CN112935994B - Special-shaped surface polishing device and polishing method - Google Patents

Abstract

The invention relates to a special-shaped surface polishing device and polishing method, which includes: a polishing medium, a six-axis manipulator, a polishing liquid spraying device, a polishing liquid spraying device, and a workpiece clamping rotary platform, and the polishing medium includes a stacked insertion layer and a polishing layer, the upper surface of the insertion layer is provided with a first groove, the surface of the polishing layer in contact with the insertion layer is provided with a second groove, and the insertion layer is provided with a pressure sensor and A temperature sensor, the polishing structure of the polishing layer is adapted to the surface to be polished; the material of the polishing medium is microporous polyurethane. The present invention selects the polishing medium of microporous polyurethane material, and the foaming hole of microporous polyurethane is beneficial to the fluidity of polishing powder, and polishing medium comprises the insertion layer and polishing layer that are stacked, each layer is all provided with groove, increases polishing liquid The fluidity improves the polishing efficiency, and the six-axis manipulator is used to grab the polishing medium, which is convenient for replacing the polishing medium.

Description

Special-shaped surface polishing device and polishing method

technical field

The invention relates to the technical field of mechanical precision machining, in particular to a special-shaped surface polishing device and a polishing method.

Background technique

At present, the ultra-second-generation and third-generation low-light night vision technology is developing towards 4G, which puts forward higher requirements for the surface polishing quality and shape and dimension accuracy of optical fiber image transmission components used in low-light night vision devices. High surface quality ensures photoelectron quantum conversion efficiency. , Precision assembly ensures high resolution performance. In the preparation process of the low-light night vision device, when the grinding and polishing quality of the surface of the optical fiber image transmission component used is higher, the dimensional accuracy is higher, the dimensional consistency is better, and the stability between batches is higher. For the whole tube Performance improvement plays a key role. At present, more and more users and producers of optical fiber image transmission components are aware of the importance of this problem. Grinding and polishing is a key process in the production, processing and manufacturing of optical fiber image transmission components. The most fundamental quality requirement for component applications is to make the surface quality of components reach optical-grade surface quality and external dimensions through grinding and polishing.

Under the current application background conditions, there are many positions for grinding and polishing on the surface of optical fiber image transmission components, which can be roughly divided into three categories. According to the grinding and polishing position, the largest is the two end faces of the component, which is also the most demanding position for optical quality; The second is the step surface and the cylindrical or inclined surface. This position generally has higher requirements, and it needs to achieve a fine polishing effect without pitting and scratches; the last is the fillet position, which is connected to the end face. The optical processing quality requirements are the same as the end face. No pitting and scratches are required. For the end plane, the polishing methods and technologies are very mature, including classical polishing, double-sided polishing, ion polishing, etc., but for the polishing of special-shaped surfaces, such as cylindrical surfaces, inclined surfaces and aspherical surfaces, there is no corresponding automatic machinery at present. The polishing of the equipment is generally done by hand. Through manual and flexible hand movements, it can be thrown to the position that cannot be polished by the machine, such as the root position where the step connects to the cylinder or slope, as well as slopes with different angles and rounded corners with different curvature radii. However, one of the biggest disadvantages of the manual method is that the polishing efficiency is extremely low, and the flatness and parallelism of the polishing are difficult to meet the requirements of use, that is, the consistency of the polishing quality is poor, which affects the polishing quality, resulting in a decline in the yield of optical fiber image transmission components. It can even lead to the scrapping of the product, which increases the cost of manufacturing.

Contents of the invention

The main purpose of the present invention is to provide a special-shaped surface polishing device and polishing method to solve the existing technical problems such as difficult polishing, low efficiency, and poor polishing quality of the existing special-shaped surface.

The purpose of the present invention and the solution to its technical problems are achieved by adopting the following technical solutions. According to a special-shaped surface polishing device proposed by the present invention, it comprises:

A polishing medium, which includes a stacked insertion layer and a polishing layer, the upper surface of the insertion layer is provided with a first groove, and the surface of the polishing layer in contact with the insertion layer is provided with a second groove, The insertion layer is provided with a pressure sensor and a temperature sensor, and the polishing structure of the polishing layer is adapted to the surface to be polished; the material of the polishing medium is microporous polyurethane;

A six-axis manipulator, which includes a manipulator, a base for fixing the manipulator, and a clamping portion at the end of the manipulator, the clamping portion being used to clamp the polishing medium;

Polishing fluid injection equipment, which includes a first polishing fluid tank and a first nozzle, one end of the first nozzle is connected to a first nozzle for injecting the polishing fluid into the first groove;

Polishing liquid spraying equipment, which includes a second polishing liquid tank and a second spray pipe, one end of the second spray pipe is connected to a second spray head for providing polishing liquid to the polishing site;

The workpiece clamping rotary platform includes a rotary platform and a pneumatic clamp arranged on the rotary platform, and the pneumatic clamp is used for clamping a workpiece to be polished.

