CN120710020A

CN120710020A - Static VAR generator power module

Info

Publication number: CN120710020A
Application number: CN202511040190.4A
Authority: CN
Inventors: 裴圣华; 姜倩; 曹利民; 王建兵; 尹诚宇; 张生辉; 赵倩; 王永新
Original assignee: Tbea Xi'an Flexible Power T&d Co ltd; TBEA Xinjiang Sunoasis Co Ltd
Current assignee: Tbea Xi'an Flexible Power T&d Co ltd; TBEA Xinjiang Sunoasis Co Ltd
Priority date: 2025-07-28
Filing date: 2025-07-28
Publication date: 2025-09-26

Abstract

The present application relates to a static VAR generator power module. The static VAR generator power module includes a module chassis structural assembly, a DC support capacitor assembly, a DC current-carrying laminated busbar assembly, an AC current-carrying busbar assembly, a panel assembly, a liquid-cooled power module assembly, and a module control board assembly. Through a unified module chassis structural design, the interchangeability of the main structural components is achieved, solving the problems of high production costs and difficult maintenance caused by non-standardized parts in the prior art. The module supports single H-bridge and dual H-bridge structural configurations, has high versatility and flexibility, is suitable for different application scenarios, and significantly improves production efficiency and equipment reliability.

Description

Power module of static var generator

Technical Field

The application relates to the technical field of power electronics, in particular to a power module of a static var generator.

Background

With the development of power electronics technology, a static var Generator (STATIC VAR) is increasingly widely applied in the fields of modern power systems, industry and new energy, and becomes a key device for reactive power compensation, voltage stabilization and power quality optimization. SVG adopts cascade H bridge structure through modularized design, has realized the matching of system voltage and electric wire netting voltage, has showing the reliability and the adaptability that have promoted equipment. At present, the structural form of SVG power module mainly includes single H bridge module and two H bridge module and bypass model thereof, through quick-witted case structural component, power module, control module, cooling module and bypass module's collaborative work, has satisfied the demand of different application scenario.

In the related art, the design of the SVG power module mainly depends on the structural scheme of a single H-bridge or a double H-bridge, and the bypass function is selected according to the actual requirement. However, due to the differences of different types of power device types, structural materials and process forms, the structural forms, the appearance and the sizes of the modules are greatly different, so that the standardization degree is low. In addition, market demand fluctuation to single model is great, has further aggravated module structure spare part interchangeability and the poor problem of commonality for manufacturing cost is high, production cycle extension, maintenance degree of difficulty increase. The design with complicated structure not only violates the design principle of the product, but also puts higher requirements on the capability of the research team, and increases the research and development risk and management challenges of enterprises.

However, the above-mentioned design method of the SVG power module has obvious limitations. On one hand, the non-standardization of the structural parts results in low mass production benefit and difficult control of manufacturing cost, and on the other hand, the external design of the bypass switch not only increases the size of the power cabinet, but also can cause misoperation risks due to electromagnetic interference. In addition, the traditional direct-current side composite laminated copper busbar structure is high in processing difficulty and high in cost, and the economic benefit of the industry is further restricted. These problems seriously affect the market competitiveness of SVG power modules, and a new structural design is needed to solve the deficiencies of the prior art.

Disclosure of Invention

Based on this, it is necessary to provide a Static Var Generator (SVG) power module for solving the problems of poor interchangeability of structural components, high production cost, difficult maintenance, and the like of the SVG power module.

A static var generator power module, the static var generator power module comprising:

A module chassis structural assembly (1) for assembling the components of the static var generator power module, wherein the module chassis structural assembly (1) comprises:

A module structure main frame (101);

The module direct-current capacitor bin supporting plate (103) is arranged on the rear end face of the module structure main frame (101) and is used for sealing the rear end face of the module structure main frame (101);

A liquid-cooled power module assembly mounting plate (104) horizontally arranged on the front half part in the module structure main frame (101) for dividing the front half part in the module structure main frame (101) into an upper space (107) and a lower space (108);

the module control board mounting trays (105) are vertically arranged on two sides of the upper space (107);

A liquid cooling system top fixing plate (106) arranged on the top of the inner side of the upper space (107) and the liquid cooling power module assembly mounting plate (104);

A DC supporting capacitor assembly (2) arranged in the lower space (108);

The direct current carrying laminated busbar assembly (3) is arranged in the module structure main frame (101) and is connected with the direct current supporting capacitor assembly (2);

The alternating current bus bar assembly (4) is arranged on the module structure main frame (101) in an extending mode;

The liquid cooling power module assembly (6) is arranged on the liquid cooling system top fixing plate (106), and the liquid cooling power module assembly mounting plate (104) is used for bearing the liquid cooling power module assembly (6) and is connected with the direct current carrying laminated busbar assembly (3) and the alternating current carrying busbar assembly (4);

The module control board assembly (7) is arranged on the module control board mounting tray (105) and is connected with the direct current carrying laminated busbar assembly (3).

In one embodiment, the static var generator power module further comprises:

the electromagnetic shielding plates (102) are arranged on the left side surface and the right side surface of the module structure main frame (101), and the electromagnetic shielding plates (102) are used for carrying out electromagnetic shielding on the module control plate assembly (7);

the panel assembly (5) is connected to the module case structure assembly (1) and is used for closing the front end face of the upper space (107), wherein the panel assembly (5) comprises:

The panel (501), the front end surface that the said panel (501) is used for closing the said upper space (107), there is the first breach (503) on the said panel (501), the said first breach (503) supplies the said alternating current to carry the busbar assembly (4) to extend from the said module structure main frame (101);

a DC test terminal (502) arranged on the panel (501) and used for connecting an external DC circuit;

The capacitor assemblies (9) are arranged on the module direct current capacitor bin supporting plate (103), and the capacitor assemblies (9) are connected with the direct current carrier laminated busbar assembly (3).

In one embodiment, the static var generator power module further comprises:

the bypass switch assembly (8) is arranged above the direct current support capacitor assembly (2) in an embedded mode and is connected with the alternating current busbar assembly (4), and the bypass switch assembly (8) comprises:

A bypass switch mounting plate (802) for providing mechanical support;

a bypass switch component (801) provided on the bypass switch mounting plate (802);

A bypass switch ac outlet line (803);

The bypass switch alternating current incoming line row (804), the bypass switch alternating current incoming line row (804) and the bypass switch alternating current outgoing line row (803) are arranged on the bypass switch component (801).

In one embodiment, the module control board assembly (7) is set to be one, the direct current supporting capacitor assembly (2), the direct current carrying laminated busbar assembly (3), the alternating current carrying busbar assembly (4), the panel assembly (5), the liquid cooling power module assembly (6), the module control board assembly (7), and the capacitor assembly (9) are all set in the module case structure assembly (1), wherein:

The direct current support capacitor assembly (2), the panel assembly (5), the liquid cooling power module assembly (6), the module control board assembly (7) and the capacitor assembly (9) are connected with the direct current carrying laminated busbar assembly (3), and the liquid cooling power module assembly (6) is also connected with the alternating current carrying busbar assembly (4) so as to form a single H-bridge module without a bypass structure (10).

In one embodiment, the module control board assembly (7) is configured as one, the dc supporting capacitor assembly (2), the dc current carrying laminated busbar assembly (3), the ac current carrying busbar assembly (4), the panel assembly (5), the liquid cooling power module assembly (6), the module control board assembly (7), the bypass switch assembly (8), and the capacitor assembly (9) are all configured in the module case structural assembly (1), wherein:

the direct current support capacitor assembly (2), the panel assembly (5), the liquid cooling power module assembly (6), the module control board assembly (7) and the capacitor assembly (9) are connected with the direct current carrying laminated busbar assembly (3), the liquid cooling power module assembly (6) is further connected with the alternating current carrying busbar assembly (4), and the bypass switch assembly (8) is connected with the alternating current carrying busbar assembly (4) to form a single H bridge module with bypass structure (20).

In one embodiment, the number of module control board assemblies (7) is two, the number of direct current supporting capacitor assemblies (2) and the number of direct current carrying laminated busbar assemblies (3) and the number of alternating current carrying laminated busbar assemblies (4) and the number of panel assemblies (5) and the number of liquid cooling power module assemblies (6) and the number of two module control board assemblies (7) and the number of capacitor assemblies (9) are all set in the module case structural assembly (1), wherein:

The direct current support capacitor assembly (2), the panel assembly (5), the liquid cooling power module assembly (6), the module control board assembly (7) and the capacitor assembly (9) are connected with the direct current carrying laminated busbar assembly (3), and the liquid cooling power module assembly (6) is also connected with the alternating current carrying busbar assembly (4) so as to form a double-H-bridge module without a bypass structure (30).

