CN120142069B - Method for detecting foreign matter in a semiconductor workpiece storage device to be cleaned and cleaning equipment - Google Patents
Method for detecting foreign matter in a semiconductor workpiece storage device to be cleaned and cleaning equipmentInfo
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- CN120142069B CN120142069B CN202510629018.6A CN202510629018A CN120142069B CN 120142069 B CN120142069 B CN 120142069B CN 202510629018 A CN202510629018 A CN 202510629018A CN 120142069 B CN120142069 B CN 120142069B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N5/00—Analysing materials by weighing, e.g. weighing small particles separated from a gas or liquid
- G01N5/02—Analysing materials by weighing, e.g. weighing small particles separated from a gas or liquid by absorbing or adsorbing components of a material and determining change of weight of the adsorbent, e.g. determining moisture content
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/16—Sorting according to weight
- B07C5/28—Sorting according to weight using electrical control means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/38—Collecting or arranging articles in groups
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
- B08B9/20—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought
- B08B9/42—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought the apparatus being characterised by means for conveying or carrying containers therethrough
- B08B9/44—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought the apparatus being characterised by means for conveying or carrying containers therethrough the means being for loading or unloading the apparatus
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/34—Purifying; Cleaning
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/90—Investigating the presence of flaws or contamination in a container or its contents
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- General Physics & Mathematics (AREA)
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- Health & Medical Sciences (AREA)
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The application relates to a method for detecting foreign matters in a semiconductor workpiece storage device to be cleaned and cleaning equipment. The detection method comprises the steps of obtaining label information of a semiconductor workpiece storage device, obtaining a current weight value of the semiconductor workpiece storage device, retrieving a reference weight value of the semiconductor workpiece storage device related to the label information from a database, triggering a first detection instruction if the reference weight value does not exist in the database, otherwise, comparing the current weight value with the reference weight value, triggering the first detection instruction when a difference value between the current weight value and the reference weight value exceeds a preset threshold value, wherein the first detection instruction is used for executing separation action of a box body and a cover body of the semiconductor workpiece storage device and detecting whether foreign matters exist in the box body and the cover body, and finishing detection when the difference value between the current weight value and the reference weight value is within the preset threshold value range. The detection method can ensure the detection accuracy and the detection efficiency.
Description
Technical Field
The application relates to the technical field of semiconductors, in particular to a method for detecting foreign matters in a semiconductor workpiece storage device to be cleaned and cleaning equipment.
Background
During semiconductor wafer fabrication, wafers are stored in FOUPs (Front Opening Unified Pod, front opening unified pods) for transfer between different process tools. Since the wafers after being subjected to different processes, particularly after a wet chemical process, may generate adhering contaminants on the wafer surface, the adhering contaminants may contaminate the FOUP when stored inside the FOUP, thereby contaminating the wafers stored in the next lot. Therefore, the FOUP is sent to special equipment for cleaning at regular intervals to ensure the cleanliness of the FOUP.
In fact, in the case where there is a residual wafer in the FOUP that is fed into the full-automatic cleaning machine for cleaning, the wafer or wafer fragment remaining in the FOUP may not only damage the full-automatic cleaning machine, but also damage the residual wafer, causing a large loss to the wafer processing factory.
Therefore, it is necessary to confirm whether or not a wafer remains in the FOUP before cleaning the FOUP.
However, the conventional FOUP has complicated detection procedures and low detection efficiency, and affects the cleaning efficiency of the whole cleaning device.
Disclosure of Invention
In view of the above, an embodiment of the present application provides a method for detecting a foreign object in a semiconductor workpiece storage device to be cleaned and a cleaning apparatus for solving at least one of the problems in the related art.
In a first aspect, an embodiment of the present application provides a method for detecting a foreign object in a semiconductor workpiece storage device to be cleaned, the method including:
acquiring label information of a semiconductor workpiece storage device;
Acquiring a current weight value of the semiconductor workpiece storage device;
retrieving from a database a reference weight value of the semiconductor workpiece storage device associated with the tag information;
If the reference weight value does not exist in the database, triggering a first detection instruction, otherwise, comparing the current weight value with the reference weight value;
When the difference value between the current weight value and the reference weight value exceeds a preset threshold value, triggering the first detection instruction, wherein the first detection instruction is used for executing the separation action of the box body and the cover body of the semiconductor workpiece storage device and confirming whether foreign matters exist in the box body and the cover body;
and finishing detection when the difference value between the current weight value and the reference weight value is within the preset threshold range.
