CN112865872B - Analog optical transmission module - Google Patents

Abstract

The application discloses an analog optical transmission module, which comprises N bidirectional transmission optical signal receiving and transmitting combination parts, a golden finger, a receiving circuit, a transmitting circuit, N transmitting transmission channels and N receiving transmission channels, wherein each bidirectional transmission optical signal receiving and transmitting combination part comprises a transmitting TO and a receiving TO, the transmitting TO is used for converting an electric signal input into the bidirectional transmission optical signal receiving and transmitting combination part into an optical signal output, the receiving TO is used for converting the optical signal input into the bidirectional transmission optical signal receiving and transmitting combination part into the electric signal output, the golden finger, the receiving circuit and the transmitting circuit are all arranged in a printed circuit board, one end of a microstrip line of the receiving circuit is electrically connected with the golden finger, one end of a microstrip line of the transmitting circuit is electrically connected with the golden finger, and one end of a Kth transmitting transmission channel is electrically connected with the other end of the microstrip line of the transmitting circuit. The multi-channel optical fiber can reduce signal crosstalk among multiple channels, and has small volume.

Description

Analog optical transmission module

Technical Field

The application relates to the field of communication, in particular to an analog optical transmission module.

Background

Radio-over-fiber (RoF) technology is an emerging radio access technology that combines optical fiber communication with wireless communication in response to high-speed, high-capacity wireless communication demands. The central station modulates the microwaves to the laser, the modulated light waves are transmitted through a complex optical fiber link, and after reaching the base station, the photoelectric conversion demodulates the microwave signals and then the microwave signals are transmitted through the antenna for users to use. Radio frequency (or millimeter wave) signals transmitted by the optical fibers improve wireless bandwidth, but loss in the atmosphere after the antenna is transmitted can be increased, and the optical fibers are used as transmission links, so that the optical fiber antenna has the characteristics of low loss, high bandwidth and electromagnetic interference prevention. It is these advantages that make RoF technology have wide application prospect in fields such as wireless broadband communication, satellite communication, intelligent transportation system in the future. The RoF system has the advantages of wider cellular coverage, wider bandwidth, lower cost, lower power consumption, ease of installation, and the like, as compared to conventional systems.

The existing analog optical module needs to use a special radio frequency head for signal transmission, has high cost, and is difficult to realize miniaturization, so that the mass application of the analog optical module is limited. The analog optical transmission module has higher isolation requirements on channels, and no small-sized analog optical module with multiple channels exists at present.

Disclosure of Invention

The object of the present application is to provide a miniaturized analog optical transmission module capable of reducing signal crosstalk between multiple channels,

An analog optical transmission module comprises N bidirectional transmission optical signal receiving and transmitting combination parts, a golden finger, a receiving circuit, a transmitting circuit, N transmitting transmission channels and N receiving transmission channels, wherein each bidirectional transmission optical signal receiving and transmitting combination part comprises a transmitting TO and a receiving TO, the transmitting TO is used for converting an electric signal input TO the bidirectional transmission optical signal receiving and transmitting combination part into an optical signal output, the receiving TO is used for converting the optical signal input TO the bidirectional transmission optical signal receiving and transmitting combination part into an electric signal output, the golden finger, the receiving circuit and the transmitting circuit are all arranged in a printed circuit board, one end of a microstrip line of the receiving circuit is electrically connected with the golden finger, one end of the microstrip line of the transmitting circuit is electrically connected with the golden finger, one end of a K transmitting transmission channel is electrically connected with the other end of the microstrip line of the transmitting circuit, one end of the K receiving transmission channel is electrically connected with the other end of the microstrip line of the receiving circuit, the other end of the K receiving transmission optical signal receiving and transmitting combination part is electrically connected with the input end of the receiving TO of the K bidirectional transmission optical signal receiving and transmitting combination part, and the other end of the K transmission optical signal receiving and transmitting combination part is electrically connected with the microstrip line of the receiving TO, and the K transmission optical signal receiving and transmitting combination part is electrically connected with the microstrip line, and the microstrip line is 1 = N.

The bidirectional transmission optical signal receiving and transmitting combined component is a BOSA structure with separated transmission and reception.

The grounds of the golden fingers are electrically connected with each other.