In one embodiment, the dc support capacitor assembly (2) comprises:

A capacitive support (201);

a capacitance fixing member (204) arranged at a distance from the capacitance support member (201);

The connecting piece (203) is used for connecting the capacitance supporting piece (201) and the capacitance fixing piece (204) so that the capacitance supporting piece (201) and the capacitance fixing piece (204) form a frame structure;

And two capacitance elements (202) are arranged in the frame structure.

In one embodiment, the dc support capacitor assembly (2) comprises:

A capacitive support (201);

a capacitance fixing member (204) disposed opposite to the capacitance support member (201);

And four capacitance elements (202) are arranged in the frame structure.

In one embodiment, the dc current carrying laminated busbar assembly (3) comprises:

The first direct current positive electrode is connected with the busbar (301) in parallel greatly;

the first direct current negative electrode is connected with a busbar (303) in large parallel;

The first parallel insulating isolation film (302) is arranged between the first direct current positive electrode large parallel busbar (301) and the first direct current negative electrode large parallel busbar (303) and isolates the first direct current positive electrode large parallel busbar (301) and the first direct current negative electrode large parallel busbar (303);

two direct current negative electrode collection busbar (306), two collection insulating isolation films (305) and two positive electrode direct current collection busbar (304), wherein:

The direct current negative electrode collecting busbar (306), the collecting insulating isolation film (305) and the positive direct current collecting busbar (304) are arranged on the left side of the first direct current negative electrode large parallel busbar (303) from top to bottom, and the other direct current negative electrode collecting busbar (306), the other collecting insulating isolation film (305) and the other positive direct current collecting busbar (304) are arranged on the right side of the first direct current negative electrode large parallel busbar (303) from bottom to top;

The direct current negative electrode collecting busbar (306) is arranged on the first direct current negative electrode large parallel busbar (303), the collecting insulating isolation film (305) is arranged on the direct current negative electrode collecting busbar (306) and isolates the direct current positive electrode collecting busbar (304) and the direct current negative electrode collecting busbar (306), and the direct current positive electrode collecting busbar (304) is arranged on the collecting insulating isolation film (305);

the anodes of the two direct current support capacitor components are connected with a busbar (307);

The two direct current support capacitor assembly negative electrode connection busbar (308), the two direct current support capacitor assembly positive electrode connection busbar (307) and the two direct current support capacitor assembly negative electrode connection busbar (308) are symmetrically arranged on the left side and the right side of the first direct current negative electrode large parallel busbar (303) and are used for being connected with the direct current support capacitor assembly (2);

the first parallel insulating isolation film (302) and the collecting insulating isolation film (305) are made of fireproof polypropylene insulating paper;

The first direct current positive electrode large parallel busbar (301), the first direct current negative electrode large parallel busbar (303), the direct current positive electrode collecting busbar (304), the direct current negative electrode collecting busbar (306), the direct current support capacitor component positive electrode connecting busbar (307) and the direct current support capacitor component negative electrode connecting busbar (308) are made of copper or aluminum.

Two second direct current positive electrode large parallel bus bars (1001);

two second direct current negative electrode large parallel busbar (1003);

The second parallel insulating isolation films (1002) are arranged between the second direct current positive electrode large parallel busbar (1001) and the second direct current negative electrode large parallel busbar (1003), and isolate the second direct current positive electrode large parallel busbar (1001) and the second direct current negative electrode large parallel busbar (1003);

The two direct current negative electrode collecting busbar (306) are respectively arranged on the two groups of second direct current negative electrode large parallel busbar (1003), the two collecting insulating isolation films (305) are respectively arranged on the two groups of direct current negative electrode collecting busbar (306), the collecting insulating isolation films (305) are used for isolating the direct current positive electrode collecting busbar (304) and the direct current negative electrode collecting busbar (306), and the two direct current positive electrode collecting busbar (304) are respectively arranged on the collecting insulating isolation films (305);

the anodes of the four direct current support capacitor components are connected with a busbar (307);

four direct current support capacitance assembly negative electrode connection busbar (308), wherein:

The direct current support capacitor assembly positive electrode connecting busbar (307) and the direct current support capacitor assembly negative electrode connecting busbar (308) are arranged on one of the second direct current negative electrode large parallel busbar (1003), the other two direct current support capacitor assembly positive electrode connecting busbars (307) and the other two direct current support capacitor assembly negative electrode connecting busbars (308) are arranged on the other second direct current negative electrode large parallel busbar (1003), and the direct current support capacitor assembly positive electrode connecting busbar (307) and the direct current support capacitor assembly negative electrode connecting busbar (308) are arranged on the side edge of the second direct current negative electrode large parallel busbar (1003) at intervals.

In one embodiment, the ac current carrying busbar assembly (4) comprises:

an ac current carrying busbar input (401);

And the alternating current bus output end (402), and the alternating current bus input end (401) and the alternating current bus output end (402) have the same structure.

In one embodiment, a liquid cooled power module assembly (6) includes:

A liquid-cooled heat-dissipating plate (601);

A chip-type discharge resistor (602) provided on the liquid-cooled heat-dissipating plate (601);

a power module driving plate (603) provided on the liquid cooling plate (601);

A liquid-cooled power module (604) disposed on the power module drive board (603);

The alternating current busbar auxiliary support piece (605) is arranged on the side face of the liquid cooling heat dissipation plate (601) and is used for being connected with the alternating current busbar assembly (4);

the liquid cooling heat dissipation plate (601) is internally provided with a circulating flow channel, a heat conduction material is coated between the liquid cooling heat dissipation plate (601) and the liquid cooling power module (604) and between the liquid cooling heat dissipation plate and the patch type discharge resistor (602), and the liquid cooling heat dissipation plate (601) is used for cooling the liquid cooling power module (604) and the patch type discharge resistor (602).

Above-mentioned SVG power module has adopted unified module machine case structural component design, through integrated module machine case structural component, direct current support capacitor subassembly, the female subassembly of arranging of direct current-carrying stromatolite, the female subassembly of arranging of alternating current-carrying, liquid cooling power module subassembly and module control board subassembly for main structural component possesses interchangeability, thereby solves the low, high in manufacturing cost of mass production benefit, the maintenance difficulty scheduling problem because of structural component non-standardization leads to among the prior art.

Drawings

Fig. 1 is a schematic structural diagram of a power module (a single H-bridge module does not include a bypass structure) of a static var generator according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of a power module (including a bypass structure of a single H-bridge module) of a static var generator according to an embodiment of the present application.

Fig. 3 is a schematic structural diagram of a power module (a dual H-bridge module does not include a bypass structure) of a static var generator according to an embodiment of the present application.

Fig. 4 is a schematic structural diagram of a module chassis structure assembly according to an embodiment of the present application.

Fig. 5 is a schematic structural diagram of a dc supporting capacitor assembly according to an embodiment of the application.

Fig. 6 is a schematic structural diagram of a dc supporting capacitor assembly in a single H-bridge module according to an embodiment of the application.

Fig. 7 is a schematic structural diagram of a dc supporting capacitor assembly in a dual H-bridge module according to an embodiment of the application.

Fig. 8 is a schematic structural diagram of an ac current carrying busbar assembly according to an embodiment of the present application.

Fig. 9 is a schematic structural diagram of a panel assembly according to an embodiment of the application.

Fig. 10 is a schematic structural diagram of a liquid-cooled power module assembly according to an embodiment of the present application.

Fig. 11 is a schematic structural diagram of a module control board assembly according to an embodiment of the present application.

FIG. 12 is a schematic diagram of a bypass switch assembly according to an embodiment of the present application.

Reference numerals in the specific embodiments are as follows:

10. the single H bridge module does not contain a bypass structure, the 20 th and the double H bridge modules do not contain a bypass structure;

1. a module chassis structural assembly;

101. a module structure main frame; 102, an electromagnetic shielding plate, 103, a module direct-current capacitor bin supporting plate, 104, a liquid cooling power module assembly mounting plate, 105, a module control plate mounting tray, 106, a liquid cooling system top fixing plate, 107, an upper space, 108 and a lower space;

2. a DC supporting capacitor assembly;

201. Capacitance support member, 202, capacitance element, 203, connecting member, 204, capacitance fixing member;

3. A direct current carrying laminated busbar assembly;

301. The direct current positive electrode large parallel busbar, 302, a first parallel insulating isolation film, 303, a first direct current negative electrode large parallel busbar, 304, a direct current positive electrode collecting busbar, 305, a collecting insulating isolation film, 306, a direct current negative electrode collecting busbar, 307, a direct current support capacitor component positive electrode connecting busbar, 308, a direct current support capacitor component negative electrode connecting busbar, 309, a first hole, 310, a second hole;

4. an alternating current bus bar assembly;

401. an ac current carrying busbar input, 402 an ac current carrying busbar output;

5. A panel assembly;

501. panel, 502, DC test terminal

6. A liquid-cooled power module assembly;

601. the device comprises a liquid cooling heat dissipation plate, a surface mounted discharge resistor, a 603 power module driving plate, a 604 liquid cooling power module, a 605 alternating current bus auxiliary support;

7. A module control board assembly;

701. a module control board;

8. a bypass switch assembly;

801. bypass switch components, a bypass switch mounting plate, 803 bypass switch alternating current outlet lines, 804 bypass switch alternating current inlet lines;

9. A capacitor assembly;

1001. The second direct current positive electrode large parallel busbar, 1002 the second parallel insulating isolation film, 1003 the second direct current negative electrode large parallel busbar.

