CN1421062A - Passive electrostatic shielding structures for electrical circuits and with external partial shielding energy channels - Google Patents

Abstract

The present invention relates to a universal multifunctional shared conductive shielding structure (9905) coupled with two electrically oppositely differential energy channels (810b, 810f), the shielding structure locally utilizing an electrical shielding architecture with stacked conductive layered steps, comprising circuitry for simultaneously propagating energy along paired electrically differential channels utilizing bypass and feed-through energy propagation modes.

Description

Passive electrostatic shielding structures for electrical circuits and with external partial shielding energy channels

technical field

The present application relates to a general purpose multifunctional shared conductive shielding structure, coupled with electrically reversed differential energy channels, which partially utilizes a Faraday shielding architecture with laminated conductive layered steps, including A circuit for propagating energy along pairs of electrically differential channels utilizing bypass and feedthrough energy propagation modes. Furthermore, the use of electrically and physically opposed differential electrodes sandwiching the entire stack of conductive layer steps in a predetermined manner provides a further structural embodiment. The present invention also relates to discrete and non-discrete general purpose multifunctional shared conductive shielding structures, coupled with electrically reversed differential energy pathways, which partially utilize a Faraday shielding architecture with laminated conductive layers Stepping, containing circuitry capable of encompassing energy propagation, and having a balanced, centrally located and shared common conducting energy channel or electrode for complementary and simultaneous shielding and smoothing between energized conducting channels and electrodes Energy decoupling operation. The present invention, when energized, will almost always allow both the outer, partially shielded pair of differentially conducted energy channel electrodes and the contained pair of reversed differentially conducted energy channel electrodes, respectively, to be balanced and electrically reversed. interact in complementary ways.

Background technique

The present invention relates to a layered general-purpose multifunctional shared conductive shielding structure for circuit and energy regulation, plus an electrically reversed complementary energy channel. The shielding structure also has a shared, centrally located conductive channel or electrode that complementarily and simultaneously shields and allows smooth energy interaction between energized conductive channel electrodes. The present invention, when energized, will generally allow the interoperability of the contained conductive channels or electrodes, respectively, in harmony and in opposite phase or oppositely charged manner. When placed into a circuit and energized, inventive embodiments will also provide EMI filtering and electrical surge protection, while maintaining a substantially uniform or balanced voltage feed between the source and energy consuming load. Furthermore, the present invention will almost always be effective in providing simultaneous energy regulation functions including bypassing, energy and signal decoupling, energy storage, and continuous balancing in simultaneous switching operation (SSO) states of integrated circuit gates. As inventive embodiments are passively operated within the circuit, these regulation functions are provided with minimal contribution of parasitic destructive energy placed back into the circuitry.

Today, as the density of electronic devices in societies around the world increases, government or private standards for eliminating electromagnetic interference (EMI) and making electrical products immune to such interference have become more stringent. Only a few years ago, the main causes of interference were sources and conditions such as voltage imbalances, spurious voltage transients from electrical shocks, humans, or other electromagnetic wave generators.

At higher operating frequencies, line regulation of propagating energy with prior art components has resulted in increased levels of interference in the form of EMI, RFI, and capacitive and inductive parasitics. These increases are due to inherent manufacturing offsets and performance imperfections in passive components that create or cause interference in associated circuits when operating at higher operating frequencies. EMI can also be generated from the circuit itself, so EMI shielding is required. Differential and shared mode noise energy can be generated and will always travel along and around cables, circuit board traces or traces, high speed transmission lines and bus lanes. In many cases, these critical energy conductors act as antennas that radiate the energy field, compounding the problem.

Other sources of EMI interference are generated by active silicon components during operation or switching. These problems, such as SSO, are notorious causes of circuit destruction, and problems known in the industry include unshielded differential energy paths allowing free coupling of parasitic energy into the circuit, creating severe interference at high frequencies.

Other damage to circuits arises from large voltage transients and ground loop disturbances caused by changing ground potentials, which can render a well-balanced computer or power system useless. Existing electrical shock and EMI protection devices have been unable to provide adequate protection in a single integrated circuit package. Various discrete and networked lumped filters, decouplers, surge eliminators, combinations and circuit configurations have proven ineffective, as demonstrated by the shortcomings of the prior art.

