CN113905530B - Positioning and manufacturing method of printed circuit board - Google Patents
Positioning and manufacturing method of printed circuit board Download PDFInfo
- Publication number
- CN113905530B CN113905530B CN202111229716.5A CN202111229716A CN113905530B CN 113905530 B CN113905530 B CN 113905530B CN 202111229716 A CN202111229716 A CN 202111229716A CN 113905530 B CN113905530 B CN 113905530B
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- printed circuit
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 238000003801 milling Methods 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims abstract description 14
- 238000005520 cutting process Methods 0.000 claims abstract description 4
- 241001079814 Symphyotrichum pilosum Species 0.000 claims description 7
- 235000004224 Typha angustifolia Nutrition 0.000 claims description 7
- 239000000696 magnetic material Substances 0.000 claims description 2
- 230000005389 magnetism Effects 0.000 claims description 2
- 238000001125 extrusion Methods 0.000 claims 4
- 238000007599 discharging Methods 0.000 claims 1
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- JAYCNKDKIKZTAF-UHFFFAOYSA-N 1-chloro-2-(2-chlorophenyl)benzene Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1Cl JAYCNKDKIKZTAF-UHFFFAOYSA-N 0.000 description 4
- 101100084627 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) pcb-4 gene Proteins 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Automatic Assembly (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
The invention relates to a positioning and manufacturing method of a printed circuit board, which comprises the following steps: the method comprises the steps of setting a plurality of base plates on an automatic milling machine, fixing a semi-finished printed circuit board on the base plates through a plurality of pins, cutting the semi-finished printed circuit board into a plurality of finished circuit boards through milling action of a milling cutter of the automatic milling machine, taking out the pins one by one, and then taking down the finished circuit boards from the base plates to complete the whole manufacturing process.
Description
Technical Field
The invention relates to a manufacturing method of a printed circuit board, in particular to a manufacturing method for positioning the whole printed circuit board through pins and then cutting.
Background
As shown in fig. 1, in order to improve the manufacturing efficiency of the finished PCB, the whole PCB is manufactured at present, and then the whole PCB is integrally placed on an automatic milling machine for milling and dividing to obtain an independent finished PCB.
As shown in fig. 1, the automatic milling machine generally includes a workbench and a milling cutter 2, the milling cutter 2 is located above the workbench, a backing plate 3 is fixed on the workbench, during working, the whole PCB 4 is fixedly placed on the backing plate 3, the milling cutter 2 moves down and performs milling action to divide the whole PCB 4 into a plurality of independent PCB finished products 5, and finally, the independent PCB finished products 5 are taken down one by one, thereby completing the whole milling division work.
In order to ensure the stability of the PCB board during the milling operation, the positioning is performed by the pins 6 in the conventional machining manner, which is described in detail below.
The backing plate 3 is provided with backing plate holes 7, four corners of each PCB finished product 5 are provided with finished product plate holes 8, and pins 6 are simultaneously inserted into the finished product plate holes 8 and the backing plate holes 7, so that the purpose of fixing the whole PCB 4 and each PCB finished product 5 on the backing plate 3 is achieved.
However, the foregoing operation has various drawbacks when implemented, and will now be described separately. Firstly, when the pins 6 are inserted, the pins are inserted one by utilizing hammer tools through striking, the working efficiency is extremely low, meanwhile, the situation that the base plate 3 and the PCB 4 are damaged often occurs, secondly, when the pins 6 are removed, the pins are pulled out one by utilizing pliers tools in a hard pulling mode, the working efficiency is extremely low, meanwhile, the situation that the base plate and the PCB are scrapped due to breakage of the pins in holes often occurs, and the situation is the main defect of the prior art.
Disclosure of Invention
The technical scheme adopted by the invention is as follows: a positioning manufacturing method of a printed circuit board comprises the following steps: the method comprises the steps of setting a plurality of base plates on an automatic milling machine, fixing a semi-finished printed circuit board on the base plates through a plurality of pins, performing milling action by a milling cutter of the automatic milling machine, cutting the semi-finished printed circuit board into a plurality of finished circuit boards, taking out the pins one by one, and then taking down the finished circuit boards from the base plates to complete the whole manufacturing process.