Detailed Description

In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.

In the description of the present application, it should be understood that, if any, these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., are used herein with respect to the orientation or positional relationship shown in the drawings, these terms refer to the orientation or positional relationship for convenience of description and simplicity of description only, and do not indicate or imply that the apparatus or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the application.

Furthermore, the terms "first," "second," and the like, if any, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the terms "plurality" and "a plurality" if any, mean at least two, such as two, three, etc., unless specifically defined otherwise.

In the present application, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly. For example, they may be fixedly connected, detachably connected or integrally formed, mechanically connected, electrically connected, directly connected or indirectly connected through an intermediate medium, and communicated between two elements or the interaction relationship between two elements unless clearly defined otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present application, unless expressly stated or limited otherwise, the meaning of a first feature being "on" or "off" a second feature, and the like, is that the first and second features are either in direct contact or in indirect contact through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that if an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. If an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein, if any, are for descriptive purposes only and do not represent a unique embodiment.

See fig. 1-4. In the present application, the module case structure assembly 1 is used to assemble the individual components of the static var generator power module. The module chassis structure assembly 1 includes a module structure main frame 101, a module dc capacitor box support plate 103, a liquid-cooled power module assembly mounting plate 104, a module control board mounting tray 105, and a liquid-cooled system top fixing plate 106. The module structure main frame 101 is an installation framework of the whole chassis, the module direct-current capacitor box supporting plate 103 is arranged on the rear end face of the module structure main frame 101 and used for sealing the rear end face of the module structure main frame 101, the liquid-cooling power module assembly mounting plate 104 is horizontally arranged on the front half part of the module structure main frame 101 and used for dividing the front half part in the module structure main frame 101 into an upper space 107 and a lower space 108, the module control plate mounting trays 105 are vertically arranged on two sides of the upper space 107, the liquid-cooling system top fixing plate 106 is arranged on the top of the inner side of the upper space 107 and the liquid-cooling power module assembly mounting plate 104, and the electromagnetic shielding plate 102 is also divided into a left part and a right part and is respectively arranged on two sides of the module structure main frame 101101.

In some embodiments of the present application, the module control board mounting trays 105 are vertically symmetrically disposed on both sides of the upper space 107.

In some embodiments of the present application, the module case structure component 1 uses a carbon steel sheet metal as a base material, and can flexibly select the thickness of the sheet metal according to the weight and power of the power module of the static var generator and the installation and protection requirements of internal electrical devices, and the design of the structure component is completed through processes such as bending, cutting and the like. The module direct-current capacitor box supporting plate 103, the liquid-cooling power module assembly mounting plate 104, the module control plate mounting tray 105 and the liquid-cooling system top fixing plate 106 are all separate parts, and are mounted and fixed on the module structure main frame 101 in a bolt, riveting mode and the like. The assembly scheme is convenient for quality control and debugging in the production process and further provides convenience for later maintenance. The split type structural design allows the internal layout to be flexibly adjusted according to different application scenes, meanwhile, the standardized connection mode remarkably improves the universality and interchangeability of parts, and the production cost and the stock pressure of spare parts are effectively reduced.

In some embodiments of the present application, the main frame 101 of the module structure is a cuboid structure, and the side surface of the main frame 101 of the module structure is provided with heat dissipation holes. Meanwhile, a lifting hand and a flanging design are arranged on the side face of the main frame 101 of the module structure, so that the module is carried and contact scratch is prevented. The radiating holes formed in the side surfaces ensure effective ventilation and heat radiation during operation of the power device, foreign matters are prevented from entering through reasonable aperture and layout, and safe operation of equipment is guaranteed. The hand lifting design combines with the human engineering principle, so that an operator can easily apply force when carrying the module, and the convenience of installation and maintenance is remarkably improved.

Continuing to combine figures 1 through 4. The direct current supporting capacitor assembly 2 is arranged in the lower space 108, the direct current carrying laminated busbar assembly 3 is arranged in the module structure main frame 101 and connected with the direct current supporting capacitor assembly 2, the alternating current carrying busbar assembly 4 is arranged on the module structure main frame 101 in an extending mode, the liquid cooling power module assembly 6 is arranged on the liquid cooling system top fixing plate 106, the liquid cooling power module assembly mounting plate 104 is used for bearing the liquid cooling power module assembly 6 and connected with the direct current carrying laminated busbar assembly 3 and the alternating current carrying busbar assembly 4, and the module control plate assembly 7 is arranged on the module control plate mounting tray 105 and connected with the direct current carrying laminated busbar assembly 3. The module case structural component 1 is used as a core support, and the optimized layout of the internal functional components is realized by reasonably dividing the space. The DC supporting capacitor assembly 2 is arranged in the lower space 108 to provide stable DC support for the system, and the DC current carrying laminated busbar assembly 3 is used as an electrical connection part to ensure the reliability of the power circuit. The alternating current busbar assembly 4 extends to the outside of the case, and can achieve efficient connection among the SVG modules. The liquid cooling power module assembly 6 is doubly fixed with the mounting plate 104 through the liquid cooling system top fixing plate 106, so that the heat dissipation efficiency is ensured, and the structural stability is ensured. The module control board assembly 7 is vertically mounted on the tray 105 and connected with the direct current carrying laminated busbar assembly 3 to form a complete control system. The design not only optimizes the space utilization rate, but also realizes the rapid assembly and maintenance of each component through the standardized interface, and provides a flexible configuration scheme for the single H bridge and double H bridge structures.

In some embodiments of the present application, the module case structure assembly 1 further includes electromagnetic shielding plates 102 disposed on the left and right sides of the module structure main frame 101. The electromagnetic shielding plate 102 is a separate component, and is mounted and fixed on the left side surface and the right side surface of the main frame 101 of the module structure by means of bolts, riveting and the like, so that the influence of external electromagnetic interference on the internal sensitive electronic element can be effectively isolated.

In some embodiments of the application, the static var generator power module further comprises a panel assembly 5 connected to the module case structure assembly 1 for closing the front end surface of the upper space 107 to protect the internal components.

In some embodiments of the application, the static var generator power module further comprises a plurality of capacitor assemblies 9, wherein the capacitor assemblies 9 are arranged on the module direct current capacitor bin supporting plate 103 and are connected with the direct current carrying laminated busbar assembly 3. Preferably, the number of capacitive components 9 is 10. The design obviously enhances the direct current supporting capability of the module and ensures the stability and the electric energy quality of the power loop. Through rationally arranging the capacitor assembly 9, not only space utilization is optimized, but also the dynamic response speed and the anti-interference capability of the system are improved, thereby providing reliable guarantee for reactive compensation and voltage stabilization.

In the application, the main frame 101 of the module structure is used as an installation framework of the whole chassis, provides a stable supporting foundation for other components, and ensures the stability and reliability of the whole structure. The module direct current capacitor box backup pad 103 sets up the rear end face at module structure main frame 101, has not only sealed the rear end face of module structure main frame 101, still provides special installation space for capacitor assembly 9, has optimized inside overall arrangement. The liquid cooling power module assembly mounting plate 104 is horizontally arranged on the front half part of the module structure main frame 101101, and divides the front half part in the module structure main frame 101 into an upper space 107 and a lower space 108. The module control board mounting trays 105 are vertically and symmetrically arranged on two sides of the upper space 107, so that space is saved, the module control board assembly 7 is more convenient to mount, and meanwhile, the symmetrical design is beneficial to balancing the internal structure and reducing electromagnetic interference. The liquid cooling system top fixing plate 106 is arranged on the top of the inner side of the upper space 107 and the liquid cooling power module assembly mounting plate 104, so that a stable mounting platform is provided for the liquid cooling power module assembly 6, and efficient operation of the heat dissipation system is ensured. The electromagnetic shielding plates 102 are arranged on the two sides of the main frame 101 of the module structure in a left-right mode, so that external electromagnetic interference is effectively shielded, stable operation of sensitive components such as the module control panel assembly 7 is protected, and anti-interference capability and reliability of equipment are improved. The whole design not only optimizes the internal space layout, but also enhances the maintainability and the universality of the equipment, and provides a flexible configuration scheme for different application scenes.

