CN120341145B - A packaging fixture for limiting CLIP - Google Patents
A packaging fixture for limiting CLIPInfo
- Publication number
- CN120341145B CN120341145B CN202510811834.9A CN202510811834A CN120341145B CN 120341145 B CN120341145 B CN 120341145B CN 202510811834 A CN202510811834 A CN 202510811834A CN 120341145 B CN120341145 B CN 120341145B
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- cover plate
- limiting
- clip
- lead frame
- limit
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Abstract
The invention discloses a packaging jig for limiting CLIP, and relates to the field of semiconductor power device packaging and manufacturing. The invention comprises a limit cover plate, a limit base and a lead frame, wherein the limit base is arranged below the limit cover plate, the lead frame is embedded and arranged in the limit base, a chip block is arranged above the lead frame, a solder paste component is arranged between the chip block and the lead frame, a CLIP is arranged above the solder paste component, a cover plate window is formed in the limit cover plate, a U-shaped limit column is fixedly connected to one side of the cover plate window, and four cover plate guide columns with the same diameter are fixedly connected to the top of the limit cover plate. According to the invention, through the design of the specific lead frame structure and the CLIP frame structure and the structure of the packaging jig, the fixed patch position of the CLIP is kept in the process of bonding reflow soldering, and the corner and the offset of the CLIP are not generated.
Description
Technical Field
The invention belongs to the field of semiconductor power device packaging and manufacturing, and particularly relates to a packaging jig for limiting CLIP.
Background
With the continuous development of semiconductor power device packages, higher requirements are being placed on the electrical properties of the product and the heat dissipation capability of the product. In order to achieve better heat dissipation and smaller RDS (ON) at the same time, a structural process of product double-sided heat dissipation and CLIP (copper sheet bonding) is generally adopted, the CLIP leaks to the top of the product to provide top heat dissipation, the CLIP is matched with a bottom lead frame to achieve double-sided heat dissipation, meanwhile, the CLIP is used as an internal electrical path to achieve better product RDS (ON) and higher reliability, but in practical production application, the CLIP is stuck above a chip, when the reflow soldering process is carried out, a sticky material (solder paste) is in a molten state, at the moment, the CLIP can generate corners and offset under the action of tension and gravity center, if the CLIP corner offset is uncontrollable, poor internal electrical performance of the product can be caused, poor packaging appearance, reduced top heat dissipation area and the like, and lower packaging yield of the product is caused.
According to the technical scheme, the CLIP and the lead frame are designed to be mutually nested in a buckling structure, so that the CLIP is limited, the turn angle deviation of the CLIP is limited, but as the power device packaging has higher requirements on power density, the product packaging volume is continuously reduced, or the CLIP structure is designed to be more complex, the smaller product volume causes that the CLIP frame and the lead frame are not provided with space design buckling structures, the more complex CLIP structure is used for limiting the design of the buckling structures, and the smaller product cannot realize the technological capability of limiting the turn angle of the CLIP.
The technical scheme of the prior buckle structure makes the CLIP structure and the lead frame structure more complex, so that the CLIP and the lead frame have larger size, the material utilization rate is lower, the precision requirement of a plurality of matched dimensional tolerance is higher, and the production and manufacturing cost of the lead frame and the CLIP material is obviously improved.
Disclosure of Invention
The invention aims to provide a packaging jig for limiting a CLIP, which limits the CLIP in the reflow soldering process through the packaging jig, so that the limit in the CLIP reflow soldering process is realized, and the packaging yield is ensured. The chip is characterized in that a limit notch is designed on the chip, meanwhile, a matched limit column is designed on the packaging jig, the chip is matched with the limit column of the packaging jig through the notch of the chip in the chip mounting process, the chip takes the limit column as a track, the chip slides into the packaging jig from top to bottom, a lead frame, a chip copper sheet and the packaging jig are placed into a vacuum reflow oven together after mounting, reflow soldering is carried out, the packaging jig limits the chip copper sheet in the reflow process, and the fact that the bonding position of the chip copper sheet does not generate corners or offsets is guaranteed. And after the reflow soldering is finished, the packaging jig is removed, and the CLIP adhesive sheet is completed.
