CN112822905B - Electronic load device and load module with heat dissipation function - Google Patents

Abstract

The present application provides an electronic load device and a load module with heat dissipation function. The electronic load device includes a main board and a load module. The main board has a plurality of first ports, and the load module includes a sub-board and a heat dissipation unit. The sub board has a second port and a pin slot, the second port is used for pluggably connecting one of the plurality of first ports, and the pin slot is used for connecting a power component. The heat dissipation unit has a cylindrical body and a plurality of heat dissipation fins, the cylindrical body defines an outer surface and an opposite inner surface, and the plurality of heat dissipation fins are connected to the outer surface. When the power component is connected to the pin slot, the power component contacts the inner surface.

Description

Electronic load device and load module with cooling function

technical field

The present application relates to an electronic load device and a load module, in particular, to a modular electronic load device and a load module with a heat dissipation function.

Background technique

In order to respond to various usage scenarios and needs, the same series of products may have models with different performances. For example, electronic load devices may correspond to different models according to different load powers. Generally speaking, although the types of electronic load devices are different, in most cases, only the number of power components differs. The heat dissipation structure is often not designed separately, but a heat dissipation structure that can meet the highest load power is adopted. For example, suppose that the same series of electronic load devices need to be designed with 500W, 300W, and 100W of load power respectively. In practice, the industry tends to choose the 500W specification to design the heat dissipation structure, and then provide the heat dissipation structure to provide Use for all models. The advantage of using a shared heat dissipation structure is that it can improve the sharing of parts, thereby reducing R&D and manufacturing costs without affecting the performance of various models.

However, while reducing costs, the above approach is accompanied by some disadvantages. For example, when a heat dissipation structure that can be used for a 500-watt model is only used for a 100-watt or 300-watt model, the specifications are undoubtedly over-satisfied, and at the same time, too much resources are wasted for excess heat dissipation capacity, causing unnecessary damage to the environment. burden. Also, having the 100W or 300W model use the same cooling structure as the 500W model would also make the 100W or 300W model too bulky to reduce weight. Therefore, the industry needs a new electronic load device and load module, hoping to reduce resource waste while corresponding to various load powers.

SUMMARY OF THE INVENTION

In view of this, the present application proposes an electronic load device with modular load modules. In this way, users can combine different numbers of load modules according to different load power requirements. Therefore, the waste of resources can be reduced, and the electronic load device with small load power can be prevented from being too bulky.

The present application provides an electronic load device, which includes a main board and a load module. The main board has a plurality of first ports, and the load module includes a sub-board and a heat dissipation unit. The sub board has a second port and a pin slot, the second port is used for pluggably connecting one of the plurality of first ports, and the pin slot is used for connecting a power component. The heat dissipation unit has a cylindrical body and a plurality of heat dissipation fins, the cylindrical body defines an outer surface and an opposite inner surface, and the plurality of heat dissipation fins are connected to the outer surface. When the power component is connected to the pin slot, the power component contacts the inner surface.

In some embodiments, the electronic load device may further include a fan unit, the fan unit is detachably connected to the load module, and the air outlet surface of the fan unit is perpendicular to the inner surface. In addition, the electronic load device may further include a fixing rod and a stopper, one of the plurality of heat dissipation fins has a first positioning element, the stopper has a second positioning element, and the fixing rod passes through the first positioning element and the stopper. The second positioning component. The stopper may be disposed on the main board and on the same side as the plurality of first ports. In addition, the plurality of heat dissipation fins extend from the outer surface, and the plurality of heat dissipation fins may be spiral.

In some embodiments, the second port of the sub-board can be pluggably connected to one of the plurality of first ports along a first direction, and the pin slot can be connected to a power component along a second direction. perpendicular to the second direction. In addition, the plurality of first ports are arranged on the surface of the motherboard at equal intervals along a third direction, and the third direction is perpendicular to the first direction. In addition, the inner surface of the cylindrical body may surround the accommodating space, and the sub-machine board shields at least part of the opening of the accommodating space in the third direction.

The present application provides a load module with heat dissipation function, which can be assembled in an electronic load device independently. Moreover, the load module has an independent sub-board, so that the user can assemble the load module on the main board of the electronic load device according to different load power requirements. Therefore, the waste of resources can be reduced, and the electronic load device with small load power can be prevented from being too bulky.