In some embodiments of the application, the static var generator power module further comprises a bypass switch assembly 8, wherein the bypass switch assembly 8 is arranged above the direct current support capacitor assembly 2 in an embedded mode and is connected with the alternating current busbar assembly 4. The embedded layout not only remarkably optimizes the utilization rate of the internal space of the power cabinet and avoids the extra occupation of the traditional external bypass switch on the equipment volume, but also improves the response speed of the system by shortening the bypass driving path. The bypass switch assembly 8 and the alternating current busbar assembly 4 are directly connected, so that rapid action response can be realized when the system needs rapid switching, and stable operation of a power grid is effectively ensured. Meanwhile, the integrated design also provides closed metal protection for the bypass switch and the driving part thereof, so that the malfunction risk caused by electromagnetic interference is greatly reduced, and the reliability of the system in a complex electromagnetic environment is enhanced. The structure design not only meets the requirements of a modern power system on equipment compactness and high reliability, but also provides convenience for field maintenance, and fully embodies the functionality and practicality.

See fig. 1. In some embodiments of the application, the module control board assembly 7 is provided as one. The direct current support capacitor assembly 2, the direct current carrying laminated busbar assembly 3, the alternating current carrying busbar assembly 4, the panel assembly 5, the liquid cooling power module assembly 6, the module control board assembly 7 and the capacitor assembly 9 are all arranged in the module case structure assembly 1, wherein the direct current support capacitor assembly 2, the panel assembly 5, the liquid cooling power module assembly 6, the module control board assembly 7 and the capacitor assembly 9 are all connected with the direct current carrying laminated busbar assembly 3, and the liquid cooling power module assembly 6 is also connected with the alternating current carrying busbar assembly 4 so as to form a single H-bridge module without the bypass structure 10.

See fig. 2. In some embodiments of the application, the module control board assembly 7 is provided as one. The direct current support capacitor assembly 2, the direct current carrying laminated busbar assembly 3, the alternating current carrying busbar assembly 4, the panel assembly 5, the liquid cooling power module assembly 6, the module control board assembly 7, the bypass switch assembly 8 and the capacitor assembly 9 are all arranged in the module case structure assembly 1, wherein the direct current support capacitor assembly 2, the panel assembly 5, the liquid cooling power module assembly 6, the module control board assembly 7 and the capacitor assembly 9 are all connected with the direct current carrying laminated busbar assembly 3, the liquid cooling power module assembly 6 is also connected with the alternating current carrying busbar assembly 4, and the bypass switch assembly 8 is connected with the alternating current carrying busbar assembly 4 to form the single H bridge module bypass structure 20.

See fig. 3. In some embodiments of the application, the module control board assembly 7 is provided in two. The direct current support capacitor assembly 2, the direct current carrying laminated busbar assembly 3, the alternating current carrying busbar assembly 4, the panel assembly 5, the liquid cooling power module assembly 6, the two module control board assemblies 7 and the capacitor assembly 9 are all arranged in the module case structure assembly 1, wherein the direct current support capacitor assembly 2, the panel assembly 5, the liquid cooling power module assembly 6, the module control board assemblies 7 and the capacitor assembly 9 are all connected with the direct current carrying laminated busbar assembly 3, and the liquid cooling power module assembly 6 is also connected with the alternating current carrying busbar assembly 4 so as to form a double H-bridge module without the bypass structure 30.

The application provides a flexible configuration scheme of two basic topologies of a single H bridge and a double H bridge through a modularized design, and simultaneously supports optional integration of bypass functions. The configuration of the single module control board assembly 7 in the single H-bridge module without bypass structure 10 achieves efficient control of the system, while the addition of the embedded bypass switch assembly 8 in the single H-bridge module with bypass structure 20 provides a reliable protection mechanism for the system, and the dual H-bridge module without bypass structure 30 meets the requirements of higher power levels through the dual control board configuration. The three standardized structure variants share the same module case structure assembly 1 and core function modules, and the maximum generalization and interchangeability of parts are realized through modularized combination. The design not only remarkably reduces the production cost and the stock pressure of spare parts, but also greatly shortens the delivery cycle of the product, and simultaneously provides a solution which can be flexibly selected according to the actual application scene for the end user. The unified installation interface and connection mode ensure the rapid deployment and maintenance of different configuration modules, and the standardized structural design ensures the consistency and reliability of the product quality. The serial design scheme perfectly balances the contradiction between the product diversity requirement and the large-scale production benefit, and provides an ideal engineering realization path for the large-scale application of SVG equipment.

Referring to fig. 5, fig. 5 is a schematic structural diagram of a dc supporting capacitor assembly according to an embodiment of the application. Referring to fig. 2, in the single H-bridge module bypass structure 20, the dc support capacitor assembly 2 includes a capacitor support 201, a capacitor element 202, a connector 203, and a capacitor fixing 204. The capacitor fixing piece 204 and the capacitor supporting piece 201 are arranged at intervals, and the connecting piece 203 is used for connecting the capacitor supporting piece 201 and the capacitor fixing piece 204, so that the capacitor supporting piece 201 and the capacitor fixing piece 204 form a frame structure. The capacitive elements 202 are disposed within the frame structure, two in number.

Referring to fig. 1 and 3, in the case where the single H-bridge module does not include the bypass structure 10 and the double H-bridge module does not include the bypass structure 30, the dc supporting capacitor assembly 2 includes a capacitor supporting member 201, a capacitor element 202, a connecting member 203, and a capacitor fixing member 204. The capacitor fixing piece 204 and the capacitor supporting piece 201 are arranged at intervals, and the connecting piece 203 is used for connecting the capacitor supporting piece 201 and the capacitor fixing piece 204, so that the capacitor supporting piece 201 and the capacitor fixing piece 204 form a frame structure. The capacitive elements 202 are disposed in the frame structure, four in number.

In the application, the direct-current support capacitor assembly 2 adopts a modularized frame design, and a standardized mounting platform capable of flexibly adapting to different topological structures is constructed through ingenious combination of the capacitor support piece 201, the connecting piece 203 and the capacitor fixing piece 204. The scheme of configuring two capacitive elements 202 in the single H-bridge module without the bypass structure 10 achieves the optimal balance of space and performance, not only ensures enough direct current supporting capability, but also reserves installation space for the bypass switch assembly 8, and the capacity expansion design of four capacitive elements 202 in the single H-bridge module without the bypass structure 10 and the double H-bridge module without the bypass structure 30 significantly improves the energy buffering and filtering performance of the system. This expandable frame structure design not only achieves firm fixation and efficient heat dissipation of the capacitive element 202, but also ensures part interchangeability between different configurations through standardized interfaces. The unified mounting mode simplifies the production and assembly process, reduces the manufacturing cost, and is convenient for replacing elements during later maintenance. The design fully considers the electrical performance requirements and space constraint conditions in different application scenes, realizes the optimal cost-benefit ratio while ensuring the reliability, and provides key support for the series development of SVG power modules.

In some embodiments of the application, the dc support capacitor assembly 2 is a separate assembly. The capacitor support 201, the connector 203 and the capacitor fixing 204 are connected into a frame structure by bolts. The capacitive element 202 is secured within the frame structure by bolts.

In some embodiments of the present application, the capacitive support 201 is made of plastic or insulating material, such as PA, SMC or FR4. The connecting piece 203 and the capacitor fixing piece 204 are made of carbon steel sheet metal materials. The direct current support capacitor assembly 2 fully considers the dual requirements of electric safety and mechanical strength, the capacitor support 201 adopts high-performance insulating materials such as PA, SMC or FR4, the capacitor support 201 not only has excellent electric insulating performance, but also can effectively prevent creepage and breakdown risks in high-pressure environments, the light weight characteristic of the capacitor support reduces the overall weight of the module, the high-temperature resistance and ageing resistance of the capacitor support assembly ensure the reliability of long-term operation, the connecting piece 203 and the capacitor fixing piece 204 matched with the capacitor support assembly are made of carbon steel sheet metal materials, the perfect combination of high strength and high precision is realized through a precise stamping forming process, the excellent mechanical performance of the carbon steel material provides stable support fixing for the capacitor element 202, the good electric conduction characteristic of the capacitor support assembly also ensures the reliability of system grounding, the optimal combination of the insulating material and the metal material not only meets the safety requirement of electric isolation, but also ensures the stability of structural support, and the standardized purchasing material reduces the cost, thereby being convenient for quality control in mass production.