In order to solve the technical problems, the invention is realized by the following technical scheme.
The invention discloses a packaging jig for limiting a chip, which comprises a limiting cover plate, a limiting base and a lead frame, wherein the limiting base is arranged below the limiting cover plate, the lead frame is embedded and arranged in the limiting base, a chip block is arranged above the lead frame, a solder paste component is arranged between the chip block and the lead frame, the chip is arranged above the solder paste component, a cover plate window is arranged in the limiting cover plate, one side of the cover plate window is fixedly connected with a U-shaped limiting column, the top of the limiting cover plate is fixedly connected with four cover plate guide columns with the same diameter, the top of the limiting base is provided with four limiting seat guide holes with the same diameter, the window is arranged above the limiting base, the inside of the window is fixedly connected with a limiting seat bottom plate, two sides of the top of the limiting seat bottom plate are fixedly connected with limiting seat guide columns with the same diameter, a limiting seat rectangular groove is arranged on the limiting seat bottom plate, two sides of the top of the lead frame are respectively and fixedly provided with a frame carrier and a frame pin.
The invention further provides that the solder paste component comprises carrier solder paste, chip solder paste and frame solder paste, wherein the chip block is stuck above the frame carrier through the carrier solder paste, the CLIP is stuck above the chip block through the chip solder paste, and one side of the bottom of the CLIP is stuck above the frame pins through the frame solder paste.
The invention is further characterized in that two guide U-shaped grooves are symmetrically formed in two sides of the CLIP, the guide U-shaped grooves are matched with the U-shaped limiting columns, and the fit clearance is designed to be 0.05mm.
The invention further provides that the cover plate guide posts are designed at the center positions of four frames at the top of the limiting cover plate, the cover plate windowing is designed to be in rectangular array arrangement, multiple rows and multiple columns can be adopted, and a single cover plate windowing corresponds to a single unit product of the lead frame.
The invention further provides that the limit base is a whole rectangular alloy plate, the windowing depth is designed to be more than 2 times of the thickness of the lead frame, and the length and width of the windowing are larger than those of the lead frame, so that the lead frame can be completely placed into the windowing, and the guide hole of the limit base is matched with the guide post of the cover plate.
The invention is further characterized in that the number of the rectangular grooves of the limiting seat is multiple, the length and width of the rectangular grooves of the limiting seat are the same as the length and width of the windowed cover plate, the positions of the rectangular grooves of the limiting seat and the windowed cover plate are the same, and the depth of the rectangular grooves of the limiting seat is 0.2mm.
The invention further provides that the frame carrier and the frame lead material have the same thickness and are designed to be on the same plane.
The beneficial effects of the invention are as follows:
1. According to the invention, through the design of the specific lead frame structure and the CLIP frame structure and the structure of the packaging jig, the fixed patch position of the CLIP is kept in the process of bonding reflow soldering, and the corner and the offset of the CLIP are not generated.
2. The invention can solve the problems of high material cost, difficult material production and manufacturing caused by a complex material structure and high material waste caused by the design scheme that the lead frame and the CLIP frame are mutually buckled in the prior industry and have anti-rotation angle and anti-offset structure, thereby greatly reducing the production cost.
3. According to the invention, through a specific packaging jig structure, the limit of the CLIP can be realized by only designing a U-shaped or circular notch on the CLIP, and the problem that the prior products with extremely small size are packaged in the industry is solved, and the CLIP can not realize the limit of the CLIP due to the fact that the CLIP is smaller in size and can not realize the limit of the CLIP by designing the CLIP buckle structure, or the CLIP can not realize the limit of the CLIP due to a more complex product structure.
Drawings
In order to more clearly illustrate the technical solution of the embodiments of the present invention, the drawings used for describing the embodiments will be briefly described below.
