Disclosure of Invention
The invention aims to provide a light-emitting component with a depth-of-field effect, which can form a strong visual depth sense when the light-emitting component emits light by combining the originality of a structure and a functional material, increase the layering sense of the light-emitting component and greatly improve the function and artistic effect of the light-emitting component.
In order to solve the technical problems, the technical scheme provided by the invention is as follows:
a light emitting assembly with depth of field effect, comprising: the light-emitting device comprises a first light reflecting part, an adhesive layer and a second light reflecting part, wherein the adhesive layer is used for bonding the lower surface of the first light reflecting part and the upper surface of the second light reflecting part and forming a cavity between the first light reflecting part and the second light reflecting part, the upper surface of the second light reflecting part is provided with a light-emitting functional layer, the light-emitting functional layer is positioned in the cavity formed by the first light reflecting part, the adhesive layer and the second light reflecting part, and the lower surface of the second light reflecting part is provided with a mirror layer.
Furthermore, the first light reflecting part can reflect and transmit light, and a pattern layer is further arranged on the upper surface and/or the lower surface of the first light reflecting part and is not superposed with the adhesive layer and the light emitting functional layer.
Further, the mirror layer arranged on the lower surface of the second light reflecting portion completely covers the lower surface of the second light reflecting portion.
Further, the light-emitting functional layer comprises a conductive layer and a light-emitting layer, and the overall height of the light-emitting functional layer is smaller than that of the adhesive layer.
Furthermore, the conducting layer of the light-emitting functional layer is a non-closed continuous pattern layer, the non-closed end of the conducting layer extends outwards to form an electrode pin, the electrode pin is connected with a lead, the conducting layer and the electrode pin are formed by printing conductive ink, the light-emitting layer covers the conducting layer, the light-emitting layer is formed by printing electroluminescent ink, and the light-emitting layer is one of a continuous pattern or a non-continuous pattern.
Further, the molding substrate of the first light reflecting part and the second light reflecting part is a transparent sheet, and the transparent sheet is specifically one or a combination of two of polycarbonate, polyethylene terephthalate, polypropylene, polylactic acid, polymethyl methacrylate and glass.
A method for preparing a light-emitting assembly with a depth of field effect comprises the following steps:
pretreatment: performing surface pretreatment on the upper surface and/or the lower surface of the forming substrate of the first light reflecting part and the second light reflecting part to increase the printability of the forming substrate;
manufacturing a first light reflecting part: cutting the pretreated forming base material according to the required shape and size to obtain a first light reflecting part;
manufacturing a second light reflecting part: the manufacturing of the second light reflecting part specifically comprises the following steps,
s01 printing mirror layer: printing a layer of mirror ink on the lower surface of the molding base material of the second light reflecting part through a printing process, and flatly drying to form a mirror layer on the lower surface of the molding base material;
s02 printing conductive layer: printing a layer of conductive ink on the upper surface of the molded substrate processed in the step S01 through a printing process to form a non-closed continuous pattern layer and drying the non-closed continuous pattern layer to form a conductive layer, wherein the non-closed end extends outwards to form an electrode pin;
s03 printing light emitting layer: printing a continuous or discontinuous electroluminescent ink layer on the conductive layer formed in the step S02 by a printing process, and drying to form a light-emitting layer, thereby completing the fabrication of the light-emitting functional layer;
s04 bonding lead: fixing an external lead on the electrode pin formed in the step S02 through a conductive adhesive so that the lead can be electrically connected with the conductive layer;
s05 printing an adhesive layer: on the basis of the step S04, printing a layer of adhesive on the periphery of the luminous functional layer through a printing process, and drying to form an adhesive layer;
s06 forming: cutting the molding base material processed in the step S05 according to the required shape and size to obtain a second light reflecting part;
bonding: and adhering the first reflecting part and the second reflecting part together by the lower surface of the first reflecting part through the adhesive layer of the second reflecting part to form the light-emitting component with the depth of field effect.
