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CN113365418A - Flexible circuit board and manufacturing method thereof - Google Patents

Flexible circuit board and manufacturing method thereof Download PDF

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Publication number
CN113365418A
CN113365418A CN202110601079.3A CN202110601079A CN113365418A CN 113365418 A CN113365418 A CN 113365418A CN 202110601079 A CN202110601079 A CN 202110601079A CN 113365418 A CN113365418 A CN 113365418A
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China
Prior art keywords
conductive
trace
groove
conductive layer
size
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CN202110601079.3A
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CN113365418B (en
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梁魁
王迎姿
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BOE Technology Group Co Ltd
Beijing BOE Technology Development Co Ltd
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BOE Technology Group Co Ltd
Beijing BOE Technology Development Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The utility model provides a flexible circuit board, flexible circuit board includes first flexible substrate and the second flexible substrate of laminating with this first flexible substrate, first flexible substrate includes first flexible base member layer, forms and is in at least one first line recess and at least one first electrically conductive line of walking on the first flexible base member layer, first electrically conductive line setting is walked in corresponding first line recess on the cross section of first line recess, the opening size of first line recess is no longer than the size of first line recess middle part, just the bottom size of first line recess opening is no longer than the size of first line recess middle part, the surface of first electrically conductive line with the surface laminating of first line recess. The present disclosure also provides a method of manufacturing a flexible circuit board.

Description

Flexible circuit board and manufacturing method thereof
Technical Field
The present disclosure relates to circuit technology, and in particular, to a flexible circuit board and a method of manufacturing the flexible circuit board.
Background
With the popularization of wearable devices, the application of flexible circuit boards is also more and more extensive. As the flexible circuit board needs to be bent during use, the conductive traces in the flexible circuit board also have a risk of breaking. Therefore, how to avoid the conductive traces from breaking in the bending process of the flexible circuit board becomes a technical problem to be solved in the field.
Disclosure of Invention
An object of the present disclosure is to provide a flexible circuit board and a method of manufacturing the flexible circuit board.
As an aspect of the present disclosure, a flexible circuit board is provided, where the flexible circuit board includes a first flexible substrate and a second flexible substrate attached to the first flexible substrate, where the first flexible substrate includes a first flexible substrate layer, at least one first trace groove formed on the first flexible substrate layer, and at least one first conductive trace, the first conductive trace is disposed in the corresponding first trace groove, on a cross section of the first trace groove, an opening size of the first trace groove is not greater than a size of a middle portion of the first trace groove, a bottom size of the opening of the first trace groove is not greater than a size of the middle portion of the first trace groove, and an outer surface of the first conductive trace is attached to a surface of the first trace groove.
Optionally, the first conductive trace includes a first organic conductive layer, a first metal conductive layer, and a first organic conductive core, the first organic conductive layer is attached to a surface of the corresponding first trace groove, the first organic conductive layer defines a first accommodating space, the first metal conductive layer is disposed in the first accommodating space, the first metal conductive layer defines a second accommodating space, and the first organic conductive core is accommodated in the second accommodating space.
Optionally, the first flexible substrate includes at least one first routing group, each first routing group includes a plurality of first conductive routing lines which have the same extending direction and are arranged in parallel, and the plurality of first conductive routing lines in the same first routing group are electrically connected to each other.
Optionally, the first wire group further includes at least one first connecting wire, and the first connecting wire is connected between two adjacent first conductive wires.
Optionally, the first flexible substrate includes at least one second routing group, the second routing group includes a plurality of first routing lines and at least one second connection routing line, in the same second routing group, the plurality of first routing lines are sequentially arranged along the same extending direction, a gap exists between adjacent ends of two adjacent first routing lines, a width direction of the gap intersects with the extending direction of the first routing lines, and the two adjacent first routing lines are electrically connected through the second connection routing lines.
Optionally, the second flexible substrate includes a second flexible base layer, at least one second trace groove formed on the second flexible base layer, and at least one second conductive trace, the second conductive trace is disposed in the corresponding second trace groove, each first conductive trace corresponds to at least one second conductive trace, and the second conductive trace is electrically connected to the corresponding first conductive trace.
Optionally, on the cross section of the second trace groove, the size of the opening of the second trace groove is not greater than the size of the middle of the second trace groove, the size of the bottom of the opening of the second trace groove is not greater than the size of the middle of the second trace groove, and the outer surface of the second conductive trace is attached to the surface of the second trace groove.
