CN112930106B - Flexible electronic device and assembling method thereof - Google Patents
Flexible electronic device and assembling method thereof Download PDFInfo
- Publication number
- CN112930106B CN112930106B CN202110090546.0A CN202110090546A CN112930106B CN 112930106 B CN112930106 B CN 112930106B CN 202110090546 A CN202110090546 A CN 202110090546A CN 112930106 B CN112930106 B CN 112930106B
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- electronic device
- flexible substrate
- flexible
- silicone
- assembling
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- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 59
- 239000013464 silicone adhesive Substances 0.000 claims abstract description 43
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 42
- 239000000741 silica gel Substances 0.000 claims abstract description 40
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 40
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 24
- 239000004944 Liquid Silicone Rubber Substances 0.000 claims abstract description 23
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 11
- 239000011248 coating agent Substances 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 13
- 239000007788 liquid Substances 0.000 claims description 13
- 238000004513 sizing Methods 0.000 claims description 4
- 229920001971 elastomer Polymers 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims 2
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 230000007704 transition Effects 0.000 abstract description 4
- 239000003292 glue Substances 0.000 description 13
- 239000000463 material Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- -1 polydimethylsiloxane Polymers 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0469—Surface mounting by applying a glue or viscous material
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention relates to a flexible electronic device and an assembling method thereof, wherein the flexible electronic device comprises a flexible substrate and an electronic device, wherein the electronic device is arranged on the inner surface of the flexible substrate; the silica gel shell is arranged on one side of the flexible substrate; the liquid silicone rubber layer and the silicone adhesive film layer are mutually bonded, the liquid silicone rubber layer is bonded on the inner surface of the silicone shell, and the silicone adhesive film layer is bonded on the inner surface of the flexible substrate. The silicone adhesive film layer is tightly bonded with the flexible substrate, so that the function of a transition layer is achieved, the silica gel shell is tightly bonded with the flexible substrate, and the bonding strength and the stability of the flexible electronic equipment are improved.
Description
Technical Field
The present invention relates to the field of flexible electronic technologies, and in particular, to a flexible electronic device and a method for assembling the flexible electronic device.
Background
Flexible electronics is an emerging electronic technology that has wide applications in fields such as flexible sensors, wearable devices, medical, etc. due to its unique flexibility, ductility, and efficient, low-cost manufacturing process. A flexible electronic device generally includes a flexible substrate, an organic/inorganic electronic device fabricated on the flexible substrate, and a silicone shell attached to the flexible substrate, and the flexible substrate and the silicone shell are assembled by an adhesion process.
At present, glue used in a bonding process generally comprises quick-drying glue, UV glue, liquid glue (including normal-temperature cured liquid glue and high-temperature cured liquid glue), hot melt glue and the like, wherein the quick-drying glue is easy to brittle fracture and cannot meet the requirements of dust prevention and water prevention after assembly; one of the two materials assembled by the UV adhesive needs to be transparent; after the hot melt adhesive is assembled, the originally flexible parts can be hardened, so that the use experience is influenced; normal temperature curing liquid glue is unstable when assembling two hardness and the big material of surface tension difference, can't pass through reliable experiment, influences the life of product, and high temperature curing liquid glue can't use because on the inside product that contains the battery of product, because the battery can't bear high temperature. Therefore, the flexible electronic product bonded and assembled by the existing common glue cannot pass a reliable test, and the design and use requirements of the flexible electronic device cannot be met.
Disclosure of Invention
The invention aims to provide flexible electronic equipment and an assembling method thereof.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides flexible electronic equipment, which comprises a flexible substrate and an electronic device, wherein the electronic device is arranged on the inner surface of the flexible substrate; the silica gel shell is arranged on one side of the flexible substrate; the liquid silicone rubber layer and the silicone adhesive film layer are mutually bonded, the liquid silicone rubber layer is bonded on the inner surface of the silicone shell, and the silicone adhesive film layer is bonded on the inner surface of the flexible substrate.
Preferably, the thickness of the liquid silicone rubber layer is 0.1 mm-0.2 mm.
Preferably, the flexible substrate is a PET board, a PC board, a PP board, a TPE board or a TPU board.