With reference to the first aspect of the present application, in an alternative embodiment, the semiconductor workpiece storage device is cleaned with a cleaning apparatus;
The triggering the first detection instruction comprises:
arranging the semiconductor workpiece storage device to be cleaned at a loading station of a loading unit of the cleaning equipment;
moving the semiconductor workpiece storage device located at the loading station to a detection station of the loading unit;
unlocking by using an unlocking mechanism to separate a box body and a cover body of the semiconductor workpiece storage device, wherein the semiconductor workpiece storage device comprises the box body and the cover body, and the cover body is detachably connected with the box body;
and detecting the foreign matters in the box body by using a detection assembly, wherein the foreign matters comprise wafers and/or wafer fragments.
With reference to the first aspect of the present application, in an optional implementation manner, the detection method further includes:
And responding to the first detection instruction, and utilizing a detection assembly to confirm whether foreign matters exist in the semiconductor workpiece storage device, wherein the detection assembly comprises a visual detection device and a photoelectric detection device.
With reference to the first aspect of the present application, in an optional implementation manner, the detection method further includes:
if the detection result of the detection component is qualified or the difference value between the current weight value and the reference weight value is within the preset threshold value range, transferring the semiconductor workpiece storage device to a buffer station of the loading unit or a cleaning unit of the cleaning equipment for cleaning, wherein the buffer station is positioned in the cleaning equipment;
And if the detection result of the detection component is unqualified, returning the semiconductor workpiece storage device to the loading station, wherein the loading station is positioned outside the cleaning equipment.
With reference to the first aspect of the present application, in an optional implementation manner, when the difference between the current weight value and the reference weight value exceeds a preset threshold value and the foreign object detection result is qualified, the reference weight value of the semiconductor workpiece storage device stored in the database is updated based on the current weight value, and an electronic mark is performed.
With reference to the first aspect of the present application, in an optional implementation manner, the detection method further includes:
and recording the current weight value of each acquired semiconductor workpiece storage device so as to correct the preset threshold value.
With reference to the first aspect of the present application, in an optional implementation manner, the detection method further includes:
the semiconductor workpiece storage device is transferred between the loading station and the inspection station using a slide rail assembly.
With reference to the first aspect of the present application, in an optional implementation manner, if the foreign object detection result is qualified, the reference weight value of the semiconductor workpiece storage device stored in the database is updated based on the current weight value.
In combination with the first aspect of the present application, in an optional implementation manner, the preset threshold is set based on a first parameter of the semiconductor workpiece storage device and a second parameter of a wafer held by the semiconductor workpiece storage device, where the first parameter includes a type, a material, and a thickness of the semiconductor workpiece storage device, and the second parameter includes a type, a material, and a thickness of the wafer.
In a second aspect, an embodiment of the present application provides a cleaning apparatus for foreign matter in a semiconductor workpiece storage device, the cleaning apparatus including:
A first acquisition unit for acquiring tag information of the semiconductor workpiece storage device;
a second acquisition unit configured to acquire a current weight value of the semiconductor workpiece storage device;
A control unit for retrieving a reference weight value of the semiconductor workpiece storage device associated with the tag information from a database, and for triggering a first detection instruction when the reference weight value does not exist in the database, otherwise, comparing the current weight value with the reference weight value;
the detection unit is used for triggering the first detection instruction when the difference value between the current weight value and the reference weight value exceeds a preset threshold value, wherein the first detection instruction is used for detecting whether foreign matters exist in the semiconductor workpiece storage device or not, and the detection is completed when the difference value between the current weight value and the reference weight value is within the preset threshold value range.
The detection method for the foreign matters in the semiconductor workpiece storage device to be cleaned provided by the embodiment of the application comprises the steps of comparing the obtained current weight value of the semiconductor workpiece storage device with the reference weight value stored in the database, triggering a first detection instruction when the reference weight value does not exist in the database or the difference value between the current weight value and the reference weight value exceeds a threshold range, executing the separation action of the box body and the cover body of the semiconductor workpiece storage device and detecting whether the foreign matters exist in the box body and the cover body, and finishing detection when the difference value between the current weight value and the reference weight value is within the preset threshold range, wherein the detection method is used for detecting in a weighing detection mode in the detection process, and then detecting uncovering when the weighing detection mode is abnormal.
