CN112947721B - Compact vibration-damping heat-radiating device of mainboard - Google Patents
Compact vibration-damping heat-radiating device of mainboard Download PDFInfo
- Publication number
- CN112947721B CN112947721B CN202110214345.7A CN202110214345A CN112947721B CN 112947721 B CN112947721 B CN 112947721B CN 202110214345 A CN202110214345 A CN 202110214345A CN 112947721 B CN112947721 B CN 112947721B
- Authority
- CN
- China
- Prior art keywords
- seat body
- space
- outer seat
- heat dissipating
- connecting rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Fluid-Damping Devices (AREA)
Abstract
The invention relates to a compact vibration-damping heat-radiating device of a mainboard, which comprises an outer seat body, wherein the upper end of the outer seat body is provided with an inner seat body for installing the mainboard, the outer end surface of the inner seat body is in sealing fit with the inner surface of the outer seat body in a vertically sliding manner, and a first space is formed between the bottom of the outer seat body and the bottom of the inner seat body; a cylinder body is arranged on the outer side of the bottom of the outer seat body, a piston capable of sliding up and down is arranged in the cylinder body, a connecting rod is fixedly connected to the piston, the connecting rod penetrates through the bottom of the outer seat body and is fixedly connected with the inner seat body, the connecting rod can be movably matched with the bottom of the outer seat body in a sealing mode up and down, and a second space is formed between the piston and the bottom of the outer seat body; the two one-way valves are used for communicating the first space and the second space into a one-way circulation passage, wherein one-way valve is used for enabling the cooling liquid in the first space to flow into the second space, and the other one-way valve is used for enabling the cooling liquid in the second space to flow into the first space. The invention has the advantages of compact structure and small occupied space.
Description
Technical Field
The invention relates to the technical field of heat dissipation and vibration reduction of a mainboard, in particular to a compact vibration reduction and heat dissipation device of the mainboard.
Background
The motherboard is generally a rectangular circuit board, on which many important circuit systems, such as BIOS chips, I/O control chips, expansion slots, and so on, are mounted. For field carrying tools, very complex electronic systems are often equipped; because the field condition is abominable, the vibration of carrying tool is very big, and electronic system often bears the work load of heavy load moreover, causes the vibration of mainboard and temperature ratio higher, in order to guarantee that the mainboard is reliable and stable work, need set up damping heat radiation structure. Some existing mainboards are also provided with vibration reduction and heat dissipation devices, but the vibration reduction and heat dissipation devices generally have the problems of large structure and large occupied space; for a field carrying tool, on the premise of meeting the requirements of vibration reduction and heat dissipation, a vibration reduction and heat dissipation structure is pursued to be as small as possible, and the occupied space is pursued to be as small as possible, which is very important for a high-precision circuit control system. Therefore, the development of a compact vibration-damping heat-dissipating device with a brand-new structure is valuable.
Disclosure of Invention
The invention aims to solve the technical problem of providing a compact vibration-damping heat-radiating device with a brand-new structure of a mainboard, aiming at the defects of huge structure and large occupied space of the vibration-damping heat-radiating device in the prior art.
The technical scheme adopted by the invention for solving the technical problems is as follows:
a compact vibration-damping heat-dissipating device for a mainboard comprises an outer seat body with an upper end opening, wherein an inner seat body for installing the mainboard is arranged in the upper end opening of the outer seat body, the outer end surface of the inner seat body is in sealing fit with the inner surface of the outer seat body, the inner seat body can slide up and down along the outer seat body, and a first space for containing cooling liquid is formed between the bottom of the outer seat body and the bottom of the inner seat body;
a cylinder body is arranged on the outer side of the bottom of the outer seat body, a piston capable of sliding up and down is arranged in the cylinder body, a connecting rod is fixedly connected to the piston, the connecting rod penetrates through the bottom of the outer seat body and is fixedly connected with the inner seat body, the connecting rod can be movably matched with the bottom of the outer seat body in a sealing mode up and down, and a second space for containing cooling liquid is formed between the piston and the bottom of the outer seat body;
the bottom of the outer seat body is also provided with two one-way valves, the two one-way valves are used for conducting the first space and the second space into a one-way circulation passage, one of the one-way valves is used for enabling the cooling liquid in the first space to flow into the second space, and the other one-way valve is used for enabling the cooling liquid in the second space to flow into the first space.