FIG. 1 is a perspective view of an overall structure provided by the present invention;
FIG. 2 is a top view of the overall assembly structure provided by the present invention;
FIG. 3 is an enlarged view of FIG. 2A in accordance with the present invention;
fig. 4 is a schematic diagram of a limiting base structure provided by the invention;
FIG. 5 is an enlarged view of B of FIG. 4 in accordance with the present invention;
Fig. 6 is a schematic diagram of a connection structure between a lead frame and a limiting base provided by the invention;
fig. 7 is a schematic view of a leadframe structure according to the present invention;
fig. 8 is a schematic structural diagram of a solder paste assembly according to the present invention;
FIG. 9 is a schematic diagram of a CLIP structure according to the present invention;
fig. 10 is a schematic structural diagram of a limiting cover plate provided by the invention.
The description of the drawings is 1, a limit cover plate; 11, cover plate windowing, 12, U-shaped limit posts, 13, cover plate guide posts, 2, limit bases, 21, limit base guide holes, 22, limit base bottom plates, 23, limit base guide posts, 24, limit base rectangular grooves, 3, lead frames, 31, frame guide holes, 32, frame carriers, 33, frame pins, 4, solder paste assemblies, 41, carrier solder paste, 42, chip solder paste, 43, frame solder paste, 5, chip blocks, 6, CLIP, 61 and guide U grooves.
Detailed Description
The following description of the technical solutions according to the embodiments of the present invention will be given with reference to the accompanying drawings in the embodiments of the present invention, where the described embodiments are only some embodiments of the present invention, but not all embodiments.
Example 1
Referring to fig. 1-10, the invention discloses a packaging jig for limiting CLIP, which comprises a limiting cover plate 1, a limiting base 2 and a lead frame 3, wherein the limiting base 2 is arranged below the limiting cover plate 1, the lead frame 3 is embedded and arranged in the limiting base 2, a chip block 5 is arranged above the lead frame 3, a solder paste component 4 is arranged between the chip block 5 and the lead frame 3, a CLIP6 is arranged above the solder paste component 4, a cover plate opening 11 is arranged in the limiting cover plate 1, one side of the cover plate opening 11 is fixedly connected with a U-shaped limiting column 12, the top of the limiting cover plate 1 is fixedly connected with four cover plate guide columns 13 with the same diameter, four limiting seat guide holes 21 with the same diameter are formed in the top of the limiting base 2, an opening window is arranged above the limiting base 2, a limiting seat bottom plate 22 is fixedly connected with two sides of the top of the limiting seat bottom plate 22, a limiting seat rectangular groove 24 is arranged on the limiting seat bottom plate 22, a frame carrier 32 and frame pins 33 are prevented from being scratched by the arrangement of the limiting seat rectangular groove 24, the top of the lead frame carrier 32 and the lead frame pins 33 are fixedly arranged on the two sides of the top of the lead frame 3, and the top of the lead frame carrier 33 is fixedly arranged on the top of the frame carrier 33.
As the optimization of the embodiment, the lead frame 3 is borne through the limit base 2, limit guide posts are designed on the base to be matched with guide holes of the lead frame 3, the chip block 5 is stuck on the surface of the chip block 6, the limit cover plate 1 is matched with the limit base guide holes 21 through the cover plate guide posts 13, the limit cover plate 1 and the chip 6 are designed to be matched with U-shaped grooves, and the limit cover plate 1 limits the chip 6.
Example 2
Referring to fig. 1-10, on the basis of embodiment 1, the solder paste assembly 4 includes carrier solder paste 41, chip solder paste 42 and frame solder paste 43, chip block 5 is adhered over frame carrier 32 by carrier solder paste 41, CLIP6 is adhered over chip block 5 by chip solder paste 42, one side of the bottom of CLIP6 is adhered over frame pins 33 by frame solder paste 43, two guide U grooves 61 are symmetrically provided on both sides of CLIP6, the guide U grooves 61 are mutually matched with U-shaped limiting posts 12, the matching gap is designed to be 0.05mm, cover plate guide posts 13 are designed at the center of four frames at the top of limiting cover plate 1, cover plate windows 11 are designed to be arranged in a rectangular array, which can be multiple rows and multiple columns, the single cover plate window 11 corresponds to a single unit product of the lead frame 3, the limiting base 2 is a whole rectangular alloy plate, the window depth is designed to be more than 2 times the thickness of the lead frame 3, the window length and width are larger than the length and width of the lead frame 3, the lead frame 3 can be completely put into the window, the limiting base guide holes 21 and the cover plate guide posts 13 are mutually matched, the number of the limiting base rectangular grooves 24 is multiple, the length and width of the limiting base rectangular grooves 24 are the same as the length and width of the cover plate window 11, the limiting base rectangular grooves 24 are the same as the cover plate window 11 in position design, the depth of the limiting base rectangular grooves 24 is designed to be 0.2mm, the material thicknesses of the frame carrier 32 and the frame pins 33 are the same, and the limiting base rectangular grooves are designed to be on the same plane.