Additional aspects and advantages of the application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the application.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute a limitation on the application. In the drawings:
fig. 1 is a schematic structural view of a cleaning apparatus for a semiconductor workpiece storage device according to an embodiment of the present application;
FIG. 2 is a top view showing the overall structure of a cleaning apparatus for a semiconductor workpiece storage device according to an embodiment of the present application;
Fig. 3 is a schematic structural view of a semiconductor workpiece storage device and an unlocking mechanism in a cleaning apparatus for a semiconductor workpiece storage device according to an embodiment of the present application;
FIG. 4 is a schematic overall flow chart of a method for detecting foreign matters in a semiconductor workpiece storage device to be cleaned according to an embodiment of the present application;
FIG. 5 is a schematic diagram of a method for detecting a foreign object in a semiconductor workpiece storage device to be cleaned according to an embodiment of the present application;
Fig. 6 is a block diagram of a device for detecting foreign matters in a semiconductor workpiece storage device to be cleaned according to an embodiment of the present application.
Reference numerals:
100. A cleaning device;
10. A frame;
20. a loading unit; 210, a loading station, 220, a detection station, 230, a sliding rail assembly;
30. A cleaning unit;
40. 410, cover, 420, box;
50. and an unlocking mechanism.
Detailed Description
In order to make the technical scheme and the beneficial effects of the application more obvious and understandable, the following detailed description is given by way of example. Wherein the drawings are not necessarily to scale, and wherein local features may be exaggerated or minimized to more clearly show details of the local features, unless otherwise defined, technical and scientific terms used herein have the same meaning as those in the technical field to which the present application pertains.
In the description of the present invention, the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "height", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. refer to the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are merely for convenience of simplifying the description of the present invention, and do not indicate that the apparatus or element referred to must have a specific orientation, be constructed and operated in a specific orientation, i.e., are not to be construed as limiting the present invention.
In the present invention, the terms "first", "second" are used for descriptive purposes only and are not to be construed as relative importance of the features indicated or the number of technical features indicated. Thus, a feature defining "first", "second" may explicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., and "a number" means at least one, such as one, two, three, etc., unless explicitly specified otherwise.
In the present invention, the terms "mounted," "connected," "secured," "disposed," and the like are to be construed broadly, unless otherwise specifically limited. For example, "connected" may be either fixedly connected or detachably connected or integrally formed, mechanically connected or electrically connected, directly connected or indirectly connected via an intermediate medium, or communicated between two elements or an interaction relationship between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present invention, unless explicitly defined otherwise, a first feature "on", "above", "over" and "above", "below" or "under" a second feature may be that the first feature and the second feature are in direct contact, or that the first feature and the second feature are in indirect contact via an intermediary. Moreover, a first feature "above," "over" and "on" a second feature may be that the first feature is directly above or obliquely above the second feature, or simply indicates that the level of the first feature is higher than the level of the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the level of the first feature is less than the level of the second feature.
In some embodiments, the semiconductor workpiece storage device may be a FOUP (i.e. front opening unified pod), a FOSB (Front Opening Shipping Box, front opening unified pod), a reticle pod for storing a reticle, etc., and may be a storage pod for other purposes, and the specific structural style or type of the semiconductor workpiece storage device to be cleaned is not particularly limited.
Referring to fig. 1 to 3, an embodiment of the present application provides a cleaning apparatus 100 for a semiconductor workpiece storage device, wherein the cleaning apparatus 100 includes a frame 10, a loading unit 20, a weighing assembly (not shown), a cleaning unit 30, and a detecting assembly (not shown).
Wherein, the frame 10 makes the cleaning device 100 have a closed processing space, and the cleanliness of the inner space of the frame 10 is far greater than that of the outer space of the frame 10. The cleaning unit 30 is located inside the housing 10 and is used for cleaning the semiconductor workpiece storage device 40. The inspection assembly is used to inspect the semiconductor workpiece storage device 40 for foreign matter, including wafers and/or wafer fragments.
The loading unit 20 is provided with a loading station 210, a detecting station 220 and a buffer station (not shown in the figure), wherein the loading station 210 is a station area for loading the semiconductor workpiece storage device 40 to be cleaned, the detecting station 220 is a station area for detecting the foreign matters in the semiconductor workpiece storage device 40, and the buffer station is a station area capable of receiving the semiconductor workpiece storage device 40 which is qualified in the foreign matters detection so as to facilitate the subsequent feeding into the cleaning unit 30 for cleaning.
The loading unit 20 further includes a slide rail assembly 230, and the semiconductor workpiece storage device 40 utilizes the slide rail assembly 230 to effect transfer between the loading station 210, the inspection station 220, and the buffer station.
The weighing assembly is used to weigh the semiconductor workpiece storage device 40 to obtain its current weight value. The weighing assembly may be located at the loading station 210 to obtain a current weight value of the semiconductor workpiece storage device 40 when the semiconductor workpiece storage device 40 is located at the loading station 210. Of course, the weighing assembly may be disposed at other stations, and embodiments of the present application are not limited. The weighing assembly may be a strain sensor, an electromagnetic force balance sensor, a piezoelectric sensor, or the like, and embodiments of the present application are not particularly limited.
The semiconductor workpiece storage device 40 includes a case 420 and a cover 410, the cover 410 is detachably connected to the case 420, and the case 420 and the cover 410 can be unlocked or locked. The cover 410 and the box 420 are locked or unlocked by using the knob assembly of the unlocking mechanism 50, that is, the knob assembly can realize the closed connection of the cover 410 and the box 420, and can also realize the separation of the cover 410 and the box 420. Specifically, when it is necessary to perform foreign matter detection on the semiconductor workpiece storage device 40, unlocking is performed by using the knob assembly of the unlocking mechanism 50 to separate the cover 410 from the case 420, and after the detection is completed, the cover 410 is locked to the case 420 by using the knob assembly of the unlocking mechanism 50.
The detection component is arranged in the frame body 10, so that the cleanliness of the detection component can be better guaranteed, and the detection component can adopt image shooting or scanning equipment such as a camera. In an alternative embodiment, the detection assembly may employ a laser scanning device. In an alternative embodiment, the laser scanning device adopts the opposite laser scanning device to detect the foreign matters, the emitting part and the receiving part can be installed relatively, when the substrate or the wafer shields the light, the output signal is immediately sent out, meanwhile, the thickness of the substrate or the wafer can be accurately calculated by combining with a servo matched encoder, and the small and bright light spots are easy to align due to the smaller appearance, the response time is faster (0.25 ms in an exemplary way), and the detection precision and reliability are higher. In some embodiments, the laser scanning device employs a reflective laser scanning device for foreign object detection, and also requires a very small spot laser diffuse reflection technique, in combination with a fast response time, to ensure accurate counting and anomaly determination of the substrate or wafer.
In addition, the scanning device is not limited to the laser scanning device, but may be a high-frequency light wave scanning device, a radar wave scanning device, or the like.
In some embodiments, after the detection component of the camera is used to obtain the scan image through the foreign object detection scanning, the scan image is further identified and judged, so that whether the semiconductor workpiece storage device 40 has the foreign object can be intuitively determined, the accuracy of the identification and judgment result is improved, and the specific position of the foreign object can be accurately determined.
In the related art, it is necessary to determine whether a wafer or wafer fragment remains in the semiconductor workpiece storage device 40 before cleaning, and in order to increase the throughput of the semiconductor workpiece storage device 40, it is generally performed by weighing, but in this detection method, a fixed qualification value needs to be set, and the difference between different semiconductor workpiece storage devices 40 is large, so that the phenomena of missing inspection and false inspection are liable to occur.
In addition, with the development of the process technology, the wafer cost increases, and the loss caused by the missing inspection increases, so that the missing inspection phenomenon must be avoided. In the actual use process of the semiconductor workpiece storage device 40, the semiconductor wafer processing factory or the semiconductor chip manufacturing factory will modify the semiconductor workpiece storage device 40 to a certain extent, when the semiconductor workpiece storage device 40 is damaged, the components (such as the handle and the cover 410) of the semiconductor workpiece storage device 40 are replaced, and the weight of the semiconductor workpiece storage device 40 will change accordingly, so if a fixed weighing detection fit value is set, the accuracy of the traditional weighing detection will be greatly reduced, and the requirement is not satisfied. And the uncapping detection of the semiconductor workpiece storage device needs to consume a great deal of time, so that the cleaning efficiency of the cleaning equipment is reduced.
Based on the above, the embodiment of the application provides a method for detecting foreign matters in a semiconductor workpiece storage device to be cleaned, which is characterized in that the method compares the obtained current weight value of the semiconductor workpiece storage device with a reference weight value stored in a database, when the reference weight value does not exist in the database or the difference value between the current weight value and the reference weight value exceeds a threshold range, a first detection instruction is triggered, namely, the separation action of a box body and a cover body of the semiconductor workpiece storage device is executed and whether the foreign matters exist in the box body and the cover body is detected, and when the difference value between the current weight value and the reference weight value is within the preset threshold range, the detection is completed.
Specifically, referring to fig. 4 and 5, a method for detecting a foreign object in a semiconductor workpiece storage device to be cleaned according to an embodiment of the present application includes the following steps:
S1, acquiring label information of a semiconductor workpiece storage device.
