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CN113490109B - Acoustic module and electronic equipment - Google Patents

Acoustic module and electronic equipment Download PDF

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Publication number
CN113490109B
CN113490109B CN202110762957.XA CN202110762957A CN113490109B CN 113490109 B CN113490109 B CN 113490109B CN 202110762957 A CN202110762957 A CN 202110762957A CN 113490109 B CN113490109 B CN 113490109B
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diaphragm
shell
acoustic module
speaker unit
tuning
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CN113490109A (en
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李乐乐
蒋国珠
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Vivo Mobile Communication Co Ltd
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Vivo Mobile Communication Co Ltd
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/20Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 

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  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

The application discloses an acoustic module and electronic equipment, and belongs to the technical field of audio. The disclosed acoustic module comprises a first shell and a loudspeaker monomer, wherein the first shell is provided with a first accommodating cavity, and the loudspeaker monomer is arranged in the first accommodating cavity; the loudspeaker unit comprises a first vibrating diaphragm, and the first vibrating diaphragm limits the first accommodating cavity into a front sound cavity and a rear sound cavity; the acoustic module comprises a second vibrating diaphragm, the second vibrating diaphragm is arranged in the rear sound cavity, a sealed tuning space is defined in the rear sound cavity, tuning medium is filled in the tuning space, and the density of the tuning medium is smaller than that of air. The scheme can improve the low-frequency performance of the acoustic module and effectively reduce the resonance peak of the frequency response.

Description

声学模组及电子设备Acoustic modules and electronic equipment

技术领域Technical Field

本申请属于音频技术领域,具体涉及一种声学模组及电子设备。The present application belongs to the field of audio technology, and specifically relates to an acoustic module and an electronic device.

背景技术Background technique

随着技术的进步,手机、平板电脑等电子设备的性能不断提升,其中,随着用户对视听功能的要求越来越高,进而需要提升扬声器模组的品质。With the advancement of technology, the performance of electronic devices such as mobile phones and tablets has been continuously improved. Among them, as users' requirements for audio-visual functions become higher and higher, the quality of speaker modules needs to be improved.

在相关技术中,扬声器模组包括壳体和扬声器单体,扬声器单体将壳体分为前音腔和后音腔,业内采用在后音腔中填充吸音材料来提升低频性能,但该方式操作过程较为繁琐,且带来的低频性能提升有限,同时还会导致扬声器模组出现较高的频响谐振峰而影响整体声学性能。In the related art, the speaker module includes a shell and a speaker unit. The speaker unit divides the shell into a front sound cavity and a rear sound cavity. The industry adopts filling the rear sound cavity with sound-absorbing materials to improve the low-frequency performance. However, the operation process of this method is relatively cumbersome and the improvement in low-frequency performance is limited. At the same time, it will also cause the speaker module to have a higher frequency response resonance peak and affect the overall acoustic performance.

发明内容Summary of the invention

本申请实施例的目的是提供一种声学模组及电子设备,以提升声学模组的低频性能,并有效降低频响谐振峰。The purpose of the embodiments of the present application is to provide an acoustic module and an electronic device to improve the low-frequency performance of the acoustic module and effectively reduce the frequency response resonance peak.

为了解决上述技术问题,本申请是这样实现的:In order to solve the above technical problems, this application is implemented as follows:

第一方面,本申请实施例提供了一种声学模组,其包括第一壳体和扬声器单体,所述第一壳体具有第一收容腔,所述扬声器单体设置于所述第一收容腔;所述扬声器单体包括第一振膜,所述第一振膜将所述第一收容腔限定出前音腔和后音腔;In a first aspect, an embodiment of the present application provides an acoustic module, which includes a first housing and a speaker unit, wherein the first housing has a first receiving cavity, and the speaker unit is disposed in the first receiving cavity; the speaker unit includes a first diaphragm, and the first diaphragm defines a front sound cavity and a rear sound cavity in the first receiving cavity;

所述声学模组包括第二振膜,所述第二振膜设置于所述后音腔,并在所述后音腔内限定出密封的调谐空间,所述调谐空间内填充有调谐介质,所述调谐介质的密度小于空气密度。The acoustic module includes a second diaphragm, which is arranged in the rear sound cavity and defines a sealed tuning space in the rear sound cavity. The tuning space is filled with a tuning medium, and the density of the tuning medium is less than the density of air.

第二方面,本申请实施例提供了一种电子设备,其包括本申请实施例第一方面所提供的声学模组,所述电子设备包括第一外壳、第二外壳和功能器件,所述第一外壳和所述第二外壳组合形成第二收容腔,所述功能器件和所述声学模组定位设置于所述第二收容腔。In a second aspect, an embodiment of the present application provides an electronic device, which includes the acoustic module provided in the first aspect of the embodiment of the present application, the electronic device includes a first shell, a second shell and a functional device, the first shell and the second shell are combined to form a second receiving cavity, and the functional device and the acoustic module are positioned in the second receiving cavity.

在本申请实施例中,由于第二振膜在后音腔内限定出密封的调谐空间,当扬声器单体工作时,后音腔内的声波会作用于第二振膜而驱动第二振膜振动;同时,由于调谐空间内的调谐介质的密度小于空气密度,第二振膜在振动时调谐介质的等效顺性在低频段能够产生正顺性,其能够拉升低频而提升声学模组的低频性能;正是由于调谐介质的密度小于空气密度,第二振膜在振动时难以与第一振膜的频率相匹配,特别是在高频段,第二振膜在调谐空间的振动能够产生反谐振,其能够有效压低扬声器单体的谐振峰而降低声学模组的频响谐振峰,进而改善音质失真、优化声学模组的声学性能。In the embodiment of the present application, since the second diaphragm defines a sealed tuning space in the rear sound cavity, when the speaker unit is working, the sound waves in the rear sound cavity will act on the second diaphragm and drive the second diaphragm to vibrate; at the same time, since the density of the tuning medium in the tuning space is less than the density of air, the equivalent compliance of the tuning medium can produce positive compliance in the low frequency band when the second diaphragm vibrates, which can pull up the low frequency and improve the low frequency performance of the acoustic module; precisely because the density of the tuning medium is less than the density of air, the second diaphragm is difficult to match the frequency of the first diaphragm when vibrating, especially in the high frequency band, the vibration of the second diaphragm in the tuning space can produce anti-resonance, which can effectively lower the resonance peak of the speaker unit and reduce the frequency response resonance peak of the acoustic module, thereby improving sound quality distortion and optimizing the acoustic performance of the acoustic module.

