CN112965337A - Photomask component for wafer lithography - Google Patents
Photomask component for wafer lithography Download PDFInfo
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- CN112965337A CN112965337A CN202110225862.4A CN202110225862A CN112965337A CN 112965337 A CN112965337 A CN 112965337A CN 202110225862 A CN202110225862 A CN 202110225862A CN 112965337 A CN112965337 A CN 112965337A
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- adhesion
- air
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- 238000001459 lithography Methods 0.000 title abstract description 7
- 238000001816 cooling Methods 0.000 claims abstract description 33
- 238000001179 sorption measurement Methods 0.000 claims abstract description 20
- 238000012216 screening Methods 0.000 claims abstract description 16
- 238000001259 photo etching Methods 0.000 claims description 19
- 244000208734 Pisonia aculeata Species 0.000 claims description 10
- 230000000694 effects Effects 0.000 claims description 8
- 239000000725 suspension Substances 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims 3
- 239000000428 dust Substances 0.000 abstract description 15
- 238000000034 method Methods 0.000 abstract description 13
- 239000000126 substance Substances 0.000 abstract description 9
- 239000002923 metal particle Substances 0.000 abstract description 2
- 238000009423 ventilation Methods 0.000 abstract description 2
- 230000000903 blocking effect Effects 0.000 description 11
- 230000002349 favourable effect Effects 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention discloses a photomask component for wafer lithography, which structurally comprises a fixed seat, a locking groove and a light screening device, wherein the inside of the fixed seat and the locking groove are integrally formed, the bottom surface of the light screening device is welded on the top surface of the fixed seat, when a lithography machine sucks air flow for ventilation and cooling, air can be fed and exhausted through a cooling plate, if the photomask component is used in a factory with more dust, the air flow can firstly pass through an air guide structure, an adhesion column is pushed to rotate through the impact force of the air flow in the air guide structure to enable the adhesion column to rotate rapidly so as to adhere dust substances in the air flow, the air flow can flow back again through a backflow groove to be repeatedly adhered, the air flow is decelerated in the air flow input process, an adsorption wheel is used for adsorbing metal particles in the air flow continuous input process, and the phenomenon that the dust adheres to the photomask in the cooling process is avoided, meanwhile, the inflowing air flow is gentle, and the influence of the air flow impact on the photomask is avoided.
Description
Technical Field
The invention relates to the field of wafer photoetching development, in particular to a photomask component for wafer photoetching.
Background
The photomask is a master mask made of quartz material and used in a semiconductor exposure process, light rays emitted by a photoetching machine are screened through the photomask, so that the light rays of the photoetching machine can be used for photoetching the surface of a wafer according to a required shape, different layers of photomasks are required to be used with different precisions in photoetching, the photomasks are sleeved in a photomask assembly to be fixed, in the photoetching process, a wafer in the photoetching machine is required to be firstly coated with glue and then baked at high temperature to be slightly hardened so that a solvent in the wafer cannot escape, after baking is finished, air flow is required to be pumped from the outside for cooling, the surface of the wafer is still in a clean state after baking and cooling because the wafer is subjected to hydrophobic treatment before photoetching, but if the photoetching machine is used in a factory with more floating dust, more floating dust is easily caused in the pumped air, the floating dust cannot be attached to the wafer, but the photomask is not subjected to hydrophobic treatment, so that the floating dust is easily adhered to the surface of the photomask in the process of cooling by pumping air, the screening of the photomask on light rays is influenced, and the photoetching precision is reduced.
Disclosure of Invention
In view of the above problems, the present invention provides a mask assembly for wafer lithography.
