CN112813465B - 3D printing device and method based on electro-deposition - Google Patents
3D printing device and method based on electro-deposition Download PDFInfo
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- CN112813465B CN112813465B CN201911119616.XA CN201911119616A CN112813465B CN 112813465 B CN112813465 B CN 112813465B CN 201911119616 A CN201911119616 A CN 201911119616A CN 112813465 B CN112813465 B CN 112813465B
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/003—3D structures, e.g. superposed patterned layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to a 3D printing device and method based on electrodeposition, which comprises a model plate, an electrode plate, ionic liquid, a light source and a power supply, wherein the model plate and the electrode plate are correspondingly arranged and can move relatively, the ionic liquid is filled between the model plate during initial printing and a deposition model on the model plate and the electrode plate during printing, the gap between the deposition model and the electrode plate is less than 1mm, or the depth of the deposition model immersed in the ionic liquid is less than 1mm, a material conveying device for maintaining the ionic liquid to flow is arranged between the deposition model and the electrode plate, the electrode plate is of a selective illumination conductive structure, an illumination conductive area is electrically connected with the ionic liquid, the electrode plate is electrically connected with the positive electrode of the power supply, the model plate is electrically connected with the negative electrode of the power supply, and the light source is arranged on the other side of the electrode plate relative to the model plate. The invention can realize flexible and accurate selective electrodeposition additive printing, and is beneficial to improving the accuracy and efficiency of electrodeposition-based 3D printing.
Description
Technical Field
The invention belongs to the technical field of 3D printing, and particularly relates to a 3D printing device and method based on electrodeposition.
Background
In a conventional 3D printing apparatus based on a powder spreading process, a layer of powder material is spread on a work table (or called a powder bed or a material bed) by using a material spreading apparatus, and then a laser beam is controlled to irradiate the spread powder layer or a binder injector is used to selectively spray the spread powder layer according to information of a printed model to form a selectively solidified layer. And then, the workbench descends by one material layer thickness, then the powder layer is paved and selectively solidified on the powder layer, and the process is repeated until the three-dimensional model is printed. The method has the disadvantages of complicated process, high printing cost, low speed and low precision.
If the traditional selective electrodeposition mode is adopted, namely, the mode of spraying electrolyte (or ionic liquid or ionic solution) by one or more nozzles and electrifying for electrodeposition is used for metal forming, the structure of the 3D printer is still more complex, and the number of the movable nozzles or the array electrodes is not easy to manufacture more or more finely, so that the printing speed is low, the electrolyte covers the whole printing model in the printing process, the whole surface of the model in the electrodeposition process can be electroplated, and the printing precision of the model is influenced.
Disclosure of Invention
The invention aims to provide a 3D printing device and method based on electrodeposition, which can realize flexible and accurate selective electrodeposition additive printing and is beneficial to improving the precision and efficiency of electrodeposition-based 3D printing.
The invention solves the technical problem by adopting the technical scheme that a 3D printing device based on electrodeposition is provided, which comprises a model plate, an electrode plate, ionic liquid, a light source and a power supply and is characterized in that: the model plate and the electrode plate are correspondingly arranged and can relatively move, ionic liquid is filled between the model plate during initial printing and a deposition model on the model plate during printing and the electrode plate, the clearance between the deposition model and the electrode plate is less than 1mm and/or the depth of the deposition model immersed into the ionic liquid is less than 1mm, a material conveying device for maintaining the flow of the ionic liquid is arranged between the deposition model and the electrode plate, the material conveying device is a material conveying belt or a material scraper which moves between the deposition model and the electrode plate so as to drive the flow of the ionic liquid or a micro-nozzle array which sprays the ionic liquid between the deposition model and the electrode plate along the upper surface of the electrode plate, the electrode plate is of a selective illumination conductive structure, the illumination conductive area is electrically connected with the ionic liquid, the electrode plate is electrically connected with the positive electrode of the power supply, the model plate is electrically connected with the negative electrode of the power supply, and the light source is arranged on the other side of the electrode plate opposite to the model plate.
The electrode plate includes the array electrode layer and the photo-resistor layer that combine each other, the photo-resistor layer is located the opposite side of the relative model board of array electrode layer, the array electrode includes conducting wire board and electrode, conducting wire board is equipped with the electrode hole that the array distributes, the electrode set up in the electrode hole and with conducting wire board between mutual insulation, through photo-resistor layer conductive connection between the electrode of illumination conducting area and the conducting wire board, the conducting wire board is connected with the anodal electricity of power, the electric conduction is expert between electrode and the ionic liquid, it is insulating between conducting wire board and the ionic liquid.
The electrode plate comprises a transparent conducting layer and a photoresistance layer which are mutually combined, the transparent conducting layer is positioned on the other side of the photoresistance layer opposite to the model plate, the transparent conducting layer is electrically connected with a positive electrode of a power supply, and the photoresistance layer is electrically connected with the ionic liquid.
The electrode plate comprises a P-type semiconductor layer and an N-type semiconductor layer which are combined with each other, the N-type semiconductor layer is positioned on the other side of the P-type semiconductor layer opposite to the model plate, the N-type semiconductor layer is electrically connected with the anode of the power supply, and the P-type semiconductor layer is electrically connected with the ionic liquid.
And grid electrodes are arranged on the other side of the N-type semiconductor layer relative to the model plate and are electrically connected with the positive electrode of the power supply, and anti-reflection layers are arranged in interval illumination areas among the grid electrodes.
And a transparent conducting layer is arranged on the other side of the N-type semiconductor layer, which is opposite to the model plate, and the transparent conducting layer is electrically connected with the positive electrode of the power supply.
The electrode plate comprises a P-type semiconductor layer and an N-type semiconductor layer which are combined with each other, the N-type semiconductor layer is located on the other side, opposite to the model plate, of the P-type semiconductor layer, the N-type semiconductor layer is provided with a P-type semiconductor array, the P-type semiconductor array is electrically connected with the positive electrode of the power supply, and the P-type semiconductor layer is electrically connected with the ionic liquid.
The electrode plate comprises a P-type semiconductor layer and an N-type semiconductor layer which are combined with each other, the N-type semiconductor layer is located on the other side, opposite to the model plate, of the P-type semiconductor layer, the P-type semiconductor layer is provided with an N-type semiconductor array, the N-type semiconductor layer is electrically connected with the anode of the power supply, and the N-type semiconductor array is electrically connected with the ionic liquid.
The light beam emitted by the light source is adjusted by the optical system and is emitted to the electrode plate to form an electrode pattern and a localized electric field.
When the material conveyer is a material conveying belt, the material conveying belt is provided with a vertical through hole structure, so that the ionic liquid can flow in the up-and-down direction of the through hole structure.