附图说明BRIEF DESCRIPTION OF THE DRAWINGS

图1为本申请实施例公开的声学模组的分解结构示意图;FIG1 is a schematic diagram of the exploded structure of an acoustic module disclosed in an embodiment of the present application;

图2为本申请实施例公开的声学模组的轴测剖视图;FIG2 is an isometric cross-sectional view of the acoustic module disclosed in an embodiment of the present application;

图3为关于图2中A处的局部放大图;FIG3 is a partial enlarged view of point A in FIG2 ;

图4为本申请实施例公开的电子设备的局部剖视图;FIG4 is a partial cross-sectional view of an electronic device disclosed in an embodiment of the present application;

图5为本申请实施例公开的声学模组的电学类比示意图;FIG5 is an electrical analog schematic diagram of the acoustic module disclosed in the embodiment of the present application;

图6为本申请实施例公开的声学模组的变化力顺与频率的关系示意图;FIG6 is a schematic diagram showing the relationship between the changing force compliance and the frequency of the acoustic module disclosed in the embodiment of the present application;

图7为本申请实施例公开的声学模组与相关技术的频率响应曲线的对比图。FIG. 7 is a comparison diagram of the frequency response curves of the acoustic module disclosed in the embodiment of the present application and the related art.

附图标记说明:Description of reference numerals:

100-第一壳体、110-第一子壳、120-第二子壳、100-first housing, 110-first sub-housing, 120-second sub-housing,

200-扬声器单体、210-第一振膜、200-speaker unit, 210-first diaphragm,

300-增效组件、310-第二振膜、320-第二壳体、330-调谐质量块、300-synergistic component, 310-second diaphragm, 320-second shell, 330-tuning mass block,

400-承载台、410-台阶部、400-carrying platform, 410-step part,

500-防尘件、500-Dustproof parts,

600-第一外壳、700-第二外壳、800-屏幕、900-电池、600-first shell, 700-second shell, 800-screen, 900-battery,

C1-前音腔、C2-后音腔、C3-调谐空间、C4-第二收容腔、C1-front sound cavity, C2-rear sound cavity, C3-tuning space, C4-second receiving cavity,

G1-振动间隙、G2-安装槽、P-导音通道、H-出音孔。G1-vibration gap, G2-installation slot, P-sound guide channel, H-sound outlet hole.

具体实施方式Detailed ways

下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚地描述,显然,所描述的实施例是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域普通技术人员获得的所有其他实施例,都属于本申请保护的范围。The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象,而不用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换,以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施,且“第一”、“第二”等所区分的对象通常为一类,并不限定对象的个数,例如第一对象可以是一个,也可以是多个。此外,说明书以及权利要求中“和/或”表示所连接对象的至少其中之一,字符“/”,一般表示前后关联对象是一种“或”的关系。The terms "first", "second", etc. in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and/or" in the specification and claims represents at least one of the connected objects, and the character "/" generally indicates that the objects associated with each other are in an "or" relationship.

以下结合附图,详细说明本申请实施例公开的技术方案。The technical solution disclosed in the embodiments of the present application is described in detail below in conjunction with the accompanying drawings.

为了解决相关技术中扬声器存在的低频性能较差、频响谐振峰较高的技术问题,本申请实施例提供一种声学模组。如图1~图4,本申请实施例所公开的声学模组包括第一壳体100、扬声器单体200和第二振膜310。在本申请实施例中,声学模组的具体类型可以有多种,例如喇叭、听筒、耳机等,本申请实施例对其不做限制。In order to solve the technical problems of poor low-frequency performance and high frequency response resonance peak of the speaker in the related art, the embodiment of the present application provides an acoustic module. As shown in Figures 1 to 4, the acoustic module disclosed in the embodiment of the present application includes a first shell 100, a speaker unit 200 and a second diaphragm 310. In the embodiment of the present application, there can be many specific types of acoustic modules, such as speakers, receivers, headphones, etc., which are not limited in the embodiment of the present application.

其中,第一壳体100是声学模组的基础构件,其为声学模组的其他构件提供了安装基础,也起到一定的防护功能。具体地,如图1和图2所示,第一壳体100具有第一收容腔,扬声器单体200和第二振膜310均设置于第一收容腔内。为了便于实现拆装,第一壳体100可以包括第一子壳110和第二子壳120,第一子壳110和第二子壳120组合形成第一收容腔;在图1和图2的实施方式中,在组装时,将扬声器单体200和第二振膜310首先安装于第一子壳110上,再将第二子壳120扣合对接在第一子壳110上,即实现声学模组的组装;需要对声学模组进行检修维护时,将第二子壳120从第一子壳110上卸下即可。Among them, the first shell 100 is the basic component of the acoustic module, which provides an installation foundation for other components of the acoustic module and also plays a certain protective function. Specifically, as shown in Figures 1 and 2, the first shell 100 has a first receiving cavity, and the speaker unit 200 and the second diaphragm 310 are both arranged in the first receiving cavity. In order to facilitate disassembly and assembly, the first shell 100 may include a first sub-shell 110 and a second sub-shell 120, and the first sub-shell 110 and the second sub-shell 120 are combined to form a first receiving cavity; in the embodiments of Figures 1 and 2, during assembly, the speaker unit 200 and the second diaphragm 310 are first installed on the first sub-shell 110, and then the second sub-shell 120 is snap-fitted and docked on the first sub-shell 110, that is, the assembly of the acoustic module is realized; when the acoustic module needs to be inspected and maintained, the second sub-shell 120 can be removed from the first sub-shell 110.

扬声器单体200是声学模组的主要发声构件,其包括第一振膜210,扬声器单体200在工作时会驱动第一振膜210振动,第一振膜210会推动第一收容腔内的空气而产生声波,第一壳体100设置有与外部连通的导音通道P,且导音通道P与第一收容腔连通,则扬声器单体200产生的声波可以通过导音通道P而传出。当然,为了能够正常发声,第一振膜210将第一收容腔限定出前音腔C1和后音腔C2,第一振膜210通过交替朝向前音腔C1和后音腔C2振动而产生声波。The speaker unit 200 is the main sound-generating component of the acoustic module, which includes a first diaphragm 210. When the speaker unit 200 is working, it will drive the first diaphragm 210 to vibrate. The first diaphragm 210 will push the air in the first receiving cavity to generate sound waves. The first shell 100 is provided with a sound guide channel P connected to the outside, and the sound guide channel P is connected to the first receiving cavity, so the sound waves generated by the speaker unit 200 can be transmitted through the sound guide channel P. Of course, in order to be able to sound normally, the first diaphragm 210 defines the first receiving cavity into a front sound cavity C1 and a rear sound cavity C2, and the first diaphragm 210 generates sound waves by vibrating alternately toward the front sound cavity C1 and the rear sound cavity C2.

