CN112770487B - Flexible composite circuit board with virus killing function and manufacturing process thereof - Google Patents
Flexible composite circuit board with virus killing function and manufacturing process thereof Download PDFInfo
- Publication number
- CN112770487B CN112770487B CN202011626610.4A CN202011626610A CN112770487B CN 112770487 B CN112770487 B CN 112770487B CN 202011626610 A CN202011626610 A CN 202011626610A CN 112770487 B CN112770487 B CN 112770487B
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- circuit board
- phase change
- coating
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- 239000002131 composite material Substances 0.000 title claims abstract description 38
- 241000700605 Viruses Species 0.000 title claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000011248 coating agent Substances 0.000 claims abstract description 61
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 26
- 230000003064 anti-oxidating effect Effects 0.000 claims abstract description 25
- 239000011889 copper foil Substances 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 22
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- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 8
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- 239000012071 phase Substances 0.000 claims abstract description 8
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims abstract description 7
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- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
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- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
- 150000004645 aluminates Chemical class 0.000 claims description 5
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- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 4
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- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 claims description 4
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- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 claims description 3
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- 238000000071 blow moulding Methods 0.000 claims description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 3
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- 241000894006 Bacteria Species 0.000 abstract description 9
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- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 abstract description 2
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- REFJWTPEDVJJIY-UHFFFAOYSA-N Quercetin Chemical compound C=1C(O)=CC(O)=C(C(C=2O)=O)C=1OC=2C1=CC=C(O)C(O)=C1 REFJWTPEDVJJIY-UHFFFAOYSA-N 0.000 description 4
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- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 description 4
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- ZVOLCUVKHLEPEV-UHFFFAOYSA-N Quercetagetin Natural products C1=C(O)C(O)=CC=C1C1=C(O)C(=O)C2=C(O)C(O)=C(O)C=C2O1 ZVOLCUVKHLEPEV-UHFFFAOYSA-N 0.000 description 2
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- 241000191967 Staphylococcus aureus Species 0.000 description 2
- UXRMWRBWCAGDQB-UHFFFAOYSA-N Theaflavin Natural products C1=CC(C2C(CC3=C(O)C=C(O)C=C3O2)O)=C(O)C(=O)C2=C1C(C1OC3=CC(O)=CC(O)=C3CC1O)=CC(O)=C2O UXRMWRBWCAGDQB-UHFFFAOYSA-N 0.000 description 2
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- 230000017525 heat dissipation Effects 0.000 description 2
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- YLTGFGDODHXMFB-UHFFFAOYSA-N isoacetovanillon Natural products COC1=CC=C(C(C)=O)C=C1O YLTGFGDODHXMFB-UHFFFAOYSA-N 0.000 description 2
- MWDZOUNAPSSOEL-UHFFFAOYSA-N kaempferol Natural products OC1=C(C(=O)c2cc(O)cc(O)c2O1)c3ccc(O)cc3 MWDZOUNAPSSOEL-UHFFFAOYSA-N 0.000 description 2
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- IPMYMEWFZKHGAX-ZKSIBHASSA-N theaflavin Chemical compound C1=C2C([C@H]3OC4=CC(O)=CC(O)=C4C[C@H]3O)=CC(O)=C(O)C2=C(O)C(=O)C=C1[C@@H]1[C@H](O)CC2=C(O)C=C(O)C=C2O1 IPMYMEWFZKHGAX-ZKSIBHASSA-N 0.000 description 2
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- 230000003612 virological effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L2/00—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor
- A61L2/02—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor using physical phenomena
- A61L2/14—Plasma, i.e. ionised gases
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L2/00—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor
- A61L2/16—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor using chemical substances
- A61L2/23—Solid substances, e.g. granules, powders, blocks, tablets
- A61L2/232—Solid substances, e.g. granules, powders, blocks, tablets layered or coated
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L2/00—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor
- A61L2/16—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor using chemical substances
- A61L2/23—Solid substances, e.g. granules, powders, blocks, tablets
- A61L2/238—Metals or alloys, e.g. oligodynamic metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/14—Paints containing biocides, e.g. fungicides, insecticides or pesticides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Public Health (AREA)
- Epidemiology (AREA)
- Veterinary Medicine (AREA)
- General Health & Medical Sciences (AREA)
- Animal Behavior & Ethology (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Wood Science & Technology (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Plant Pathology (AREA)
- Plasma & Fusion (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Agricultural Chemicals And Associated Chemicals (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to a flexible composite circuit board with a virus killing function, which sequentially comprises a virus killing coating, an anti-oxidation coating, an insulating flexible medium film, an adhesive layer and a copper foil substrate from top to bottom; the disinfection coating comprises 90-95 parts of nano silver-copper alloy mixed particles, 7-9 parts of peony root bark extract and 3-5 parts of zirconium oxide powder; the anti-oxidation coating comprises aluminum oxide; the insulating flexible medium film is internally provided with a cavity, the insulating flexible medium film is internally provided with a solid-liquid phase change agent, the phase change critical point of the solid-liquid phase change agent is 10-15 ℃, and the insulating flexible medium film is connected with the copper foil substrate in an adhesion manner through the adhesive layer. The flexible composite circuit board can directly kill bacteria and viruses and can accelerate the cooling.
Description
Technical Field
The invention relates to the field of flexible circuit boards, in particular to a flexible composite circuit board with a virus killing function and a manufacturing process thereof.
Background
The flexible circuit board is also called as an FPC (flexible printed circuit), is a technology emerging only in recent years, is mainly used for some high-precision products, and is generally used for mobile phones, computers and digital cameras.
The current flexible circuit board has the following problems in daily use: (1) some enterprises influenced by the production process need to work in a relatively humid environment for a long time, so that bacteria or viruses are easy to breed on the flexible circuit board, the existing circuit board manufacturing process enters a nanometer stage, bacteria can deposit and form bacterial plaque with the convenient surface of the flexible circuit board due to large volume, on one hand, the power consumption is increased, and circuit components can be burnt out or failed in a short circuit mode at any time, the viruses can enter an etching groove of a copper foil substrate due to small volume, and the viruses can form electric field interference to enable the circuit components to be burnt out in a direct short circuit mode; (2) after the circuit board works for a period of time, because the temperature of the surface of the board body rises when the heat is generated due to power consumption, the cooling effect of the board body is poor, the working state of the electronic component is influenced, the service life of the electronic component working under the high-temperature state for a long time is short, and the electronic component is easy to burn out.
Disclosure of Invention
The invention aims to provide a flexible composite circuit board which can directly kill bacteria and viruses and can accelerate the cooling.
In order to achieve the purpose, the technical scheme of the invention is as follows: a flexible composite circuit board with a virus killing function sequentially comprises a virus killing coating, an anti-oxidation coating, an insulating flexible medium film, an adhesive layer and a copper foil substrate from top to bottom;
the disinfection coating comprises 90-95 parts of nano silver-copper alloy mixed particles, 7-9 parts of peony root bark extract and 3-5 parts of zirconium oxide powder;
the anti-oxidation coating comprises aluminum oxide;
the insulating flexible medium film is internally provided with a cavity, the insulating flexible medium film is internally provided with a solid-liquid phase change agent, the phase change critical point of the solid-liquid phase change agent is 10-15 ℃, and the insulating flexible medium film is connected with the copper foil substrate in an adhesion manner through the adhesive layer.
Further, the insulating flexible medium film is any one of a polyimide film, a polyester film and a polytetrafluoroethylene film.
Further, the adhesive layer is any one of acrylate adhesive, polyurethane adhesive or butyl adhesive.
Further, a coupling agent is arranged between the anti-oxidation coating and the insulating flexible medium film.
Further, the coupling agent is a silane coupling agent, a titanate coupling agent or an aluminate coupling agent.
Further, the solid-liquid phase change agent comprises 13 parts by weight of beryllium chloride tetrahydrate, 6 parts by weight of barium chloride dihydrate, 2 parts by weight of silicon dioxide, 5 parts by weight of crotonic acid, 3 parts by weight of potassium chloride and 15 parts by weight of water.
Further, the solid-liquid phase change agent comprises, by weight, 30 parts of beryllium chloride tetrahydrate, 9 parts of barium chloride dihydrate, 2 parts of silicon dioxide, 5 parts of maleic anhydride, 7 parts of sodium acetate, 9 parts of potassium chloride and 40 parts of water.
On the other hand, the invention also provides a manufacturing process of the flexible composite circuit board, which comprises the following steps:
s1: pasting glue, namely coating the viscose glue on the copper foil substrate;
s2: filling a solid-liquid phase change agent, forming an internal cavity by the insulating flexible medium film through vacuum blow molding, filling the solid-liquid phase change agent into the internal cavity, sealing the insulating flexible medium film after bubble removal treatment, and flattening to obtain the insulating flexible medium flat film filled with the solid-liquid phase change agent;
s3: sticking a film, namely sticking the obtained insulating flexible medium flat film on a viscose through hot pressing;
s4: and (2) electrostatic spraying, namely applying direct current high voltage between the copper foil substrate with the film and a spray gun to generate an electrostatic field to charge disinfection coating particles and anti-oxidation coating particles, spraying the anti-oxidation coating and the disinfection coating on the insulating flexible medium flat film in sequence, and depositing the coating particles on the surface of the insulating flexible medium flat film uniformly through mutual collision under the action of the electrostatic field to obtain a finished product of the flexible composite circuit board.
The invention has the beneficial effects that:
1. according to the invention, a certain amount of nano silver-copper alloy particles are added into the disinfecting coating, at a conventional temperature, only copper metal atoms exposed on the outer surface can be oxidized (the internal copper metal atoms are not oxidized), silver metal atoms are not oxidized (the silver metal atoms are not easily oxidized at a low temperature and are easily oxidized only at a high temperature, which is the physical characteristic of the silver metal), so that the alloy material has better conductivity and sterilizing performance, the more excellent the conductivity of the material is, the stronger the interference capability on a biological electric field of microorganisms is, the stronger the capability of killing the microorganisms is, and thereby superbacteria and viruses can be killed; a certain amount of zirconium oxide is added into the disinfecting coating, the zirconium oxide can induce air negative ions, and the negative ions can sterilize, disinfect, deodorize and keep fresh; the peony root bark extract in the disinfection coating contains various active substances such as paeonol, gallic acid, quercetin, tannic acid, theaflavin and the like, so that the peony root bark extract can resist bacteria (escherichia coli, staphylococcus aureus, salmonella, listeria and the like), fungi (black mold, blue mold and the like), fungi (bacteria causing tinea, candida, acne pathogenic bacteria and the like) and viruses (foot-and-mouth disease virus, avian influenza and the like).
2. The oxidation-resistant coating containing the alumina is sprayed on the surface of the flexible composite circuit board, so that the oxidation reaction on the surface of the flexible composite circuit board can be effectively prevented, and the surface of the flexible composite circuit board can be prevented from being scratched by hard parts because the alumina has the characteristic of high hardness, so that the flexible composite circuit board is more durable.
3. According to the invention, the solid-liquid phase change agent with the phase change critical point of 10-15 ℃ is filled in the insulating flexible medium film, and then the insulating flexible medium film is bonded with the copper foil substrate, so that after the arrangement, when the flexible composite circuit board is in a high-temperature heating state due to long-time use, the solid-liquid phase change agent is changed into a liquid state from a solid state, and the heat emitted by the mobile electronic equipment is absorbed in the process, so that the flexible composite circuit board can be continuously cooled.
Drawings
Fig. 1 is a schematic diagram of a flexible composite circuit board layer according to an embodiment of the invention.
In the figure, an anti-microbial coating 100; an oxidation-preventing coating 200; an insulating flexible dielectric film 300; an adhesive layer 400; a copper foil substrate 500.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the following will explain in detail a flexible composite circuit board with a virus killing function and a manufacturing process thereof with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Example one
Referring to fig. 1, the flexible composite circuit board with a virus killing function sequentially includes, from top to bottom, a virus killing coating 100, an anti-oxidation coating 200, an insulating flexible dielectric film 300, an adhesive layer 400, and a copper foil substrate 500.
The anti-virus coating 100 comprises 90 parts of nano silver-copper alloy mixed particles, 9 parts of peony root bark extract and 5 parts of zirconia powder.
The anti-oxidation coating 200 comprises alumina, and other additives such as corrosion inhibitor, toughening agent, coupling agent, etc. can be added for improving other performances; the coupling agent can better combine the insulating flexible medium film 300 with the anti-oxidation coating 200, the main component of which is alumina, the coupling agent can be a silane coupling agent, a titanate coupling agent or an aluminate coupling agent, and the like, the addition of the coupling agent can enhance the adhesive strength between the insulating flexible medium film 300 and the anti-oxidation coating 200, improve the performance of the composite material, simultaneously prevent other media from permeating into an interface, improve the state of the interface, and be beneficial to the aging resistance, the stress resistance and the electrical insulation performance of a product.
The insulating flexible medium film 300 is a polytetrafluoroethylene film, a cavity is arranged in the polytetrafluoroethylene film, a solid-liquid phase change agent is arranged in the cavity and comprises 13 parts of beryllium chloride tetrahydrate, 6 parts of barium chloride dihydrate, 2 parts of silicon dioxide, 5 parts of crotonic acid, 3 parts of potassium chloride and 15 parts of water, the phase change critical point of the solid-liquid phase change agent is 10 ℃, and the polytetrafluoroethylene film is bonded with the copper foil substrate 500 through acrylate glue.
Example two
Referring to fig. 1, a flexible composite circuit board with a virus killing function sequentially comprises, from top to bottom, a virus killing coating 100, an anti-oxidation coating 200, an insulating flexible dielectric film 300, an adhesive layer 400 and a copper foil substrate 500;
the anti-virus coating 100 comprises 95 parts of nano silver-copper alloy mixed particles, 7 parts of peony root bark extract and 3 parts of zirconia powder.
The anti-oxidation coating 200 comprises alumina, and other additives such as corrosion inhibitor, toughening agent, coupling agent, etc. can be added for improving other performances; the coupling agent can better combine the insulating flexible medium film 300 with the anti-oxidation coating 200, the main component of which is alumina, the coupling agent can be a silane coupling agent, a titanate coupling agent or an aluminate coupling agent, and the like, the addition of the coupling agent can enhance the adhesive strength between the insulating flexible medium film 300 and the anti-oxidation coating 200, improve the performance of the composite material, simultaneously prevent other media from permeating into an interface, improve the state of the interface, and be beneficial to the aging resistance, the stress resistance and the electrical insulation performance of a product.
The insulating flexible medium film 300 is a polyimide film, a cavity is arranged in the polyimide film, a solid-liquid phase change agent is arranged in the cavity, the solid-liquid phase change agent comprises 30 parts of beryllium chloride tetrahydrate, 9 parts of barium chloride dihydrate, 2 parts of silicon dioxide, 5 parts of maleic anhydride, 7 parts of sodium acetate, 9 parts of potassium chloride and 40 parts of water, the phase change critical point of the solid-liquid phase change agent is 15 ℃, and the polyimide film is bonded with the copper foil substrate 500 through polyurethane glue.
EXAMPLE III
Referring to fig. 1, a flexible composite circuit board with a virus killing function sequentially comprises, from top to bottom, a virus killing coating 100, an anti-oxidation coating 200, an insulating flexible dielectric film 300, an adhesive layer 400 and a copper foil substrate 500;
the anti-virus coating 100 comprises 93 parts of nano silver-copper alloy mixed particles, 8 parts of peony root bark extract and 4 parts of zirconia powder.
The anti-oxidation coating 200 comprises alumina, and other additives such as corrosion inhibitor, toughening agent, coupling agent, etc. can be added for improving other performances; the coupling agent can better combine the insulating flexible medium film 300 with the anti-oxidation coating 200, the main component of which is alumina, the coupling agent can be a silane coupling agent, a titanate coupling agent or an aluminate coupling agent, and the like, the addition of the coupling agent can enhance the adhesive strength between the insulating flexible medium film 300 and the anti-oxidation coating 200, improve the performance of the composite material, simultaneously prevent other media from permeating into an interface, improve the state of the interface, and be beneficial to the aging resistance, the stress resistance and the electrical insulation performance of a product.
The insulating flexible medium film 300 is a polyester film, a cavity is arranged in the polyester film, a solid-liquid phase change agent is arranged in the cavity, the solid-liquid phase change agent comprises 13 parts of beryllium chloride tetrahydrate, 6 parts of barium chloride dihydrate, 2 parts of silicon dioxide, 5 parts of crotonic acid, 3 parts of potassium chloride and 15 parts of water, the phase change critical point of the solid-liquid phase change agent is 10 ℃, and the polyester film is in adhesive connection with the copper foil substrate 500 through butyl rubber.
It should be noted that the polyimide film, the polyester film or the teflon film in the above three embodiments all have insulating, waterproof and air-permeable functions, the insulating function is mainly to protect the copper foil substrate 500, and the waterproof and air-permeable functions are mainly to prevent the solid-liquid phase change agent from leaking during the phase transformation.
In the three embodiments, the acrylate glue, the polyurethane glue or the butyl glue are all waterproof glue, and all have waterproof effect.
Comparative example 1
In contrast to example one, the biocidal coating 100 was not sprayed, and the rest were the same.
Comparative example No. two
Compared with the first embodiment, the insulating flexible dielectric film 300 is not filled with the solid-liquid phase-change agent, and the rest is the same.
The product is subjected to an antibacterial/viral performance test through GB/T31402-2015
The comparison shows that the flexible composite circuit boards in the three embodiments of the invention have excellent sterilization and virus killing capabilities, and the comparative example also has excellent sterilization and virus killing capabilities, because a certain amount of nano silver-copper alloy particles are added into the sterilization coating 100, when the flexible composite circuit boards are cooled at low temperature, only copper metal atoms exposed on the outer surface can be oxidized (the internal copper metal atoms are not oxidized), silver metal atoms are not oxidized (the silver metal atoms are not easily oxidized at low temperature and are easily oxidized only at high temperature, which is the physical property of silver metal), so that the conductive performance and the sterilization performance of the alloy material are better, the more excellent the conductive performance of the material is, the stronger the interference capability on a biological electric field of microorganisms is, the stronger the capability of killing the microorganisms is, and super bacteria and viruses can be killed; a certain amount of zirconium oxide is added into the disinfection coating 100, and when the refrigerator works, the zirconium oxide can induce air negative ions which can sterilize, disinfect, deodorize and keep fresh; the peony root bark extract added into the disinfecting coating 100 contains various active substances such as paeonol, gallic acid, quercetin, tannic acid, theaflavin and the like, so that the peony root bark extract can resist bacteria (escherichia coli, staphylococcus aureus, salmonella, listeria and the like), fungi (black mold, blue mold and the like), fungi (bacteria causing blazing, candida, acne pathogenic bacteria and the like) and viruses (foot-and-mouth disease virus, avian influenza and the like).
Product heat dispersion test
As can be seen from the above comparison, the three embodiments and the first comparative example of the present invention all have the insulating flexible dielectric thin film 300 filled with the solid-liquid phase change agent therein, so that the heat dissipation efficiency can be ensured to be more than 50%, because when the mobile electronic device is in a high temperature heating state due to long-term use, the solid-liquid phase change agent is changed from the solid state to the liquid state, and the heat dissipated by the mobile electronic device is absorbed in the process, so that the mobile electronic device can be continuously cooled; in contrast to the second embodiment, since the insulating flexible dielectric film 300 is not filled with the solid-liquid phase change agent, the heat dissipation effect of the flexible composite circuit board of the second embodiment is very poor, which is not favorable for normal operation of the electronic components inside the composite circuit board and is easy to fail or damage.
In addition, the invention also provides a manufacturing process of the flexible composite circuit board in the three embodiments, which comprises the following steps:
s1: pasting glue, namely coating the viscose glue on the copper foil substrate;
s2: filling a solid-liquid phase change agent, forming an internal cavity by the insulating flexible medium film through vacuum blow molding, filling the solid-liquid phase change agent into the internal cavity, sealing the insulating flexible medium film after bubble removal treatment, and flattening to obtain the insulating flexible medium flat film filled with the solid-liquid phase change agent;
s3: sticking a film, namely sticking the obtained insulating flexible medium flat film on a viscose through hot pressing;
s4: and (2) electrostatic spraying, namely applying direct current high voltage between the copper foil substrate with the film and a spray gun to generate an electrostatic field to charge disinfection coating particles and anti-oxidation coating particles, spraying the anti-oxidation coating and the disinfection coating on the insulating flexible medium flat film in sequence, and depositing the coating particles on the surface of the insulating flexible medium flat film uniformly through mutual collision under the action of the electrostatic field to obtain a finished product of the flexible composite circuit board.
It should be noted that in the film pasting process, any one of a spraying process, a co-extrusion process, and an in-mold film coating process may be selected, as long as the fixing of the film pasting is satisfied, and the method is not limited herein.
The electrostatic spraying in the process flow has the following advantages: (1) the mechanically atomized coating particles repel each other after having a negative charge and become more dispersed and more uniform; (2) due to the attraction effect of the electric field, the charged paint mist is effectively adsorbed and deposited on the surface of the workpiece, the adhesion rate is high, the paint mist is uniformly distributed on the whole surface, and the utilization rate of the paint can reach more than 80 percent, so that the paint is saved; (3) compared with air spraying and high-pressure airless spraying, the paint mist particles have low flowing speed, so that the working environment condition is improved, and the health of workers is facilitated.
Although the present invention has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (7)
1. The manufacturing process of the flexible composite circuit board with the virus killing function is characterized in that the flexible composite circuit board sequentially comprises a virus killing coating (100), an anti-oxidation coating (200), an insulating flexible medium film (300), an adhesive layer (400) and a copper foil substrate (500) from top to bottom;
the disinfection coating (100) comprises 90-95 parts of nano silver-copper alloy mixed particles, 7-9 parts of peony root bark extract and 3-5 parts of zirconium oxide powder;
the oxidation-resistant coating (200) comprises alumina;
a cavity is arranged in the insulating flexible dielectric film (300), a solid-liquid phase change agent is arranged in the cavity, the phase change critical point of the solid-liquid phase change agent is 10-15 ℃, and the insulating flexible dielectric film (300) is in adhesive connection with the copper foil substrate (500) through the adhesive layer (400);
the manufacturing process comprises the following steps:
s1: pasting glue, namely coating the viscose glue on the copper foil substrate;
s2: filling a solid-liquid phase change agent, forming an internal cavity by the insulating flexible medium film through vacuum blow molding, filling the solid-liquid phase change agent into the internal cavity, sealing the insulating flexible medium film after bubble removal treatment, and flattening to obtain the insulating flexible medium flat film filled with the solid-liquid phase change agent;
s3: sticking a film, namely sticking the obtained insulating flexible medium flat film on a viscose through hot pressing;
s4: and (2) electrostatic spraying, namely applying direct current high voltage between the copper foil substrate with the film and a spray gun to generate an electrostatic field to charge disinfection coating particles and anti-oxidation coating particles, spraying the anti-oxidation coating and the disinfection coating on the insulating flexible medium flat film in sequence, and depositing the coating particles on the surface of the insulating flexible medium flat film uniformly through mutual collision under the action of the electrostatic field to obtain a finished product of the flexible composite circuit board.
2. The manufacturing process of the flexible composite circuit board with the virucidal function as claimed in claim 1, wherein the insulating flexible dielectric film (300) is any one of a polyimide film, a polyester film or a polytetrafluoroethylene film.
3. The manufacturing process of the flexible composite circuit board with the virucidal function as claimed in claim 1, wherein the adhesive layer (400) is any one of acrylate glue, polyurethane glue and butyl glue.
4. The manufacturing process of the flexible composite circuit board with the antivirus function according to claim 1, wherein a coupling agent is provided between the anti-oxidation coating and the insulating flexible medium film (300).
5. The manufacturing process of the flexible composite circuit board with the virucidal function as claimed in claim 4, wherein the coupling agent is a silane coupling agent, a titanate coupling agent or an aluminate coupling agent.
6. The manufacturing process of the flexible composite circuit board with the virucidal function, according to claim 1, wherein the solid-liquid phase change agent comprises 13 parts by weight of beryllium chloride tetrahydrate, 6 parts by weight of barium chloride dihydrate, 2 parts by weight of silicon dioxide, 5 parts by weight of crotonic acid, 3 parts by weight of potassium chloride and 15 parts by weight of water.
7. The manufacturing process of the flexible composite circuit board with the virucidal function according to claim 1, wherein the solid-liquid phase change agent comprises 30 parts by weight of beryllium chloride tetrahydrate, 9 parts by weight of barium chloride dihydrate, 2 parts by weight of silicon dioxide, 5 parts by weight of maleic anhydride, 7 parts by weight of sodium acetate, 9 parts by weight of potassium chloride and 40 parts by weight of water.
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Address after: Building 101, No. 7 Datian Yangnan 1st Road, Dongfang Community, Songgang Street, Bao'an District, Shenzhen City, Guangdong Province, 518000 Patentee after: Shenzhen Jiean nano composite material Co.,Ltd. Address before: 518000 Factory Building No. 7 Datian Yangnan 1st Road, Dongfang Community, Songgang Street, Bao'an District, Shenzhen, Guangdong Province Patentee before: Shenzhen Jiean nano composite material Co.,Ltd. |
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| CP02 | Change in the address of a patent holder |