The invention also provides an assembly method of the flexible electronic equipment, which comprises the following steps: putting the silica gel shell into a lower die of an assembly jig, and then coating liquid silicone rubber on the bonding surface of the silica gel shell; arranging the electronic device on the flexible substrate, coating a silicone adhesive on the adhesive surface of the flexible substrate, and baking to enable the silicone adhesive to form a silicone adhesive film; placing the baked flexible substrate and the baked electronic device on the inner surface of the silica gel shell to enable the silicone adhesive film and the liquid silicone rubber to be connected with each other, and obtaining an assembled jig lower die assembly; and carrying out die assembly on the upper assembling jig and the lower assembling jig module, and then taking out the upper assembling jig and the lower assembling jig module after a shaping process to obtain the flexible electronic equipment.
Preferably, in the baking process, the baking temperature is 40-65 ℃, and the baking time is 20-50 min.
Preferably, the sizing process comprises the steps of: and applying 50-70kg of pressure on the upper die of the assembly jig, continuously applying the pressure for 10-30 minutes, then removing the pressure, standing for 70-90 minutes, and taking out.
Preferably, the sizing process further comprises: taking out and standing for 12-36 hours.
Preferably, the lower assembly jig die is provided with a mounting groove, and the silica gel shell is placed in the mounting groove in the step of placing the silica gel shell into the lower assembly jig die; in the step of die assembly, the distance between the bottom surface of the mounting groove and the inner surface of the upper die of the assembly jig is 0.6-0.8mm.
Preferably, a notch is formed on the silica gel shell; in the step of coating the liquid silicone rubber on the adhesive surface of the silicone shell, coating the liquid silicone rubber on the surface of the silicone shell corresponding to the periphery of the notch; coating a silicone adhesive on the surface of the flexible substrate corresponding to the periphery of the electronic device in coating the silicone adhesive on the adhesive surface of the flexible substrate; and in the step of placing the baked flexible substrate and the electronic device on the inner surface of the silica gel shell, correspondingly placing the electronic device in the notch.
Compared with the prior art, the invention has the beneficial effects that:
according to the flexible electronic equipment provided by the technical scheme, the flexible substrate and the silica gel shell are bonded through the liquid silica gel layer and the silicone adhesive film layer, wherein the silicone adhesive film layer comprises polydimethylsiloxane and the like, and can be cured to be rubber solid on the flexible substrate, so that the silicone adhesive film layer is tightly bonded with the flexible substrate, a transition layer effect is achieved, the silica gel shell is tightly bonded with the flexible substrate, and the bonding strength and the stability of the flexible electronic equipment are enhanced.
According to the assembling method of the flexible electronic equipment, the silicone adhesive is coated on the adhesive surface of the flexible substrate, then baking is carried out to enable the silicone adhesive to form a silicone adhesive film, so that the silicone adhesive film layer is tightly adhered to the flexible substrate, the function of a transition layer is achieved, the adhesive surface of the silica gel shell is coated with liquid silicone rubber, and die assembly is carried out, so that the silica gel shell is tightly adhered to the flexible substrate, and the adhesive strength and the stability of the flexible electronic equipment are enhanced.
Drawings
Fig. 1 is a schematic diagram of an explosive structure of a flexible electronic device according to an embodiment of the present invention.
Fig. 2 is a schematic view of a portion of the flexible substrate and electronic device of fig. 1.
Fig. 3 is a schematic diagram of an exploded structure before mold clamping in an assembly process of a flexible electronic device according to an embodiment of the present invention.
Fig. 4 is a cross-sectional view of the flexible electronic device after mold clamping in the assembly process according to the embodiment of the invention.
Fig. 5 is a partially enlarged view of a point a shown in fig. 4.
Description of the symbols of the drawings:
1. a flexible substrate; 2. an electronic device; 3. a silica gel shell; 4. a liquid silicone rubber layer; 5. a silicone adhesive film layer; 6. assembling a lower jig die; 7. and assembling an upper die of the jig.
Detailed Description
The present invention will now be described in more detail with reference to the accompanying drawings, in which the description of the invention is given by way of illustration and not of limitation. The various embodiments may be combined with each other to form other embodiments not shown in the following description.
Referring to fig. 1-2, an embodiment of the invention provides a flexible electronic device, including: the electronic device comprises a flexible substrate 1, an electronic device 2, a silica gel shell 3, a liquid silica gel layer 4 and a silicone adhesive film layer 5. The electronic device 2 is arranged on the inner surface of the flexible substrate 1, and the silica gel shell 3 is arranged on one side of the flexible substrate 1; the flexible substrate 1 and the silica gel shell 3 are bonded through a liquid silica gel layer 4 and a silicone adhesive film layer 5, the liquid silica gel layer 4 is bonded on the inner surface of the silica gel shell 3, and the silicone adhesive film layer 5 is bonded on the inner surface of the flexible substrate 1.