Portions of U.S. Patent Application Serial No. 09/594,447 (filed August 3, 2000), as well as portions of the following commonly owned patents (U.S. Patent Nos. 6,097,581, 6,018,448, 5,909,350, and 5,142,430), relate to a new set of discrete multi- Continued improvement of functional energy regulators. 09/594,447 is a continuation-in-part of the pending application of U.S. Application No. 09/594,447 (filed June 15, 2000), 09/594,447 is a part-pending application of U.S. Application No. 09/579,606 (filed May 26, 2000) Continuation, 09/579,606 is a continuation-in-part of the pending application of US Application No. 09/460,218 (filed December 13, 1999). These multifunctional energy conditioners propose a common shared, centrally located common conduction electrode, structured to complementarily and simultaneously energize and pair electrically complementary differential conduction energy channels attached to external energy-carrying conduction channels Electrode interaction.

The present application expands on these concepts and further discloses a new implementation that applicants believe will help solve and reduce industrial problems and obstacles as part of a circuit protection and regulation system.

The present application also provides a manufacturing infrastructure with unprecedented adaptability or ease of production retrofitting compared to the prior art.

Contents of the invention

In light of the foregoing, it has been discovered that there is a need to provide a layered multifunctional shared conductive shield structure that, in broad embodiments, includes components that share a common, centrally located, common conductive channel or electrode for easy energy regulation. The energy conduction channel also contains multiple other functional components.

This layered multifunctional common conductive shielding structure also protects against the electrically reversed differential electrodes by allowing predetermined, simultaneous energy interactions between the grouped and energized conductive channels and the various conductive channels external to the embodiment elements. The presence of portions of the propagating energy on the energy channel provides simultaneous physical and electrical shielding.

An advanced method for high-frequency decoupling is to provide closely located low-impedance, parallel energy paths inside and adjacent to the electrically reversed differential electrode energy paths or power distribution/signal planes, rather than on the PCB. Multiple low-impedance decoupling capacitors in parallel to try to achieve the same purpose.

Accordingly, according to the present invention, the solution to low impedance power distribution above a few hundred MHz lies in thin dielectric power distribution plane technology with internal parallel complementary alignment and positioning.

It is therefore also an object of embodiments of the present invention to be able to operate efficiently over a wide frequency range compared to a single component or a single passive regulation network. Ideally, the invention would be general in its application potential and utilize various embodiments of predetermined grouping elements; a working invention would almost always continue to perform effectively within systems operating at frequencies in excess of 1 GHz.

It is an object of embodiments of the present invention to provide energy decoupling to active systems while maintaining a constant apparent potential for the active components and their circuits.

It is an object of embodiments of the present invention to minimize, eliminate or filter unwanted electromagnetic radiation generated by differential and common mode currents flowing in electronic pathways initially affected by embodiments of the invention.

It is an object of embodiments of the present invention to provide multifunctional common conductive shielding and energy conditioning structures for conductive energy pathways having a variety of multilayer embodiments and employing a variety of dielectrics not limited by specific physical properties The material, when attached to a circuit and energized, can provide both line conditioning and protection, as will be explained.

It is an object of embodiments of the present invention to provide users with the ability to solve problems or limitations not addressed by prior art devices, including, but not limited to, simultaneous source-to-load and/or load-to-source decoupling, differential dynamic and shared mode EMI filtering, retention and removal of most energy parasitics, and electrical shock protection in an integrated embodiment; and performing said of these functions.

It is an object of embodiments of the present invention to be readily adaptable for use with one or more external conductive attachments for common conductive areas located outside of the original manufactured invention, which can help embodiments of the present invention provide protection to electronic system circuitry. Furthermore, protection is provided from active to active electronic components from electromagnetic field radiation, overvoltages and energy consuming electromagnetic radiation contributed by an inventive embodiment itself and in prior art devices in the form of parasitic contribute back to the main circuit.

It is an object of embodiments of the present invention to provide a physically integrated, shielded contained, conductive electrode architecture for separate electrode materials and/or separate dielectric material compositions, for which multiple aspects of the present invention may be produced In terms of possible embodiments, the structures, when manufactured, do not limit inventive embodiments to a particular form, shape or size, and are not limited to the embodiments shown herein.

It is an object of embodiments of the present invention to provide users with an embodiment that enables them to implement a relatively inexpensive, miniaturized solution that can be used for integration into multiple electronic products.

It is an object of embodiments of the present invention to provide an embodiment that reduces the need for additional supporting discrete passive components to achieve the desired filtering and/or line conditioning, which cannot be provided by prior art components .