The purpose of the present invention and its technical problems can also be further realized by adopting the following technical measures.

Preferably, the aforementioned special-shaped surface polishing device, wherein the thickness of the embedded layer is 10mm-20mm; the thickness of the polishing layer is 5mm-10mm;

The inserting layer and the polishing layer are bonded by glue.

The thickness of the embedded layer is 10mm-20mm; the thickness of the polishing layer is 5mm-10mm;

The polyurethane material contains fillers; the fillers include cerium oxide or zirconium oxide.

Preferably, the aforementioned special-shaped surface polishing device, wherein the first grooves are arranged vertically and horizontally alternately, the groove width is 1-3 mm, the groove depth is 1-3 mm, and the distance between two adjacent parallel grooves is 10-20 mm;

The second grooves are arranged vertically and horizontally alternately, the groove width is 1-3mm, the groove depth is 1-3mm, and the distance between two adjacent parallel grooves is 10-20mm.

Preferably, in the aforementioned special-shaped surface polishing device, a plurality of through holes penetrating up and down are arranged in the first groove, and the diameter of the through holes is 1-3 mm; and/or,

A plurality of through holes penetrating up and down are arranged in the second groove, and the diameter of the through holes is 1-3 mm.

Preferably, the aforementioned special-shaped surface polishing device, wherein a first hydraulic pump is provided on the first nozzle, and the other end of the first nozzle leads to the first polishing liquid tank;

A second hydraulic pump is arranged on the second spray pipe, and the other end of the second spray pipe leads to the second polishing solution tank.

Preferably, the aforementioned special-shaped surface polishing device, wherein the polishing structure of the polishing layer is adapted to the surface to be polished includes:

When the surface to be polished is flat, choose a flat polishing structure;

When the surface to be polished is a spherical surface, select the corresponding circular surface polishing structure;

When the surface to be polished is a special-shaped surface, select the corresponding special-shaped polishing structure.

Preferably, in the aforementioned special-shaped surface polishing device, both the pressure sensor and the temperature sensor are located on the side of the embedding layer in contact with the polishing layer.

Preferably, the aforementioned special-shaped surface polishing device also includes:

a polishing container, the workpiece clamping rotary platform is set in the polishing container;

The polishing liquid recovery equipment is arranged at the bottom of the grinding and polishing container, and is used for recovering the polishing liquid for repeated use.

Preferably, the aforementioned special-shaped surface polishing device, wherein the polishing liquid recovery device includes a filter and a liquid reservoir, the filter is a centrifugal filter, including a polishing liquid recovery chamber and a glass waste overflow chamber, the filter The polishing liquid recovery chamber is connected with the polishing container through a first pipeline, and one end of the first pipeline connected to the polishing container is provided with a coarse filter, and the first pipeline is connected to the polishing liquid recovery chamber of the filter one end of which is provided with a fine filter;

A stirrer, a heating rod and a temperature sensor are arranged in the liquid reservoir, the liquid reservoir is connected with the first polishing solution tank through a second pipeline, and the liquid reservoir is connected with the second polishing liquid tank through a third pipeline. The polishing solution tank is connected, and the second pipeline and the third pipeline are respectively provided with return motors.

The purpose of the present invention and the solution to its technical problems are also achieved by the following technical solutions. According to a kind of special-shaped surface polishing method that the present invention proposes, it comprises:

Before polishing, use clean water to ultrasonically clean the workpiece to be polished, ultrasonic for 10-15 minutes, take it out, and rinse it with clean water; put the rinsed workpiece to be polished into a pneumatic fixture;

According to the shape and size of the surface to be polished of the workpiece to be polished, select the appropriate polishing medium, and use the six-axis manipulator to grab the polishing medium;

Set the polishing pressure and polishing liquid temperature, turn on the rotating platform, polishing liquid spraying equipment, polishing liquid spraying equipment and polishing liquid recovery equipment; start the control system to polish the surface of the workpiece to be polished;

During the polishing process, the used polishing liquid enters the polishing liquid recovery equipment, and after being centrifuged, returns to the polishing liquid spraying equipment and the polishing liquid spraying equipment.