Further, in the process of preparing the first light reflecting portion, there may be a step of,
s01 printing pattern layer: printing color ink on the upper surface and/or the lower surface of the pretreated molded substrate of the first light reflecting part through a printing process and drying to form a pattern layer;
s02 forming: and cutting the molding base material processed in the step S01 according to the required shape and size to obtain a first light reflecting part.
The invention relates to a packaging box of a light-emitting component with a depth-of-field effect.
The invention has the beneficial effects that:
the invention forms a light-emitting component with depth of field effect by arranging the light-emitting functional layer between the first light reflecting part and the second light reflecting part with mirror coating and bonding and fixing the light-emitting functional layer by the adhesive, when the power supply is not switched on, the light-emitting component does not emit light and has no depth of field sense, when the light-emitting component is switched on and emits light, the light emitted by the light-emitting point is reflected for multiple times by the first light reflecting part and the second light reflecting part, when observed by naked eyes, the whole light-emitting component forms a light-emitting pattern which extends layer by layer, has strong visual depth of field effect and rich gradation sense, and combines the pattern layer on the upper surface and/or the lower surface of the first light reflecting part, the visual effect and the gradation of the printed pattern are more effectively supported by the combination of the light-emitting effect and the depth of field effect of the light-emitting component, and the light-emitting component is applied to, when making the packing carton close the lid and close, light-emitting component is not luminous, and when opening the packing carton, light-emitting component begins luminous to great promotion packing carton's visual effect, mutual experience feel and visual stereovision are felt, have reduced the technological complexity through the abundant stereovision that simple paper structure constitutes, the effectual production efficiency who promotes this type of packing product.
Detailed Description
In order to make the technical problems solved, the technical solutions adopted and the technical effects achieved by the present invention clearer, the technical solutions of the present invention are further described below by way of specific embodiments with reference to the accompanying drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some but not all of the elements associated with the present invention are shown in the drawings.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "right", etc. are used in an orientation or positional relationship based on that shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
Example one
As shown in fig. 1, the present embodiment discloses a light emitting assembly with depth of field effect, comprising: the light-emitting device comprises a first light reflecting part 1, an adhesive layer 2 and a second light reflecting part 3, wherein the adhesive layer 2 is used for bonding the lower surface of the first light reflecting part 1 and the upper surface of the second light reflecting part 3 and forming a cavity between the first light reflecting part 1 and the second light reflecting part 3, the upper surface of the second light reflecting part 3 is provided with a light-emitting functional layer 31, the light-emitting functional layer 31 is located in the cavity formed by the first light reflecting part 1, the adhesive layer 2 and the second light reflecting part 3, and the lower surface of the second light reflecting part 3 is provided with a mirror layer 32.
The molding substrate of the first light reflecting part 1 and the second light reflecting part 3 is a transparent sheet, and the transparent sheet is specifically one or a combination of two of Polycarbonate (PC), polyethylene terephthalate (PET), polypropylene (PP), polylactic acid (PLA), polymethyl methacrylate (PMMA) and glass. Since the first light reflecting part 1 is a transparent sheet, the first light reflecting part 1 can reflect and transmit light.
The light emitting function layer 31 includes a conductive layer 311 and a light emitting layer 312, and the overall height of the light emitting function layer 31 is smaller than the height of the adhesive layer 2. The conductive layer 311 of the light emitting functional layer 31 is a non-closed continuous pattern layer, a non-closed end of the conductive layer 311 extends outwards to form an electrode pin 313, the electrode pin 313 is connected with a lead 314, the conductive layer 311 and the electrode pin 313 are formed by printing conductive ink, the light emitting layer 312 covers the conductive layer 311, the light emitting layer 312 is formed by printing electroluminescent ink, and the light emitting layer 312 is one of a continuous pattern and a non-continuous pattern.