本申请实施例的第二振膜310设置于后音腔C2,并在后音腔C2内限定出密封的调谐空间C3,调谐空间C3内填充有调谐介质,调谐介质的密度小于空气密度。The second diaphragm 310 of the embodiment of the present application is disposed in the rear sound cavity C2 and defines a sealed tuning space C3 in the rear sound cavity C2. The tuning space C3 is filled with a tuning medium, and the density of the tuning medium is less than the density of air.

应理解的是,基于第二振膜310的设置形式,第二振膜310也将后音腔C2分隔为调谐空间C3和另一个腔室,当第一振膜210振动时,其在后音腔C2产生的声波会传播至第二振膜310,并推动第二振膜310振动,振动的第二振膜310会挤压调谐空间C3内的调谐介质,在第一振膜210和第二振膜310的双重振动下,进而提升声学模组的低频性能。具体地,第二振膜310在振动时调谐空间C3内的调谐介质的等效顺性是随频率变化的复合顺性,但总体而言,调谐介质的等效顺性能够在低频段产生正顺性,进而达到拉升低频而提升声学模组的低频性能。It should be understood that, based on the arrangement of the second diaphragm 310, the second diaphragm 310 also divides the rear sound cavity C2 into the tuning space C3 and another chamber. When the first diaphragm 210 vibrates, the sound waves generated in the rear sound cavity C2 will propagate to the second diaphragm 310 and push the second diaphragm 310 to vibrate. The vibrating second diaphragm 310 will squeeze the tuning medium in the tuning space C3. Under the dual vibration of the first diaphragm 210 and the second diaphragm 310, the low-frequency performance of the acoustic module is improved. Specifically, when the second diaphragm 310 vibrates, the equivalent compliance of the tuning medium in the tuning space C3 is a composite compliance that varies with frequency, but in general, the equivalent compliance of the tuning medium can produce positive compliance in the low-frequency band, thereby achieving the goal of pulling up the low frequency and improving the low-frequency performance of the acoustic module.

与此同时,由于调谐介质的密度小于空气密度,当第二振膜310振动时其频率会逐渐与第一振膜210的频率趋于不同,在频率逐渐升高的过程中,二者之间的频率匹配度也会越来越低;在进入到高频段后,第二振膜310在调谐空间C3的振动会产生与扬声器单体200的谐振峰相反的反谐振,第二振膜310的反谐振会阻碍吸收并压低扬声器单体200的谐振峰,这样就使得声学模组整体的频响谐振峰被降低,最终达到改善音质失真、优化声学模组的声学性能的目的。At the same time, since the density of the tuning medium is less than the density of air, when the second diaphragm 310 vibrates, its frequency will gradually become different from the frequency of the first diaphragm 210. In the process of gradually increasing frequency, the frequency matching degree between the two will become lower and lower; after entering the high frequency band, the vibration of the second diaphragm 310 in the tuning space C3 will produce an anti-resonance opposite to the resonance peak of the speaker unit 200. The anti-resonance of the second diaphragm 310 will hinder the absorption and lower the resonance peak of the speaker unit 200, thereby reducing the overall frequency response resonance peak of the acoustic module, thereby achieving the purpose of improving sound quality distortion and optimizing the acoustic performance of the acoustic module.

在本申请实施例中,调谐介质的类型可以有多种,其可选为氦气和氖气,氦气和氖气均属于惰性气体,它们具备优秀的安全可靠性;或者,调谐介质也可选为氢气、氨气等其他密度小于空气的气体,但基于安全考虑,它们的适用性会较低;但是,基于实现本申请实施例中调谐介质的作用的前提,上述气体均能够满足要求。In the embodiment of the present application, there can be multiple types of tuning media, which can be selected as helium and neon. Both helium and neon are inert gases with excellent safety and reliability. Alternatively, the tuning medium can also be selected as hydrogen, ammonia and other gases with a density less than that of air, but due to safety considerations, their applicability will be lower. However, based on the premise of realizing the role of the tuning medium in the embodiment of the present application, the above gases can meet the requirements.

由上述说明可知,在本申请实施例中,由于第二振膜310在后音腔C2内限定出密封的调谐空间C3,当扬声器单体200工作时,后音腔C2内的声波会作用于第二振膜310而驱动第二振膜310振动;同时,由于调谐空间C3内的调谐介质的密度小于空气密度,第二振膜310在振动时调谐介质的等效顺性在低频段能够产生正顺性,其能够拉升低频而提升声学模组的低频性能;正是由于调谐介质的密度小于空气密度,第二振膜310在振动时难以与第一振膜210的频率相匹配,特别是在高频段,第二振膜310在调谐空间C3的振动能够产生反谐振,其能够有效压低扬声器单体200的谐振峰而降低声学模组的频响谐振峰,进而改善音质失真、优化声学模组的声学性能。It can be seen from the above description that in the embodiment of the present application, since the second diaphragm 310 defines a sealed tuning space C3 in the rear sound cavity C2, when the speaker unit 200 is working, the sound waves in the rear sound cavity C2 will act on the second diaphragm 310 and drive the second diaphragm 310 to vibrate; at the same time, since the density of the tuning medium in the tuning space C3 is less than the density of air, the equivalent compliance of the tuning medium when the second diaphragm 310 vibrates can produce positive compliance in the low frequency band, which can pull up the low frequency and improve the low frequency performance of the acoustic module; precisely because the density of the tuning medium is less than the density of air, the second diaphragm 310 is difficult to match the frequency of the first diaphragm 210 when vibrating, especially in the high frequency band, the vibration of the second diaphragm 310 in the tuning space C3 can produce anti-resonance, which can effectively lower the resonance peak of the speaker unit 200 and reduce the frequency response resonance peak of the acoustic module, thereby improving the sound quality distortion and optimizing the acoustic performance of the acoustic module.

