CN120385904A - A three-temperature device for integrated circuit chip testing and its use method - Google Patents
A three-temperature device for integrated circuit chip testing and its use methodInfo
- Publication number
- CN120385904A CN120385904A CN202311676493.6A CN202311676493A CN120385904A CN 120385904 A CN120385904 A CN 120385904A CN 202311676493 A CN202311676493 A CN 202311676493A CN 120385904 A CN120385904 A CN 120385904A
- Authority
- CN
- China
- Prior art keywords
- temperature
- integrated circuit
- circuit chip
- test
- heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
本发明公开了一种用于集成电路芯片测试用的三温装置与使用方法，涉及芯片测试技术领域，包括：箱体、测试夹具、蒸发器、冷却剂输送管、温控加热器、测试喷嘴，箱体内设置有用于加热箱体内气体的加热装置，箱体内设置有环境喷嘴，箱体上穿设有用于运输集成电路芯片的输送轨道；输送轨道能将集成电路芯片运输到测试夹具上；冷却剂输送管还与环境喷嘴相连以通过环境喷嘴向箱体输送冷却剂；温控加热器与蒸发器相连通，温控加热器用于加热通过温控加热器的气体；测试喷嘴设置在测试夹具上并与温控加热器相连，在蒸发器中蒸发后的冷却剂进入温控加热器中被加热，再喷吹到集成电路芯片上。本发明能够保证集成电路芯片进行测试的温度稳定，提高检测准确性。
The present invention discloses a three-temperature device for integrated circuit chip testing and its use method, relating to the field of chip testing technology. The device comprises: a box, a test fixture, an evaporator, a coolant delivery pipe, a temperature-controlled heater, and a test nozzle. The box is provided with a heating device for heating the gas inside the box, an environmental nozzle is provided inside the box, and a conveyor track for transporting integrated circuit chips is provided on the box; the conveyor track can transport the integrated circuit chips to the test fixture; the coolant delivery pipe is also connected to the environmental nozzle to deliver coolant to the box through the environmental nozzle; the temperature-controlled heater is connected to the evaporator and is used to heat the gas passing through the temperature-controlled heater; the test nozzle is provided on the test fixture and connected to the temperature-controlled heater; the coolant evaporated in the evaporator enters the temperature-controlled heater, is heated, and is then sprayed onto the integrated circuit chip. The present invention can ensure temperature stability during integrated circuit chip testing and improve detection accuracy.
Description
Technical Field
The invention relates to the technical field of chip testing, in particular to a three-temperature device for testing an integrated circuit chip and a using method thereof.
Background
The packaged integrated circuit chip needs to be electrically tested to understand the performance and stability of the packaged integrated circuit chip at various temperatures. When the package chip is tested, the integrated circuit chip needs to be tested under the condition of different temperatures so as to test the performance and failure problems of the chip under different temperatures, in the prior art, the high-temperature test and the low-temperature test equipment are usually arranged separately, and the three-temperature device is a device for performing low-temperature, normal-temperature and high-temperature tests. At present, the three-temperature device used when testing chips at different temperatures has the defects of large temperature fluctuation, long time reaching preset temperature, low efficiency and incapability of rapidly meeting test accuracy.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention provides a three-temperature device for testing an integrated circuit chip, which can ensure the temperature stability of the integrated circuit chip for testing and improve the detection accuracy.
According to the embodiment of the first aspect of the invention, the three-temperature device for testing the integrated circuit chips comprises a box body, a test fixture, an evaporator, a coolant conveying pipe, a temperature control heater and a test nozzle, wherein a heating device for heating gas in the box body is arranged in the box body, an environment nozzle is arranged in the box body, a conveying track for conveying the integrated circuit chips is arranged on the box body in a penetrating mode, the test fixture is used for fixing the integrated circuit chips under test, the conveying track can convey the integrated circuit chips onto the test fixture, the evaporator is arranged in the box body, the coolant conveying pipe is connected with the evaporator, the coolant enters the evaporator through the coolant conveying pipe to absorb heat and evaporate to cool the gas in the box body, the coolant conveying pipe is also connected with the environment nozzle to convey the coolant to the box body through the environment nozzle, the heater is communicated with the evaporator and is used for heating the gas passing through the evaporator, the test fixture can convey the integrated circuit chips onto the test fixture, the coolant conveying pipe is connected with the temperature control heater through the evaporator, and then the temperature control heater is blown into the test fixture from the temperature control nozzle to the temperature control heater after the temperature control heater is arranged in the test fixture, and the temperature control heater is connected with the evaporator.