The invention has the beneficial effects that:
through setting up first space, second space and two one-way valves, make the coolant liquid can one-way circulation flow between first space and second space. When the cooling device works, the external disturbance source causes the vibration of the main plate, so that the inner seat body slides up and down along the outer seat body, the cooling liquid is pressed to flow in a one-way circulation mode between the first space and the second space, the circulation flow forms a retarding force, and the vibration of the main plate is greatly reduced; in addition, the heat of mainboard passes through the coolant liquid of interior pedestal transmission first space, and the coolant liquid has guaranteed better heat dissipation through circulation flow. This scheme simple structure through the coolant liquid unidirectional cycle flow between first space and second space not only fine solution mainboard damping and radiating problem, compact structure moreover, this damping heat radiation structure's thickness is very little to occupation space is little, and this has very important effect to high-accuracy circuit control system.
On the basis of the technical scheme, the method also comprises the following preferable technical schemes:
preferably, the check valve includes an outer sleeve, a baffle, a top spring, a first connecting plug and a second connecting plug, a convex ring with an opening is provided in the outer sleeve, the first connecting plug and the second connecting plug are respectively provided at two ends of the outer sleeve, one end of the top spring is connected with the first connecting plug, the other end of the top spring is connected with the baffle, the baffle seals the opening of the convex ring under the action of the top spring, a liquid passing hole is further provided on the baffle, and the liquid passing hole is staggered with the opening of the convex ring.
Preferably, the first connecting plug is in sealed threaded connection with the outer sleeve.
Preferably, a plurality of cooling fins are arranged on the outer side of the bottom of the outer base.
Preferably, a cooling chamber is connected in series between at least one of the one-way valves and the second space.
Preferably, the cooling chamber is a flexible bag that is deformable.
Preferably, a sealing ring is arranged between the outer end surface of the inner seat body and the inner surface of the outer seat body, and a sealing ring is arranged between the connecting rod and the bottom of the outer seat body.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the present invention will be further described with reference to the accompanying drawings and embodiments, wherein the drawings in the following description are only part of the embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive efforts according to the accompanying drawings:
FIG. 1 is a schematic structural diagram of a compact vibration-damping heat dissipation apparatus according to a preferred embodiment of the present invention;
FIG. 2 is a schematic structural view of a check valve according to a preferred embodiment of the present invention;
fig. 3 is a schematic structural diagram of a compact vibration-damping heat dissipation apparatus according to another preferred embodiment of the present invention.
In the above drawings: 1. a main board; 2. an inner seat body; 3. an outer seat body; 4. a cylinder body; 5. a piston; 6. a connecting rod; 8. a second one-way valve; 9. a second conduit; 10. a first conduit; 11. a first one-way valve; 12. cooling liquid; 13. a cooling chamber; 31. a heat sink; 81. an outer sleeve; 82. a baffle plate; 83. a spring is supported; 84. a first connecting plug; 85. a second connecting plug; 811. a convex ring; 821. a liquid passing hole; 841. a first connecting pipe; 851. a second connecting pipe.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without inventive step, are within the scope of the present invention.