An object of embodiments of the present invention is to provide users with an embodiment that allows users to implement an easy-to-manufacture, general-purpose, multi-functional electronic embodiment to address various electrical issues and problems currently faced when using prior art devices. Constraints have consistent solutions.

It is an object of embodiments of the present invention to provide an embodiment in the form of a predetermined grouping of discrete or non-discrete devices, or conductive paths, which constitute a multifunctional electronic embodiment which, when attached to external conductive paths or predetermined conductive surfaces, operate efficiently over a wide frequency range while providing energy decoupling to active circuit components while maintaining a constant apparent potential for each portion of the circuit.

It is an object of embodiments of the present invention to provide an embodiment in the form of a predetermined grouping of discrete or non-discrete devices, or conductive paths, which constitute a multifunctional electronic embodiment for providing blocking circuits or using The inherent common conduction path circuitry inherent in this embodiment, in combination with an external conduction surface or ground area provides a connection from a pair of conduction path conductors to another energy path to attenuate EMI and overvoltage.

It is an object of embodiments of the present invention to provide an embodiment that utilizes standard manufacturing processes, constructed of common dielectric materials and conductive materials or composite conductive materials, to achieve tight capacitance between electrical pathways within the embodiment Tolerance while maintaining a constant, uninterrupted conduction path for energy propagation from the source to the load that uses the energy.

Finally, it is an object of embodiments of the present invention to provide such an embodiment which very closely couples pairs of electrical conductors to each other in an area or space partially enclosed by a plurality of commonly connected conductive electrodes, plates, or channels , and give the user the option to selectively couple the external conductors or channels to separate, non-shared energy channels or electrode plates as part of this embodiment.

This description also discloses many other arrangements and configurations that achieve or are based on the above objects and advantages of the embodiments of the invention to present a general multifunctional shared conductive shielding structure within the scope of the invention plus two for energy and EMI regulation and protection Versatility and wide application of energy channels in electrical back-differentials.

Description of drawings

Figure 1 shows a detailed plan view of multifunctional common conductive electrode channels and differential electrode channels stacked within a portion of a generalized Faraday shield structure embodiment 9900, shown in Figure 2, with stacked conductive layered stepping;

Figure 2 shows a component perspective view of an embodiment of a generalized Faraday shield structure 9900 with stacked conductive layered steps in accordance with the present invention;

Figure 3 shows a cross-sectional view of an embodiment 9905 of a paired differential bypass circuit regulation embodiment utilizing a portion of an embodiment of a general Faraday shield structure having conductive layered steps of an electrode stack, in accordance with the present invention, Used to regulate multiple individual bypass circuits;

Fig. 4 shows the top view of the layered positioning of two groups of differential, twisted pair, and cross-over feedthrough electrode energy channels according to the present invention;

Figure 5 shows a plan view of a set of pairs of "direct feed-through" feed-through electrodes comprising electrode energy channels configured with a split differential electrode configuration in accordance with the present invention;

6-6A shows a detailed plan view of the common conductive shield electrode channel showing a typical split electrode configuration according to the present invention, and FIG. 6B shows a detailed plan view showing a typical split electrode configuration according to the invention;

Figure 7A shows a partial cross-sectional view of another alternative embodiment 9210 comprising two pairs of electrically reversed differential, twisted pair, jumper feedthrough electrode energy channels configured in accordance with the present invention;

Figure 7B shows part of a top view of 9910 according to the present invention;

Figure 8 shows a cross-sectional view of a portion of an alternative embodiment 9915, including pairs of electrically reversed differential electrode energy channels configured in accordance with the present invention;

Figure 9 shows the circuit combination of the separate electrodes used for all the electrodes presented in the examples. As an option of the present invention, this combined alternative allows one of the two sets of electrodes to be configured as non-separated.

Detailed ways

Co-pending and commonly owned applications including US Application Serial No. 09/594,447 (filed June 15, 2000) are incorporated herein by reference. 09/594,447 is a continuation-in-part of the co-pending application of U.S. Application No. 09/579,606 (filed May 26, 2000), and 09/579,606 is a co-pending application of U.S. Application No. 09/460,218 (filed December 13, 1999) 09/460,218 is a continuation in part of U.S. Application No. 09/056,379 (filed April 7, 1998, now granted Patent No. 6,018,448), and 09/056,379 is a continuation of U.S. Application No. 09/008,769 (January 1998 09/008,769 is a continuation-in-part of U.S. Application No. 08/841,940 (filed April 8, 1997, now granted, Patent No. 5,909,350) continue.

This application also incorporates herein by reference, in part, co-pending and commonly owned U.S. provisional applications including: U.S. Provisional Application No. 60/180,101 filed February 3, 2000, U.S. Provisional Application No. 60/180,101 filed April 28, 2000 Provisional Application No. 60/200,327, U.S. Provisional Application No. 60/xxxxx filed August xx, 2000, U.S. Provisional Application No. 60/xxxxx filed August xx, 2000, U.S. Provisional Application No. August xx, 2000 No. 60/xxxxx, U.S. Provisional Application No. 60/xxxxx filed December 15, 2000, as they relate in one form or another to the new set of multifunctional energy conditioners for energy spreading circuits and Continued improvement of the shielding structure.

As used herein, the term "universal multifunctional shared conductive shielding structure plus two electrically reversed differential energy paths" refers to both forms, separated and non-separated, utilizing an additional electrically reversed differential path as a conductive feedthrough and Shared conductive shield structure for bypassing energy pathways.

Furthermore, the acronym "AOC" as used herein means "Area or Space of Predetermined Physical Convergence or Confluence" which is defined as the physical boundary of inventive elements being fabricated together. De-energized and energized are defined as either discrete or non-discrete common multifunctional shared conductive shielding structures plus electrically reversed differential energy pathways within the "AOC" where energy is directed to and/or from the The extent or degree to which energy is propagated in areas outside a predetermined area.

In electricity, the various interactions and interrelationships between energy propagation are generally described in terms of their complementary dynamics, which are caused by pairs of energy partial elements with opposite energy or force. The energy portion of the energy or force element interacts from one polar opposite or electrically complementary state to each other polar opposite or electrically complementary state. Due to the limitations of today's detection equipment, the results of these interactions are often not recorded. Thus, interactions are described as dynamic events of complementary equilibrium states, with dual symmetries of simultaneous, identical, or complementary, mirror-like, anti-mirror-positioned and timed, etc., taking into account that Those skilled in the art understand that the artificial tolerances and/or limitations used to describe and record certain dynamics, while generally permitted by the precise meaning of the words, never reach the molecular or atomic scale of existing matter. recordability.

In the world of quantum mechanics, the principle of complementarity states that there are pairs of quantities that are complementary because they describe a whole only when put together, but that are mutually exclusive because they can never be measured simultaneously . They cannot be measured because the act of measuring a property produces a unity that includes the part being measured, the measurement, and the observer. This larger dynamic whole in turn defines a new dynamic "part" that is separate from, but connected to, the original dynamic "part" or event being measured. These two dynamic "parts" must always be mutually exclusive. No matter what we observe, no matter how we design the experiment, this dynamic "behavior" always indicates a new "part" outside of the experiment but connected to it. In quantum mechanics, this principle leads directly to the well-known uncertainty principle, which asserts that there are fundamental limits to the achievable precision in simultaneous measurements. This principle also limits the accuracy of the simultaneous measurements of energy and time required to make energy measurements.

To contrast science with examples in art, the aesthetic significance of elements (as in a work of art) is usually achieved by giving each element the importance it deserves and often allowing one element to contrast, oppose, or pair with another. A delightful integration. In the arts rather than in the sciences, the word complementarity is often used in a looser sense, to refer to a balance in which counterparts are not necessarily identical but only similar. Effects can be described as not only contrasting, but also complementary.

A symmetrical design should produce a pleasing effect; if there are too close correspondences, the effect may be monotonous. Mathematical operations or transformations that produce a graph that is identical to the original graph (or its mirror image) are called symmetric operations. Such operations include reflection, rotation, double reflection, and transformation. The set of all operations on a given graph that make the graph invariant constitutes the symmetry group of that graph. Thus, the restriction on the combined accuracy of certain simultaneous, related pairs of measurements, in general, the balance or correspondence between the parts of an object; the term symmetry is used in science, and should take into account the equal or precise adjustment by opposing forces. resulting in stability and efficiency.

These definitions should also be used with the generally applied uncertainty principle, limited by the degree of precision possessed by the present test equipment, and not necessarily noticeable on large scale ordinary measurements, inspection of smaller structures or combined operations . Statements of measurement or purported cancellation or elimination in the ordinary understood sense having regard to manufacture refer to shape and size as far as construction is concerned, and are understood to mean that each of the foregoing events has occur.