According to some embodiments of the invention, an air source for providing compressed air is arranged outside the box body, and the air source is connected with an air heater so as to input the compressed air into the air heater, and the compressed air is heated by the air heater and then is conveyed to the temperature control heater through a compressed air pipeline.
According to some embodiments of the invention, a check valve is provided on the compressed air line to prevent gas flow from the temperature controlled heater to the air heater.
According to some embodiments of the invention, the test fixture is provided with a plurality of test contact pieces for clamping a plurality of integrated circuit chips at the same time, and the temperature-controlled heater and the test nozzle are also provided with a plurality of test contact pieces for controlling the temperature of gas blown to each integrated circuit chip respectively.
According to some embodiments of the invention, a plurality of temperature sensors are provided on the test fixture to detect the temperature of the gas blown from the test nozzle to each of the integrated circuit chips and the test contact pads, respectively.
According to some embodiments of the invention, the temperature sensor is electrically connected to a controller, and the controller adjusts the heating power of the corresponding temperature control heater according to the temperature detected by the temperature sensor, so that the air temperature at the corresponding temperature sensor is kept at a preset value.
According to some embodiments of the invention, a circulation fan is provided in the tank to homogenize the temperature of the gas in the tank.
According to some embodiments of the invention, the circulation fan, the evaporator, the heating device, and the environmental nozzle are symmetrically arranged in two groups in the box.
According to some embodiments of the invention, the housing is at least partially of a thermal insulation material to reduce power consumption and to stabilize the temperature of the integrated circuit chip and the test contact pad during testing.
The invention also provides a using method of the three-temperature device for testing the integrated circuit chip, which comprises the steps of S1, opening the box door, placing the integrated circuit chip to be tested on the testing fixture, and closing the box door;
S2, testing the integrated circuit chip at normal temperature;
And S3, inputting a coolant into the evaporator and the environment nozzle through the coolant conveying pipe, cooling the integrated circuit chip in the box body, starting the temperature control heater to heat so as to control the temperature of the coolant flowing through the temperature control heater, and spraying the coolant to the surface of the integrated circuit chip through the test nozzle to further cool the integrated circuit chip. After the temperature of the integrated circuit chip is stable, performing low-temperature test on the integrated circuit chip;
And S4, stopping conveying the coolant into the coolant conveying pipe, starting the heating device to heat the air in the box body, starting the air source to input compressed air into the air heater, starting the air heater to heat the compressed air flowing through the air heater, starting the temperature control heater to control the temperature of the air flowing through the temperature control heater, and performing high-temperature test on the integrated circuit chip after the temperature of the integrated circuit chip is stable.
The three-temperature device for testing the integrated circuit chip has at least the following beneficial effects:
(1) On the basis of heating and cooling air in the box body, a test nozzle is arranged to blow high-temperature or low-temperature gas to the integrated circuit chip to be tested, so that the efficiency of heating and cooling the integrated circuit chip is improved while the stability of the temperature is ensured;
(2) The evaporator gasifies the coolant entering the temperature control heater, so that the stability of the air flow sprayed from the test nozzle is ensured;
(3) The temperature of a plurality of integrated circuit chips can be controlled through a plurality of temperature control heaters respectively, so that the detection efficiency is improved.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The invention is further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a schematic diagram of a case according to an embodiment of the present invention;
FIG. 2 is a schematic view of a mounting structure according to an embodiment of the present invention;
FIG. 3 is an enlarged view of FIG. 2 at A;
FIG. 4 is a schematic diagram of a coolant delivery tube and compressed air line according to an embodiment of the present invention.