The present application provides a load module with heat dissipation function, which includes a heat dissipation unit and a sub-machine board. The heat dissipation unit has a cylindrical body and a plurality of heat dissipation fins, the cylindrical body defines an outer surface and an opposite inner surface, the inner surface surrounds an accommodating space, and the plurality of heat dissipation fins are connected to the outer surface. The sub-machine board is used for fixing a plurality of power components, the plurality of power components are located in the accommodating space, and each power component contacts the inner surface. The heat dissipation unit further defines a first side and a second side, the cylindrical body is located between the first side and the second side, and the sub-board covers at least part of the opening of the accommodating space on the first side.

In some embodiments, the plurality of heat dissipation fins may extend from the outer surface, and the plurality of heat dissipation fins are helical. In addition, the inner surface may have a plurality of flat regions, each flat region for contacting one of the plurality of power components, and the plurality of flat regions are not coplanar.

To sum up, the electronic load device provided by the present application can combine different numbers of load modules on the motherboard according to different load power requirements. In addition, since the load module can use the same heat dissipation unit, it can not only enjoy the cost advantage brought by the high degree of sharing of parts, but also avoid the use of an oversized heat dissipation structure in models with low load power.

The details of other functions and embodiments of the present application are described below with reference to the accompanying drawings.

Description of drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments described in this application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative efforts.

1 is a schematic perspective view of an electronic load device according to an embodiment of the present application;

2 is a schematic perspective view of a mainboard according to an embodiment of the present application;

3 is a schematic perspective view of a load module according to an embodiment of the present application;

4 is a schematic perspective view of a sub-board and a power component of a load module according to an embodiment of the present application;

5 is a schematic perspective view of a heat dissipation unit of a load module according to an embodiment of the present application.

Symbol Description

1 Electronic load device 10 Mainboard

10a, 10b stopper 100 plate body

102a～102g first port 104 External port

12a～12d load module 120 sub board

1200 second port 1202 pin slot

1204 power components 122 cooling units

1220 cylindrical body 1222 outer surface

1224 inner surface 1224a flat area

1226 cooling fins 1228 positioning components

14 Fan unit 16 Fixing rod

S1 accommodation space

Detailed ways

The foregoing and other technical contents, features and effects of the present application will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as: up, down, left, right, front or rear, etc., are only referring to the directions of the drawings. Accordingly, the directional terms used are illustrative and not limiting of the present application.

Please refer to FIG. 1 . FIG. 1 is a schematic perspective view illustrating an electronic load device according to an embodiment of the present application. As shown in FIG. 1 , the electronic load device 1 includes a main board 10 and a plurality of load modules 12 a to 12 d , and a fan unit 14 may be connected to one side of the load module 12 d. Here, although FIG. 1 shows four load modules 12a-12d, this embodiment does not limit the actual number of load modules. For example, the electronic load device 1 may include only one load module 12a or more load modules. In addition, the load modules 12a-12d may be set with the same or different load powers, for example, when the load powers are the same, the appearance or size of the multiple load modules may be approximately the same. In addition, the electronic load device 1 may also include a casing (not shown), so that the main board 10 , the plurality of load modules 12 a to 12 d and the fan unit 14 can be installed in the casing. Each component of the electronic load device 1 will be described below.

Please refer to FIG. 1 and FIG. 2 together. FIG. 2 is a three-dimensional schematic diagram illustrating a mainboard according to an embodiment of the present application. As shown in the figure, the mainboard 10 has a board body 100 , a plurality of first ports 102 a to 102 g disposed on the board body 100 , and an external port 104 . The board body 100 may be a printed circuit board, and may have circuit traces inside, and the circuit traces may be used to electrically connect the first ports 102 a - 102 g and the external port 104 . Here, as long as the first ports 102a-102g can be used to electrically connect a plurality of load modules 12a-12d, and the external port 104 can be electrically connected to an external power supply terminal or control terminal to receive current or control signals, the corresponding Those with ordinary knowledge in the technical field can freely select the specifications of the first ports 102a to 102g and the external port 104 . In addition, the present embodiment does not limit the arrangement positions of the first ports 102a-102g and the external ports 104 on the board body 100. For example, the first ports 102a-102g may be arranged at equal intervals in one direction (ie, along the third direction). On the plate body 100 , the external port 104 may be located at the edge of the plate body 100 .

In addition, this embodiment does not limit the number of the first ports. Although the plate body 100 shown in the drawings is provided with six first ports 102a-102g, the number of the first ports can be increased or decreased. The number of a port may be related to the maximum load power of the electronic load device 1 . For example, the greater the number of the first ports, the higher the load power of the electronic load device 1 may be. In practice, each of the first ports 102a-102g may correspond to a load module. As shown in the figure, the port 102a may correspond to the load module 12a, and the port 102b may correspond to the load module 12b. Assuming that each load module is measured with a load power of 100W, since the mainboard 10 has six first ports 102a-102g, it can be inferred that the mainboard 10 should be able to share models between 100W and 600W. At this time, since the mainboard 10 of the electronic load device 1 shown in this embodiment is connected with four load modules 12a-12d, it is a model capable of providing a load power of 400 watts. Of course, models with different load powers may also use different motherboards. For example, a 400-watt model may also have exactly four first ports, which is not limited in this embodiment.

In addition, all the first ports 102a-102g are not necessarily connected to load modules, for example, the number of the first ports and the load modules may be different. It can be seen from the diagram that the first port 102f and the first port 102g can also be left empty without being connected to the load module. Of course, other first ports may also be left empty in practice, which is not limited in this embodiment. In one example, the load power of the electronic load device 1 is more related to the specifications of the power components in each load module. For example, the higher the load power of the power components, the electronic load device 1 can connect the same number of load modules when the same number of load modules are connected. lower, provide higher load power. It is worth mentioning that this embodiment is only to demonstrate that the first port may be related to the load power, and is not used to limit the range of the load power that the electronic load device 1 can use.

In order to describe the load module of this embodiment in detail, please refer to FIG. 1 to FIG. 5 together. FIG. 3 is a schematic perspective view of a load module according to an embodiment of the present application, and FIG. 4 is a schematic diagram of a load module according to an embodiment of the present application. FIG. 5 is a three-dimensional schematic diagram illustrating a heat dissipation unit of the load module according to an embodiment of the present application. As shown in the figures, FIG. 3 to FIG. 5 select one of the load modules 12a-12d. For example, taking the load module 12a as an example, the load module 12a may include a sub-board 120 and a heat dissipation unit 122. The sub-board 120 has a second Port 1200 and pin slot 1202. The second port 1200 is used for pluggably connecting one of the plurality of first ports 102a-102g, such as the first port 102a shown in FIG. 2 . Since the first ports 102a-102g may have the same specifications, the load module 12a may also be connected to other first ports. In one example, the daughter board 120 may be a printed circuit board like the board body 100, and may have circuit traces inside, and the circuit traces may be used to electrically connect the second port 1200 with the pin slot. 1202. Here, the pin slot 1202 can also be used to connect the power component 1204, so that the current provided by the external power supply terminal can pass through the external port 104, the board body 100 to the first port 102a, and then pass through the second port 1200 through the sub-board 120. , the pin slot 1202 to the power component 1204 .

As shown in the figure, the second port 1200 can be pluggably connected to the first port 102 a in a direction perpendicular to the board body 100 (ie, along the first direction), so that the sub board 120 can stand on one side of the board body 100 . Here, this embodiment does not limit the specifications of the second port 1200, as long as the first port 102a and the second port 1200 can be connected to each other and transmit current or control signals, they belong to the category of the second port 1200 in this embodiment. In addition, the pin slot 1202 may include one or more vias on the sub-board 120 , so that the connection pins (pins) of the power components 1204 can be inserted into the pin slots 1202 , so that the power components 1204 can be electrically connected To the circuit traces inside the daughter board 120 . At this time, the power component 1204 can be inserted into the pin slot 1202 on the sub-board 120 vertically (ie, along the second direction). In one example, a plurality of pin slots 1202 may be provided on the sub-board 120. For example, FIG. 4 shows that the sub-board 120 is provided with three pin slots 1202, and each pin slot 1202 is connected to A power assembly 1204.

In practice, the power components 1204 will generate high heat during operation, so the plurality of pin slots 1202 should be approximately spaced apart by a certain distance to prevent the power components 1204 from contacting each other. For heat dissipation, the load module 12a further includes a heat dissipation unit 122, the heat dissipation unit 122 has a cylindrical body 1220, and the cylindrical body 1220 defines an outer surface 1222 and an opposite inner surface 1224. In appearance, the cylindrical body 1220 may be a hollow structure, so that the inner surface 1224 surrounds the accommodating space S1. As can be seen from the drawings, the inner surface 1224 may be a part of the boundary of the accommodating space S1, but is not used to close the accommodating space S1. For example, the accommodating space S1 may have openings on both sides of the cylindrical body 1220. When the sub-board 120 and the heat dissipation unit 122 are assembled together, the sub-board 120 will be adjacent to one side of the cylindrical body 1220, each power component 1204 should contact the inner surface 1224, and the sub-board 120 will cover the container The opening of the space S1 part.

In the example shown in the figure, because the power components 1204 are substantially cube-shaped, in order to make each power component 1204 more closely contact the inner surface 1224, the inner surface 1224 has a flat area 1224a for the power components 1204 to contact, namely The flat area 1224a and the power components 1204 can be in a one-to-one relationship such that one side of the power components 1204 can conduct thermal conduction with the inner surface 1224. In other words, the shape of the inner surface 1224 of the cylindrical body 1220 or the number of the flat areas 1224 a can be determined according to the number of the power components 1204 mounted on the sub-board 120 . For example, three power components 1204 arranged in a triangular shape (triangle) are electrically connected to the sub-board 120, so that the inner surface 1224 of the cylindrical body 1220 can also be correspondingly provided with three flat areas that are not coplanar 1224a, so that all three power components 1204 can contact the inner surface 1224 flatly.

In addition, when the sub-board 120 and the heat dissipation unit 122 are assembled together, this embodiment does not limit whether the sub-board 120 and the heat dissipation unit 122 are fixed together. In practice, if the power component 1204 is closely attached to the flat area 1224a of the inner surface 1224, it should contribute to the efficiency of heat conduction. For example, the power component 1204 may be adhered to the flat area 1224a of the inner surface 1224 with thermally conductive adhesive, or the power component 1204 may be directly locked or snapped onto the flat area 1224a of the inner surface 1224 . In one example, the power component 1204 may only be placed in the accommodating space S1, so that the power component 1204 only contacts the flat area 1224a of the inner surface 1224, and the power component 1204 may not be pasted or fixed on the inner surface 1224. flat area 1224a.

On the other hand, the outer surface 1222 of the cylindrical body 1220 can be connected with a plurality of heat dissipation fins 1226, and the appearance of the heat dissipation fins 1226 can be spiral-shaped to increase the wind impact area. In addition, in addition to the function of the heat dissipation fins 1226 to dissipate heat, some of the heat dissipation fins 1226 have positioning components 1228 (first positioning components). In practice, positioning elements 1228 may be provided on the cooling fins 1226 located at the corners, that is, there may be a plurality of positioning elements 1228 arranged symmetrically. Of course, this embodiment does not limit the position of the positioning assembly 1228, as long as the positioning assembly 1228 can be used to snap the fixing rod 16 in FIG. Taking an actual example, when the load modules 12a-12d are respectively connected to the first ports 102a-102d, the load modules 12a-12d may be fixed by simply connecting the first port 102a and the second port 1200 to each other, which may be structurally weak and not stable enough. At this time, the electronic load device 1 can lock together each heat dissipation unit 122 in the load modules 12a-12d through the plurality of fixing rods 16, so that the structure is relatively firm. Of course, this embodiment is not limited to having the fixing rods 16. For example, the housing of the electronic load device 1 may be used to fix the relative positions of the main board 10 and the load modules 12a-12d, so the electronic load device 1 lacking the fixing rods 16 will not As for the impact function.

In addition, the board body 100 of the main board 10 may also have detachable stoppers 10a, 10b, and the user can determine the placement positions of the stoppers 10a, 10b according to the number of load modules. For example, in the example shown in FIG. 1 , since four load modules 12 a to 12 d are connected to the main board 10 , the stopper 10 a can be arranged on one side of the load module 12 a , and the stopper 10 b can be arranged on the other side of the load module 12 d side so that the load modules 12a-12d are slightly clamped between the stoppers 10a, 10b. In addition, the stoppers 10a, 10b may further have through holes (second positioning components), so that the fixing rod 16 may connect the stoppers 10a, 10b and each heat dissipation unit 122 of the load modules 12a to 12d in series to each other. Together. Because the stoppers 10a and 10b are directly fixed on the plate body 100 , they may be stronger than the load modules 12a - 12d connected to each other by the first port 102a and the second port 1200 . As mentioned above, the present embodiment does not limit the presence of the stoppers 10a and 10b. For example, the housing of the electronic load device 1 may be used to hold the load modules 12a to 12d, so that the electronic loads of the stoppers 10a and 10b are lacking. The device 1 also does not affect the function.

