CN113689969B - Single-row transposed conductor and preparation method thereof - Google Patents
Single-row transposed conductor and preparation method thereof Download PDFInfo
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- CN113689969B CN113689969B CN202110790154.5A CN202110790154A CN113689969B CN 113689969 B CN113689969 B CN 113689969B CN 202110790154 A CN202110790154 A CN 202110790154A CN 113689969 B CN113689969 B CN 113689969B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/06—Insulating conductors or cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/02—Disposition of insulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
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Abstract
The invention discloses a single-row transposed conductor, which comprises a conductor and a transposition part, wherein the conductor and the transposition part are both composed of the following raw materials: the raw materials comprise the following components in percentage by weight: 65% of copper, 30% of steel, 2% of alumina, 2% of silicon micropowder and 1% of microcrystalline graphite; when the transposed conductor is prepared, the traditional transposition mode of the transposition part from the top is changed, the transposition direction of the transposition part is creatively changed into two sides from the top, when the transposition part is bent, one bending mode with the traditional bending mode is not needed, only the transposition part is bent approximately, the bending range of the formed arc part is not required, the processing technology is greatly reduced, meanwhile, the surface smoothness of the transposed conductor is ensured, and the difficulty of subsequent wrapping work is greatly reduced.
Description
Technical Field
The invention relates to the technical field of transposed conductors, in particular to a single-column transposed conductor and a preparation method thereof.
Background
The winding of the large-scale power transformer adopts the transposed conductor, so that the load loss can be greatly reduced, the hot point temperature rise of the winding is reduced, the mechanical strength of the winding is improved, the structure is more compact, and the coil is more convenient to process.
Compared with the common flat wire, the transposed conductor has a plurality of advantages, and the manufacturing cost of the transformer is reduced due to smaller external dimension.
The transposed conductors are mostly arranged in two rows of a plurality of flat conductors, the radial positions of the windings of each conductor are different, under the condition that the axial leakage magnetic fluxes corresponding to all the positions are unequal, the electromotive force generated by each conductor under the induction of the axial leakage magnetic fluxes is unequal, and the difference of the electromotive force can form circulation among the parallel conductors, so that the current density in the conductors is increased, the load loss is increased, even local overheating is generated, the heat of the local overheating is accumulated by the double-row arranged flat conductors, the speed of radiating the heat to the outside is slow, the load loss is larger and larger, and the service life is shortened;
in order to solve the problem of heat dissipation, the conventional transposed conductor is tried to be packaged by using a net, namely, a net strapping tape is used for replacing package insulation, but the conventional transposed conductor is only suitable for windings with lower turn-to-turn working field strength of 35kV or below, and the application range is low.
Meanwhile, when the transposition parts on two sides of the existing transposition wire are bent, the bending process is complex, and due to the material problem of the transposition wire, the transposition wire has certain toughness, is easy to loosen, has too low surface smoothness, and seriously influences subsequent binding work.
Therefore, a single-column transposed conductor and a preparation method thereof are provided.
Disclosure of Invention
The invention aims to provide a single-column transposed conductor and a preparation method thereof, which aim to solve the problems in the background art.
In order to achieve the purpose, the invention provides the following technical scheme: a single-row transposed conductor comprises a conductor and a transposition part, wherein the conductor and the transposition part are both composed of the following raw materials: the raw materials comprise the following components in percentage by weight: 65% of copper, 30% of steel, 2% of alumina, 2% of silicon micropowder and 1% of microcrystalline graphite;
the number of the wires is many, and is no less than sixteen, and is a plurality of the wires are parallelly connected and arranged, parallelly connected the range of the upper and lower both sides of wire are parallelly connected and are provided with two transposition portions, transposition portion bending type becomes arc portion, the outside cover of arc portion is equipped with the elasticity U-shaped clamp, the outside of wire is around being equipped with daniel pine paper, the through-hole has evenly been seted up in the outside of daniel pine paper.
As a further preferred aspect of the present invention: and a filling part is arranged between the arc part and the lead.
As a further preferred aspect of the present invention: the filling part is filled with an insulating filling layer.
A preparation method of a single-column transposed conductor comprises the following steps:
s1, arranging a plurality of wires in parallel, bending the transposition part to form an arc-shaped part, and fixing the arc-shaped part on two sides of the arc-shaped part by using elastic U-shaped clamps;
s2, filling the insulating filling layer in the filling part, and naturally cooling and forming;
s3, winding the Daniel pine paper on the outer side of the lead, wherein the number of winding layers is not less than n, and n is not less than 2;
s4, using a tapping machine to form through holes in m layers on the surface of the Denny pine paper, wherein m is less than n;
and S5, removing the elastic U-shaped clamp to obtain the single-row transposed conductor.