如图1~图3所示,本申请实施例的声学模组可以包括增效组件300,增效组件300包括第二振膜310、调谐介质和第二壳体320,第二振膜310与第二壳体320之间限定出调谐空间C3。As shown in FIGS. 1 to 3 , the acoustic module of the embodiment of the present application may include an enhancement component 300 , which includes a second diaphragm 310 , a tuning medium, and a second shell 320 , wherein a tuning space C3 is defined between the second diaphragm 310 and the second shell 320 .

应理解的是,在前述的后音腔C2未设置第二壳体320的实施方式中,第二振膜310可以通过与第一壳体100的内壁之间限定出调谐空间C3,该方案复用了第一壳体100的内壁而提升了结构紧凑性,但会导致安装成本变高。在本实施方式中,第二振膜310、调谐介质和第二壳体320组合形成增效组件300,这样就将增效组件300设计为一个模块化组件,其内部始终构造有填充有调谐介质的调谐空间C3,因此,在声学模组的组装过程中,仅需要将该增效组件300固定在后音腔C2中即可,而不需要考虑如何设置第二振膜310来构造调谐空间C3以及如何填充调谐介质的问题,由此可见,该增效组件300无疑简化了安装过程而降低了安装成本。同时,模块化的增效组件300也便于批量生产,进而降低制造成本。It should be understood that in the aforementioned embodiment where the rear sound cavity C2 is not provided with the second shell 320, the second diaphragm 310 can define a tuning space C3 with the inner wall of the first shell 100. This solution reuses the inner wall of the first shell 100 to improve the compactness of the structure, but will result in higher installation costs. In this embodiment, the second diaphragm 310, the tuning medium and the second shell 320 are combined to form an enhancement component 300, so that the enhancement component 300 is designed as a modular component, and the tuning space C3 filled with the tuning medium is always constructed inside. Therefore, during the assembly process of the acoustic module, it is only necessary to fix the enhancement component 300 in the rear sound cavity C2, without considering how to set the second diaphragm 310 to construct the tuning space C3 and how to fill the tuning medium. It can be seen that the enhancement component 300 undoubtedly simplifies the installation process and reduces the installation cost. At the same time, the modular enhancement component 300 is also convenient for mass production, thereby reducing manufacturing costs.

为了强化第二振膜310的振动效果,如图1~图3所示,本申请实施例的增效组件300还可以包括调谐质量块330,调谐质量块330设置于第二振膜310上。应理解的是,调谐质量块330具有一定的质量,其增加了第二振膜310上的负载,进而会改变第二振膜310的振动频率和振动幅度,以达到强化第二振膜310的振动效果。在第二振膜310的振动效果被强化的基础上,增效组件300无疑能够进一步地提升声学模组的低频性能和进一步地降低声学模组的频响谐振峰。In order to strengthen the vibration effect of the second diaphragm 310, as shown in FIGS. 1 to 3, the enhancement component 300 of the embodiment of the present application may also include a tuning mass block 330, which is disposed on the second diaphragm 310. It should be understood that the tuning mass block 330 has a certain mass, which increases the load on the second diaphragm 310, thereby changing the vibration frequency and vibration amplitude of the second diaphragm 310 to achieve the purpose of strengthening the vibration effect of the second diaphragm 310. On the basis of strengthening the vibration effect of the second diaphragm 310, the enhancement component 300 can undoubtedly further improve the low-frequency performance of the acoustic module and further reduce the frequency response resonance peak of the acoustic module.

当然,本申请实施例的第二振膜310的边缘区域可以设置有折环,通过折环可进一步强化第二振膜310的振动效果。Of course, the edge area of the second diaphragm 310 in the embodiment of the present application may be provided with a folding ring, and the vibration effect of the second diaphragm 310 may be further enhanced by the folding ring.

在上述的增效组件300包括调谐质量块330的实施方式中,为了对本申请实施例的声学模组的有益效果进行论证,本申请实施例进行了电力声类比,具体内容如下:In the above-mentioned embodiment where the enhancement component 300 includes the tuning mass block 330, in order to demonstrate the beneficial effects of the acoustic module of the embodiment of the present application, the embodiment of the present application performs an electric power-acoustic analogy, and the specific contents are as follows:

如图5所示,图5示出了声学模组的电学类比示意图,其中,C0为原始系统(未设置增效组件300时)的力顺,虚线框内为增加的增效组件300,Cm为增效组件300中的第二振膜310的声容(声顺),Mm为增效组件300中调谐质量块330的质量,Rm为增效组件300的声阻,C2为增效组件300内调谐介质的声顺,P为调谐空间C3内的气压,U为体积流速度。As shown in FIG5 , FIG5 shows an electrical analogy schematic diagram of the acoustic module, wherein C 0 is the force compliance of the original system (when the enhancement component 300 is not set), the dotted frame is the added enhancement component 300, C m is the acoustic capacitance (acoustic compliance) of the second diaphragm 310 in the enhancement component 300, M m is the mass of the tuning mass block 330 in the enhancement component 300, R m is the acoustic resistance of the enhancement component 300, C 2 is the acoustic compliance of the tuning medium in the enhancement component 300, P is the air pressure in the tuning space C3, and U is the volume flow velocity.

进行电力声类比:Cm-Cm,Mm-L,Rm-R,P-Ee,U-I;其中,L为电感,R为电阻,Ee为电动势,I为电流。Make an electric-acoustic analogy: Cm - Cm , Mm -L, Rm -R, P-Ee, UI; where L is inductance, R is resistance, Ee is electromotive force, and I is current.

系统原始阻抗为:The original impedance of the system is:

增加增效组件300后,其阻抗为:After adding 300 booster components, the impedance is:

定义等效力顺Ceff,则Define the equivalent force order C eff , then

but

定义增效组件300的谐振频率ω0Define the resonant frequency ω 0 of the synergistic assembly 300,

but

分母有理化后取实部,After rationalizing the denominator, take the real part.

make

but

Re(Ceff)=C0+ΔCeff Re(C eff )=C 0 +ΔC eff

由上述推导可知,相较于原始系统,本申请实施例的声学模组能够在原始力顺C0上附加了一个随驱动频率ω变化的可变力顺ΔCeff,因此,只需要控制各参数,即可改变可变力顺ΔCeff的数值,当可变力顺ΔCeff为正值时,则声学模组的整体力顺变大,当可变力顺ΔCeff为负值时,则声学模组的整体力顺变小。From the above derivation, it can be seen that compared with the original system, the acoustic module of the embodiment of the present application can add a variable force compliance ΔC eff that changes with the driving frequency ω to the original force compliance C 0. Therefore, it is only necessary to control various parameters to change the value of the variable force compliance ΔC eff . When the variable force compliance ΔC eff is a positive value, the overall force compliance of the acoustic module becomes larger. When the variable force compliance ΔC eff is a negative value, the overall force compliance of the acoustic module becomes smaller.