These concepts, as described above, give the impression that it is a difficult matter to describe in just a few sentences the meaning of the various degrees of limitation of events. This is not an excuse, but rather, the usage of words known to be considered strict or definitive, are still used here, and the reader or those skilled in the art are expected to understand these words, adjectives, Adverbs and nouns.

The use of the following terms, such as "complementary simultaneous", same time, same size, same size, equal, equal, equal in size, etc., should be read with the real-world precision upon which these terms are to be interpreted, all in accordance with the perceived Normal and standard general understanding, in particular customary understanding in terms of as far as practical within manufacturing tolerances are concerned, or in accordance with the various OEMs within the state of the art who actually intend to construct the invention described herein and variations thereof. The variants described, therefore, are contemplated by standard industry processes, with various standard industry assembly constraints or any other standard industry constraints on the manufacture of electronic devices for energized circuit embodiments, not just as for this The invention described in the specification and variations thereof are described.

The invention takes the form of various embodiments such as discrete and non-discrete structures as a combination of layered or laminated conductive, semiconductive and non-conductive dielectric separate materials. These layers can be combined to form unique circuits that can be set up and powered up in the system. Embodiments of the invention include layers of conductive, semiconductive, and nonconductive planes that make up sets of common conductive channel electrodes, conductors, deposits, plates (all referred to herein as "channels"), and dielectric planes. These layers are oriented in a generally parallel relationship to one another, towards predetermined pairs or groups of elements, which also include various combinations of channels and their layering in predetermined fabrication structures.

These inventive elements are not limited to dielectric layers, multiple electrode conduction paths, sheets, stacks, deposits, multiple common conduction paths or shields, sheets, stacks or deposits. The invention also includes combining and connecting said dielectric layers, multiple electrode conducting paths, sheets, stacks, deposits, multiple common conducting paths or shields, sheets, stacks or deposits together for Feed into a larger electrical system.

Structural layer devices can be shaped, embedded, encapsulated, or inserted into various electrical systems or other subsystems, either as they are fabricated or thereafter, to perform line conditioning, decoupling, and/or assist in altering the electrical transfer of energy. The invention can be implemented as a single, stand-alone system or in groups of larger electrical structures such as integrated circuits. The invention also exists as a de-energized, self-contained, discrete component, energized together with a combination, as a sub-circuit of a larger circuit in other embodiments such as, but not limited to, printed circuit boards (PCBs), Interferometers, substrates, connectors, integrated circuits, optical circuits or atomic structures. Alternative inventive embodiments may also be constructed in the form of another device, such as a PCB, interferometer or substrate, having a different function than the smaller, discrete form of the inventive embodiment. Such alternative embodiments may be stacked to provide most of the benefits described for regulating propagating energy from a source to a load and back as possible systems or subsystems containing active and passive components along with circuitry. Prior art printed circuit boards have been used in layered configurations with VIAs to service or tap various power, signal and ground planes located between dielectric and insulating materials.

At least one pair of electrically reversed complementary aligned and stacked conductive energy channel electrodes are substantially all assembled into an electrode cage structure, symmetrically aligned and layered shields comprising at least one central and shared, common conductive channel or region surrounded by electrodes. When energized, the inner/outer common energy channel electrodes and/or zones become a shared reference ground plane for circuit voltages present between two anti-phase or electrically reversed differential conduction energy channel electrodes, which The two electrodes are electrically or physically located at opposite ends of the common energy channel electrode and the central and shared common conduction electrode channels or the outer common conduction region. These types of configurations contribute significantly to the cancellation of E and H fields, stray capacitance, stray inductance, parasites, and allow mutual cancellation of signals, electrical energy, and electric fields of the return channel at different locations. Embodiment variants of the inventive architecture built with or using PCBs can use various grounding schemes to improve the efficiency of existing structures now used by large PCB manufacturers.

In order to propagate EMI energy, two fields are required, an electric field and a magnetic field. A voltage difference between two or more points in an electric field couples energy into a circuit. Changing electric fields in space can generate magnetic fields. Any time varying magnetic flux produces an electric field. As a result, purely electric or purely magnetic time-varying fields cannot exist independently of each other. Although it is not necessary to create embodiments of the invention to modulate one type of field more than another, it is conceivable to use different types of materials to create embodiments that do this particular modulation of one energy field more than another .

For nearly all of the embodiments of the invention described and those not described, applicant contemplates that the manufacturer may choose to combine a wide variety of possible materials to combine the constituents of the invention at the time of manufacture, while still retaining the Some or nearly all of the required degrees of electrical functionality of embodiments of the invention.

The materials used in the composition of inventive embodiments may comprise one or more layers of material elements consistent with existing processing techniques and are not limited to any possible dielectric material. These materials may be semiconductor materials such as silicon, germanium, gallium-arsenide, or semi-insulating or insulating materials such as but not limited to any K, high K and low K dielectrics. Likewise, inventive embodiments are not limited to any possible conductive material, such as magnetic, nickel-based materials, MOV-type materials, ferritic materials, thin films such as Mylar, or virtually any kind of conductive material that can create conductive channels. Substances and processes, and virtually any kind such as but not limited to doped polysilicon, sintered polycrystalline substances, metals, or polysilicon silicates, conductive material deposits,

Use of an inventive embodiment or cell attached between energized pairs of wires will alleviate the problem of capacitive imbalance or circuit voltage imbalance, or the problem of manufacturing imbalance that is exacerbated at high frequency operation commonly associated with prior art devices .

Prior art capacitors manufactured in the same production batch are prone to capacitance variation from part to part in the range >.05%-25%. Therefore, when prior art capacitors are placed in a circuit and energized, their manufacturing tolerances are brought into the circuit, in which case, for example, differential pairing circuits accentuate voltage imbalances in the circuit. Even though prior art units are manufactured with less than 10% minimum capacitance variation between discrete units, there is some cost or fee paid by the user for the manufacturer to recoup the cost of inspection, manual sorting of artifacts, and Additional cost for more specialized dielectrics and for fabrication techniques required to manufacture prior art units with reduced individual variation required for differential signaling or filtering. This invention allows the use of a very cheap dielectric material (relative to other available materials) to obtain the balance between the two wires.

Use of the inventive embodiments will allow placement into differentially operated circuits or virtually any electrically reversed and differential paired wire circuit to provide complementary and substantially equal capacitance tolerances, because of the inventive unit, that will be used in the following Electrically, portions of the propagating energy between each pair of wires are evenly shared and complementary using circuits of embodiments of the invention. Inventive voltage tolerance and/or capacitive and inductive balancing and/or minimization between the shared central conduction channel within an inventive embodiment will almost always be relatively maintained at the level at which the inventive embodiment was originally manufactured in the factory, even if is to use X/R dielectrics, which are commonly specified with as much as 20% allowable capacitance variation in discrete units.

Therefore, an invention manufactured at a value greater than 0 to at least 5% tolerance, when manufactured as described in the specification, will almost always also have an associated value greater than 0 to at least 5% tolerance, energized system Capacitance tolerance between paired lines in , and the additional benefit of two prior art devices having a bypassed paired line of an embodiment of the invention traded. As a result, bypassing and/or decoupling operations eliminate the need for expensive, specialized dielectric materials in an attempt to maintain capacitive balance between the two system conduction channels, and give the inventor the opportunity to use similar materials in the material construction of the entire circuit. the capacitive element. The new invention is placed between the conduction channels, while the common conduction channel, which also constitutes an embodiment of the invention, is connected to a third conduction channel, which is common to all elements of the common conduction channel, and is the outer conduction area.

When a general purpose multifunctional shared conductive shield structure plus two electrically reversed differential energy channels is fabricated and subsequently attached to an externally fabricated conductive When channeling, inventive embodiments will always provide energy conditioning functions simultaneously, including at least bypass, energy, power line decoupling, energy field, and filtering. Almost all electrically reversed differential energy pathways or electrodes within inventive embodiments are almost entirely encapsulated within the shielding structure, and will almost always be relatively immune to almost all internally generated attempts to escape from surrounding encapsulated differential conductive pathway electrodes. The impact of escaping capacitance or energy parasites in the packaging container area. At the same time, the common multifunctional shared conductive shielding structure prevents almost any externally generated capacitive or energy parasitics such as "floating capacitance" from coupling onto the very same package differential conductive paths due to physical shielding that is independent of electrostatic shielding effects , the electrostatic shielding effect is created by the common conductive shielding structure and its attachment by known industrial attachment means, the latter being known in the art to be connected to externally located industrial conductive areas.

Attachments to common external conductive areas include areas such as what are often described as "floating", potential-free conductive areas (at a given moment), circuitry loops, chassis or PCB ground, or even earth ground. Through other features, such as cancellation of mutually opposing energy fields and interconnected parallel circuits, embodiments of the invention allow generation of low conductive common shield channel electrodes on or within a Gauss-Faraday cage or common conductive shield element with respect to its encapsulating conductive common shield. The impedance path, which then facilitates the continuous movement of the various parts of the energy out, is located in the common conduction area outside, thereby accomplishing or facilitating the creation of a low impedance energy path also for exploiting unwanted EMI noise.

This attachment scheme will almost always allow a "0" voltage reference to be generated on opposite ends of the shared central and common conductive channel, for each positioned differential conductor, each of its (differential conductor) structures and the outer Use such shared conductive surfaces. The use of inventive embodiments allows voltages to be maintained and complementary even if there is an SSO (Simultaneous Switching Operation) state between gates located within the integrated circuit and not returned to the circuitry when the inventive embodiments are passively operated within the circuitry The contribution of destructive energy parasites.

Thus, parasitics are prevented or minimized due to breaking the capacitive balance of the invention which is made non-energized, as opposed to what happens in every other prior art cell which does not use a conductive shielding structure. The prior art generally allows free parasites to act to destroy the circuit, despite best efforts contrary to almost all prior art devices to date.

As mentioned earlier, the propagated EMI can be the product of electric and magnetic fields respectively. Until recently, there has been an emphasis in the art on filtering EMI with DC energy or current from energy conductors carrying high frequency noise. Embodiments of the invention, however, are capable of conditioning energy using DC, AC, and AC/DC hybrid type energy propagation along conductive pathways in electrical systems or test equipment. This includes using inventive embodiments to regulate energy in systems containing many different types of energy propagation formats, in systems containing many types of circuit propagation characteristics, within the same electrical system platform.

It should be noted that although not shown, the various electrode layers in Figures 2, 3, 8 and 9 are contemplated as having separate electrode arrangements or in combination with other non-split arrangements. Due to time constraints, this specification omits various combinations in certain drawings.

The point of a Faraday cage structure is used when connecting common conductive channels to each other, the set of channels working together with a larger outer conductive area or surface to cancel radiated electromagnetic radiation, providing a larger, dissipated Conductive surface area for voltage and electrical shocks, and simultaneous initiation of parasitic and other transient common conduction electrode cage static dynamic elimination where multiple common conduction channels are electrically connected to system or chassis ground, depending on the inventive embodiment Reference ground for circuits placed in it and energized. The electrically reversed differentially conducting energy electrodes or structures are electrically separated and also shielded from each other and generally do not touch the interior of the inventive embodiments.

The attached inner common conducting electrode channels that make up the Faraday cage structure allow the common outer conducting region or the common energy channels to actually become one extended, closely located, and generally parallel relative to their positions of said common conducting elements. Device - if located inside a predetermined layered PCB or similar electronic circuit when subsequently energized.

Figure 1, Figure 2, and Figure 3 show a general Faraday shield architecture with stacked conduction layered steps with pairs of electrically reversed differential conduction channels. Therefore, discussions will be made freely back and forth between FIGS. 1, 2, and 3 in order to disclose the benefits of a separate and interchangeably configured Faraday cage-like shared conductive shielding structure such as embodiment 9905 shown in FIG. Part of a pair of differential conduction channels which, when placed in the conduction combinations of the various inner and outer shared conduction channels (not fully shown) in Figures 1, 2, and 3, facilitate multiple and independent operation energy regulation.

In Figure 2, the common conductive shield electrode channels 850F/850F-IM, 840F, 830F, 820F, 810F, 800/800-IM, 810B, 820B, 830B, 840B, and 850B/850B-IM in embodiment 9900 contain a common An embodiment of a Faraday shielding architecture with the stack conduction layered steps shown without paired, electrically reversed differential conduction channels. The final and optional sandwiched 850F/850F-IM and 850B/850B-IM common conductive shield channel is used in embodiment 9900 as an image mask as shown at 9905 in Figure 3 using various common electrode channels Part of a variant of , it may be found that the latter also contains part of a general Faraday shielding architecture with stacked conductive layered steps with conductive differential channels, if desired.

It should be noted that most - but not all - of the general gist described here is common to the new invention and alternative embodiments. The paragraphs referring to the common conduction channel 800/800-IM also apply to the other common channels insofar as they are connected to the same potential external common channels rather than external differential channels (neither shown in Figures 1 nor 2). conduction channel.

FIG. 1 shows a portion of the complete shielded electrode container 800E of FIG. 2 . Returning to FIG. 1 , differential conductive bypass electrode channel 855BB is sandwiched between shared central common conductive channel 800/800-IM and common conductive shield electrode channel 810B (810B is not shown in FIG. 2).