The first embodiment is as follows: as shown in fig. 1, a compact vibration-damping heat dissipation device for a motherboard includes an outer housing 3 with an opening at an upper end, an inner housing 2 is disposed in the opening at the upper end of the outer housing 3, and the motherboard 1 is fixed on the inner housing 2. A first space A for containing the cooling liquid 12 is formed between the bottom of the outer seat body 3 and the bottom of the inner seat body 2, the outer end face of the inner seat body 2 is in sealing fit with the inner surface of the outer seat body 3, so that the cooling liquid 12 cannot leak from the joint face, the problem of leakage can be solved at the joint face by adopting high-precision fit, and as the pressure of the cooling liquid 12 is lower, the viscosity of the cooling liquid 12 is higher, and the high-precision fit can ensure that no leakage exists at the joint face; in order to reduce the processing precision or further ensure the sealing effect, a sealing rubber ring or a plurality of layers of sealing steel rings with staggered gaps can be added at the joint surface, and the inner seat body 2 can slide up and down along the outer seat body 3.
As shown in fig. 1, a cylinder 4 is disposed at the outer side of the bottom of the outer seat 3, and the cylinder 4 and the outer seat 3 may be integrally formed or welded together. A piston 5 capable of sliding up and down is arranged in the cylinder 4, a connecting rod 6 is fixedly connected to the piston 5, the connecting rod 6 penetrates through the bottom of the outer seat body 3 and is fixedly connected with the inner seat body 2, the connecting rod 6 can be movably matched with the bottom of the outer seat body 3 up and down in a sealing manner, and a second space B for containing cooling liquid 12 is formed between the piston 5 and the bottom of the outer seat body 3. Similarly, sealing rings can be arranged between the connecting rod 6 and the outer seat body 3 and between the piston 5 and the cylinder body 4. The bottom of the outer seat body 3 is also provided with a first one-way valve 11 and a second one-way valve 8, and the first one-way valve 11 communicates the first space A with the second space B through a first conduit 10; a second one-way valve 8 communicates the first space a with the second space B via a second conduit 9. The cooling liquid 12 in the first space a flows into the second space B in one way through the first one-way valve 11, and the cooling liquid 12 in the second space B flows into the first space a in one way through the second one-way valve 8. The first check valve 11 and the second check valve 8 communicate the first space a and the second space B into a one-way circulation path.
As shown in fig. 2, the first check valve 11 and the second check valve 8 have the same structure, the second check valve 8 includes an outer sleeve 81, a baffle 82, a top spring 83, a first connecting plug 84 and a second connecting plug 85, a convex ring 811 with an opening is provided in the outer sleeve 81, the first connecting plug 84 and the second connecting plug 85 are respectively provided at both ends of the outer sleeve 81, one end of the top spring 83 is connected to the first connecting plug 84, the other end of the top spring 83 is connected to the baffle 82, the baffle 82 seals the opening of the convex ring 811 under the action of the top spring 83, a liquid passing hole 821 is further provided in the baffle 82, and the liquid passing hole 821 is staggered from the opening of the convex ring 811. The first connecting plug 84 is in a sealing threaded connection with the outer sleeve 81, so that the spring force of the spring 83 is adjustable. The first connecting plug 84 is provided with a first connecting pipe 841 for connection with a coolant conduit, and the second connecting plug 85 is provided with a second connecting pipe 851 for connection with a coolant conduit.
It can be seen from the above structure that: by providing the first space a, the second space B, and the first check valve 11 and the second check valve 8, the coolant can be made to circulate in one direction between the first space a and the second space B. When the cooling device works, an external disturbance source causes the vibration of the main board 1, so that the inner base body 2 slides up and down along the outer base body 3, the cooling liquid 12 is pressed to flow in a one-way circulation mode between the first space A and the second space B, the circulation flow forms a retarding force, and the vibration of the main board 1 is greatly reduced; in addition, the heat of the main board 1 is transferred to the cooling liquid 12 in the first space a through the inner housing 2, and the cooling liquid 12 ensures better heat dissipation through circulating flow. This scheme simple structure through coolant liquid 12 unidirectional cycle flow between first space A and second space B not only fine solution mainboard 1 damping and radiating problem, compact structure moreover, this damping heat radiation structure's thickness is very little, can accomplish 1 mainboard thickness to occupation space is little, and this has very important effect to high-precision circuit control system. In order to improve the heat dissipation effect, a plurality of heat dissipation fins 31 are disposed on the outer side of the bottom of the outer base 3.