In the second step, a plurality of pad holes are formed in the pad plate, a plurality of fixing holes are formed in the semi-finished printed circuit board corresponding to the pad plate holes, the fixing holes correspond to the pad plate holes, the fixing holes are formed in four corners of each finished circuit board, the pins are arranged in the fixing holes in a penetrating mode, the bottoms of the pins are screwed in the pad plate holes, accordingly the semi-finished printed circuit board is fixed on the pad plate, the pins comprise threaded assembling portions, taking out portions and screw rods, the threaded assembling portions are arranged at the bottoms of the screw rods, the taking out portions are arranged at the tops of the screw rods, the threaded assembling portions are used for being screwed in the pad plate holes, and the taking out portions are used for being matched with assembling tools to complete assembling and disassembling of the pins.
The beneficial effects of the invention are as follows: the manufacturing process of the pin is realized through the threaded assembling part and the taking-out part of the pin, wherein the threaded assembling part is used for being screwed in the backing plate hole, so that the pin can be assembled and disassembled conveniently, the taking-out part can be matched with an automatic disassembling assembler to complete the automatic assembling and the automatic disassembling of the pin, the threaded assembling part comprises an external thread, an internal thread is arranged in the backing plate hole, and the external thread is meshed in the internal thread.
Drawings
Fig. 1 is a schematic diagram of the operation of the prior art.
Fig. 2 is a schematic diagram of the operation of the present invention.
Fig. 3 is a schematic view of the pin of the present invention.
FIG. 4 is a schematic transverse cross-sectional view of a retaining ring of the present invention.
Fig. 5 is a front view of the pin of the present invention.
Fig. 6 is a schematic view of the manual assembly of the pin of the present invention.
Fig. 7 is a schematic view of the structure of the automatic disassembly assembler of the present invention.
Fig. 8 is a schematic view of the automatic disassembling and assembling device of the present invention for rotational disassembling operation.
Fig. 9 is a schematic view of the automatic disassembling and assembling machine of the present invention for performing a rotational assembling work.
Detailed Description
As shown in fig. 2 to 9, a positioning and manufacturing method of a printed circuit board includes the following steps: as shown in fig. 2 and 3, a plurality of base plates 20 are provided on an automatic milling machine 10 in a first step, a semi-finished printed circuit board 30 is fixed on the base plates 20 in a second step, a milling operation is performed by a milling cutter 11 of the automatic milling machine 10 in a third step, the semi-finished printed circuit board 30 is cut into a plurality of finished circuit boards 40, and the finished circuit boards 40 are removed from the base plates 20 one by one in a fourth step, so that the whole manufacturing process is completed.
In the second step, the semi-finished printed circuit board 30 is fixed on the pad 20 by a plurality of pins 100, a plurality of pad holes 21 are formed on the pad 20, a plurality of fixing holes 31 are formed on the semi-finished printed circuit board 30 corresponding to the pad holes 21, the fixing holes 31 correspond to the pad holes 21, and the fixing holes 31 are formed at four corners of each finished circuit board 40.
The pins 100 are inserted into the fixing holes 31 and the pad holes 21 from top to bottom, thereby fixing the semi-finished printed circuit board 30 on the pad 20, and each of the finished printed circuit boards 40 can be fixed on the pad 20 by the pins 100, so that the finished printed circuit board 40 and the semi-finished printed circuit board 30 will not shift when the milling cutter 11 of the automatic milling machine 10 performs the milling operation.
As shown in fig. 5, the pin 100 includes a screw fitting portion 110, a withdrawing portion 120, and a shank 130, wherein the screw fitting portion 110 is disposed at the bottom of the shank 130, and the withdrawing portion 120 is disposed at the top of the shank 130.