By virtue of the above technical solutions, the special-shaped surface polishing device and polishing method proposed by the present invention have at least the following advantages:

1. The special-shaped surface polishing device of the present invention includes a polishing medium, a six-axis manipulator, a polishing liquid spraying device, a polishing liquid spraying device, and a workpiece clamping rotary platform. The polishing medium made of microporous polyurethane and the foaming holes of microporous polyurethane are selected. It is beneficial to the fluidity of the polishing powder, and the polishing medium includes a laminated layer and a polishing layer, and each layer is provided with grooves to increase the fluidity of the polishing liquid and improve the polishing efficiency. The shape and size of the polishing medium can be designed on site according to the shape and size of the surface to be polished, and the six-axis manipulator can be used to grab the polishing medium to facilitate the replacement of the polishing medium.

2. The device of the present invention is based on the automatic program control of the manipulator, multi-degree-of-freedom movement, and its characteristics of being easy to imitate manual polishing actions. Through program control, the automatic imitation manual polishing of positions with small areas and high quality requirements can be achieved significantly. Improve grinding and polishing efficiency, surface quality and processing dimensional accuracy, thereby improving product consistency and stability.

3. The polishing process realizes the monitoring of pressure and temperature, and controls the polishing action through the sensor feedback signal. By putting the pressure sensor and temperature sensor into the polyurethane polishing material, in the actual polishing process, through the monitoring of pressure and temperature, the efficiency of polishing can be analyzed and judged, and the relationship between pressure, temperature and polishing quality and efficiency can be established.

4. In the present invention, the combination of spraying and showering/infiltration is adopted to ensure that the polishing liquid flows continuously and evenly on the polishing surface, so as to improve the polishing efficiency and avoid defective products caused by polishing discomfort. The polishing liquid first enters the connecting layer of the manipulator through the polishing liquid injection equipment, and flows through the surface groove. Since polyurethane is a porous material, the polishing liquid penetrates through the micropores in the material, passes through the embedded layer, and reaches the polishing layer; at the same time , using polishing liquid spray equipment to directly spray the polishing liquid to the polishing position.

5. The present invention utilizes centrifugal separation technology to realize the separation of glass powder and polishing powder in the polishing liquid. The glass powder with low density overflows from the upper layer through centrifugal separation, while the polishing powder flows out from the bottom of the device, realizing the recycling of the polishing powder. Reduce the cost of polishing. At the same time, the auxiliary fine filtration technology ensures the efficiency of centrifugal separation.

6. The special-shaped surface polishing device of the present invention is an automatic polishing device, which realizes the automatic polishing of the special-shaped surface of the hard optical fiber image transmission element, mainly for the polishing of the fillet, cylinder, inclined surface and table top of the optical fiber image transmission element. The area of the location is small, and the polishing quality requirements are high. It has been verified that the processing efficiency and quality of optical fiber image transmission components can be significantly improved by using the special-shaped surface polishing device of the present invention. At present, the unqualified rate caused by processing and polishing quality problems is nearly 2% to 5%. If the polishing device of the present invention is used to reduce the surface quality unqualified rate to less than 0.5%, its economic benefits are very considerable. Improve grinding and polishing efficiency by more than 50%. In addition, surface quality standards for fiber optic imaging components can be refined.

7. The special-shaped surface polishing device of the present invention is not only used for automatic polishing of special-shaped surfaces of hard optical fiber image transmission components, but also can be used for automatic polishing of special-shaped surfaces of optical glass, ceramics and other materials to realize automatic polishing of special-shaped surfaces.

8. The special-shaped surface polishing method of the present invention is simple and fast, can realize automatic polishing, improve polishing efficiency, surface quality and processing dimensional accuracy, and the polishing liquid is returned to the polishing liquid spraying equipment and polishing liquid spraying equipment through centrifugal separation, Reduce environmental pollution and reduce costs.

The above description is only an overview of the technical solution of the present invention. In order to understand the technical means of the present invention more clearly and implement it according to the contents of the description, the preferred embodiments of the present invention and accompanying drawings are described in detail below.

Description of drawings

Fig. 1 is a schematic structural view of a special-shaped surface polishing device proposed by an embodiment of the present invention;

Fig. 2 is a schematic structural view of a polishing medium proposed by an embodiment of the present invention;

Fig. 3 is a schematic structural view of a polishing medium proposed in another embodiment of the present invention;

Fig. 4a is a schematic structural view of the inner circular polishing surface;

Figure 4b is a schematic structural view of a triangular polished surface;

Figure 4c is a schematic structural view of a stepped polished surface;

Figure 4d is a schematic structural view of the outer circular polished surface;

Fig. 5 is a schematic diagram of a grooved structure of a polishing medium proposed by an embodiment of the present invention;

Fig. 6 is a structural schematic diagram of a special-shaped surface polishing device proposed by another embodiment of the present invention;

Fig. 7 is a schematic structural diagram of the polishing liquid recovery equipment of a special-shaped surface polishing device proposed by an embodiment of the present invention.