In order to achieve the purpose, the invention is realized by the following technical scheme: a light shield component for wafer lithography structurally comprises a fixed seat, a locking groove and a light screening device, wherein the inside of the fixed seat and the locking groove are integrally formed, and the bottom surface of the light screening device is welded on the top surface of the fixed seat; the light screening device comprises a light-passing board, an outer wall, a light cover, a mounting frame and a cooling plate, wherein the bottom surface of the light-passing board is fixedly connected with the top surface of the outer wall, the two ends of the light cover are fixedly connected with the outer ring of the mounting frame, the two ends of the mounting frame are fixedly connected with the inner layer of the cooling plate, the cooling plate is embedded into the inner layer of the outer wall, the cooling plate is provided with two cooling plates, and the two cooling plates are distributed on the inner.
Further, the cooling plate is including concentrating the pipe, hanging pole, adsorption wheel, air guide plate, concentrate the pipe left side and lead the air guide plate right side and put through each other and be connected through the electric welding, adsorption wheel center with hang the outer activity block of pole, hang the pole both ends and concentrate the intraductal embedment of pipe and be connected, the adsorption wheel is equipped with eight, and eight adsorption wheel gaps distribute in hanging the pole skin evenly, and the adsorption wheel skin is equipped with colluding the palpus structure that magnet made.
Furthermore, the air guide plate comprises a fixed shell, a filter cover and air guide structures, the left side of the fixed shell is connected with the right side of the filter cover in a welded mode, the left side of the air guide structures is fixedly connected with the right side of the filter cover in an embedded mode, the number of the air guide structures is four, and the four air guide structures are attached to each other and distributed on the right side of the filter cover.
Furthermore, the air guide structure comprises a guide plate, an air guide tube, a central wheel, a blocking piece and a vortex groove, wherein the bottom surface of the guide plate is fixedly connected with the outer layer of the air guide tube in an embedded mode, the inner layer of the air guide tube is movably clamped with the bottom surface of the blocking piece through the central wheel, the vortex groove and the left side of the blocking piece are integrally formed, and five blocking pieces are arranged on the outer ring of the central wheel in a star-shaped mode.
Furthermore, the guide plate comprises a supporting plate, four pressing balls, a fixed plate and a contact plate, wherein the left side of the supporting plate is connected with the right side of the contact plate through the pressing balls, the top surface of the fixed plate is fixedly connected with the bottom surface of the supporting plate, the top surface of the fixed plate is movably connected with the bottom surface of the contact plate, and the four pressing balls are uniformly distributed between the fixed plate and the contact plate.
Further, the contact plate includes plate body, water conservancy diversion piece, backward flow groove, adhesion post, plate body left side and backward flow groove be integrated into one piece, the water conservancy diversion piece right side is embedded in the plate body left side, adhesion post both ends and backward flow inslot inlayer activity block, the backward flow groove is equipped with six with the adhesion post, and six backward flow grooves and adhesion post interval distribute in the plate body left side uniformly.
Further, the adhesion post includes outer lane shell, drive block, adhesion head, props post, fixed axle, outer lane shell outer loop is connected with the drive block bottom surface is inlayed admittedly, the first embedding of adhesion is in outer lane shell outer loop, outer lane shell inner ring is through propping post and fixed axle outer loop swing joint, the adhesion head is equipped with five, and five adhesion heads are star distribution in outer lane shell outer loop.
Furthermore, the adhesion head comprises a pull-back ring, an elastic handle, a supporting rod, a sticky head and a speed reduction groove, wherein the outer ring of the pull-back ring is fixedly embedded and connected with the middle section of the elastic handle, the outer ring of the pull-back ring is connected with the bottom surface of the sticky head through the supporting rod, the outer layer of the sticky head and the speed reduction groove are integrally formed, and the sticky head is made of a gum material and has strong adsorption capacity on powdery substances.
Advantageous effects
Compared with the prior art, the invention has the following beneficial effects:
when the photoetching machine is used for drawing air flow for ventilation and cooling, air can be fed and exhausted through the cooling plate, if the photoetching machine is used in a factory with more dust, the air flow can firstly pass through the air guide structure, the adhesion column is pushed to rotate by the impact force of the air flow in the air guide structure so as to rotate rapidly and adhere dust substances in the air flow, the air flow is enabled to flow back again through the backflow groove for repeated adhesion, the air flow is decelerated in the air flow input process, and the adsorption wheel is used for adsorbing metal particles in the air flow continuous input process, so that the phenomenon that dust is adhered to a photomask in the cooling process is avoided, the inflowing air flow is enabled to be gentle, and the influence of air flow impact on the photomask work is avoided.
