CN120033131A - Optical alignment device, optical alignment method and storage medium - Google Patents
Optical alignment device, optical alignment method and storage medium Download PDFInfo
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- CN120033131A CN120033131A CN202311562652.XA CN202311562652A CN120033131A CN 120033131 A CN120033131 A CN 120033131A CN 202311562652 A CN202311562652 A CN 202311562652A CN 120033131 A CN120033131 A CN 120033131A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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Abstract
The invention provides an optical alignment device, an optical alignment method and a computer readable storage medium. The optical alignment device comprises a microscope objective, a first camera, a second camera, an infrared light source and a controller. The first end of the microscope objective is oriented towards the first sample and the second sample to be aligned. The first camera is aligned with the second end of the microscope objective via a first semi-reflective semi-transparent lens. The second camera is aligned to the second end of the microscope objective via a first mirror and the first half mirror. The infrared light source is configured to provide infrared light to a first end of the microscope objective that penetrates the first sample and/or the second sample. The wafer and the chip are aligned by sharing the microscope objective, so that the chip can be prevented from being horizontally moved greatly after being positioned, and the alignment precision of the wafer and the chip and whether bubbles exist on the bonding surface can be directly detected, so that the bonding quality of the wafer and the chip is improved.
Description
Technical Field
The present invention relates to the field of semiconductor device processing, and more particularly, to an optical alignment device, an optical alignment method, and a computer readable storage medium.
Background
In the process of semiconductor device fabrication, the bonding process of the wafer and the chip is critical. Prior to bonding, semiconductor processing equipment is required to align the wafer with the die. A common alignment method is to position the wafer and the die using two optical microscopy systems, respectively. However, the positioned chip also needs to be horizontally moved by a large margin to complete bonding. Thus, the mechanical movement of this method increases the alignment error, affecting the bonding accuracy. In addition, the existing semiconductor processing equipment needs to be provided with an additional detection module for detecting the bonding precision and whether bubbles are generated on the bonding surface.
In order to overcome the above-mentioned drawbacks of the prior art, there is a need in the art for an improved optical alignment device that can avoid a large horizontal movement of the die after positioning, and can directly detect the alignment accuracy of the wafer and the die and whether there is a bubble on the bonding surface, so as to improve the bonding quality of the wafer and the die.
Disclosure of Invention
The following presents a simplified summary of one or more aspects in order to provide a basic understanding of such aspects. This summary is not an extensive overview of all contemplated aspects, and is intended to neither identify key or critical elements of all aspects nor delineate the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that is presented later.
In order to overcome the defects in the prior art, the invention provides an optical alignment device, an optical alignment method and a computer readable storage medium, which can align a wafer with a chip by sharing a microscope objective, avoid the chip from greatly moving horizontally after positioning, and can directly detect the alignment precision of the wafer with the chip and whether bubbles exist on a bonding surface so as to improve the bonding quality of the wafer with the chip.
Specifically, the optical alignment device provided according to the first aspect of the present invention includes a microscope objective, a first camera, a second camera, an infrared light source, and a controller. The first end of the microscope objective is oriented towards the first sample and the second sample to be aligned. The first camera is aligned with the second end of the microscope objective via a first semi-reflective semi-transparent lens. The second camera is aligned to the second end of the microscope objective via a first mirror and the first half mirror. The infrared light source is configured to provide infrared light to a first end of the microscope objective that penetrates the first sample and/or the second sample. The controller is configured to focus the microscope objective onto the first sample at a first time instant for one of the first camera and the second camera to acquire a first image of the first sample, focus the microscope objective onto the second sample at a second time instant for the other of the first camera and the second camera to acquire a second image of the second sample, and determine an amount of lateral offset of the first sample and/or the second sample based on a planar position of the first image and the second image.
Further, in some embodiments of the present invention, a first barrel and a second barrel are further included. The first barrel lens is arranged between the first camera and the first semi-reflecting semi-transparent lens. The controller focuses the microscope objective on a first surface of the first sample facing the second sample by adjusting the distance between the first barrel lens and the first camera, and/or a second barrel lens arranged between the second camera and the first reflecting lens. The controller focuses the microscope objective on a second surface of the second sample facing the first sample by adjusting a distance between the second barrel lens and the second camera.
Further, in some embodiments of the invention, the microscope objective is disposed above the first sample and the second sample. The infrared light source is arranged below the first sample and the second sample, and provides infrared light penetrating through the first sample and the second sample for the first end of the microscope objective in a back illumination mode.
Further, in some embodiments of the present invention, the infrared light source is disposed on a side of the first sample and the second sample, and projects onto the first surface of the first sample above via the second mirror to provide the first end of the microscope objective with infrared light penetrating the first sample.