Example two: referring to fig. 3, the other structure is the same as that of the first embodiment except that a cooling chamber 13 is added on the basis of the first embodiment, and the cooling chamber 13 is connected in series with the first conduit 10. The cooling chamber 13 is generally arranged at a position far away from the high-temperature member, and the cooling liquid 12 can obtain better heat dissipation effect when flowing through the cooling chamber 13. Meanwhile, the cooling chamber 13 is preferably a flexible soft bag that is deformable so that the cooling chamber 13 can be stuffed and fixed in irregular spaces without separately planning a space for placing the cooling chamber 13, thereby making the structure more compact.
It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.
Claims (7)
1. A compact vibration-damping heat-dissipating device for a mainboard is characterized by comprising an outer seat body with an upper end opening, wherein an inner seat body used for installing the mainboard is arranged in the upper end opening of the outer seat body, the outer end surface of the inner seat body is in sealing fit with the inner surface of the outer seat body, the inner seat body can slide up and down along the outer seat body, and a first space used for containing cooling liquid is formed between the bottom of the outer seat body and the bottom of the inner seat body;
a cylinder body is arranged on the outer side of the bottom of the outer seat body, a piston capable of sliding up and down is arranged in the cylinder body, a connecting rod is fixedly connected to the piston, the connecting rod penetrates through the bottom of the outer seat body and is fixedly connected with the inner seat body, the connecting rod can be movably matched with the bottom of the outer seat body in a sealing mode up and down, and a second space for containing cooling liquid is formed between the piston and the bottom of the outer seat body;
the bottom of the outer seat body is also provided with two one-way valves, the two one-way valves are used for conducting the first space and the second space into a one-way circulation passage, one of the one-way valves is used for enabling the cooling liquid in the first space to flow into the second space, and the other one-way valve is used for enabling the cooling liquid in the second space to flow into the first space.
2. The compact vibration damping and heat dissipating device for a motherboard as recited in claim 1, wherein the check valve comprises an outer sleeve, a baffle, a top spring, a first connecting plug and a second connecting plug, a protruding ring with an opening is disposed in the outer sleeve, the first connecting plug and the second connecting plug are disposed at two ends of the outer sleeve respectively, one end of the top spring is connected to the first connecting plug, the other end of the top spring is connected to the baffle, the baffle seals the opening of the protruding ring under the action of the top spring, the baffle is further provided with a liquid passing hole, and the liquid passing hole is staggered with the opening of the protruding ring.
3. The compact vibration damping and heat dissipating device for a main board according to claim 2, wherein the first connecting plug is in sealed threaded connection with the outer sleeve.
4. The compact vibration damping and heat dissipating device for a main board of claim 1, wherein a plurality of heat dissipating fins are disposed on the outer side of the bottom of the outer housing.
5. A compact vibration damping and heat dissipating apparatus for a main plate according to claim 1, wherein a cooling chamber is connected in series between at least one of said check valves and said second space.
6. A compact vibration damping and heat dissipating apparatus for a main board as set forth in claim 5, wherein said cooling chamber is a flexible bag.