In the technical scheme, the components of the silicone adhesive film layer comprise polydimethylsiloxane and the like, and the silicone adhesive film layer can be cured to be rubber solid on the flexible substrate, so that the silicone adhesive film layer is tightly bonded with the flexible substrate, the transition layer effect is achieved, the silica gel shell is tightly bonded with the flexible substrate, and the bonding strength and the stability of the flexible electronic equipment are enhanced.
As a preferred embodiment, the thickness of the liquid silicone rubber layer is 0.1mm to 0.2mm, and the silicone rubber shell and the flexible substrate have a better bonding effect at the thickness.
The flexible electronic device in this embodiment may be used as a wearable medical device, wherein the flexible substrate may be a PET board, a PC board, a PP board, a TPE board, or a TPU board, and the electronic device 2 may include a PCBA, a battery, a bioelectrical probe, a sensor, a chip, and the like.
Referring to fig. 3 to fig. 5, an embodiment of the present invention further provides an assembling method of a flexible electronic device, including the following steps: putting the silica gel shell 3 into an assembly jig lower die 6, and then coating liquid silicone rubber on the bonding surface of the silica gel shell 3; arranging the electronic device 2 on the flexible substrate 1, then coating a silicone adhesive on the adhesive surface of the flexible substrate 1, and baking to enable the silicone adhesive to form a silicone adhesive film 5; placing the baked flexible substrate and the baked electronic device on the inner surface of the silica gel shell 3, and connecting the silicone adhesive film layer 5 and the liquid silica gel layer 4 with each other to obtain an assembled jig lower die assembly; and (3) carrying out die assembly on the upper die 7 of the assembly jig and the lower die component of the assembly jig, and then taking out the upper die and the lower die component of the assembly jig after a shaping process to obtain the flexible electronic equipment.
When the two materials of the product bonded by the glue are the silica gel shell 3 and the flexible substrate 1, the hardness difference of the two materials is large, the surface tension of the flexible substrate 1 is low, and the liquid glue bonding assembly product can not pass a reliable test and is introduced into the silicone adhesive film layer 5, so that the thickness of the liquid glue can be accurately controlled, the bonding strength and stability are enhanced, and the service life of the product is prolonged.
As a preferred embodiment, when the silica gel housing 3 is placed into the assembly jig lower mold 6, the mounting groove of the assembly jig lower mold 6 corresponds to the silica gel housing 3 one by one, and the liquid silicone rubber is coated on the adhesive surface of the mounting groove which is away from the electronic device 2 and on the inner side of the silica gel housing.
As a preferred embodiment, the silicone adhesive is smeared on the inner side of the flexible substrate to avoid the adhesive surface of the electronic device, and then baking is carried out, wherein the baking temperature is 40-65 ℃, and the baking time is 20-50 min. Preferably, the baking temperature is 65 ℃, and the baking time is 20min; or baking at 40 deg.C for 50min; a silicone adhesive is caused to form the silicone adhesive film layer 5.
As a preferred embodiment, the liquid silicone rubber may be selected from products of type DC 3145; the silicone adhesive may be selected from the products of type MH 132.
As a preferred embodiment, the electronic device 2 comprises a PCBA, a battery, a bioelectric probe, a sensor, a chip; the flexible substrate 1 is made of PET.
As a preferred embodiment, the baked flexible substrate 1 and the baked electronic device 2 are placed on the inner surface of the silica gel shell 3, and the mounting grooves of the electronic device 2 and the silica gel shell 3 are correspondingly mounted one by one, so that the silicone adhesive film layer 5 and the liquid silicone rubber layer 4 are connected with each other, thereby obtaining an assembled jig lower die assembly; and (5) closing the upper die 7 of the assembly jig and the lower die component of the assembly jig.
In a preferred embodiment, after the upper assembly jig die 7 and the lower assembly jig die are closed, the thickness of the liquid silicone rubber layer 4 is 0.1mm to 0.2mm. And after the upper die 7 of the assembly jig and the lower die component of the assembly jig are closed, the height of the die cavity is 0.75mm.