Further, in some embodiments of the present invention, the second mirror is a second half mirror. The second half-reflecting half-mirror is positioned between the first half-reflecting half-lens and the microscope objective lens so as to vertically project the infrared light rays incident from the side surface of the infrared light source to the first surface of the first sample.
Further, in some embodiments of the invention, a lateral displacement mechanism is also included. The transverse displacement mechanism is connected with the first sample and/or the second sample and is used for transversely adjusting the position of the first sample and/or the second sample according to the transverse deviation amount so as to align the first sample and the second sample.
Further, in some embodiments of the invention, a longitudinal displacement mechanism is also included. The longitudinal displacement mechanism is for longitudinally adjusting a position of the first sample and/or the second sample after aligning the first sample and the second sample to bond a first surface of the first sample to a second surface of the second sample.
Further, in some embodiments of the present invention, the controller is further configured to focus the micro-objective onto the first sample at a third time after the bonding is completed for the one of the first camera and the second camera to acquire a third image of the first sample, to focus the micro-objective onto the second sample at a fourth time after the bonding is completed for the other of the first camera and the second camera to acquire a fourth image of the second sample, and to determine an alignment accuracy of the first sample and the second sample based on a planar position of the third image and the fourth image.
Further, in some embodiments of the invention, the controller is further configured to parse the third image and/or the fourth image to determine whether there is a bubble on a bonding surface of the first sample and the second sample.
Further, in some embodiments of the present invention, the first sample and the second sample are selected from a wafer or an integrated circuit chip.
Further, the optical alignment method provided according to the second aspect of the invention comprises the steps of focusing a micro objective onto a first sample at a first end of the micro objective for a first camera at a second end of the micro objective to collect a first image of the first sample, focusing the micro objective onto a second sample at the first end of the micro objective for a second camera to provide an infrared light penetrating through the first sample and/or the second sample to the first end of the micro objective via an infrared light source to collect a second image of the second sample, and determining the lateral deviation amount of the first sample and/or the second sample according to the plane positions of the first image and the second image.
Further, the above-described computer-readable storage medium according to the second aspect of the present invention has stored thereon computer instructions. The computer instructions, when executed by a processor, implement the optical alignment method as provided by the second aspect of the invention.
Drawings
The above features and advantages of the present invention will be better understood after reading the detailed description of embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily to scale and components having similar related features or characteristics may have the same or similar reference numerals.
Fig. 1 illustrates a schematic diagram of an optical alignment device provided in accordance with some embodiments of the present invention.
Fig. 2 illustrates a schematic structural diagram of an optical alignment device provided in accordance with some embodiments of the present invention.
Fig. 3 illustrates a schematic diagram of an optical alignment device provided in accordance with some embodiments of the present invention.
Fig. 4 illustrates a flow diagram of an optical alignment method provided in accordance with some embodiments of the invention.
Fig. 5 illustrates a flow diagram of a detection method provided in accordance with some embodiments of the present invention.
Reference numerals:
10. Infrared light source
11. Microscope objective
12. First camera
13. Second camera
14. First sample
15. Second sample
16. First half reflecting half mirror
17. First reflecting mirror
18. First cylindrical lens
19. Second cylindrical lens
21. Second half-reflecting mirror
Detailed Description
Further advantages and effects of the present invention will become apparent to those skilled in the art from the disclosure of the present specification, by describing the embodiments of the present invention with specific examples. While the description of the invention will be presented in connection with a preferred embodiment, it is not intended to limit the inventive features to that embodiment. Rather, the purpose of the invention described in connection with the embodiments is to cover other alternatives or modifications, which may be extended by the claims based on the invention. The following description contains many specific details for the purpose of providing a thorough understanding of the present invention. The invention may be practiced without these specific details. Furthermore, some specific details are omitted from the description in order to avoid obscuring the invention.
In the description of the present invention, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected via an intervening medium, or in communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal", "vertical" as used in the following description should be understood as referring to the orientation depicted in this paragraph and the associated drawings. This relative terminology is for convenience only and is not intended to be limiting of the invention as it is described in terms of the apparatus being manufactured or operated in a particular orientation.
It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various elements, regions, layers and/or sections, these elements, regions, layers and/or sections should not be limited by these terms and these terms are merely used to distinguish between different elements, regions, layers and/or sections. Accordingly, a first component, region, layer, and/or section discussed below could be termed a second component, region, layer, and/or section without departing from some embodiments of the present invention.
As described above, a common alignment method is to position the wafer and the chip by two optical microscope systems, respectively. However, the positioned chip also needs to be horizontally moved by a large margin to complete bonding. Thus, the mechanical movement of this method increases the alignment error, affecting the bonding accuracy. In addition, the existing semiconductor processing equipment needs to be provided with an additional detection module for detecting the bonding precision and whether bubbles are generated.
In order to overcome the defects in the prior art, the invention provides an optical alignment device, an optical alignment method and a computer readable storage medium, which can align a wafer with a chip by sharing a microscope objective, avoid the chip from greatly moving horizontally after positioning, and can directly detect the alignment precision of the wafer with the chip and whether bubbles exist on a bonding surface so as to improve the bonding quality of the wafer with the chip.
In some non-limiting embodiments, the above optical alignment method provided by the second aspect of the present invention may be implemented based on the above optical alignment device provided by the first aspect of the present invention. Specifically, the optical alignment device may be provided with a memory and a controller. The memory includes, but is not limited to, the above-described computer-readable storage medium provided by the third aspect of the present invention, having stored thereon computer instructions. The controller is coupled to the memory and configured to execute computer instructions stored on the memory to implement the above-described optical alignment method provided by the second aspect of the present invention.
Referring specifically to fig. 1 and 2, fig. 1 is a schematic diagram illustrating an optical alignment device according to some embodiments of the present invention, and fig. 2 is a schematic diagram illustrating a structure of the optical alignment device according to some embodiments of the present invention.
In the embodiment shown in fig. 1 and 2, the optical alignment device according to the first aspect of the present invention includes a micro objective 11, a first camera 12, a second camera 13, an infrared light source 10 and a controller. The first end of the microscope objective 11 is directed towards the first sample 14 and the second sample 15 to be aligned. The first camera 12 is aligned with the second end of the microscope objective 11 via a first half mirror 16. The second camera 13 is aligned with the second end of the microscope objective 11 via a first mirror 17 and a first half mirror 16. The infrared light source 10 is arranged to provide infrared light to a first end of the micro objective 11 penetrating the first sample 14 and/or the second sample 15. Here, the first sample 14 and the second sample 15 are selected from a wafer or an integrated circuit chip.
In addition, the optical alignment device provided in the first aspect of the present invention further includes a first barrel 18 and a second barrel 19. The first barrel 18 is disposed between the first camera 12 and the first half mirror 16. Here, the controller may focus the microscope objective 11 on the first surface of the first sample 14 toward the second sample 15 by adjusting the distance between the first barrel 18 and the first camera 12. Similarly, the second barrel mirror 19 is disposed between the second camera 13 and the first mirror 17. Here, the controller may focus the micro objective 11 on the second surface of the second sample 15 facing the first sample 14 by adjusting the distance between the second barrel lens 19 and the second camera 13.
Further, in some embodiments, the micro objective 11 is disposed above the first sample 14 and the second sample 15. The infrared light source 10 is optionally disposed under the first sample 14 and the second sample 15, and provides infrared light penetrating the first sample 14 and the second sample 15 to the first end of the microscope objective 11 by means of back illumination.
Referring to fig. 3, fig. 3 is a schematic diagram illustrating an optical alignment device according to some embodiments of the invention.
In the embodiment shown in fig. 3, the infrared light source 10 is optionally disposed on the side of the first sample 14 and the second sample 15, and is projected onto the first surface of the first sample 14 above via the second mirror to provide the first end of the microscope objective 11 with infrared light penetrating the first sample 14. The second mirror may be a second half mirror 21. The second half mirror 21 is located between the first half mirror 16 and the micro objective 11 to vertically project the side-incident infrared light of the infrared light source 10 onto the first surface of the first sample 14.
Furthermore, the optical alignment device provided in the first aspect of the present invention further comprises a lateral displacement mechanism. The lateral displacement mechanism is connected to the first sample 14 and/or the second sample 15, and is used for laterally adjusting the position of the first sample 14 and/or the second sample 15 according to the lateral deviation amount so as to align the first sample 14 and the second sample 15.
Furthermore, the optical alignment device provided in the first aspect of the present invention further comprises a longitudinal displacement mechanism. The longitudinal displacement mechanism is used to longitudinally adjust the position of the first sample 14 and/or the second sample 15 after aligning the first sample 14 and the second sample 15 to bond the first surface of the first sample 14 to the second surface of the second sample 15.
The working principle of the above-described optical alignment device will be described below in connection with some embodiments of the optical alignment method. It will be appreciated by those skilled in the art that these examples of alignment methods are merely some non-limiting embodiments provided by the present invention, and are intended to clearly illustrate the general concepts of the present invention and to provide some embodiments that are convenient for public implementation, rather than limiting the overall functionality or overall operation of the optical alignment device. Likewise, the optical alignment device is just a non-limiting embodiment provided by the present invention, and does not limit the execution bodies and execution sequences of the steps in the optical alignment methods.
Referring specifically to fig. 4, fig. 4 is a flow chart illustrating an optical alignment method according to some embodiments of the invention.
As shown in fig. 4, at a first moment in time, the controller may first focus the micro objective 11 onto the first sample 14 by adjusting the distance between the first barrel 18 and the first camera 12 for one of the first camera 12 and the second camera 13 to acquire a first image of the first sample 14. Then, at a second instant in time, the controller may focus the microscope objective 11 onto the second sample 15 by adjusting the distance between the second barrel mirror 19 and the second camera 13 for the other of the first camera 12 and the second camera 13 to acquire a second image of the second sample 15. The controller may then determine the amount of lateral deviation of the first sample 14 and/or the second sample 15 based on the planar positions of the first image and the second image.
The controller of the optical alignment device may then control the lateral displacement mechanism to laterally adjust the position of the first sample 14 and/or the second sample 15 according to the lateral deviation amount, so as to align the first sample 14 and the second sample 15.
Still further, the controller of the optical alignment device may continue to control the longitudinal displacement mechanism to longitudinally adjust the position of the first sample 14 and/or the second sample 15 to bond the first surface of the first sample 14 to the second surface of the second sample 15.
Referring to fig. 5, fig. 5 is a flow chart illustrating a detection method according to some embodiments of the invention.
As shown in fig. 5, the optical alignment device provided in the first aspect of the present invention may further detect the alignment accuracy of the first sample 14 and the second sample 15. At a third time after bonding is completed, the controller may again focus the micro objective 11 onto the first sample 14 by adjusting the distance between the first barrel 18 and the first camera 12 for one of the first camera 14 and the second camera 14 to acquire a third image of the first sample 14. Then, at a fourth time after bonding is completed, the controller may focus the micro objective 11 onto the second sample 15 by adjusting the distance between the second barrel 19 and the second camera 13 for the other of the first camera 12 and the second camera 13 to acquire a fourth image of the second sample 15. Finally, the controller may determine the alignment accuracy of the first sample 14 and the second sample 15 according to the plane positions of the third image and the fourth image.
Further, the controller of the optical alignment device may analyze the third image and/or the fourth image to determine whether there is a bubble on the bonding surface of the first sample 14 and the second sample 15.
In summary, the optical alignment device, the optical alignment method and the computer readable storage medium provided by the invention can align the wafer and the chip by sharing one microscope objective, avoid the large horizontal movement of the chip after positioning, and can directly detect the alignment precision of the wafer and the chip and whether bubbles exist on the bonding surface so as to improve the bonding quality of the wafer and the chip.
While, for purposes of simplicity of explanation, the methodologies are shown and described as a series of acts, it is to be understood and appreciated that the methodologies are not limited by the order of acts, as some acts may, in accordance with one or more embodiments, occur in different orders and/or concurrently with other acts from that shown and described herein or not shown and described herein, as would be understood and appreciated by those skilled in the art.
The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (12)
1. An optical alignment device, comprising:
a microobjective having a first end facing the first sample and the second sample to be aligned;
a first camera aligned with a second end of the microobjective via a first semi-reflective semi-transparent mirror;
a second camera aligned to a second end of the microscope objective through a first mirror and the first half mirror;
An infrared light source for providing an infrared light beam penetrating the first sample and/or the second sample to a first end of the microscope objective, and
A controller configured to focus the microscope objective onto the first sample at a first time instant for one of the first camera and the second camera to acquire a first image of the first sample, to focus the microscope objective onto the second sample at a second time instant for the other of the first camera and the second camera to acquire a second image of the second sample, and to determine an amount of lateral deviation of the first sample and/or the second sample based on a planar position of the first image and the second image.
2. The optical alignment device of claim 1, further comprising:
a first cylindrical lens arranged between the first camera and the first half-reflecting half-transmitting lens, wherein the controller focuses the microscope objective on the first surface of the first sample towards the first surface of the second sample by adjusting the distance between the first cylindrical lens and the first camera, and/or
And the second cylindrical lens is arranged between the second camera and the first reflecting mirror, and the controller enables the micro objective lens to focus on the second surface of the second sample facing the first sample by adjusting the distance between the second cylindrical lens and the second camera.
3. The optical alignment device of claim 1, wherein the microscope objective is disposed above the first sample and the second sample,
The infrared light source is arranged below the first sample and the second sample, and provides infrared light penetrating through the first sample and the second sample for the first end of the microscope objective in a back illumination mode.