Reference numerals:
The box 100, the heating device 110, the environmental nozzle 120, the feed hole 130, the circulating fan 140, the motor 141;
An integrated circuit chip 200;
a test fixture 300, a test contact 310, a temperature sensor 320;
An evaporator 400;
a coolant delivery pipe 500;
a temperature controlled heater 600;
A test nozzle 700;
A gas source 800;
an air heater 900, a compressed air line 910.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
In the description of the present invention, it should be understood that the direction or positional relationship indicated with respect to the description of the orientation, such as up, down, etc., is based on the direction or positional relationship shown in the drawings, is merely for convenience of describing the present invention and simplifying the description, and does not indicate or imply that the apparatus or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
In the description of the present invention, plural means two or more. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present invention can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
Referring to fig. 1 to 4, a three-temperature apparatus for testing an integrated circuit chip according to an embodiment of the present invention includes a case 100, a test jig 300, an evaporator 400, a coolant delivery pipe 500, a temperature-controlled heater 600, and a test nozzle 700. The heating device 110 for heating the gas in the box 100 is arranged in the box 100, and the heating device 110 can be an electrothermal tube type heater with fins. An environmental nozzle 120 is arranged in the box body 100, and a feeding hole 130 for the conveying rail 101 to pass through is arranged at the upper end of the box body 100. The integrated circuit chip 200 is an integrated circuit chip. To facilitate the ingress and egress of the integrated circuit chip 200 to and from the housing 100, a conveyor rail 101 is provided for the ingress and egress of the integrated circuit chip 200 to and from the housing 100, the conveyor rail 101 passing through the housing 100, the conveyor rail 101 acting as a guide for the integrated circuit chip 200. It is envisioned that the conveyor track 101 is disposed vertically, and the specific structure of the conveyor track 101 and the driving ic chip 200 are all prior art, so they will not be described in detail. The test fixture 300 is used for fixing the integrated circuit chip 200 under test, the test fixture 300 is positioned at the bottom of the conveying track 101, the test fixture 300 plays a role in fixing and positioning the integrated circuit chip 200, and the integrated circuit chip 200 can slide into the test fixture 300 along the conveying track 101. The evaporator 400 is arranged in the box body 100, and the evaporator 400 is a serpentine copper pipe. The coolant delivery pipe 500 communicates with the evaporator 400, and a storage tank for storing coolant is further connected to the coolant delivery pipe 500. A valve is provided on the coolant delivery pipe 500 to control the flow rate of the coolant. The coolant is low-temperature air or liquid nitrogen. The coolant is changed from a liquid state to a gas state in the evaporator 400 by endothermic evaporation of the coolant fed into the evaporator 400 to cool the gas in the tank 100. The coolant delivery pipe 500 is also connected to the ambient nozzle 120 to deliver coolant to the tank 100 through the ambient nozzle 120, and to cool the air inside the tank 100 after the coolant enters the tank 100. The temperature control heater 600 is communicated with the evaporator 400, the temperature control heater 600 is used for heating the gas passing through the temperature control heater 600, and the temperature control heater 600 is a heating wire type heater with smaller heating body mass, so that the hysteresis of temperature regulation is reduced, and the sensitivity of temperature control is improved. The test nozzle 700 is disposed on the test fixture 300 and connected to the temperature-controlled heater 600, and the gaseous coolant evaporated in the evaporator 400 enters the temperature-controlled heater 600 to be heated, and then is sprayed from the test nozzle 700 onto the integrated circuit chip 200 located on the test fixture 300 to further cool the integrated circuit chip 200. Direct heating of the liquid coolant is prone to pressure fluctuations caused by bumping, so the coolant is first converted to a gaseous state by the evaporator 400 and then enters the temperature-controlled heater 600. The air in the case 100 is heated by the heating device 110 and the air in the case 100 is cooled by the coolant, so that the temperature in the case 100 can be switched between high temperature and low temperature, thereby realizing the test of the integrated circuit chip 200 at three temperatures.
Referring to fig. 1 to 4, it can be understood that an air source 800 for supplying compressed air is provided outside the case 100, and the air source 800 is an air compressor. The air source 800 is connected to the air heater 900 to supply compressed air to the air heater 900, and the compressed air is heated by the air heater 900 and then supplied to the temperature-controlled heater 600 through the compressed air line 910. In the high temperature test, the integrated circuit chip 200 needs a gas with a higher temperature to be heated, so the coolant conveying pipe 500 is closed, and the heated compressed air with a higher temperature is used as a gas source for heating the integrated circuit chip 200, thereby improving the heating efficiency.
Referring to fig. 1 to 4, it can be appreciated that a check valve is provided on the compressed air line 910 to prevent gas from flowing from the temperature-controlled heater 600 to the air heater 900. In order to prevent the coolant from flowing to the air heater 900 to waste the coolant when the air source 800 supplying the compressed air is turned off during the low temperature test, a check valve is provided to prevent the coolant in a gaseous state from flowing into the air heater 900.