在式中,电感L、电阻R和增效组件300的谐振频率ω0,可以对应通过调谐质量块330的质量、增效组件300的声阻和第二振膜310的振动频率来任意实现组合变化。In-style In the embodiment, the inductance L, the resistance R and the resonant frequency ω 0 of the enhancement component 300 can be arbitrarily combined and changed by correspondingly tuning the mass of the mass block 330 , the acoustic impedance of the enhancement component 300 and the vibration frequency of the second diaphragm 310 .

可选地,设置以下参数:Optionally, set the following parameters:

变量variable 数值(国标单位)Value (national standard unit) L(对应Mm)L(corresponding to Mm) 50e-650e-6 R(对应Rm)R(corresponding to Rm) 10e-310e-3 ω0 ω 0 40004000

进而得到ΔCeff和驱动频率ω之间的关系如图6所示。The relationship between ΔC eff and the driving frequency ω is shown in FIG6 .

基于图6可知,加入该增效组件300后,增效组件300所包括的调谐介质的等效顺性是随频率变化的复合顺性,其可在低频段产生正顺性,进而能起到降低后腔整体顺性、降低f0及拉升低频的作用;同时,在高频段区域,其能够产生一个与扬声器单体200的谐振峰相反的反谐振,其能够压低高频谐振峰fh处的峰值(可参见图7),进而达到降低杂音、改善失真,最终实现对声学模组的声学性能的优化。Based on FIG6 , it can be seen that after adding the enhancement component 300, the equivalent compliance of the tuning medium included in the enhancement component 300 is a composite compliance that varies with frequency, which can produce positive compliance in the low-frequency band, thereby reducing the overall compliance of the rear cavity, reducing f0 and pulling up the low frequency; at the same time, in the high-frequency band area, it can produce an anti-resonance opposite to the resonance peak of the speaker unit 200, which can lower the peak value at the high-frequency resonance peak fh (see FIG7 ), thereby reducing noise, improving distortion, and ultimately optimizing the acoustic performance of the acoustic module.

为了便于设置扬声器单体200,如图1~图3所示,本申请实施例的第一收容腔内可以设置有承载台400,承载台400用于支撑安装扬声器单体200的至少部分边缘,承载台400即是扬声器单体200的安装基础,由于扬声器单体200的第一振膜210将第一收容腔分隔为前音腔C1和后音腔C2,则承载台400也位于前音腔C1和后音腔C2之间,其辅助实现对第一收容腔的分隔。To facilitate the installation of the speaker unit 200, as shown in FIGS. 1 to 3, a supporting platform 400 may be provided in the first receiving cavity of the embodiment of the present application. The supporting platform 400 is used to support at least part of the edge of the speaker unit 200 for installation. The supporting platform 400 is the installation base of the speaker unit 200. Since the first diaphragm 210 of the speaker unit 200 divides the first receiving cavity into the front sound cavity C1 and the rear sound cavity C2, the supporting platform 400 is also located between the front sound cavity C1 and the rear sound cavity C2, which assists in realizing the separation of the first receiving cavity.

同时,本申请实施例的承载台400与第一壳体100之间可以限定出与增效组件300相匹配的安装槽G2,增效组件300设置于安装槽G2内。如此设置下,承载台400对增效组件300起到支挡作用,能够对增效组件300起到限位作用,因此,本申请实施例的承载台400实现了功能复用,如此有利于提升声学模组内部的结构紧凑性。At the same time, a mounting groove G2 matching the synergistic component 300 can be defined between the carrier 400 and the first shell 100 of the embodiment of the present application, and the synergistic component 300 is arranged in the mounting groove G2. In this arrangement, the carrier 400 supports the synergistic component 300 and can limit the synergistic component 300. Therefore, the carrier 400 of the embodiment of the present application realizes functional reuse, which is conducive to improving the compactness of the structure inside the acoustic module.

应理解的是,本申请实施例的承载台400可以被配置为支撑扬声器单体200的部分边缘,扬声器的其他边缘可以由第一壳体100内壁外延形成的支撑结构来支撑,或者,本申请实施例的承载台400可以被配置为支撑扬声器单体200的全部边缘。It should be understood that the support platform 400 of the embodiment of the present application can be configured to support a partial edge of the speaker unit 200, and the other edges of the speaker can be supported by a supporting structure formed by the extension of the inner wall of the first shell 100, or the support platform 400 of the embodiment of the present application can be configured to support the entire edge of the speaker unit 200.

本申请实施例未限制增效组件300的形状,其可以为方形体、圆柱体等各种形状构型;当然,随着增效组件300的形状改变,安装槽G2可适应性调整形状来适配增效组件300。The embodiment of the present application does not limit the shape of the enhancement component 300, which may be a square body, a cylinder, or other shapes. Of course, as the shape of the enhancement component 300 changes, the mounting groove G2 may adaptively adjust its shape to fit the enhancement component 300.

本申请实施例也未限制增效组件300的具体设置位置,如图4所示,增效组件300设置于第一壳体100的底壁,在其他的实施方式中,在第二振膜310朝向后音腔C2的前提下,增效组件300可以设置于第一壳体100的顶壁、侧壁等区域。The embodiment of the present application also does not limit the specific setting position of the enhancement component 300. As shown in FIG. 4, the enhancement component 300 is set on the bottom wall of the first shell 100. In other embodiments, under the premise that the second diaphragm 310 faces the rear sound cavity C2, the enhancement component 300 can be set on the top wall, side wall and other areas of the first shell 100.

进一步地,为了提升扬声器单体200的安装稳定性,如图1和图3所示,本申请实施例的承载台400在朝向扬声器单体200的一侧端面设置有台阶部410,台阶部410的形状与扬声器单体200的形状相匹配,扬声器单体200安装于台阶部410上。应理解的是,台阶部410包括底面和侧面,台阶部410的底面可以对扬声器单体200进行支撑,台阶部410的侧面则对扬声器单体200的外周面进行限位约束,以对扬声器单体200进行止动,进而提升了扬声器单体200的安装稳定性;如此设置下,即便是第一振膜210在较高频率下振动,也不会导致扬声器单体200产生移位。Furthermore, in order to improve the installation stability of the speaker unit 200, as shown in FIG1 and FIG3, the supporting platform 400 of the embodiment of the present application is provided with a step portion 410 on the end surface of one side facing the speaker unit 200, and the shape of the step portion 410 matches the shape of the speaker unit 200, and the speaker unit 200 is installed on the step portion 410. It should be understood that the step portion 410 includes a bottom surface and a side surface, the bottom surface of the step portion 410 can support the speaker unit 200, and the side surface of the step portion 410 limits the outer peripheral surface of the speaker unit 200 to stop the speaker unit 200, thereby improving the installation stability of the speaker unit 200; under such a setting, even if the first diaphragm 210 vibrates at a higher frequency, it will not cause the speaker unit 200 to shift.