Each semiconductor workpiece storage device has own tag information, and the tag information not only corresponds to the information of the brand, model, type, weight and the like of the semiconductor workpiece storage device, but also stores a plurality of pieces of information of the wafer, such as the type of the wafer, the batch number, the process route and the like. The tag information is a two-dimensional code imprinted on the surface of the semiconductor workpiece storage device, but is not limited to this.
The label information not only can realize the seamless butt joint between the semiconductor workpiece storage device and equipment in the transportation process, but also can carry out quality tracing and batch management, logistics optimization, inventory management and the like.
S2, acquiring the current weight value of the semiconductor workpiece storage device.
S3, retrieving the reference weight value of the semiconductor workpiece storage device associated with the tag information from the database.
S4, if the reference weight value does not exist in the database, triggering a first detection instruction, otherwise, comparing the current weight value with the reference weight value.
And S5, triggering a first detection instruction when the difference value between the current weight value and the reference weight value exceeds a preset threshold value, wherein the first detection instruction is used for executing the separation action of the box body and the cover body of the semiconductor workpiece storage device and confirming whether foreign matters exist in the box body and the cover body.
And S6, finishing detection when the difference value between the current weight value and the reference weight value is within a preset threshold range.
According to the detection method, the current weight value of the semiconductor workpiece storage device is obtained by utilizing the weighing detection mode, the reference weight value of the semiconductor workpiece storage device stored in the database is obtained based on the label information of the semiconductor workpiece storage device, and when the difference value between the current weight value of the semiconductor workpiece storage device and the reference weight value is within the preset threshold range, detection is completed, so that the detection efficiency can be greatly improved. And if the reference weight value does not exist in the database or the difference value between the current weight value of the semiconductor workpiece storage device and the reference weight value exceeds a preset threshold value, performing cover opening detection, namely, executing the separation action of the box body and the cover body of the semiconductor workpiece storage device and confirming whether foreign matters exist in the box body and the cover body of the semiconductor workpiece storage device so as to ensure detection accuracy.
In addition, a database is established, and a mapping relation between the label information of each semiconductor workpiece storage device and the weight information of each semiconductor workpiece storage device when the semiconductor workpiece storage device is empty is established, so that in the actual judging process, different judging standards are determined based on different conditions of each semiconductor workpiece storage device, and the condition that the accuracy of different types of semiconductor workpiece storage devices is reduced due to the fact that one judging standard is shared can be greatly reduced.
The current weight value of the semiconductor workpiece storage device is compared with the reference weight value stored in the database by establishing the database, when the difference value between the current weight value and the reference weight value exceeds the preset threshold value, the semiconductor workpiece storage device can be judged to be abnormal, and whether the semiconductor workpiece storage device is abnormal due to the existence of foreign matters or the abnormality caused by the change of the self weight of the semiconductor workpiece storage device can be further judged through uncovering detection.
It should be noted that, the weighing detection of the cleaning apparatus on the semiconductor workpiece storage device can be completed in a very short time (for example, 2 s), and the detection efficiency of the weighing detection mode is far greater than that of the cleaning apparatus on the semiconductor workpiece storage device. In the actual processing process of the semiconductor workpiece storage devices, no foreign matters exist in most of the semiconductor workpiece storage devices, and the ratio of the number of the semiconductor workpiece storage devices with the foreign matters to the total number of the semiconductor workpiece storage devices is less than 1%, so that the vast majority of the semiconductor workpiece storage devices do not need to be subjected to uncovering detection in the detection process, and the detection efficiency can be greatly improved.
In an alternative embodiment, in step S4, when the semiconductor workpiece storage device is cleaned for the first time, since the weight information thereof is not recorded in the database, the open cover detection of the semiconductor workpiece storage device is required.
In an alternative embodiment, the detecting method further includes recording a current weight value of each of the obtained semiconductor workpiece storage devices to correct the preset threshold values in step S5 and step S6.
It can be understood that the function of the preset threshold value is to provide a certain tolerance for the weight information of the semiconductor workpiece storage device, so that misjudgment caused by factors such as abrasion of the semiconductor workpiece storage device, sensor errors and the like is avoided, the preset threshold value is optimized by analyzing the historical data, and the detection accuracy can be improved.
In an alternative embodiment, the preset threshold values in step S5 and step S6 are set based on a first parameter of the semiconductor workpiece storage device and a second parameter of the wafer held by the semiconductor workpiece storage device, where the first parameter includes a type and a material of the semiconductor workpiece storage device, and the second parameter includes a type, a material and a thickness of the wafer. The type and the material of the semiconductor workpiece storage device determine the weight of the semiconductor workpiece storage device, the type, the material and the thickness of the wafer also determine the weight of the semiconductor workpiece storage device, when the wafer is remained in the semiconductor workpiece storage device, the current weight information of the semiconductor workpiece storage device is determined by the weight information of the semiconductor workpiece storage device when the semiconductor workpiece storage device is empty and the weight information of the remained wafer, and in order to improve the detection precision, different types of semiconductor workpiece storage devices have different preset thresholds.
In an alternative embodiment, in step S4 and step S5, triggering the first detection instruction includes:
s41, arranging the semiconductor workpiece storage device to be cleaned at a loading station of a loading unit of the cleaning equipment.
S42, moving the semiconductor workpiece storage device positioned at the loading station to a detection station of the loading unit.
S43, unlocking by using an unlocking mechanism so as to separate the box body and the cover body of the semiconductor workpiece storage device.
S44, detecting the foreign matters in the box body by using a detection assembly, wherein the foreign matters comprise wafers and/or wafer fragments.
In the embodiment of the application, the reference weight value of the semiconductor workpiece storage device does not exist in the database, or the difference value between the current weight value of the semiconductor workpiece storage device and the reference weight value exceeds the preset threshold value, the first detection instruction is triggered to perform the uncovering detection so as to further confirm whether the foreign matter exists in the semiconductor workpiece storage device or not and improve the detection accuracy.
In an alternative embodiment, in response to the first detection instruction, the detection assembly is utilized to confirm whether the foreign matter exists inside the semiconductor workpiece storage device, and the detection assembly comprises a visual detection device and a photoelectric detection device.
The visual detection device and the photoelectric detection device detect whether foreign matters exist in the semiconductor workpiece storage device or not, and can greatly improve detection accuracy.
In an alternative embodiment, the detection method further comprises:
If the detection result of the detection component is that the difference value between the current weight value and the reference weight value is within the preset threshold value range, the semiconductor workpiece storage device is moved to a buffer station of the loading unit or to a cleaning unit of the cleaning equipment for cleaning, and the buffer station is positioned in the cleaning equipment.
And when the cleaning unit is in a working state, the semiconductor workpiece storage device which is qualified in detection is moved to a buffer station to wait for the cleaning unit to finish cleaning operation, so that the detection of the subsequent semiconductor workpiece storage device is not influenced, the detection efficiency of a detection procedure is improved, and in addition, the buffer station is positioned in the cleaning device, and the scheduling and transportation flexibility can be improved.
And if the detection result of the detection component is unqualified, returning the semiconductor workpiece storage device to a loading station, wherein the loading station is positioned outside the cleaning equipment.
And returning the semiconductor workpiece storage device with the unqualified detection result to a loading station positioned outside the cleaning equipment so as to transfer the unqualified semiconductor workpiece storage device to the next process or the next station.
In an alternative embodiment, if the foreign object detection result is qualified, the reference weight value of the semiconductor workpiece storage device stored in the database is updated based on the current weight value.
It can be understood that when the difference between the current weight value and the reference weight value exceeds the preset threshold, a first detection instruction is triggered, the first detection instruction is to separate the cover body and the box body of the semiconductor workpiece storage device, and perform foreign matter detection on the interior of the box body, when the foreign matter detection result is qualified, the detection result is taken as a reference, and the reference weight value of the semiconductor workpiece storage device stored in the database is updated based on the current weight value of the semiconductor workpiece storage device acquired in the step S2. In the use process of the semiconductor workpiece storage device, the weight change caused by the conditions of refitting, maintaining and the like exists, and the weight of the semiconductor workpiece storage device is updated after the fact that the semiconductor workpiece storage device is free of foreign matters is determined, so that misjudgment of the foreign matters in the semiconductor workpiece storage device caused by the fact can be effectively avoided.
It is also understood that if the reference weight value does not exist in the database, that is, the semiconductor workpiece storage device has not been cleaned by the cleaning apparatus, and thus the weight information thereof is not recorded in the database, the current weight value of the semiconductor workpiece storage device acquired in step S2 is added to the database and used as the reference weight value of the semiconductor workpiece storage device.
In an alternative embodiment, when the difference between the current weight value and the reference weight value exceeds a preset threshold value and the foreign object detection result is qualified, the reference weight value of the semiconductor workpiece storage device stored in the database is updated based on the current weight value, and the electronic mark is performed.
The semiconductor workpiece storage device with the current weight value and the reference weight value exceeding the preset threshold and the qualified foreign matter detection result is electronically marked, and it can be understood that the semiconductor workpiece storage device is added with abnormal comments so as to remind maintenance personnel to check the semiconductor workpiece storage device with the abnormality in time and further confirm the reason of the abnormality of the semiconductor workpiece storage device. For example, the weight of the semiconductor workpiece storage device changes due to replacement of parts or damage.
In an alternative embodiment, the inspection method further comprises transferring the semiconductor workpiece storage device between the loading station and the inspection station using the slide rail assembly. The sliding rail component can improve the transfer efficiency of the semiconductor workpiece storage device between the loading station and the detection station. Compared with the prior art, the manipulator which needs to be matched with high precision and high moving speed is used for realizing the scheduling among different stations, the sliding rail assembly can reduce the failure rate of equipment, and the equipment cost can be reduced.
The embodiment of the application also provides cleaning equipment for foreign matters in the semiconductor workpiece storage device, referring to fig. 6, the cleaning equipment comprises a first acquisition unit, a second acquisition unit, a control unit and a detection unit.
The first acquisition unit is used for acquiring tag information of the semiconductor workpiece storage device.
The second acquisition unit is used for acquiring the current weight value of the semiconductor workpiece storage device.
The control unit is used for retrieving the reference information value of the semiconductor workpiece storage device associated with the tag information from the database, triggering the first detection instruction when the reference weight value does not exist in the database, and otherwise, comparing the current weight value with the reference weight value.
The detection unit is used for triggering a first detection instruction when the difference value between the current weight value and the reference weight value exceeds a preset threshold value, wherein the first detection instruction is used for detecting whether foreign matters exist in the semiconductor workpiece storage device or not, and the detection is completed when the difference value between the current weight value and the reference weight value is within a preset threshold value range.
The embodiment of the application also provides a cleaning method of the semiconductor workpiece storage device, which comprises the following steps:
The semiconductor workpiece storage device is inspected by using the inspection method provided in any one of the embodiments.
And when the detection result of the semiconductor workpiece storage device is qualified, moving the semiconductor workpiece storage device to a cleaning unit.
The semiconductor workpiece storage device is cleaned by a cleaning unit.
When the detection result of the semiconductor workpiece storage device is unqualified, the semiconductor workpiece storage device is moved to a loading station of the loading unit, and then the loading station is moved to the outside of the frame body.
According to the cleaning method, before the semiconductor workpiece storage device is cleaned, whether the foreign matters exist in the semiconductor workpiece storage device or not is detected, the semiconductor workpiece storage device with the residual foreign matters can be picked out before the semiconductor workpiece storage device is cleaned, so that the damage of the residual foreign matters in the semiconductor workpiece storage device to cleaning equipment can be avoided, meanwhile, the residual foreign matters are damaged, and the damage to a wafer processing factory is further avoided.
It should be understood that the above examples are illustrative and are not intended to encompass all possible implementations. Various modifications and changes may be made in the above embodiments without departing from the scope of the disclosure. Likewise, the individual features of the above embodiments can also be combined arbitrarily to form further embodiments of the application which may not be explicitly described. Therefore, the above examples merely represent several embodiments of the present application and do not limit the scope of protection of the patent of the present application.
Claims (10)
1. A method for detecting a foreign object in a semiconductor workpiece storage device to be cleaned, the method comprising:
acquiring label information of a semiconductor workpiece storage device;
Acquiring a current weight value of the semiconductor workpiece storage device;
retrieving from a database a reference weight value of the semiconductor workpiece storage device associated with the tag information;
If the reference weight value does not exist in the database, triggering a first detection instruction, otherwise, comparing the current weight value with the reference weight value;
When the difference value of the current weight value and the reference weight value exceeds a preset threshold value, triggering the first detection instruction, wherein the first detection instruction is used for executing the separation action of the box body and the cover body of the semiconductor workpiece storage device and confirming whether foreign matters exist in the box body and the cover body;
and finishing detection when the difference value between the current weight value and the reference weight value is within the preset threshold range.
2. The method for detecting foreign matter in a semiconductor workpiece storage device to be cleaned according to claim 1, wherein the semiconductor workpiece storage device is cleaned with a cleaning apparatus;
The triggering the first detection instruction comprises:
arranging the semiconductor workpiece storage device to be cleaned at a loading station of a loading unit of the cleaning equipment;
moving the semiconductor workpiece storage device located at the loading station to a detection station of the loading unit;
unlocking by using an unlocking mechanism to separate a box body and a cover body of the semiconductor workpiece storage device, wherein the semiconductor workpiece storage device comprises the box body and the cover body, and the cover body is detachably connected with the box body;
and detecting the foreign matters in the box body by using a detection assembly, wherein the foreign matters comprise wafers and/or wafer fragments.