7. The compact vibration damping and heat dissipating device for a main board of claim 1, wherein a sealing ring is disposed between the outer end surface of the inner housing and the inner surface of the outer housing, and a sealing ring is disposed between the connecting rod and the bottom of the outer housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110214345.7A CN112947721B (en) | 2021-02-25 | 2021-02-25 | Compact vibration-damping heat-radiating device of mainboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110214345.7A CN112947721B (en) | 2021-02-25 | 2021-02-25 | Compact vibration-damping heat-radiating device of mainboard |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112947721A CN112947721A (en) | 2021-06-11 |
| CN112947721B true CN112947721B (en) | 2022-08-05 |
Family
ID=76246289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110214345.7A Active CN112947721B (en) | 2021-02-25 | 2021-02-25 | Compact vibration-damping heat-radiating device of mainboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112947721B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3068892U (en) * | 1999-11-11 | 2000-05-26 | 川富 簡 | CPU heat dissipation device |
| CN102705627A (en) * | 2012-06-07 | 2012-10-03 | 长城汽车股份有限公司 | Vibration reduction device of engine cooling water pipe and vehicle |
| CN206224338U (en) * | 2016-11-30 | 2017-06-06 | 国家电网公司 | A kind of vibrationproof radiating hard disk rack for server |
| CN210119745U (en) * | 2019-03-22 | 2020-02-28 | 南京晓庄学院 | A computer built-in multifunctional water cooling plate |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4020725B2 (en) * | 2002-07-29 | 2007-12-12 | 富士通株式会社 | Electronic equipment with energy-saving cooling system |
| US7167366B2 (en) * | 2002-09-11 | 2007-01-23 | Kioan Cheon | Soft cooling jacket for electronic device |
| US9677820B2 (en) * | 2015-05-11 | 2017-06-13 | Cooler Master Co., Ltd. | Electronic device and liquid cooling heat dissipation structure thereof |
-
2021
- 2021-02-25 CN CN202110214345.7A patent/CN112947721B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3068892U (en) * | 1999-11-11 | 2000-05-26 | 川富 簡 | CPU heat dissipation device |
| CN102705627A (en) * | 2012-06-07 | 2012-10-03 | 长城汽车股份有限公司 | Vibration reduction device of engine cooling water pipe and vehicle |
| CN206224338U (en) * | 2016-11-30 | 2017-06-06 | 国家电网公司 | A kind of vibrationproof radiating hard disk rack for server |
| CN210119745U (en) * | 2019-03-22 | 2020-02-28 | 南京晓庄学院 | A computer built-in multifunctional water cooling plate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112947721A (en) | 2021-06-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11350545B2 (en) | Cold plate assembly for an electronic component | |
| US9200851B2 (en) | Pressure control unit and method facilitating single-phase heat transfer in a cooling system | |
| CN101179920B (en) | Apparatus and method for cooling heat-generating device | |
| Mahajan et al. | Cooling a microprocessor chip | |
| EP0068142B1 (en) | Gas cooled modules for electrical components | |
| US10468331B2 (en) | Heat management system | |
| US5046552A (en) | Flow-through heat transfer apparatus with movable thermal via | |
| Bahman et al. | Optimization tool for direct water cooling system of high power IGBT modules | |
| US20240314980A1 (en) | Cold plate with integrated sliding pedestal and processing system including the same | |
| Khan et al. | Review of micro and mini channels, porous heat sinks with hydrophobic surfaces for single phase fluid flow | |
| CN114340298B (en) | Radiators and electronic equipment | |
| CN105952440A (en) | Forced cooling thermal insulation cabin for underground electronic devices | |
| US4500945A (en) | Directly sealed multi-chip module | |
| CN112947721B (en) | Compact vibration-damping heat-radiating device of mainboard | |
| TWM545361U (en) | Air-cooling and liquid-cooling composite heat dissipator | |
| CN107977064B (en) | Water-cooling heat dissipation device of server and heat dissipation method thereof | |
| TWM251442U (en) | Liquid cooling apparatus | |
| CN113973470A (en) | Water cooling device and water cooling system | |
| US20070119570A1 (en) | Water-cooling heat dissipation system | |
| CN105682425A (en) | Radiating method for high-power device of logging instrument | |
| CN104133538A (en) | Zone bit liquid cooling quick mounting modular server system | |
| CN115616385B (en) | Temperature control testing system and method | |
| EP4092720A1 (en) | Heat sink | |
| CN211152554U (en) | Heat dissipation unit and heat dissipation device thereof | |
| Vogel | Liquid cooling performance for a 3-D multichip module and miniature heat sink |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |