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CN1324448C - Capacitive touch panel using thin film and manufacturing method thereof - Google Patents

Capacitive touch panel using thin film and manufacturing method thereof Download PDF

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Publication number
CN1324448C
CN1324448C CNB2004100703338A CN200410070333A CN1324448C CN 1324448 C CN1324448 C CN 1324448C CN B2004100703338 A CNB2004100703338 A CN B2004100703338A CN 200410070333 A CN200410070333 A CN 200410070333A CN 1324448 C CN1324448 C CN 1324448C
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capacitive touch
conductive material
insulation course
touch control
control plate
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CN1728071A (en
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邱延诚
简永烈
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Elan Microelectronics Corp
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Elan Microelectronics Corp
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Abstract

A capacitive touch control panel using a film comprises a film layer and a printed circuit board which are combined together, wherein the traces of the film layer in two directions are provided, the printed circuit board is provided with a base material, a first conductor layer and a second conductor layer are respectively arranged on the upper part and the lower part of the base material, the first conductor layer is provided with a joint, a guide hole is arranged on the first conductor layer to be connected to the second conductor layer, and the joint is connected with the traces in the two directions. The manufacturing method of the capacitive touch panel is that the thin film layer and the printed circuit board are manufactured respectively, and then the thin film layer is printed on the printed circuit board by using conductive adhesive for jointing or using the printed circuit board as a substrate.

Description

使用薄膜的电容式触控板及其制作方法Capacitive touch panel using thin film and manufacturing method thereof

技术领域technical field

本发明有关一种电容式触控板及其制作方法，特别是关于一种使用薄膜的电容式触控板及其制作方法。The invention relates to a capacitive touch panel and a manufacturing method thereof, in particular to a capacitive touch panel using a thin film and a manufacturing method thereof.

背景技术Background technique

触控板已经被广泛地应用在电子产品上。已知的触控板有电阻式、电磁式及电容式三种，电容式触控板的工作原理是利用使用者的手指或导体接触到触控板的瞬间产生一个电容效应，因而可由电容值的变化确定手指或导体的位置。传统的电容式触控板是以四层的印刷电路板(PCB)为架构，其四层架构为一接地层、一X轴线迹(X trace)、一Y轴线迹(Y trace)及一电路层，然而以四层的印刷电路板为架构的电容式触控板，制作成本高。Touch panels have been widely used in electronic products. There are three types of known touch panels: resistive, electromagnetic and capacitive. The working principle of the capacitive touch panel is to use the moment when the user's finger or conductor touches the touch panel to generate a capacitive effect. The change determines the position of the finger or conductor. The traditional capacitive touch panel is based on a four-layer printed circuit board (PCB). The four-layer structure is a ground layer, an X-axis trace (X trace), a Y-axis trace (Y trace) and a circuit layer, but the capacitive touch panel based on the four-layer printed circuit board has high manufacturing cost.

为了降低制作成本，以二层的印刷电路板为架构的电容式触控板被提出，然而其电气特性较四层的印刷电路板为架构的电容式触控板差，因此，在产业上的利用上不高。In order to reduce the production cost, a capacitive touch panel based on a two-layer printed circuit board is proposed, but its electrical characteristics are worse than those based on a four-layer printed circuit board. Use is not high.

另一方面，传统的电容式触控板的介电材质不透光，限制其应用于其它领域的发展。因此，本发明提出一种使用薄膜的电容式触控板及其制作方法，以降低触控板的制作成本，且可扩展其应用。On the other hand, the dielectric material of the traditional capacitive touch panel is opaque, which limits its application in other fields. Therefore, the present invention proposes a capacitive touch panel using a thin film and a manufacturing method thereof, so as to reduce the manufacturing cost of the touch panel and expand its application.

发明内容Contents of the invention

本发明的目的之一，在于提出一种使用薄膜的电容式触控板及其制作方法，以降低成本。One of the objectives of the present invention is to provide a capacitive touch panel using a thin film and a manufacturing method thereof, so as to reduce costs.

本发明的目的之一，在于提出一种使用薄膜的电容式触控板及其制作方法，使电容式触控板透明化。One of the objectives of the present invention is to provide a capacitive touch panel using a thin film and a manufacturing method thereof, so as to make the capacitive touch panel transparent.

本发明提供一种使用薄膜的电容式触控板，包括：一薄膜层，具有第一绝缘层、第二绝缘层、第三绝缘层、包含Y轴线迹的第一导电材料层及包含X轴线迹的第二导电材料层，该第一导电材料层在该第一绝缘层及第二绝缘层之间，该第二绝缘层在该第一导电材料层及第二导电材料层之间，该第二导电材料层在该第二绝缘层及第三绝缘层之间，该Y轴线迹及X轴线迹分别具有第一线迹接点及第二线迹接点；以及The invention provides a capacitive touch panel using a thin film, comprising: a thin film layer having a first insulating layer, a second insulating layer, a third insulating layer, a first conductive material layer including a Y-axis trace, and a first conductive material layer including an X-axis The second conductive material layer of the trace, the first conductive material layer is between the first insulating layer and the second insulating layer, the second insulating layer is between the first conductive material layer and the second conductive material layer, the a second conductive material layer is between the second insulating layer and the third insulating layer, and the Y-axis trace and the X-axis trace respectively have a first trace contact and a second trace contact; and

一印刷电路板，具有一基板、第一导体层及第二导体层在该基板的两面上，该第一导体层在该第三绝缘层及基板之间，该第一导体层具有接合点与该第一线迹接点及第二线迹接点压合，以及导孔连接至该第二导体层。A printed circuit board has a substrate, a first conductor layer and a second conductor layer on both sides of the substrate, the first conductor layer is between the third insulating layer and the substrate, and the first conductor layer has joints and The first trace contact and the second trace contact are pressed together, and the via hole is connected to the second conductor layer.

本发明的所提供的另外一种使用薄膜的电容式触控板，包括：Another capacitive touch panel using a thin film provided by the present invention includes:

一薄膜层，具有第一绝缘层及第二绝缘层、包含Y轴线迹的第一导电材料层及包含X轴线迹的第二导电材料层，该第一导电材料层在该第一绝缘层及第二绝缘层之间，该第二绝缘层在该第一导电材料层及第二导电材料层之间；以及A thin film layer has a first insulating layer and a second insulating layer, a first conductive material layer including Y-axis traces, and a second conductive material layer including X-axis traces, the first conductive material layer is on the first insulating layer and between a second insulating layer, the second insulating layer being between the first conductive material layer and the second conductive material layer; and

一印刷电路板，具有一基板、导体层及接合点在该基板的两面上，该接合点在该第二导电材料层及基板之间，该接合点连接该Y轴线迹及X轴线迹，该接合点具有导孔，连接至该导体层。A printed circuit board has a substrate, a conductor layer and joints on both sides of the substrate, the joint is between the second conductive material layer and the substrate, the joint connects the Y-axis trace and the X-axis trace, the The junction has vias connected to the conductor layer.

本发明还提供一种电容式触控板的制作方法，包括下列步骤：The present invention also provides a method for manufacturing a capacitive touch panel, comprising the following steps:

分别制作薄膜层及印刷电路板，该印刷电路板具有一接合点；separately fabricating the film layer and the printed circuit board, the printed circuit board having a joint;

该薄膜层以一绝缘层为基底依序印刷Y轴线迹、第二绝缘层、X轴线迹及第三绝缘层，该第一及第二方向线迹具有第一及第二线迹接点；以及The film layer uses an insulating layer as a base to sequentially print Y-axis traces, a second insulating layer, X-axis traces and a third insulating layer, and the first and second direction traces have first and second trace contacts; and

压合该第一及第二线迹接点及该接合点。Pressing the first and second stitch contacts and the joining point.

一种电容式触控板的制作方法，可采用下列步骤实现：A method for manufacturing a capacitive touch panel can be realized by the following steps:

以一印刷电路板为基底依序印刷Y轴线迹、第一绝缘层及X轴线迹；以及using a printed circuit board as a substrate to sequentially print the Y-axis trace, the first insulating layer and the X-axis trace; and

粘着一第二绝缘层在该X轴线迹。A second insulating layer is adhered to the x-axis trace.

根据本发明，一种电容式触控板将一薄膜层与一印刷电路板结合，该薄膜层具有二方向的线迹，该印刷电路板具有第一及第二导体层在一基材的两面上，该第一导体层具有接合点与该二方向的线迹接合，且具有一导孔以连接第一及第二导体层。该电容式触控板的制作方法分别制作该薄膜层及印刷电路板，再以导电胶接合，或以该印刷电路板为基底，将该薄膜层印刷在该印刷电路板上。According to the present invention, a capacitive touch panel combines a thin film layer with traces in two directions with a printed circuit board having first and second conductor layers on both sides of a substrate Above, the first conductor layer has joints and the two-direction wire trace joints, and has a guide hole for connecting the first and second conductor layers. The manufacturing method of the capacitive touch panel manufactures the thin film layer and the printed circuit board respectively, and then joins them with conductive glue, or uses the printed circuit board as the base, and prints the thin film layer on the printed circuit board.

附图说明Description of drawings

图1为本发明使用薄膜的电容式触控板的第一实施例的结构示意图；Fig. 1 is the structural representation of the first embodiment of the capacitive touch panel using thin film in the present invention;

图2为图1中导电材料层18及22的图形示意图；FIG. 2 is a schematic diagram of conductive material layers 18 and 22 in FIG. 1;

图3为图1中导体层26的图形示意图；FIG. 3 is a schematic diagram of the conductor layer 26 in FIG. 1;

图4为本发明第二实施例的结构示意图；以及FIG. 4 is a schematic structural diagram of a second embodiment of the present invention; and

图5为图4中导电材料层208及212的图形示意图。FIG. 5 is a schematic diagram of the conductive material layers 208 and 212 in FIG. 4 .

图号说明Description of figure number

10        电容式触控板              12        薄膜层10 Capacitive Touch Panel 12 Film Layer

14        印刷电路板                16        绝缘层14 Printed circuit board 16 Insulation layer

18        导电材料层                20        绝缘层18 Conductive material layer 20 Insulation layer

22        导电材料层                24        绝缘层22 Conductive material layer 24 Insulation layer

26        导体层                    28        基材26 Conductor layer 28 Substrate

30        导体层                    50        线迹接点30 Conductor layer 50 Trace contacts

52        线迹接点                  100       接合点52 Trace Contacts 100 Junctions

200       电容式触控板              202       薄膜层200 Capacitive touch panel 202 Film layer

204       印刷电路板                206       绝缘层204 Printed circuit board 206 Insulation layer

208       导电材料层                210       绝缘层208 Conductive material layer 210 Insulation layer

212       导电材料层                214       基材212 Conductive material layer 214 Substrate

216       导体层                    250       接合点216 conductor layer 250 junction

252        导孔252 guide hole

具体实施方式Detailed ways

图1为本发明使用薄膜的电容式触控板10的结构示意图，包括薄膜层12及印刷电路板14，薄膜层12作为模拟感应结构，其包括绝缘层16、导电材料层18、绝缘层20、导电材料层22及绝缘层24，绝缘层16为薄膜层12的基材，可使用具透光性的绝缘材料，例如聚酯(Polyester；PET)薄膜，或不具透光性的绝缘材料，导电材料层18含有Y轴线迹，导电材料层22含有X轴线迹，导电材料层18及22为低阻抗的导电材料，例如银胶，绝缘层20供导电材料层18及20之间的绝缘，绝缘层24介于导电材料层22与印刷电路板14之间，绝缘层20及24使用介电系数为2～4的材料，可使用具透光性的绝缘材料，例如油墨，或不具透光性的绝缘材料。印刷电路板14包括一导体层26、基材28及导体层30，印刷电路板14为双面的印刷电路板，导体层26作为接地，基材28为印刷电路板14的基板，一般而言，其材料以玻璃纤维(FR4)为主，导体层30为制作电路及供放置电路的电子组件，导体层26及30以例如铜箔为材料。Fig. 1 is a structural schematic diagram of a capacitive touch panel 10 using a thin film in the present invention, including a thin film layer 12 and a printed circuit board 14, the thin film layer 12 is used as an analog sensing structure, and it includes an insulating layer 16, a conductive material layer 18, and an insulating layer 20 , conductive material layer 22 and insulating layer 24, insulating layer 16 is the base material of film layer 12, can use the insulating material of tool translucency, such as polyester (Polyester; PET) film, or the insulating material that does not have translucency, The conductive material layer 18 contains Y-axis traces, and the conductive material layer 22 contains X-axis traces. The conductive material layers 18 and 22 are low-impedance conductive materials, such as silver glue, and the insulating layer 20 provides insulation between the conductive material layers 18 and 20. The insulating layer 24 is interposed between the conductive material layer 22 and the printed circuit board 14. The insulating layers 20 and 24 use materials with a dielectric coefficient of 2 to 4, and can use transparent insulating materials, such as ink, or non-transparent materials. permanent insulating material. The printed circuit board 14 includes a conductor layer 26, a substrate 28 and a conductor layer 30. The printed circuit board 14 is a double-sided printed circuit board, the conductor layer 26 is used as a ground, and the substrate 28 is the substrate of the printed circuit board 14. Generally speaking , its material is mainly glass fiber (FR4), the conductor layer 30 is an electronic component for making and placing the circuit, and the conductor layers 26 and 30 are made of copper foil, for example.

图2为图1中导电材料层18及22的图形示意图，以绝缘层16为基底依序印刷导电材料层18及22，导电材料层18作为电容式触控板10的Y轴线迹，其具有线迹接点50，导电材料层22作为电容式触控板10的X轴线迹，其具有线迹接点52，线迹接点50及52与导体层26的接合点连接。FIG. 2 is a schematic diagram of the conductive material layers 18 and 22 in FIG. 1. The conductive material layers 18 and 22 are sequentially printed on the insulating layer 16 as the base. The conductive material layer 18 is used as the Y-axis trace of the capacitive touch panel 10, which has The trace contact 50 , the conductive material layer 22 serves as the X-axis trace of the capacitive touch panel 10 , which has a trace contact 52 , and the trace contacts 50 and 52 are connected to the joints of the conductive layer 26 .

图3为图1中导体层26的图形示意图，导体层26在基材28上，并与薄膜层12的绝缘层24贴合，导体层26作为接地使用，其具有接合点100，在接合点100与线迹接点50及52之间涂上一导电胶，并且以高温压合的方式，使接合点100与线迹接点50及52电性导通，接合点100具有导孔102以使导电材料层18及22与导体层30的电路导通。3 is a schematic diagram of the conductor layer 26 in FIG. 1, the conductor layer 26 is on the substrate 28, and is bonded with the insulating layer 24 of the film layer 12, the conductor layer 26 is used as a ground, and it has a joint 100, at the joint 100 and the trace contacts 50 and 52 are coated with a conductive glue, and the bonding point 100 is electrically connected to the trace contacts 50 and 52 by high-temperature pressing, and the bonding point 100 has a guide hole 102 to conduct electricity The material layers 18 and 22 are electrically connected to the conductor layer 30 .

电容式触控板10的制作方法包括将薄膜层12及印刷电路板14分开制作，薄膜层12以绝缘层16为基底，依序将导电材料层18、绝缘层20、导电材料层22及绝缘层24印刷在绝缘层16上，印刷电路板14是将电路蚀刻在导体层30，再将线迹接点50及52与接合点100以导电胶由高温压合技术压合，使导电材料层18及22与导体层30的电路导通，最后将电子组件放置在导体层30上。The manufacturing method of the capacitive touch panel 10 includes making the thin film layer 12 and the printed circuit board 14 separately, the thin film layer 12 is based on the insulating layer 16, and the conductive material layer 18, the insulating layer 20, the conductive material layer 22 and the insulating layer are sequentially formed. The layer 24 is printed on the insulating layer 16, and the printed circuit board 14 is to etch the circuit on the conductor layer 30, and then the trace contacts 50 and 52 and the junction 100 are pressed together by high-temperature lamination technology with conductive glue, so that the conductive material layer 18 and 22 are connected to the circuit of the conductor layer 30 , and finally the electronic components are placed on the conductor layer 30 .

图4为本发明第二实施例的结构示意图，使用薄膜的电容式触控板200的包括薄膜层202及印刷电路板204，薄膜层202作为模拟感应结构，其包括一绝缘层206、导电材料层208、绝缘层210及导电材料层212，绝缘层206可使用具透光性的绝缘材料，例如PET，或不具透光性的绝缘材料，导电材料层208含有Y轴线迹，导电材料层212含有X轴线迹，导电材料层208及212为低阻抗的导电材料，例如银胶，绝缘层210为供导电材料层208及212之间的绝缘，使用介电系数为2～4的材料，可使用具透光性的绝缘材料，例如油墨，或不具透光性的绝缘材料。印刷电路板204包括基材214及导体层216，印刷电路板204为双面的印刷电路板，基材214为印刷电路板204的基板，一般而言，以玻璃纤维(FR4)为主，导体层216供放置组件及制作电路，导体层216以例如铜箔为材料。4 is a schematic structural diagram of the second embodiment of the present invention. The capacitive touch panel 200 using a thin film includes a thin film layer 202 and a printed circuit board 204. The thin film layer 202 is used as an analog sensing structure, which includes an insulating layer 206, a conductive material Layer 208, insulating layer 210 and conductive material layer 212. The insulating layer 206 can use a light-transmitting insulating material, such as PET, or a non-light-transmitting insulating material. The conductive material layer 208 contains Y-axis traces, and the conductive material layer 212 Containing X-axis traces, the conductive material layers 208 and 212 are low-impedance conductive materials, such as silver glue, and the insulating layer 210 is used for insulation between the conductive material layers 208 and 212. The material with a dielectric coefficient of 2-4 can be used. Use light-transmitting insulating materials, such as ink, or non-light-transmitting insulating materials. The printed circuit board 204 includes a base material 214 and a conductor layer 216. The printed circuit board 204 is a double-sided printed circuit board. The layer 216 is used for placing components and making circuits, and the conductor layer 216 is made of, for example, copper foil.

图5为图4中导电材料层208及212的图形示意图，基材214与导电材料层212之间具有接合点250，其上依序印刷导电材料层212及208，接合点250连接导电材料层212及208，接合点250以例如铜箔为材料，接合点250中具有导孔252，使导电材料层212及208经由接合点250至导孔252与导体层216的电路及电子组件导通。FIG. 5 is a schematic diagram of the conductive material layers 208 and 212 in FIG. 4. There is a joint 250 between the substrate 214 and the conductive material layer 212, on which the conductive material layers 212 and 208 are printed in sequence, and the joint 250 is connected to the conductive material layer. 212 and 208 , the joint 250 is made of copper foil, for example, and has a guide hole 252 in the joint 250 , so that the conductive material layers 212 and 208 are connected to the circuit and electronic components of the conductor layer 216 through the joint 250 to the guide hole 252 .

电容式触控板200的制作方法是以印刷电路板204为基底，将薄膜层202依序印刷在印刷电路板204上，详言之，其包括将电路蚀刻在印刷电路板204的导体层216上，再依序将导电材料层212、绝缘层210、导电材料层208印刷在基材214与导电材料层212之间的接合点250上，绝缘层206粘着于导电材料层208上，最后将组件放置在导体层216上。The manufacturing method of the capacitive touch panel 200 is based on the printed circuit board 204, and the film layer 202 is sequentially printed on the printed circuit board 204. Specifically, it includes etching the circuit on the conductive layer 216 of the printed circuit board 204. , and then sequentially print the conductive material layer 212, the insulating layer 210, and the conductive material layer 208 on the junction 250 between the substrate 214 and the conductive material layer 212, the insulating layer 206 is adhered to the conductive material layer 208, and finally the Components are placed on conductor layer 216 .

Claims (24)