如图2和图4所示,本申请实施例的第一振膜210可以与第二振膜310相平行。应理解的是,第二振膜310是在第一振膜210振动产生的声波推动下而实现振动,在此种结构布局下,第二振膜310与第一振膜210的振动方向相同,更便于第一振膜210产生的声波对第二振膜310施加推动作用,进而有利于强化对增效组件300的驱动效果,以提升增效组件300的增效作用。As shown in FIG. 2 and FIG. 4 , the first diaphragm 210 of the embodiment of the present application can be parallel to the second diaphragm 310. It should be understood that the second diaphragm 310 is vibrated under the impetus of the sound waves generated by the vibration of the first diaphragm 210. Under this structural layout, the second diaphragm 310 and the first diaphragm 210 have the same vibration direction, which makes it easier for the sound waves generated by the first diaphragm 210 to exert a driving effect on the second diaphragm 310, thereby helping to strengthen the driving effect of the synergistic component 300, so as to enhance the synergistic effect of the synergistic component 300.

为了便于第二振膜310能够顺利实现振动,本申请实施例的第二振膜310与第一壳体100的第一内壁之间可以设置有振动间隙G1,振动间隙G1供第二振膜310进行振动,第一内壁为第一壳体100上与第二振膜310相对的内壁。应理解的是,一方面,本申请实施例的振动间隙G1为第二振膜310的振动动作提供了避让空间,由于振动间隙G1的存在,当第二振膜310朝向第一内壁振动时,就避免了第二振膜310振动至与第一内壁相接触,这样,第二振膜310就不会受到第一内壁的干涉,进而确保第二振膜310能够顺利振动;另一方面,该振动间隙G1还用于保证第二振膜310振动时气流的流畅,减少第二振膜受气压影响出现失真的情况。In order to facilitate the second diaphragm 310 to vibrate smoothly, a vibration gap G1 may be provided between the second diaphragm 310 and the first inner wall of the first shell 100 of the embodiment of the present application. The vibration gap G1 is for the second diaphragm 310 to vibrate. The first inner wall is the inner wall on the first shell 100 opposite to the second diaphragm 310. It should be understood that, on the one hand, the vibration gap G1 of the embodiment of the present application provides an escape space for the vibration action of the second diaphragm 310. Due to the existence of the vibration gap G1, when the second diaphragm 310 vibrates toward the first inner wall, the second diaphragm 310 is prevented from vibrating to contact with the first inner wall. In this way, the second diaphragm 310 will not be interfered by the first inner wall, thereby ensuring that the second diaphragm 310 can vibrate smoothly. On the other hand, the vibration gap G1 is also used to ensure the smoothness of the airflow when the second diaphragm 310 vibrates, reducing the distortion of the second diaphragm due to the influence of air pressure.

本申请实施例未限制振动间隙G1的具体尺寸,在可选的方案中,如图4所示,本申请实施例的第二振膜310与第一内壁之间的距离为a,a的取值范围可以为a≥0.2mm。如此设置下,本申请实施例的第二振膜310与第一内壁之间的距离a限定出了下限值0.2mm,只要a不低于0.2mm,第二振膜310即能够实现顺利振动,进而避免了将距离a设计加工得过低;同时,基于该设计要求,只要不低于0.2mm,距离a可以尽量设置得较小,这样能够提升声学模组的结构紧凑性。The embodiment of the present application does not limit the specific size of the vibration gap G1. In an optional solution, as shown in FIG4 , the distance between the second diaphragm 310 and the first inner wall of the embodiment of the present application is a, and the value range of a can be a ≥ 0.2 mm. In this setting, the distance a between the second diaphragm 310 and the first inner wall of the embodiment of the present application is limited to a lower limit of 0.2 mm. As long as a is not less than 0.2 mm, the second diaphragm 310 can achieve smooth vibration, thereby avoiding the design of the distance a being too low; at the same time, based on the design requirements, as long as it is not less than 0.2 mm, the distance a can be set as small as possible, which can improve the structural compactness of the acoustic module.

如图2所示,本申请实施例的第一壳体100设置有导音通道P,导音通道P与前音腔C1连通,导音通道P、扬声器单体200和增效组件300在第一壳体100内可以沿同一方向依次排布。具体而言,在此种结构布局下,导引通道、前音腔C1、扬声器单体200、后音腔C2和增效组件300均位于同一方向上,可见这样能够使得声学模组的结构布局更为规则,既便于加工又有利于提升声学模组的结构紧凑性。As shown in FIG2 , the first housing 100 of the embodiment of the present application is provided with a sound guide channel P, which is connected to the front sound cavity C1, and the sound guide channel P, the speaker unit 200 and the enhancement component 300 can be arranged in the same direction in sequence in the first housing 100. Specifically, under this structural layout, the guide channel, the front sound cavity C1, the speaker unit 200, the rear sound cavity C2 and the enhancement component 300 are all located in the same direction, which can make the structural layout of the acoustic module more regular, which is not only convenient for processing but also conducive to improving the structural compactness of the acoustic module.

同时,如此设置下,扬声器单体200在后音腔C2和前音腔C1产生的声波能够依次通过前音腔C1和导音通道P传播至声学模组之外,增效组件300的增效作用也位于上述结构的排布方向上,这样就避免声学模组内的声波沿弯折的传播路径传播而导致过量损耗,在声波的传播路径被缩短的情况下,无疑能够优化声学模组的音质。At the same time, under such a configuration, the sound waves generated by the speaker unit 200 in the rear sound cavity C2 and the front sound cavity C1 can be transmitted to the outside of the acoustic module through the front sound cavity C1 and the sound guide channel P in turn, and the enhancement effect of the enhancement component 300 is also located in the arrangement direction of the above-mentioned structure, thereby avoiding excessive loss caused by the sound waves in the acoustic module propagating along the tortuous propagation path. When the propagation path of the sound waves is shortened, the sound quality of the acoustic module can undoubtedly be optimized.