When the material conveyer is a material conveying belt, the ionic liquid is adsorbed in the material conveying belt, the upper surface of the material conveying belt is in contact with the surface of the deposition model layer, and the surface of the layer is in contact with the electrode plate, so that electric connection, movement of charged ions in the ionic liquid and electrodeposition to the surface of the deposition model layer are realized through the contact.
When the material conveying device is a material conveying belt, two opposite sides of the electrode plate are respectively provided with an ionic liquid box, a rotating shaft is arranged in the ionic liquid box, and the material conveying belt is driven to rotate and drive ionic liquid to move through the rotating shafts at two ends.
And a temperature control device and/or an ultrasonic generating device are/is further arranged in the ionic liquid tank.
And the side surface of the model plate opposite to the electrode plate is provided with a conductive easy-to-release layer, and the deposition model is printed and formed on the easy-to-release layer.
And a current sensor is arranged on an electric connection loop between the model plate and the electrode plate, and the relative movement between the model plate and the electrode plate is regulated and controlled by detecting a loop current signal through the current sensor.
When the material conveyer is a micro-nozzle array, a return pipeline for returning the ionic liquid into the ionic liquid tank is arranged in the direction opposite to the spraying direction of the micro-nozzle array.
The technical scheme adopted by the invention for solving the technical problem is to provide a 3D printing method based on electrodeposition, which comprises a model plate, an electrode plate, ionic liquid, a light source and a power supply, wherein the electrode plate is electrically connected with the positive pole of the power supply, the model plate is electrically connected with the negative pole of the power supply, and the light source is arranged on the other side of the electrode plate relative to the model plate, and comprises the following steps:
(1) analyzing the structure of the preprinting model to obtain model data of each printing layer;
(2) adjusting the distance between the model plate and the electrode plate to be a preset distance;
(3) filling ionic liquid between the model plate during initial printing and a deposition model on the model plate and an electrode plate during printing, keeping the gap between the deposition model and the electrode plate to be less than 1mm, or keeping the surface of the model plate or the surface of the deposition model to be flush with the top surface of the ionic liquid or the depth of immersing the ionic liquid to be less than 1 mm;
(4) controlling a light beam emitted by a light source according to the pattern of the printing layer, so that the light beam irradiates on an electrode plate to form an electrode pattern matched with the pattern of the printing layer, a localized electric field is formed between the electrode plate and a model plate corresponding to the electrode pattern, and ionic liquid at a position on the model plate corresponding to the localized electric field is subjected to electrodeposition to form a deposited printing layer;
(5) driving the ionic liquid to flow by adopting a material transfer device between the deposition model and the electrode plate, and updating the ionic liquid between the model plate and the electrode plate;
(6) and (5) repeating the steps (2) to (5) to sequentially perform deposition printing on each printing layer of the preprinting model to obtain a deposition model (4).
The technical scheme adopted by the invention for solving the technical problem is to provide a 3D printing method based on electrodeposition, which comprises a model plate, an electrode plate, ionic liquid, a light source and a power supply, wherein the electrode plate is electrically connected with the positive pole of the power supply, the model plate is electrically connected with the negative pole of the power supply, and the light source is arranged on the other side of the electrode plate relative to the model plate, and comprises the following steps:
(1) analyzing the structure of the preprinting model to obtain model data of each printing layer;
(2) adjusting the distance between the model plate and the electrode plate to be a preset distance;
(3) filling ionic liquid between the model plate during initial printing and a deposition model on the model plate and an electrode plate during printing, keeping the gap between the deposition model and the electrode plate to be less than 1mm, or keeping the surface of the model plate or the surface of the deposition model to be flush with the top surface of the ionic liquid or the depth of immersing the ionic liquid to be less than 1 mm;
(4) controlling a light beam emitted by a light source according to the pattern of the printing layer, so that the light beam irradiates on an electrode plate to form an electrode pattern matched with the pattern of the printing layer, a localized electric field is formed between the electrode plate and a model plate corresponding to the electrode pattern, and ionic liquid at a position on the model plate corresponding to the localized electric field is subjected to electrodeposition to form a deposited printing layer;
(5) updating ionic liquid between the model plate and the electrode plate by adopting relative translation between the model plate and the electrode plate;
(6) and (5) repeating the steps (2) to (5) to sequentially perform deposition printing on each printing layer of the preprinting model to obtain a deposition model (4).
In the layer printing process, the current of each corresponding point is controlled in the step (4) by detecting the concave-convex information of the surface of the deposition model layer, so that the surface of the layer tends to be flat or keeps flat.
And (4) controlling the current of each point by adjusting the irradiation light intensity distribution of the light beam.
The light intensity is increased corresponding to the concave part of the deposition model, and the current is increased, or the light intensity is reduced corresponding to the convex part, and the current is reduced.
And a current sensor is arranged on an electric connection loop between the model plate and the electrode plate, and the relative movement between the model plate and the electrode plate is regulated and controlled by detecting a loop current signal through the current sensor.
Advantageous effects
Firstly, the selective illumination of the electrode plate enables the illumination area of the electrode plate to form an electric conduction area, the electrode pattern with controllable shape can be obtained on the electrode plate, and the localized electric field with controllable shape is formed between the photovoltaic plate and the model plate, so that flexible and accurate selective electrodeposition additive printing can be realized. And the on-off of the current can be flexibly controlled by controlling the light beam, the response speed is high, and the accuracy and the efficiency of the electrodeposition printing are favorably improved.
Secondly, the interval between the template and the electrode plate is regulated and controlled, so that the surface of the deposition model layer is in flush contact with the ionic liquid or is extremely thin immersed, repeated electrodeposition of the printed part of the deposition model can be effectively reduced or avoided, and the printing precision of the deposition model can be greatly improved.
Thirdly, the material conveyer is arranged in the ionic liquid, so that the ionic liquid in a narrow gap between the deposition model and the electrode plate can be quickly updated through the material conveyer, and quick and accurate electrodeposition printing is facilitated.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention (deposition model is level with the ionic liquid).
Fig. 2 is a schematic structural diagram (deposition model immersion ionic liquid) of the principle of the present invention.
Fig. 3 is a schematic structural diagram of embodiment 1 of the present invention.
Fig. 4 is a schematic plan view of the electrode plate in embodiment 1 of the present invention.
Fig. 5 is a schematic structural diagram of embodiment 2 of the present invention.
Fig. 6 is a schematic structural diagram of embodiment 3 of the present invention.
Fig. 7 is a schematic structural diagram of embodiment 4 of the present invention.
Fig. 8 is a schematic structural diagram of embodiment 5 of the present invention.
Fig. 9 is a schematic structural diagram of embodiment 6 of the present invention.
Fig. 10 is a schematic structural diagram of embodiment 7 of the present invention.
Fig. 11 is a schematic structural diagram of embodiment 8 of the present invention.
Fig. 12 is a schematic structural view of embodiment 9 of the present invention.