Detailed ways

In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation, structure and characteristics of the special-shaped surface polishing device and polishing method proposed according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. And its effect, detailed description is as follows. In the following description, different "one embodiment" or "embodiment" do not necessarily refer to the same embodiment. Furthermore, the particular features, structures or characteristics of one or more embodiments may be combined in any suitable manner.

As shown in Figures 1-5, an embodiment of the present invention proposes a special-shaped surface polishing device, which includes: a polishing medium 1, a six-axis manipulator 3, a polishing liquid spraying device 2, a polishing liquid spraying device 4 and a workpiece holder Hold the rotating platform.

The polishing medium 1 includes a stacked insertion layer 12 and a polishing layer 11, the upper surface of the insertion layer 12 is provided with a first groove 121, and the surface of the polishing layer 11 in contact with the insertion layer 12 is provided with The second groove 111, the embedded layer 12 is provided with a pressure sensor 15 and a temperature sensor 16, the polishing structure of the polishing layer 11 is adapted to the surface to be polished; the material of the polishing medium 1 is microporous polyurethane.

In this embodiment, a microporous polyurethane material is selected as the polishing medium, and the foam holes in it are beneficial to the fluidity of the polishing powder.

Further, both the pressure sensor and the temperature sensor are located on the side of the embedding layer in contact with the polishing layer.

By inserting pressure sensors and temperature sensors into the polyurethane polishing material, it is preferable that the pressure sensors and temperature sensors are placed close to the position 5mm-10mm above the polishing point and placed in the implant layer to realize the pressure and temperature during the polishing process. The monitoring, the polishing action is controlled through the sensor feedback signal. In the actual polishing process, through the monitoring of pressure and temperature, the efficiency of polishing is analyzed and judged, and the relationship between pressure, temperature and polishing quality and efficiency is established. The structure diagram of the placement position of the pressure and temperature sensors in the embedded layer is shown in Figure 2.

In some preferred embodiments, the polyurethane material contains fillers; the fillers include cerium oxide or zirconium oxide.

A small amount of filler is added to the polyurethane material. The polyurethane material containing cerium oxide is mainly used to improve the polishing efficiency. The polyurethane material containing zirconia is mainly used to improve the finish. The polyurethane material without filler is stable during the polishing process. According to the different objects to be polished, choose the corresponding Shore hardness polyurethane.

Further, the polyurethane material is mixed with cerium oxide filler, the particle size of which is less than 5 microns, which can effectively improve the polishing efficiency when used as a polishing medium.

In some embodiments, as shown in FIG. 2 , the thickness of the insertion layer 12 is 10mm-20mm; the thickness of the polishing layer 11 is 5mm-10mm; the insertion layer 12 and the polishing layer 11 are passed through Adhesive bonding.

In order to increase the fluidity of the polishing liquid and improve the polishing efficiency, grooves can be made on the surface of the polyurethane material, and a flowable type of glue can be selected for bonding to make the glue layer uniform.

In some embodiments, the first grooves 121 are arranged vertically and horizontally alternately, the groove width is 1-3mm, preferably 2mm, the groove depth is 1-3mm, preferably 2mm, and the distance between two adjacent parallel grooves is 10-20mm , preferably 15mm;

The second grooves 111 are arranged vertically and horizontally alternately, the groove width is 1-3mm, preferably 2mm, the groove depth is 1-3mm, preferably 2mm, and the distance between two adjacent parallel grooves is 10-20mm, preferably 15mm.

The arrangement of the first groove and the second groove can be the same or different, as shown in FIG. 5 , one of the arrangement of the second groove 111 is shown.

In some other embodiments, as shown in FIG. 3 , the polishing medium 1 includes a top layer 13 in addition to the embedding layer 12 and the polishing layer 11, and a third groove 131 is also opened on the top layer 13, and the top layer 13 The thickness is 10mm-20mm, the thickness of the embedded layer 12 is 10mm-20mm; the thickness of the polishing layer 11 is 5mm-10mm. The top layer 13 , the embedding layer 12 and the polishing layer 11 are sequentially stacked. The layers are bonded by glue.

Adding the top layer can increase the grip force of the manipulator, or connect with the six-axis manipulator through mechanical drilling.

In addition to slotting, holes can also be drilled to improve the fluidity of the polishing fluid. Generally, the diameter of the holes is about 2mm, and the actual size and arrangement of the holes are set according to the processing surface.

In some embodiments, as shown in FIG. 2 , several through holes 122 penetrating up and down are provided in the first groove 121, and the diameter of the through holes 122 is 1-3 mm, preferably 2 mm; and/or,

A plurality of through holes 112 penetrating up and down are provided in the second groove 111 , and the diameter of the through holes 112 is 1-3 mm, preferably 2 mm.