当然,本申请实施例未限制增效组件300的具体设置位置,其可以与扬声器单体200和/或导音通道P等错位设置。Of course, the embodiment of the present application does not limit the specific setting position of the enhancement component 300, which can be offset from the speaker unit 200 and/or the sound guide channel P.

如图4所示,基于前述的声学模组,本申请实施例还提供一种电子设备,其包括前述任一方案提及的声学模组,这样就使得该电子设备具有了前述任一方案的有益效果,在此不再赘述;电子设备包括第一外壳600、第二外壳700和功能器件,第一外壳600和第二外壳700组合形成第二收容腔C4,功能器件和声学模组定位设置于第二收容腔C4。As shown in Figure 4, based on the aforementioned acoustic module, an embodiment of the present application also provides an electronic device, which includes the acoustic module mentioned in any of the aforementioned schemes, so that the electronic device has the beneficial effects of any of the aforementioned schemes, which will not be repeated here; the electronic device includes a first shell 600, a second shell 700 and a functional device, the first shell 600 and the second shell 700 are combined to form a second receiving cavity C4, and the functional device and the acoustic module are positioned in the second receiving cavity C4.

其中,第一外壳600和第二外壳700是电子设备的基础构件,二者可拆卸设置而便于电子设备整体的拆装。第二收容腔C4是电子设备内部的安装空间,在功能器件和声学模组定位安装于第二收容腔C4,就完成了功能器件和声学模组的组装工序。The first housing 600 and the second housing 700 are basic components of the electronic device, and the two can be detachably arranged to facilitate the disassembly and assembly of the electronic device as a whole. The second receiving cavity C4 is the installation space inside the electronic device. When the functional device and the acoustic module are positioned and installed in the second receiving cavity C4, the assembly process of the functional device and the acoustic module is completed.

本申请实施例所指的电子设备可以是智能手机、平板电脑、电子书阅读器、可穿戴装置等设备,本申请实施例不限制电子设备的具体类型。The electronic device referred to in the embodiments of the present application may be a smart phone, a tablet computer, an e-book reader, a wearable device, or the like. The embodiments of the present application do not limit the specific type of the electronic device.

为了提升电子设备的结构紧凑性,本申请实施例的第一外壳600、第二外壳700和功能器件中的至少部分之间可以形成第一收容腔,声学模组的扬声器单体200和第二振膜310设置于第一收容腔。应理解的是,在此种结构布局下,声学模组的第一壳体100即被第一外壳600的内壁、第二外壳700的内壁和功能器件的外壁的至少部分所代替,由此可见,在简化了声学模组的结构的基础上,本申请实施例的电子设备还实现了其内部的部分结构的复用,这样无疑能够提升电子设备的结构紧凑性,进而符合轻薄化的设计理念。In order to improve the structural compactness of the electronic device, a first receiving cavity can be formed between the first housing 600, the second housing 700 and at least part of the functional device in the embodiment of the present application, and the speaker unit 200 and the second diaphragm 310 of the acoustic module are arranged in the first receiving cavity. It should be understood that under this structural layout, the first shell 100 of the acoustic module is replaced by at least part of the inner wall of the first housing 600, the inner wall of the second housing 700 and the outer wall of the functional device. It can be seen that on the basis of simplifying the structure of the acoustic module, the electronic device of the embodiment of the present application also realizes the reuse of part of its internal structure, which can undoubtedly improve the structural compactness of the electronic device and meet the design concept of thinness.

本实施例的未限制功能器件的具体类型,其可以包括但不限于电池900、主板、副板等。当然,在电子设备包括屏幕800的实施方式中,屏幕800也可以用于代替第一壳体100。The specific types of functional components are not limited in this embodiment, and may include but are not limited to a battery 900 , a main board, a sub-board, etc. Of course, in an embodiment where the electronic device includes a screen 800 , the screen 800 may also be used to replace the first housing 100 .

为了将声学模组发出的声波传播至电子设备之外,第一外壳600或第二外壳700上对应导音通道P的位置开设有出音孔H,出音孔H与导音通道P连通,以使得声波顺利传播至电子设备之外。In order to propagate the sound waves emitted by the acoustic module outside the electronic device, a sound outlet hole H is opened at a position corresponding to the sound guide channel P on the first shell 600 or the second shell 700, and the sound outlet hole H is connected to the sound guide channel P so that the sound waves can be smoothly propagated outside the electronic device.

为了避免电子设备外部的杂物(例如水渍、灰尘等)进入到电子设备内部,本实施例的导音通道可以设置有防尘件500;进一步地,防尘件500可以设置于第一壳体100对应导音通道P的区域,防尘件500的类型可以有多种,例如防尘网、防尘海绵、防尘布等。In order to prevent foreign matter outside the electronic device (such as water stains, dust, etc.) from entering the interior of the electronic device, the sound guide channel of this embodiment can be provided with a dustproof part 500; further, the dustproof part 500 can be arranged in the area of the first shell 100 corresponding to the sound guide channel P, and there can be various types of dustproof parts 500, such as a dustproof net, a dustproof sponge, a dustproof cloth, etc.

上面结合附图对本申请的实施例进行了描述,但是本申请并不局限于上述的具体实施方式,上述的具体实施方式仅仅是示意性的,而不是限制性的,本领域的普通技术人员在本申请的启示下,在不脱离本申请宗旨和权利要求所保护的范围情况下,还可做出很多形式,均属于本申请的保护之内。The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims (11)

