CN113100689A - Imaging assembly three-dimensional circuit and endoscope - Google Patents
Imaging assembly three-dimensional circuit and endoscope Download PDFInfo
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- CN113100689A CN113100689A CN202110178860.4A CN202110178860A CN113100689A CN 113100689 A CN113100689 A CN 113100689A CN 202110178860 A CN202110178860 A CN 202110178860A CN 113100689 A CN113100689 A CN 113100689A
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- mounting
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- imaging assembly
- transmission cable
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/00064—Constructional details of the endoscope body
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/00112—Connection or coupling means
- A61B1/00121—Connectors, fasteners and adapters, e.g. on the endoscope handle
- A61B1/00126—Connectors, fasteners and adapters, e.g. on the endoscope handle optical, e.g. for light supply cables
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
- A61B1/05—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances characterised by the image sensor, e.g. camera, being in the distal end portion
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- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Surgery (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Biomedical Technology (AREA)
- Optics & Photonics (AREA)
- Pathology (AREA)
- Radiology & Medical Imaging (AREA)
- Biophysics (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Heart & Thoracic Surgery (AREA)
- Medical Informatics (AREA)
- Molecular Biology (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Endoscopes (AREA)
Abstract
The invention discloses an imaging assembly three-dimensional circuit and an endoscope, comprising an integrally formed circuit structural part; the circuit structural part comprises a mounting body part and a transmission cable mounting part, wherein the transmission cable mounting part is formed at the first end of the mounting body part, an electronic element mounting area is formed on the mounting body part, a plurality of circuits are formed on the mounting body part, the plurality of circuits are distributed along the mounting body part, contact conduction parts are respectively formed at the first end and the second end of the mounting body part, and the contact conduction parts formed on the circuits at the first end of the mounting body part correspond to the transmission cable mounting part; the lines corresponding to the electronic component mounting areas form contact conduction parts in the electronic component mounting areas, respectively. This scheme is through forming the regional integral type structure of formation with the component installation and switch on each other, and the stability of circuit has wholly been improved.
Description
Technical Field
The invention relates to the technical field of endoscopes, in particular to an imaging technology in an endoscope.
Background
The endoscope tip has a camera system, a water-air system, an illumination system, a structural device and the like, and can enter the body through the natural pore canal through the insertion part for clinical diagnosis and treatment. Referring to fig. 1, the image pickup system includes an optical lens 1, an image sensor 2, a circuit module 3, an electronic component 4, a protective case 5, and a transmission cable 6.
Light reflected in the natural cavity enters the image sensor 2 through the optical lens 1, the image sensor 2 is borne on the circuit module 3, wherein the circuit module 3 is formed by splicing two FR4 circuit boards of a transverse board 31 and a vertical board 32, so that a longitudinal slender structure is realized and the optical fiber cable is assembled on a metal protection shell, and in addition, the transmission cable comprises four mutually independent transmission wires which are respectively welded on the vertical boards 32 in the circuit module.
On the premise of satisfying the internal control assembly of the protective shell 5 with a compact structure, in order to ensure the effective transmission of image signals, the welding position of the transmission cable 6 and the vertical plate 32 and the pins of the electronic element 4 need to be protected absolutely, otherwise, a circuit short circuit can occur, and the camera system is caused to fail.
As shown in fig. 2, there is shown an example of a mounting structure of a conventional camera system in an end mount. As can be seen, the hard end of the endoscope carries the imaging system 10, the illumination optical window 8, the instrument channel 9, the illumination fiber 7. The endoscope clinical application requires that the structure of the camera system is required to meet the structural space usage of the functional components contained in the hard part of the front end of the endoscope, and simultaneously meet the requirements of the hard end part of the endoscope with smaller size and the instrument channel 9 with larger size.
Accordingly, the existing imaging system configuration has the following disadvantages in the practical use process (shown in fig. 1):
(1) the circuit module 3 in the existing camera system is formed by welding the transverse plate 31 and the vertical plate 32, and errors exist in welding, so that the longitudinal linear error of the whole structure of the circuit module 3 is large, and assembly is influenced;
(2) an electronic element 4 in the existing camera system is welded on the surface of a circuit module 3, does not contain any insulation protection, and has the risk of generating short circuit with a metal protective shell 5;
(3) the transmission cable 6 in the existing camera system comprises four wires, is welded on the surface of the circuit module 3, does not comprise any insulation protection, and has the risk of short circuit with the metal protection shell 5.
Therefore, how to improve the reliability of the endoscope imaging system is a problem to be solved in the field.
Disclosure of Invention
Aiming at the technical problem that the construction scheme of the camera system in the existing endoscope is low in reliability, the invention aims to provide a three-dimensional circuit of an imaging assembly, which abandons the welding scheme of components in the existing camera system and greatly improves the reliability of the whole scheme. On the basis, the invention further provides an endoscope adopting the imaging assembly three-dimensional circuit.
In order to achieve the above object, the imaging assembly stereo circuit provided by the invention is installed at the head end of an endoscope, and comprises an integrally formed circuit structural part and an image sensor;
the circuit structural part comprises a mounting body part and a transmission cable mounting part, wherein the transmission cable mounting part is formed at the first end of the mounting body part, an electronic element mounting area is formed on the mounting body part, a plurality of circuits are directly formed on the mounting body part, the plurality of circuits are distributed along the mounting body part, contact conduction parts are respectively formed at the first end and the second end of the mounting body part, and the contact conduction parts formed on the circuits at the first end of the mounting body part correspond to the transmission cable mounting part; forming contact conduction parts in the electronic component mounting areas corresponding to the lines of the electronic component mounting areas respectively;
the image sensor is arranged at the second end of the body arranging part.
Further, the line is directly plated on the mounting body part by a laser direct structuring process.
Further, each of the continuous lines of the plurality of lines communicates with the image sensor, the electronic component mounting region, and the transmission cable mounting section.
Further, a corresponding groove is formed on the region of the mounting body part corresponding to the circuit.
Further, an insulating layer is arranged on the installation body part, and the insulating layer covers the circuit and/or the electronic element on the installation body part.
Furthermore, the transmission cable installation part is formed by matching a plurality of cable arrangement grooves with arc-shaped cross sections.
Further, the positioning body part comprises at least four continuous lines, and the lines are distributed on different planes of the positioning body part.
Further, at least one of the four continuous lines is non-linear and distributed on different planes on which the body portion is disposed.
Further, the projection of the section of the body part is arranged to cover the imaging chip.
In order to achieve the above object, the present invention provides an endoscope, wherein an imaging system in an endoscope end seat employs the above-described imaging block three-dimensional circuit.
According to the imaging assembly three-dimensional circuit provided by the invention, the regions where the elements are installed form an integrated structure and are mutually conducted, so that the stability of a circuit is integrally improved.
Drawings
The invention is further described below in conjunction with the appended drawings and the detailed description.
Fig. 1 is a schematic structural diagram of a conventional endoscopic imaging system;
FIG. 2 is a schematic view of a prior art endoscopic camera system in an end block;
FIG. 3 is a schematic cross-sectional view of a three-dimensional structure according to the present embodiment;
FIG. 4 is a schematic structural view of a three-dimensional structural member according to the present embodiment;
FIG. 5 is a schematic diagram of a circuit distribution area according to the present embodiment;
FIG. 6 is a schematic cross-sectional view of the transmission cable installation area in the present solution;
FIG. 7 is a schematic view of the recess on the body portion;
FIG. 8 is a schematic diagram of a second embodiment of the present invention;
FIG. 9 is a bottom view of the structure of the second embodiment of the present invention;
fig. 10 is a schematic configuration diagram of the configuration in which the circuit member is mounted on the endoscope imaging system according to this embodiment.
The following are labeled and explained for the structural components of the stereo circuit of the imaging assembly:
100: a circuit structural member; 110: a body part is arranged; 120: transmission cable installation area
130: an electronic component mounting area; 140: a groove; 121: a first cable; 122: second cable
123: a third cable; 124: a fourth cable; 125: a first placement groove; 126: second placing groove
127: a third placement groove; 128: a fourth placement groove; 200: an optical lens; 300: image sensor with a plurality of pixels
400: an electronic component; 500: a housing; 600: a transmission cable.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further explained below by combining the specific drawings.
The first embodiment is as follows:
referring to fig. 3, which is a schematic diagram of a three-dimensional circuit of the imaging assembly in the present embodiment, the three-dimensional circuit includes an integrally formed circuit member 100; the overall length g of the three-dimensional structure is 3-5 mm, and the length design of the structure can meet the miniaturization requirement of endoscope products.
Referring to fig. 4, the circuit structure 100 includes a mounting body 110 and a transmission cable mounting portion 120. The transmission cable installation part 120 is formed at a first end of the installation body part 110 to be in contact with the installation body part.
The mounting body 110 is an insulator structure, preferably made of an insulating material; the insulating material is not limited and may be determined according to the actual situation.
A transmission cable installation part 120 for installing a transmission cable, which is formed at a first end of the installation body part 110 and is in contact connection with the installation body part 110; the transmission cable installation part 120 is formed by 4 cable installation grooves with arc-shaped cross sections in a matching way. The groove structure can ensure that the isolation effect between transmission cables is better, and the electronic safety of endoscope products is better met.
The 4 cable arrangement grooves are respectively a first arrangement groove 125, a second arrangement groove 126, a third arrangement groove 127 and a fourth arrangement groove 128; the four placing grooves are respectively symmetrically arranged and form an integrated structure. The integrated structure is compact, the size of the device can be well reduced, and the space is saved.
4 transmission cables can distribute on 4 arrangement grooves, through fixed mode of setting with 4 transmission cable welded fastening on 4 arrangement grooves.
The distribution design of the transmission cables isolates 4 transmission cables through 4 independent cable arrangement grooves, achieves the insulation effect between the transmission cables 600, avoids short circuit and interference of the cables 600, ensures the stability of the lines and improves the safety performance of the whole endoscope product.
Wherein, referring to fig. 6, the distance e separating each arc-shaped surface should be greater than 0.14 mm; the length h between the diagonal arcs should be less than 1.4 mm; the diameter d of the port of the arc-shaped surface is more than 0.38 mm; the length f of the arc-shaped surface is more than 1.00 mm; the imaging effect can be improved by accurately setting the size.
The mounting body part 110 is formed with an electronic component mounting area 130. The electronic component mounting region 130 is a placement groove; the inner wall of the placing groove is provided with an insulating layer which covers the electronic element, so that short circuit and damage caused by connecting circuits can be avoided.
Wherein, referring to fig. 3, the height b of the placement groove should be greater than 3mm, and the width should be greater than 0.5 mm.
The electronic element 400 is placed in the placement groove 130 and has an embedded structure, so that the electronic element 400 can be surrounded, the periphery of the electronic element 400 is protected in an insulating manner, a surface conduction wire is prevented from contacting the protection shell when the protection shell 500 is assembled, and the electronic element 400 is short-circuited and damaged. Besides the insulating property of the placing groove structure is improved, the overall structure miniaturization of the placing body part can be further met, and therefore the requirement of an endoscope product on the overall structure size miniaturization is met.
Further, the surface layer is arranged on the body part 110, and is directly excited and plated into a multi-path circuit by an energy light beam under the condition that a circuit board is not arranged, and the thickness of the multi-path circuit is 0.05-0.001mm, and is preferably 0.015 mm.
The plurality of routes are distributed along the placement body part 110, and contact conduction parts are respectively formed at the first end and the second end of the placement body part 100; the lines corresponding to the electronic component mounting regions 130 form contact conduction portions in the electronic component mounting regions 130, respectively.