Fig. 13 is a sectional view a-a of fig. 12.
Detailed Description
The invention will be further illustrated with reference to the following specific examples. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Further, it should be understood that various changes or modifications of the present invention may be made by those skilled in the art after reading the teaching of the present invention, and such equivalents may fall within the scope of the present invention as defined in the appended claims.
Referring to fig. 1, which is a schematic view of a 3D printing apparatus based on electrodeposition, a pattern plate 1 is positioned on top, an electrode plate 2 is positioned on bottom, the pattern plate 1 and the electrode plate 2 are vertically disposed in correspondence, and a printed deposition pattern 4 is coupled to the pattern plate 1. The electrode plate 2 is a selective illumination conductive structure, that is, the bottom surface of the electrode plate 2 is selectively irradiated by the light beam 51 emitted by the light source 5, and the side surface of the electrode plate 2 facing the model plate 1 can be formed with an electrode pattern matching (same or equal proportion) the irradiation of the light beam 51. The pattern plate 1 and the electrode plate 2 can move relatively, such as the pattern plate 1 moves away in a direction perpendicular to the surface of the electrode plate 2 (i.e., in a direction indicated by a first arrow 91). An ionic liquid 3 is disposed between the mold plate 1 and the electrode plate 2, the ionic liquid 3 contains ions 31, and the top surface of the ionic liquid 3 contacts the surface of the mold plate 1 at the time of initial printing or the surface of a deposition pattern 4 on the mold plate 1 during printing (i.e., the lower surface in the drawing), as shown in fig. 1. Or the deposition model 4 is partially immersed into the ionic liquid 4 to a depth of less than 1 millimeter (mm), as shown in fig. 2, and the ionic liquid 3 is in contact with the upper surface of the electrode plate 2. The printing device also comprises a power supply 6, wherein the negative electrode of the power supply 6 is electrically connected with the model plate 1, the positive electrode of the power supply 6 is electrically connected with the electrode plate 2, an electric loop is formed by the ionic liquid 3, and the power supply 6 can adopt a direct current power supply or a pulse power supply. Of course, a switch or a current detection device may be provided in the circuit. It is also possible to include control means (not shown in the figure) for the light beam 51, the power source 6, the relative movement of the pattern plate 1 and the electrode plate 2, or the control of the scraper 71, etc.
In the printing process, an irradiation pattern of the light beam 51 is formed according to a layer pattern of a pre-printed model and is irradiated onto the electrode plate 2, a corresponding electrode pattern is formed on the upper surface of the electrode plate 2 and is electrically conductive with the ionic liquid 3, a region, which is not irradiated by the light beam, on the upper surface of the electrode plate 2 is not electrically conductive with the ionic liquid 3, a localized electric field is formed between the electrode plate 2 and the model plate 1, and the ions 31 are driven to move towards the model plate 1 during initial printing or the deposition model 4 during printing and generate electrodeposition. When the deposition pattern 4 is formed between the mold plate 1 and the electrode plate 2, the deposition pattern 4 is coupled to the mold plate 1, the mold plate 1 can move away from the electrode plate 2 along the first arrow 91 during the printing process, for example, the mold plate 1 can move a set distance and then stop performing electrodeposition, and then move the set distance again, or continuously move in a direction away from the electrode plate 2 until the printing of the entire deposition pattern 4 is completed. The ionic liquid 3 between the deposition model 4 and the electrode plate 2 during the printing process can be rapidly refreshed by a material conveyer 7, for example, the material conveyer 7 in fig. 1 is a scraper 71, the scraper 71 is disposed between the deposition model 4 (i.e., the deposition model 4 or the model plate 1) and the electrode plate 2 as shown in fig. 1, and the scraper 71 refreshes the ionic liquid 3 in the narrow gap between the deposition model 4 and the electrode plate 2 by moving in the direction of the second arrow 92.
The relative movement of the model plate 1 and the electrode plate 2 means that the model plate 1 drives the deposition model 4 to move a set distance away from the electrode plate 2 along the direction indicated by the first arrow 91; it is also possible that the mold plate 1 and the deposition mold 4 do not move, while the electrode plate 2 moves in the opposite direction of the first arrow 91; or the relative movement between the model plate 1 and the electrode plate 2 can also be the movement of the model plate 1 relative to the electrode plate 2 along the direction perpendicular to the first arrow 91, i.e. relative translation, for example, the relative movement can be used to replace the ionic liquid 3 in the narrow gap between the deposition model 4 and the electrode plate 2; or the electrode plate 2 is moved relative to the former plate 1 in a direction perpendicular to the first arrow 91. The relative movement of the pattern plate 1 and the electrode plate 2 along the direction of the first arrow 91 can keep the surface of the deposition pattern 4 in contact with the top surface of the ionic liquid 3 and not to be immersed too deeply, such as less than 1mm, or keep the distance between the surface of the deposition pattern 4 and the electrode plate 2 within a set value range, such as less than 1mm, or less than 0.1mm, thereby improving the printing precision or speed.
Fig. 2 illustrates that the bottom of the deposition model 4 is partially immersed into the ionic liquid 3, and although a patterned electrode is formed on the electrode plate 2 to form a localized electric field, ions in the immersed ionic liquid 3 are also electrodeposited on the side wall of the model 4 due to the diffusion effect of the electric field, so that it is difficult to control the printing accuracy of the deposition model 4. Therefore, it is desirable to keep the depth of immersion of the deposition model 4 into the ionic liquid 3 as small as possible, for example, for a model of a generally conventional size, when the immersion depth is greater than 1mm, the accuracy of printing may be significantly affected. In addition, fig. 2 also illustrates that the material transfer belt 72 may be adopted by the material transfer device 7, as shown in fig. 2, the material transfer belt 72 is disposed between the deposition model 4 (i.e., the deposition model 4 or the model plate 1) and the electrode plate 2, and the material transfer belt 72 moves along the direction indicated by the second arrow 92, so that the ionic liquid 3 between the deposition model 4 and the electrode plate 2 can be rapidly taken away and new ionic liquid 3 can be replenished, and the smooth printing process is ensured. The material conveying belt 72 can convey the ionic liquid 3 more stably than the material scraper 71, so that the ionic liquid 3 is not easy to wave, the splashing of the ionic liquid 3 to the side wall of the deposition model 4 is reduced, and the printing precision is favorably improved. In order to achieve better electric field localization and improve printing precision, the distance between the deposition model 4 and the electrode plate 2 is as small as possible, for example, less than 1mm, or less than 0.1mm, and in such a small gap, the material transfer belt 72 can be made of a material capable of adsorbing the ionic liquid 3, and can transfer the ionic liquid 3 more effectively than the scraper (scraper) 71. Fig. 2 also illustrates that the light source 5 is a surface projection light source, such as DLP, but may also be an LCD light source, an LED light source, or a laser scanning light source. The surface projection light source can greatly improve the forming speed of the localized electric field and improve the printing speed.