In some embodiments, the polishing structure of the polishing layer 11 adapted to the surface to be polished includes:

When the surface to be polished is flat, choose a flat polishing structure;

When the surface to be polished is a spherical surface, select the corresponding circular surface polishing structure;

When the surface to be polished is a special-shaped surface, select the corresponding special-shaped polishing structure.

In this embodiment, the polishing structure of the polishing layer in the polishing medium can be prepared in advance according to the shape and size of the commonly used surface to be polished in a variety of models for on-site selection, and the use of manipulators can facilitate the replacement of the polishing medium, or make a flat surface first Polishing structure, the corresponding polishing structure is ready-to-use on site. Usually W40 diamond pellets are used to sharpen the polished surface. During use, brushes can be used to brush the polyurethane surface as needed, which helps to improve the polishing efficiency. The polishing surface of the polishing layer is designed correspondingly according to the shape of the polished surface, and can adopt a plane or an arc or a special-shaped design. The plane is suitable for a throwing plane, and the round surface is suitable for a throwing surface as shown in Figures 4a and 4d. 4a is an inner circle, which is suitable for throwing rounded corners. Figure 4d is an outer circle, which is suitable for concave surfaces, and the special shape is suitable for special-shaped surfaces, as shown in Figures 4b and 4c. Figure 4b is a triangle, which is suitable for throwing sharp corners; Figure 4c is a stepped shape, suitable for throwing a stepped surface.

The six-axis manipulator 3 includes a manipulator 31 , a base 32 for fixing the manipulator, and a clamping part 33 at the end of the manipulator, and the clamping part 33 is used for clamping the polishing medium 1 .

In this embodiment, the six-axis manipulator specifically includes: precision components such as a base, shoulders, elbows, and wrists; the six-axis manipulator is driven by a motor; a servo drive module for the joints of the manipulator; Grinding medium clamping device, the clamping part of the manipulator is easy to open and close, which can realize rapid replacement of different polishing media.

The device of this embodiment also includes a set of control system, adopts a central management system, and can realize data injection, rewriting, timing and other management and control operations for N processing terminals through network ports or wifi.

The control system is connected with the six-axis manipulator for controlling the six-axis manipulator to grab the polishing medium and perform polishing operations; the control system is connected with the pressure sensor and temperature sensor in the polishing medium for controlling the polishing pressure and the temperature of the polishing liquid; the control system is connected with the polishing liquid spraying equipment and the polishing liquid spraying equipment, and is respectively used to control the injection flow and the spraying flow of the polishing liquid; the control system is connected with the workpiece clamping rotary platform , used to control the rotation speed of the rotating platform; the control system is connected with the polishing liquid recovery equipment, used to control the centrifugal filtration operation of the filter and the stirring speed of the stirrer in the liquid reservoir and the heating power of the heating rod, and control Return the power of the motor.

The six-axis manipulator of this embodiment simulates the movement of a human arm with six degrees of freedom, as shown in Figure 1, with precise control and high repeat positioning accuracy. The robotic arm control system is advanced, stable, safe and reliable. It has excellent characteristics of good drag trial and high sensitivity collision. Exquisite mechanical structure design, compact shape, can adapt to the narrow working space and high-precision task requirements.

Through visual programming settings, manually drag the robot arm, record the running track points for programming, and realize drag teaching; and the function of collision stop, collision detection algorithm based on force sense, through joint current and dual encoder feedback, can also be used According to the needs, it can be customized to support the terminal six-dimensional force sensor or six-joint single-dimensional force sensor to detect external force feedback, which can detect accidental collision and stop running, ensuring the safety of man-machine coexistence.

Repeat positioning accuracy: ±0.05mm

Rated life: 30000h

Collaborative operation: Collaborative robot safety functions such as "safe and applicable monitored stop", "drag teaching" and "power and force limitation".

Degrees of freedom: 6

Maximum reach: 666mm

Load: ≥3kg

Programming: on the industrial flat panel display user interface

Installation method: any angle

Protection class: IP64

Noise: ≤64dB

Material: Aluminum Alloy.

In this embodiment, a mechanical arm is used to perform automatic polishing on the shaped polishing position of the optical fiber image transmission element. It adopts multi-axis cooperative robotic arm, and its characteristics: meet the requirements of large load, wide arm, high precision, low temperature resistance -20°, IP64 protection level. It flexibly simulates the manual polishing action, and realizes precise control of the polishing position, avoids processing defects caused by force application, position, and angle deviation during manual operation, improves the qualified rate of finished products, and enables a single operator to operate multiple devices at the same time. Provide guarantee for user units to reduce staff and increase efficiency.

The polishing liquid spraying device 2 includes a first polishing liquid tank and a first spray pipe, one end of the first spray pipe is connected with a first spray head for spraying the polishing liquid into the first groove 121 .