In order to ensure good electrical communication, the conductive layer 311 of the light-emitting functional layer 31 is a non-closed continuous pattern layer, the pattern layer is mainly a similar annular pattern formed by one or more combinations of a square, a circle, an ellipse and a triangle, the non-closed end of the conductive layer 311 extends outwards to form an electrode pin 313, the electrode pin 313 is connected with a lead 314, the lead 314 is mainly used for facilitating later-stage electrical connection, the conductive layer 311 is formed by printing conductive ink, the light-emitting layer 312 covers the conductive layer 311, the light-emitting layer 312 is formed by printing electroluminescent ink, and the light-emitting layer 312 is a continuous pattern.
The conductive layer 311 is formed by printing one of nano silver wire conductive ink, graphene conductive ink and carbon conductive ink through a printing process; the light emitting layer 312 is formed by printing ink containing a polymer organic electroluminescent material through a printing process.
In order to promote the light reflection ability of second reflection of light portion 3, make the reflection that the light that luminous functional layer 31 emitted can be many times second reflection of light portion 3's lower surface, through printing process full version coating one deck mirror surface printing ink, mirror surface printing ink forms the high mirror surface layer 32 that similar mirror is the same after leveling is dry, not only can guarantee like this that the light that luminescent layer 312 sent can most reflect back, can also guarantee that luminescent layer 312 can be fine forms clear virtual image on mirror surface layer 32.
As shown in fig. 7, a method for manufacturing a light emitting assembly with depth of field effect includes the following steps:
pretreatment: the upper surface and/or the lower surface of the molding substrate of the first retroreflective portion 1 and the second retroreflective portion 3 are subjected to surface pretreatment to increase the printability of the molding substrate.
Manufacturing a first light reflecting part 1: cutting the pretreated forming base material according to the required shape and size to obtain a first light reflecting part 1;
manufacturing a second light reflecting part 3: the second light reflecting part 3 is specifically manufactured by the following steps,
s01 printing mirror layer 32: printing a layer of mirror ink on the lower surface of the molding base material of the second light reflecting part 3 which is pretreated by a printing process, and flatly drying to form a mirror layer 32 on the lower surface of the molding base material;
s02 printing conductive layer 311: printing a layer of conductive ink on the upper surface of the molded substrate processed in step S01 by a printing process to form a non-closed continuous pattern layer and drying the non-closed continuous pattern layer to form a conductive layer 311, wherein the non-closed end extends outwards to form an electrode pin 313;
s03 printing luminescent layer 312: printing a continuous annular electroluminescent ink layer on the conductive layer 311 formed in step S02 by a printing process, and drying to form a light-emitting layer 312, thereby completing the fabrication of the light-emitting functional layer 31;
s04 attachment lead 314: fixing an external lead 314 on the electrode pin 313 formed in step S02 by a conductive adhesive, so that the lead 314 can electrically communicate with the conductive layer 311;
s05 printing adhesive layer 2: on the basis of the step S04, printing a layer of adhesive on the periphery of the light-emitting functional layer 31 by a printing process, and drying to form an adhesive layer 2;
s06 forming: cutting the molding substrate processed in the step S05 according to a desired shape and size to obtain a second light reflecting part 3;
bonding: and adhering the first reflecting part 1 and the second reflecting part 3 together by the lower surface of the first reflecting part 1 through the adhesive layer 2 of the second reflecting part 3 to form the light-emitting component with the depth of field effect.
After the light emitting assembly is prepared, the light emitting assembly is connected to the positive electrode and the negative electrode of a battery pack through a lead 314, wherein the battery pack can be one of commercially available button batteries, paper batteries and film batteries. The conductive layer 311 starts to be electrically connected and transfers charges to the polymer organic electroluminescent material in the light emitting layer 312 to enable the polymer organic electroluminescent material to emit light, the light emitting light is reflected by the first light reflecting part 1 and the second light emitting part 3 for multiple times, so that the light emitting pattern formed by the light emitting layer 311 is imaged by the mirror layer 32 for multiple times, multiple annular continuous images are formed on the mirror layer 32, when the multiple annular continuous images are observed by naked eyes, the multiple annular continuous images form regular light emitting images which are large outside and small inside and extend in a circulating mode in sequence, a strong visual scene depth feeling is formed on the mirror layer 32, and after the electrical connection is disconnected, only very weak imaging can be seen on the mirror layer 32.