In a preferred embodiment, after the upper assembly jig mould 7 and the lower assembly jig mould are closed, 60kg of pressure is applied to the upper assembly jig mould 7 for 16 minutes, then the pressure is removed, the equipment is taken out after the equipment is kept still for 80 minutes, and the equipment is taken out and kept still for curing for 24 hours.
And (3) performance testing: the flexible electronic device obtained by the assembly method provided by this embodiment can pass 20N tensile test and can pass 23 days of high temperature and high humidity test at 65 ℃ and 95mb humidity and 10 days of cold and hot impact test.
The above embodiments are only preferred embodiments of the present invention, and the scope of the present invention should not be limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are intended to be covered by the claims.
Claims (8)
1. A method of assembling a flexible electronic device, comprising the steps of:
putting the silica gel shell (3) into an assembly jig lower die (6), and then coating liquid silica rubber on the bonding surface of the silica gel shell (3);
arranging an electronic device (2) on a flexible substrate (1), coating a silicone adhesive on an adhesive surface of the flexible substrate (1), and baking to enable the silicone adhesive to form a silicone adhesive film;
placing the baked flexible substrate (1) and the baked electronic device (2) on the inner surface of the silica gel shell (3) to enable the silicone adhesive film and the liquid silicone rubber to be connected with each other, and obtaining an assembled jig lower die assembly;
assembling an upper assembling jig mould (7) and a lower assembling jig mould component, and then taking out after a shaping process to obtain the flexible electronic equipment;
a notch is formed on the silica gel shell (3); in the step of coating liquid silicone rubber on the adhesive surface of the silicone shell (3), coating the liquid silicone rubber on the surface of the silicone shell (3) corresponding to the periphery of the notch; coating a silicone adhesive on the adhesive surface of the flexible substrate (1), and coating a silicone adhesive on the surface of the flexible substrate (1) corresponding to the periphery of the electronic device (2); and in the step of placing the baked flexible substrate (1) and the baked electronic device (2) on the inner surface of the silica gel shell (3), correspondingly placing the electronic device (2) in the notch.
2. The method for assembling a flexible electronic device according to claim 1, wherein the baking temperature is 40 ℃ to 65 ℃ and the baking time is 20min to 50min.
3. The method of assembling a flexible electronic device according to claim 1, wherein the sizing process comprises the steps of: and (3) applying 50-70kg of pressure on the upper die (7) of the assembly jig, continuously applying the pressure for 10-30 minutes, then removing the pressure, standing for 70-90 minutes, and taking out.
4. The method of assembling a flexible electronic device according to claim 3, wherein the sizing process further comprises: taking out and standing for 12-36 hours.
5. The method for assembling flexible electronic device according to claim 1, wherein the lower mold (6) of the assembling jig is provided with an installation groove, and the step of placing the silicone shell (3) into the lower mold (6) of the assembling jig places the silicone shell (3) into the installation groove; in the step of die assembly, the distance between the bottom surface of the mounting groove and the inner surface of the upper die (7) of the assembly jig is 0.6-0.8mm.
6. A flexible electronic device, characterized in that the method of assembling a flexible electronic device according to claim 1 comprises a flexible substrate (1) and an electronic device (2), the electronic device (2) being disposed on an inner surface of the flexible substrate (1);
the silica gel shell (3) is arranged on one side of the flexible substrate (1);
the liquid silicone rubber layer (4) and the silicone adhesive film layer (5) are bonded with each other, the liquid silicone rubber layer (4) is bonded on the inner surface of the silicone shell (3), and the silicone adhesive film layer (5) is bonded on the inner surface of the flexible substrate (1).
7. The flexible electronic device according to claim 6, wherein the thickness of the liquid silicone rubber layer (4) is 0.1mm to 0.2mm.
8. Flexible electronic device according to claim 6, characterized in that the flexible substrate (1) is a PET sheet, a PC sheet, a PP sheet, a TPE sheet or a TPU sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110090546.0A CN112930106B (en) | 2021-01-22 | 2021-01-22 | Flexible electronic device and assembling method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110090546.0A CN112930106B (en) | 2021-01-22 | 2021-01-22 | Flexible electronic device and assembling method thereof |
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| CN112930106A CN112930106A (en) | 2021-06-08 |
| CN112930106B true CN112930106B (en) | 2022-11-22 |
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