Further, a first hydraulic pump is provided on the first nozzle, and the other end of the first nozzle leads to the first polishing solution tank.

The polishing liquid injection equipment adopts a liquid injection device, and the polishing liquid injection equipment adopts micro-hole injection to realize continuous and equal injection of small flow of polishing liquid, and the position of the injection port is adjustable.

In some preferred embodiments, the cross-section of the polishing medium is circular, and the landing point of the polishing liquid ejected from the nozzle is located on the groove of the polishing medium, three quarters of the radius away from the center of the polishing medium.

The polishing liquid spraying device 4 includes a second polishing liquid tank and a second spray pipe. One end of the second spray pipe is connected with a second spray head for providing polishing liquid to the polishing site.

Further, a second hydraulic pump is provided on the second nozzle, and the other end of the second nozzle leads to the second polishing solution tank.

In this embodiment, the polishing liquid adopts the design of spraying and dripping/seeping. Whether the polishing liquid can evenly flow to the polishing surface during the polishing process is very important. In the present invention, the combination of spraying and showering/infiltration is adopted to ensure that the polishing liquid flows continuously and evenly on the polishing surface, so as to improve the polishing efficiency and avoid defective products caused by polishing discomfort. The polishing liquid first enters the connecting layer of the manipulator through the polishing liquid injection equipment, and flows through the surface groove. Since polyurethane is a porous material, the polishing liquid penetrates through the micropores in the material, passes through the embedded layer, and reaches the polishing layer; at the same time , using polishing liquid spray equipment to directly spray the polishing liquid to the polishing position.

The workpiece clamping rotary platform includes a rotary platform 5 and a pneumatic clamp 6 arranged on the rotary platform 5, and the pneumatic clamp 6 is used for clamping a workpiece 9 to be polished.

A rotary drive device is provided below the rotary platform, and the rotary drive device is a rotary drive motor. Pneumatic fixture adopts high-precision pneumatic three-jaw clamping method, and chooses built-in cylinder mode, which has the advantages of convenient loading and unloading, large clamping force, good sealing, high precision, safety and reliability, and ensures that the workpiece is loaded in place without angle inclination , suitable for sample loading of various sizes. The rotation speed of the workpiece clamping rotary platform is controllable.

Further, as shown in Figure 6, the special-shaped surface polishing device also includes:

A polishing container 7, the workpiece holding rotating platform is arranged in the polishing container 7;

The polishing liquid recovery device 8 is arranged at the bottom of the grinding and polishing container 7, and is used for recovering the polishing liquid for repeated use.

The returned polishing liquid is centrifuged to separate the polishing powder from the glass powder and recover the polishing liquid.

In some embodiments, as shown in FIG. 7, the polishing liquid recovery device 8 includes a filter 81 and a liquid reservoir 82, the filter is a centrifugal filter, including a polishing liquid recovery chamber and a glass waste overflow chamber, so The polishing liquid recovery chamber of the filter 81 is connected with the polishing container 7 through a first pipeline, and one end of the first pipeline connected to the polishing container 7 is provided with a coarse filter screen 83, and the first pipeline is connected to the polishing container 7. One end of the polishing solution recovery chamber of the filter is provided with a fine filter screen 84;

The liquid reservoir 82 is provided with a stirrer 821, a heating rod 822 and a temperature sensor (not shown in the figure), and the liquid reservoir 82 is connected with the first polishing solution tank through a second pipeline. The liquid container 82 is connected to the second polishing liquid tank through a third pipeline, and the second pipeline and the third pipeline are respectively provided with return motors.

The polishing liquid is a suspension of polishing powder, and the density of the polishing powder in the polishing liquid is twice that of the glass waste (glass powder polished from the surface of the workpiece to be polished during polishing). The centrifugal separation technology is used to realize the polishing liquid Separation of medium polishing powder and glass waste. In this device, the used polishing liquid enters the polishing liquid recovery chamber first, and the glass waste slag with low density floats on the upper layer of the polishing liquid, and overflows from the upper opening of the polishing liquid recovery chamber to the glass waste slag overflow chamber through centrifugal separation, and is discharged from the system. The polishing liquid with polishing powder flows out from the lower opening of the polishing liquid recovery chamber, which realizes the recycling of the polishing liquid and reduces the cost of polishing. At the same time, the auxiliary fine filtration technology ensures the efficiency of centrifugal separation.

Use circulating pump to filter and adopt continuous filtration method to filter out large glass debris and impurities, so as to realize the repeated use of grinding and polishing liquid. When grinding, the particle size of the polishing liquid is not greater than W24 grade, and when polishing, the particle size of the polishing liquid is not greater than W10.

Pumping rate: ≥1.0m ³ /h

Rated voltage: 220V/50Hz

Motor power: ≤150W

Noise: ≤64dB.