As a further preferred aspect of the present invention: in S1, before arranging the wires in parallel, the method further includes:
s11, melting copper and steel raw materials: respectively heating and melting copper and steel raw materials to obtain liquid molten steel and molten copper;
s12, screening the raw materials of alumina, silica micropowder and microcrystalline graphite: crushing the alumina, the silicon micropowder and the microcrystalline graphite, and sieving the crushed materials through a 350-450-mesh sieve to obtain a mixture with a powder structure;
s13, cooling and forming: pouring molten steel into a die, uniformly spreading a mixture with a powder structure to form a heat conduction layer, and cooling to room temperature to obtain a flat steel plate;
s14: copper electroplating solution: and (3) uniformly paving the copper liquid in the flat steel plate by using electroplating equipment to obtain the lead with high heat dissipation performance.
As a further preferred aspect of the present invention: in S13, the thickness of the heat conduction layer is 350-550um, and the thickness of the flat steel plate is 1.3-2.1mm.
As further preferable in the present technical solution: and in the S2, when the insulating filling layer is filled, melting the insulating filling layer into a liquid structure, placing the insulating filling layer below the filling part by using a mold, wherein the upper surface of the mold is smooth and flat, the contact part of the mold and the arc part is free of a gap, a cover plate is arranged above the arc part, the lower surface of the cover plate is smooth and flat, the contact part of the cover plate and the arc part is free of a gap, and cooling for 1.5-2 hours after pouring is finished.
As a further preferred aspect of the present invention: and in the step S5, the removed elastic U-shaped clamps are collected uniformly and recycled.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, the raw materials of the lead are changed, and copper is electroplated on the outer side of the steel, so that the lead has excellent electrical conductivity and corrosion resistance, high strength, low production cost and capability of saving a large amount of copper resources;
2. when the transposed conductor is prepared, the traditional transposition mode of the transposition part from the top is changed, the transposition direction of the transposition part is changed into two sides creatively, when the transposition part is bent, one bending mode with the traditional bending mode is not needed, the transposition part is only bent approximately, the bending range of the formed arc part is not required, the processing technology is greatly reduced, meanwhile, the surface smoothness of the transposed conductor is ensured, and the subsequent wrapping work difficulty is greatly reduced;
3. the Daniel pine paper insulation wrapping mode with more than two layers is arranged, and the through holes are formed in the surface of the Daniel pine paper through the hole opening machine, so that the insulation performance of the transposed conductor is ensured, the heat dissipation effect is improved, the Daniel pine paper insulation wrapping mode is different from the traditional net-wrapped transposed conductor and the traditional paper-wrapped transposed conductor, the heat dissipation effect of net-shaped wrapping is achieved, the insulation performance of the paper-wrapped transposed conductor is good, the Daniel pine paper insulation wrapping mode is suitable for windings of various high-strength interturn working fields, and the application range is wide.
Drawings
FIG. 1 is a schematic structural diagram of a transposed conductor S1 of the present invention;
FIG. 2 is a schematic view of a transposed conductor S2 of the present invention;
FIG. 3 is a schematic structural diagram of a transposed conductor S3 of the present invention;
FIG. 4 is a schematic structural diagram of a transposed conductor S4 of the present invention;
fig. 5 is a schematic structural view of a transposed conductor S5 of the present invention.
In the figure: 1. a wire; 2. a bit-shifting portion; 3. an arc-shaped portion; 4. a filling section; 5. an elastic U-shaped clamp; 6. an insulating filling layer; 7. daniel pine paper; 8. and a through hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples
Referring to fig. 1-5, the present invention provides a technical solution: a single-row transposed conductor comprises a conductor 1 and a transposition part 2, wherein the conductor 1 and the transposition part 2 are respectively composed of the following raw materials: the raw materials by weight percentage are: 65% of copper, 30% of steel, 2% of alumina, 2% of silicon micropowder and 1% of microcrystalline graphite;
the quantity of wire 1 is many, and is no less than sixteen, and a plurality of wires 1 are parallelly connected to be arranged, and the upper and lower both sides of the wire 1 of parallelly connected range are parallelly connected and are provided with two transposition portion 2, and 2 bending type of transposition portion become arc portion 3, and the outside cover of arc portion 3 is equipped with elasticity U-shaped clamp 5, and the outside of wire 1 is around being equipped with daniel pine paper 7, and through-hole 8 has evenly been seted up in the outside of daniel pine paper 7.
In this embodiment, specifically: a filling part 4 is arranged between the arc part 3 and the lead 1.
In this embodiment, specifically: the inside of the filling part 4 is filled with an insulating filling layer 6; the insulating filling layer 6 filled in the filling part 4 is used for insulation and supports the space in the filling part 4, thereby improving the overall stability.
A preparation method of a single-column transposed conductor comprises the following steps:
s1, arranging a plurality of wires 1 in parallel, bending a transposition part 2 to form an arc part 3, and clamping and fixing the arc part 3 at two sides by using an elastic U-shaped clamp 5;
s2, filling the insulating filling layer 6 in the filling part 4, and naturally cooling and forming;
s3, winding the Daniel pine paper 7 on the outer side of the lead 1, wherein the number of layers is not less than n, and n is not less than 2;
s4, forming through holes 8 in the m layers on the surface of the Deny pine paper 7 by using a tapping machine, wherein m is less than n;
and S5, removing the elastic U-shaped clamp 5 to obtain the single-row transposed conductor.
In this embodiment, specifically: in S1, before arranging the wires 1 in parallel, the method further includes the steps of:
s11, melting copper and steel raw materials: respectively heating and melting copper and steel raw materials to obtain liquid molten steel and molten copper;
s12, screening the raw materials of alumina, silica micropowder and microcrystalline graphite: crushing the alumina, the silicon micropowder and the microcrystalline graphite, and sieving the crushed materials with a 350-mesh sieve to obtain a mixture with a powdery structure;
s13, cooling and forming: pouring molten steel into a die, uniformly spreading a mixture with a powder structure to form a heat conduction layer, and cooling to room temperature to obtain a flat steel plate;
s14: copper electroplating solution: and (3) uniformly paving the copper liquid in the flat steel plate by using electroplating equipment to obtain the lead 1 with high heat dissipation performance.
In this embodiment, specifically: in S13, the heat conductive layer has a thickness of 350um, and the flat steel plate has a thickness of 1.3mm.
In this embodiment, specifically: in S2, when the insulating filling layer 6 is filled, melting the insulating filling layer 6 into a liquid structure, placing the liquid structure below the filling part 4 by using a mold, wherein the upper surface of the mold is smooth and flat, the contact part of the mold and the arc part 3 is free of a gap, a cover plate is arranged above the arc part 3, the lower surface of the cover plate is smooth and flat, the contact part of the cover plate and the arc part 3 is free of a gap, and cooling for 1.5 hours after pouring is finished; the surface of the transposed conductor is ensured to be smooth, and subsequent processing is not hindered.
In this embodiment, specifically: in S5, the removed elastic U-shaped clamps 5 are collected uniformly and recycled; used for saving processing resources.
Example two
Referring to fig. 1-5, the present invention further provides an embodiment, which is different from the first embodiment:
a single-column transposed conductor comprises a conductor 1 and a transposition part 2, wherein the conductor 1 and the transposition part 2 are respectively composed of the following raw materials: the raw materials by weight percentage are: 55% of copper, 40% of steel, 2% of alumina, 2% of silicon micropowder and 1% of microcrystalline graphite;
a preparation method of a single-column transposed conductor comprises the following steps:
s1, arranging a plurality of wires 1 in parallel, bending a transposition part 2 to form an arc-shaped part 3, and clamping two sides of the arc-shaped part 3 by using an elastic U-shaped clamp 5;
s2, filling the insulating filling layer 6 in the filling part 4, and naturally cooling and forming;
s3, winding the Daniel pine paper 7 on the outer side of the lead 1, wherein the number of winding layers is not less than n, and n is not less than 2;
s4, a hole opening machine is used for forming through holes 8 in the m layer on the surface of the Denny pine paper 7, wherein m is smaller than n;
and S5, removing the elastic U-shaped clamp 5 to obtain the single-row transposed conductor.
In this embodiment, specifically: in S1, before arranging the wires 1 in parallel, the method further includes the steps of:
s11, melting copper and steel raw materials: respectively heating and melting copper and steel raw materials to obtain liquid molten steel and molten copper;
s12, screening the raw materials of alumina, silica micropowder and microcrystalline graphite: crushing the aluminum oxide, the silicon micropowder and the microcrystalline graphite, and sieving with a 400-mesh sieve to obtain a mixture with a powdery structure;
s13, cooling and forming: pouring molten steel into a die, uniformly spreading a mixture with a powder structure to form a heat conduction layer, and cooling to room temperature to obtain a flat steel plate;
s14: copper electroplating solution: and (3) uniformly paving the copper liquid in the flat steel plate by using electroplating equipment to obtain the lead 1 with high heat dissipation performance.
In this embodiment, specifically: in S13, the heat conductive layer has a thickness of 450um, and the flat steel plate has a thickness of 1.7mm.
In this embodiment, specifically: in S2, when the insulating filling layer 6 is filled, the insulating filling layer 6 is melted into a liquid structure, the mold is placed below the filling part 4, the upper surface of the mold is smooth and flat, a gap is not formed between the upper surface of the mold and the contact part of the mold and the arc part 3, a cover plate is arranged above the arc part 3, the lower surface of the cover plate is smooth and flat, a gap is not formed between the lower surface of the cover plate and the contact part of the cover plate and the arc part 3, and after pouring is finished, the cooling is carried out for 1.8 hours.
In this embodiment, specifically: in S5, the removed elastic clevises 5 are collected together and recycled.
EXAMPLE III
Referring to fig. 1-5, the present invention further provides an embodiment, which is different from the first embodiment:
a single-row transposed conductor comprises a conductor 1 and a transposition part 2, wherein the conductor 1 and the transposition part 2 are respectively composed of the following raw materials: the raw materials by weight percentage are: 45% of copper, 45% of steel, 4% of aluminum oxide, 4% of silicon micropowder and 2% of microcrystalline graphite;
a preparation method of a single-column transposed conductor comprises the following steps:
s1, arranging a plurality of wires 1 in parallel, bending a transposition part 2 to form an arc-shaped part 3, and clamping two sides of the arc-shaped part 3 by using an elastic U-shaped clamp 5;
s2, filling the insulating filling layer 6 in the filling part 4, and naturally cooling and forming;
s3, winding the Daniel pine paper 7 on the outer side of the lead 1, wherein the number of winding layers is not less than n, and n is not less than 2;
s4, a hole opening machine is used for forming through holes 8 in the m layer on the surface of the Denny pine paper 7, wherein m is smaller than n;
and S5, removing the elastic U-shaped clamp 5 to obtain the single-row transposed conductor.
In this embodiment, specifically: in S1, before arranging the wires 1 in parallel, the method further includes the steps of:
s11, melting copper and steel raw materials: respectively heating and melting copper and steel raw materials to obtain liquid molten steel and molten copper;
s12, screening the raw materials of alumina, silica micropowder and microcrystalline graphite: crushing the aluminum oxide, the silicon micropowder and the microcrystalline graphite, and sieving the crushed materials with a 450-mesh sieve to obtain a mixture with a powdery structure;
s13, cooling and forming: pouring molten steel into a die, uniformly spreading a mixture with a powder structure to form a heat conduction layer, and cooling to room temperature to obtain a flat steel plate;
s14: copper electroplating solution: and (3) uniformly paving the copper liquid in the flat steel plate by using electroplating equipment to obtain the lead 1 with high heat dissipation performance.
In this embodiment, specifically: in S13, the heat conductive layer has a thickness of 550um, and the flat steel plate has a thickness of 2.1mm.
In this embodiment, specifically: in S2, when the insulating filling layer 6 is filled, the insulating filling layer 6 is melted into a liquid structure, the mold is placed below the filling part 4, the upper surface of the mold is smooth and flat, a gap is not formed between the upper surface of the mold and the contact part of the mold and the arc part 3, a cover plate is arranged above the arc part 3, the lower surface of the cover plate is smooth and flat, a gap is not formed between the lower surface of the cover plate and the contact part of the cover plate and the arc part 3, and after the pouring is finished, the cooling is carried out for 2 hours.
In this embodiment, specifically: in S5, the removed elastic clevises 5 are collected together and recycled.
According to the working principle or the structural principle, when the lead is used, the raw materials of the lead 1 are changed, and copper is electroplated on the outer side of steel, so that the lead 1 has excellent electrical conductivity and corrosion resistance, high strength and low production cost, a large amount of copper resources can be saved, and in addition, alumina, silicon micropowder and microcrystalline graphite with high thermal conductivity are laid between the steel and the copper, the high electrical conductivity of the material is ensured, the heat dissipation capacity of the lead 1 is improved, the power transmission capacity is large, the power transmission efficiency is high, and the power transmission safety is high;
when the transposed conductor is prepared, the traditional transposition mode of the transposition part 2 from the top is changed, the transposition direction of the transposition part 2 is changed into two sides creatively, when the transposition part 2 is bent, one bending mode is not needed compared with the traditional bending mode, only the transposition part 2 is bent approximately, the bending range of the formed arc-shaped part 3 is not required, the processing technology is greatly reduced, meanwhile, the surface smoothness of the transposed conductor is ensured, and the subsequent wrapping work difficulty is greatly reduced;
according to the invention, through arranging Daniel pine paper insulation wrapping in a wrapping mode with more than two layers and arranging the through holes on the surface of the Daniel pine paper through the tapping machine, the insulation performance of the transposed conductor is ensured, and the heat dissipation effect is also improved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A single-column transposed conductor comprises a conductor (1) and a transposition part (2), and is characterized in that: the lead (1) and the transposition part (2) are respectively composed of the following raw materials: the raw materials comprise the following components in percentage by weight: 45-65% of copper, 30-45% of steel, 2-4% of alumina, 2-4% of silicon micropowder and 1-2% of microcrystalline graphite;
the quantity of wire (1) is many, and is no less than sixteen, and is a plurality of wire (1) parallel arrangement, parallel arrangement the upper and lower both sides of wire (1) are parallelly connected and are provided with two transposition portion (2), transposition portion (2) bending type becomes arc portion (3), elastic U-shaped clamp (5) are established to the outside cover of arc portion (3), the outside of wire (1) is around being equipped with dannie pine paper (7), through-hole (8) have evenly been seted up in the outside of dannie pine paper (7).
2. The single-column transposed conductor of claim 1, wherein: and a filling part (4) is arranged between the arc part (3) and the lead (1).
3. The single-column transposed conductor of claim 2, wherein: the filling part (4) is filled with an insulating filling layer (6).
4. A preparation method of a single-column transposed conductor is characterized by comprising the following steps: the method comprises the following steps:
s1, arranging a plurality of wires (1) in parallel, bending a transposition part (2) to form an arc-shaped part (3), and clamping and fixing the arc-shaped part (3) at two sides by using an elastic U-shaped clamp (5);
s2, filling an insulating filling layer (6) in the filling part (4), and naturally cooling and forming;
s3, winding the Daniel pine paper (7) on the outer side of the lead (1), wherein the number of winding layers is not less than n, and n is not less than 2;
s4, a hole opening machine is used for forming through holes (8) in the m layers on the surface of the Denny paper (7), wherein m is smaller than n;
and S5, removing the elastic U-shaped clamp (5) to obtain the single-row transposed conductor.
5. The method for preparing a single-column transposed conductor according to claim 4, characterized in that: in S1, before arranging the wires (1) in parallel, the method further includes the steps of:
s11, melting copper and steel raw materials: respectively heating and melting copper and steel raw materials to obtain liquid molten steel and molten copper;
s12, screening the raw materials of alumina, silica micropowder and microcrystalline graphite: crushing the alumina, the silicon micropowder and the microcrystalline graphite, and sieving the crushed materials through a 350-450-mesh sieve to obtain a mixture with a powder structure;
s13, cooling and forming: pouring the molten steel into a mold, uniformly spreading a mixture with a powder structure to form a heat conduction layer, and cooling to room temperature to obtain a flat steel plate;
s14: copper electroplating solution: and (3) uniformly paving the copper liquid in the flat steel plate by using electroplating equipment to obtain the lead (1) with high heat dissipation performance.
6. The method for preparing a single-column transposed conductor according to claim 5, wherein: in S13, the thickness of the heat conduction layer is 350-550um, and the thickness of the flat steel plate is 1.3-2.1mm.
7. The method for preparing a single-column transposed conductor according to claim 4, wherein: and in the S2, when the insulating filling layer (6) is filled, melting the insulating filling layer (6) into a liquid structure, placing the insulating filling layer below the filling part (4) by using a mold, wherein the upper surface of the mold is smooth and flat, the contact part of the mold and the arc part (3) is free of a gap, a cover plate is arranged above the arc part (3), the lower surface of the cover plate is smooth and flat, the contact part of the cover plate and the arc part (3) is free of a gap, and cooling is carried out for 1.5-2h after pouring is finished.
8. The method for preparing a single-column transposed conductor according to claim 4, wherein: and in the S5, the removed elastic U-shaped clamps (5) are collected uniformly and recycled.
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| CN108109727A (en) * | 2017-12-07 | 2018-06-01 | 扬州苏昌机电有限公司 | A kind of exhausted self-adhering-type enameled transposition conductor of paper |
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| CN1969344A (en) * | 2004-06-17 | 2007-05-23 | 3M创新有限公司 | Cable and its manufacturing method |
| CN2752923Y (en) * | 2004-11-30 | 2006-01-18 | 保定天威集团有限公司 | Voltage transformer transposition conductive wire |
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