Example two
As shown in fig. 2, the main differences between the present embodiment and the first embodiment are: the light-emitting layer 312 is in a discontinuous pattern, so that the light-emitting layer 312 is a discontinuous light-emitting point, and the rest is the same as the first embodiment.
As shown in fig. 7, a method for manufacturing a light emitting assembly with depth of field effect includes the following steps:
pretreatment: the upper surface and/or the lower surface of the molding substrate of the first retroreflective portion 1 and the second retroreflective portion 3 are subjected to surface pretreatment to increase the printability of the molding substrate.
Manufacturing a first light reflecting part 1: cutting the pretreated forming base material according to the required shape and size to obtain a first light reflecting part 1;
manufacturing a second light reflecting part 3: the second light reflecting part 3 is specifically manufactured by the following steps,
s01 printing mirror layer 32: printing a layer of mirror ink on the lower surface of the molding base material of the second light reflecting part 3 which is pretreated by a printing process, and flatly drying to form a mirror layer 32 on the lower surface of the molding base material;
s02 printing conductive layer 311: printing a layer of conductive ink on the upper surface of the molded substrate processed in step S01 by a printing process to form a non-closed continuous pattern layer and drying the non-closed continuous pattern layer to form a conductive layer 311, wherein the non-closed end extends outwards to form an electrode pin 313;
s03 printing luminescent layer 312: printing an annular intermittent electroluminescent ink layer on the conductive layer 311 formed in step S02 by a printing process, and drying to form a light-emitting layer 312, thereby completing the fabrication of the light-emitting functional layer 31;
s04 attachment lead 314: fixing an external lead 314 on the electrode pin 313 formed in step S02 by a conductive adhesive, so that the lead 314 can electrically communicate with the conductive layer 311;
s05 printing adhesive layer 2: on the basis of the step S04, printing a layer of adhesive on the periphery of the light-emitting functional layer 31 by a printing process, and drying to form an adhesive layer 2;
s06 forming: cutting the molding substrate processed in the step S05 according to a desired shape and size to obtain a second light reflecting part 3;
bonding: and adhering the first reflecting part 1 and the second reflecting part 3 together by the lower surface of the first reflecting part 1 through the adhesive layer 2 of the second reflecting part 3 to form the light-emitting component with the depth of field effect.
After the light emitting assembly is prepared, the light emitting assembly is connected with the positive electrode and the negative electrode of the battery pack through the lead 314, so that the light emitting pattern formed by the light emitting layer 312 is imaged for multiple times through the mirror layer 32, and the main difference of the imaging is that in the embodiment, multiple annular intermittent point images are formed on the mirror layer 32, and when the multiple annular intermittent point images are observed by naked eyes, the multiple annular intermittent point images form regular light emitting images which are large in outside and small in inside and extend in a cycle mode in sequence.
EXAMPLE III
As shown in fig. 3 to 4, the main differences between the present embodiment and the first embodiment are: the upper surface of the first light reflecting part 1 is further provided with a pattern layer 11, the pattern layer 11 is not overlapped with the adhesive layer 2 and the light emitting functional layer 31, and the rest is the same as that of the first embodiment.
As shown in fig. 8, a method for manufacturing a light emitting assembly with depth of field effect includes the following steps:
pretreatment: the upper surface and/or the lower surface of the molding substrate of the first retroreflective portion 1 and the second retroreflective portion 3 are subjected to surface pretreatment to increase the printability of the molding substrate.
Manufacturing a first light reflecting part 1: the manufacturing of the first light reflecting part 1 specifically comprises the following steps,
s01 printing the pattern layer 11: printing color ink on the upper surface of the molding base material of the pretreated first light reflecting part 1 through a printing process and drying to form a pattern layer 11;
s02 forming: cutting the molding substrate processed in the step S01 according to a required shape and size to obtain a first light reflecting part 1;
manufacturing a second light reflecting part 3: the second light reflecting part 3 is specifically manufactured by the following steps,
s01 printing mirror layer 32: printing a layer of mirror ink on the lower surface of the molding base material of the second light reflecting part 3 which is pretreated by a printing process, and flatly drying to form a mirror layer 32 on the lower surface of the molding base material;
s02 printing conductive layer 311: printing a layer of conductive ink on the upper surface of the molded substrate processed in step S01 by a printing process to form a non-closed continuous pattern layer and drying the non-closed continuous pattern layer to form a conductive layer 311, wherein the non-closed end extends outwards to form an electrode pin 313;
s03 printing luminescent layer 312: printing a continuous annular electroluminescent ink layer on the conductive layer 311 formed in step S02 by a printing process, and drying to form a light-emitting layer 312, thereby completing the fabrication of the light-emitting functional layer 31;
s04 attachment lead 314: fixing an external lead 314 on the electrode pin 313 formed in step S02 by a conductive adhesive, so that the lead 314 can electrically communicate with the conductive layer 311;
s05 printing adhesive layer 2: on the basis of the step S04, printing a layer of adhesive on the periphery of the light-emitting functional layer 31 by a printing process, and drying to form an adhesive layer 2;
s06 forming: cutting the molding substrate processed in the step S05 according to a desired shape and size to obtain a second light reflecting part 3;
bonding: and adhering the first reflecting part 1 and the second reflecting part 3 together by the lower surface of the first reflecting part 1 through the adhesive layer 2 of the second reflecting part 3 to form the light-emitting component with the depth of field effect.
After the light-emitting component is prepared, the light-emitting component is connected with the anode and cathode of the battery pack through the lead 314, the conductive layer 311 starts to be electrically connected, charges are transferred to the high-molecular organic electroluminescent material in the light-emitting layer 312 to enable the high-molecular organic electroluminescent material to emit light, the light-emitting light is reflected for multiple times through the first reflecting part 1 and the mirror layer 32 to enable the light-emitting pattern formed by the light-emitting layer 312 to be imaged for multiple times through the mirror layer 32, multiple annular continuous images are formed on the mirror layer 32, when the light-emitting component is observed through naked eyes, the multiple annular continuous images form regular light-emitting images which are large in outside and small in inside and extend in sequence in a circulating mode, a strong visual depth sense is formed on the mirror layer 32, a front-back layout is formed with the pattern layer 11 on the upper surface of the first reflecting part 1, the visual depth sense is fully embodied, and under the irradiation of the light emitted by the light-emitting layer 312, the pattern color is more vivid and has a strong light and shade sense, the visual effect is better.
Example four
As shown in fig. 5, the main differences between the present embodiment and the first embodiment are: the lower surface of the first light reflecting part 1 is further provided with a pattern layer 11, the pattern layer 11 is not overlapped with the adhesive layer 2 and the light emitting functional layer 31, and the rest is the same as that of the first embodiment.
As shown in fig. 8, a method for manufacturing a light emitting assembly with depth of field effect includes the following steps:
pretreatment: the upper surface and/or the lower surface of the molding substrate of the first retroreflective portion 1 and the second retroreflective portion 3 are subjected to surface pretreatment to increase the printability of the molding substrate.