1.一种声学模组,其特征在于,包括第一壳体、扬声器单体和增效组件,所述第一壳体具有第一收容腔,所述扬声器单体设置于所述第一收容腔;所述扬声器单体包括第一振膜,所述第一振膜将所述第一收容腔限定出前音腔和后音腔;1. An acoustic module, characterized in that it comprises a first housing, a speaker unit and an enhancement component, wherein the first housing has a first receiving cavity, and the speaker unit is disposed in the first receiving cavity; the speaker unit comprises a first diaphragm, and the first diaphragm defines a front sound cavity and a rear sound cavity in the first receiving cavity; 所述增效组件包括第二振膜、调谐介质和第二壳体,所述第二振膜设置于所述后音腔,所述第二振膜与所述第二壳体在所述后音腔内限定出密封的调谐空间,所述调谐空间内填充有调谐介质,所述调谐介质的密度小于空气密度。The enhancement component includes a second diaphragm, a tuning medium and a second shell. The second diaphragm is arranged in the rear sound cavity. The second diaphragm and the second shell define a sealed tuning space in the rear sound cavity. The tuning space is filled with a tuning medium, and the density of the tuning medium is less than the density of air. 2.根据权利要求1所述的声学模组,其特征在于,所述第一振膜与所述第二振膜相平行。2. The acoustic module according to claim 1, characterized in that the first diaphragm is parallel to the second diaphragm. 3.根据权利要求1所述的声学模组,其特征在于,所述调谐介质为氦气。3. The acoustic module according to claim 1, characterized in that the tuning medium is helium. 4.根据权利要求1所述的声学模组,其特征在于,所述第二振膜与所述第一壳体的第一内壁之间设置有振动间隙,所述振动间隙供所述第二振膜进行振动,所述第一内壁为所述第一壳体上与所述第二振膜相对的内壁。4. The acoustic module according to claim 1 is characterized in that a vibration gap is arranged between the second diaphragm and the first inner wall of the first shell, the vibration gap is provided for the second diaphragm to vibrate, and the first inner wall is the inner wall of the first shell opposite to the second diaphragm. 5.根据权利要求4所述的声学模组,其特征在于,所述第二振膜与所述第一内壁之间的距离为a,a的取值范围为a≥0.2mm。5 . The acoustic module according to claim 4 , wherein the distance between the second diaphragm and the first inner wall is a, and the value range of a is a≥0.2 mm. 6.根据权利要求1所述的声学模组,其特征在于,所述增效组件还包括调谐质量块,所述调谐质量块设置于所述第二振膜上。6. The acoustic module according to claim 1 is characterized in that the enhancement component further comprises a tuning mass block, and the tuning mass block is arranged on the second diaphragm. 7.根据权利要求1所述的声学模组,其特征在于,所述第一收容腔内设置有承载台,所述承载台用于支撑安装所述扬声器单体的至少部分边缘;所述承载台与所述第一壳体之间限定出与所述增效组件相匹配的安装槽,所述增效组件设置于所述安装槽内。7. The acoustic module according to claim 1 is characterized in that a supporting platform is arranged in the first receiving cavity, and the supporting platform is used to support and install at least a part of the edge of the speaker unit; an installation groove matching the enhancement component is defined between the supporting platform and the first shell, and the enhancement component is arranged in the installation groove. 8.根据权利要求7所述的声学模组,其特征在于,所述承载台在朝向所述扬声器单体的一侧端面设置有台阶部,所述台阶部的形状与所述扬声器单体的形状相匹配,所述扬声器单体安装于所述台阶部上。8. The acoustic module according to claim 7 is characterized in that the supporting platform is provided with a step portion on the end surface of one side facing the speaker unit, the shape of the step portion matches the shape of the speaker unit, and the speaker unit is installed on the step portion. 9.根据权利要求1所述的声学模组,其特征在于,所述第一壳体设置有导音通道,所述导音通道与所述前音腔连通,所述导音通道、所述扬声器单体和所述增效组件在所述第一壳体内沿同一方向依次排布。9. The acoustic module according to claim 1 is characterized in that the first shell is provided with a sound guide channel, the sound guide channel is connected to the front sound cavity, and the sound guide channel, the speaker unit and the enhancement component are arranged in sequence along the same direction in the first shell. 10.一种电子设备,其特征在于,包括权利要求1至9中任一项所述的声学模组,所述电子设备包括第一外壳、第二外壳和功能器件,所述第一外壳和所述第二外壳组合形成第二收容腔,所述功能器件和所述声学模组定位设置于所述第二收容腔。10. An electronic device, characterized in that it comprises the acoustic module described in any one of claims 1 to 9, the electronic device comprises a first shell, a second shell and a functional device, the first shell and the second shell are combined to form a second receiving cavity, and the functional device and the acoustic module are positioned in the second receiving cavity. 11.根据权利要求10所述的电子设备,其特征在于,所述第一外壳、所述第二外壳和所述功能器件中的至少部分之间形成所述第一收容腔,所述声学模组的扬声器单体和第二振膜设置于所述第一收容腔。11. The electronic device according to claim 10 is characterized in that the first receiving cavity is formed between the first shell, the second shell and at least part of the functional device, and the speaker unit and the second diaphragm of the acoustic module are arranged in the first receiving cavity.
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Publication number Priority date Publication date Assignee Title
CN114745460B (en) * 2022-04-26 2024-11-05 歌尔股份有限公司 Acoustic devices and terminal equipment
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CN220545134U (en) * 2023-05-16 2024-02-27 镇江贝斯特新材料股份有限公司 Low resonance enclosures and electronic equipment

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101317498A (en) * 2005-11-30 2008-12-03 索尼爱立信移动通讯股份有限公司 Speakerbox

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2010050068A1 (en) * 2008-10-31 2012-03-29 パイオニア株式会社 Speaker device and automobile
US8767994B2 (en) * 2010-11-19 2014-07-01 Apple Inc. Gas filled speaker volume
CN203039865U (en) * 2012-08-28 2013-07-03 比亚迪股份有限公司 Sound chamber device and electronic device using same
JP2014131139A (en) * 2012-12-28 2014-07-10 Sharp Corp Sealed speaker unit
CN104038855A (en) * 2014-06-04 2014-09-10 瑞声光电科技(常州)有限公司 Electric acoustic device and assembly method for same
CN104869522B (en) * 2015-06-03 2019-03-05 歌尔股份有限公司 Loudspeaker module packaging technical
CN106028238B (en) * 2016-07-07 2021-05-18 歌尔股份有限公司 Double-monomer loudspeaker module, design method thereof and electronic equipment
CN106101957B (en) * 2016-07-20 2019-10-22 瑞声科技(新加坡)有限公司 Loudspeaker enclosure
CN106162468A (en) * 2016-08-31 2016-11-23 歌尔股份有限公司 Speaker module
CN107277711A (en) * 2017-06-29 2017-10-20 维沃移动通信有限公司 A kind of sound cavity apparatus and mobile terminal
CN108882126B (en) * 2018-08-02 2020-07-14 瑞声科技(新加坡)有限公司 Loudspeaker box
CN213818184U (en) * 2019-12-27 2021-07-27 楼氏电子(苏州)有限公司 Acoustic transducer and microphone assembly

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101317498A (en) * 2005-11-30 2008-12-03 索尼爱立信移动通讯股份有限公司 Speakerbox

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