The working principle of the invention comprises the following steps:
the first step is that the limiting bases 2 are fixed on the tray through the equipment fixture, a plurality of limiting bases 2 can be borne on one tray, the lead frames 3 are sucked and placed in the limiting bases 2 through the suction nozzle of the chip mounter equipment, and the lead frames 3 are fixed in the limiting bases 2 through the mutual matching of the limiting base guide posts 23 on the limiting bases 2 and the lead frame guide holes 31 on the lead frames 3.
The second step is that the chip mounter device smears carrier solder paste 41 on the frame carrier 32, and the chip mounter device picks up the chip block 5 and pastes the chip block on the carrier solder paste 41.
Third, the chip solder paste 42 is applied on the chip by the chip mounter, and the frame solder paste 43 is applied on the frame pins 33 by the chip mounter.
And fourthly, the chip mounter equipment picks up the limiting cover plate 1, and the limiting cover plate 1 is fixed on the limiting base 2 through the matching of the cover plate guide posts 13 and the limiting seat guide holes 21.
And fifthly, the chip mounter picks up the chip 6 and pastes the chip 6 on the chip solder paste 42 and the frame solder paste 43, and the position of the chip 6 is fixed by mutually matching the U-shaped limiting column 12 and the chip guiding U groove 61, so that the chip 6 is limited to generate a corner and offset.
And step six, placing the whole tray into a vacuum reflow furnace for solder paste reflow soldering, wherein in the reflow soldering process, the position of the CLIP6 is fixed through the mutual matching of the U-shaped limiting columns 12 and the guide U grooves 61, and the rotation angle and the deflection of the CLIP are limited.
And seventh, after the reflow soldering is finished, the chip mounter equipment picks up the limiting cover plate 1, removes the limiting cover plate 1, picks up the lead frame 3 by the chip mounter, places the lead frame 3 with the chips and the CLIPs in a material box, and enters the next working procedure.
And eighth step, grinding the molded product to expose the top surface of the product from the CLIP 6.
While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that modifications may be made to the described embodiments in various different ways without departing from the spirit and scope of the invention. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive of the scope of the invention, which is defined by the appended claims.
Claims (7)
1. The packaging jig for the limit CLIP comprises a limit cover plate (1), a limit base (2) and a lead frame (3) and is characterized in that the limit base (2) is arranged below the limit cover plate (1), the lead frame (3) is embedded and arranged inside the limit base (2), a chip block (5) is arranged above the lead frame (3), a solder paste component (4) is arranged between the chip block (5) and the lead frame (3), and a CLIP (6) is arranged above the solder paste component (4);
The novel limiting cover plate is characterized in that a cover plate opening window (11) is formed in the limiting cover plate (1), a U-shaped limiting column (12) is fixedly connected to one side of the cover plate opening window (11), and four cover plate guide columns (13) with the same diameter are fixedly connected to the top of the limiting cover plate (1);
four limit seat guide holes (21) with the same diameter are formed in the inner top of the limit base (2), a window is formed in the upper side of the limit base (2), a limit seat bottom plate (22) is fixedly connected in the window, limit seat guide columns (23) with the same diameter are fixedly connected to two sides of the top of the limit seat bottom plate (22), and a limit seat rectangular groove (24) is formed in the limit seat bottom plate (22);
frame guiding holes (31) are formed in two sides of the top of the lead frame (3), and a frame carrier (32) and frame pins (33) are respectively and fixedly arranged on the top of the lead frame (3).