Referring to fig. 6, fig. 6 is a schematic structural diagram of a dc supporting capacitor assembly in a single H-bridge module according to an embodiment of the application. Referring to fig. 1 and 2, in the case of the single H-bridge module without bypass structure 10 and the single H-bridge module with bypass structure 20, the dc current carrying laminated busbar assembly 3 includes a first dc positive maximum parallel busbar 301, a first parallel insulating barrier film 302, a first dc negative maximum parallel busbar 303, a dc positive collecting busbar 304, a collecting insulating barrier film 305, a dc negative collecting busbar 306, a dc support capacitor assembly positive connecting busbar 307, and a dc support capacitor assembly negative connecting busbar 308. The first parallel insulating isolation film 302 is disposed between the first dc positive large parallel busbar 301 and the first dc negative large parallel busbar 303, and isolates the first dc positive large parallel busbar 301 and the first dc negative large parallel busbar 303. In this embodiment, the dc negative electrode collection busbar 306, the collection insulating separator 305, and the positive electrode dc collection busbar 304 are all two. A direct current negative electrode collecting busbar 306, a collecting insulating isolation film 305 and a positive direct current collecting busbar 304 are arranged on the left side of the first direct current negative electrode large parallel busbar 303 from top to bottom, and another direct current negative electrode collecting busbar 306, another collecting insulating isolation film 305 and another positive direct current collecting busbar 304 are arranged on the right side of the first direct current negative electrode large parallel busbar 303 from bottom to top. The direct current negative electrode collecting busbar 306 is arranged on the first direct current negative electrode large parallel busbar 303, the collecting insulating isolation film 305 is arranged on the direct current negative electrode collecting busbar 306 and isolates the direct current positive electrode collecting busbar 304 and the direct current negative electrode collecting busbar 306, and the direct current positive electrode collecting busbar 304 is arranged on the collecting insulating isolation film 305. In this embodiment, the dc supporting capacitor assembly positive electrode connection busbar 307 and the dc supporting capacitor assembly negative electrode connection busbar 308 are both set to 2. The positive electrode connection busbar 307 of the two direct current support capacitor components and the negative electrode connection busbar 308 of the two direct current support capacitor components are symmetrically arranged on the left side and the right side of the first direct current negative electrode large parallel busbar 303 and are connected with the direct current support capacitor component 2.

In some embodiments of the present application, the first dc negative electrode maximum parallel busbar 303 is provided with a first hole 309 and a second hole 310. The first holes 309 and the second holes 310 are several, and the capacitor assembly 9 is connected to the dc-current carrying laminated busbar assembly 3 through the first holes 309 and the second holes 310. The open hole layout not only optimizes the current distribution path and reduces the line impedance, but also remarkably improves the electrical reliability of the system through a multipoint connection mode. The symmetrical arrangement design of the first holes 309 and the second holes 310 ensures the current equalizing effect between the capacitor assembly 9 and the busbar, effectively avoids the local overheating phenomenon, and meanwhile, the modularized connecting interface greatly simplifies the assembly process and improves the production efficiency.

In some embodiments of the present application, the first parallel insulating barrier film 302 and the collecting insulating barrier film 305 are made of fireproof polypropylene insulating paper. The fireproof polypropylene insulating paper has excellent electrical insulating performance, and the special flame retardant property can prevent fire from spreading under abnormal conditions, so that the running safety of equipment is obviously improved. The material has good mechanical strength and temperature resistance, can keep stable insulation property in long-term operation, and avoids insulation failure caused by material aging. Meanwhile, the light and thin characteristics of the polypropylene material enable the isolating film to be stacked in multiple layers in a limited space, and support is provided for compact design of the direct current carrying laminated busbar assembly 3.

In some embodiments of the present application, the first dc positive electrode large parallel busbar 301, the first dc negative electrode large parallel busbar 303, the dc positive electrode collecting busbar 304, the dc negative electrode collecting busbar 306, the dc support capacitor element positive electrode connecting busbar 307, and the dc support capacitor element negative electrode connecting busbar 308 are made of copper or aluminum, the copper mark is red copper, and the aluminum mark is 1 series. The red copper material can ensure the stable operation of each component under the working condition of long-term heavy current by virtue of the excellent conductivity and corrosion resistance, and the 1-series aluminum alloy realizes the light weight design and reduces the overall weight of the module while ensuring the good conductivity. Both materials have excellent ductility and processability, facilitating the fabrication of complex shaped structures by precision stamping processes.

In the single H-bridge module structure, the dc current carrying laminated busbar assembly 3 adopts a bulk lamination design, and reliable positive and negative isolation is achieved by laminating the first dc positive electrode large parallel busbar 301, the first dc negative electrode large parallel busbar 303, the dc positive electrode collecting busbar 304 and the dc negative electrode collecting busbar 306 and matching the first parallel insulating isolation film 302 and the collecting insulating isolation film 305. In addition, the symmetrical arrangement and standardized interface design of the positive electrode connection busbar 307 of the direct-current support capacitor assembly and the negative electrode connection busbar 308 of the direct-current support capacitor assembly not only ensures the efficient connection with the direct-current support capacitor assembly 2, but also realizes the interchangeability of parts among different configuration modules. The whole direct current carrying laminated busbar assembly 3 realizes perfect balance of high current bearing capacity and safety isolation in a compact space through the optimized combination of a copper/aluminum conductor and a fireproof insulating material formed by precise stamping, and provides a high-efficiency and reliable electric connection solution for SVG power modules.

Referring to fig. 7, fig. 7 is a schematic structural diagram of a dc supporting capacitor assembly in a dual H-bridge module according to an embodiment of the application. Referring to fig. 3, in the dual H-bridge module without bypass structure 30, the dc current carrying laminated busbar assembly 3 includes two second dc positive large parallel busbars 1001, two second parallel insulating spacers 1002, two second dc negative large parallel busbars 1003, two dc negative collecting busbars 306, two collecting insulating spacers 305, two positive dc collecting busbars 304, four dc supporting capacitor assembly positive connecting busbars 307, and four dc supporting capacitor assembly negative connecting busbars 308. The second parallel insulating isolation film 1002 is disposed between the second direct current positive electrode large parallel busbar 1001 and the second direct current negative electrode large parallel busbar 1003, and isolates the second direct current positive electrode large parallel busbar 1001 and the second direct current negative electrode large parallel busbar 1003, the two direct current negative electrode collecting busbars 306 are respectively disposed on the two groups of second direct current negative electrode large parallel busbars 1003, the two collecting insulating isolation films 305 are respectively disposed on the two groups of direct current negative electrode collecting busbars 306, the collecting insulating isolation films 305 are used for isolating the direct current positive electrode collecting busbars 304 and the direct current negative electrode collecting busbars 306, and the two direct current positive electrode collecting busbars 304 are respectively disposed on the collecting insulating isolation films 305. Two direct current support capacitor assembly positive electrode connection busbar 307 and two direct current support capacitor assembly negative electrode connection busbar 308 are arranged on one second direct current negative electrode large parallel busbar 1003, and the other two direct current support capacitor assembly positive electrode connection busbar 307 and the other two direct current support capacitor assembly negative electrode connection busbar 308 are arranged on the other second direct current negative electrode large parallel busbar 1003. The positive electrode connection busbar 307 of the direct current support capacitor assembly and the negative electrode connection busbar 308 of the direct current support capacitor assembly are arranged on the side edge of the second direct current negative electrode large parallel busbar 1003 at intervals.

The application provides a highly optimized electrical connection solution for single H-bridge and double H-bridge structures through the design of the direct current carrying laminated busbar assembly 3 which is overlapped in bulk. In the single H bridge structure, a double-layer busbar stacking design with symmetrical arrangement is adopted, reliable positive and negative electrode isolation is realized through the first parallel insulating isolation film 302 and the collecting insulating isolation film 305, meanwhile, symmetrical direct current support capacitors are used for connecting busbar to ensure current balance distribution, and in the double H bridge structure, two groups of independent busbar systems with the same structure are adopted, and the requirement of higher power level is met through multiplying the number of connecting points. The modular design concept ensures that bus-bar assemblies with different topological structures keep highly consistent interface standards, so that the universal interchangeability of parts is ensured, and the line impedance and the heat loss are reduced through the optimized current path design. Particularly, the design of the expandable busbar system not only simplifies the production process, reduces the manufacturing cost, but also provides convenience for field maintenance, and when the system capacity needs to be adjusted, only the number of modules needs to be correspondingly increased or decreased, and the design scheme fully considers the differentiated requirements of SVG equipment with different power levels on electrical performance, space utilization rate and economy.