Drawings
FIG. 1 is a schematic three-dimensional structure of a mask assembly for wafer lithography according to the present invention.
Fig. 2 is a schematic structural diagram of a front cross section of the light screening device of the present invention.
FIG. 3 is a schematic structural view of a front cross section of a cooling plate according to the present invention.
FIG. 4 is a schematic structural view of a front cross section of the air guide plate of the present invention.
FIG. 5 is a schematic structural view in elevation section of the gas directing structure of the present invention.
FIG. 6 is a schematic structural view of a front cross section of the guide plate of the present invention.
Fig. 7 is a schematic structural diagram of a front cross section of a contact plate according to the present invention.
FIG. 8 is a schematic top cross-sectional view of an adhesive column of the present invention.
FIG. 9 is a schematic structural view of a front cross section of an adhesion head of the present invention.
In the figure: fixing seat-1, locking groove-2, light screening device-3, light transmitting plate-31, outer wall-32, light shade-33, mounting rack-34, cooling plate-35, concentration tube-351, suspension rod-352, adsorption wheel-353, air guide plate-354, fixing shell-A1, filter shade-A2, air guide structure-A3, guide plate-A31, air guide tube-A32, center wheel-A33, barrier sheet-A34, vortex groove-A35, supporting plate-B1, contact plate ball-B2, fixing plate-B3, plate-B4, plate-B41, guide block-B42, reflux groove-B43, adhesion column-B44, outer ring shell-C1, driving block-C2, adhesion head-C3, support column-C4, fixing shaft-C5, reflux column-B43, adhesion column-B44, outer ring shell-C1, driving block-C2, a pull-back ring-C31, an elastic handle-C32, a support rod-C33, a sticky head-C34 and a deceleration groove-C35.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it is obvious that the described embodiments are some, not all embodiments of the present invention, and all other embodiments obtained by those skilled in the art without creative efforts based on the embodiments of the present invention belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
The first embodiment is as follows:
referring to fig. 1-6, the embodiments of the present invention are as follows: a light shield component for wafer photoetching structurally comprises a fixed seat 1, a locking groove 2 and a light screening device 3, wherein the inside of the fixed seat 1 and the locking groove 2 are integrally formed, and the bottom surface of the light screening device 3 is welded on the top surface of the fixed seat 1; light screening ware 3 includes light-passing board 31, outer wall 32, light shield 33, mounting bracket 34, cooling plate 35, light-passing board 31 bottom surface is connected with outer wall 32 top surface is set firmly, light shield 33 both ends are connected with the outer loop of mounting bracket 34 is set firmly, mounting bracket 34 both ends are set firmly with the cooling plate 35 inlayer and are connected, cooling plate 35 imbeds in outer wall 32 inlayer, cooling plate 35 is equipped with two, and two cooling plate 35 mirror image distributions are in outer wall 32 inlayer, are favorable to making admit air and unobstructed exhaust.
Wherein, the cooling plate 35 includes concentrated pipe 351, suspension rod 352, adsorption wheel 353, air guide plate 354, concentrated pipe 351 left side and air guide plate 354 right side intercommunication and through the electric welding connection, adsorption wheel 353 center and the outer activity block of suspension rod 352, suspension rod 352 both ends and concentrated pipe 351 inlayer embedded connection, adsorption wheel 353 is equipped with eight, and eight adsorption wheel 353 gaps evenly distribute in suspension rod 352 skin, and the outer beard structure that colludes that is equipped with the magnet and makes of adsorption wheel 353 is favorable to increasing the adsorption area to the metallics.
