CN1255858C - Scribing device for brittle material substrate and scribing method for brittle material substrate - Google Patents

Abstract

The invention provides a scribing device for a brittle material substrate. Wherein the plurality of laser spots are formed so as to have a plurality of intensity distribution peaks along the scribe line direction of the brittle material substrate, and the interval between the plurality of laser spots and the interval between the intensity distribution peaks of the laser spots are set according to the type of the brittle material substrate on which the dark crack is formed.

Description

Scribing device for brittle material substrate and scribing method for brittle material substrate

technical field

The present invention relates to a scribing device (scribing device) used when cutting a brittle material substrate such as a glass substrate and a semiconductor wafer used in a flat panel display (hereinafter referred to as FPD).

Background technique

The FPD in which a pair of glass substrates are pasted together is produced by pasting a pair of large-sized mother glass substrates together and then cutting them into predetermined sizes. When cutting the mother glass substrate, a scribe line is formed on the mother glass substrate in advance with a cutter. When a scribe line is formed with a cutter, or when the glass substrate is cut after the scribe line is formed, fine glass powder and cullet are generated, causing various problems.

In order to avoid the generation of fine glass powder and glass cullet during scribing and cutting with a cutter, in recent years, a method of using a laser beam to form a scribe line has been put into practical use. In the method of forming a scribe line on a glass substrate using a laser beam, as shown in FIG. 5 , the glass substrate 50 is irradiated with a laser beam emitted from a laser oscillator 61 . The laser beam irradiated from the laser oscillator 61 forms an oblong laser spot LS on the glass substrate 50 along the line to be scratched formed on the glass substrate 50 . The glass substrate 50 and the laser beam irradiated from the laser oscillator 61 are relatively moved along the longitudinal direction of the laser spot.

The glass substrate 50 is heated by the laser beam to a temperature lower than a temperature at which the glass substrate 50 is melted, that is, to a temperature lower than a softening point of the glass substrate. Thereby, the surface of the glass substrate 50 irradiated with the laser spot LS is heated, but not melted.

In addition, a cooling medium such as cooling water is sprayed from the cooling nozzle 62 in order to form a scribe line near the area irradiated with the laser beam on the surface of the glass substrate 50 . After the surface of the glass substrate irradiated with the laser beam is heated by the laser beam to generate compressive stress, a cooling medium is sprayed to generate tensile stress. In this way, since tensile stress is generated near the region where compressive pressure is generated, a stress gradient based on each stress is generated between the two regions. Along the planned scratch line, a scratch line along the thickness direction of the glass is formed where the vertical crack BC advances and develops.

The vertical cracks thus formed on the surface of the glass substrate 50 are fine and usually cannot be observed with the naked eye, so they are called dark cracks (Brain cracks) BC.

6 is a perspective view schematically showing a state of beam irradiation on a glass substrate 50 to be scribed by a laser scribing device, and FIG. 7 is a plan view schematically showing a state of physical changes on the glass substrate 50 .

The laser beam LB emitted from the laser oscillator 61 forms an oblong laser spot LS on the surface of the glass substrate 50 . The laser spot LS has, for example, an oblong shape with a major diameter b of 30.0 mm and a minor diameter a of 1.0 mm, and is irradiated so that the major axis coincides with the direction of the formed scribe line.

In this case, the beam intensity of the laser spot LS formed on the glass substrate 50 is higher at the outer periphery than at the center. Therefore, at each end portion in the major axis direction on the line to be scratched, the beam intensity becomes maximum respectively, and the beam intensity at the central portion of the laser spot LS sandwiched between each end portion is smaller than that of each end portion. strength.

The glass substrate 50 is relatively moved along the long axis direction of the laser spot LS, whereby the glass substrate 50, after being heated corresponding to a large beam intensity at one end of the laser spot LS along a predetermined line for scratching, is heated corresponding to the laser beam intensity at one end of the laser spot LS. The central part of the spot LS is heated by a small beam intensity, and thereafter heated by a large beam intensity. Simultaneously, thereafter, relative to the end irradiation area of the laser spot LS, for example, along the major axis direction of the laser spot LS, the cooling point CP on the planned scratching line with an interval L of 2.5 mm is cooled from the cooling nozzle 62. Spray cooling water.

Thereby, a temperature gradient (collision) occurs in a region between the laser spot LS and the cooling spot CP, and a large tensile stress is generated in a region opposite to the laser spot LS with respect to the cooling spot CP. Simultaneously, by utilizing this tensile stress, at the end of the glass substrate 50 , from the slit formed by the wheel cutter 35 , a dark crack BC develops along a line to be scratched.

The glass substrate 50 is heated by the oblong laser spot LS. In this case, the glass substrate 50 is heated by a large beam intensity at one end of the laser spot LS, the heat is transferred from its surface to the inside in the vertical direction, but, by relatively moving the laser beam with respect to the glass substrate 50, After the portion heated by the end of the laser spot LS is heated by a small beam intensity corresponding to the central portion of the laser spot LS, it is heated again by a large beam intensity corresponding to the end of the laser spot LS.