In some embodiments of the present application, two sets of second dc negative electrode maximum parallel busbar 1003 are respectively provided with a first hole 309 and a second hole 310. The first holes 309 and the second holes 310 are several, and the capacitor assembly 9 is connected to the dc-current carrying laminated busbar assembly 3 through the first holes 309 and the second holes 310. The open hole layout not only optimizes the current distribution path and reduces the line impedance, but also remarkably improves the electrical reliability of the system through a multipoint connection mode. The symmetrical arrangement design of the first holes 309 and the second holes 310 ensures the current equalizing effect between the capacitor assembly 9 and the busbar, effectively avoids the local overheating phenomenon, and meanwhile, the modularized connecting interface greatly simplifies the assembly process and improves the production efficiency.

In some embodiments of the present application, the second parallel insulating isolation film 1002 and the collecting insulating isolation film 305 are made of fireproof polypropylene insulating paper. The fireproof polypropylene insulating paper has excellent electrical insulating performance, and the special flame retardant property can prevent fire from spreading under abnormal conditions, so that the running safety of equipment is obviously improved. The material has good mechanical strength and temperature resistance, can keep stable insulation property in long-term operation, and avoids insulation failure caused by material aging. Meanwhile, the light and thin characteristics of the polypropylene material enable the isolating film to be stacked in multiple layers in a limited space, and support is provided for compact design of the direct current carrying laminated busbar assembly 3.

In some embodiments of the present application, the second dc positive large parallel busbar 1001, the second dc negative large parallel busbar 1003, the dc positive collecting busbar 304, the dc negative collecting busbar 306, the dc supporting capacitor element positive connecting busbar 307 and the dc supporting capacitor element negative connecting busbar 308 are made of copper or aluminum, the copper mark is red copper, and the aluminum mark is 1 series. The red copper material can ensure the stable operation of each component under the working condition of long-term heavy current by virtue of the excellent conductivity and corrosion resistance, and the 1-series aluminum alloy realizes the light weight design and reduces the overall weight of the module while ensuring the good conductivity. Both materials have excellent ductility and processability, facilitating the fabrication of complex shaped structures by precision stamping processes.

Referring to fig. 8, fig. 8 is a schematic structural diagram of an ac current carrying busbar assembly according to an embodiment of the present application. The ac current carrying busbar assembly 4 comprises an ac current carrying busbar input 401 and an ac current carrying busbar output 402. The ac current bus input 401 and the ac current bus output 402 are identical in structure and are interchangeably mountable. In some embodiments of the present application, the ac current carrying busbar input 401 and the ac current carrying busbar output 402 are made of copper or aluminum, the copper brand is red copper, and the aluminum brand is 1 series.

When the module only comprises a single H bridge, all the capacitor devices (the capacitor assembly 9 and the direct current supporting capacitor assembly 2) are connected in parallel at the direct current end (the direct current carrying laminated busbar assembly 3) of the single H bridge, so that the system current of the single H bridge is larger and the power is higher, and when the module comprises two H bridges (the two H bridges are connected in series), one half of the capacitor devices (the capacitor assembly 9 and the direct current supporting capacitor assembly 2) are connected in parallel at the direct current end (the direct current carrying laminated busbar assembly) of the single H bridge, so that the system current of the single H bridge is smaller and the power is lower. In the single H-bridge module, the system current is large and limited by the current carrying capacity of the aluminum material with unit section, so that the size of the alternating current carrying busbar assembly 4 is large, and in the double H-bridge module, the system current is small and the size of the alternating current carrying busbar assembly 4 is small.

The alternating current busbar assembly 4 adopts a standardized design concept, and the input end 401 and the output end 402 of the alternating current busbar assembly have identical structures and dimension specifications, so that bidirectional interchangeable installation is realized. The symmetrical design not only simplifies the production and manufacturing flow and reduces the management cost of parts, but also provides great flexibility in the actual installation and maintenance process. By adopting the high-conductivity red copper or 1 series aluminum alloy material and matching with a precision machining process, the reliability and durability of the alternating current busbar assembly 4 under the working condition of long-term heavy current can be ensured. The interchangeable structural design remarkably improves the assembly efficiency, shortens the field installation time, simultaneously provides convenience for component replacement in later maintenance, fully embodies the advantages of modular design, and ensures the SVG power module to have engineering practicability while ensuring the performance.

Referring to fig. 9, fig. 9 is a schematic structural diagram of a panel assembly according to an embodiment of the application. The panel assembly 5 includes a panel 501 and a dc test terminal 502. The panel 501 is used for sealing the front end surface of the upper space 107, and a first notch 503 is provided on the panel 501, where the first notch 503 is used for extending the ac current bus bar assembly 4 from the main frame 101 of the module structure. The dc test terminal 502 is disposed on the panel 501 for connecting to an external dc circuit. The extensible direct current test terminals 502 configured on the panel 501 adopt a modularized design thought, and can flexibly adjust the quantity and layout according to actual electrical requirements, thereby not only meeting test requirements in different application scenes, but also maintaining the overall coordination of the appearance.

Inside the static var generator power module, a direct current test terminal 502 is connected with a direct current positive electrode large parallel busbar 301 and a direct current negative electrode large parallel busbar 303 of the direct current carrying laminated busbar assembly 3 through cables, wherein a DC ⁺ of the direct current test terminal 502 is connected with the direct current positive electrode large parallel busbar 301, and a DC ^- of the direct current test terminal 502 is connected with the direct current negative electrode large parallel busbar 303. Since the dc current carrying laminated busbar assembly 3 is connected to the module control board 701, power supply and performance testing on the module control side can be satisfied.

In some embodiments of the present application, the panel 501 is made of high temperature plastic, and can be used for silk-screen printing of brand marks, module types, and connection terminal marks of the module control board 701.

Referring to fig. 10, fig. 10 is a schematic structural diagram of a liquid-cooled power module assembly according to an embodiment of the application. The liquid cooling power module assembly 6 comprises a liquid cooling heat dissipation plate 601, a patch type discharge resistor 602, a power module driving plate 603, a liquid cooling power module 604 and an alternating current busbar auxiliary support 605. The surface mounted discharge resistor 602 and the power module driving plate 603 are both arranged on the liquid cooling heat dissipation plate 601, the liquid cooling power module 604 is arranged on the power module driving plate 603, and the alternating current busbar auxiliary support 605 is arranged on the side surface of the liquid cooling heat dissipation plate 601 and is used for being connected with the alternating current busbar assembly 4.

According to some embodiments of the present application, a circulation flow channel is disposed in the liquid cooling heat dissipation plate 601, heat is conducted in a metal compression manner, a heat conducting material is coated between the liquid cooling heat dissipation plate 601 and the liquid cooling power module 604 and the chip discharging resistor 602, and the liquid cooling heat dissipation plate 601 is used for cooling the liquid cooling power module 604 and the chip discharging resistor 602.

According to some embodiments of the present application, the heat conductive material coated between the liquid cooling plate 601 and the liquid cooling power module 604 and the chip discharging resistor 602 is heat conductive silicone grease.

According to some embodiments of the application, the liquid cooling plate 601 is made of aluminum alloy, and the brand is 6 series. The liquid cooling plate 601 is made of aluminum alloy, and internally comprises a closed liquid flow channel, and the heat of the radiator body is taken away by carrying out inflow and outflow circulation of low-temperature liquid. The mounting planes of the liquid-cooled power module 604 and the patch-type discharge resistor 602 are closely attached to the outer surface of the liquid-cooled heat dissipation plate 601, and heat of the liquid-cooled power module 604 and the patch-type discharge resistor 602 is indirectly taken away through contact heat transfer (coating heat-conducting silicone grease to increase heat transfer efficiency), so that temperature control of the liquid-cooled power module 604 and the patch-type discharge resistor 602 is realized.

According to some embodiments of the present application, the ac current carrying busbar auxiliary support 605 is made of an insulating material, and is made of SMC or FR4, and is used for assisting in fixing the ac current carrying busbar assembly 4, so as to enhance the lap reliability of the ac current carrying busbar assembly 4 and the liquid cooled power module 604. The direct current carrying laminated busbar assembly 3 is connected with the direct current supporting capacitor assembly 2, the capacitor assembly 9 and the liquid cooling power module assembly 6, the capacitor devices (the direct current supporting capacitor assembly 2 and the capacitor assembly 9) are connected in parallel through the direct current carrying laminated busbar assembly 3, and the merging terminals after being connected in parallel are connected to the direct current end of the liquid cooling power module 604 of the liquid cooling power module assembly 6, so that the connection between the capacitor devices and the liquid cooling power module 604 is completed.