In addition, the material conveyor 7 may also adopt a micro-nozzle array mode, as shown in fig. 12 and 13, by adopting this mode, the material conveyor belt 72 or the material scraper 71 can be prevented from entering the projection area between the deposition model 4 or the model plate 1 and the electrode plate 2 during the process of ion liquid replacement, interference on electrodeposition is reduced, the device operation complexity is reduced, the system stability is improved, and the gap between the deposition model 4 or the model plate 1 and the electrode plate 2 is more favorably reduced. And has a better effect on deposition models having a small left-right direction dimension as in fig. 12 and 13.
The material conveyer 7 is a device capable of rapidly replacing the ionic liquid 3 between the deposition model 4 or the model plate 1 and the electrode plate 2 under the condition that a narrow gap (for example, less than 1mm, or less than 0.1 mm) is formed between the deposition model 4 and the electrode plate 2, and the projection area of the surface of the deposition model 4 on the electrode plate 2 can be randomly changed, and is also capable of realizing the contact between the surface of the multilayer deposition model 4 and the upper surface of the ionic liquid 3 or the immersion of the multilayer deposition model 4 in the ionic liquid 3, wherein the depth of the multilayer deposition model 4 is less than 1 mm. If an ordinary pumping device is used for pumping the ionic liquid 3 between the model plate 1 and the electrode plate 2 for high-speed washing and replacement of the ionic liquid, because the surface of the deposition model 4 is randomly changed, most of the ionic liquid flows around the deposition model 4 and cannot flow and be replaced in a gap between the deposition model 4 and the electrode plate 2, and the ionic liquid 3 mainly flows around the deposition model 4 to enable electrodeposition to be carried out on the peripheral side surface of the deposition model 4, so that the precision of the deposition model is influenced, and the forming speed of the deposition model is reduced.
Overall, the invention can achieve the following benefits: the selective electric conduction of the electrode plate 2 is realized by utilizing selective illumination to form a localized electric field, and meanwhile, the model plate 1 moves towards the direction far away from the electrode plate 2, so that the rapid selective electrodeposition additive manufacturing is realized, and the structure is simple and the cost is low. Because the deposition model 4 is not or rarely immersed in the ionic liquid 3 in the printing process, the electrodeposition does not or rarely occur on the finished printing part, and the printing precision of the model can be greatly improved. Due to the use of the material conveyor 7 (e.g., scraper 71, material conveyor belt 72, or micro-nozzle array 73), in the case of a narrow gap between the deposition model 4 and the electrode plate 2, e.g., less than 1mm or 0.1mm, rapid renewal of the ionic liquid 3 between the deposition model 4 and the electrode plate 2 can be achieved, so that a rapid and accurate electrodeposition printing process can be achieved.
Example 1
Fig. 3 illustrates an embodiment of a 3D printing device based on electrodeposition, in which the electrode plate 2 is composed of a photoresistor layer 28 and an array electrode layer 26. The photoresistor layer 28 can greatly reduce the resistance in the illuminated area, and the non-illuminated area can maintain a high resistance state, so as to realize a selective conductive area, and the photoresistor layer 28 can be made of photoresistor materials, such as photoconductive high molecular materials (photoconductive polymers), such as polyvinylcarbazole, or inorganic photoconductive materials, or other photoconductive materials, and can also form a micro-nano array of photoconductive materials. Referring to the top view of the electrode plate 2 in fig. 4, the array electrode layer 26 includes a conductive circuit board 22 and electrode holes formed in an array on the conductive circuit board 22, the electrodes 21 are disposed in the electrode holes, and the electrodes 21 and the conductive circuit board 22 are electrically connected through a photoresistive layer 28. The areas of the photoresistor layer 28 not irradiated by the light beam 51 are insulated from the electrode 21 and the conductive wiring board 22, and the areas irradiated by the light beam 51 are electrically connected and conducted between the electrode 21 and the conductive wiring board 22 through the photoresistor layer 28 having a low resistance. The electrode 21 is in contact with the ionic liquid 3 to realize electrical conduction (for example, a conductive protective layer may be disposed on the surface of the electrode 21, and the electrode is in contact with the ionic liquid 3 through the protective layer to realize electrical conduction), the conductive circuit board 22 is not electrically connected with the ionic liquid 3, or is not in contact with the ionic liquid 3, for example, an insulating material film (not shown in the figure) may be disposed between the conductive circuit board 22 and the ionic liquid 3, and the conductive circuit board 22 is electrically connected with the positive electrode of the power supply 6. The electrode plate 2 of the illumination area is provided with a corresponding charged electrode 21 pattern, and the ionic liquid 3 is provided with a corresponding pattern localized electric field. The figure also shows that the material conveying belt 72 can be contacted with the surface of the deposition model 4, and the movement of the material conveying belt 72 in the printing process can polish the surface of the deposition model 4, so that the surface of the deposition model 4 can be kept flat. The uneven or concave-convex structure of the surface of the deposition model 4 can cause distortion of an electric field or current, and the printing precision is influenced. It is also shown that an electrically conductive easy-release layer 11 may be provided between the deposition pattern 4 and the former plate 1 to facilitate removal of the deposition pattern 4 from the former plate 1 after printing has been completed, although if the former plate 1 is part of the final part, the electrically conductive easy-release layer 11 may not be necessary in order to allow the deposition pattern 4 to be reliably bonded to the former plate 1.
Example 2
Fig. 5 illustrates another embodiment of a 3D printing apparatus based on electrodeposition, wherein the electrode plate 2 comprises a photoresistor layer 28 and a transparent conductive layer 29 attached in contact with the photoresistor layer 28, the transparent conductive layer 29 is located on the other side of the photoresistor layer 28 opposite to the mold plate 1, the transparent conductive layer 29 is transparent to light (electromagnetic waves) and conductive, and the transparent conductive layer 29 is connected to the positive electrode of the power source 6. The light beam 51 irradiates the photoresistor layer 28 through the transparent conductive layer 29, the resistance of the irradiated area is greatly reduced to form an electrode pattern, and a complete electric circuit is formed through the transparent conductive layer 29, and the resistance of the non-irradiated area is kept high, so that a localized electric field is formed in the ionic liquid 3, and localized electrodeposition is performed. It is also shown that the belt 72 may have a vertical through-hole structure, so that the ionic liquid 3 can flow up and down through the through-hole structure, which facilitates electrodeposition, and can be taken away along with the belt 72 in the process of translation along the second arrow 92, thereby achieving rapid replacement of the ionic liquid 3.