Referring to fig. 1 to 4, it can be understood that 4 or 8 test contact pieces 310 are provided on the test fixture 300 to simultaneously test 4 or 8 integrated circuit chips 200, and 4 or 8 temperature control heaters 600 and test nozzles 700 are also provided to control the temperature of gas blown to each integrated circuit chip 200, respectively. By adjusting the power of the 4 or 8 temperature-controlled heaters 600, the 4 or 8 integrated circuit chips 200 can be tested at different temperatures, respectively, and it is envisioned that the temperature difference between the 4 or 8 integrated circuit chips 200 at the same time is not more than 200 ℃. When 4 or 8 integrated circuit chips 200 need to be subjected to the same temperature test, the temperature control heaters 600 respectively provided can prevent the temperature of the integrated circuit chips 200 from being different due to uneven heating. The specific structure and mounting of the test contact 310 is prior art and will not be described in detail. The number of test contact pads 310 provided on the test fixture 300 is determined by the actual production requirements.
Referring to fig. 1 to 4, it can be understood that a plurality of temperature sensors 320 are provided on the test fixture 300 to detect the temperature of the gas blown from the test nozzle 700 to each of the integrated circuit chips 200 and the test contact pieces 310, respectively. The temperature sensor 320 is spaced apart from the integrated circuit chip 200 by no more than 2cm so that the temperature detected by the temperature sensor 320 is close to the air temperature on the surface of the integrated circuit chip 200. The temperature sensor 320 includes a thermocouple sensor and a semiconductor thermistor sensor, and may be typically 0-500 degrees celsius due to the limited operating range of the thermocouple sensor. At temperatures below 0 degrees celsius, thermocouple sensors have poor accuracy. In order to improve the detection precision, the semiconductor thermistor with better low-temperature performance is added to measure the temperature at low temperature.
Referring to fig. 1 to 4, it is understood that the temperature sensor 320 is electrically connected to a controller, and the specific structure of the controller is the prior art and will not be described in detail. The controller adjusts the heating power of the corresponding temperature-controlled heater 600 according to the temperature detected by the temperature sensor 320, so that the air temperature at the corresponding temperature sensor 320 is maintained at a preset value. It is contemplated that the temperature of the gas blown onto the integrated circuit chip 200 may also be controlled by adjusting the flow of compressed air or coolant. When the power of the temperature-controlled heater 600 is constant, the coolant flow rate is inversely related to the temperature of the gas blown onto the integrated circuit chip 200, and the compressed air flow rate is inversely related to the temperature of the gas blown onto the integrated circuit chip 200. The flow of compressed air or coolant may be controlled to perform coarse tuning and then the power of the temperature-controlled heater 600 may be varied to perform fine tuning when adjusting the temperature of the gas blown onto the integrated circuit chip 200.
Referring to fig. 1 to 4, it can be understood that a circulation fan 140 is provided in the cabinet 100 to make the temperature of the gas in the cabinet 100 uniform. Since temperature fluctuation of the integrated circuit chip 200 due to uneven gas temperature distribution of the case 100 at the time of test is prevented, the detection accuracy is improved. The motor 141 for driving the circulation fan 140 to rotate is located outside the box 100 to avoid damage to the motor 141 caused by high temperature, the circulation fan 140 is a through-flow fan with uniform air outlet, and the blades of the circulation fan 140 are made of alloy materials with high temperature resistance.
Referring to fig. 1 to 4, it can be understood that the circulation fan 140, the evaporator 400, the heating device 110, and the environmental nozzle 120 are symmetrically disposed in two groups within the cabinet 100. So that the temperature distribution of the gas in the cabinet 100 is more uniform. Each evaporator 400 is connected to two temperature-controlled heaters 600 to reduce the operating flow rate of the individual evaporators 400, and the coolant is sufficiently converted into gas in the evaporators 400.
Referring to fig. 1 to 4, it can be appreciated that the case 100 is at least partially made of a thermal insulation material to reduce power consumption. The inner layer of the box body 100 is made of stainless steel, and the outer layer is coated with heat-insulating materials such as rock wool which can resist high temperature. Preventing heat from being dissipated through the case 100 during heating. The temperature inside the case 100 can be kept stable.