Wherein, air guide plate 354 is including fixed shell A1, filter mantle A2, air guide structure A3, fixed shell A1 left side and filter mantle A2 right side welded connection, air guide structure A3 left side and filter mantle A2 right side are inlayed and are connected admittedly, air guide structure A3 is equipped with four, and four air guide structure A3 are laminated each other and are distributed in filter mantle A2 right side, are favorable to increasing the air input, make the cooling rate faster.
The air guide structure A3 comprises a guide plate A31, an air guide tube A32, a center wheel A33, a blocking sheet A34 and an eddy current groove A35, the bottom surface of the guide plate A31 is fixedly connected with the outer layer of the air guide tube A32 in an embedded mode, the inner layer of the air guide tube A32 is movably clamped with the bottom surface of the blocking sheet A34 through the center wheel A33, the eddy current groove A35 and the left side of the blocking sheet A34 are integrally formed, five blocking sheets A34 are arranged, and the five blocking sheets A34 are distributed on the outer ring of the center wheel A33 in a star mode, so that the blocking by the blocking sheets is facilitated, the flowing speed of air flow is reduced, and the impact force of the air flow is reduced.
The guide plate A31 includes layer board B1, pressure ball B2, fixed plate B3, contact plate B4, layer board B1 is connected on the left through pressure ball B2 and contact plate B4 right side, fixed plate B3 top surface and layer board B1 bottom surface are embedded and are connected, fixed plate B3 top surface and contact plate B4 bottom surface swing joint, pressure ball B2 is equipped with four, and four pressure ball B2 clearances evenly distribute between fixed plate B3 and contact plate B4, are favorable to evenly absorbing the impact force that the air current impact produced on contact plate B4, avoid contact plate B4 shake influence adsorption effect.
Based on the above embodiment, the specific working principle is as follows: adding enough light shield 33 in a light screening device 3 according to the photoetching precision, fixing the light shield assembly in a photoetching machine through a fixed seat 1 and a locking groove 2, in the photoetching process, drawing air flow into the light shield 33 through a cooling plate 35 of the light screening device 3 from the outside by the photoetching machine, cooling the light shield 33, wherein the air flow firstly passes through an air guide structure A3 arranged on an air guide plate 354 of the cooling plate 35 in the entering process, after entering an air guide structure A3, firstly impacts a guide plate A31 and contacts a contact plate B4, and simultaneously the contact plate is guided to move along a contact plate B4, at the moment, impact force generated by the air flow impacting the B4 is deformed and absorbed by a pressing ball B2 to keep the stability of the contact plate B4, and simultaneously, all dust substances in the air flow are adsorbed in the guiding process of the air flow passing through the contact plate B4, then the air flow continuously flows and enters an air guide tube A32, the barrier piece A34 is pushed to rotate and the air duct A32 is intermittent and smooth, kinetic energy is lost by air flow in the process of pushing the barrier piece A34, the flowing speed of the air flow is reduced, then the air flow enters the concentration tube 351, is finally adsorbed by the adsorption wheels 353 for the first time, is released on the light shield 33 and is led out from the cooling plate 35 on the other side.
Example two:
referring to fig. 7-9, the embodiment of the present invention is as follows: contact plate B4 includes plate body B41, water conservancy diversion piece B42, backward flow groove B43, adhesion post B44, plate body B41 left side and backward flow groove B43 are the integrated into one piece, water conservancy diversion piece B42 right side is embedded in plate body B41 left side, adhesion post B44 both ends and backward flow groove B43 inlayer activity block, backward flow groove B43 is equipped with six with adhesion post B44, and six backward flow grooves B43 and adhesion post B44 clearance distribute evenly in plate body B41 left side, are favorable to increasing backward flow number of times and adhesion number of times, make the air of outflow cleaner.
Wherein, the adhesion post B44 includes outer lane shell C1, drive block C2, adhesion head C3, brace C4, fixed axle C5, outer lane shell C1 outer loop is connected with drive block C2 bottom surface is embedded firmly, adhesion head C3 is embedded in outer lane shell C1 outer loop, outer lane shell C1 inner loop is through brace C4 and fixed axle C5 outer loop swing joint, adhesion head C3 is equipped with five, and five adhesion heads C3 are the star and distribute in outer lane shell C1 outer loop, are favorable to increasing the frequency of adhesion.