1. a capacitive touch control plate that uses film is characterized in that, comprising:
One thin layer, have first insulation course, second insulation course, the 3rd insulation course, comprise first conductive material layer of Y-axis stitching and comprise second conductive material layer of X-axis stitching, this first conductive material layer is between this first insulation course and second insulation course, this second insulation course is between this first conductive material layer and second conductive material layer, this second conductive material layer is between this second insulation course and the 3rd insulation course, and this Y-axis stitching and X-axis stitching have the first stitching contact and the second stitching contact respectively; And
One printed circuit board (PCB), have a substrate, first conductor layer and second conductor layer on the two sides of this substrate, this first conductor layer is between the 3rd insulation course and substrate, this first conductor layer has abutment and this first stitching contact and the second stitching contact pressing, and guide hole is connected to this second conductor layer.
2. the capacitive touch control plate of use film as claimed in claim 1 is characterized in that, this insulation course comprises the insulating material of a light transmission.
3. the capacitive touch control plate of use film as claimed in claim 1 is characterized in that, this insulation course comprises the insulating material of a non-light transmittance.
4. the capacitive touch control plate of use film as claimed in claim 1 is characterized in that, this first conductive material layer, second conductive material layer are low-impedance conductive material.
5. the capacitive touch control plate of use film as claimed in claim 4 is characterized in that, this low-impedance conductive material comprises elargol.
6. the capacitive touch control plate of use film as claimed in claim 1 is characterized in that, this second and third insulation course has 2～4 dielectric coefficient.
7. the capacitive touch control plate of use film as claimed in claim 1 is characterized in that, this second and third insulation course comprises the insulating material of a light transmission.
8. the capacitive touch control plate of use film as claimed in claim 1 is characterized in that, this second and third insulation material layer comprises printing ink.
9. the capacitive touch control plate of use film as claimed in claim 1 is characterized in that, this first and second conductor layer comprises Copper Foil.
10. the capacitive touch control plate of use film as claimed in claim 1 is characterized in that, this substrate comprises glass fibre.
11. a capacitive touch control plate that uses film is characterized in that, comprising:
One thin layer, have first insulation course and second insulation course, comprise first conductive material layer of Y-axis stitching and comprise second conductive material layer of X-axis stitching, this first conductive material layer is between this first insulation course and second insulation course, and this second insulation course is between this first conductive material layer and second conductive material layer; And
One printed circuit board (PCB) has a substrate, conductor layer and abutment on the two sides of this substrate, and this abutment is between this second conductive material layer and substrate, and this abutment connects this Y-axis stitching and X-axis stitching, and this abutment has guide hole, is connected to this conductor layer.
12. the capacitive touch control plate of use film as claimed in claim 11 is characterized in that, this first insulation course comprises the insulating material of a light transmission.
13. the capacitive touch control plate of use film as claimed in claim 11 is characterized in that, this first insulation course comprises the insulating material of a non-light transmittance.
14. the capacitive touch control plate of use film as claimed in claim 11 is characterized in that, this first conductive material layer and second conductive material layer are low-impedance conductive material.
15. the capacitive touch control plate of use film as claimed in claim 14 is characterized in that, this low-impedance conductive material comprises elargol.
16. the capacitive touch control plate of use film as claimed in claim 11 is characterized in that, this second insulation course has 2～4 dielectric coefficient.
17. the capacitive touch control plate of use film as claimed in claim 11 is characterized in that, this second insulation course comprises the insulating material of a light transmission.
18. the capacitive touch control plate of use film as claimed in claim 11 is characterized in that, this second insulation material layer comprises printing ink.
19. the capacitive touch control plate of use film as claimed in claim 11 is characterized in that, this conductor layer comprises Copper Foil.
20. the capacitive touch control plate of use film as claimed in claim 11 is characterized in that, this substrate comprises glass fibre.
21. the method for making of a capacitive touch control plate is characterized in that, comprises the following steps:
Make thin layer and printed circuit board (PCB) respectively, this printed circuit board (PCB) has an abutment;
This thin layer is that Y-axis stitching, second insulation course, X-axis stitching and the 3rd insulation course are printed in substrate in regular turn with an insulation course, and this Y-axis stitching has the first stitching contact and the X-axis stitching has the second stitching contact; And
This first stitching contact of pressing and second stitching contact and the abutment.
22. the method for making of capacitive touch control plate as claimed in claim 21 is characterized in that, the step at this first and second stitching contact of this pressing and abutment comprises the following steps:
Be coated with this first and second stitching contact and this abutment with a conducting resinl; And
Pressing this first and second stitching contact and this abutment are with conducting this first and second stitching contact and this abutment.
23. the method for making of capacitive touch control plate as claimed in claim 22 is characterized in that, this first and second stitching contact of this pressing and this abutment are should first and second stitching contact and this abutment with high-temperature high-pressure.
24. the method for making of a capacitive touch control plate is characterized in that, comprises the following steps:
With a printed circuit board (PCB) is that Y-axis stitching, first insulation course and X-axis stitching are printed in substrate in regular turn; And
Adhere one second insulation course at this X-axis stitching.
CNB2004100703338A 2004-07-29 2004-07-29 Capacitive touch panel using thin film and manufacturing method thereof Expired - Fee Related CN1324448C (en)

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