The analog radio frequency signal of the golden finger is transmitted by using a single-ended signal transmission mode.

The size of the golden finger is compatible with the standard DSFP protocol.

The transmitting transmission channel is a transmitting flexible circuit board, and the receiving transmission channel is a receiving flexible circuit board.

The receiving TO is TO33 or TO46 and the transmitting TO is TO38 or TO56.

N=2。

The two-way transmission optical signal receiving and transmitting combined components are vertically arranged in the bottom shell side by side and are respectively fixed on two flange surface bayonets of the bottom shell through standard LC sleeves, the printed circuit board is arranged in the rear end of the bottom shell, the upper cover is covered on the bottom shell, limiting fixation is carried out through protruding points at the front end of the upper cover and grooves of the bottom shell, and the rear end is fastened through a first fixing screw and a second fixing screw.

Further comprises:

And the heat sink is arranged between the emission TO and the bottom shell of the bidirectional transmission optical signal receiving and emitting combined component and is respectively contacted with the emission TO and the bottom shell.

The beneficial technical effects of the application are as follows:

According TO the application, a BOSA scheme with separated transmission and reception is adopted, each TO signal is transmitted by using an independent transmission channel and an independent reception channel, and meanwhile, the transmission channel and the reception channel are directly fixed near a golden finger, so that crosstalk of radio frequency signals in the transmission process of a printed circuit board can be reduced, the golden finger is adopted TO transmit multi-channel analog signals, transmission of multiple paths of analog signals is realized under the SFP packaging size, the volume is reduced, the transmission density is increased, and the universal adaptability is realized.

Drawings

Fig. 1 is an electrical schematic diagram of an analog optical transmission module according to an embodiment of the present application;

fig. 2 is a block diagram of an analog optical transmission module according to an embodiment of the present application;

FIG. 3 is a schematic diagram of a BOSA compatible side-by-side arrangement according to one embodiment of the present application

Fig. 4 is an exploded view of a simulated optical transmission module according to an embodiment of the present application;

Fig. 5 is a schematic structural diagram of an external connector of an analog optical transmission module according to an embodiment of the present application;

fig. 6 is a schematic structural diagram of a pluggable circuit board assembly connector with a golden finger after mating and insertion according to an embodiment of the present application;

fig. 7 is a schematic structural diagram of a BOSA according to an embodiment of the present application;

FIG. 8 is a schematic diagram of a printed circuit board compatible with BOSA placed side by side according to the embodiment of the application;

Fig. 9 is a schematic diagram of sfp+ cage, an analog optical transmission module and an optical fiber connection according to an embodiment of the present application;

FIG. 10 is a schematic view of the golden finger of the present application on a printed circuit board;

FIG. 11 is a schematic diagram of the PIN pad structure of the underlying gold finger of the present application;

FIG. 12 is a schematic diagram of the PIN pad structure of the upper layer of the golden finger of the present application;

FIG. 13 is a table showing the definition of PIN PINs for upper and lower gold fingers according to the present application;

Fig. 14 is a schematic diagram of a performance simulation result provided in an embodiment of the present application.

Detailed Description

The following examples are given as a specific description of the present application, it being necessary to point out that the following examples are given for further illustration of the application and are not to be construed as limiting the scope of the application.

In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.

Furthermore, the terms "first," "second," "kth," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "first", "second", "K" may include one or more such features, either explicitly or implicitly. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more, unless otherwise clearly defined.

In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected via an intervening medium, or in communication between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