In this way, on the surface of the glass substrate 50, the heat of the portion initially heated with a high beam intensity is reliably transferred to the inside of the glass substrate during subsequent heating with a low beam intensity. In addition, it is necessary to prevent continuous heating of the surface of the glass substrate 50 with a large beam intensity in order to prevent melting of the surface of the glass substrate 50 . Then, when the glass substrate 50 is heated again with a large beam intensity to reliably heat the inside of the glass substrate 50 , compressive stress is generated on the surface and inside of the glass substrate 50 . Then, after such a lapse of time, tensile stress is generated by spraying cooling water at the cooling point CP in the vicinity of the region where compressive stress occurs.

When the area heated by the laser spot LS generates compressive stress and the cooling water generates tensile stress at the cooling point CP, the compressive stress generated by the thermal diffusion area HD between the laser spot LS and the cooling point CP is relatively CP, a large tensile stress is generated in the area opposite to the laser spot. Simultaneously, by utilizing this tensile stress, from the slit formed by the wheel cutter 35 at the end of the glass substrate 50, the dark crack BC develops along the line to be scratched.

In addition, by reducing the relative moving speed of the laser beam with respect to the glass substrate 50, dark cracks BC (vertical cracks) extend in the thickness direction of the glass substrate 50, and develop along the planned scratch line in a state penetrating the glass substrate 50 (scribing thus performed line, generally referred to as cutting the glass substrate 50 as a whole).

In the description of the above prior art example, the example in which the dark crack BC develops from the slit formed by the wheel cutter 35 at the end of the glass substrate 50 was described, but the wheel cutter The slit formed by the device 35 does not necessarily have to be at the end of the glass substrate 50.

In addition, in order to form the dark crack BC, it is not necessarily necessary to form a slit in the glass substrate 50 .

When the dark crack BC as a scribe line is formed on the glass substrate 50, the glass substrate 50 is provided to the following cutting process so that a bending moment acts along the width direction of the dark crack BC as the direction indicated by the arrow in FIG. way to apply force to the glass substrate. Thereby, the glass substrate 50 is cut|disconnected along the scribe line which is the line of the dark crack BC.

In such a scribing device, when conditions such as the material and thickness of the glass substrate 50 change, it is necessary to change the conditions for heating with the laser beam. In order to make the emitted laser beam form a predetermined oval laser spot LS on the glass substrate 50, the laser oscillation device needs to pre-set the configuration and focus of the optical system such as the lens. When changing the heating conditions using the laser beam, it is necessary to The shape of the laser spot LS formed on the surface of the glass substrate 50 is changed. Therefore, in order to change the shape of the laser spot LS, it is necessary to replace the lens of the optical system, adjust the focus, and further, adjust the mode of the laser light emitted from the laser oscillator, etc., and there is a problem that these adjustments are not easy.

In order to solve this problem, an object of the present invention is to provide a method that can easily cope with the brittle material even if conditions such as the material and thickness of the brittle material substrate change when forming a scribe line on a brittle substrate such as a glass substrate. Scribing apparatus for substrates of brittle material substrates.

Contents of the invention

The scribing device for brittle material substrates of the present invention forms vertical cracks along the predetermined scribing lines, comprising: at least one laser oscillator that emits laser beams that are continuously or intermittently irradiated at high speeds to follow the cracks on the surface of brittle material substrates In the area where the scratch line is scheduled to be formed, a laser irradiation spot with a temperature lower than the softening point of the brittle material substrate is formed; the optical mechanism performs optical processing on the laser beam oscillated by the laser oscillator, and adjusts the scanning speed of the spot and scanning paths, or form single or multiple spots, or change the intensity distribution; the cooling mechanism is used to continuously cool the cooling medium near the laser irradiation spot, and it is characterized in that the optical mechanism is composed as follows: the irradiation is performed by the laser oscillator Oscillating the emitted laser beam, using the irradiated laser beam to form multiple laser spots on the brittle material substrate, and adjusting the scanning speed and scanning path of the irradiated laser beam, the multiple laser spots have multiple peaks of intensity distribution respectively; when When the brittle material substrate is thicker than the brittle material substrate suitable for the preset intervals of the plurality of laser spots, and when the thermal conductivity of the brittle material substrate is greater than that suitable for the preset plurality of laser spots When the thermal conductivity of the spaced brittle material substrates is low, in at least one of the cases, the optical mechanism adjusts the distance between the plurality of laser spots formed along the predetermined scratch line to be smaller than the preset The interval between a plurality of laser spots, and the peak interval of the intensity distribution of the plurality of laser spots is set to be smaller than the preset peak interval of the intensity distribution of the plurality of laser spots; and, when the brittle material substrate When the thickness of the brittle material substrate is thinner than the thickness of the brittle material substrate suitable for the preset intervals of the plurality of laser spots, and when the thermal conductivity of the brittle material substrate is smaller than that suitable for the preset plurality of laser spots When the thermal conductivity of the spaced brittle material substrates is high, in at least one of the cases, the optical mechanism sets the intervals of the plurality of laser spots formed along the predetermined scratch line to be larger than the intervals of the plurality of laser spots. The interval between the light spots, and the peak interval of the intensity distribution of the plurality of laser spots is set to be greater than the preset peak interval of the intensity distribution of the plurality of laser spots.

The scribing device for brittle material substrates of the present invention is characterized in that the intensity distribution of the aforementioned plurality of laser spots is in a non-Gaussian mode.

The method for scribing a brittle material substrate according to the present invention is to form a vertical crack along a predetermined line for scribing, comprising: continuously or intermittently irradiating a laser beam at a high speed from at least one laser oscillator to form a scribe along the predetermined scribing line on the surface of a brittle material substrate. The step of forming a laser irradiation spot with a temperature lower than the softening point of the brittle material substrate in the region of the trace line; using an optical mechanism to optically process the laser beam from the above-mentioned laser oscillator, and adjusting the scanning speed and scanning path of the spot , or the step of forming single or multiple spots, or changing the intensity distribution, using a cooling mechanism that supplies a cooling medium for cooling to continuously cool the vicinity of the laser spot, characterized in that the optical mechanism The following structure: irradiate the laser beam oscillated by the laser oscillator, use the irradiated laser beam to form a plurality of laser spots on the brittle material substrate, and adjust the scanning speed and scanning path of the irradiated laser beam, and the plurality of laser spots are respectively There are a plurality of peaks of intensity distribution; the following actions are performed by the optical mechanism: when the brittle material substrate is thicker than the brittle material substrate suitable for the preset spacing of the plurality of laser spots, and, when the brittle material substrate When the thermal conductivity of the brittle material substrate is lower than the thermal conductivity of the brittle material substrate suitable for the preset intervals of the plurality of laser spots, in at least one of the cases, the optical mechanism adjusts the formed along the predetermined scratch line. The interval between the plurality of laser spots is set to be smaller than the preset interval of the plurality of laser spots, and the peak interval of the intensity distribution of the plurality of laser spots is set to be smaller than the preset interval of the plurality of laser spots. and, when the thickness of the brittle material substrate is thinner than the thickness of the brittle material substrate suitable for the preset interval of the plurality of laser spots, and, when the brittle material substrate When the thermal conductivity of the brittle material substrate is higher than the thermal conductivity of the brittle material substrate suitable for the preset spacing of the plurality of laser spots, in at least one of the cases, the optical mechanism sets the predetermined scratch line formed along the The interval between the plurality of laser spots is set to be greater than the interval between the plurality of laser spots, and at the same time, the peak interval of the intensity distribution of the plurality of laser spots is set to be greater than the preset interval of the plurality of laser spots The peak interval of the intensity distribution of .

Description of drawings

FIG. 1 is a front view showing an example of an embodiment of a scribing device for a brittle material substrate according to the present invention.

Fig. 2 is a schematic configuration diagram showing an example of a laser oscillator and an optical system used in the scribing device of the present invention.

Fig. 3 (a) is a schematic configuration diagram showing another example of the laser oscillator and optical system used in the scribing device of the present invention, and Fig. Schematic illustration of the intensity distribution on the laser spot.

Fig. 4 (a) is a schematic structural view showing further another example of the laser oscillation device and the optical system used in the scribing device of the present invention, and Fig. 4 (b) and (c) respectively represent the irradiation from the device to Schematic illustration of the intensity distribution of a laser spot on a glass substrate.

Fig. 5 is a schematic diagram for explaining the operation of a scribing device using a laser beam.

FIG. 6 is a perspective view schematically showing a state of a glass substrate in an operation of forming a scribe line by a laser scribing device.

FIG. 7 is a plan view schematically showing the state of the glass substrate.

Fig. 8(a) is a schematic view showing a plurality of laser spots formed on a glass substrate by using the laser oscillation device and the optical system used in the scribing device of the present invention shown in Fig. 3(a) and Fig. 4(b) , Figure 8(b) is an enlarged view of the laser spot and an intensity distribution view.

Detailed ways

Embodiments of the present invention will be described below with reference to the drawings.

Fig. 1 is a schematic configuration diagram showing an embodiment of a scribing device for a brittle material substrate according to the present invention. This scribing device, for example, is used to form a scribing line on a glass substrate 50 when cutting off a glass substrate for an FPD. As shown in FIG. direction) reciprocating slide table 12.