2. The packaging jig for limiting CLIP according to claim 1, wherein the solder paste assembly (4) comprises carrier solder paste (41), chip solder paste (42) and frame solder paste (43), the chip block (5) is adhered above the frame carrier (32) through the carrier solder paste (41), the CLIP (6) is adhered above the chip block (5) through the chip solder paste (42), and one side of the bottom of the CLIP (6) is adhered above the frame pins (33) through the frame solder paste (43).
3. The packaging jig for limiting CLIP according to claim 1, wherein two guide U-shaped grooves (61) are symmetrically formed in two sides of the CLIP (6), the guide U-shaped grooves (61) are matched with the U-shaped limiting columns (12), and a fit clearance is designed to be 0.05mm.
4. The packaging jig for limiting CLIP according to claim 1, wherein the cover plate guide posts (13) are designed at the center positions of four frames at the top of the limiting cover plate (1), the cover plate windows (11) are designed to be arranged in a rectangular array, and can be arranged in multiple rows and multiple columns, and a single cover plate window (11) corresponds to a single unit product of the lead frame (3).
5. The packaging jig for limiting CLIP (CLIP) according to claim 1, wherein the limiting base (2) is a whole rectangular alloy plate, the windowing depth is designed to be more than 2 times the thickness of the lead frame (3), the length and width of the windowing are larger than those of the lead frame (3), the lead frame (3) can be completely placed into the windowing, and the limiting base guide holes (21) are matched with the cover plate guide posts (13).
6. The packaging jig for limiting CLIP according to claim 1, wherein the number of the rectangular limiting seat grooves (24) is multiple, the length and width of the rectangular limiting seat grooves (24) are the same as the length and width of the cover plate window (11), the rectangular limiting seat grooves (24) and the cover plate window (11) are the same in position design, and the depth of the rectangular limiting seat grooves (24) is 0.2mm.
7. The packaging jig for limiting CLIP according to claim 1, wherein the frame carrier (32) and the frame pins (33) are made of the same material and are designed on the same plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202510811834.9A CN120341145B (en) | 2025-06-18 | 2025-06-18 | A packaging fixture for limiting CLIP |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202510811834.9A CN120341145B (en) | 2025-06-18 | 2025-06-18 | A packaging fixture for limiting CLIP |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN120341145A CN120341145A (en) | 2025-07-18 |
| CN120341145B true CN120341145B (en) | 2025-08-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202510811834.9A Active CN120341145B (en) | 2025-06-18 | 2025-06-18 | A packaging fixture for limiting CLIP |
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| Country | Link |
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| CN (1) | CN120341145B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105552042A (en) * | 2015-12-24 | 2016-05-04 | 江苏长电科技股份有限公司 | Multi-chip integrated stacked sandwiched packaging structure and technological method therefor |
| CN112289754A (en) * | 2019-07-23 | 2021-01-29 | 珠海格力电器股份有限公司 | Power module and packaging method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8076183B2 (en) * | 2009-10-27 | 2011-12-13 | Alpha And Omega Semiconductor, Inc. | Method of attaching an interconnection plate to a semiconductor die within a leadframe package |
| CN215771129U (en) * | 2021-07-15 | 2022-02-08 | 昆山市品能精密电子有限公司 | Lead frame for chip packaging |
| CN218788374U (en) * | 2022-09-23 | 2023-04-04 | 泉州市三安集成电路有限公司 | Semiconductor packaging shell and semiconductor packaging structure |
| JP2024545387A (en) * | 2022-11-17 | 2024-12-06 | 海信家電集団股▲ふん▼有限公司 | Power module assembly and electronic device including same |
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2025
- 2025-06-18 CN CN202510811834.9A patent/CN120341145B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105552042A (en) * | 2015-12-24 | 2016-05-04 | 江苏长电科技股份有限公司 | Multi-chip integrated stacked sandwiched packaging structure and technological method therefor |
| CN112289754A (en) * | 2019-07-23 | 2021-01-29 | 珠海格力电器股份有限公司 | Power module and packaging method |
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| CN120341145A (en) | 2025-07-18 |
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