The application discloses an analog optical transmission module which is used for transmitting broadband analog signals, the frequency range is 10M-20G, the analog optical transmission module comprises N bidirectional transmission optical signal receiving and transmitting combination parts, a golden finger, a receiving circuit, a transmitting circuit, N transmitting transmission channels and N receiving transmission channels, each bidirectional transmission optical signal receiving and transmitting combination part comprises a transmitting TO and a receiving TO, the transmitting TO is used for converting electric signals input into the bidirectional transmission optical signal receiving and transmitting combination parts into optical signals TO be output, the receiving TO is used for converting the optical signals input into the bidirectional transmission optical signal receiving and transmitting combination parts into the electric signals TO be output, the golden finger, the receiving circuit and the transmitting circuit are arranged in a printed circuit board, one end of a microstrip line of the receiving circuit is electrically connected with the golden finger, one end of the microstrip line of the transmitting circuit is electrically connected with the golden finger, one end of the K transmitting transmission channel is electrically connected with the other end of the microstrip line of the transmitting circuit, one end of the K receiving transmission channel is electrically connected with the other end of the line of the receiving circuit, the other end of the K bidirectional transmission optical signal receiving and transmitting combination part is electrically connected with the other end of the microstrip line of the receiving circuit, and the other end of the K transmission optical signal receiving and transmitting combination part is electrically connected with the K transmission optical signal receiving and transmitting signal receiving and transmitting signal TO be an integer of N=1. The bidirectional transmission optical signal receiving and transmitting combined component is a BOSA structure with separated transmission and reception. The transmitting transmission channel is a transmitting flexible circuit board, and the receiving transmission channel is a receiving flexible circuit board.

The lands of the gold fingers 21 are electrically connected to each other. In order to further reduce crosstalk between analog signals, the application carries out via hole processing on the ground of the golden finger 21, so that the upper and lower layers of the golden finger are electrically connected together through the via holes, and channel crosstalk can be effectively shielded. The analog radio frequency signal of the golden finger is transmitted by using a single-ended signal transmission mode. The size of the golden finger is compatible with the standard DSFP protocol.

The application will be further described hereinafter by taking n=2 as an example.

The application provides an analog optical transmission module which can realize the transmission of multipath broadband signals and the stable transmission of signal frequencies from 10M to 20G. As shown in fig. 1, the multi-channel analog optical module in the embodiment of the present application may include a golden finger port, two Bi-directional transmission optical signal receiving and transmitting combined components (Bi-direction Optical Subassembly, BOSA), a transmitting circuit, a receiving circuit, and a printed circuit board assembly. The receiving circuit and the transmitting circuit simultaneously control two BOSAs, namely two signal transmitting links and two signal receiving links;

As shown in fig. 2, an embodiment of the present application provides an analog optical transceiver module. The structure is a brand new small hot plug simulated optical module, compared with the SFP/SFP+/DSFP and other packaging forms, the structure can vertically place two BOSA structures side by side on the basis of not increasing the length and the width of the module, as shown in figure 3, the length and the width directions of the dimension of the application can also accord with the SFF-8432Rev5.2 protocol standard, the height direction of the application is about 2mm higher than the SFF-8432Rev5.2 protocol standard, the design of the rear end of the module and the height of the printed circuit board 6 accord with the SFP/SFP+/DSFP protocol, and thus, the application can be compatible with the existing connector and LC optical fiber jumper in the aspect of structure and has universality.

In one embodiment, as shown in fig. 2-4, the first BOSA 7 and the second BOSA 8 are fixed on two flange bayonets of the bottom shell 1 through the standard LC sleeve 14, and the positions in the optical ports are consistent, so that the standard LC fiber optic connector can be compatible and pluggable, as shown in fig. 9. The printed circuit board 6 is disposed in the rear end of the bottom chassis 1. The upper cover 5 covers the bottom shell, limiting fixation is carried out through the protruding points at the front end of the upper cover 5 and the grooves of the bottom shell 1, and the rear end can be fastened and fixed between the bottom shell 1 and the upper cover 5 only by using the first fixing screw 9 and the second fixing screw 11, so that the optical module is simple and reliable in structure and convenient to assemble and repair. The EMI shielding shrapnel 2 is approximately U-shaped, the U-shaped opening is provided with opposite convex clamping catches, the front end of the bottom shell 1 is positioned in the EMI shielding shrapnel 2, the clamping catches of the EMI shielding shrapnel 2 are buckled with the upper cover 5, and the EMI shielding shrapnel 2 is wrapped outside the bottom shell 1 and the upper cover 5 and is used for locking a module. The pull ring 3 is arranged at the front end of the bottom shell 1 and is used for drawing the application. The shell formed by the bottom shell 1 and the upper cover 5 is used for protecting the internal devices and isolating electromagnetic signals. A spring 10 is mounted on the upper cover 5 for releasing the elastic force. The slider 4 is mounted on the upper cover 5 and accommodates a spring 10 therein, and the spring 10 provides an elastic force for returning to an original position after the slider 4 slides. The bottom case 1 further includes an optical port for placing an output optical terminal of the BOSA.