Optionally, the second conductive trace includes a second organic conductive layer, a second metal conductive layer, and a second organic conductive core, the second organic conductive layer is attached to the surface of the corresponding second trace groove, the second organic conductive layer defines a third receiving space, the second metal conductive layer is disposed in the third receiving space, the second metal conductive layer defines a fourth receiving space, and the second organic conductive core is received in the fourth receiving space.
As a second aspect of the present disclosure, there is provided a manufacturing method of a flexible circuit board, wherein the manufacturing method includes:
providing a first flexible substrate body;
forming at least one first wiring groove on the first flexible substrate body, wherein the opening size of the first wiring groove is not more than the size of the middle part of the first wiring groove on the cross section of the first wiring groove, and the bottom size of the opening of the first wiring groove is not more than the size of the middle part of the first wiring groove;
forming corresponding first conductive wires in each first wire groove respectively, wherein the outer surfaces of the first conductive wires are attached to the surfaces of the first wire grooves to obtain a first flexible substrate;
and forming a second flexible substrate on the first flexible substrate to perform insulation packaging on the first conductive routing.
Optionally, the step of forming a corresponding first conductive trace in each first trace groove respectively includes:
forming a first organic conductive layer on the first flexible substrate body formed with the first routing groove;
patterning the first organic conducting layer to obtain corresponding first organic conducting layers in the first wiring grooves respectively, wherein the first organic conducting layers are attached to the surfaces of the corresponding first wiring grooves, and a first accommodating space is defined by the first organic conducting layers;
forming a metal conductive layer;
patterning the metal conducting layers to form corresponding first metal conducting layers in the first accommodating spaces respectively, wherein the first metal conducting layers define second accommodating spaces;
forming a second organic conductive layer;
and patterning the second organic conductive layer to form a first organic conductive core in each of the second accommodating spaces, respectively.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic diagram of one embodiment of a flexible circuit board provided by the present disclosure;
fig. 2 is a schematic structural diagram of the first flexible substrate after the first conductive trace is removed;
fig. 3 is a schematic top view of a flexible circuit board provided by the present disclosure;
FIG. 4 is a schematic diagram of a first wire set;
FIG. 5 is a schematic diagram of a second wire group;
fig. 6 is a schematic view illustrating a second connection trace of the second traces disposed on the second flexible substrate;
FIG. 7 is a schematic diagram of another embodiment of a flexible circuit board provided by the present disclosure;
fig. 8 is a flow chart of a manufacturing method provided by the present disclosure.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
As an aspect of the present disclosure, a flexible circuit board is provided, as shown in fig. 1 and 3 (fig. 1 is a cross-sectional view of fig. 3), which includes a first flexible substrate 100 and a second flexible substrate 200 attached to the first flexible substrate 100, wherein the first flexible substrate 100 includes a first flexible base layer 110, at least one first trace groove 110a (see fig. 2) formed on the first flexible base layer 110, and at least one first conductive trace 120, and the first conductive trace 120 is disposed in the corresponding first trace groove. As shown in fig. 2, in the cross section of the first trace groove 110a, an opening dimension d1 of the first trace groove 110a does not exceed a dimension d2 of the middle portion of the first trace groove 110a, a bottom dimension d3 of the first trace groove opening 110a does not exceed a dimension d2 of the middle portion of the first trace groove 110a, and the outer surface of the first conductive trace 120 is attached to the surface of the first trace groove.
In this disclosure, because the width of the middle portion of the first wire groove is the largest, and the width of the opening and the bottom surface of the first wire groove are both smaller, when the flexible circuit board is bent, the first conductive wire 120 is not easy to fall off from the first wire groove, so that the phenomena of circuit breaking and the like of the flexible circuit board in the use process can be avoided, and the service life of the product comprising the flexible circuit board is prolonged.
In the present disclosure, the specific structure of the first conductive trace 120 is not particularly limited, and as an alternative embodiment, as shown in fig. 1, the first conductive trace 120 includes a first organic conductive layer 121, a first metal conductive layer 122, and a first organic conductive core 123. The first organic conductive layer 121 is attached to the surface of the corresponding first trace groove, the first organic conductive layer 121 defines a first accommodating space, the first metal conductive layer 122 is disposed in the first accommodating space, the first metal conductive layer 122 defines a second accommodating space, and the first organic conductive core 123 is accommodated in the second accommodating space.
The first organic conductive layer 121 and the first organic conductive core 123 are made of organic material (for example, PEDOT) doped metal nano conductive particles, have good flexibility, and are not easily broken under the bending action. Meanwhile, the first metal conductive layer 122 is disposed to reduce the resistance of the first conductive trace.