The liquid cooling power module assembly 6 is used as a core component of the SVG power module, and the combination of efficient heat dissipation and stable operation is realized through a highly integrated design. The liquid cooling heat dissipation plate 601 made of aluminum alloy is internally provided with a circulating runner, and is matched with the application of heat conduction silicone grease, so that excellent heat dissipation performance is provided for the power module 604 and the patch type discharge resistor 602, the space utilization rate is optimized by vertical stacking arrangement of the power module driving plate 603 and the liquid cooling power module 604, and the alternating current bus auxiliary support 605 is made of SMC or FR4 insulating materials, so that the mechanical strength connected with the alternating current bus assembly 4 is ensured, and reliable electrical isolation is provided. The compact and efficient design not only meets the heat dissipation requirements at high power densities, but also simplifies the assembly process by modular layout.

Referring to fig. 11, fig. 11 is a schematic structural diagram of a module control board assembly according to an embodiment of the application. The module control board assembly 7 includes a module control board 701. According to some embodiments of the application, the module control board assembly 7 is connected to the dc current carrying laminated busbar assembly 3 using a high voltage tolerant cable for power extraction. The module control board assembly 7 is in optical fiber communication with an external control device. The module control board assembly 7 is used as a control part of the SVG power module, and the design of the module control board assembly fully considers the requirements of high-voltage isolation and interference resistance. The module control board 701 realizes safe and reliable power connection with the direct current carrying laminated busbar assembly 3 through a special high voltage resistant cable, ensures stable power supply of a control system, and simultaneously adopts an optical fiber communication technology to realize data interaction with an external control device. The design combining high-voltage isolation and optical fiber communication ensures that the module control board assembly 7 can maintain accurate control performance in a complex electromagnetic environment, and provides solid technical guarantee for intelligent operation of SVG power modules.

Referring to fig. 12, fig. 12 is a schematic structural diagram of a bypass switch assembly according to an embodiment of the application. The bypass switch assembly 8 includes a bypass switch element 801, a bypass switch mounting plate 802, a bypass switch ac outlet line 803, and a bypass switch ac inlet line 804. The bypass switch component 801 is arranged on a bypass switch mounting plate 802, the bypass switch mounting plate 802 is used for providing mechanical support, and a bypass switch alternating current incoming line row 804 and a bypass switch alternating current outgoing line row 803 are arranged on the bypass switch component 801.

According to some embodiments of the application, the bypass switch assembly 8 is connected in parallel between the input 401 and the output 402 of the modular ac current carrying busbar assembly 4. The bypass switch alternating current outlet line 803 and the bypass switch alternating current inlet line 804 are flexibly adjusted according to the actual assembly process of the whole module, so that the electric connection of the main loop of the bypass switch is completed.

In some embodiments of the present application, the bypass switch assembly 8 is bolted in parallel between the input 401 and output 402 of the modular ac current carrying busbar assembly 4.

According to some embodiments of the present application, the bypass switch element 801 is mounted to the bypass switch mounting plate 802 by screws, and the bypass switch mounting plate 802 is a carbon steel sheet metal bending blanking part. The bypass switch ac outlet 803 and the bypass switch ac inlet 804 are made of aluminum materials, and the brand number is 1 series.

According to the application, the embedded structural design is carried out on the physical bypass switch of the SVG power module, so that common problems of oversized power cabinet or consumption of maintenance space, overlong bypass driving path and the like caused by the external bypass switch are solved, and meanwhile, the embedded bypass switch forms closed metal protection on the bypass switch body and the driving part thereof, so that the malfunction risk of the bypass switch caused by electromagnetic environment interference is solved to a great extent.

In the operation process of the module, the dynamic rectification inversion process of the power loop can generate variable induced electromotive force on the metal frame, and the variable induced electromotive force can interfere with a weak current control system. Aiming at the electromagnetic compatibility problem, the scheme adopts a differential potential control strategy that for a single H-bridge module, the potential of the chassis structure component 1 is locked at the negative terminal of the capacitor element 202 through an equipotential line, and for a double H-bridge module, a cascade common point is selected as a potential reference point. The potential control method effectively inhibits the interference of the frame induced potential on the control system, ensures that electromagnetic energy of the power loop cannot be coupled to the control loop, maintains potential balance of all parts of the system, and improves the operation stability and anti-interference capability of the module under a complex electromagnetic environment.

The application also provides a static var generator comprising a single H-bridge module without bypass structure 10.

The application also provides a static var generator comprising a single H-bridge module including a bypass structure 20.

The present application also provides a static var generator comprising a dual H-bridge module without bypass structure 30.

The present application provides three typically configured static var generator solutions through a modular design concept, a basic type based on a single H-bridge without bypass structure 10, a safety enhanced type with a single H-bridge with bypass structure 20 integrating the bypass function, and a high power type with a double H-bridge without bypass structure 30. The serial product design fully considers the differentiated requirements of different application scenes on the power grade and the functional completeness, and all models adopt unified standardized interfaces and interchangeable structural designs, so that the flexibility of product configuration is ensured, the generalization of core parts is realized, a full-series solution from basic to high-end and from simple to complete is provided for reactive compensation of the power system, and the market adaptability and the economical efficiency of the product are improved.

The application also provides a static var generator valve group which comprises a plurality of mutually connected static var generators. Each static var generator is connected with each other through an alternating current carrying busbar assembly 4, wherein an alternating current carrying busbar input end 401 is connected with the output end of the previous static var generator, and an alternating current carrying busbar output end 402 is connected with the input end of the next static var generator, so that the mutual connection of a plurality of static var generators is realized. Each static var generator is based on a unified power module architecture, supports single H bridge or double H bridge configuration, and can selectively integrate bypass functions, so that application scenes of different voltage levels and power requirements are met. In addition, the modularized characteristic of the valve group enables maintenance and upgrading to be more convenient, the fault of a single static var generator does not influence the operation of the whole system, and the reliability and the usability of equipment are remarkably improved. The bypass switch assembly 8 is connected in parallel between the input end 401 and the output end 402 of the module alternating current busbar assembly 4, when a single static var generator fails, the system closes related functions of the body through a control strategy, and the fault position is guaranteed not to be broken in series through the bypass switch mode, so that uninterrupted operation of the system is realized. The design is not only suitable for industrial power systems, but also can be widely applied to the fields of new energy power generation, rail transit and the like, and provides a high-efficiency and flexible solution for reactive compensation and power quality optimization of a power grid.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.

Claims

1. A static VAR generator power module, characterized in that the static VAR generator power module comprises:

A module chassis structure assembly (1) is used to assemble various components of the static VAR generator power module, wherein the module chassis structure assembly (1) includes:

Module structure main frame (101);

A module DC capacitor bin support plate (103) is provided on the rear end face of the module structure main frame (101) and is used to close the rear end face of the module structure main frame (101);

A liquid cooling power module assembly mounting plate (104) is horizontally arranged in the front half of the module structure main frame (101) to divide the front half of the module structure main frame (101) into an upper space (107) and a lower space (108);

Module control board mounting trays (105) are vertically arranged on both sides of the upper space (107);

A liquid cooling system top fixing plate (106) is arranged on the top of the inner side of the upper space (107) and on the liquid cooling power module assembly mounting plate (104);

A DC support capacitor assembly (2) is disposed in the lower space (108);

A DC current-carrying laminated busbar assembly (3) is arranged in the module structure main frame (101) and is connected to the DC support capacitor assembly (2);

An AC current-carrying busbar assembly (4) is extended and arranged on the module structure main frame (101);

A liquid-cooled power module assembly (6) is arranged on the liquid-cooling system top fixing plate (106); the liquid-cooled power module assembly mounting plate (104) is used to carry the liquid-cooled power module assembly (6) and is connected to the DC current-carrying laminated busbar assembly (3) and the AC current-carrying busbar assembly (4);

A module control board assembly (7) is arranged on the module control board mounting tray (105) and is connected to the DC current-carrying laminated busbar assembly (3).

2. The static VAR generator power module according to claim 1, further comprising:

Electromagnetic shielding plates (102) are arranged on the left and right sides of the module structure main frame (101), and the electromagnetic shielding plates (102) are used to electromagnetically shield the module control board assembly (7);

A panel assembly (5) is connected to the module chassis structure assembly (1) and is used to close the front end surface of the upper space (107); wherein the panel assembly (5) includes:

A panel (501), the panel (501) being used to close the front end surface of the upper space (107), the panel (501) being provided with a first notch (503), the first notch (503) being used for the AC current-carrying busbar assembly (4) to extend out from the module structure main frame (101);

A DC test terminal (502), provided on the panel (501), for connecting to an external DC circuit;

A capacitor assembly (9) is arranged on the module DC capacitor compartment support plate (103), and the capacitor assembly (9) is in the form of a plurality of capacitor assemblies connected to the DC current-carrying laminated busbar assembly (3).