The adhesive head C3 comprises a pull-back ring C31, an elastic handle C32, a support rod C33, a sticky head C34 and a deceleration groove C35, the outer ring of the pull-back ring C31 is fixedly connected with the middle section of the elastic handle C32 in an embedded mode, the outer ring of the pull-back ring C31 is connected with the bottom surface of the sticky head C34 through a support rod C33, the outer layer of the sticky head C34 and the deceleration groove C35 are integrally formed, the adhesive head C34 is made of gum materials, has strong adsorption capacity on powder substances, and is favorable for adsorbing dust substances in air on the adhesive head C34 and preventing the dust substances from falling off.
Based on the above embodiment, the specific working principle is as follows: the airflow flows into the contact plate B4 and is guided to flow along the surface of the plate body B41, then the airflow is lifted by the guide block B42 and enters the backflow groove B43, the driving block C2 of the adhesion column B44 is driven by the flowing impact force of the airflow to drive the outer ring shell C1 to rotate, the adhesion head C3 extends outwards due to the centrifugal force generated by rotation and pulls the elastic handle C32, the adhesion head C34 extends outwards to be in contact with the airflow, the contact area is increased by the deceleration groove C35 and the airflow speed is reduced, the dust substances contained in the airflow are adhered to the adhesion head C34, then the airflow flows out, a part of the airflow flows back again under the action of the backflow groove B43 and is continuously filtered repeatedly, and after the airflow passes through the adhesion columns B44 and the backflow groove B43, almost all the dust substances contained in the flowing-out airflow are adhered.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (8)
1. The utility model provides a wafer is light cover subassembly for photoetching, its structure includes fixing base (1), locking groove (2), light screening ware (3), its characterized in that:
the inside of the fixed seat (1) and the locking groove (2) are integrally formed, and the bottom surface of the light screening device (3) is welded on the top surface of the fixed seat (1);
light screening ware (3) include light-passing board (31), outer wall (32), light shield (33), mounting bracket (34), cooling plate (35), light-passing board (31) bottom surface is connected with outer wall (32) top surface is set in solid, light shield (33) both ends are connected with mounting bracket (34) outer loop is set in solid, mounting bracket (34) both ends are connected with cooling plate (35) inlayer is set in solid, cooling plate (35) imbed in outer wall (32) inlayer.
2. The mask assembly of claim 1, wherein: the cooling plate (35) comprises a concentration pipe (351), a suspension rod (352), an adsorption wheel (353) and an air guide plate (354), the left side of the concentration pipe (351) is communicated with the right side of the air guide plate (354) and is connected with the right side of the air guide plate (354) through electric welding, the center of the adsorption wheel (353) is movably clamped with the outer layer of the suspension rod (352), and two ends of the suspension rod (352) are fixedly connected with the inner layer of the concentration pipe (351).
3. The mask assembly of claim 2, wherein: air guide plate (354) are including fixed shell (A1), filter mantle (A2), air guide structure (A3), fixed shell (A1) left side and filter mantle (A2) right side welded connection, air guide structure (A3) left side and filter mantle (A2) right side are embedded and are connected.
4. The mask assembly of claim 3, wherein: air guide structure (A3) includes baffle (A31), air duct (A32), centre wheel (A33), arresting piece (A34), vortex groove (A35), baffle (A31) bottom surface and air duct (A32) outer layer are embedded and are connected, air duct (A32) inlayer is through centre wheel (A33) and arresting piece (A34) bottom surface activity block, vortex groove (A35) and arresting piece (A34) left side be integrated into one piece.
5. The mask assembly of claim 4, wherein: the guide plate (A31) comprises a supporting plate (B1), pressing balls (B2), a fixing plate (B3) and a contact plate (B4), wherein the left side of the supporting plate (B1) is connected with the right side of the contact plate (B4) through the pressing balls (B2), the top surface of the fixing plate (B3) is fixedly embedded in the bottom surface of the supporting plate (B1), and the top surface of the fixing plate (B3) is movably connected with the bottom surface of the contact plate (B4).
6. The mask assembly of claim 5, wherein: contact plate (B4) is including plate body (B41), water conservancy diversion piece (B42), return-flow tank (B43), adhesion post (B44), plate body (B41) left side and return-flow tank (B43) integrated into one piece, water conservancy diversion piece (B42) right side is embedded in plate body (B41) left side, adhere post (B44) both ends and return-flow tank (B43) inlayer activity block.
7. The mask assembly of claim 6, wherein: adhere post (B44) including outer lane shell (C1), drive block (C2), adhesion head (C3), brace (C4), fixed axle (C5), outer lane shell (C1) outer loop is connected with drive block (C2) bottom surface is embedded and is fixed, adhesion head (C3) is embedded in outer lane shell (C1) outer loop, outer lane shell (C1) inner ring is through brace (C4) and fixed axle (C5) outer loop swing joint.
8. The mask assembly of claim 7, wherein: the adhesion head (C3) comprises a pull-back ring (C31), an elastic handle (C32), a support rod (C33), a sticky head (C34) and a speed reduction groove (C35), wherein the outer ring of the pull-back ring (C31) is fixedly embedded in the middle section of the elastic handle (C32), the outer ring of the pull-back ring (C31) is connected with the bottom surface of the sticky head (C34) through the support rod (C33), and the outer layer of the sticky head (C34) and the speed reduction groove (C35) are integrally formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110225862.4A CN112965337A (en) | 2021-03-01 | 2021-03-01 | Photomask component for wafer lithography |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110225862.4A CN112965337A (en) | 2021-03-01 | 2021-03-01 | Photomask component for wafer lithography |
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| Publication Number | Publication Date |
|---|---|
| CN112965337A true CN112965337A (en) | 2021-06-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110225862.4A Pending CN112965337A (en) | 2021-03-01 | 2021-03-01 | Photomask component for wafer lithography |
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| CN (1) | CN112965337A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW543791U (en) * | 2002-11-15 | 2003-07-21 | Jiun-Ji Liau | Photomask heat dissipation apparatus |
| US20120026474A1 (en) * | 2010-08-02 | 2012-02-02 | Asml Holding N.V. | Reticle Cooling in a Lithographic Apparatus |
| CN102360157A (en) * | 2011-09-28 | 2012-02-22 | 上海华力微电子有限公司 | Device for removing tiny dust and stains from photomask surface and method thereof |
| US20150241796A1 (en) * | 2012-10-31 | 2015-08-27 | Asml Holding N.V. | Reticle Cooling System In A Lithographic Apparatus |
| CN111381452A (en) * | 2018-12-29 | 2020-07-07 | 上海微电子装备（集团）股份有限公司 | Mask plate cooling device and photoetching equipment |
-
2021
- 2021-03-01 CN CN202110225862.4A patent/CN112965337A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW543791U (en) * | 2002-11-15 | 2003-07-21 | Jiun-Ji Liau | Photomask heat dissipation apparatus |
| US20120026474A1 (en) * | 2010-08-02 | 2012-02-02 | Asml Holding N.V. | Reticle Cooling in a Lithographic Apparatus |
| CN102360157A (en) * | 2011-09-28 | 2012-02-22 | 上海华力微电子有限公司 | Device for removing tiny dust and stains from photomask surface and method thereof |
| US20150241796A1 (en) * | 2012-10-31 | 2015-08-27 | Asml Holding N.V. | Reticle Cooling System In A Lithographic Apparatus |
| CN111381452A (en) * | 2018-12-29 | 2020-07-07 | 上海微电子装备（集团）股份有限公司 | Mask plate cooling device and photoetching equipment |
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Application publication date: 20210615 |
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| WD01 | Invention patent application deemed withdrawn after publication |