In order to further avoid the occurrence of circuit disconnection during the use of the flexible circuit board, as an optional implementation manner, as shown in fig. 4, the first flexible substrate 100 includes at least one first routing group, each first routing group includes a plurality of first conductive traces 120 that extend in the same direction and are arranged in parallel, and the plurality of first conductive traces 120 in the same first routing group are electrically connected to each other.
The electrical signals transmitted by the first conductive traces 120 in the same first trace group are the same, and even if one of the first conductive traces is broken at some position, the other first conductive traces electrically connected to the broken first conductive trace 120 can still complete the transmission of the signals, thereby ensuring the normal operation of the flexible circuit board.
For example, in the embodiment shown in fig. 4, one first trace group includes two first conductive traces 120, and when one of the second conductive traces 120 is broken at a, the other first conductive trace can still function to transmit an electrical signal.
In the present disclosure, an electrical connection manner of two first conductive traces in the same first trace group is not particularly limited, and optionally, as shown in fig. 4, the first trace group further includes at least one first connection trace 310, and the first connection trace 310 is connected between two adjacent first conductive traces 120.
As another embodiment of the present disclosure, the flexible circuit board includes at least one second routing group, as shown in fig. 5, the second routing group includes a plurality of first routing lines 120 and at least one second connection routing line 320, in the same second routing group, the plurality of first routing lines 120 are sequentially arranged along the same extending direction, a gap exists between adjacent ends of two adjacent first routing lines 120, a width direction of the gap intersects with an extending direction of the first routing lines 120, and the two adjacent first routing lines 120 are electrically connected through the second connection routing line 220. In such an embodiment, the second connection trace 320 can be disposed on a portion of the flexible circuit board that is often bent during use, so as to avoid the first trace 120 from being broken due to the frequent bending.
In the present disclosure, the second connection trace 320 may be disposed in the first flexible substrate 100, and the second connection trace 320 may also be disposed in the second flexible substrate 200. Shown in fig. 6 (this fig. 6 is a schematic sectional view II-II of fig. 5) is a schematic view of the second connection trace 320 being provided in the second flexible substrate 200.
The second flexible substrate 200 mainly serves to insulate and encapsulate the first flexible substrate, and therefore, in the present disclosure, the specific structure of the second flexible substrate 200 is not particularly limited as long as the first flexible substrate can be encapsulated.
As an alternative embodiment, the second flexible substrate 200 may be an insulating film layer.
As another optional implementation, the second flexible substrate 200 includes a second flexible base layer 210, at least one second trace groove formed on the second flexible base layer 210, and at least one second conductive trace 220, the second conductive trace 220 is disposed in the corresponding second trace groove, at least one second conductive trace corresponds to each first conductive trace 120, and the second conductive trace 220 is electrically connected to the corresponding first conductive trace 120.
The second conductive trace 220 is provided to further avoid the circuit disconnection in the flexible circuit board, specifically, the signal transmitted in the second conductive trace 220 is the same as the signal transmitted in the first conductive trace 120 electrically connected to the second conductive trace 220, and the second conductive trace 220 can still transmit the signal when the first conductive trace 120 is partially broken.
In the present disclosure, the specific structure of the second conductive trace 220 is not particularly limited. For example, the second conductive trace 220 can be made of a metal material.
As an optional implementation manner, the structure of the second conductive trace is the same as that of the first conductive trace. That is, on the cross section of the second trace groove, the opening size of the second trace groove does not exceed the size of the middle part of the second trace groove, the bottom size of the second trace groove opening does not exceed the size of the middle part of the second trace groove, and the outer surface of the second conductive trace 220 is attached to the surface of the second trace groove.
Further, as shown in fig. 7, the second conductive trace 220 includes a second organic conductive layer 221, a second metal conductive layer 222, and a second organic conductive core 223, the second organic conductive layer 221 is attached on a surface of the corresponding second trace groove, the second organic conductive layer 221 defines a third receiving space, the second metal conductive layer 222 is disposed in the third receiving space, the second metal conductive layer 222 defines a fourth receiving space, and the second organic conductive core 223 is received in the fourth receiving space.