The invention also provides a using method of the three-temperature device for testing the integrated circuit chip, which comprises the following steps:
step S1, determining the type of test to be performed, if normal temperature test is performed, performing step S2, if low temperature test is performed, performing step S3, and if high temperature test is performed, performing step S4;
step S2, sliding 4 or 8 integrated circuit chips 200 to be detected onto the test fixture 300 through the conveying track 101, folding the test contact pieces 310 on the test fixture 300, and clamping and fixing the corresponding integrated circuit chips 200;
Step S3, opening valves on the coolant conveying pipes 500, inputting coolant into the evaporator 400 and the environmental nozzle 120 through the coolant conveying pipes 500, after the temperature in the box 100 is reduced to a preset temperature, sliding 4 or 8 integrated circuit chips 200 to be detected onto the test fixture 300 through the conveying rails 101, closing the test contact pieces 310 on the test fixture 300, clamping and fixing the corresponding integrated circuit chips 200, and controlling the temperature of the coolant flowing through the temperature control heater 600 by adjusting the opening of the valves on the coolant conveying pipes 500 and starting the temperature control heater 600 to heat, wherein the coolant is sprayed onto the surface of the integrated circuit chips 200 through the test nozzle 700 to further cool the integrated circuit chips 200. After the temperature measured by the temperature sensor 320 is stabilized at a preset value for 3 minutes, performing a low temperature test on the integrated circuit chip 200;
Step S4, starting the heating device 110 to heat the air in the box 100, after the temperature in the box 100 is increased to a preset temperature, sliding 4 or 8 integrated circuit chips 200 to be detected onto the test fixture 300 through the conveying rail 101, folding the test contact pieces 310 on the test fixture 300, clamping and fixing the corresponding integrated circuit chips 200, starting the air source 800 to input compressed air into the air heater 900, starting the air heater 900 to heat the compressed air flowing through the air heater 900, controlling the temperature of the air flowing through the temperature control heater 600 by adjusting the flow rate of the compressed air output by the air source 800 and starting the temperature control heater 600, and performing high-temperature test on the integrated circuit chips 200 after the temperature of the integrated circuit chips 200 is stabilized at the preset value for 3 minutes.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present invention.
Claims (10)
1. A three temperature apparatus for testing an integrated circuit chip, comprising:
The integrated circuit chip packaging box comprises a box body (100), wherein a heating device (110) for heating gas in the box body (100) is arranged in the box body (100), an environment nozzle (120) is arranged in the box body (100), and a conveying track (101) for conveying integrated circuit chips (200) is arranged on the box body (100) in a penetrating manner;
-a test fixture (300) for holding the integrated circuit chip (200) under test, the conveyor track (101) being capable of transporting the integrated circuit chip (200) onto the test fixture (300);
an evaporator (400) disposed within the housing (100);
A coolant delivery pipe (500) connected to the evaporator (400), the coolant entering the evaporator (400) through the coolant delivery pipe (500) to absorb heat and evaporate to cool the gas in the tank (100), the coolant delivery pipe (500) also connected to the environmental nozzle (120) to deliver the coolant to the tank (100) through the environmental nozzle (120);
A temperature controlled heater (600) in communication with the evaporator (400), the temperature controlled heater (600) for heating a gas passing through the temperature controlled heater (600);
And a test nozzle (700) which is arranged on the test fixture (300) and is connected with the temperature control heater (600), wherein the coolant evaporated in the evaporator (400) enters the temperature control heater (600) to be heated, and then is sprayed from the test nozzle (700) onto the integrated circuit chip (200) positioned on the test fixture (300).
2. A three temperature device for integrated circuit chip testing according to claim 1, wherein a source (800) for providing compressed air is provided outside the case (100), and wherein the source (800) is connected to an air heater (900) to supply compressed air to the air heater (900), and wherein the compressed air is heated by the air heater (900) and then supplied to the temperature controlled heater (600) through a compressed air line (910).
3. A three temperature device for integrated circuit chip testing according to claim 2, wherein said compressed air line (910) is provided with a one-way valve to prevent gas flow from said temperature controlled heater (600) to said air heater (900).
4. A three temperature device for integrated circuit chip testing according to claim 3, wherein said test fixture (300) is provided with a plurality of test contact pads (310) for simultaneously clamping a plurality of said integrated circuit chips (200), and said temperature controlled heater (600) and said test nozzle (700) are also provided with a plurality of air temperature controlling means for controlling the temperature of air blown to each of said integrated circuit chips (200), respectively.