Manufacturing a first light reflecting part 1: the manufacturing of the first light reflecting part 1 specifically comprises the following steps,
s01 printing the pattern layer 11: printing color ink on the lower surface of the molding base material of the pretreated first light reflecting part 1 through a printing process and drying to form a pattern layer 11;
s02 forming: cutting the molding substrate processed in the step S01 according to a required shape and size to obtain a first light reflecting part 1;
manufacturing a second light reflecting part 3: the second light reflecting part 3 is specifically manufactured by the following steps,
s01 printing mirror layer 32: printing a layer of mirror ink on the lower surface of the molding base material of the second light reflecting part 3 which is pretreated by a printing process, and flatly drying to form a mirror layer 32 on the lower surface of the molding base material;
s02 printing conductive layer 311: printing a layer of conductive ink on the upper surface of the molded substrate processed in step S01 by a printing process to form a non-closed continuous pattern layer and drying the non-closed continuous pattern layer to form a conductive layer 311, wherein the non-closed end extends outwards to form an electrode pin 313;
s03 printing luminescent layer 312: printing a continuous annular electroluminescent ink layer on the conductive layer 311 formed in step S02 by a printing process, and drying to form a light-emitting layer 312, thereby completing the fabrication of the light-emitting functional layer 31;
s04 attachment lead 314: fixing an external lead 314 on the electrode pin 313 formed in step S02 by a conductive adhesive, so that the lead 314 can electrically communicate with the conductive layer 311;
s05 printing adhesive layer 2: on the basis of the step S04, printing a layer of adhesive on the periphery of the light-emitting functional layer 31 by a printing process, and drying to form an adhesive layer 2;
s06 forming: cutting the molding substrate processed in the step S05 according to a desired shape and size to obtain a second light reflecting part 3;
bonding: and adhering the first reflecting part 1 and the second reflecting part 3 together by the lower surface of the first reflecting part 1 through the adhesive layer 2 of the second reflecting part 3 to form the light-emitting component with the depth of field effect.
EXAMPLE five
As shown in fig. 6, the main differences between the present embodiment and the first embodiment are: the upper surface and the lower surface of the first light reflecting part 1 are both provided with pattern layers 11, the pattern layers 11 are not overlapped with the adhesive layer 2 and the light emitting function layer 31, and the rest parts are the same as the first embodiment.
As shown in fig. 8, a method for manufacturing a light emitting assembly with depth of field effect includes the following steps:
pretreatment: the upper surface and/or the lower surface of the molding substrate of the first retroreflective portion 1 and the second retroreflective portion 3 are subjected to surface pretreatment to increase the printability of the molding substrate.
Manufacturing a first light reflecting part 1: the manufacturing of the first light reflecting part 1 specifically comprises the following steps,
s01 printing the pattern layer 11: printing color ink on the upper surface and the lower surface of the molding base material of the pretreated first light reflecting part 1 through a printing process and drying to form a pattern layer 11;
s02 forming: cutting the molding substrate processed in the step S01 according to a required shape and size to obtain a first light reflecting part 1;
manufacturing a second light reflecting part 3: the second light reflecting part 3 is specifically manufactured by the following steps,
s01 printing mirror layer 32: printing a layer of mirror ink on the lower surface of the molding base material of the second light reflecting part 3 which is pretreated by a printing process, and flatly drying to form a mirror layer 32 on the lower surface of the molding base material;
s02 printing conductive layer 311: printing a layer of conductive ink on the upper surface of the molded substrate processed in step S01 by a printing process to form a non-closed continuous pattern layer and drying the non-closed continuous pattern layer to form a conductive layer 311, wherein the non-closed end extends outwards to form an electrode pin 313;
s03 printing luminescent layer 312: printing a continuous annular electroluminescent ink layer on the conductive layer 311 formed in step S02 by a printing process, and drying to form a light-emitting layer 312, thereby completing the fabrication of the light-emitting functional layer 31;
s04 attachment lead 314: fixing an external lead 314 on the electrode pin 313 formed in step S02 by a conductive adhesive, so that the lead 314 can electrically communicate with the conductive layer 311;
s05 printing adhesive layer 2: on the basis of the step S04, printing a layer of adhesive on the periphery of the light-emitting functional layer 31 by a printing process, and drying to form an adhesive layer 2;
s06 forming: cutting the molding substrate processed in the step S05 according to a desired shape and size to obtain a second light reflecting part 3;
bonding: and adhering the first reflecting part 1 and the second reflecting part 3 together by the lower surface of the first reflecting part 1 through the adhesive layer 2 of the second reflecting part 3 to form the light-emitting component with the depth of field effect.
The invention relates to a packaging box of a light-emitting component with a depth-of-field effect.
The foregoing embodiments are merely illustrative of the principles and features of this invention, which is not limited to the above-described embodiments, but rather is susceptible to various changes and modifications without departing from the spirit and scope of the invention, which changes and modifications are within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.