As a second aspect of the present disclosure, there is provided a manufacturing method of a flexible circuit board, wherein, as shown in fig. 8, the manufacturing method includes:
in step S210, a first flexible substrate body is provided;
in step S220, at least one first trace groove is formed on the first flexible substrate body, and on a cross section of the first trace groove, an opening size of the first trace groove does not exceed a size of a middle portion of the first trace groove, and a bottom size of the first trace groove opening does not exceed a size of the middle portion of the first trace groove;
in step S230, forming corresponding first conductive traces in each first trace groove, respectively, and attaching an outer surface of the first conductive trace to a surface of the first trace groove to obtain a first flexible substrate;
in step S240, a second flexible substrate is formed on the first flexible substrate to perform insulation packaging on the first conductive trace.
The flexible circuit board provided by the first aspect of the disclosure can be formed by using the manufacturing method, and the principle and the beneficial effects of the flexible circuit board are described in detail in the first aspect, and are not described in detail herein.
In the present disclosure, the second flexible substrate may be formed on the first flexible substrate by means of insulating layer coating or imprinting.
As an alternative implementation, the step S230 of forming a corresponding first conductive trace in each of the first trace grooves includes:
in step S231, forming a first organic conductive layer on the first flexible substrate body formed with the first trace groove;
in step S232, patterning the first organic conductive layer to obtain corresponding first organic conductive layers in the first routing grooves, where the first organic conductive layers are attached to the surfaces of the corresponding first routing grooves, and a first accommodating space is defined by the first organic conductive layers;
in step S233, a metal conductive layer is formed;
in step S234, performing a patterning process on the metal conductive layers to form corresponding first metal conductive layers in the first accommodating spaces, respectively, wherein the first metal conductive layers define second accommodating spaces;
in step S235, a second organic conductive layer is formed;
in step S236, the second organic conductive layer is patterned to form first organic conductive cores in the respective second receiving spaces.
As described above, the first and second organic conductive layers may be made of PEDOT material doped with nano-metal conductive particles.
The conductive metal layer may be formed of a metal or alloy having good conductivity, such as copper or aluminum.
In the present disclosure, step S220 is not particularly limited. As an alternative embodiment, step S220 may include:
forming an inorganic layer on the first flexible substrate body in a chemical vapor deposition mode, wherein the inorganic layer is made of silicon nitride and/or silicon dioxide;
patterning the inorganic layer into a hard mask by a photolithography process;
dry etching is carried out on the first flexible substrate body under the action of the hard mask, and the first wiring groove is formed on the first flexible substrate by controlling process parameters in the dry etching process;
and removing the hard mask.
When the structure of the second conductive trace on the second flexible substrate is the same as the structure of the first conductive trace on the first flexible conductive substrate, the second flexible substrate can be formed by the same process as the first flexible substrate.
It is to be understood that the above embodiments are merely exemplary embodiments that are employed to illustrate the principles of the present disclosure, and that the present disclosure is not limited thereto. It will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the disclosure, and these are to be considered as the scope of the disclosure.

Claims (10)