3. The method for detecting a foreign object in a semiconductor workpiece storage device to be cleaned as recited in claim 2, further comprising:
And responding to the first detection instruction, and utilizing a detection assembly to confirm whether foreign matters exist in the semiconductor workpiece storage device, wherein the detection assembly comprises a visual detection device and a photoelectric detection device.
4. The method for detecting a foreign object in a semiconductor workpiece storage device to be cleaned as recited in claim 3, further comprising:
if the detection result of the detection component is qualified or the difference value between the current weight value and the reference weight value is within the preset threshold value range, transferring the semiconductor workpiece storage device to a buffer station of the loading unit or a cleaning unit of the cleaning equipment for cleaning, wherein the buffer station is positioned in the cleaning equipment;
And if the detection result of the detection component is unqualified, returning the semiconductor workpiece storage device to the loading station, wherein the loading station is positioned outside the cleaning equipment.
5. The method according to claim 1, wherein when a difference between the current weight value and the reference weight value exceeds a preset threshold value and the detection result of the foreign matter is qualified, the reference weight value of the semiconductor workpiece storage device stored in the database is updated based on the current weight value, and an electronic mark is performed.
6. The method for detecting a foreign object in a semiconductor workpiece storage device to be cleaned as recited in claim 1, further comprising:
and recording the current weight value of each acquired semiconductor workpiece storage device so as to correct the preset threshold value.
7. The method for detecting a foreign object in a semiconductor workpiece storage device to be cleaned as recited in claim 2, further comprising:
the semiconductor workpiece storage device is transferred between the loading station and the inspection station using a slide rail assembly.
8. The method according to any one of claims 1 to 7, wherein if the detection result of the foreign matter is qualified, updating the reference weight value of the semiconductor workpiece storage device stored in the database based on the current weight value.
9. The method according to any one of claims 1 to 7, wherein the predetermined threshold value is set based on a first parameter of the semiconductor workpiece storage device and a second parameter of a wafer held by the semiconductor workpiece storage device, the first parameter including a type, a material, and the second parameter including a type, a material, and a thickness of the wafer.
10. A cleaning apparatus for foreign matter in a semiconductor workpiece storage device, the cleaning apparatus comprising:
A first acquisition unit for acquiring tag information of the semiconductor workpiece storage device;
a second acquisition unit configured to acquire a current weight value of the semiconductor workpiece storage device;
A control unit for retrieving a reference weight value of the semiconductor workpiece storage device associated with the tag information from a database, and for triggering a first detection instruction when the reference weight value does not exist in the database, otherwise, comparing the current weight value with the reference weight value;
the detection unit is used for triggering the first detection instruction when the difference value between the current weight value and the reference weight value exceeds a preset threshold value, wherein the first detection instruction is used for detecting whether foreign matters exist in the semiconductor workpiece storage device or not, and the detection is completed when the difference value between the current weight value and the reference weight value is within the preset threshold value range.
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| CN104854688A (en) * | 2012-12-07 | 2015-08-19 | 东京毅力科创株式会社 | Substrate processing device, application method for substrate device and storage medium |
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| JP4584531B2 (en) * | 2002-08-02 | 2010-11-24 | 株式会社日立製作所 | Foreign matter monitoring system |
| CN109904087A (en) * | 2019-01-14 | 2019-06-18 | 全球能源互联网研究院有限公司 | Method and device for detecting particle size of semiconductor wafer surface |
| CN113866180A (en) * | 2021-12-06 | 2021-12-31 | 晶芯成(北京)科技有限公司 | Foreign matter detection method, semiconductor wafer detection method and system |
| CN117161031B (en) * | 2023-11-02 | 2024-02-02 | 江苏芯梦半导体设备有限公司 | Semiconductor workpiece box cleaning device, equipment and cleaning method |
| CN118348008A (en) * | 2024-03-06 | 2024-07-16 | 惠州市赢合智能技术有限公司 | Pole piece surface foreign matter detection method and pole piece detection system |
| CN118218326A (en) * | 2024-03-14 | 2024-06-21 | 江苏芯梦半导体设备有限公司 | Substrate storage container cleaning method, cleaning unit and cleaning equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104854688A (en) * | 2012-12-07 | 2015-08-19 | 东京毅力科创株式会社 | Substrate processing device, application method for substrate device and storage medium |
| CN107866426A (en) * | 2016-09-23 | 2018-04-03 | 锡宬国际有限公司 | Wafer box cleaning device |
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