In embodiment 1, the array electrode layer 26 is used to control the conductive area according to the pattern of the light beam 51, for example, the conductive circuit board 22 and the electrode 21 can be made of copper material, which is beneficial to realizing high current conduction capability; the transparent conductive layer 29 in embodiment 2 can simplify the structure of the electrode plate 2 and is advantageous for achieving high electric field localization accuracy. The transparent conductive layer 29 may be made of indium tin oxide, aluminum-doped zinc oxide, or other transparent and conductive materials.
Example 3
Fig. 6 illustrates another embodiment of a 3D printing apparatus based on electrodeposition, in which the electrode plate 2 includes a P-type semiconductor layer 23 and an N-type semiconductor layer 24, i.e., a PN junction is formed within the electrode plate 2, the N-type semiconductor layer 24 is electrically connected to the positive electrode of the power supply 6, and the P-type semiconductor layer 23 is electrically connected to the ionic liquid 3, as indicated by a symbol on the right side of the electrode plate 2 in the figure, the electrode plate 2 corresponds to a photodiode array plate. When the light beam 51 irradiates, due to the photovoltaic effect, the PN junction of the area irradiated by the light beam is conducted, an electrode pattern is formed, and a localized electric field is formed in the ionic liquid 3.
In order to reduce the current transmission loss, grid electrodes 25 may be further provided, and the grid electrodes 25 are electrically connected to each other and to the positive electrode of the power supply 6. The spaced illumination areas between the grid electrodes 25 may also be provided with an anti-reflection layer 27 to reduce the reflectivity of the beam 51 and to improve the absorption of the beam 51 onto the PN junction. The P-type semiconductor layer 23 and the N-type semiconductor layer 24 may be, but not limited to, single crystal silicon, polycrystalline silicon, amorphous silicon, CdTe, CIGS, GaAs, dye-sensitized or organic thin film, or MS junction or heterojunction including homotype heterojunction (such as P-P type heterojunction or N-N type heterojunction) or inversion heterojunction (such as P-N type heterojunction), which may be understood as PN junction in the present invention, but other semiconductor junctions capable of realizing photovoltaic effect may be used as PN junction.
Example 4
In embodiment 4 illustrated in fig. 7, the electrode plate 2 is different from embodiment 3 in that a transparent conductive layer 29 is disposed on the other side of the N-type semiconductor layer 24 opposite to the mold plate 1, the transparent conductive layer 29 is attached to the N-type semiconductor layer 24, and the transparent conductive layer 29 is electrically connected to the positive electrode of the power supply 6, so that the structure of the electrode plate 2 can be simplified, the illumination area and the current conduction efficiency can be improved, the accuracy of forming an electrode pattern by illumination can be improved, and the electrodeposition speed and accuracy can be improved. The transparent conductive layer 29 may be made of indium tin oxide, aluminum-doped zinc oxide, or other transparent and conductive material.
Example 5
Fig. 8 illustrates that the electrode plate 2 can also adopt a phototransistor array, such as a PNP type structure. In fig. 8, the electrode plate 2 includes a P-type semiconductor layer 23 electrically connected to the ionic liquid 3, an N-type semiconductor layer 24, and a P-type semiconductor array 23a discretely provided in or on the N-type semiconductor layer 24, and each semiconductor cell of the P-type semiconductor array 23a is electrically connected to the positive electrode of the power supply 6. As indicated by the right-hand symbol of the electrode plate 2, the electrode plate 2 corresponds to a phototransistor array plate, and the P-type semiconductor layer 23 may have an array structure formed of minute P-type semiconductor cells.
Example 6
Fig. 9 illustrates that the electrode plate 2 may also adopt an NPN-type semiconductor structure. The electrode plate 2 includes an N-type semiconductor layer 24, a P-type semiconductor layer 23, and an N-type semiconductor array 24a disposed in or on the P-type semiconductor layer 23, the N-type semiconductor array 24a is electrically connected to the ionic liquid 3, such as a contact, an insulating layer (not shown) may be disposed between the P-type semiconductor layer 23 and the ionic liquid 3, and the N-type semiconductor layer 24 is electrically connected to the positive electrode of the power supply 6. For example, a transparent conductive layer 29 is also schematically included, and the N-type semiconductor layer 24 is electrically connected to the positive electrode of the power supply 6 through the transparent conductive layer 29.
In embodiments 5 and 6, when the light beam 51 selectively irradiates the electrode plate 2, due to the photovoltaic effect, a photocurrent formed by a PN junction formed by the P-type semiconductor layer 23 and the N-type semiconductor layer 24 may be amplified by the phototransistor, and compared with the electrode plate 2 having the PN junction structure described above, the electrode plate 2 of the present embodiment can achieve a larger current under the same illumination, and is also beneficial to increasing the response speed and the electrodeposition speed. In addition, in order to replace the ionic liquid 3 between the mold plate 1 and the electrode plate 2, as shown in fig. 6 to 8, the mold plate 1 and the electrode plate 2 may be relatively moved in a translational manner along the direction of the second arrow 92, for example, the electrode plate 2 is moved along the second arrow 92 to move the ionic liquid 3 in a translational manner relative to the mold plate 1 and replace the ionic liquid 3 between the mold plate 1 and the electrode plate 2, or the mold plate 1 is moved along the second arrow 92 to replace the ionic liquid.
Example 7
Fig. 10 illustrates a specific embodiment of the material transfer belt 72, wherein two sides of the electrode plate 2 are respectively provided with a rotating shaft 81, two ends of the material transfer belt 72 are respectively wound on the rotating shafts 81, the rotating shafts 81 are respectively arranged in the ionic liquid tank 8, the ionic liquid with high concentration ions is filled in the ionic liquid tank 8, and the rotation of the rotating shafts 81 drives the material transfer belt 72 to transmit along the second arrow 92, so as to drive the ionic liquid 3 to move, thereby realizing the rapid replenishment of the ionic liquid 3 above the electrode plate 2 and accelerating the electrodeposition speed. A temperature control device 82 can be arranged in the ionic liquid box 8 to control the ionic liquid to be at a proper temperature, so that the ionic liquid is favorable for rapid ion deposition and the forming process is accelerated. An ultrasonic generator 83 can be further arranged, the vibration of ultrasonic waves is utilized to accelerate the ion transfer belt 72 to rapidly exchange the ion liquid which consumes ions with the ion liquid with high-concentration ions in the ion liquid tank 8, and the ion supplement capability of the ion transfer belt 72 is improved. Alternatively, the ionic liquid 3 is adsorbed in the material-transmitting belt 72, the upper surface of the material-transmitting belt 72 is in contact with the surface of the deposition model 4, and the surface of the layer is in contact with the electrode plate 2, so that the electrical connection, the movement of the charged ions in the ionic liquid 3 and the electrodeposition on the surface of the deposition model 4 are realized through the contact. In addition, a current or voltage regulator can be arranged on the electric loop to control the current or voltage in the electrodeposition process, and the current or voltage can be pulsated at a certain frequency, such as square wave current or voltage, so as to improve the performance, stability and speed of electrodeposition, although the regulator can also be applied to other embodiments of the invention. In addition, the electric circuit may be further provided with a current sensor 61, and the speed or position of the model plate 1 moving along the first arrow 91 may be adjusted according to a signal of the current sensor 61, for example, when the current is too small, the moving speed or the moving displacement of the model plate 1 is reduced, and when the current is greater than a certain set value, the model plate 1 moves or moves at a corresponding moving speed or a corresponding displacement, so as to improve the control accuracy of the distance between the deposition model 4 and the electrode plate 2, and improve the forming speed or accuracy. Of course, a circulation or filtration system may be provided in the ionic liquid tank 8 to maintain the concentration of ions in the ionic liquid 3 and to keep the ionic liquid 3 clean. The light source 5 is also illustrated as a laser light source, and the optical system 52 is used to adjust the light beam 51 to scan the electrode plate 2, so as to form an electrode pattern, which facilitates better electrode position accuracy control or larger molding area. Other planar projection light source schemes may of course be used.