5. A three temperature device for integrated circuit chip testing according to claim 4, wherein a plurality of temperature sensors (320) are provided on the test fixture (300) to detect the temperature of gas blown from the test nozzle (700) to each of the integrated circuit chip (200) and the test contact pad (310), respectively.
6. The three-temperature device for integrated circuit chip testing as set forth in claim 5, wherein the temperature sensor (320) is electrically connected to a controller, and the controller adjusts the heating power of the corresponding temperature-controlled heater (600) according to the temperature detected by the temperature sensor (320) so as to maintain the air temperature at the corresponding temperature sensor (320) at a preset value.
7. The three-temperature device for integrated circuit chip testing as set forth in claim 6, wherein a circulation fan (140) is disposed in the housing (100) to make the temperature of the gas in the housing (100) uniform.
8. The three-temperature device for testing integrated circuit chips according to claim 7, wherein two sets of the circulating fan (140), the evaporator (400), the heating device (110) and the environmental nozzle (120) are symmetrically arranged in the box (100).
9. A three temperature device for integrated circuit chip testing according to claim 8, wherein said housing (100) is at least partially of a thermal insulation material to reduce power consumption and to stabilize the temperature of said integrated circuit chip (200) and said test contact pad (310) during testing.
10. A method for using the three-temperature device for testing the integrated circuit chip, which is characterized by using the three-temperature device for testing the integrated circuit chip according to any one of claims 2-9, and comprising the following steps:
step S1, determining the type of test to be performed, if normal temperature test is performed, performing step S2, if low temperature test is performed, performing step S3, and if high temperature test is performed, performing step S4;
S2, the integrated circuit chip (200) to be detected slides onto the test fixture (300) through the conveying track (101), the test fixture (300) clamps and fixes the integrated circuit chip (200), and the integrated circuit chip (200) is tested at normal temperature;
S3, inputting a coolant into the evaporator (400) and the environment nozzle (120) through the coolant conveying pipe (500), after the temperature in the box body (100) is reduced to a preset temperature, sliding the integrated circuit chip (200) to be detected onto the test clamp (300) through the conveying track (101), clamping and fixing the integrated circuit chip (200) by the test clamp (300), cooling the integrated circuit chip (200) in the box body (100), starting the temperature control heater (600) to heat so as to control the temperature of the coolant flowing through the temperature control heater (600), spraying the coolant onto the surface of the integrated circuit chip (200) through the test nozzle (700), further cooling the integrated circuit chip (200), and after the temperature of the integrated circuit chip (200) is stable, performing low-temperature test on the integrated circuit chip (200);
And S4, starting the heating device (110) to heat air in the box body (100), after the temperature in the box body (100) is increased to a preset temperature, sliding the integrated circuit chip (200) to be detected onto the test fixture (300) through the conveying track (101), clamping and fixing the integrated circuit chip (200) by the test fixture (300), starting the air source (800) to input compressed air into the air heater (900), starting the air heater (900) to heat the compressed air flowing through the air heater (900), starting the temperature control heater (600) to control the air temperature flowing through the temperature control heater (600), and performing high-temperature test on the integrated circuit chip (200) after the temperature of the integrated circuit chip (200) is stable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311676493.6A CN120385904A (en) | 2023-12-07 | 2023-12-07 | A three-temperature device for integrated circuit chip testing and its use method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311676493.6A CN120385904A (en) | 2023-12-07 | 2023-12-07 | A three-temperature device for integrated circuit chip testing and its use method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN120385904A true CN120385904A (en) | 2025-07-29 |
Family