The screw fitting portion 110 is to be screwed into the pad hole 21 so that the pin 100 can be easily assembled and disassembled, and the withdrawing portion 120 can be matched with the automatic disassembling assembler 200 to complete the automatic assembly and the automatic disassembly of the pin 100.
In practice, the screw-fitting portion 110 includes a cone 111 and an external screw thread 112, the cone 111 is coupled to the bottom of the shank 130, the external screw thread 112 is provided on the outer surface of the cone 111, a taper hole 113 is provided at the bottom of the gasket hole 21 corresponding to the screw-fitting portion 110, an internal screw thread 114 is provided in the taper hole 113, and the external screw thread 112 is engaged in the internal screw thread 114.
The pin 100 can be fixed in the pad hole 21 in a screwing mode through the threaded engagement mode, so that the effects of convenient automatic assembly and automatic disassembly are achieved, the traditional pin assembly mode is changed, and in addition, the pin can be conveniently screwed in and positioned through the structure of the bevel gear.
Corresponding to the nail rod 130, a positioning ring 115 is disposed in the backing plate hole 21, as shown in fig. 3 and 4, the positioning ring 115 includes a ring body 116 and a plurality of ribs 117, the ring body 116 is inserted into the backing plate hole 21, the plurality of ribs 117 are protruded on the inner surface of the ring body 116, a positioning cavity 118 is formed around the top surface of the plurality of ribs 117 by means of the top surface of the plurality of ribs 117, the nail rod 130 is inserted into the positioning cavity 118, and the top surface of each rib 117 is propped against the outer surface of the nail rod 130.
In particular embodiments, the retaining ring 115 may be made of a resin, plastic or the like.
According to the invention, the contact area between the pin rod 130 and the backing plate hole 21 can be greatly reduced by arranging the positioning ring 115, and the friction force between the faces is reduced, so that the pin rod 130 can smoothly rotate in the backing plate hole 21 to facilitate automatic assembly and automatic disassembly, and meanwhile, the positioning precision of the pin 100 can be improved, and the vertical precision of the pin 100 is maintained.
The removal portion 120 functions to support the manual or automatic screwing of the pin 100 into or out of the backing plate hole 21, as will now be described below, respectively, in manual and automatic fashion.
As shown in fig. 6, in the manual mode, the withdrawing portion 120 is made of a magnetic material, the withdrawing portion 120 is screwed on the top end of the pin shaft 130, the top of the withdrawing portion 120 is provided with an inner angle assembly hole, and in the specific implementation, the inner angle assembly hole can be an inner hexagonal assembly hole, an inner pentagonal assembly hole, etc., an operator can screw the pin 100 in or out through a rotating tool, and the effect of conveniently accommodating the pin 100 is achieved by the magnetism of the withdrawing portion 120.
As shown in fig. 5, in the automatic mode, the extracting portion 120 includes a conical head 140, a rotary column 150 and a clamping groove 160, wherein the rotary column 150 is connected to the top of the shank 130, the conical head 140 is connected to the top of the rotary column 150, the clamping groove 160 is disposed between the conical head 140 and the shank 130, meanwhile, the clamping groove 160 is disposed around the rotary column 150, the rotary column 150 is provided with a clamping through hole 170, and the clamping through hole 170 is communicated with the clamping groove 160.
In particular, the snap-in hole 170 can accommodate insertion of a rod-shaped or tooth-shaped assembly tool, and rotation of the assembly tool after insertion can drive the pin 100 into or out of the assembly tool for assembly or disassembly, and the snap-in groove 160 is used for guiding insertion of the assembly tool for operation.
A preferred embodiment of an assembly tool is disclosed in detail below, as is the automatic disassembly assembler 200.
As shown in fig. 7, the automatic disassembly assembler 200 includes a latch 210, a sleeve 220, a puller 230, and an actuating unit 240, wherein the latch 210 is slidably disposed in the sleeve 220, a spring 211 is disposed between the latch 210 and the sleeve 220, and an inclined tooth surface 212 is disposed at the front end of the latch 210.
The puller 230 includes a cylinder 231, a pull rod 232, and a rail cylinder 233, the sleeve 220 is slidably disposed in the rail cylinder 233, and the pull rod 232 is connected between the cylinder 231 and the sleeve 220.
The motion unit 240 is connected to the puller 230, the motion unit 240 can drive the puller 230 to move up and down and rotate, further, the motion unit 240 can drive the latch 210 to move up and down and rotate, the motion unit 240 includes an up and down moving device 241 and a rotating device 242, the motion and structure of the motion unit 240 are not described in the prior art, for example, the up and down moving device 241 can be designed as a track or a mechanical arm, and the rotating device 242 can be designed as a rotating structure such as a turntable, a rotating shaft, etc.
The automatic disassembling and assembling device 200 mainly comprises a rotational disassembling operation and a rotational assembling operation.
As shown in fig. 8, the rotational disassembly is performed as follows.
In step a, the automatic disassembly assembler 200 is moved right above the pin 100, the automatic disassembly assembler 200 is descended, and the inclined tooth surface 212 of the latch 210 is moved downward along the outer surface of the bit 140 of the pin 100.
Step B, the spring 211 is compressed by the squeezing force of the cone 140 to the latch 210.
In step C, when the latch 210 moves down to the position of the snap-in slot 160, the squeezing force of the cone 140 to the latch 210 is eliminated, and the spring 211 presses the latch 210 out, so that the latch 210 is snapped into the snap-in hole 170.
Step D, the motion unit 240 rotates and drives the automatic disassembly and assembly 200 to integrally rotate.
The threaded fitting portion 110 of the pin 100 is rotated out of the tapered bore 113 of the backing plate bore 21.
In step E, the action unit 240 drives the automatic disassembling and assembling device 200 to move upwards, and the pins 100 are completely pulled out from the pad holes 21 and the fixing holes 31 of the semi-finished printed circuit board 30.
Step F, the action unit 240 drives the automatic disassembling and assembling device 200 to move to the unloading station, the puller 230 acts to pull the latch 210 out of the snap-in hole 170, and the pin 100 falls into the unloading station.
In the process of step C, when the latch 210 moves down to the position of the snap-in slot 160, the action unit 240 rotates and drives the automatic disassembling and assembling device 200 to integrally rotate, so that the latch 210 slides in the snap-in slot 160 until the latch 210 snaps into the snap-in hole 170, and the rotation process can be combined with step D to improve the efficiency.
As shown in fig. 9, the rotational assembly work is performed as follows.
In the step a, the pin 100 is vertically disposed in the unloading station, the automatic disassembly assembler 200 is moved right above the pin 100, the automatic disassembly assembler 200 is descended, and the inclined tooth surface 212 of the latch 210 is moved downward along the outer surface of the cone head 140 of the pin 100.
Step B, the spring 211 is compressed by the squeezing force of the cone 140 to the latch 210.
In step C, when the latch 210 moves down to the position of the snap-in slot 160, the squeezing force of the cone 140 to the latch 210 is eliminated, and the spring 211 presses the latch 210 out, so that the latch 210 is snapped into the snap-in hole 170.
Step D, the action unit 240 drives the automatic disassembling and assembling device 200 to move upwards as a whole and move to right above the fixing hole 31 of the semi-finished printed circuit board 30.
Step E, the action unit 240 drives the automatic disassembly assembler 200 to move downward as a whole, and inserts the pins 100 into the fixing holes 31 of the semi-finished printed circuit board 30 and the pad holes 21 at the same time.
Step F, the action unit 240 drives the automatic disassembling and assembling device 200 to rotate and move downwards, so that the threaded assembling portion 110 of the pin 100 is screwed into the taper hole 113 of the pad hole 21.
In step G, the puller 230 is operated to pull the latch 210 out of the snap-in hole 170, and the moving unit 240 drives the automatic disassembling and assembling device 200 to move upwards.
In the process of step C, when the latch 210 moves down to the position of the snap-in slot 160, the action unit 240 rotates and drives the automatic disassembling and assembling device 200 to integrally rotate, so that the latch 210 slides in the snap-in slot 160 until the latch 210 is snapped into the snap-in through hole 170.
In the process of step F, the purpose of the action unit 240 driving the automatic disassembly and assembly 200 to rotate and move downwards is to avoid collision of the threads when the threads are not contacted, so as to realize rotation insertion and avoid damage of the threads.
In practice, the movement and positioning of the various parts in the above-mentioned process can be controlled by the sensors, in particular the laser sensors, and the accuracy of the various actions in the above-mentioned process can be controlled due to the high production accuracy of the printed circuit board.
In addition, the number of turns of the external thread 112 and the internal thread 114 may be appropriately reduced to simplify the action form of the mechanism, and the number of turns of the external thread 112 and the internal thread 114 may be set to one turn or half turn. Meanwhile, the taper 111 of the screw fitting portion 110 is constructed to be easily introduced at the time of insertion, thereby facilitating insertion of the socket.
Claims (7)
1. The positioning and manufacturing method of the printed circuit board is characterized by comprising the following steps of:
a first step, arranging a plurality of backing plates on an automatic milling machine,
secondly, fixing the semi-finished printed circuit board on the backing plate through a plurality of pins,
thirdly, milling by a milling cutter of the automatic milling machine, cutting the semi-finished printed circuit board into a plurality of finished circuit boards,
fourth, taking out the pins one by one, then taking down the finished circuit board from the backing plate to complete the whole manufacturing process,
in the second step, a plurality of pad holes are arranged on the pad, a plurality of fixing holes are arranged on the semi-finished printed circuit board corresponding to the pad holes, the fixing holes correspond to the pad holes, the fixing holes are arranged at four corners of each finished circuit board,
the pin is penetrated in the fixing hole, the bottom of the pin is screwed in the pad hole, thereby fixing the semi-finished printed circuit board on the pad,
the pin comprises a screw thread assembling part, a taking-out part and a pin rod, wherein the screw thread assembling part is arranged at the bottom of the pin rod, the taking-out part is arranged at the top of the pin rod, the screw thread assembling part is used for being screwed in the gasket hole, the taking-out part is used for being matched with an assembling tool so as to complete the assembling and the disassembling of the pin,
the taking-out part comprises a conical head, a rotary column and a clamping groove, wherein the rotary column is connected to the top of the screw rod, the conical head is connected to the top of the rotary column, the clamping groove is arranged between the conical head and the screw rod, meanwhile, the clamping groove is annularly arranged around the rotary column, the rotary column is provided with clamping through holes which are communicated with the clamping groove,
the assembly tool is an automatic disassembly assembly device, the automatic disassembly assembly device comprises a latch, a sleeve, a puller and an action unit, wherein the latch is arranged in the sleeve in a sliding way, a spring is arranged between the latch and the sleeve, the front end of the latch is provided with an inclined tooth surface, the puller comprises a cylinder body, a pull rod and a track cylinder, the sleeve is arranged in the track cylinder in a sliding way, the pull rod is connected between the cylinder body and the sleeve, the action unit is connected with the puller, the action unit comprises an up-down moving device and a rotating device,
in the fourth step, the automatic disassembly assembler performs rotational disassembly of the pin as follows,
step A, the automatic disassembly assembler moves to the position right above the pin, the automatic disassembly assembler descends, the inclined tooth surface of the latch moves downwards along the outer surface of the conical head of the pin,
step B, compressing the spring by means of the extrusion acting force of the cone head to the latch,
step C, when the latch moves down to the clamping groove position, the extrusion acting force of the cone head on the latch is eliminated, the spring presses the latch out to clamp the latch into the clamping through hole,
step D, the action unit rotates and drives the automatic disassembly assembler to integrally rotate, the threaded assembly part of the pin rotates out of the taper hole of the backing plate hole,
step E, the action unit drives the automatic disassembly assembler to move upwards integrally, the pin is completely pulled out from the backing plate hole and the fixing hole of the semi-finished printed circuit board,
and F, the action unit drives the automatic disassembly assembler to move to the unloading station, the puller acts to pull the latch out of the clamping through hole, and the pin falls into the unloading station.
2. The method for positioning and manufacturing a printed circuit board according to claim 1, wherein: the screw-fitting portion includes a cone attached to the bottom of the shank and an external screw thread provided on the outer surface of the cone,
and a taper hole is arranged at the bottom of the backing plate hole corresponding to the threaded assembly part, an internal thread is arranged in the taper hole, the external thread is meshed in the internal thread, and the pin is fixed in the backing plate hole in a threaded manner.
3. The positioning and manufacturing method of the printed circuit board as claimed in claim 2, wherein: corresponding to the nail rod, a positioning ring is arranged in the backing plate hole, the positioning ring comprises a ring body and a plurality of convex ribs, the ring body is inserted into the backing plate hole, the convex ribs are convexly arranged on the inner surface of the ring body, a positioning cavity is formed by surrounding the top surfaces of the convex ribs, the nail rod is inserted into the positioning cavity, and the top surface of each convex rib is propped against the outer surface of the nail rod.
4. The positioning and manufacturing method of the printed circuit board as claimed in claim 2, wherein: the withdrawing part is made of magnetic materials, the withdrawing part is screwed on the top end of the nail rod, an inner angle assembly hole is formed in the top of the withdrawing part, an operator can screw the pin in or out through an assembly tool, and meanwhile the pin is accommodated by means of the magnetism of the withdrawing part.
5. The method for positioning and manufacturing a printed circuit board according to claim 1, wherein: in the process of the step C, when the latch moves down to the clamping groove, the action unit rotates and drives the automatic disassembly assembler to integrally rotate, so that the latch slides in the clamping groove until the latch is clamped in the clamping through hole.
6. The method for positioning and manufacturing a printed circuit board according to claim 1, wherein: in the second step, the automatic disassembly assembler performs rotational assembly of the pin by the steps of,
step A, the pin is vertically arranged in a discharging station, the automatic disassembly assembler moves to the position right above the pin, the automatic disassembly assembler descends, the inclined tooth surface of the latch moves downwards along the outer surface of the conical head of the pin,
step B, compressing the spring by means of the extrusion acting force of the cone head to the latch,
step C, when the latch moves down to the clamping groove position, the extrusion acting force of the cone head on the latch is eliminated, the spring presses the latch out to clamp the latch into the clamping through hole,
step D, the action unit drives the automatic disassembly assembler to move upwards integrally and move to the position right above the fixing hole of the semi-finished printed circuit board,
step E, the action unit drives the whole automatic disassembly assembler to move downwards, the pin is simultaneously inserted into the fixing hole of the semi-finished printed circuit board and the backing plate hole,
f, the action unit drives the automatic disassembly assembler to rotate and move downwards, the thread assembly part of the pin is screwed into the taper hole of the backing plate hole,
and G, the puller acts to pull the latch out of the clamping through hole, and the action unit drives the automatic disassembly assembler to move upwards.
7. The method for positioning and manufacturing the printed circuit board as claimed in claim 6, wherein: in the process of the step C, when the latch moves down to the clamping groove, the action unit rotates and drives the automatic disassembly assembler to integrally rotate, so that the latch slides in the clamping groove until the latch is clamped in the clamping through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111229716.5A CN113905530B (en) | 2021-10-22 | 2021-10-22 | Positioning and manufacturing method of printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111229716.5A CN113905530B (en) | 2021-10-22 | 2021-10-22 | Positioning and manufacturing method of printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN113905530A CN113905530A (en) | 2022-01-07 |
| CN113905530B true CN113905530B (en) | 2023-11-21 |
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| CN202111229716.5A Active CN113905530B (en) | 2021-10-22 | 2021-10-22 | Positioning and manufacturing method of printed circuit board |
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