the present invention, the substrate 1 is provided with a plurality of mounting holes 12 to enable mounting and positioning of the substrate 1.
In one embodiment of the present invention, a plurality of mounting holes 12 are provided between two adjacent conductive members 2.
In one embodiment of the present invention, the plurality of mounting holes 12 are disposed in the middle region of the substrate 1 and are located relatively inside the conductive member 2 near the middle region.
In an embodiment of the present invention, the substrate 1 is a circular circuit board, and the centers of the plurality of conductive members 2 are coincident with the axis of the substrate 1.
In an embodiment of the present invention, the axis of the substrate 1 coincides with the via 11.
The invention also provides an electronic device, which comprises a plurality of circuit devices and a circuit board wiring structure, wherein the specific structure of the circuit board wiring structure refers to the embodiment, and the electronic device adopts all the technical schemes of all the embodiments, so that the electronic device at least has all the beneficial effects brought by the technical schemes of the embodiments, and the detailed description is omitted. Wherein the plurality of circuit devices are electrically connected to the plurality of connection terminals 21 of the circuit board wiring structure.
In one embodiment of the present invention, the circuit devices are provided one-to-one with the connection terminals 21.
In one embodiment of the invention, the circuit device may be a plug-in fit with the connection terminal 21.
In an embodiment of the present invention, the circuit device and the connection terminal 21 may be soldered.
The foregoing description is only of the optional embodiments of the present invention, and is not intended to limit the scope of the invention, and all the equivalent structural changes made by the description of the present invention and the accompanying drawings or the direct/indirect application in other related technical fields are included in the scope of the invention.