3. The static VAR generator power module according to claim 2, characterized in that the static VAR generator power module further comprises:

A bypass switch assembly (8) is embedded above the DC support capacitor assembly (2) and connected to the AC current-carrying busbar assembly (4); wherein the bypass switch assembly (8) comprises:

A bypass switch mounting plate (802) for providing mechanical support;

A bypass switch component (801) is arranged on the bypass switch mounting plate (802);

Bypass switch AC outlet bus (803);

A bypass switch AC incoming line row (804), wherein the bypass switch AC incoming line row (804) and the bypass switch AC outgoing line row (803) are both arranged on the bypass switch component (801).

4. The static VAR generator power module according to claim 2, characterized in that the module control board assembly (7) is provided as one, the DC support capacitor assembly (2), the DC current-carrying laminated busbar assembly (3), the AC current-carrying busbar assembly (4), the panel assembly (5), the liquid-cooled power module assembly (6), the module control board assembly (7), and the capacitor assembly (9) are all provided in the module chassis structure assembly (1), wherein:

The DC support capacitor assembly (2), the panel assembly (5), the liquid-cooled power module assembly (6), the module control board assembly (7) and the capacitor assembly (9) are all connected to the DC current-carrying laminated busbar assembly (3), and the liquid-cooled power module assembly (6) is also connected to the AC current-carrying busbar assembly (4) to form a single H-bridge module without a bypass structure (10).

5. The static VAR generator power module according to claim 3, characterized in that the module control board assembly (7) is provided as one, the DC support capacitor assembly (2), the DC current-carrying laminated busbar assembly (3), the AC current-carrying busbar assembly (4), the panel assembly (5), the liquid-cooled power module assembly (6), the module control board assembly (7), the bypass switch assembly (8), and the capacitor assembly (9) are all provided in the module chassis structure assembly (1), wherein:

The DC support capacitor assembly (2), the panel assembly (5), the liquid-cooled power module assembly (6), the module control board assembly (7) and the capacitor assembly (9) are all connected to the DC current-carrying laminated busbar assembly (3), the liquid-cooled power module assembly (6) is also connected to the AC current-carrying busbar assembly (4), and the bypass switch assembly (8) is connected to the AC current-carrying busbar assembly (4) to form a single H-bridge module with a bypass structure (20).

6. The static VAR generator power module according to claim 2, characterized in that the module control board assembly (7) is provided in two, the DC support capacitor assembly (2), the DC current-carrying laminated busbar assembly (3), the AC current-carrying busbar assembly (4), the panel assembly (5), the liquid-cooled power module assembly (6), the two module control board assemblies (7), and the capacitor assembly (9) are all provided in the module chassis structure assembly (1), wherein:

The DC support capacitor assembly (2), the panel assembly (5), the liquid-cooled power module assembly (6), the module control board assembly (7) and the capacitor assembly (9) are all connected to the DC current-carrying laminated busbar assembly (3), and the liquid-cooled power module assembly (6) is also connected to the AC current-carrying busbar assembly (4) to form a double H-bridge module without a bypass structure (30).

7. The static VAR generator power module according to claim 5, characterized in that the DC link capacitor component (2) comprises:

Capacitor support (201);

A capacitor fixing member (204) is spaced apart from the capacitor supporting member (201);

A connecting member (203) is used to connect the capacitor support member (201) and the capacitor fixing member (204), so that the capacitor support member (201) and the capacitor fixing member (204) form a frame structure;

Two capacitor elements (202) are arranged in the frame structure.

8. The static VAR generator power module according to claim 4 or 6, characterized in that the DC link capacitor component (2) comprises:

Capacitor support (201);

A capacitor fixing member (204) is arranged opposite to the capacitor supporting member (201);

Four capacitor elements (202) are arranged in the frame structure.

9. The static VAR generator power module according to claim 4 or 5, characterized in that the DC current-carrying laminated busbar assembly (3) comprises:

A first DC positive parallel busbar (301);

The first DC negative pole is connected in parallel to the busbar (303);

A first parallel insulating isolation membrane (302) is provided between the first DC positive parallel busbar (301) and the first DC negative parallel busbar (303), and isolates the first DC positive parallel busbar (301) and the first DC negative parallel busbar (303);

Two DC negative electrode collecting busbars (306), two collecting insulating isolation membranes (305) and two positive DC collecting busbars (304), wherein:

On the left side of the first DC negative parallel busbar (303), there are provided, from top to bottom, a DC negative collecting busbar (306), a collecting insulating isolation membrane (305), and a positive DC collecting busbar (304); on the right side of the first DC negative parallel busbar (303), there are provided, from bottom to top, another DC negative collecting busbar (306), another collecting insulating isolation membrane 305, and another positive DC collecting busbar (304);

The DC negative electrode collection busbar (306) is arranged on the first DC negative electrode parallel busbar (303); the collection insulation isolation membrane (305) is arranged on the DC negative electrode collection busbar (306) and isolates the DC positive electrode collection busbar (304) and the DC negative electrode collection busbar (306); the DC positive electrode collection busbar (304) is arranged on the collection insulation isolation membrane (305);

The positive electrodes of the two DC support capacitor assemblies are connected to the busbar (307);

Two DC support capacitor components negative electrode connection busbars (308), the two DC support capacitor components positive electrode connection busbars (307) and the two DC support capacitor components negative electrode connection busbars (308) are symmetrically arranged on the left and right sides of the first DC negative parallel busbar (303) for connection to the DC support capacitor components (2);

The first parallel insulating isolation membrane (302) and the collecting insulating isolation membrane (305) are made of fireproof polypropylene insulating paper;

The first DC positive parallel busbar (301), the first DC negative parallel busbar (303), the DC positive collecting busbar (304), the DC negative collecting busbar (306), the DC support capacitor assembly positive connecting busbar (307), and the DC support capacitor assembly negative connecting busbar (308) are made of copper or aluminum.

10. The static VAR generator power module according to claim 6, characterized in that the DC current-carrying laminated busbar assembly (3) comprises:

Two second DC positive poles connected in parallel (1001);

Two second DC negative poles are connected in parallel to the busbar (1003);

Two second parallel insulating isolation membranes (1002), the second parallel insulating isolation membranes (1002) being arranged between the second DC positive parallel busbar (1001) and the second DC negative parallel busbar (1003), and isolating the second DC positive parallel busbar (1001) and the second DC negative parallel busbar (1003);

The two DC negative electrode collecting busbars (306) are respectively arranged on the two second DC negative electrode parallel busbars (1003); the two collecting insulating isolation membranes (305) are respectively arranged on the two groups of DC negative electrode collecting busbars (306), and the collecting insulating isolation membranes (305) are used to isolate the DC positive electrode collecting busbar (304) and the DC negative electrode collecting busbar (306); the two DC positive electrode collecting busbars (304) are respectively arranged on the collecting insulating isolation membranes (305);

The positive electrodes of the four DC support capacitor assemblies are connected to the busbar (307);

The negative poles of the four DC support capacitor assemblies are connected to a busbar (308), wherein:

Two of the DC support capacitor assembly positive electrode connection busbars (307) and two of the DC support capacitor assembly negative electrode connection busbars (308) are arranged on one of the second DC negative super parallel busbars (1003); the other two of the DC support capacitor assembly positive electrode connection busbars (307) and the other two of the DC support capacitor assembly negative electrode connection busbars (308) are arranged on another of the second DC negative super parallel busbars (1003); the DC support capacitor assembly positive electrode connection busbars (307) and the DC support capacitor assembly negative electrode connection busbars (308) are arranged at intervals on the sides of the second DC negative super parallel busbars (1003).

11. The static VAR generator power module according to claim 1, characterized in that the AC current-carrying busbar assembly (4) comprises:

AC current carrying busbar input terminal (401);

The AC current-carrying busbar output end (402) has the same structure as the AC current-carrying busbar input end (401) and the AC current-carrying busbar output end (402).

12. The static VAR generator power module according to claim 1, characterized in that the liquid-cooled power module assembly (6) comprises:

Liquid cooling heat sink (601);

A chip-type discharge resistor (602) is arranged on the liquid-cooled heat sink (601);

A power module driving board (603) is arranged on the liquid-cooling heat sink (601);

A liquid-cooled power module (604) is arranged on the power module driving board (603);

An AC current-carrying busbar auxiliary support member (605) is provided on the side of the liquid-cooling heat sink (601) and is used to be connected to the AC current-carrying busbar assembly (4);

A circulation channel is provided in the liquid-cooled heat sink (601), and a heat-conducting material is coated between the liquid-cooled heat sink (601), the liquid-cooled power module (604), and the chip-type discharge resistor (602). The liquid-cooled heat sink (601) is used to cool the liquid-cooled power module (604) and the chip-type discharge resistor (602).