The slide table 12 is supported by a pair of guide rails 14 and 15 arranged in parallel in the Y direction on the upper surface of the frame 11, and the slide table 12 can slide along the respective guide rails 14 and 15 in a horizontal state. At the intermediate portion of the two guide rails 14 and 15, a ball screw 13 parallel to each guide rail 14 and 15 is provided so as to be rotated by a motor (not shown). The ball screw 13 is capable of forward rotation and reverse rotation, and the ball nut 16 is mounted on the ball screw 13 in a threaded state. The ball nut 16 is integrally mounted on the slide table 12 in a non-rotatable state, and the ball nut 16 slides in two directions along the ball screw 13 by forward rotation and reverse rotation of the ball screw 13 . Thus, the slide table 12 integrally attached to the ball nut 16 slides in the Y direction along the respective guide rails 14 and 15 .

On the slide table 12, a pedestal 19 is arranged in a horizontal state. The pedestal 19 is slidably supported by a pair of guide rails 21 arranged in parallel on the slide table 12 . Each guide rail 21 is arranged along the X direction perpendicular to the Y direction which is the sliding direction of the slide table 12 . In addition, a ball screw 22 is disposed parallel to each guide rail 21 at the center between the guide rails 21 , and the ball screw 22 can be rotated forward and backward by a motor 23 .

A ball nut 24 is threadedly attached to the ball screw 22 . The ball nut 24 is integrally attached to the pedestal 19 in a non-rotating state, and the ball nut 24 moves in two directions along the ball screw 22 by forward rotation and reverse rotation of the ball screw 22 . Thereby, the pedestal 19 slides in the X direction along each guide rail 21 .

On the pedestal 19, the rotation mechanism 25 is provided, and the rotation table 26 which mounts the glass substrate 50 which is a cutting object in a horizontal state is installed on this rotation mechanism 25. As shown in FIG. The rotation mechanism 25 rotates the rotation table 26 around a central axis in the vertical direction (theta direction). For example, the glass substrate 50 is fixed to the turntable 26 using a suction chuck.

Above the turntable 26 , a support stand 31 is arranged at an appropriate interval from the turntable 26 . The support table 31 is supported in a horizontal state by the lower end portion of an optical holder 33 arranged in a vertical state. The upper end of the optical holder 33 is attached to the lower surface of the mount 32 provided on the frame 11 . On the mounting table 32, a laser oscillation device 34 that emits a laser beam is provided.

The laser oscillator 34 irradiates the laser beam emitted from the laser oscillator to the optical system held in the optical holder 33 .

On the support table 31 attached to the lower end portion of the optical holder 33 , a wheel cutter 35 for forming a slit on the end face portion of the glass substrate 50 is provided. The wheel cutter 35 is spaced at an appropriate distance from the longitudinal end of the laser beam that irradiates the glass substrate 50 and is arranged linearly along the longitudinal direction of the laser beam. Held liftably.

Furthermore, on the support table 31 , near the optical holder 33 , a cooling nozzle 37 is provided. A cooling medium such as cooling water, He gas, N 2 gas, or CO 2 gas is sprayed from the cooling nozzle 37 onto the glass substrate 50 . The cooling medium ejected from the cooling nozzle 37 is blown to a position close to the longitudinal end of the laser spot irradiated from the optical holder 33 to the glass substrate 50 .

In addition, on the mounting table 32, a pair of CCD cameras (or camera heads) 38 and 39 for taking pictures of the alignment (calibration) marks engraved on the glass substrate 50 in advance are provided, and images captured by the respective CCD cameras 38 and 39 are displayed. The monitors 28 and 29 are installed on the mounting table 32, respectively.

FIG. 2 is a schematic configuration diagram of an optical system provided in the laser oscillator 34 and the optical holder 33 . The laser oscillation device 34 has a laser oscillator 34a emitting a laser beam, and the laser beam emitted by the laser oscillator 34a passes through an X-axis current mirror (galvano mirror) 34b, a Y-axis current mirror (galvano mirror) 34c, and a configuration The f-θ lens 33 a inside the optical holder 33 irradiates onto the glass substrate 50 .

The X-axis current mirror 34b rotates at high speed, scans the laser beam irradiated by the laser oscillator 34a at high speed, and reflects it to the Y-axis current mirror 34c. In addition, the Y-axis current mirror 34 c is also rotated at high speed to scan the laser beam irradiated by the X-axis current mirror 34 b at high speed and reflect it toward the glass substrate 50 . And, the laser beam reflected by the Y-axis current mirror 34c is irradiated onto the glass substrate 50 through the f-θ lens 33a.

The laser beams irradiated onto the glass substrate 50 via the f-theta lens 33a form elliptical beams along the Y-axis direction and the X-axis direction, respectively, according to the respective rotational speeds of the X-axis current mirror 34b and the Y-axis current mirror 34c. Laser spots LS1 and LS2.

The lens used for the laser beam reflected by the above-mentioned Y-axis current mirror 34c is not limited to the f-θ lens.

The distance between the respective laser beams LS1 and LS2 is changed by adjusting the rotational speeds of the X-axis current mirror 34b and the Y-axis current mirror 34c. At the same time, cooling water is sprayed from the cooling nozzle 37 to a position close to the ellipse LS2 along the X-axis direction.

When scribing the glass substrate 50 using such a scribing device, first, the glass substrate 50 divided into a predetermined size is placed on the turntable 26 of the scribing device, and fixed by a suction device. Then, the alignment marks provided on the glass substrate 50 are imaged by the CCD cameras 38 and 39 . The imaged alignment marks are displayed on the monitors 28 and 29, and the glass substrate 50 is positioned at a predetermined position based on the display.

Scribing is performed with a laser on the glass substrate 50 positioned relative to the support table 31 located at the lower end of the optical holder 33 . When scribing the glass substrate 50 , the respective laser spots LS1 and LS2 irradiated from the optical holder 33 onto the surface of the glass substrate 50 are formed on the line to be scribed on the glass substrate 50 . The positioning of the turntable 26 is performed by sliding the slide table 12 , sliding the pedestal 19 , and rotating the turntable 26 by the rotation mechanism 25 .

When the turntable 26 is positioned with respect to the support stand 31 , the turntable 26 is slid in the X direction, and the end of the glass substrate 50 faces the wheel cutter 35 . Then, the wheel cutter 35 is lowered. At the end of the glass substrate 50, a slit is formed along a line to be scratched.

Then, while sliding the rotary table 26 in the X direction along the planned scratch line, the laser beam from the laser oscillator 34 is oscillated, and at the same time, the cooling medium is sprayed from the cooling nozzle and compressed air, for example, cooling water and compressed air are sprayed together. injection.

Utilizing the oscillating laser beam from the laser oscillator 34, on the glass substrate 50, along the scanning direction of the glass substrate 50, an elliptical laser spot LS1 elongated along the Y-axis direction is formed at a predetermined distance apart from the glass substrate 50. , and an elliptical laser spot LS2 that becomes longer along the X-axis direction. Simultaneously, cooling water is sprayed on the laser spot LS2 in a region separated by a predetermined interval from the side opposite to the moving direction of the glass substrate 50 . Thereby, dark cracks are formed as scribe lines on the glass substrate 50 .

When a dark crack as a scribe line is formed on the glass substrate 50 , the glass substrate 50 is supplied to the next cutting process, and a force is applied to the glass substrate such that a bending moment acts in the width direction of the scribe line. Thereby, the glass substrate 50 is cut along the scribe line.

When the type of the glass substrate 50 on which the scribe line is formed by the scribing device is changed, the rotation speeds of the X-axis current mirror 34b and the Y-axis current mirror 34c in the laser oscillator 34 are adjusted respectively, and the laser beam formed on the glass substrate is adjusted. The spacing between the laser spots LS1 and LS2 on the surface of 50.

In addition, by changing the scanning pattern of the laser beam by using the X-axis current mirror 34b and the Y-axis current mirror 34c, the intensity distribution of the laser spots LS1 and LS2 along the respective major axis directions can have multiple peaks.

Thereby, the interval between the laser spots LS1 and LS2 and the state of their respective intensity distributions become the state suitable for the material of the glass substrate 50, etc. Since the laser beam is irradiated on the glass substrate 50, the glass substrate 50 is heated to the conditions necessary for the formation of dark cracks deep throughout its interior.

Furthermore, by using the X-axis current mirror 34b and the Y-axis current mirror 34c to change the scanning pattern of the laser beam, and form a plurality of laser spots LS2 in series at predetermined intervals, the intensity of the formed multiple laser spots can be reduced. The distribution state is set to various.

Preferably, by arranging the peaks of the multiple intensity distributions that form the multiple laser spots LS2 on a straight line, it can be further adapted to the state of the material of the glass substrate 50 and the conditions required for forming deep dark cracks. Setup made easy.

As described above, by adjusting the scanning speed and scanning path of the laser beam at high speed, a plurality of laser spots are formed. The plurality of laser spots are formed on the glass substrate 50 as if multi-mode laser spots.

When the glass substrate 50 is relatively thick, or when the thermal conductivity is low, the distance between the laser spots LS1 and LS2 is set to be small. In addition, when there are multiple LS2s, the distance between the LS2 is set to be small. In addition, the interval between the peaks of the intensity distribution of the laser spot along the X-axis is also set to be small. Conversely, when the glass substrate 50 is relatively thin or the thermal conductivity is high, the distance between the laser spots LS1 and LS2 is set to be large, and when there are a plurality of LS2, the distance between the LS2 is set to In addition, the distance between the peaks of the intensity distribution of the plurality of laser spots along the X-axis is also set to be relatively large.

In this way, in the case of changing conditions such as the material of the glass substrate 50 to be scribed, since the laser beam irradiating the glass substrate can be easily changed to a state suitable for the glass substrate 50, it is easy to correspond to each Glass substrates under various conditions.

The laser spot LS1 is formed such that the intensity distribution of the entire spot is uniform. Alternatively, preferably, the laser spot LS1 is formed along the Y-axis so as to have two intensity distribution peaks sandwiching the planned scratch line.

Thereby, on the line to be scratched, compressive stress is applied from both sides of the line, and when the laser spot LS1 is used to heat the line to be scratched on the glass substrate 50, it is possible to prevent the generation of stress from the end of the glass substrate 50 and the like. Abnormal cracks that are different from dark cracks.

In the above description, for the case of a scribing device equipped with a laser oscillating device 34 emitting a laser beam from the laser oscillating device 34a and an optical holder 33 as shown in FIG. Although described above, a scribing device including a plurality of laser oscillators and a plurality of optical holders corresponding thereto, and an optical system shown in FIG. 2 provided on a plurality of optical holders may also be used.

In this way, by providing a plurality of laser oscillation devices and a plurality of optical holders, it is possible to irradiate the glass substrate 50 with laser beams having a plurality of different wavelengths. Generally, a material has an optimum light wavelength region for absorbing light, and when a material is irradiated with a laser beam close to this wavelength region, the inside of the material can be heated in a short time. Thus, dark cracks are easily formed by irradiating a laser beam close to the light absorption wavelength of the brittle material substrate.

In order to cut off various brittle material substrates to form optimal dark crack lines, it is necessary to adjust the intervals of multiple laser spots formed on brittle material substrates, the intensity distribution of multiple laser spots, and furthermore, the laser beams that form multiple laser spots The wavelength is adjusted to the best state. Therefore, a scribing device equipped with a plurality of laser oscillation devices and a plurality of optical holders is employed.

Furthermore, the intensity distribution of the laser spot LS1 and the plurality of laser spots LS2 may be in a non-Gaussian mode.

FIG. 3 is a schematic configuration diagram showing another example of a laser oscillator 34 and an optical system. The laser oscillator 34 has a first laser oscillator 34a and a second laser oscillator 34g. The first and second laser oscillators 34a and 34g respectively irradiate laser beams having a Gaussian mode intensity distribution parallel to each other in the horizontal direction.

The laser beam oscillated by the first laser oscillator 34a is vertically reflected toward the glass substrate 50 by the first mirror 33c mounted on the moving table 33d. The first reflection mirror 33c is moved in the direction of approaching and separating from the first laser oscillator 34a by the moving stage 33d. The moving stage 33d is moved by a stepping motor, whereby the position of the first mirror 33c relative to the first laser oscillator 34c is finely adjusted.

Also, the laser beam irradiated from the second laser oscillator 34g is irradiated onto the first semicircular mirror 33f fixed on the moving stage 33d' below the first reflection mirror 33c. The first semicircular mirror 33f transmits the laser beam reflected by the first reflection mirror 33c arranged above it, and reflects the laser beam irradiated from the second laser oscillator 34g downward.

The oscillating laser beams emitted from the first and second laser oscillators irradiated on the first semicircular mirror 33f become in a phase-shifted state, and at the first semicircular mirror 33f, the laser beams having a pair of intensity distribution peaks are synthesized. beam. In this case, the intervals between the intensity distribution peaks can be changed and reset at any time by adjusting the positions of the first reflector 33c and the first semicircular mirror 33f by the moving stations 33d and 33d'.

In this way, the laser beams synthesized by the first semicircular mirror 33f so as to have a pair of peaks of the intensity distribution are irradiated onto the glass substrate 50 through the f-θ lens 33a.

Furthermore, the lens used for the laser beams synthesized by the first semicircular mirror 33f is not limited to the f-θ lens.

The laser beams synthesized by the first semicircular mirror 33f are irradiated onto the glass substrate 50 with the peak of the intensity distribution along the X-axis direction which is the moving direction of the glass substrate 50 .

The scribing device having such a laser oscillator and optical system irradiates a laser beam having a pair of intensity distribution peaks along the X-axis direction onto the glass substrate 50 moving along the X-axis direction to heat the surface of the glass substrate 50 . Simultaneously, on the surface of the glass substrate 50 near the portion heated by the irradiation of the laser beam, dark cracks as scratch lines are formed on the glass substrate by spraying the cooling medium.

In this case, when the material and thickness of the glass substrate 50 to form dark cracks by the scribing device change, the laser beam reflected from the first mirror 33c to the first semicircular mirror 33f is adjusted by means of the moving stage 33d and/or 33d'. The position of the beam is adjusted by adjusting the peak interval of the intensity distribution of the laser spot formed on the surface of the glass substrate 50 by the laser beam. Thereby, it becomes a state suitable for the material etc. of the glass substrate 50. FIG. Thus, when a laser spot having a pair of peaks of the intensity distribution is formed on the glass substrate 50 along the moving direction of the glass substrate 50, the entire interior of the glass substrate 50 is effectively heated to a state necessary for forming dark cracks.

Therefore, the scribing device having the optical system shown in FIG. 3 can easily change various physical parameters of the laser beam irradiated on the glass substrate when conditions such as the material of the glass substrate 50 to be scribed change. In a state suitable for the glass substrate 50 , it is possible to easily cope with glass substrates under various conditions.

3( b ) is a schematic diagram describing the state of obtaining a laser spot having a pair of peaks of the intensity distribution with respect to the glass substrate 50 when the intensity distribution of the laser beams oscillated from the laser oscillators 34 a and 34 g is a Gaussian mode.

In addition, the distance between the peaks can be changed by adjusting the mobile stations 33d and 33d', and the arrangement order of the two peaks can be changed if necessary.

In addition, a plurality of laser spots shown in FIG. 8 can be formed on the glass substrate 50 by moving the first mirror 33c shown in FIG. The interval between the laser spots formed at this time is equal to the movement amount of the pitch feed of the first reflecting mirror 33c. By changing the amount of movement, when the conditions such as the material of the glass substrate 50 to be scribed change, the intervals of a plurality of laser beams irradiated on the glass substrate can be easily changed to be suitable for the state of the glass substrate 50. It is easy to correspond to glass substrates of various conditions.

When the intensity distribution of the laser beams oscillated from the laser oscillators 34a and 34g is a Gaussian mode, the outer peripheral portion of the laser spot formed on the glass substrate 50 does not directly participate in the heating of the glass substrate 50, and there is a possibility that the glass substrate 50 is lowered. Possibility of heating efficiency. Therefore, as shown in FIG. 3(c), it is preferable to make the intensity distribution of the laser beams oscillated by the laser oscillators 34a and 34g be non-Gaussian.

In addition, preferably, a plurality of laser oscillators, corresponding half-circle mirrors and a mechanism for moving the half-circle mirrors are added to the structure shown in FIG. , the laser spot formed on the glass substrate 50 has a structure in which a plurality of intensity distribution peaks are obtained along the moving direction of the glass substrate 50 .

Furthermore, the plurality of laser oscillators may be laser oscillators that oscillate laser beams of different wavelengths.

FIG. 4 is a schematic configuration diagram showing another example of the laser oscillator 34 and the optical system. In this case, only the first laser oscillator 34a is provided on the laser oscillator 34, and the laser beam oscillated by the laser oscillator 34a is irradiated on the second semi-transmissive semi-transmissive semi-conductor fixedly arranged on the mobile table 33b'. On the mirror (Ha-Fumila-) 33b. The second half mirror 33b splits the laser beam emitted from the laser oscillator 34a into a beam transmitted to the first mirror and a beam reflected downward.

The laser beam reflected downward by the second half mirror 33b is irradiated onto the first half mirror 33f by the second mirror 33e disposed below the second half mirror 33b.

Other configurations are the same as those of the laser oscillator and optical system shown in FIG. 3 .

In the case of this structure, the laser beam split by the second half mirror 33b is synthesized by the first half mirror 33f, and is irradiated on the glass substrate 50 through the f-theta lens 33a, on the surface of the glass substrate 50 A laser spot is formed with a pair of peaks in the intensity distribution. Same as the situation of FIG. 3, by utilizing the movement of the moving platforms 33d, 33d' and 33b', adjusting the reflection position when the laser beam is reflected by the first reflector 33c to the first semicircular mirror, a part of the laser spot can be properly set. The interval between the peaks of the intensity distribution. Therefore, when conditions such as the material of the glass substrate 50 to be scribed change, the intensity distribution and the mutual interval of the laser beams irradiated on the glass substrate 50 can also be easily changed to be suitable for the state of the glass substrate 50. Easily respond to glass substrates under various conditions.

FIG. 4( b ) is a schematic diagram depicting a state where laser spots with a pair of thermal energy peaks are obtained with respect to the glass substrate 50 when the intensity distribution of the laser mode oscillated by the laser oscillator 34 a is a Gaussian mode.

In addition, by adjusting the mobile stations 33d, 33d', and 33b', the distance between the peaks can be changed, and the arrangement order of the two peaks can also be changed if necessary.

In addition, by moving the first mirror 33 c of FIG. 4( a ) in high-speed multiple-pitch feed, a plurality of laser spots as shown in FIG. 8 can be formed on the glass substrate 50 . The interval between the laser spots formed at this time is equal to the movement amount of the pitch feed of the first reflecting mirror 33c. By changing the amount of movement, when the conditions such as the material of the glass substrate 50 to be scribed change, the intervals of a plurality of laser beams irradiated on the glass substrate can be easily changed to be suitable for the state of the glass substrate 50, which can be easily achieved. Easily respond to glass substrates under various conditions.

In addition, in the case where the laser beams oscillated by one laser oscillator 34a are divided and then synthesized, when the intensity distribution of the laser beams emitted by the laser oscillator 34a is in a Gaussian mode, the laser beam formed on the glass substrate 50 The peripheral part of the light spot does not directly participate in heating too much after being irradiated during the scribing process of the glass substrate 50 , which will reduce the heating efficiency of the glass substrate 50 . Therefore, as shown in FIG. 4(c), it is preferable to make the intensity distribution of the laser beam emitted from the laser oscillator 34a be a non-Gaussian mode.