Example 8
Fig. 11 illustrates an overall structure of a 3D printing apparatus based on electrodeposition, an ionic liquid 3 and a material conveying device 7 moving in a direction perpendicular to the drawing are disposed above an electrode plate 2, a light beam 51 emitted by a light source 5 is adjusted by an optical system 52 to emit towards the electrode plate 2 to form an electrode pattern and a localized electric field to perform localized electrodeposition on the surface of a deposition model 4 layer, and the deposition model 4 is combined on a model plate 1 and moves along a guide rail 95 in a direction of a first arrow 91 until the deposition model 4 is printed. In the printing process, the signal feedback of the current sensor 61 can be adopted to control the deposition model 4 to avoid that the deposition model is immersed too deeply into the ionic liquid 3 to influence the printing precision, and simultaneously, the deposition model is prevented from being separated from the ionic liquid 3 to interrupt or reduce the electrodeposition current. Each section may be mounted to a frame 99.
Example 9
Fig. 12 and 13 show another schematic structure of a 3D printing apparatus based on electrodeposition, which is different from embodiment 8 in that the material conveyer 7 employs a micro-nozzle array 73, the micro-nozzle array 73 is disposed between the deposition model 4 (i.e., the deposition model 4 or the model plate 1) and the electrode plate 2 as shown in fig. 12, and the micro-nozzle array 73 ejects the ionic liquid 3 in a direction parallel to the upper surface of the electrode plate 2, so that the ionic liquid 3 between the deposition model 4 or the model plate 1 and the electrode plate 2 can be rapidly changed, and the printing speed is increased. A return line 74 may further be provided for returning the ionic liquid to an ionic liquid tank (not shown). By adopting the mode, the material conveyer 7 can be prevented from entering the deposition model 4 or the area between the model plate 1 and the electrode plate 2, the interference on electrodeposition is reduced, the running complexity of the device is reduced, and the system stability is improved. The deposition model with a small left-right direction dimension as in fig. 12 and 13 has a better effect. Also illustrated in fig. 12 is an optical train system 52 that can also use a refractive lens to condition the beam 51, with the dashed box in the middle of fig. 13 illustrating the electrodepositable area.
The ionic liquid 3 can be metal salt solution or electrolyte in electroplating or electroforming or electrolysis technology, such as metal or alloy of copper, nickel, iron, etc., or metal salt solution or electrolyte of other metal materials, such as copper sulfate solution, nickel sulfate solution (watt solution), iron chloride solution, fluoroborate solution, sodium nitrate solution, sodium chloride solution, or sulfamate solution, etc.
The following provides an electrodeposition-based 3D printing method, using the electrodeposition-based 3D printing apparatus of the above embodiments, including the steps of:
1. analyzing the structure of the preprinting model to obtain model data of each printing layer;
2. adjusting the distance between the model plate 1 and the electrode plate 2 to be a preset distance;
3. ionic liquid 3 is filled between the model plate 1 during initial printing and a deposition model 4 on the model plate 1 and the electrode plate 2 during printing, a gap between the deposition model 4 and the electrode plate 2 is kept to be less than 1mm, and/or the surface of the deposition model 4 is kept flush with the top surface of the ionic liquid 3 or the depth of the immersed ionic liquid 3 is kept to be less than 1 mm;
4. controlling a light beam 51 emitted by a light source 5 according to a pattern of a printing layer, so that the light beam 51 irradiates on an electrode plate 2 to form an electrode pattern matched with the pattern of the printing layer, a localized electric field is formed between the electrode plate 2 and a model plate 1 corresponding to the electrode pattern, and an ionic liquid 3 at a position on the model plate 1 corresponding to the localized electric field is subjected to electrodeposition to form a deposited printing layer;
5. a material conveyer 7 between a deposition model 4 and the electrode plate 2 is adopted to drive ionic liquid 3 to flow, or relative translation between the model plate 1 and the electrode plate 2 is adopted to update the ionic liquid 3 between the model plate 1 and the electrode plate 2;
6. and repeating the steps 2-5 to sequentially perform deposition printing on each printing layer of the preprinted model to obtain a deposition model 4.
The thickness of the mold tends to be uneven after stacking a plurality of layers at the time of electrodeposition, i.e., the flatness (or planarity) is deteriorated, and the adjustment of the flatness of the layers (i.e., the flatness of the surface of the mold 4) can be performed by the following method:
first, the flatness or the distribution information of the unevenness of the surface of the detection layer, for example, the distribution information of the unevenness of each layer of the model surface, can be obtained by irradiating the region to be detected of the electrode plate 2 with a light beam point by point, detecting the current values at each position, and then analyzing the current values at each position to form the distribution map of the unevenness of the end face of the model 4. Of course, other surface irregularity detection methods are also possible.
Then, controlling the current of each point in the electrodeposition process of the corresponding layer in the step 4 according to the flatness information of the layer, so that the surface of the layer tends to be flat or keeps flat; for example, relatively increasing current at a valley, or relatively decreasing current at a lobe. The feedback control in this way can improve the molding accuracy of the mold 4. For example, the light intensity of the light beam 51 at different positions can be adjusted according to the concave-convex condition of the surface of the deposition model 4, for example, the light intensity is increased corresponding to the concave of the deposition model 4, the current is increased, or the light intensity is decreased corresponding to the convex, and the current is decreased, so that the electrodeposition speed is increased at the concave of the surface of the deposition model 4 in the electrodeposition process of the 4 th step, the electrodeposition speed is decreased at the convex, the surface of the deposition model 4 is automatically adjusted to be flat, and the printing precision is improved.
The directional terms such as "upper", "lower", "left", "right", etc. used in the description of the present invention are based on the convenience of the specific drawings and are not intended to limit the present invention. In practical applications, the actual orientation may differ from the drawings due to the spatial variation of the structure as a whole, but such variations are within the scope of the invention as claimed.
Claims (22)
1. The utility model provides a 3D printing device based on electrodeposition, includes model board (1), electrode board (2), ionic liquid (3), light source (5) and power (6), its characterized in that: the model plate (1) and the electrode plate (2) are arranged correspondingly and can move relatively, ionic liquid (3) is filled between the model plate (1) and the deposition model (4) on the model plate (1) in the printing process and the electrode plate (2) during initial printing, the gap between the deposition model (4) and the electrode plate (2) is less than 1mm and/or the depth of the deposition model (4) immersed into the ionic liquid (3) is less than 1mm, a material conveyer (7) for maintaining the ionic liquid (3) to flow is arranged between the deposition model (4) and the electrode plate (2), the material conveyer (7) is a material conveying belt (72) or a material scraper (71) which moves between the deposition model (4) and the electrode plate (2) so as to drive the ionic liquid (3) to flow or is a micro-nozzle array (73) for spraying the ionic liquid (3) between the deposition model (4) and the electrode plate (2) along the upper surface of the electrode plate (2), electrode plate (2) are selective illumination conducting structure and illumination conducting area and ionic liquid (3) electricity is connected, electrode plate (2) are connected with the anodal electricity of power (6), model board (1) are connected with the negative pole electricity of power (6), light source (5) set up in the opposite side of the relative model board (1) of electrode plate (2).
2. An electrodeposition-based 3D printing device according to claim 1, characterized in that: electrode board (2) are including array electrode layer (26) and photoresistance layer (28) that combine together, photoresistance layer (28) are located the opposite side of array electrode layer (26) relative model board (1), array electrode layer (26) include conducting circuit board (22) and electrode (21), conducting circuit board (22) are equipped with the electrode hole that the array distributes, electrode (21) set up in the electrode hole and with conducting circuit board (22) between mutual insulation, through photoresistance layer (28) conductive connection between electrode (21) and the conducting circuit board (22) of illumination conducting area, conducting circuit board (22) and the anodal electric connection of power (6), electric conduction leads to between electrode (21) and ionic liquid (3), insulating between conducting circuit board (22) and ionic liquid (3).
3. An electrodeposition-based 3D printing device according to claim 1, characterized in that: the electrode plate (2) comprises a transparent conducting layer (29) and a photoresistance layer (28) which are combined with each other, the transparent conducting layer (29) is positioned on the other side of the photoresistance layer (28) relative to the model plate (1), the transparent conducting layer (29) is electrically connected with a positive electrode of a power supply (6), and the photoresistance layer (28) is electrically connected with the ionic liquid (3).
4. An electrodeposition-based 3D printing device according to claim 1, characterized in that: the electrode plate (2) comprises a P-type semiconductor layer (23) and an N-type semiconductor layer (24) which are combined with each other, the N-type semiconductor layer (24) is positioned on the other side of the P-type semiconductor layer (23) opposite to the model plate (1), the N-type semiconductor layer (24) is electrically connected with the positive electrode of the power supply (6), and the P-type semiconductor layer (23) is electrically connected with the ionic liquid (3).
5. An electrodeposition-based 3D printing device according to claim 4, wherein: grid electrodes (25) are arranged on the other side, opposite to the model plate (1), of the N-type semiconductor layer (24), the grid electrodes (25) are electrically connected with the positive electrode of the power supply (6), and anti-reflection layers (27) are arranged in spaced illumination areas among the grid electrodes (25).
6. An electrodeposition-based 3D printing device according to claim 4, wherein: and a transparent conducting layer (29) is arranged on the other side of the N-type semiconductor layer (24) opposite to the model plate (1), and the transparent conducting layer (29) is electrically connected with the positive electrode of the power supply (6).
7. An electrodeposition-based 3D printing device according to claim 1, wherein: the electrode plate (2) comprises a P-type semiconductor layer (23) and an N-type semiconductor layer (24) which are combined with each other, the N-type semiconductor layer (24) is located on the other side, opposite to the model plate (1), of the P-type semiconductor layer (23), the N-type semiconductor layer (24) is provided with a P-type semiconductor array (23a), the P-type semiconductor array (23a) is electrically connected with a positive electrode of a power supply (6), and the P-type semiconductor layer (23) is electrically connected with the ionic liquid (3).
8. An electrodeposition-based 3D printing device according to claim 1, characterized in that: the electrode plate (2) comprises a P-type semiconductor layer (23) and an N-type semiconductor layer (24) which are combined with each other, the N-type semiconductor layer (24) is located on the other side, opposite to the model plate (1), of the P-type semiconductor layer (23), an N-type semiconductor array (24a) is arranged on the P-type semiconductor layer (23), the N-type semiconductor layer (24) is electrically connected with the positive electrode of the power supply (6), and the N-type semiconductor array (24a) is electrically connected with the ionic liquid (3).
9. An electrodeposition-based 3D printing device according to claim 1, characterized in that: a light beam (51) emitted by the light source (5) is adjusted by an optical system (52) to be emitted to the electrode plate (2) to form an electrode pattern and a localized electric field.
10. An electrodeposition-based 3D printing device according to claim 1, characterized in that: when the material conveyer (7) is a material conveying belt (72), the material conveying belt (72) is provided with a vertical through hole structure, so that the ionic liquid (3) can flow in the up-and-down direction of the through hole structure.
11. An electrodeposition-based 3D printing device according to claim 1, characterized in that: when the material conveyer (7) is a material conveying belt (72), the ionic liquid (3) is adsorbed in the material conveying belt (72), the upper surface of the material conveying belt (72) is in contact with the surface of the deposition model (4), the surface of the layer is in contact with the electrode plate (2), and electric connection, movement of charged ions in the ionic liquid (3) and electrodeposition to the surface of the deposition model (4) are realized through contact.
12. An electrodeposition-based 3D printing device according to claim 1, characterized in that: when the material conveying device (7) is a material conveying belt (72), two opposite sides of the electrode plate (2) are respectively provided with an ionic liquid box (8), a rotating shaft (81) is arranged in the ionic liquid box (8), and the material conveying belt (72) is driven to rotate through the rotating shafts (81) at two ends and drives the ionic liquid (3) to move.
13. An electrodeposition-based 3D printing device as in claim 12, wherein: the ionic liquid box (8) is also internally provided with a temperature control device (82) and/or an ultrasonic wave generating device (83).
14. An electrodeposition-based 3D printing device according to any one of claims 1 to 13, wherein: the side of the model plate (1) opposite to the electrode plate (2) is provided with a conductive easy-to-release layer (11), and the deposition model (4) is printed and formed on the easy-to-release layer (11).
15. An electrodeposition-based 3D printing device according to any one of claims 1 to 13, wherein: a current sensor (61) is arranged on an electric connection loop between the model plate (1) and the electrode plate (2), and relative movement between the model plate (1) and the electrode plate (2) is regulated and controlled by detecting a loop current signal through the current sensor (61).
16. An electrodeposition-based 3D printing device according to claim 1, wherein: when the material conveyer (7) is a micro-nozzle array (73), a return pipeline (74) for returning the ionic liquid (3) to the ionic liquid box (8) is arranged in the direction opposite to the spraying direction of the micro-nozzle array (73).
17. A3D printing method based on electrodeposition is characterized in that: including model board (1), electrode plate (2), ionic liquid (3), light source (5) and power (6), electrode plate (2) are connected with the anodal electricity of power (6), model board (1) is connected with the negative pole electricity of power (6), light source (5) set up in the opposite side of the relative model board (1) of electrode plate (2), include the following step:
(1) analyzing the structure of the preprinting model to obtain model data of each printing layer;
(2) adjusting the distance between the model plate (1) and the electrode plate (2) to be a preset distance;
(3) ionic liquid (3) is filled between the model plate (1) during initial printing and a deposition model (4) on the model plate (1) and the electrode plate (2) during printing, a gap between the deposition model (4) and the electrode plate (2) is kept to be less than 1 millimeter, and/or the surface of the model plate (1) or the surface of the deposition model (4) is kept to be flush with the top surface of the ionic liquid (3) or the depth of the immersed ionic liquid (3) is less than 1 mm;
(4) controlling a light beam (51) emitted by a light source (5) according to the pattern of the printing layer, so that the light beam (51) irradiates on an electrode plate (2) to form an electrode pattern matched with the pattern of the printing layer, a localized electric field is formed between the electrode plate (2) and a model plate (1) corresponding to the electrode pattern, and an ionic liquid (3) at a position on the model plate (1) corresponding to the localized electric field is subjected to electrodeposition to form a deposition printing layer;
(5) driving the ionic liquid (3) to flow by adopting a material conveyer (7) between the deposition model (4) and the electrode plate (2), and updating the ionic liquid (3) between the model plate (1) and the electrode plate (2);
(6) and (5) repeating the steps (2) to (5) to sequentially perform deposition printing on each printing layer of the preprinting model to obtain a deposition model (4).
18. A3D printing method based on electrodeposition is characterized in that: including model board (1), electrode plate (2), ionic liquid (3), light source (5) and power (6), electrode plate (2) are connected with the anodal electricity of power (6), model board (1) is connected with the negative pole electricity of power (6), light source (5) set up in the opposite side of the relative model board (1) of electrode plate (2), including following step:
(1) analyzing the structure of the preprinting model to obtain model data of each printing layer;
(2) adjusting the distance between the model plate (1) and the electrode plate (2) to be a preset distance;
(3) filling ionic liquid (3) between a model plate (1) during initial printing and a deposition model (4) on the model plate (1) and an electrode plate (2) during printing, keeping a gap between the deposition model (4) and the electrode plate (2) to be less than 1mm, and/or keeping the surface of the model plate (1) or the surface of the deposition model (4) to be flush with the top surface of the ionic liquid (3) or keeping the depth of immersing the ionic liquid (3) to be less than 1 mm;
(4) controlling a light beam (51) emitted by a light source (5) according to the pattern of the printing layer, so that the light beam (51) irradiates on an electrode plate (2) to form an electrode pattern matched with the pattern of the printing layer, a localized electric field is formed between the electrode plate (2) and a model plate (1) corresponding to the electrode pattern, and an ionic liquid (3) at a position on the model plate (1) corresponding to the localized electric field is subjected to electrodeposition to form a deposition printing layer;
(5) updating the ionic liquid (3) between the model plate (1) and the electrode plate (2) by adopting the relative translation between the model plate (1) and the electrode plate (2);
(6) and (5) repeating the steps (2) to (5) to sequentially perform deposition printing on each printing layer of the preprinting model to obtain a deposition model (4).
19. A method of electrodeposition-based 3D printing according to claim 17 or 18, characterized in that: in the layer printing process, the current of each corresponding point is controlled in the step (4) by detecting the concave-convex information of the surface of the deposition model (4), so that the surface of the layer tends to be flat or keeps flat.
20. The electrodeposition-based 3D printing method of claim 18, wherein: in the step (4), the control of the current magnitude of each point is realized by adjusting the irradiation light intensity distribution of the light beam (51).
21. The electrodeposition-based 3D printing method of claim 20, wherein: the light intensity is increased corresponding to the concave part of the deposition model (4), and the current is increased, or the light intensity is reduced corresponding to the convex part, and the current is reduced.
22. A method of electrodeposition-based 3D printing according to claim 17 or 18, characterized in that: a current sensor (61) is arranged on an electric connection loop between the model plate (1) and the electrode plate (2), and relative movement between the model plate (1) and the electrode plate (2) is regulated and controlled by detecting a loop current signal through the current sensor (61).
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203994732U (en) * | 2014-08-25 | 2014-12-10 | 北京紫晶立方科技有限公司 | Two-dimensional array is electroplated and is piled up 3D printer |
| CN109097797A (en) * | 2018-10-17 | 2018-12-28 | 大连美光速造科技有限公司 | Metal additive manufacturing device and method based on laser local electroplating |
| CN109913930A (en) * | 2019-03-03 | 2019-06-21 | 吉林大学 | Array composite electric field metal electrochemical micro-nano-scale additive manufacturing device and method |
| CN110016696A (en) * | 2019-03-25 | 2019-07-16 | 广东工业大学 | A micro-electroforming device based on photoconductive electrode plate and its micro-electroforming method |
| CN110284160A (en) * | 2019-08-14 | 2019-09-27 | 吉林大学 | A kind of photoinduction electrochemical metal 3D printing device and method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI227285B (en) * | 2001-10-15 | 2005-02-01 | Univ Southern California | Methods of and apparatus for producing a three-dimensional structure |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203994732U (en) * | 2014-08-25 | 2014-12-10 | 北京紫晶立方科技有限公司 | Two-dimensional array is electroplated and is piled up 3D printer |
| CN109097797A (en) * | 2018-10-17 | 2018-12-28 | 大连美光速造科技有限公司 | Metal additive manufacturing device and method based on laser local electroplating |
| CN109913930A (en) * | 2019-03-03 | 2019-06-21 | 吉林大学 | Array composite electric field metal electrochemical micro-nano-scale additive manufacturing device and method |
| CN110016696A (en) * | 2019-03-25 | 2019-07-16 | 广东工业大学 | A micro-electroforming device based on photoconductive electrode plate and its micro-electroforming method |
| CN110284160A (en) * | 2019-08-14 | 2019-09-27 | 吉林大学 | A kind of photoinduction electrochemical metal 3D printing device and method |
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