CN112995453B - Depth information camera module and assembling method thereof - Google Patents

Abstract

The application relates to a depth information camera module and an assembling method thereof. The depth information camera module comprises a projection module used for projecting a light signal to a measured target, and the projection module has an integrated structure; wherein the projection module comprises: a projection unit electrically connected to a base and an optical element, the projection unit being mounted to the electrically connected base, the optical element being mounted to the electrically connected base and held on a projection path of the projection unit; the receiving module is used for receiving the optical signal reflected by the measured target; and the circuit board comprises a first circuit board and a second circuit board arranged in a staggered manner with the first circuit board, the projection module is assembled and electrically connected to the first circuit board, and the receiving module is electrically connected to the second circuit board.

Description

Depth information camera module and assembling method thereof

Technical Field

The application relates to the field of depth imaging, in particular to a depth information camera module and an assembling method thereof.

Background

In recent years, with the development of optical measurement technology, the acquisition of depth information and the development of applications based on the depth information have become hot functions of intelligent terminal devices. For example, some manufacturers have configured a depth information camera module on a smart phone to realize a face recognition function of the smart phone. The depth information acquisition principle can be realized based on the principles of Flight Time, structured light or binocular measurement, wherein, in the depth information camera module, the TOF depth information camera module based on the Time of Flight (TOF) is one of the popular products.

Taking the TOF depth information camera module as an example, a typical TOF depth information camera module includes a projecting component and a receiving component, in the operation process, the projecting component projects an optical signal with a specific waveband to a measured object after being turned on, and the receiving component receives the optical signal reflected from the measured object, so as to obtain the depth information of the measured object according to the time difference or the phase difference between the emitted optical signal and the received optical signal.

However, as various types of mobile terminal devices are being miniaturized and thinned, the assembly space reserved for the depth information camera module is being compressed. Meanwhile, the terminal equipment has higher and higher requirements on the working performance of the depth information camera module, so that the heat dissipation problem of the depth information camera module is more serious. In addition, other technical problems are also found in the production, preparation, application and maintenance of the depth information camera module, for example, the radio frequency of the projection assembly interferes other electronic components, the maintenance cost and difficulty are high, and the like.

Therefore, there is a need for an improved depth information camera module to meet the current and future requirements of terminal equipment.

Disclosure of Invention

A primary object of the present application is to provide a depth information camera module and an assembling method thereof, in which a projection module and a reception module of the depth information camera module are disposed to be misaligned by a holder such that top surfaces of the projection module and the reception module are flush with each other, in such a manner that an error generated due to a difference between a projection path of the projection module and a reception path of the reception module is reduced.

Another object of the present application is to provide a depth information camera module and an assembling method thereof, in which a projection module and a receiving module of the depth information camera module are dislocated by a holder so that top surfaces of the projection module and the receiving module are flush with each other, so that the depth information camera module has a more compact structure, and is convenient to install and apply.

Another objective of the present application is to provide a depth information camera module and an assembling method thereof, wherein an electromagnetic shielding cover is disposed outside the projection module, so as to isolate the radio frequency generated by the projection module from electromagnetic interference generated by other electronic components through the shielding cover.

Another object of the present application is to provide a depth information camera module and an assembling method thereof, in which the projection module has an integrated structure so as to be easily installed and maintained in a simple replacement manner when a failure occurs.

Another objective of the present application is to provide a depth information camera module and an assembling method thereof, wherein the projection module includes an electrical connection base, a projection unit mounted on the electrical connection base and electrically connected to the electrical connection base; and the optical element is arranged on the electric connection base, wherein the electric connection base comprises an electric connection structure extending in the electric connection base, so that the heat generated by the projection unit can be dissipated by the electric connection structure to enhance the heat dissipation performance of the projection unit.

Another objective of the present application is to provide a depth information camera module and an assembling method thereof, wherein the electrical connection structure includes an electrical connection region exposed on the upper surface of the electrical connection base, and the electrical connection region has a relatively larger area size compared to the conventional manner of achieving electrical connection through a lead, so as to enhance the heat dissipation performance of the projection unit.

Another objective of the present application is to provide a depth information camera module and an assembling method thereof, wherein in a possible implementation manner of the present application, the electrical connection structure includes a bent conductive sheet, an unbent conductive sheet and a conductive column, wherein the conductive sheet can provide an electrical connection area with a larger area exposed on the upper surface of the electrical connection base, so as to enhance the heat dissipation performance of the projection unit.

Another objective of the present application is to provide a depth information camera module and an assembling method thereof, wherein in a possible implementation manner of the present application, the electrical connection structure includes a bent conductive sheet, wherein the conductive sheet has an electrical connection area exposed on the upper surface of the electrical connection base and having a larger area, so as to enhance the heat dissipation performance of the projection unit.

Other advantages and features of the present application will become apparent from the following description and may be realized by means of the instrumentalities and combinations particularly pointed out in the appended claims.

In order to realize at least one of the above-mentioned purpose or advantage, the present application provides a depth information camera module, which includes:

the projection module is used for projecting a light signal to a measured target and has an integrated structure; wherein the projection module comprises: a projection unit electrically connected to a base and an optical element, the projection unit being mounted to the electrically connected base, the optical element being mounted to the electrically connected base and held on a projection path of the projection unit;

the receiving module is used for receiving the optical signal reflected by the measured target; and

the circuit board comprises a first circuit board and a second circuit board arranged in a staggered mode with the first circuit board, the projection module is electrically connected to the first circuit board in a mode that the electric connection base is electrically connected to the first circuit board after being assembled into an independent module, and the receiving module is electrically connected to the second circuit board.

In the depth information imaging module according to the present application, the depth information imaging module further includes a holder that holds the first circuit board and the second circuit board in a misaligned state, wherein the holder includes a first holding portion, a second holding portion, and a connecting bridge that connects the first holding portion and the second holding portion, and the projection module is held by the first holding portion and the reception module is held by the second holding portion.

In the depth information camera module according to the present application, the electrical connection base includes a package body and an electrical connection structure integrally wrapped in the package body, the electrical connection structure includes at least one first electrical connection end formed on an upper surface of the package body and at least one second electrical connection end extending downward from the first electrical connection end and exposed on a lower surface of the package body, the projection unit is mounted on the upper surface of the package body and electrically connected to the first electrical connection end, and the second electrical connection end is electrically connected to the first circuit board.

In the depth information camera module according to the present application, the package includes a carrying portion integrally extending from an upper surface thereof, and the optical element is mounted on the carrying portion.

In the depth information camera module according to the present application, the electrical connection structure includes at least two conductive sheets that are independent of each other, at least a portion of the at least two conductive sheets is bent, wherein the bent conductive sheet includes a first portion, a third portion, and a second portion extending between the first portion and the third portion, at least a portion of the first portion is exposed on the upper surface of the package, at least a portion of the third portion is exposed on the lower surface of the package, a portion of the first electrical connection terminal is disposed on the portion of the first portion exposed on the upper surface of the package, and a portion of the second electrical connection terminal is disposed on the portion of the third portion exposed on the lower surface of the package.

In the depth information camera module according to the present application, the electrical connection structure further includes at least one conductive pillar, the conductive pillar is disposed on and electrically connected to the lower surface of the conductive pillar that is not bent, the conductive pillar has a predetermined height so as to extend to the lower surface of the package body, wherein at least a portion of the upper surface of the conductive pillar that is not bent is exposed on the upper surface of the package body, at least a portion of the lower surface of the conductive pillar is exposed on the lower surface of the package body, wherein the remaining portion of the first electrical connection end is disposed on the portion of the conductive pillar that is not bent that is exposed on the upper surface of the package body, and the remaining portion of the second electrical connection end is disposed on the portion of the lower surface of the conductive pillar that is exposed on the lower surface of the package body.

In the depth information camera module according to the present application, the at least two conductive sheets are all bent, each bent conductive sheet forms a first portion, a third portion, and a second portion extending between the first portion and the third portion, at least a portion of the first portion is exposed on the upper surface of the package, and at least a portion of the second portion is exposed on the lower surface of the package, wherein the first electrical connection end is disposed on the portion of the first portion exposed on the upper surface of the package, and the second electrical connection end is disposed on the portion of the third portion exposed on the lower surface of the package.

In the depth information camera module according to the present application, the height of the conductive column is consistent with the height of the second portion of the bent conductive sheet.

In the depth information camera module according to the present application, the projection module further includes a shielding cover covering the electrical connection base, wherein the shielding cover includes an optical window corresponding to the projection unit.

In the depth information camera module according to the present application, the projection module further includes at least one electronic component disposed on the first circuit board and/or the second circuit board.

In the depth information camera module according to the application, the receiving module includes: the light-sensitive chip is electrically connected with the second circuit board, the base is arranged on the second circuit board, and the light-filtering element is kept in a light-sensitive path of the light-sensitive chip; and an optical lens held in a light sensing path of the light sensing chip.

In the depth information camera module according to the application, the receiving module further comprises a reinforcing plate superposed on the lower surface of the photosensitive chip, the second circuit board is provided with an opening penetrating through the second circuit board, and the photosensitive chip is installed in the opening and supported on the reinforcing plate.

In the depth information camera module according to the present application, the reinforcing plate is made of a metal material.

In the depth information camera module according to the application, the second circuit board comprises a mounting groove formed on the upper surface of the second circuit board in a sunken mode, and the photosensitive chip is mounted in the mounting groove.

In the depth information camera module according to the present application, the projection unit is implemented as a laser projector, which includes a negative electrical terminal and at least one positive electrical terminal, and the negative electrical terminal and the at least one positive electrical terminal are electrically connected to different first electrical connection terminals, respectively.

According to another aspect of the present application, there is also provided an assembling method of a depth information camera module, including:

providing a circuit board, wherein the circuit board comprises a first circuit board, a second circuit board and a flexible connecting board for electrically connecting the first circuit board and the second circuit board;

providing a projection module with an integrated structure, wherein the projection module comprises an electric connection base, a projection unit which is mounted and electrically connected to the electric connection base, and an optical element which is kept on a projection path of the projection unit, the electric connection base comprises a packaging body and an electric connection structure which is integrally wrapped in the packaging body, the electric connection structure comprises at least one first electric connection end which is formed on the upper surface of the packaging body and at least one second electric connection end which extends downwards from the first electric connection end and is exposed out of the lower surface of the packaging body, the projection unit is mounted on the upper surface of the packaging body and is electrically connected to the first electric connection end, the packaging body comprises a bearing part which is integrally extended upwards from the upper surface of the packaging body, and the optical element is mounted on the bearing part so as to be kept on the projection path of the projection unit;

electrically connecting the projection module to the first circuit board;

electrically connecting a photosensitive chip to the second circuit board, arranging a base on the second circuit board, installing a filter element on the base, and installing an optical lens on the base to form a receiving module;

moving the first circuit board or the second circuit board so that the receiving module and the projecting module are arranged in a staggered manner; and

holding the projecting module and the receiving module in a holder such that the first circuit board and the second circuit board remain misaligned and the top surface of the receiving module is flush with the top surface of the projecting module.

In an assembly method according to the present application, holding the projection module and the reception module in a holder includes:

the first holding part is embedded in the holding frame in a clamping way; and

the receiving module is embedded in the second holding part of the holding frame in a clamping mode.

Further objects and advantages of the present application will become apparent from an understanding of the ensuing description and drawings.

These and other objects, features and advantages of the present application will become more fully apparent from the following detailed description, the accompanying drawings and the claims.

Drawings

The above and other objects, features and advantages of the present application will become more apparent by describing in more detail embodiments of the present application with reference to the attached drawings. The accompanying drawings are included to provide a further understanding of the embodiments of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. In the drawings, like reference numbers generally indicate like parts or steps.

Fig. 1 illustrates a schematic diagram of a depth information camera module according to an embodiment of the present application.

Fig. 2 illustrates a schematic diagram of a projection module of the depth information camera module according to an embodiment of the present application.

Fig. 3 illustrates a schematic diagram of a variant implementation of the projection module according to an embodiment of the application.

Fig. 4 illustrates a schematic diagram of the conductive member being bent in the modified embodiment shown in fig. 3.

Fig. 5 illustrates a schematic diagram of another variant implementation of the projection module according to an embodiment of the application.

Fig. 6 illustrates another schematic diagram of the depth information camera module according to the embodiment of the present application.

Fig. 7 illustrates a schematic diagram of a receiving module of the depth information camera module according to the embodiment of the application.

Fig. 8 is a schematic diagram illustrating a variation of the receiving module of the depth information camera module according to the embodiment of the present application

Fig. 9 is a schematic diagram illustrating an assembly process of the depth information camera module according to an embodiment of the present application.

Detailed Description

Hereinafter, example embodiments according to the present application will be described in detail with reference to the accompanying drawings. It should be understood that the described embodiments are only some embodiments of the present application and not all embodiments of the present application, and that the present application is not limited by the example embodiments described herein.

Exemplary depth information Camera Module

As shown in fig. 1, a depth camera module according to an embodiment of the present application is illustrated. Particularly, in the embodiment of the present application, the depth information camera module is a Time of flight (TOF) depth information module that operates based on a TOF rule. In specific application, the depth information camera module can be assembled on the terminal equipment so as to collect the depth information of the measured target through the depth information camera module. Illustratively, the terminal device includes, but is not limited to, a smartphone, a tablet, a laptop, a wearable device, and the like.

As shown in fig. 1, the depth information camera module according to the embodiment of the present application includes: the depth information camera module comprises a projection module 10, a receiving module 20, a circuit board 30 and a holder 40, wherein the projection module 10 and the receiving module 20 are respectively electrically connected to the circuit board 30, the projection module 10 and the receiving module 20 are arranged in a staggered manner through the holder 40, so that the top surfaces of the projection module 10 and the receiving module 20 are flush with each other, and the depth information camera module has a more compact structure and is convenient to install and use. In operation, the projection module 10 is activated to generate an optical signal with a predetermined wavelength to a target, and the receiving module 20 is configured to receive the optical signal reflected by the target, so as to measure a depth of the target by measuring a time interval t from transmission to reception (often referred to as a pulse ranging method) or a phase generated by moving the optical signal to and from the target once (often referred to as a phase difference ranging method). Here, the top surfaces of the projection module 10 and the reception module 20 are flush with each other, indicating that a height difference between the top surfaces of the projection module 10 and the reception module 20 is within a preset range, not only indicating that there is no height difference between the top surfaces of the projection module 10 and the reception module 20.

As shown in fig. 1, the holder 40 according to the embodiment of the present application includes a first holding portion 41, a second holding portion 42, and a connecting bridge 43 connecting the first holding portion 41 and the second holding portion 42, wherein the projection module 10 is held at the second holding portion 41 and the reception module 20 is held at the second holding portion 42, in such a manner that the projection module 10 and the reception module 20 are disposed with a shift so that top surfaces of the projection module 10 and the reception module 20 are flush with each other. Those skilled in the art will appreciate that the receiving module and the projecting module of the conventional TOF depth information camera module have different height dimensions, and more specifically, the size of the projecting module is much smaller than the size (especially, the height dimension) of the receiving module. Accordingly, in the embodiment of the present application, the retainer 40 is preformed (or bent after completion of the preforming) into a specific shape and structure such that the first holding portion 41 and the second holding portion 42 are formed at different height positions, and the difference between the upper end surfaces of the first holding portion 41 and the second holding portion 42 is within a preset range. In this way, the relative positional relationship between the top surfaces of the projection module and the reception module is effectively restricted and regulated by the relative positional relationship between the first holding portion 41 and the second holding portion 42 of the holder 40, so that the top surfaces of the projection module 10 and the reception module 20 can be flush with each other after the projection module is mounted to the first holding portion 41 and the reception module is mounted to the second holding portion 42. It should be understood that when the top surfaces of the projection module 10 and the reception module 20 are flush with each other, errors due to the difference between the projection path of the projection module 10 and the reception path of the reception module 20 can be effectively reduced.

In one possible implementation, the retainer 40 is made of a metal material having relatively good flexibility and ductility, wherein the first retaining portion 41 includes a first mounting shell having a first opening, and the second retaining portion 42 includes a second mounting shell having a second opening. Accordingly, the projection module is embedded in the first opening of the first mounting housing, and the receiving module is embedded in the second opening of the second mounting housing. Here, "snap-fit" means to be fitted and engaged. Of course, it should be understood by those skilled in the art that in other embodiments of the present application, the holder 40 may be made of other materials, such as plastic materials, and the like, and the present application is not limited thereto; also, the projection module and the receiving module may be held by the first holding portion 41 and the second holding portion 42 of the holder 40 in other manners, for example, by support, clamping, and the like, which is not limited to the present application.

As shown in fig. 1, the circuit board according to the embodiment of the present application includes a first circuit board 31, a second circuit board 32, and a flexible connection board 33 electrically connecting the first circuit board 31 and the second circuit board 32, wherein the projection module is electrically connected to the first circuit board 31, and the receiving module is electrically connected to the second circuit board 32. As shown in fig. 1, in the embodiment of the present application, the first circuit board 31 and the second circuit board 32 are also arranged by the holder 40 in a staggered manner, that is, a certain height difference is formed between the upper surfaces of the first circuit board 31 and the second circuit board 32. It should be understood that the height difference between the first circuit board 31 and the second circuit board 32 can control the height difference between the upper surfaces of the projection module 10 and the reception module 20 within a reasonable range to reduce errors due to the difference between the projection optical path of the projection module 10 and the reception path of the reception module 20. In a specific implementation, the first circuit board 31 and/or the second circuit board 32 may be implemented as a PCB board, a ceramic substrate, or the like, and the type of the first circuit board 31 and the second circuit board 32 is not limited in this application.

In one possible implementation, in accordance with the projection module 10, the first circuit board 31 is also fitted into the first holding portion 41 of the holder 40, in such a way as to reinforce the bonding strength of the projection module 10 to the first holding portion 41. It is also possible that the first circuit board 31 may be disposed in a floating manner, i.e., there is no engagement relationship between the first circuit board 31 and the first holding portion 41. Accordingly, in one possible embodiment, in accordance with the receiving module 20, the second circuit board 32 is also fitted into the second holding portion 42 of the holder 40, in such a way that the bonding strength of the receiving module 20 to the second holding portion 42 is increased. It is also possible that the second circuit board 32 can be arranged in a floating manner, i.e. there is no coupling relationship between the second circuit board 32 and the second holding portion 42. That is, the relationship between the first circuit board 31 and the second circuit board 32 and the holder 40 is not limited to the present application.

Further, fig. 2 illustrates a schematic diagram of a projection module of the depth information camera module according to an embodiment of the present application, and the projection module 10 according to an embodiment of the present application has an integrated structure. Specifically, as shown in fig. 2, the projection module 10 according to the embodiment of the present application includes a projection unit 11 for projecting an optical signal, an optical element 12 held on a projection path of the projection unit 11, and an electrical connection base 14 mounted and electrically connected to the second circuit board 32, wherein the projection unit 11 is mounted and electrically connected to the electrical connection base 14. It should be understood that the second circuit board 32 can provide electrical energy for activating the projection unit 11 through the electrical connection base 14, so that, after being turned on, the projection unit 11 generates an optical signal with a predetermined wavelength, which is further modulated by the optical element 12 before being projected to the target to be measured.

More specifically, in the embodiment of the present application, the projection unit 11 may be implemented as a Laser projector, such as a VCSEL (Vertical Cavity Surface Emitting Laser), a Vertical Cavity Surface Emitting Laser, or an LED light source, or other light sources capable of projecting light signals. Also, in some specific examples, the laser projectors or LED light sources can be arranged in an array to form an array of laser projectors or LED light sources. The optical element 12 may be implemented as an optical diffraction element, which is used to reproduce and/or diffuse the optical signal generated by the projection unit 11 without changing the characteristics (e.g., waveform, wavelength, etc.) of the optical signal, but of course, in other examples of the present application, the optical element 12 may also be implemented as other types of optical elements, such as ground glass, etc., without being limited thereto.

In particular, in the embodiment of the present application, the electrical connection base 14 has a special structural configuration, so that the projection module 10 has an integral miniaturized size and has superior heat dissipation performance. Specifically, as shown in fig. 2, the electrical connection base 14 includes a package body 141 and an electrical connection structure 142 wrapped in the package body 141, and the electrical connection structure 142 includes at least one first electrical connection terminal 1421 formed on an upper surface of the package body 141 and at least one second electrical connection terminal 1422 extending downward from the first electrical connection terminal 1421 and exposed on a lower surface of the package body 141 (that is, in the embodiment of the present application, upper and lower surfaces of the electrical connection base 14 are electrical connection surfaces provided with electrical connection ports). Accordingly, when the projection unit 11 is mounted on the upper surface of the electrical connection base 14, the projection unit 11 can be electrically connected to the upper surface of the electrical connection base 14 in such a manner that the first electrical connection terminal 1421 is electrically connected, and, when the projection module 10 is mounted on the circuit board 30 of the depth information camera module, the projection module 10 can be electrically connected to the circuit board 30 in such a manner that the second electrical connection terminal 1422 of the electrical connection base 14 is electrically connected to the second circuit board 32 of the circuit board 30, in such a manner that the electrical conduction between the projection unit 11 and the circuit board 30 is achieved.

Hereinafter, a circuit configuration of the electrical connection structure 142 of the embodiment of the present application will be described by taking as an example that the projection unit 11 is implemented as a VCSEL laser projector. Those skilled in the art will appreciate that a VCSEL laser projector includes a negative electrical terminal disposed on a lower surface thereof and at least one positive electrical terminal disposed on an upper surface thereof, wherein the number of positive electrical terminals depends on the power requirements of the VCSEL laser projector (the specific relationship is positive, i.e., the number of positive electrical terminals increases as the power requirements of the VCSEL laser projector increases).

Correspondingly to the electrical connection requirement of the VCSEL laser projector, in the embodiment of the present application, the electrical connection structure 142 includes at least two independent conductive members 1423, the conductive members 1423 extend into the package 141, and at least a portion of an upper end surface of the conductive member 1423 is exposed on the upper surface of the package 141, and at least a portion of a lower end surface of the conductive member 1423 is exposed on the lower surface of the package 141, wherein the first electrical connection terminal 1421 is disposed on the portion of the upper end surface of the conductive member exposed on the upper surface of the package 141, and the second electrical connection terminal 1422 is disposed on the portion of the lower end surface of the conductive member 1423 exposed on the lower surface of the package 141.

Accordingly, when the VCSEL laser is mounted and electrically connected to the electrical connection base 14, the negative terminal of the VCSEL laser is electrically connected to one of the first electrical connection terminals 1421, and further, the positive terminal of the VCSEL is electrically connected to the other first electrical connection terminals 1421 by wire bonding. It is worth mentioning that for VCSEL laser projectors, the positive electrical terminal wire bonding method includes two ways: one is single-sided wire bonding, and the other is double-sided wire bonding, which is different in that: when the positive electric terminal of the VCSEL laser projector is arranged on two sides of the upper surface of the VCSEL laser projector, double-side routing is adopted, and when the positive electric terminal of the VCSEL laser projector is arranged on one side of the upper surface of the VCSEL laser projector, single-side routing is adopted.

In the embodiment of the present application, the conductive member 1423 has a pillar structure, that is, the conductive member 1423 is implemented as a conductive pillar (e.g., a copper pillar). It should be understood that, compared to the conventional wire-bonding method, at least a portion of the upper end surface of the conductive member 1423 exposed on the upper surface of the package body 141 has a relatively larger area size, so that a larger heat dissipation area can be provided for the projection unit 11 to enhance the heat dissipation performance of the projection unit 11. Further, compared to the conventional lead wire, the pillar of the conductive member 1423 and the lower end surface of the conductive member 1423 have relatively larger sizes, and it should be understood by those skilled in the art that when the projection unit 11 is electrically connected to the upper surface of the electrical connection base 14, the upper end surface of the conductive member 1423, the pillar of the conductive member 1423 and the lower end surface of the conductive member 1423 form a heat dissipation channel of the projection unit 11, which can dissipate heat generated by the projection unit 11 to the second circuit board 32 and further to the outside along the bent upper end surface, pillar and lower end surface of the conductive member 1423, so that when the upper end surface of the conductive member 1423, the pillar of the conductive member 1423 and the lower end surface of the conductive member 1423 have relatively larger sizes, the heat dissipation performance of the formed heat dissipation channel is enhanced.

In order to further enhance the heat dissipation performance, in some specific examples of the embodiments of the present application, a heat dissipation plate (e.g., a metal plate) may be further attached to a lower surface of the second circuit board 32, so that heat can be transferred to the outside through the heat dissipation plate. Alternatively, the second circuit board 32 is provided with heat dissipation holes to enhance the heat dissipation performance of the second circuit board 32.

In a specific example of the embodiment of the present application, the conductive member 1423 may be implemented as a conductive member having a sheet structure made of a metal material, a metal and metal alloy material, a non-metal conductive material, or a non-metal and metal alloy material. Of course, it should be understood by those skilled in the art that, in the implementation, the specific material of the conductive component is not limited in the present application, and it only needs to have a certain conductive performance and a better heat dissipation performance.

Fig. 3 illustrates a schematic diagram of a variant implementation of the projection module according to an embodiment of the application. As shown in fig. 3, in this modified embodiment, the conductive member 1423 includes at least two conductive sheets having a sheet structure, wherein at least a portion of the conductive sheet 1423A of the at least two conductive sheets 1423A is bent, and the bent conductive sheet 1423A includes a first portion 1424A, a third portion 1426A, and a second portion 1425A extending between the first portion 1424A and the third portion 1426A. As shown in fig. 3, in the modified embodiment, after the bent conductive sheet 1423A is covered by the package 141, at least a portion of the first portion 1424A of the bent conductive sheet 1423A is exposed on the upper surface of the package 141, and at least a portion of the third portion 1426A is exposed on the lower surface of the package 141, wherein a portion of the first electrical connection terminal 1421 is disposed on the portion of the first portion 1424A exposed on the upper surface of the package 141, and a portion of the second electrical connection terminal 1422 is disposed on the portion of the second portion 1425A exposed on the lower surface of the package 141.

Further, in this modified embodiment, a part of the at least two conductive sheets 1423A is bent, and another part of the at least two conductive sheets 1423A is not bent. Correspondingly, the conductive member 1423 further includes at least one conductive pillar 1427A, the conductive pillar 1427 is disposed on and electrically connected to the lower surface of the conductive sheet 1423A that is not bent, and the conductive pillar 1427A has a predetermined height so as to extend to the lower surface of the package body 141. As shown in fig. 3, in the modified embodiment, at least a portion of the upper surface of the conductive sheet 1423A that is not bent is exposed on the upper surface of the package 141, at least a portion of the lower surface of the conductive post 1427A is exposed on the lower surface of the package 141, the rest of the first electrical connection terminal 1421 is disposed on the portion of the conductive sheet 1423A that is not bent and exposed on the upper surface of the package 141, and the rest of the second electrical connection terminal 1422 is disposed on the portion of the lower surface of the conductive post 1427A and exposed on the lower surface of the package 141.

Correspondingly, when the VCSEL laser is mounted and electrically connected to the electrical connection base, the negative terminal of the VCSEL laser is electrically connected to one of the first electrical connection terminals 1421, and further, the positive terminal of the VCSEL is electrically connected to the other first electrical connection terminals 1421 by wire bonding. It is worth mentioning that for VCSEL laser projectors, the positive electrical terminal wire bonding method includes two ways: one is single-sided wire bonding, and the other is double-sided wire bonding, which is different in that: when the positive electric terminal of the VCSEL laser projector is arranged on two sides of the upper surface of the VCSEL laser projector, double-side routing is adopted, and when the positive electric terminal of the VCSEL laser projector is arranged on one side of the upper surface of the VCSEL laser projector, single-side routing is adopted.

Fig. 4 illustrates a schematic diagram in which the conductive sheet is bent in this modified embodiment. As shown in fig. 4, the conductive sheet 1423A that is not folded has a "sheet-like" structure having a thin thickness dimension and a certain width dimension, and the width dimensionMuch larger than the thickness dimension. Accordingly, after being bent, the conductive sheet 1423A has three parts: a first portion 1424A, a second portion 1425A extending downwardly and perpendicularly from the first portion 1424A, and a third portion 1426A extending both laterally and from the second portion 1425A. Preferably, in this variant embodiment, said first portion 1424A is parallel to said third portion 1426A, and said second portion 1425A is perpendicular to said first portion 1424A and said third portion 1426A. More preferably, in this modified embodiment, the first portion 1424A, the second portion 1425A, and the third portion 1426A of the conductive sheet 1423A that is bent have a "Z" shape. Of course, in other examples of this modified embodiment, the first part 1424A, the second part 1425A, and the third part 1426A of the conductive sheet 1423A that is bent may also be formed'

Or>

The conductive sheet 1423A can be bent in other manners to form other shapes, for example, the second portion 1425A extends obliquely between the first portion 1424A and the third portion 1426A, which is not limited in this application.

It should be understood that, compared to the conventional wire-bonding method, the first portion 1424A exposed on the upper surface of the package body 141 has a relatively larger area size, so as to provide a larger heat dissipation area for the projection unit 11, thereby enhancing the heat dissipation performance of the projection unit 11. Further, compared to the conventional lead wire, the second part 1425A and the third part 1426A also have relatively larger sizes, and it should be understood by those skilled in the art that when the projection unit 11 is electrically connected to the upper surface of the electrical connection base 14, the first part 1424A, the second part 1425A, and the third part 1426A of the conductive sheet 1423A that are bent form a heat dissipation channel, which can dissipate heat generated by the projection unit 11 to the outside along the first part 1424A, the second part 1425A, and the third part 1426A of the conductive sheet 1423A that are bent, so that when the first part 1424A, the second part 1425A, and the third part 1426A have relatively larger sizes, the heat dissipation performance of the heat dissipation channel formed thereby is enhanced.

For the conducting sheet 1423A that is not bent, it only has a first electrical connection terminal 1421 exposed on the upper surface of the electrical connection base 14, and in order to form a complete circuit, the conducting column 1427A is disposed on the lower surface thereof, so as to form a second electrical connection terminal 1422 conducted to the first electrical connection terminal 1421 on the lower surface of the electrical connection base 14 through the conducting column 1427A. Preferably, in this modified embodiment, the height of the conductive pillar 1427A is consistent with the height of the second portion 1425 in the conductive sheet 1423A that is bent. It should be understood that, compared to the wire-bonding method, the conductive sheet 1423A exposed on the upper surface of the package body 141 without being bent has a relatively larger area size, so as to provide a larger heat dissipation area for the projection unit 11, thereby enhancing the heat dissipation performance of the projection unit 11. Further, the conductive posts 1427 also have relatively larger dimensions than conventional leads. It should be understood by those skilled in the art that when the projection unit 11 is electrically connected to the upper surface of the electrical connection base 14, the conductive sheet 1423A and the conductive column 1427 which are not bent form a heat dissipation channel, which can dissipate heat generated by the projection unit 11 to the outside along the conductive sheet 1423A and the conductive column 1427 which are not bent, so that the heat dissipation performance of the heat dissipation channel formed finally is enhanced.

It is noted that, in this modified embodiment, the conductive sheet 1423A may be implemented as a conductive sheet 1423A having a sheet structure made of a metal material, a metal and metal alloy material, a non-metal conductive material, a non-metal and metal alloy material, for example, the conductive sheet 1423A may be implemented as a copper sheet. Of course, it should be understood by those skilled in the art that in the present embodiment, the material of the conductive sheet 1423A is not limited to the specific material, and it only needs to have a certain conductive performance and a better heat dissipation performance.

Fig. 5 illustrates a schematic diagram of another variant implementation of the projection module according to an embodiment of the application. As shown in fig. 5, in this modified embodiment, as shown in fig. 3, in this modified embodiment, the conductive member 1423 includes at least two conductive sheets 1423A having a sheet structure, wherein all of the at least two conductive sheets 1423A are bent. Each of the bent conductive sheets 1423A forms a first portion 1424A, a third portion 1426A, and a second portion 1425A extending between the first portion 1424A and the third portion 1426A, wherein at least a portion of the first portion 1424A is exposed on the upper surface of the package 141, and at least a portion of the second portion 1425A is exposed on the lower surface of the package 141, wherein the first electrical connection terminal 1421 is disposed on the portion of the first portion 1424A exposed on the upper surface of the package 141, and the second electrical connection terminal 1422 is disposed on the portion of the third portion 1426 exposed on the lower surface of the package 141. That is, in this modified embodiment, the electrical connection structure 142 for conducting the projection unit 11 is formed entirely by the conductive sheet 1423A that is bent. Accordingly, when the VCSEL laser projector is mounted on the upper surface of the electrical connection base 14, the negative electrical terminal of the VCSEL laser projector is electrically connected to the electrical connection base 14 in direct contact with the first electrical connection terminal 1421 exposed on the upper surface of the electrical connection base 14, and the positive electrical terminal of the VCSEL laser projector is electrically connected to the other first electrical connection terminals 1421 exposed on the upper surface of the electrical connection base 14 (except for the first electrical connection terminal 1421 in contact with the negative electrical terminal of the VCSEL laser projector) through a wire (e.g., gold wire), thereby achieving electrical connection between the VCSEL laser projector and the electrical connection base 14.

In the above, the electrical connection structure based on the embodiment and its modified embodiments of the present application is explained. It should be understood that, although the projection unit is exemplified as the VCSEL laser projector, those skilled in the art will understand that the electrical connection structure of the embodiments of the present application is also applicable to other types of projection units, and is not limited thereto.

Further, as shown in fig. 3, in the embodiment of the present application, the electrical connection base 14 further includes a carrier bracket 140 formed on an upper surface of the package body 141, and the optical element 12 is mounted on the carrier bracket 140, so that the optical element 12 is held in the projection path of the projection unit 11. Preferably, in the embodiment of the present application, the carrier 140 is integrally formed on the upper surface of the package body 141, that is, preferably, the carrier 140 and the package body 141 have an integral structure, so that the projection module 10 has an integral structure. It will be appreciated that when the projection module 10 is of unitary construction, it is more convenient to install and can be repaired in a simple replacement to reduce costs in the event of a failure.

In a specific implementation, the package body 141 and the carrier bracket 140 may be integrally formed by a molding process or other integrally forming process. It should be noted that, in other examples of the present application, the carrier 140 and the package body 141 may be provided as a separate structure, that is, the carrier 140 is pre-molded and mounted on the upper surface of the package body 141, which is not limited by the present application.

It should be noted that, in the embodiment of the present application, the projection module 10 further includes at least one other electronic component 13, for example, an active component and/or a passive component such as a photodiode, a driving chip, a capacitor, a resistor, and the like, where the at least one electronic component 13 is disposed on the first circuit board 31 and/or the second circuit board 32. Preferably, most of the at least one electronic component 13 is disposed on the first circuit board 31, as shown in fig. 6. In particular, in some specific examples, the driving chip in the at least one electronic component 13 may be disposed on the second circuit board 32, so that the driving chip can be closer to the projection unit 11, and the waveform projected by the projection unit 11 is more desirable. It should be noted that the position of the electronic component 13 is not limited to the present invention, and for example, a part of the electronic component may be disposed on the surface of the electrical connection base 14. Preferably, the active devices, the passive devices and the projection module 10 are fixed to the second circuit board 32 by using an SMT process, that is, the electrical connection base 14 of the projection module 10 and the second circuit board 32 can be fixed by using an SMT process, and the projection unit 11 is conducted with the second circuit board 32 through the electrical connection base 14.

Further, as shown in fig. 7, the receiving module 20 according to the embodiment of the present application includes a photosensitive chip 21 electrically connected to the second circuit board 32, a base 23 disposed on the second circuit board 32, a filter element 22 retained in a photosensitive path of the photosensitive chip 21, and an optical lens 24 retained in the photosensitive path of the photosensitive chip 21, where the photosensitive chip 21 is configured to receive the laser reflected from the target to be measured and then generate a sensing signal, so as to achieve depth information collection. The optical filter 22 and the optical lens 24 are respectively maintained in a photosensitive path of the photosensitive chip 21, wherein the optical lens 24 is used for collecting reflected laser from a target to be measured, and the optical filter 22 is used for filtering stray laser, so that only laser with a preset wavelength can pass through the optical filter 22 and reach the photosensitive element.

In a specific implementation, the receiving module 20 may be implemented by a COB (Chip on Board) process, or may be integrally formed by an MOB (Molding on Board) or MOC (Molding on Chip) process, which is not limited in this application.

In particular, in the embodiment of the present application, the second circuit board 32 has an opening 320 penetrating therethrough, and the receiving module 20 further includes a reinforcing plate 25 stacked on the lower surface of the photosensitive chip 21, wherein the photosensitive chip 21 is mounted in the opening 320 and supported by the reinforcing plate 25, in such a way that the overall height dimension of the receiving module 20 is reduced. Preferably, the reinforcing plate 25 is made of a material having a high thermal conductivity, such as a metal material, so as to reinforce the second circuit board 32 while enhancing the heat dissipation performance of the photosensitive chip 21.

It should be noted that, by disposing the photosensitive chip 21 in the opening 320 of the second circuit board 32, the overall height of the receiving module 20 can be reduced while the requirement of optical back focus between the photosensitive chip 21 and the optical lens 24 is satisfied. In addition, in the depth information camera module, since the size (particularly, the height) of the receiving module 20 is much larger than that of the projecting module 10, the size of the receiving module 20 can be reduced, and the size of the projecting module 10 can be reduced.

Fig. 8 is a schematic diagram illustrating a modified implementation of the receiving module of the depth information camera module according to an embodiment of the present application. As shown in fig. 8, in this modified embodiment, the second circuit board 32 includes a mounting groove 320A concavely formed on an upper surface thereof, and the photosensitive chip 21 is mounted to the mounting groove 320A. It should be understood that, by installing the photosensitive chip 21 in the installation groove 320A, the space occupied by the photosensitive chip 21 can be reduced while ensuring the requirement of optical back focus between the photosensitive chip 21 and the optical lens 24, so as to reduce the overall height of the receiving module 20. Moreover, since the mounting groove 320A does not penetrate through the second circuit board 32, the strength of the second circuit board 32 is not greatly reduced, and thus the thickness of the reinforcing plate 25 can be reduced.

In summary, the depth information camera module according to the embodiment of the present application is clarified, which has at least the following advantages.

First, the projection module and the reception module of the depth information camera module are disposed with a holder being misaligned such that top surfaces of the projection module and the reception module are flush with each other, in such a manner that an error generated due to a difference between a projection path of the projection module and a reception path of the reception module is reduced.

Secondly, the projection module and the receiving module of the depth information camera module are arranged in a staggered manner through the holder, so that the top surfaces of the projection module and the receiving module are flush with each other, and the depth information camera module has a more compact structure and is convenient to install and use.

And thirdly, an electromagnetic shielding cover is arranged outside the projection module so as to isolate the radio frequency generated by the projection module from other electronic components and generate electromagnetic interference through the shielding cover.

Again, the projection module has a unitary construction to facilitate installation and maintenance in the event of a failure by simple replacement.

Further, when the depth information camera module is assembled, the projection module is of an integrated structure, so that the projection module can be a finished product which is assembled and tested before assembly, and the projection module can be arranged on the first circuit board. In the conventional depth information camera module, the projection unit, the optical element and the like are required to be sequentially assembled on the second circuit board in the assembling process, and the self precision and the mutual matching precision of each component are required to be ensured in the assembling process.

Thirdly, the projection module comprises an electric connection base and a projection unit which is mounted and electrically connected to the electric connection base; and the optical element is arranged on the electric connection base, wherein the electric connection base comprises an electric connection structure extending in the electric connection base, so that the heat generated by the projection unit can be dissipated by the electric connection structure to enhance the heat dissipation performance of the projection unit.

And the electrical connection structure comprises an electrical connection area exposed on the upper surface of the electrical connection base, and compared with the existing mode of realizing electrical connection through a lead, the electrical connection area has a relatively larger area size so as to enhance the heat dissipation performance of the projection unit.

In a possible implementation manner of the present application, the electrical connection structure includes a bent conductive sheet, an unbent conductive sheet, and a conductive pillar, where the conductive sheet can provide an electrical connection area with a larger area exposed on the upper surface of the electrical connection base, so as to enhance the heat dissipation performance of the projection unit.

In another possible implementation manner of the present application, the electrical connection structure includes a bent conductive sheet, wherein the conductive sheet has an electrical connection area exposed on the upper surface of the electrical connection base and having a larger area, so as to enhance the heat dissipation performance of the projection unit.

Exemplary depth Camera Module Assembly Process

As shown in fig. 9, an assembling process of a depth information camera module according to an embodiment of the present application is explained, wherein the preparing process as illustrated in fig. 9 exemplifies assembling of the depth information camera module as illustrated in fig. 1.

As shown in fig. 9, the assembling process first includes: providing a circuit board 30, wherein the circuit board comprises a first circuit board 31, a second circuit board 32 and a flexible connecting board 33 electrically connecting the first circuit board 31 and the second circuit board 32;

next, providing a projection module 10 having an integrated structure, where the projection module 10 includes an electrical connection base 14, a projection unit 11 mounted on and electrically connected to the electrical connection base, and an optical element 12, where the electrical connection base 14 includes a package 141 and an electrical connection structure 142 integrally wrapped in the package 141, the electrical connection structure 142 includes at least one first electrical connection terminal 1421 formed on an upper surface of the package 141 and at least one second electrical connection terminal 142 extending downward from the first electrical connection terminal 1421 and exposed on a lower surface of the package 141, and the projection unit 11 is mounted on the upper surface of the package 141 and electrically connected to the first electrical connection terminal 1421; the package body 141 includes a carrying portion 140 integrally extending upward from an upper surface thereof, wherein the optical element 12 is attached to the carrying portion 140 to be held in a projection path of the projection unit 11.

It is worth mentioning that in the embodiment of the present application, the projection module 10 has a unitary structure so as to be easily installed and to be easily replaced for maintenance in case of failure.

Then, electrically connecting the projection module 10 to the first circuit board 31;

then, electrically connecting a photosensitive chip 21 to the second circuit board 32, disposing a base 23 on the second circuit board 32, mounting a filter 22 on the base 23, and mounting an optical lens 24 on the base 23 to form a receiving module 20;

next, moving the first circuit board 31 or the second circuit board 32 so that the receiving module 20 and the projecting module 10 are disposed in a misaligned state; and

then, the projection module 10 and the reception module 20 are held in a holder 40 so that the first circuit board 31 and the second circuit board 32 are held misaligned and the top surface of the reception module 20 is flush with the top surface of the projection module 10.

In particular, in the embodiment of the present application, the holding the projection module 10 and the receiving module 20 in a holder 40 includes:

a first holding portion 41 for engaging the projection module 10 with the holder 40; and

the receiving module 20 is fitted into the second holding portion 42 of the holder 40.

In summary, a process of manufacturing a depth information camera module according to an embodiment of the present application is illustrated, and the process is used for manufacturing the depth information camera module as illustrated in fig. 1. It should be understood by those skilled in the art that the assembly process described above may be finely adjusted to prepare the depth information camera module corresponding to other depth information camera modules in the modified embodiments of the present application, and details are not described herein.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the embodiments, and any variations or modifications may be made to the embodiments of the present invention without departing from the principles described.

Claims (12)

1. The utility model provides a degree of depth information module of making a video recording which characterized in that includes:

the projection module is used for projecting a light signal to a measured target and has an integrated structure; wherein the projection module comprises: a projection unit electrically connected to a base and an optical element, the projection unit being mounted to the electrically connected base, the optical element being mounted to the electrically connected base and held on a projection path of the projection unit;

the receiving module is used for receiving the optical signal reflected by the measured target; and

the circuit board comprises a first circuit board and a second circuit board arranged in a staggered mode with the first circuit board, the projection module is assembled and electrically connected to the first circuit board, and the receiving module is electrically connected to the second circuit board;

the electric connection base comprises a packaging body and an electric connection structure integrally wrapped in the packaging body, the electric connection structure comprises at least one first electric connection end formed on the upper surface of the packaging body and at least one second electric connection end extending downwards from the first electric connection end and exposed out of the lower surface of the packaging body, the projection unit is mounted on the upper surface of the packaging body and electrically connected to the first electric connection end, and the second electric connection end is electrically connected to the first circuit board;

the electrical connection structure includes at least two conductive sheets and at least one conductive pillar that are independent of each other, at least a portion of the at least two conductive sheets is bent, wherein the bent conductive sheet includes a first portion, a third portion and a second portion extending between the first portion and the third portion, at least a portion of the first portion is exposed on the upper surface of the package, at least a portion of the third portion is exposed on the lower surface of the package, a portion of the first electrical connection end is disposed on the portion of the first portion exposed on the upper surface of the package, a portion of the second electrical connection end is disposed on the portion of the third portion exposed on the lower surface of the package, the conductive pillar is disposed on and electrically connected to the lower surface of the conductive sheet that is not bent, the conductive pillar has a predetermined height to extend to the lower surface of the package, wherein at least a portion of the upper surface of the conductive sheet that is not bent is exposed on the upper surface of the package, at least a portion of the lower surface of the conductive pillar is exposed on the lower surface of the package, and the remaining portion of the first electrical connection end is disposed on the lower surface of the package that is exposed on the lower surface of the package.

2. The depth information imaging module according to claim 1, further comprising a holder that holds the first circuit board and the second circuit board in a shifted position, wherein the holder includes a first holding portion, a second holding portion, and a connecting bridge that connects the first holding portion and the second holding portion, and wherein the projection module is held by the first holding portion and the reception module is held by the second holding portion.

3. The depth information camera module of claim 1, wherein the projection module further comprises a shield covering the electrical connection base, wherein the shield comprises an optical window corresponding to the projection unit.

4. The depth information camera module according to claim 1, wherein the package includes a carrier integrally extending from an upper surface thereof, and the optical element is mounted on the carrier.

5. The depth information camera module of claim 1, wherein the projection module further comprises at least one electronic component disposed on the first circuit board and/or the second circuit board.

6. The depth information camera module of claim 2, wherein the receiving module comprises: the light sensing chip electrically connected with the second circuit board is formed on the base of the second circuit board, and the light filtering element is kept on the light sensing path of the light sensing chip; and an optical lens held in a light sensing path of the light sensing chip.

7. The depth information camera module according to claim 6, wherein the receiving module further comprises a reinforcing plate stacked on a lower surface of the photosensitive chip, the second circuit board has an opening penetrating therethrough, and the photosensitive chip is mounted in the opening and supported by the reinforcing plate.

8. The depth information camera module of claim 7, wherein the stiffener is made of a metal material.

9. The depth information camera module according to claim 6, wherein the second circuit board includes a mounting groove concavely formed on an upper surface thereof, the photosensitive chip being mounted to the mounting groove.

10. The depth information camera module of any one of claims 1 to 9, wherein the projection unit is implemented as a laser projector including a negative electric terminal and at least one positive electric terminal, the negative electric terminal and the at least one positive electric terminal being electrically connected to different ones of the first electrical connection terminals, respectively.

11. An assembling method of a depth information camera module is characterized by comprising the following steps:

providing a circuit board, wherein the circuit board comprises a first circuit board, a second circuit board and a flexible connecting board for electrically connecting the first circuit board and the second circuit board;

providing a projection module which is assembled and has an integrated structure, wherein the projection module comprises an electric connection base, a projection unit which is mounted and electrically connected to the electric connection base and an optical element which is kept on a projection path of the projection unit, the electric connection base comprises a packaging body and an electric connection structure which is integrally wrapped in the packaging body, the electric connection structure comprises at least one first electric connection end formed on the upper surface of the packaging body and at least one second electric connection end which extends downwards from the first electric connection end and is exposed out of the lower surface of the packaging body, the projection unit is mounted on the upper surface of the packaging body and is electrically connected to the first electric connection end, the packaging body comprises a bearing part which integrally extends upwards from the upper surface of the packaging body, and the optical element is mounted on the bearing part so as to be kept on the projection path of the projection unit; the electric connection base comprises a packaging body and an electric connection structure integrally wrapped in the packaging body, the electric connection structure comprises at least one first electric connection end formed on the upper surface of the packaging body and at least one second electric connection end extending downwards from the first electric connection end and exposed out of the lower surface of the packaging body, the projection unit is mounted on the upper surface of the packaging body and electrically connected to the first electric connection end, and the second electric connection end is electrically connected to the first circuit board;

the electrical connection structure includes at least two conductive sheets and at least one conductive post, which are independent from each other, at least a portion of the at least two conductive sheets is bent, wherein the bent conductive sheet includes a first portion, a third portion and a second portion extending between the first portion and the third portion, at least a portion of the first portion is exposed on the upper surface of the package body, at least a portion of the third portion is exposed on the lower surface of the package body, a portion of the first electrical connection terminal is disposed on the portion of the first portion exposed on the upper surface of the package body, a portion of the second electrical connection terminal is disposed on the portion of the third portion exposed on the lower surface of the package body, the conductive post is disposed on and electrically connected to the lower surface of the conductive sheet, the conductive post has a predetermined height to extend to the lower surface of the package body, wherein at least a portion of the upper surface of the conductive post, which is not bent, is exposed on the lower surface of the package body, and the rest of the first electrical connection terminal is disposed on the lower surface of the package body;

electrically connecting the projection module to the first circuit board in a manner that the electrical connection base is electrically connected to the first circuit board;

electrically connecting a photosensitive chip to the second circuit board, arranging a base on the second circuit board, installing a filter element on the base, and installing an optical lens on the base to form a receiving module;

moving the first circuit board or the second circuit board so that the receiving module and the projecting module are arranged in a staggered manner; and

holding the projecting module and the receiving module in a holder such that the first circuit board and the second circuit board remain misaligned and a top surface of the receiving module is flush with a top surface of the projecting module.

12. The method of assembling of claim 11, wherein holding the projecting module and the receiving module in a holder comprises:

the first holding part is embedded in the holding frame in a clamping way; and

the receiving module is embedded in the second holding part of the holding frame in a clamping mode.

Images