In one embodiment, the rf connection port may be a hot pluggable structure, as shown in fig. 5 and 6, to facilitate installation and maintenance of the analog optical transmission module of the present application. One end of the plug may be a pluggable circuit board assembly 12 with a golden finger, the other end is assembled with the external connector 13, and the pluggable circuit board assembly 12 is sized to be compatible with Small form-factor pluggable transceiver plus (sfp+)/Dual Small form-factor pluggable transceiver (DSFP) and the like. In one embodiment, the external connector 13 is compatible with a standard SFP+/DSFP connector, the compatibility is improved, the universality of the radio frequency connector is ensured, and the golden finger 21 in the pluggable circuit board assembly 12 with the golden finger can be connected to the receiving circuit 23 and the transmitting circuit 22 through direct current signals and also can be connected to the first BOSA 7 and the second BOSA 8 through broadband radio frequency signals. As shown in fig. 10, the upper layer and the lower layer of the golden finger 21 are respectively arranged on two opposite surfaces of one end of the printed circuit board, and the ground of the upper layer and the ground of the lower layer are electrically connected together through the via hole. The PIN definition of the gold finger 21 is shown in fig. 11-13.

In one embodiment, the first BOSA7 and the second BOSA 8 are respectively provided with a heat sink 18, and the heat sink 18 is disposed between the emission TO and the bottom case 1 of the bi-directional transmission optical signal receiving and emitting combined part and is respectively in contact with the emission TO and the bottom case 1. Specifically, as shown in fig. 8, the upper surface of the heat sink 18 is concave, for contacting the reflective TO17 of the first BOSA7, the contact portion is generally filled with a heat dissipation film or silica gel TO improve the heat dissipation effect, the lower surface of the heat sink 18 is generally in contact with the bottom shell 1, the contact portion is generally filled with a heat dissipation film or silica gel TO improve the heat dissipation effect, the heat sink can be made of metals with different heat conductivity coefficients, the heat dissipation of the module is improved, the BOSA optical device is protected, the structure and shape of the heat sink 18 can be adjusted according TO different package sizes TO match different optical module packages, and in another embodiment, the heat sink is directly grown on the bottom shell 1 by using the same material of the bottom shell, so as TO save the assembly step. The second BOSA 8 is provided with heat sinks in the same way as the first BOSA 7.

In one embodiment, for the first BOSA 7 and second BOSA 8 sections described above, as in fig. 7, the first BOSA is comprised of a first receiving TO15, a first BOSA housing 16, and a first transmitting TO 17. The first receiving TO15 is TO33 (TO 33 is a size standard of a TO base), the first transmitting TO17 is TO38 (TO 38 is a size standard of a TO base), the whole structure can be made small by using a small-size TO, and the first receiving TO15 and the first transmitting TO17 are packaged in a SFP compatible mode, the first BOSA housing 16 is a metal structural part and is used for fixing the first receiving TO15 and the first transmitting TO17, meanwhile, an optical filter is arranged in the first BOSA housing 16 TO realize the light splitting and combining functions of different wavelengths, and the transmitting end of the TO38 has no refrigeration function, is small in size and is easy TO assemble in the housing 1. The second BOSA is composed of a second receiving TO, a second BOSA shell and a second transmitting TO, and the connection structure of the second receiving TO, the second BOSA shell and the second transmitting TO is the same as that of the first BOSA 7, and the description of the connection structure of the first BOSA 7 is specifically referred TO above.

In one embodiment, for the first BOSA7 and the second BOSA8, as shown in fig. 7, the outside of the first BOSA7 is composed of a first transmitting flexible circuit board 19, a first receiving flexible circuit board 20 and a first BOSA light port LC sleeve 14, one end of the first transmitting flexible circuit board 19 is fixed on the printed circuit board 6 and connected with the transmitting circuit 22, one end of the first receiving flexible circuit board 20 is fixed on the printed circuit board 6 and connected with the receiving circuit 23, the other end of the first transmitting flexible circuit board 19 is fixed on a first transmitting TO17 pin of the first BOSA7, and the other end of the first receiving flexible circuit board 20 is fixed on a first receiving TO15 pin. Likewise, the second BOSA also has a second transmitting flexible circuit board, a second receiving flexible circuit board and a second BOSA light port LC sleeve, which is identical to the first BOSA 7. The aforementioned fixing may be, but is not limited to, high temperature solder bonding. The first BOSA light port LC sleeve 14 and the second BOSA light port LC sleeve can realize light access and emission, namely single-fiber bidirectional transmission signals, can simultaneously transmit 1270nm (1260-1280 nm) emission light signals and 1330nm (1320-1340 nm) receiving light signals, and can simultaneously transmit 1330nm (1320-1340 nm) emission light signals and 1270nm (1260-1280 nm) receiving light signals. If the first BOSA7 transmits 1270nm (1260-1280 nm) of a transmitted light signal and 1330nm (1320-1340 nm) of a received light signal, the second BOSA8 transmits 1330nm (1320-1340 nm) of a transmitted light signal and 1330nm (1320-1340 nm) of a received light signal, whereas if the second BOSA7 transmits 1270nm (1260-1280 nm) of a transmitted light signal and 1330nm (1320-1340 nm) of a received light signal, the first BOSA8 transmits 1330nm (1320-1340 nm) of a transmitted light signal and 1330nm (1320-1340 nm) of a received light signal.

In another embodiment, the wavelengths may also be transmitted at 1270nm (1260-1280 nm) and 1350nm (1340-1360 nm), or 12900nm (1280-1300 nm) and 1350nm (1340-1360 nm), with similar wavelength separations greater than or equal to 60 nm.

In another embodiment, TO provide a stable output of the transmit TO, the transmit TO may also use a TO56 with refrigeration (TO 56 is a size standard for TO base), and the TO56 is larger in size and generates more heat than the TO38 transmit, but has a TEC temperature control and a more stable performance output in severe ambient temperature conditions. The TO56 emission could also be integrated in the BOSA and then mounted in the structure of the housing 1.

In one embodiment, as shown in fig. 8, the printed circuit board comprises a transmitting circuit 22, a receiving circuit 23, a processor chip 24 and a golden finger 21, the transmitting circuit 22 comprises a transmitting power supply function, an automatic gain balancing function and a microstrip transmission function, the transmitting circuit 22 is connected with a first transmitting TO17 through a first transmitting flexible circuit board 19, the other end of the transmitting circuit is connected TO an external connector 13 through the golden finger, the transmitting circuit 22 supplies power TO the first transmitting TO17 of the first BOSA7 TO realize the power supply function, when the external environment temperature changes, the transmitting circuit 22 carries out gain change feedback TO realize gain balancing control so as TO keep gains basically consistent under different environment temperatures, and microstrip lines in the transmitting circuit 22 transmit broadband radio frequency signals from the golden finger 21 TO the first transmitting flexible circuit board 19. The receiving circuit 23 comprises a receiving TO power supply function and a microstrip transmission function, the receiving circuit 23 is connected with the first receiving TO15 through the first receiving flexible circuit board 20, the other end of the receiving circuit 23 is connected TO the external connector 13 through the golden finger 21, the receiving circuit 23 supplies power TO the first receiving TO15 of the first BOSA7 TO realize the power supply function, and the microstrip line in the receiving circuit 23 transmits broadband radio frequency signals from the first receiving flexible circuit board 20 TO the golden finger. The printed circuit board is connected to the second BOSA8 via the second transmitting flexible circuit board and the second receiving flexible circuit board in the same manner as the first BOSA7, i.e. the connection of the second BOSA8 to the transmitting circuit 22, the receiving circuit 23, the processor chip 24, the gold finger 21 via the second transmitting flexible circuit board and the connection of the first BOSA7 to the transmitting circuit 22, the receiving circuit 23, the processor chip 24, the gold finger 21 via the first transmitting flexible circuit board 19, the first receiving flexible circuit board 20. The processor chip 24 is used for monitoring the working states of the first BOSA7 and the second BOSA8, and the golden finger 21 is used for transmitting electric signals and broadband radio frequency signals.

Fig. 9 is a schematic diagram of an sfp+ cage 26 connected to an analog optical transmission module 25 and an optical fiber 27 according to an embodiment of the present application.

Compared with the digital optical module, the analog optical module belongs to broadband signal transmission, the gain of the analog optical module in the whole signal frequency range needs to be flat, the gain loss in the whole signal frequency range is small, the traditional analog optical module needs a special radio frequency head to conduct broadband radio frequency signal transmission, the gold finger with relatively low price is used for broadband radio frequency signal transmission for the first time, and compared with the digital module which uses differential signal transmission, the broadband radio frequency signal transmission is better achieved by single-ended signal transmission.

The application realizes the transmission of the 10M-20G broadband analog signals, and has the advantages of small insertion loss of 4 channels, small reflection, large isolation between the channels, and referring to FIG. 14.

The specific features described in the above embodiments may be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the application is not described in any detail with respect to the various possible combinations.

The present application has been described in detail with reference to the embodiments thereof, which are intended to be illustrative rather than restrictive, and variations and modifications are within the scope of the present application without departing from the general inventive concept.

Claims (8)

1. An analog optical transmission module, characterized in that it includes N bidirectional transmission optical signal receiving and transmitting combination components, gold fingers, receiving circuits, transmitting circuits, N transmitting transmission channels and N receiving transmission channels, each bidirectional transmission optical signal receiving and transmitting combination component includes a transmitting TO and a receiving TO, the transmitting TO is used to convert the electrical signal input to the bidirectional transmission optical signal receiving and transmitting combination component into an optical signal output, and the receiving TO is used to convert the optical signal input to the bidirectional transmission optical signal receiving and transmitting combination component into an electrical signal output; the gold fingers, receiving circuits, and transmitting circuits are all arranged on a printed circuit In the board, one end of the microstrip line of the receiving circuit is electrically connected to the gold finger, and one end of the microstrip line of the transmitting circuit is electrically connected to the gold finger; one end of the Kth transmitting transmission channel is electrically connected to the other end of the microstrip line of the transmitting circuit, and the other end thereof is electrically connected to the output end of the transmitting TO of the Kth bidirectional transmission optical signal receiving and transmitting combination component; one end of the Kth receiving transmission channel is electrically connected to the other end of the microstrip line of the receiving circuit, and the other end thereof is electrically connected to the input end of the receiving TO of the Kth bidirectional transmission optical signal receiving and transmitting combination component; wherein N is a positive integer greater than or equal to 1, K=1, 2, ..., N; The bidirectional transmission optical signal receiving and transmitting combined component is a BOSA structure with separate transmission and reception; The grounds of the gold fingers are electrically connected to each other; The analog radio frequency signal of the gold finger is transmitted using a single-ended signal transmission method. 2. The analog optical transmission module according to claim 1, characterized in that the size of the gold finger is compatible with the standard DSFP protocol. 3. The analog optical transmission module according to claim 1 is characterized in that the transmitting transmission channel is a transmitting flexible circuit board, and the receiving transmission channel is a receiving flexible circuit board. 4. The analog optical transmission module according to claim 1 is characterized in that the receiving TO is TO33 or TO46, and the transmitting TO is TO38 or TO56. 5 . The analog optical transmission module according to claim 1 , wherein the analog optical transmission module is used to transmit broadband analog signals with a frequency range of 10M to 20G. 6. The analog optical transmission module according to any one of claims 1 to 5, characterized in that N=2. 7. According to claim 6, the analog optical transmission module is characterized in that it also includes a bottom shell and an upper cover, the upper and lower layers of the gold fingers are respectively arranged on the two opposite surfaces of one end of the printed circuit board; two bidirectional transmission optical signal receiving and transmitting assembly components are vertically arranged side by side in the bottom shell and are respectively fixed on the two flange surface bayonet of the bottom shell through standard LC sleeves, the printed circuit board is arranged in the rear end of the bottom shell, the upper cover is covered on the bottom shell, and is limited and fixed by the front end protrusion of the upper cover and the groove of the bottom shell, and the rear end is fastened by the first fixing screw and the second fixing screw. 8. The simulated optical transmission module according to claim 7, further comprising: The heat sink is arranged between the transmitting TO and the bottom shell of the bidirectional transmission optical signal receiving and transmitting combined component and is in contact with the transmitting TO and the bottom shell respectively.