The surface layer of the body part is directly plated into a conducting circuit through a Laser Direct Structuring (LDS) circuit process, and the part irradiated by the energy beam is conducted, otherwise, the conducting circuit is not conducted, so that a continuous linear conducting circuit can be formed. Each continuous line is communicated with the imaging chip, the electronic component or the cable arrangement groove.
Specifically, the conductive lines in this scheme are 4 lines, which are shown in fig. 6 as a first cable 121, a second cable 122, a third cable 123 and a fourth cable 124.
Referring specifically to fig. 4 and 5, a first cable 121, a second cable 122, a third cable 123 and a fourth cable 124 are independently provided at the mounting body part 110, respectively; the first cable 121 and the second cable 122 are symmetrically disposed on two sides of the upper surface of the installation body 110; the third cable 123 and the fourth cable 124 are symmetrically disposed at the bottom end of the mounting body part, respectively, and are disposed corresponding to the first cable 121 and the second cable 122.
The first end conduction part 121a of the first cable 121 is located at one end of the placement body part 110, and is correspondingly contacted and conducted with the first cable placement groove 125 in the transmission cable 600; the second end conduction part 121b of the first cable 121 is located at the other end of the placement body part 110, and is connected with the pin on the image sensor 300 by welding. The middle portion of the first cable 121 extends to the electronic component mounting region 130, and forms a conduction region with the electronic component mounting region 130, so that the first cable 121 can be in contact conduction with the electronic component 400.
The first conduction part 122a of the second cable 122 is located at one end of the placement body part 110, and is correspondingly contacted and conducted with the second cable placement groove 126 in the transmission cable 600; the second end conduction part 122b of the second cable is located at the other end where the body part 110 is disposed, and is connected with the pin on the image sensor 300 by soldering. The middle portion of the second cable 122 extends to the electronic component mounting region 130, and forms a conduction region with the electronic component mounting region 130, so that the second cable 122 can be in contact conduction with the electronic component 400.
A first conduction part (not shown) of the third cable 123 is located at one end of the body part 110, and is in corresponding contact conduction with the third cable installation slot 127 in the transmission cable; the second end conduction part 123b of the third cable 123 is located at the other end of the placement body part 110, and is connected to the pin of the image sensor 300 by soldering.
The first conduction part 124a of the fourth cable 124 is located at one end of the placement body part 110, and is in corresponding contact conduction with the fourth cable placement groove 128 in the transmission cable; the second end conduction part 124b of the fourth cable is located at the other end where the body part 110 is disposed, and is connected with the pin on the image sensor 300 by soldering.
Referring to fig. 7, the corresponding grooves 140 are formed in 4 cable installation regions of the main body 110 corresponding to the circuit regions, and insulating layers are disposed in the grooves 140 to cover the conductive circuits, thereby preventing short circuit and damage of the connection circuits. By placing the conductive leads in the grooves 140, short circuits and damage during assembly and use are avoided.
Example two:
the present embodiment provides an imaging element stereo circuit based on the first embodiment, and the whole composition structure of the imaging element stereo circuit is basically the same as the composition scheme provided in the first embodiment. The same parts will not be described again here.
Referring to fig. 8-9, in the present embodiment, the mounting body 110 is designed to be a cylindrical shape according to the shape of the protective housing of the imaging component on the basis of the stereoscopic circuit of the imaging component, and the leads and the lead grooves are correspondingly arranged on the circumference of the cylinder according to the cylindrical shape.
Referring to fig. 10, the electronic component 400 is first mounted on the electronic component mounting region 130, and an insulating layer is covered on the electronic component mounting region 130 to cover the electronic component 400, so as to prevent the short circuit and damage of the connection circuit.
The transmission cable is welded and fixed with 4 ends of 4 transmission cables 600 corresponding to 4 placement grooves of the transmission cable installation area 120 respectively, extends to 4 independently arranged grooves in the cable installation area, is conducted with the electronic component installation area 130, covers an insulating layer on the cables installed in the grooves 140, and can avoid short circuit and damage during the assembling and using processes.
4 transmission cable one end fixed mounting is on 4 arrangement grooves on transmission cable installation region 120, and the other end passes transmission cable installation region 140 and is connected with image sensor and forms and switch on, and 4 transmission cable set up independently, can reach the insulating effect between the transmission cable 600, have avoided the short circuit and the interference of cable, have guaranteed the stability of circuit.
After the circuit is conducted, the circuit structural member 100 is installed into the protective shell 500 from one end of the protective shell 500; the optical lens 200 is installed at one end port of the protective casing 500 and is in contact connection with the image sensor 300, so that image signal acquisition, processing and transmission are realized.
Compared with the prior art, the scheme has the following advantages:
(1) the single three-dimensional special-shaped insulating structural part has high shape and size precision, can improve the size precision of an imaging surface, and improves the imaging effect;
(2) the transmission cable assembly adopts the isolation structure characteristic, so that the short circuit and the interference of the cable can be avoided;
(3) the insulating layers are arranged in the grooves for assembling the electronic element and the conducting wires, short circuit damage in the assembling and using processes can be avoided, and the stability and reliability of the whole camera system are improved.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. An imaging assembly three-dimensional circuit is arranged at the head end of an endoscope and is characterized by comprising a circuit structural part and an image sensor which are integrally formed;
the circuit structural part comprises a mounting body part and a transmission cable mounting part, wherein the transmission cable mounting part is formed at the first end of the mounting body part, an electronic element mounting area is formed on the mounting body part, a plurality of circuits are directly formed on the mounting body part, the plurality of circuits are distributed along the mounting body part, contact conduction parts are respectively formed at the first end and the second end of the mounting body part, and the contact conduction parts formed on the circuits at the first end of the mounting body part correspond to the transmission cable mounting part; forming contact conduction parts in the electronic component mounting areas corresponding to the lines of the electronic component mounting areas respectively;
the image sensor is arranged at the second end of the body arranging part.
2. The endoscopic imaging assembly stereo circuit according to claim 1, wherein said wire is plated directly onto the placement body portion by a laser direct structuring process.
3. An endoscopic imaging assembly stereo circuit according to claim 1, wherein each successive line of said plurality of lines communicates said image sensor, said electronic component mounting region and said transmission cable mounting portion.
4. An endoscopic imaging assembly stereo circuit according to claim 1, wherein said placement body portion is formed with corresponding grooves in the areas corresponding to the lines.
5. The endoscopic imaging assembly stereo circuit according to claim 1, wherein said placement body portion has an insulating layer thereon, said insulating layer covering circuitry and/or electronic components on the placement body portion.
6. The endoscopic imaging assembly stereo circuit according to claim 1, wherein said transmission cable mount is formed by a plurality of cable receiving slots having an arc-shaped cross section.
7. The endoscopic imaging assembly stereo circuit according to claim 1, wherein said placement body portion comprises at least four continuous lines and is distributed on different planes of the placement body portion.
8. The endoscopic imaging assembly stereo circuit according to claim 7, wherein at least one of said four line continuous lines is non-linear and distributed at different planes on which the body portion is disposed.
9. An endoscopic imaging assembly stereo circuit according to claim 1, wherein said placement body section cross-sectional projection covers the image chip.
10. An endoscope, characterized in that the imaging system in the endoscope end mount employs the imaging assembly stereo circuit of any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110178860.4A CN113100689A (en) | 2021-02-09 | 2021-02-09 | Imaging assembly three-dimensional circuit and endoscope |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110178860.4A CN113100689A (en) | 2021-02-09 | 2021-02-09 | Imaging assembly three-dimensional circuit and endoscope |
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| CN113100689A true CN113100689A (en) | 2021-07-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110178860.4A Pending CN113100689A (en) | 2021-02-09 | 2021-02-09 | Imaging assembly three-dimensional circuit and endoscope |
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