The stainless steel main structure is equipped with a heavy-duty machine base to ensure stable operation of the equipment, anti-rust, anti-corrosion, and shock absorption. The base of the six-axis manipulator is located outside the polishing container.

The special-shaped surface polishing device of this embodiment can be used to realize automatic polishing, and the polishing method mainly includes the following steps:

1) Before polishing, use clear water to ultrasonically clean the workpiece 9 to be polished, ultrasonically for 10-15 minutes, take it out, and rinse it with clean water to avoid damage to the surface during processing caused by the presence of granular foreign matter;

2) Check whether the six-axis manipulator 3, polishing liquid spraying equipment 2, polishing liquid spraying equipment 4 and workpiece clamping rotary platform are operating normally;

3) Open the six-axis manipulator 3, select the matching polishing medium 1 according to the shape and size of the surface to be polished of the workpiece 9 to be polished, call out the applicable program, and the six-axis manipulator 3 grabs the polishing medium 1;

4) Put the rinsed workpiece 9 to be polished into the high-precision pneumatic clamp 6 at a specific position, while ensuring that the center is positioned and perpendicular to the working surface;

5) Set the polishing pressure and the temperature of the polishing liquid, turn on the high-precision rotating platform 5, the polishing liquid injection equipment 2, the polishing liquid spraying equipment 4 and the polishing liquid recovery equipment 8, and start the control system;

6) The surface of the workpiece is pressed tightly by the six-axis manipulator, and at the same time, the pressure of the reflow motor and the temperature of the heating rod 822 are automatically adjusted according to the set pressure and temperature. At the same time, the micro-oscillation of the six-axis manipulator imitating manual polishing is controlled by the program to polish the surface of the workpiece to be polished, and the polishing time is the main criterion for whether the polishing is good;

During the polishing process, the used polishing liquid enters the polishing liquid recovery equipment, and after centrifugal separation, returns to the polishing liquid injection equipment and the polishing liquid spraying equipment;

7) Rinse the polished workpiece with pure water.

Based on the multi-degree-of-freedom flexible movement of the robotic arm and its advantages of being easy to imitate manual polishing actions, the automatic polishing of small-area and high-quality positions is realized through program control. Up to now, there is no automatic polishing method for the special-shaped surface of the optical fiber image transmission element based on the manipulator. The invention uses a manipulator to automatically grind and polish the special-shaped polishing position of the optical fiber image transmission element. It adopts multi-axis cooperative robotic arm, and its characteristics: meet the requirements of large load, wide arm, high precision, low temperature resistance -20°, IP64 protection level. It flexibly simulates the manual polishing action, and realizes precise control of the polishing position, avoids processing defects caused by force application, position, and angle deviation during manual operation, improves the qualified rate of finished products, and enables a single operator to operate multiple devices at the same time. Provide guarantee for user units to reduce staff and increase efficiency.

The special-shaped surface polishing device of the present invention is an automatic polishing device, which realizes the automatic polishing of the special-shaped surface of the hard optical fiber image transmission element, and is mainly aimed at the polishing of the rounded corners, cylindrical surfaces, inclined surfaces and table tops of the optical fiber image transmission element. The area is small, and the polishing quality requirements are high.

It has been verified that the processing efficiency and quality of optical fiber image transmission components can be significantly improved by using the special-shaped surface polishing device of the present invention. At present, the unqualified rate caused by processing and polishing quality problems is nearly 2% to 5%. If the polishing device of the present invention is used to reduce the surface quality unqualified rate to less than 0.5%, its economic benefits are very considerable. Improve grinding and polishing efficiency by more than 50%. In addition, surface quality standards for fiber optic imaging components can be refined.

In the description of the invention, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "horizontal", "vertical", etc. is based on the method or positional relationship shown in the drawings, and is only for convenience The present invention is described and simplified descriptions do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore, should not be construed as limiting the present invention.

In addition, in the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection, Or integrally connected; it may be mechanically connected or electrically connected; it may be directly connected or indirectly connected through an intermediary, and it may be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention in specific situations.

In the foregoing embodiments, the descriptions of each embodiment have their own emphases, and for parts not described in detail in a certain embodiment, reference may be made to relevant descriptions of other embodiments.

The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Anyone familiar with this field Those skilled in the art, without departing from the scope of the technical solution of the present invention, can use the technical content disclosed above to make some changes or modify equivalent embodiments with equivalent changes. Any simple modifications, equivalent changes and modifications made to the above embodiments by the technical essence still belong to the scope of the technical solutions of the present invention.

Claims (8)

1. A profiled surface polishing device comprising:

the polishing medium comprises an embedded layer and a polishing layer which are arranged in a stacked manner, wherein a first groove is formed in the upper surface of the embedded layer, a second groove is formed in one surface, which is in contact with the embedded layer, of the polishing layer, a pressure sensor and a temperature sensor are arranged in the embedded layer, and the polishing structure of the polishing layer is matched with a surface to be polished; the polishing medium is made of microporous polyurethane;

the six-axis mechanical arm comprises a mechanical arm, a base for fixing the mechanical arm and a clamping part positioned at the end part of the mechanical arm, wherein the clamping part is used for clamping the polishing medium;

the polishing solution spraying device comprises a first polishing solution tank and a first spray pipe, wherein one end of the first spray pipe is connected with a first spray head for spraying the polishing solution into the first groove;

the polishing liquid spraying device comprises a second polishing liquid box and a second spray pipe, wherein one end of the second spray pipe is connected with a second spray head for providing polishing liquid for a polishing part;

the workpiece clamping and rotating platform comprises a rotating platform and a pneumatic clamp arranged on the rotating platform, wherein the pneumatic clamp is used for clamping a workpiece to be polished;

the thickness of the imbedding layer is 10mm-20mm; the thickness of the polishing layer is 5mm-10mm;

the first grooves are arranged in a longitudinal and transverse mode, the groove width is 1-3mm, the groove depth is 1-3mm, and the distance between two adjacent parallel grooves is 10-20mm;

the second grooves are arranged in a longitudinal and transverse mode, the groove width is 1-3mm, the groove depth is 1-3mm, and the distance between two adjacent parallel grooves is 10-20mm;

the polyurethane material contains filler;

the filler is cerium oxide, and the granularity is less than 5 microns;

the polishing structure of the polishing layer is matched with the surface to be polished, and the polishing structure comprises: when the polished surface is a special-shaped surface, a corresponding special-shaped polishing structure is selected.

2. The profiled surface polishing device as defined in claim 1 wherein the interposed layer and polishing layer are bonded by glue.

3. The profiled surface polishing device as defined in claim 1 wherein,

a plurality of through holes penetrating up and down are arranged in the first groove, and the aperture of each through hole is 1-3mm; and/or the number of the groups of groups,

a plurality of through holes penetrating up and down are arranged in the second groove, and the aperture of each through hole is 1-3mm.

4. The profiled surface polishing device as defined in claim 1 wherein,

a first hydraulic pump is arranged on the first spray pipe, and one end of the first spray pipe is communicated with the first polishing solution tank;

the second spray pipe is provided with a second hydraulic pump, and one end of the second spray pipe is led to a second polishing solution tank.

5. The profiled surface polishing device as defined in claim 1 wherein,

the pressure sensor and the temperature sensor are both positioned on one surface of the imbedding layer, which is contacted with the polishing layer.

6. The profiled surface polishing device as defined in claim 1 further comprising:

the workpiece clamping and rotating platform is arranged in the polishing container;

and the polishing solution recycling device is arranged at the bottom end of the polishing container and is used for recycling the polishing solution and reusing the polishing solution.

7. The profiled surface polishing device as defined in claim 6 wherein,

the polishing solution recycling device comprises a filter and a liquid reservoir, wherein the filter is a centrifugal filter and comprises a polishing solution recycling chamber and a glass waste residue overflow chamber, the polishing solution recycling chamber of the filter is connected with the polishing container through a first pipeline, a coarse filter screen is arranged at one end of the first pipeline connected with the polishing container, and a fine filter screen is arranged at one end of the first pipeline connected with the polishing solution recycling chamber of the filter;

the liquid storage device is characterized in that a stirrer, a heating rod and a temperature sensor are arranged in the liquid storage device, the liquid storage device is connected with the first polishing liquid box through a second pipeline, the liquid storage device is connected with the second polishing liquid box through a third pipeline, and reflux motors are respectively arranged on the second pipeline and the third pipeline.

8. A profiled surface polishing method using the profiled surface polishing device as claimed in any one of claims 1 to 7, the method comprising:

before polishing, cleaning a workpiece to be polished by clean water through ultrasonic waves for 10-15min, taking out, and washing cleanly by clean water; loading the washed workpiece to be polished into a pneumatic clamp;

according to the shape and the size of a surface to be polished of a workpiece to be polished, selecting an adaptive polishing medium, and grabbing the polishing medium by a six-axis manipulator;

setting polishing pressure and polishing liquid temperature, and opening a rotary platform, polishing liquid spraying equipment and polishing liquid recycling equipment; starting a control system to polish the surface to be polished of the workpiece to be polished;

in the polishing process, the used polishing solution enters polishing solution recovery equipment, and after centrifugal separation, the polishing solution returns to polishing solution spraying equipment and polishing solution spraying equipment.