In order to improve the efficiency of the heat dissipation fins 1226 to dissipate heat, the electronic load device 1 may also be provided with a fan unit 14 for generating airflow to take away the heat on the heat dissipation fins 1226 . In one example, the air outlet direction of the fan unit 14 is toward the sub-board 120 , or the same as the arrangement direction of the first ports 102a-102g. Since the opening on one side of the cylindrical body 1220 is shielded by the sub-board 120 , less airflow will enter the accommodating space S1 , and more airflow will pass through the heat dissipation fins 1226 . Although FIG. 1 shows that the fan unit 14 is disposed above the stopper 10b, in practice, the fan unit 14 can also be disposed above the stopper 10a on the other side. Likewise, the fan unit 14 may also have through holes, so that the fixing rod 16 may connect the stoppers 10a, 10b, each heat dissipation unit 122 of the load modules 12a-12d, and the fan unit 14 in series. In one example, in the absence of the stoppers 10a, 10b, the fan unit 14 may be directly connected to the load modules 12a-12d in series via the fixing rod 16, and even the fan unit 14 may be fixed to the casing of the electronic load device 1, This embodiment is not limited here.

To sum up, the electronic load device provided by the present application can combine different numbers of load modules on the motherboard according to different load power requirements. In addition, since the load module can use the same heat dissipation unit, it can not only enjoy the cost advantage brought by the high degree of sharing of parts, but also avoid the use of an oversized heat dissipation structure in models with low load power.

The above-mentioned embodiments and/or implementations are only used to illustrate the preferred embodiments and/or implementations of the technology of the present application, and are not intended to limit the implementation of the technology of the present application in any form. Personnel, without departing from the scope of the technical means disclosed in the content of this application, may make some changes or modifications to other equivalent embodiments, but they should still be regarded as substantially the same technology or embodiment as this application.

Claims (10)

1. An electronic load device, comprising:

a main board with a plurality of first ports; and

a load module, comprising:

a daughter board having a second port and a pin slot, wherein the second port is used to connect with one of the first ports in a pluggable manner, and the pin slot is used to connect with a power component; and

the heat dissipation unit is provided with a cylindrical body and a plurality of heat dissipation fins, the cylindrical body is defined with an outer surface and an opposite inner surface, and the heat dissipation fins are connected with the outer surface;

when the power component is connected with the pin slot, the power component contacts the inner surface.

2. The electrical load apparatus of claim 1, further comprising a fan unit detachably connected to the load module, wherein an outlet surface of the fan unit is perpendicular to the inner surface.

3. The electronic load device of claim 1, further comprising a fixing rod and a stopping member, wherein one of the heat fins has a first positioning element, the stopping member is disposed on the motherboard and the stopping member has a second positioning element, and the fixing rod is disposed through the first positioning element and the second positioning element.

4. The electrical load apparatus of claim 1, wherein the second port of the daughter board is connected to one of the first ports in a pluggable manner along a first direction, and the pin slot is connected to the power module along a second direction, the first direction being perpendicular to the second direction.

5. The electrical load apparatus of claim 4, wherein the first ports are arranged on a surface of the motherboard at equal intervals along a third direction, the third direction being perpendicular to the first direction.

6. The electrical load apparatus as claimed in claim 5, wherein the inner surface of the cylindrical body is surrounded by a receiving space, and the sub-board covers at least a portion of an opening of the receiving space in the third direction.

7. The electrical load apparatus of claim 1, wherein the fins extend from the outer surface and the fins are helical.

8. A load module with heat dissipation function, comprising:

the heat dissipation unit is provided with a cylindrical body and a plurality of heat dissipation fins, the cylindrical body is defined with an outer surface and an opposite inner surface, the inner surface surrounds an accommodating space, and the heat dissipation fins are connected with the outer surface; and

the sub-machine plate is used for fixing a plurality of power components, the power components are positioned in the accommodating space, and each power component is contacted with the inner surface;

the heat dissipation unit further defines a first side and a second side, the cylindrical body is located between the first side and the second side, and the sub-board covers at least part of the opening of the accommodating space on the first side.

9. The load module of claim 8, wherein the fins extend from the outer surface and are helical.

10. The load module of claim 8, wherein the inner surface has a plurality of flat areas, each flat area is configured to contact one of the power devices, and the flat areas are not coplanar.

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