1.一种柔性电路板，所述柔性电路板包括第一柔性基板和与该第一柔性基板贴合的第二柔性基板，其特征在于，所述第一柔性基板包括第一柔性基体层、形成在所述第一柔性基体层上的至少一条第一走线凹槽以及至少一条第一导电走线，所述第一导电走线设置在相应的第一走线凹槽中，在所述第一走线凹槽的横截面上，所述第一走线凹槽的开口尺寸不超过所述第一走线凹槽中部的尺寸，且所述第一走线凹槽开口的底部尺寸不超过所述第一走线凹槽中部的尺寸，所述第一导电走线的外表面与所述第一走线凹槽的表面贴合。1. A flexible circuit board, the flexible circuit board comprising a first flexible substrate and a second flexible substrate attached to the first flexible substrate, wherein the first flexible substrate comprises a first flexible base layer, At least one first routing groove and at least one first conductive trace are formed on the first flexible base layer, the first conductive traces are arranged in the corresponding first routing grooves, and the On the cross section of the first routing groove, the size of the opening of the first routing groove does not exceed the size of the middle of the first routing groove, and the size of the bottom of the opening of the first routing groove does not exceed the size of the middle of the first routing groove. Exceeding the size of the middle portion of the first routing groove, the outer surface of the first conductive trace is abutted with the surface of the first routing groove. 2.根据权利要求1所述的柔性电路板，其特征在于，所述第一导电走线包括第一有机导电层、第一金属导层、以及第一有机导电芯，所述第一有机导电层贴合在相应的第一走线凹槽的表面上，且所述第一有机导电层限定有第一容纳空间，所述第一金属导电层设置在所述第一容纳空间中，且所述第一金属导电层限定有第二容纳空间，所述第一有机导电芯容纳在所述第二容纳空间中。2 . The flexible circuit board according to claim 1 , wherein the first conductive trace comprises a first organic conductive layer, a first metal conductive layer, and a first organic conductive core, and the first organic conductive The layer is attached to the surface of the corresponding first wiring groove, and the first organic conductive layer defines a first accommodation space, the first metal conductive layer is arranged in the first accommodation space, and the The first metal conductive layer defines a second accommodating space, and the first organic conductive core is accommodated in the second accommodating space. 3.根据权利要求1所述的柔性电路板，其特征在于，第一柔性基板包括至少一个第一走线组，每个所述第一走线组包括多条延伸方向一致、且并列设置的第一导电走线，且同一个第一走线组中的多条第一导电走线互相电连接。3 . The flexible circuit board according to claim 1 , wherein the first flexible substrate comprises at least one first wiring group, and each of the first wiring groups comprises a plurality of parallel wirings arranged in the same extension direction. 4 . The first conductive wires are electrically connected to each other in the same first wire group. 4.根据权利要求3所述的柔性电路板，其特征在于，所述第一走线组还包括至少一条第一连接走线，所述第一连接走线连接在相邻两条第一导电走线之间。4 . The flexible circuit board according to claim 3 , wherein the first wire group further comprises at least one first connection wire, and the first connection wire is connected to two adjacent first conductive wires. 5 . between the lines. 5.根据权利要求1所述的柔性电路板，其特征在于，所述柔性电路板包括至少一个第二走线组，所述第二走线组包括多条第一走线以及至少一条第二连接走线，在同一个第二走线组中，多条所述第一走线沿同一延伸方向依次设置，且相邻两条第一走线的相邻端部之间存在间隔，所述间隔的宽度方向与所述第一走线的延伸方向相交，相邻两条所述第一走线通过所述第二连接走线电连接，所述第二连接走线设置在所述第一柔性基板和/或所述第二柔性基板中。5 . The flexible circuit board according to claim 1 , wherein the flexible circuit board comprises at least one second wire group, and the second wire group comprises a plurality of first wires and at least one second wire. 6 . Connecting wirings, in the same second wiring group, a plurality of the first wirings are arranged in sequence along the same extending direction, and there is a gap between adjacent ends of two adjacent first wirings, the The width direction of the interval intersects with the extending direction of the first traces, and two adjacent first traces are electrically connected through the second connection traces, and the second connection traces are arranged on the first traces. in the flexible substrate and/or the second flexible substrate. 6.根据权利要求1至5中任意一项所述的柔性电路板，其特征在于，所述第二柔性基板包括第二柔性基体层、形成在所述第二柔性基体层上的至少一条第二走线凹槽以及至少一条第二导电走线，所述第二导电走线设置在相应的第二走线凹槽中，每条所述第一导电走线对应有至少一条所述第二导电走线，且所述第二导电走线与相应的第一导电走线电连接。6 . The flexible circuit board according to claim 1 , wherein the second flexible substrate comprises a second flexible base layer, at least one first strip formed on the second flexible base layer. 7 . Two routing grooves and at least one second conductive trace, the second conductive traces are arranged in the corresponding second routing grooves, and each of the first conductive traces corresponds to at least one second conductive trace Conductive traces, and the second conductive traces are electrically connected to the corresponding first conductive traces. 7.根据权利要求6所述的柔性电路板，其特征在于，在所述第二走线凹槽的横截面上，所述第二走线凹槽的开口尺寸不超过所述第二走线凹槽中部的尺寸，且所述第二走线凹槽开口的底部尺寸不超过所述第二走线凹槽中部的尺寸，所述第二导电走线的外表面与所述第二走线凹槽的表面贴合。7 . The flexible circuit board according to claim 6 , wherein, on the cross section of the second wiring groove, the size of the opening of the second wiring groove does not exceed the size of the second wiring. 8 . The size of the middle of the groove, and the size of the bottom of the opening of the second routing groove does not exceed the size of the middle of the second routing groove, the outer surface of the second conductive trace and the second trace The grooved surface fits. 8.