Industrial availability

In the technical field of scribing devices for brittle material substrates, the present invention can easily respond to changes in the type and thickness of brittle material substrates such as glass substrates on which dark cracks are formed, and can cope with various brittle substrates. Material substrates reliably form deep dark cracks.

Claims (3)

1, a kind of chalker of brittle substrate, form vertical crack along the cut preset lines, comprise: at least one laser oscillator, send laser beam continuous or that shine intermittently at a high speed, with zone, form the low laser radiation hot spot of temperature than the softening point of this brittle substrate along the lip-deep predetermined formation score line of brittle substrate; Optical facilities are carried out optical treatment to the laser beam that is sent by this laser oscillator vibration, and are adjusted the sweep speed and the scanning pattern of this hot spot, or form single or multiple hot spot, or change intensity distributions; Cooling body, supply are used for cooling off continuously near the cooling medium of this laser radiation hot spot,

It is characterized in that,

The following formation of these optical facilities: the laser beam that irradiation is sent by this laser oscillator vibration, utilize the laser beam of irradiation on this brittle substrate, to form a plurality of laser faculas, and adjust the sweep speed and the scanning pattern of the laser beam of irradiation, a plurality of laser faculas have the peak value of a plurality of intensity distributions respectively;

When this brittle substrate is thicker than the brittle substrate at the interval that is suitable for predefined described a plurality of laser faculas, and, when the thermal conductivity ratio of this brittle substrate is suitable for the thermal conductivity of brittle substrate at interval of predefined described a plurality of laser faculas when low, under one of them kind situation, adjust the interval of the described a plurality of laser faculas that form along this cut preset lines by this optical facilities, make it interval less than predefined described a plurality of laser faculas, and, set the peak intervals of the intensity distributions of described a plurality of laser faculas for peak intervals less than the intensity distributions of predefined described a plurality of laser faculas; And,

When the thickness of this brittle substrate during than the thin thickness of the brittle substrate at the interval that is suitable for predefined described a plurality of laser faculas, and, when the thermal conductivity ratio of this brittle substrate is suitable for the thermal conductivity of brittle substrate at interval of predefined described a plurality of laser faculas when high, under one of them kind situation, set the interval of the described a plurality of laser faculas that form along this cut preset lines by this optical facilities, make it interval greater than described a plurality of laser faculas, and, set the peak intervals of the intensity distributions of described a plurality of laser faculas for peak intervals greater than the intensity distributions of predefined described a plurality of laser faculas.

2, the chalker of brittle substrate as claimed in claim 1 is characterized in that, the intensity distributions of aforementioned a plurality of laser faculas is non-gaussian models.

3, a kind of scribble method of brittle substrate, form vertical crack along the cut preset lines, comprise: from least one laser oscillator irradiating laser light beam intermittently continuously or at a high speed, with zone along the lip-deep predetermined formation score line of brittle substrate, the step of the laser radiation hot spot that formation is lower than the temperature of the softening point of this brittle substrate;

Utilize optical facilities that the laser beam from above-mentioned laser oscillator is carried out optical treatment, and adjust the sweep speed and the scanning pattern of this hot spot, or form single or multiple hot spot, or change the step of intensity distributions,

Utilize to supply with the cooling body of the cooling medium that are used to cool off, the step that the near zone of described laser facula is cooled off continuously,

It is characterized in that,

The following formation of these optical facilities: the laser beam that irradiation is sent by this laser oscillator vibration, utilize the laser beam of irradiation on this brittle substrate, to form a plurality of laser faculas, and adjust the sweep speed and the scanning pattern of the laser beam of irradiation, a plurality of laser faculas have the peak value of a plurality of intensity distributions respectively;

Carry out following action by these optical facilities:

When this brittle substrate is thicker than the brittle substrate at the interval that is suitable for predefined described a plurality of laser faculas, and, when the thermal conductivity ratio of this brittle substrate is suitable for the thermal conductivity of brittle substrate at interval of predefined described a plurality of laser faculas when low, under one of them kind situation, adjust the interval of the described a plurality of laser faculas that form along this cut preset lines by this optical facilities, make it interval less than predefined described a plurality of laser faculas, and, set the peak intervals of the intensity distributions of described a plurality of laser faculas for peak intervals less than the intensity distributions of predefined described a plurality of laser faculas; And,

When the thickness of this brittle substrate during than the thin thickness of the brittle substrate at the interval that is suitable for predefined described a plurality of laser faculas, and, when the thermal conductivity ratio of this brittle substrate is suitable for the thermal conductivity of brittle substrate at interval of predefined described a plurality of laser faculas when high, under one of them kind situation, set the interval of the described a plurality of laser faculas that form along this cut preset lines by this optical facilities, make it interval greater than described a plurality of laser faculas, simultaneously, the peak intervals of the intensity distributions of described a plurality of laser faculas is set for peak intervals greater than the intensity distributions of predefined described a plurality of laser faculas.

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