ID=96488446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311676493.6A Pending CN120385904A (en) | 2023-12-07 | 2023-12-07 | A three-temperature device for integrated circuit chip testing and its use method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN120385904A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1858607A (en) * | 2005-05-02 | 2006-11-08 | 雷特控制株式会社 | Temperature control device |
| CN101738574A (en) * | 2008-11-17 | 2010-06-16 | 三星电子株式会社 | Apparatus for testing semiconductor device and method for testing semiconductor device |
| CN111307222A (en) * | 2020-04-21 | 2020-06-19 | 南通芯盟测试研究院运营管理有限公司 | Chip temperature control test equipment |
| CN213275880U (en) * | 2020-11-03 | 2021-05-25 | 苏州武乐川精密电子有限公司 | Three temperature test device of encapsulation type chip |
| CN114883215A (en) * | 2022-03-25 | 2022-08-09 | 北京京仪自动化装备技术股份有限公司 | Temperature control test system and method |
| CN217774863U (en) * | 2022-08-03 | 2022-11-11 | 深圳市斯纳达科技有限公司 | Chip three-temperature test equipment |
| CN117054690A (en) * | 2023-03-01 | 2023-11-14 | 成都华轺科技有限公司 | Radio frequency BGA three-temperature chip detection equipment |
| CN223296093U (en) * | 2023-12-07 | 2025-09-02 | 旷泰科技(上海)有限公司 | A three-temperature device for testing integrated circuit chips |
-
2023
- 2023-12-07 CN CN202311676493.6A patent/CN120385904A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1858607A (en) * | 2005-05-02 | 2006-11-08 | 雷特控制株式会社 | Temperature control device |
| CN101738574A (en) * | 2008-11-17 | 2010-06-16 | 三星电子株式会社 | Apparatus for testing semiconductor device and method for testing semiconductor device |
| CN111307222A (en) * | 2020-04-21 | 2020-06-19 | 南通芯盟测试研究院运营管理有限公司 | Chip temperature control test equipment |
| CN213275880U (en) * | 2020-11-03 | 2021-05-25 | 苏州武乐川精密电子有限公司 | Three temperature test device of encapsulation type chip |
| CN114883215A (en) * | 2022-03-25 | 2022-08-09 | 北京京仪自动化装备技术股份有限公司 | Temperature control test system and method |
| CN217774863U (en) * | 2022-08-03 | 2022-11-11 | 深圳市斯纳达科技有限公司 | Chip three-temperature test equipment |
| CN117054690A (en) * | 2023-03-01 | 2023-11-14 | 成都华轺科技有限公司 | Radio frequency BGA three-temperature chip detection equipment |
| CN223296093U (en) * | 2023-12-07 | 2025-09-02 | 旷泰科技(上海)有限公司 | A three-temperature device for testing integrated circuit chips |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6505478B1 (en) | Heat exchanger having sloped deflection surface for directing refrigerant | |
| US7900373B2 (en) | Method for conditioning semiconductor wafers and/or hybrids | |
| US9983259B2 (en) | Dual loop type temperature control module and electronic device testing apparatus provided with the same | |
| US7355428B2 (en) | Active thermal control system with miniature liquid-cooled temperature control device for electronic device testing | |
| US6723964B2 (en) | Apparatus for heating and cooling semiconductor device in handler for testing semiconductor device | |
| US9885747B2 (en) | Substrate inspection apparatus and substrate temperature control method | |
| TWI534573B (en) | Wide range temperature control apparatus | |
| JP6429084B2 (en) | Temperature control device, temperature control method and prober for wafer mounting table | |
| US20060244472A1 (en) | Temperature control apparatus | |
| CN223296093U (en) | A three-temperature device for testing integrated circuit chips | |
| JP2008107014A (en) | Cooling device, and cooling method of chamber space for device test | |
| KR20180016121A (en) | Test apparatus of semiconductor package | |
| US6628132B2 (en) | Methods and apparatus for testing a semiconductor structure using improved temperature desoak techniques | |
| CN120385904A (en) | A three-temperature device for integrated circuit chip testing and its use method | |
| KR20240052767A (en) | carburetor | |
| JP4645373B2 (en) | Electronic component temperature control device and handler device | |
| WO2023084612A1 (en) | Temperature adjustment device and electronic component testing device | |
| TWI840995B (en) | Temperature control system and electronic component testing equipment | |
| KR101013520B1 (en) | Test Handler Chamber Rapid Temperature Control | |
| JP6256526B2 (en) | Handler and parts inspection device | |
| CN222926772U (en) | Temperature control system and semiconductor test equipment | |
| JP2012185184A (en) | Temperature control apparatus of electronic component, and handler apparatus | |
| KR20090077175A (en) | Inspection thermostat | |
| US12276694B2 (en) | Coolant supplying apparatus, and temperature controlling apparatus and test handler including the same | |
| JP6256523B2 (en) | Handler and parts inspection device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |