CN113029508B - Miniature combined pressure sensor for measuring pressure at bottom of wind tunnel model - Google Patents
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- 238000012360 testing method Methods 0.000 claims abstract description 33
- 238000009530 blood pressure measurement Methods 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 9
- 238000007789 sealing Methods 0.000 claims description 28
- 239000000565 sealant Substances 0.000 claims description 3
- 238000012937 correction Methods 0.000 abstract description 2
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 239000007789 gas Substances 0.000 description 41
- 238000013461 design Methods 0.000 description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 238000009434 installation Methods 0.000 description 7
- 238000005259 measurement Methods 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
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- 238000007599 discharging Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
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- 239000007924 injection Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
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- G01M9/00—Aerodynamic testing; Arrangements in or on wind tunnels
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- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
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Abstract
The invention discloses a miniature combined pressure sensor for measuring the bottom pressure of a wind tunnel model, which comprises a core base and cover plates connected to two sides of the core base, wherein the structure after being connected into a whole is a hexahedral cylinder; a plurality of temperature sensors are arranged on the core base along the length direction, a pressure sensor is arranged between the two temperature sensors, one side of the pressure sensor along the height direction of the core base is a reference pressure end, and the other side of the pressure sensor is a test pressure end; according to the invention, the temperature compensation resistor is externally connected in the circuit, and the real-time temperature of each pressure sensor chip measured by the temperature sensor chip adjacent to the pressure sensor chip is utilized to carry out two temperature compensation modes of fine digital temperature compensation correction on the measured value of the pressure sensor, so that the influence of environmental temperature change on the pressure measurement accuracy in the wind tunnel test process is reduced, the quick accurate requirement of the pressure measurement at the bottom of the wind tunnel test model is met, and the running efficiency and the data quality of the wind tunnel test are further improved.
Description
Technical Field
The invention belongs to the technical field of sensors, and particularly relates to a miniature combined pressure sensor for measuring bottom pressure of a model in a wind tunnel test.
Background
During wind tunnel test, the pressure change condition of a plurality of pressure measuring points at the bottom of the aircraft model along with the attack angle of the model in the wind tunnel test environment needs to be rapidly and accurately obtained. Currently, the pressure is typically measured using a plurality of independent pressure sensors. Such a measurement method has the following problems:
firstly, the space near the bottom of the model is limited, the volumes of a plurality of independent pressure sensor devices are large, and the close installation of the pressure measurement devices is difficult to realize, so that the pipeline for measuring the gas path is long, and the pressure conduction time of lower bottom pressure in a test is correspondingly prolonged. Under extreme conditions, the pressure conduction time can reach 10 seconds, and the precision of bottom pressure measurement has to be replaced by a mode of prolonging the pressure stabilization time of a test ladder, so that the precision of wind tunnel test data and the test efficiency are greatly influenced;
secondly, in wind tunnel test, especially supersonic wind tunnel test, the accuracy of the conventional pressure sensor is reduced to about 0.3% under the influence of a large wind tunnel temperature change range, and the requirement of the accuracy of measuring the bottom pressure of the wind tunnel test of the advanced aircraft cannot be met;
thirdly, the measurement of the bottom pressure of the model is mostly 4-8 pressure measuring points, a plurality of groups of complex electric cables are required to be installed and laid in a narrow supporting rod threading hole, and the fault rate of bottom pressure measuring equipment is generally high during wind tunnel test due to the influence of line winding extrusion, the influence of wind tunnel test vibration, the influence of model mechanism motion involvement and the like caused by narrow space and inconvenient operation, so that the smooth proceeding of the wind tunnel test is influenced.
Disclosure of Invention
The invention aims to solve the problems that a sensor used for measuring the bottom pressure of a model in the current wind tunnel test is large in size, cannot be installed in a close manner, pressure conduction is seriously delayed, the wind tunnel temperature is changed, so that the pressure measurement accuracy is seriously reduced, the circuit connection is complex, the failure rate is high, and the like.
The invention provides a miniature combined pressure sensor for measuring the bottom pressure of a wind tunnel model, which realizes the miniaturization of a plurality of bottom pressure sensors by integrating and combining a plurality of pressure sensor chips and temperature sensor chips, an appearance structure suitable for the installation of column-type threading holes, the optimal design of an electric gas circuit and the like, so as to facilitate the installation and laying in the support rod holes of the wind tunnel model and achieve the purposes of the pressure sensor close to the installation and shortening of the measuring gas circuit;
the temperature compensation method and the temperature compensation device have the advantages that the temperature compensation resistor is externally connected, and temperature data measured in real time by the sensor are utilized to carry out temperature drift compensation on the pressure sensor, so that the measurement accuracy of the pressure sensor in a variable temperature environment is ensured; the design of the sensor integrated electric circuit improves the scattered laying state of the electric circuits of a plurality of single pressure sensors in the past, and improves the reliability of bottom pressure measurement.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
a miniature combined pressure sensor for measuring the pressure at the bottom of wind tunnel model is composed of a core base, cover plates symmetrically connected to both sides of said core base, hexahedral cylinder with base and cover plates,
the pressure sensor comprises a core body base, a plurality of through holes, a pressure sensor chip, a temperature sensor and a temperature sensor, wherein the plurality of through holes are formed in the core body base along the length direction, the pressure sensor chip is arranged in each through hole, the pressure sensor chip is arranged in the through holes in the same direction, the reference pressure end is arranged on one side of the pressure sensor chip along the height direction of the core body base, the test pressure end is arranged on the other side of the pressure sensor chip, and the temperature sensor is arranged between two adjacent pressure sensors;
the cover plate comprises a measuring gas circuit cover plate and a reference gas circuit cover plate, a sealing groove is arranged at the position, corresponding to the pressure sensor chip, on the measuring gas circuit cover plate, after the core body base and the measuring gas circuit cover plate are covered, the testing pressure end of one pressure sensor chip is correspondingly arranged in one sealing groove, a plurality of gas circuits are arranged in the measuring gas circuit cover plate, and each sealing groove is communicated with the outside through an independent gas circuit;
an inner cavity is arranged on one surface of the reference air channel cover plate connected with the core body base, a sealing cavity is formed between the inner cavity and the end surface of the core body base, reference pressure ends of all pressure sensor chips are arranged in the sealing cavity, an air channel communicated with the inner cavity is arranged on the reference air channel cover plate, the air channel is communicated with the outside,
the sealing groove is not communicated with the sealing cavity.
In the above technical scheme, the core base is cuboid, the cover plate is a trapezoid cylinder, the measuring gas circuit cover plate is fixedly connected with the core base through a screw, and the reference gas circuit cover plate is bonded with the core base through sealant.
In the technical scheme, all the pressure sensor chips have the same voltage input, the input voltage is 3-20V constant voltage power supply, each pressure sensor chip has independent voltage signal output, and the pressure sensor chips are two-line output.
In the above technical solution, each temperature sensor chip has independent input and output lines, and the input and output of each temperature sensor chip share a set of lines.
In the above technical scheme, the wire slot is arranged on the core base, and the input and output circuits of the temperature sensor chip and the pressure sensor chip are arranged in the wire slot.
In the technical scheme, two groups of air circuits communicated with the inner cavity are symmetrically arranged on the reference air circuit cover plate along the axis, and each group of air circuits is communicated with the external atmosphere.
In the above technical solution, the temperature compensation for the pressure sensor includes the following steps:
step one: the pressure sensor chips in the same miniature combined pressure sensor are selected as far as possible from MEMS pressure sensor chips with similar performance parameters, so that uniform compensation of temperature is facilitated;
step two: setting a temperature at 25% of the compensation temperature range
Standard pressure pressurization test is carried out at three pressure points of-80%, 0% and-80% of the full range of the pressure sensor chip, and linear fitting is carried out on the added standard pressure and the output of the corresponding pressure sensor chip, so that the temperature of the pressure sensor chip is obtained>
The next order of work coefficient->
；
Step three: setting a temperature at 80% of the compensation temperature range
Standard pressure pressurization test is carried out at three pressure points of-80%, 0% and-80% of the full range of the pressure sensor chip, and linear fitting is carried out on the added standard pressure and the output voltage of the corresponding pressure sensor chip, so that the temperature of the pressure sensor chip is obtained>
The next order of work coefficient->
；
Step four: calculating the comprehensive ratio of the working coefficient of the pressure sensor chip changing along with the temperature change through the first step and the second step
：
Step five: calculating the resistance value of the compensation resistor
Wherein->
For temperature->
Total resistance between constant voltage power supply two ends of time pressure sensor chip,/->
For temperature->
The total resistance between the two ends of constant voltage power supply of the pressure sensor chip;
step six: selecting the resistance value as
The resistor with constant resistance and no temperature change is connected in series to a unified constant voltage power supply loop of the pressure sensor chip, and the constant voltage power supply voltage is adjusted to be +.>
Wherein V is the initial unified constant voltage power supply voltage of the pressure sensor chip, and the primary temperature compensation is carried out on the measured value of the pressure sensor;
step seven: selecting a plurality of temperature points in the compensation temperature range of the miniature combined pressure sensor, and respectively carrying out pressurization calibration on the sensor in each constant temperature state (the pressurization force is a plurality of pressure points in the range of the pressure sensor chip during calibration), so as to obtain output values of each pressure sensor chip and each temperature sensor chip under the conditions of a plurality of groups of constant temperatures and different pressures;
step eight: taking the average value of the measured values of two adjacent temperature sensor chips as the temperature of the pressure sensor chip between the two temperature sensor chips;
step nine: fitting the results of the step seven and the step eight to obtain a binary function relation of the output voltage of the pressure sensor chip, the chip temperature and the added calibration pressure, and performing secondary temperature compensation on the measured value of the pressure sensor.
In summary, due to the adoption of the technical scheme, the beneficial effects of the invention are as follows:
through the design of the combined sensor chip, the equipment integration level is improved, and the sensor volume is reduced; meanwhile, in the aspect of the appearance design of the sensor, the cylindrical space with the diameter phi of 2 mm-phi of 4mm is considered as the wiring space of the support rod of the wind tunnel test model, so that the miniature combined pressure sensor adopts a hexagonal cylinder design similar to a cylinder, is convenient to install in the support rod space near the bottom of the model, and greatly shortens the gas path conduction time of bottom pressure measurement; in the design of the electric circuits of the input and output of the miniature combined pressure sensor, all circuits are integrated and led out uniformly, connection and trend laying of the electric circuits are fully considered when the sensor is used, the fact that all the electric circuits are laid in a straight shape when the sensor is used in the inner cavity of the support rod is guaranteed, bending and winding of a sensor electric circuit cable are avoided to the greatest extent, and convenience and reliability of sensor installation and use are greatly improved; the external temperature compensation resistor is used for compensating and correcting the measured value of the pressure sensor in two stages by utilizing the real-time temperature of each pressure sensor chip measured by the temperature sensor chip adjacent to the pressure sensor chip, so that the influence of the environmental temperature change on the pressure measurement accuracy in the wind tunnel test process is reduced, the quick and accurate requirement of the pressure measurement at the bottom of the wind tunnel test model is met, and the running efficiency and the data quality of the wind tunnel test are further improved.
Drawings
The invention will now be described by way of example and with reference to the accompanying drawings in which:
FIG. 1 is a schematic diagram of a measurement air circuit cover plate;
FIG. 2 is a schematic structural view of a core base;
FIG. 3 is a schematic structural view of a reference gas circuit cover plate;
wherein: the gas circuit measuring device comprises a measuring gas circuit cover plate 1, a sealing groove 2, a gas circuit 3, a gas circuit steel pipe 4, a core base 5, a pressure sensor chip 6, a temperature sensor chip 7, a circuit input/output interface 8, a reference gas circuit cover plate 9 and a temperature compensation resistor 10.
Detailed Description
All of the features disclosed in this specification, or all of the steps in a method or process disclosed, may be combined in any combination, except for mutually exclusive features and/or steps.
Any feature disclosed in this specification (including any accompanying claims, abstract and drawings), may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise. That is, each feature is one example only of a generic series of equivalent or similar features, unless expressly stated otherwise.
The sensor of the embodiment mainly comprises three parts, namely a base for fixing a plurality of sensor chips, and two cover plates positioned on two sides of the base, wherein one cover plate is used for connecting the pressure measured by the sensor, and the other cover plate is used for providing reference air pressure for the sensor. The cover plate and the core body base are assembled into a whole, and then the whole structure is of a six-sided cylinder structure.
As shown in fig. 2, the core base has the following structural design:
a01, adopting a cuboid of an alloy aluminum material with the height of 13mm (height) multiplied by 3mm (width) multiplied by 50mm (length) as a base, and arranging and installing a sensor chip;
a02, uniformly arranging four through holes penetrating through the core base in a transverse straight shape on the sensor core base, wherein each through hole is internally provided with an MEMS pressure sensor chip, a temperature sensor chip is arranged between every two MEMS pressure sensor chips, and a temperature sensor chip is arranged on the outer side edge of the outermost MEMS pressure sensor chip, so that one MEMS pressure sensor chip is ensured between every two temperature sensor chips; MEMS pressure sensor chips in the same miniature combined temperature compensation type pressure sensor are selected as far as possible, and the MEMS pressure sensor chips with similar performance parameters are favorable for uniform temperature compensation;
a03, the MEMS pressure sensor chip adopts a differential pressure type measuring chip, the upper surface of the chip senses the pressure of the reference edge, and the lower surface of the chip senses the pressure of the measuring gas circuit.
A04, the upper surfaces of the four pressure sensor chips are positioned on one side of the core base connected with the reference gas path cover plate, and the lower surfaces are positioned on one side of the core base connected with the measurement gas path cover plate;
a05, the temperature sensor chip adopts a PT100 temperature sensor chip;
a06, four pressure sensor chips initially adopt unified 5V constant voltage power supply, and each pressure sensor chip adopts an independent two-wire output mode to output voltage signals;
a07, five temperature sensor chips adopt independent two-wire forms to respectively carry out 1mA constant current power supply, and simultaneously output voltage signals through the two wires;
a08, uniformly leading out the input and output circuits of all the pressure sensor chips and the temperature sensor chips from the right end of the core body base by using a miniature rectangular multi-core cable connector;
a09, processing a phi 2mm metric screw hole on each of four corners of the connecting side of the core base and the measuring gas circuit cover plate by taking the intersection point which is 2mm away from the edge as the center of a circle, and fastening and connecting the subsequent measuring gas circuit cover plate and the sensor core base.
As shown in fig. 1, the design of the micro combined temperature compensation type high-precision pressure sensor measuring gas circuit cover plate is as follows:
b01, a measuring gas circuit cover plate adopts a trapezoid column design of 13mm (lower bottom) x 6mm (upper bottom) x 4.8mm (height) x 50mm (length), and is processed by using an alloy aluminum material;
b02, processing four O-shaped sealing ring mounting grooves with phi 2.1mm and depth of 0.5mm at the inlet position of each pressure sensor chip measuring surface of the sensor core base at the lower bottom surface of the trapezoid column body, and then processing a sealing gas circuit channel with phi 0.7mm from the central position of each mounting groove to the left end surface of the measuring gas circuit cover plate respectively;
b03, sealing the air channel at the B02 and extending out of the air channel outlet of the left end face of the cover plate, correspondingly sealing and installing four ventilation steel pipes with phi 1.0mm (outer diameter) multiplied by phi 0.7mm (inner diameter) multiplied by 10mm (length), so as to facilitate the access of the bottom pressure measuring air channel;
b04, processing a phi 2mm metric screw through hole on four corners of the lower bottom surface of the trapezoid by taking the intersection point 2mm away from the edge as the center of a circle, wherein the phi 2mm metric screw through hole is used for the penetration of a compression screw when the sensor is assembled;
and B05, placing an O-shaped sealing ring with the diameter of 2.1mm (outer diameter) multiplied by the diameter of 0.7mm (inner diameter) multiplied by the thickness of 0.7mm in an O-shaped sealing ring mounting groove processed in the step B02, and ensuring that a measuring gas path introduced by a measuring gas path cover plate is conducted to the lower surface of each sensor chip in a sealing and unblocked manner through the tight fit of a compression screw and the O-shaped sealing ring.
As shown in FIG. 3, the reference air circuit cover plate design of the miniature combined pressure sensor
C01, a sensor reference gas circuit cover plate adopts a trapezoid column design of 13mm (lower bottom) ×6mm (upper bottom) ×4.8mm (height) ×50mm (length), and is processed by using an alloy aluminum material;
c02, milling a trapezoid cavity with the thickness of 10mm (lower bottom) multiplied by 4.6mm (upper bottom) multiplied by 3.6mm (height) multiplied by 46mm (length) in the cover plate according to the external shape of the cover plate, so that the reference air passage cover plate is of a hollow structure;
c03, respectively processing a sealing gas path channel with the diameter of 0.7mm at the center positions of the left end face and the right end face of the reference gas path cover plate, and connecting the sealing gas path channel with the reference side pressure or cleaning the humid gas in the cavity of the reference side;
c04, the air channel of the C03 sealing air channel extends out of the air channel outlet of the left end face and the air channel outlet of the right end face of the cover plate, and an air ventilation steel pipe 9 with phi 1.0mm (outer diameter) x phi 0.7mm (inner diameter) x 10mm (length) is arranged in a sealing mode, so that access of a reference air channel is facilitated.
Combined installation of miniature combined temperature compensation type pressure sensor
D01, fixedly mounting a measuring gas path cover plate on one side of the lower surface of the sensor chip of the core base by using a screw, and ensuring that the measuring gas path is connected and conducted with a gas path of a measuring side of the sensor in a sealing way;
d02, adhering the reference gas path cover plate on the side where the upper surface of the sensor chip of the core body base is positioned by using strong sealant, so that the reference edge pressure led in by the reference edge gas path forms a larger reference cavity in the hollow cavity of the reference gas path cover plate, and covers all the reference edges of the pressure sensor chip in the cavity;
and D03, after the installation, connecting the left and right reference side air paths with pressure measuring hoses with the length of about 2 meters respectively, slowly injecting pure nitrogen from the left reference side inlet, keeping the pressure of the nitrogen at about 50KPa, discharging moist air in the reference cavity on the right side, stopping the pressure measuring hoses on the left reference side after injecting the nitrogen for 20 seconds, stopping nitrogen injection, and keeping the inside of the reference cavity of the miniature combined pressure sensor as nitrogen components.
Two-stage temperature compensation for miniature combined pressure sensor
E01, setting the temperature to 10 ℃, placing the miniature combined pressure sensor in the temperature environment for constant temperature for 2 hours, and measuring the resistance values of the two ends of the unified constant-voltage power supply of the pressure sensor chip
And selecting three pressure points of-80%, 0 and-80% of the full range of the pressure sensor, performing standard pressure pressurization test, and performing linear fitting on the added standard pressure and the corresponding sensor output voltage to obtain a primary working coefficient of each pressure sensor chip in the miniature combined pressure sensor under the temperature condition>
；
E02, setting the temperature to 30 ℃, placing the miniature combined pressure sensor in the temperature environment to keep constant temperature for 2 hours, and measuring the resistance values of the two ends of the unified constant-voltage power supply of the pressure sensor chip
And selecting three pressure points of-80%, 0 and-80% of the full range of the pressure sensor, performing standard pressure pressurization test, and performing linear fitting on the added standard pressure and the corresponding sensor output voltage to obtain a primary working coefficient of each pressure sensor chip in the miniature combined pressure sensor under the temperature condition>
；
E03, calculating the comprehensive ratio of the working coefficient of the pressure sensor chip in the miniature combined pressure sensor to the change of the working coefficient along with the temperature
：
E04, calculating the resistance of the compensation resistor
E05, selecting the resistance value as
The precise resistor with constant resistance and no temperature change is connected in series to the unified constant voltage power supply loop of the miniature combined pressure sensor, and the constant voltage power supply voltage is modified to +.>
The primary temperature compensation of the miniature combined pressure sensor is realized. Wherein the pressure sensor chip initially unifies a constant voltage supply voltage v=5v.
E06, constant pressure
And (3) supplying power, namely selecting 5 temperature points in the compensation temperature range of the miniature combined temperature compensation type pressure sensor, respectively carrying out multi-point standard pressure calibration on the sensor in a constant temperature state at the temperature of-5 ℃,10 ℃, 20 ℃, 30 ℃ and 50 ℃, wherein the standard pressure is selected to be-90 kPa, -60kPa, -30kPa, 0kPa, 30kPa, 60kPa and 90kPa for the pressure sensor chip with the measuring range of +/-100 kPa, and the output values of the pressure sensor chip and the temperature sensor chip are obtained under 5 groups of constant temperature and different pressure conditions after calibration test. And meanwhile, taking the average value of the measured values of two adjacent temperature sensors as the temperature of the pressure sensor chip clamped between the two temperature sensor chips. According to the pressure sensor chipsThe added standard pressure Pi, the chip temperature Ti (the temperature of the ith pressure sensor chip) and the corresponding two-dimensional voltage array Ui (the output voltage matrix of the ith pressure sensor chip) output by the sensor chip are subjected to fitting calculation to obtain the binary function relation between the measured value P of the pressure sensor chip and the output Ui and the temperature Ti of the pressure sensor chip, so that the secondary temperature compensation of the ith pressure sensor chip in the miniature combined pressure sensor is completed. The high-precision measurement is realized through two-stage temperature compensation correction.
The invention is not limited to the specific embodiments described above. The invention extends to any novel one, or any novel combination, of the features disclosed in this specification, as well as to any novel one, or any novel combination, of the steps of the method or process disclosed.
Claims (7)
1. The miniature combined pressure sensor for measuring the pressure at the bottom of the wind tunnel model is used for measuring the pressure at the bottom of the wind tunnel model and is characterized in that: the sensor comprises a core base and cover plates symmetrically connected with two sides of the core base, the structure of the core base and the cover plates which are connected into a whole is a hexahedral column,
the pressure sensor comprises a core body base, a plurality of through holes, a pressure sensor chip, a temperature sensor and a temperature sensor, wherein the plurality of through holes are formed in the core body base along the length direction, the pressure sensor chip is arranged in each through hole, the pressure sensor chip is arranged in the through holes in the same direction, the reference pressure end is arranged on one side of the pressure sensor chip along the height direction of the core body base, the test pressure end is arranged on the other side of the pressure sensor chip, and the temperature sensor is arranged between two adjacent pressure sensors;
the cover plate comprises a measuring gas circuit cover plate and a reference gas circuit cover plate, a sealing groove is arranged at the position, corresponding to the pressure sensor chip, on the measuring gas circuit cover plate, after the core body base and the measuring gas circuit cover plate are covered, the testing pressure end of one pressure sensor chip is correspondingly arranged in one sealing groove, a plurality of gas circuits are arranged in the measuring gas circuit cover plate, and each sealing groove is communicated with the outside through an independent gas circuit;
an inner cavity is arranged on one surface of the reference air channel cover plate connected with the core body base, a sealing cavity is formed between the inner cavity and the end surface of the core body base, reference pressure ends of all pressure sensor chips are arranged in the sealing cavity, an air channel communicated with the inner cavity is arranged on the reference air channel cover plate, the air channel is communicated with the outside,
the sealing groove is not communicated with the sealing cavity.
2. The miniature combined pressure sensor for measuring the pressure at the bottom of a wind tunnel model according to claim 1, wherein the core base is a cuboid, the cover plate is a trapezoid cylinder, the measuring gas circuit cover plate is fixedly connected with the core base through a screw, and the reference gas circuit cover plate is bonded with the core base through sealant.
3. A miniature combined pressure sensor for measuring the pressure at the bottom of a wind tunnel model according to claim 1, characterized in that all pressure sensor chips have the same voltage input, the input voltage is 3-20V constant voltage power supply, each pressure sensor chip has independent voltage signal output, and the pressure sensor chips are two-wire output.
4. A miniature combined pressure sensor for wind tunnel model bottom pressure measurement according to claim 1, characterized in that each temperature sensor chip has independent input and output lines, the input and output of each temperature sensor chip sharing a set of lines.
5. A miniature combined pressure sensor for measuring the pressure at the bottom of a wind tunnel model according to claim 3 or 4, characterized in that a wire slot is arranged on the base of the core body, and the input and output lines of the temperature sensor chip and the pressure sensor chip are arranged in the wire slot.
6. The miniature combined pressure sensor for measuring the pressure at the bottom of the wind tunnel model according to claim 1, wherein two groups of air passages communicated with the inner cavity are symmetrically arranged on the reference air passage cover plate along the axis, and each group of air passages is communicated with the external atmosphere.
7. A miniature combined pressure sensor for measuring the pressure at the bottom of a wind tunnel model according to claim 1, characterized in that the temperature compensation of the pressure sensor comprises the following procedures:
step one: setting a temperature at 25% of the compensation temperature range
Standard pressure pressurization test is carried out at three pressure points of-80%, 0% and-80% of the full range of the pressure sensor chip, and linear fitting is carried out on the added standard pressure and the output voltage of the corresponding pressure sensor chip, so that the temperature of the pressure sensor chip is obtained>
The next order of work coefficient->
；
Step two: setting a temperature at 80% of the compensation temperature range
Standard pressure pressurization test is carried out at three pressure points of-80%, 0% and-80% of the full range of the pressure sensor chip, and linear fitting is carried out on the added standard pressure and the output voltage of the corresponding pressure sensor chip, so that the pressure sensor chip is obtained at the temperature +.>
The primary work coefficient->
；/>
Step three: calculating the comprehensive ratio of the working coefficient of the pressure sensor chip changing along with the temperature change through the first step and the second step
，
，
N is the number of the pressure sensor chips;
step four: calculating the resistance value of the compensation resistor
Wherein->
For temperature->
Total resistance between constant voltage power supply two ends of time pressure sensor chip,/->
For temperature->
The total resistance between the two ends of constant voltage power supply of the pressure sensor chip;
step five: selecting the resistance value as
The resistor with constant resistance and no temperature change is connected in series to a unified constant voltage power supply loop of the pressure sensor chip, and the constant voltage power supply voltage is adjusted to be +.>
WhereinVThe method comprises the steps of (1) initially unifying constant-voltage power supply voltage for a pressure sensor chip, and performing primary temperature compensation on a measured value of the pressure sensor;
step six: selecting a plurality of temperature points in the compensation temperature range of the miniature combined pressure sensor, and respectively carrying out pressurization calibration on the sensor in each constant temperature state to obtain output values of each pressure sensor chip and each temperature sensor chip under the conditions of a plurality of groups of constant temperatures and different pressures;
step seven: taking the average value of the measured values of two adjacent temperature sensor chips as the temperature of the pressure sensor chip between the two temperature sensor chips;
step eight: fitting the results of the step six and the step seven to obtain a binary function relation of the output voltage of the pressure sensor chip, the chip temperature and the added calibration pressure, and performing secondary temperature compensation on the measured value of the pressure sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110311702.1A CN113029508B (en) | 2021-03-24 | 2021-03-24 | Miniature combined pressure sensor for measuring pressure at bottom of wind tunnel model |
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