4. The optical alignment device of claim 1, wherein the infrared light source is disposed on a side of the first sample and the second sample and projects onto the first surface of the first sample above via a second mirror to provide infrared light to the first end of the microscope objective that penetrates the first sample.
5. The optical alignment device of claim 4, wherein the second mirror is a second half mirror, wherein the second half mirror is positioned between the first half mirror and the microscope objective lens to project the infrared light from the infrared light source perpendicularly to the first surface of the first sample.
6. The optical alignment device of claim 1, further comprising:
And the transverse displacement mechanism is connected with the first sample and/or the second sample and is used for transversely adjusting the position of the first sample and/or the second sample according to the transverse deviation so as to align the first sample and the second sample.
7. The optical alignment device of claim 6, further comprising:
a longitudinal displacement mechanism for longitudinally adjusting the position of the first sample and/or the second sample after aligning the first sample and the second sample to bond a first surface of the first sample to a second surface of the second sample.
8. The optical alignment device of claim 7, wherein the controller is further configured to:
Focusing the microscope objective onto the first sample at a third time after the bonding is completed for the one of the first camera and the second camera to acquire a third image of the first sample;
Focusing the microscope objective onto the second sample at a fourth time after the bonding is completed for the other of the first camera and the second camera to acquire a fourth image of the second sample, and
And determining the alignment precision of the first sample and the second sample according to the plane positions of the third image and the fourth image.
9. The optical alignment device of claim 8, wherein the controller is further configured to:
analyzing the third image and/or the fourth image to judge whether bubbles exist on the bonding surface of the first sample and the second sample.
10. The optical alignment device of claim 1, wherein the first sample and the second sample are selected from a wafer or an integrated circuit chip.
11. An optical alignment method, comprising the steps of:
focusing a microscope objective onto a first sample at a first end of the microscope objective at a first moment, so that a first camera at a second end of the microscope objective acquires a first image of the first sample;
Focusing the microscope objective onto a second sample at a first end thereof at a second moment in time for a second camera to provide infrared light penetrating the first sample and/or the second sample to the first end of the microscope objective via an infrared light source, acquiring a second image of the second sample, and
And determining the transverse deviation amount of the first sample and/or the second sample according to the plane positions of the first image and the second image.
12. A computer readable storage medium having stored thereon computer instructions which, when executed by a processor, implement the optical alignment method of claim 11.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311562652.XA CN120033131A (en) | 2023-11-21 | 2023-11-21 | Optical alignment device, optical alignment method and storage medium |
| PCT/CN2024/097118 WO2025107571A1 (en) | 2023-11-21 | 2024-06-03 | Optical alignment device, optical alignment method, and storage medium |
| KR1020240115928A KR20250075437A (en) | 2023-11-21 | 2024-08-28 | Optical alignment device, optical alignment method and storage medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311562652.XA CN120033131A (en) | 2023-11-21 | 2023-11-21 | Optical alignment device, optical alignment method and storage medium |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN120033131A true CN120033131A (en) | 2025-05-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311562652.XA Pending CN120033131A (en) | 2023-11-21 | 2023-11-21 | Optical alignment device, optical alignment method and storage medium |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20250075437A (en) |
| CN (1) | CN120033131A (en) |
| WO (1) | WO2025107571A1 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08111600A (en) * | 1994-10-07 | 1996-04-30 | Nippon Telegr & Teleph Corp <Ntt> | High-precision mounting marker, high-precision mounting device, and high-precision mounting method |
| IL148566A (en) * | 2002-03-07 | 2007-06-17 | Nova Measuring Instr Ltd | Method and system for overlay measurement |
| US8139219B2 (en) * | 2008-04-02 | 2012-03-20 | Suss Microtec Lithography, Gmbh | Apparatus and method for semiconductor wafer alignment |
| JP7222702B2 (en) * | 2018-12-26 | 2023-02-15 | 三星電子株式会社 | WAFER BONDING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND THEREOF |
| US20220344192A1 (en) * | 2021-04-26 | 2022-10-27 | Kla Corporation | Systems and methods for absolute sample positioning |
-
2023
- 2023-11-21 CN CN202311562652.XA patent/CN120033131A/en active Pending
-
2024
- 2024-06-03 WO PCT/CN2024/097118 patent/WO2025107571A1/en active Pending
- 2024-08-28 KR KR1020240115928A patent/KR20250075437A/en active Pending
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| KR20250075437A (en) | 2025-05-28 |
| WO2025107571A1 (en) | 2025-05-30 |
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