根据权利要求7所述的柔性电路板，其特征在于，所述第二导电走线包括第二有机导电层、第二金属导层、以及第二有机导电芯，所述第二有机导电层贴合在相应的第二走线凹槽的表面上，且所述第二有机导电层限定有第三容纳空间，所述第二金属导电层设置在所述第三容纳空间中，且所述第二金属导电层限定有第四纳空间，所述第二有机导电芯容纳在所述第四容纳空间中。8 . The flexible circuit board according to claim 7 , wherein the second conductive trace comprises a second organic conductive layer, a second metal conductive layer, and a second organic conductive core, and the second organic conductive The layer is attached to the surface of the corresponding second wiring groove, and the second organic conductive layer defines a third accommodating space, the second metal conductive layer is arranged in the third accommodating space, and the The second metal conductive layer defines a fourth nano-space, and the second organic conductive core is accommodated in the fourth accommodating space. 9.一种柔性电路板的制造方法，其特征在于，所述制造方法包括：9. A manufacturing method of a flexible circuit board, wherein the manufacturing method comprises: 提供第一柔性基底本体；providing a first flexible base body; 在所述第一柔性基底本体上形成至少一条第一走线凹槽，在所述第一走线凹槽的横截面上，所述第一走线凹槽的开口尺寸不超过所述第一走线凹槽中部的尺寸，且所述第一走线凹槽开口的底部尺寸不超过所述第一走线凹槽中部的尺寸；At least one first routing groove is formed on the first flexible base body, and on the cross section of the first routing groove, the size of the opening of the first routing groove does not exceed the size of the first routing groove. The size of the middle part of the routing groove, and the size of the bottom of the opening of the first routing groove does not exceed the size of the middle part of the first routing groove; 在各条所述第一走线凹槽中分别形成相应的第一导电走线，所述第一导电走线的外表面与所述第一走线凹槽的表面贴合，以获得第一柔性基底；Corresponding first conductive traces are respectively formed in each of the first trace grooves, and the outer surface of the first conductive trace is attached to the surface of the first trace groove to obtain the first trace. flexible substrate; 在所述第一柔性基底上形成第二柔性基板，以对所述第一导电走线进行绝缘封装。A second flexible substrate is formed on the first flexible substrate to insulate and encapsulate the first conductive traces. 10.根据权利要求9所述的制造方法，其特征在于，在各条所述第一走线凹槽中分别形成相应的第一导电走线的步骤包括：10 . The manufacturing method according to claim 9 , wherein the step of respectively forming corresponding first conductive traces in each of the first trace grooves comprises: 10 . 在形成有所述第一走线凹槽的第一柔性基底本体上形成第一有机导电层；forming a first organic conductive layer on the first flexible substrate body formed with the first wiring groove; 对所述第一有机导电层进行图形化，以在各个第一走线凹槽中分别获得相应的第一有机导电层，所述第一有机导电层贴合在相应的第一走线凹槽的表面上，且所述第一有机导电层限定有第一容纳空间；The first organic conductive layer is patterned to obtain a corresponding first organic conductive layer in each of the first wiring grooves, and the first organic conductive layer is attached to the corresponding first wiring groove on the surface, and the first organic conductive layer defines a first accommodating space; 形成金属导电层；forming a metal conductive layer; 对所述金属导电层进行图形化处理，以在各个所述第一容纳空间中分别形成相应的第一金属导电层，所述第一金属导电层限定有第二容纳空间；performing a patterning process on the metal conductive layer to form a corresponding first metal conductive layer in each of the first accommodating spaces, wherein the first metal conductive layer defines a second accommodating space; 形成第二有机导电层；forming a second organic conductive layer; 对所述第二有机导电层进行图形化，以在各个所述第二容纳空间中分别形成第一有机导电芯。The second organic conductive layer is patterned to form first organic conductive cores in each of the second accommodating spaces, respectively.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5717556A (en) * 1995-04-26 1998-02-10 Nec Corporation Printed-wiring board having plural parallel-connected interconnections
US6490169B1 (en) * 1999-12-15 2002-12-03 Yazaki Corporation Conductive circuit structure having an electrically conductive surface fixed by collar walls
CN1798481A (en) * 2004-12-27 2006-07-05 三之星机带株式会社 Method for producing inorganic pattern on polyimide resin
CN103338589A (en) * 2013-05-30 2013-10-02 南昌欧菲光科技有限公司 Flexible circuit connecting component

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5717556A (en) * 1995-04-26 1998-02-10 Nec Corporation Printed-wiring board having plural parallel-connected interconnections
US6490169B1 (en) * 1999-12-15 2002-12-03 Yazaki Corporation Conductive circuit structure having an electrically conductive surface fixed by collar walls
CN1798481A (en) * 2004-12-27 2006-07-05 三之星机带株式会社 Method for producing inorganic pattern on polyimide resin
CN103338589A (en) * 2013-05-30 2013-10-02 南昌欧菲光科技有限公司 Flexible circuit connecting component

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