Above and below channel 855BB is a dielectric material or dielectric 801 . The act of depositing, fabricating and/or placing a dielectric material or medium 801 is largely a packaging and insertion of a predetermined dielectric material or medium 801 during fabrication by standard means known in the art.

The dielectric material 801 forms a separation region or space between the embodiment edge 817 and the common electrode channel edge 805 and separates the differential conduction channel electrode edge 803 and the embodiment edge 817 by an overall equal distance. Shared conductive channels 800/800-IM and 810B, and electrode channel 855BB, are substantially mostly separated from each other by a substantially parallel intermediate distance 814C by a predetermined dielectric material or medium 801 placed thereagainst them. 814C distance exists on at least two ends of the boundary or surface or surface edge 803 and 800-/800-IM-1 and 2 of 855BB, each corresponding planar electrode (2) major surface area and each of said The perimeter edge is mostly in contact with material 801, with the exception of the various conductive connections to the various electrode connection materials 798_GNDA and 890A via extensions 812A and 79-GNDA, respectively, for each conductive electrode layer location, respectively.

It should be noted that the embedding distance or area of element 806 is the boundary of the contained area of the energy flux portion during energization, and that this spacing is almost always relative to the surrounding common shield electrode rim 805 and encased common conductive shield electrode channel and almost any enclosing The electrically opposite differential electrode edge 803 of the clip's differential conductive electrode channel (not shown). This positioning and setback distance 806 of almost any differential conductive electrode channel electrode edge 803 within the common electrode edge 805 of almost any common shield electrode channel 799G conductive material region of an inventive embodiment is considered a principle of the inventive embodiment. This principle applies to almost any paired differential conduction channel that contains and uses a layered structure of shield electrodes whether in the vessel or on the outside of the shield 800 "x" vessel as shown in Figure 3, and includes at least one pair in External electrically reversed differential electrodes outside of this shield electrode layered structure, although the two external electrically reversed differential electrodes shown in Figure 3 will always utilize discrete or non-discrete forms of embodiment to some extent (May not be shown here) The layered structure of the shielding electrode in the shielding mode.

Initially, the part of the inventive embodiment shown in FIG. 2 and the two single shared conductive vessels 800 "X" after starting in FIG. 1 are now each formed with two shared conductive covers, respectively. However, instead of using four common shield electrodes in the manufacturing process, one can easily build two common conductive shield electrodes with three common shield electrodes, to build eg 800E and 800F. Thus, each single shared conductive vessel 800E and 800F shares a centrally located shield electrode channel common to both conductive shield electrode structures and the vessel, which in this case forms a shield electrode channel labeled 900A shared conduction Faraday center structure.

It should be noted that not only is the common conductive Faraday center structure 900A formed, but portions of the larger common conductive shield electrode structure 9900, denoted 900 "X" or 900B and 900C respectively, are now established.

Each of the common conductive shield electrode structures 900A, 900B, and 900C shown in FIG. 2 is sufficient on its own to operate as a common conductive Faraday cage structure with electrically reversed differential electrodes if each is so established, and if They include at least one pair of external electrically reversed differential electrodes separated by the same common conductive Faraday cage and outside the interior of the shield electrode layered structure, then they will almost always still both utilize discrete or non-discrete embodiments (which may not be shown here) shield the shield electrode layered structure.

When inventive embodiments utilize the placement and energization of separately paired electrical reverse differential energy pathways (not shown), and if a structure like 900A, 900B, and 900C is also connected together and connected to an external common Instead of using an electrically reversed and external differential energy channel, the energy conditioning function will almost always occur when attached to an energized circuit.

The relative embedding or overlapping shielding distance and region 806 relative to the embedding of electrode 855BB within 800/800_IM- of FIG. 1 enables electrostatic shielding effects, etc., to arise from this positional relationship and the relationship of various components within inventive embodiments. Some of these spatial/distance relationships include the vertical positioning of electrodes of almost all kinds (differential and common) relative to each other, by the amount of isolating dielectric material 801 used to isolate these electrodes from each other as well as internally, on the internal electrode position. They are positioned relative to each other laterally. This also includes various spacing and distance relationships or energy conditioning functions relative to external embodiment boundaries and their utility within those boundaries required for proper energy interaction to occur at those locations and boundaries. It should be noted that the common conductive channel 800/800-IM should extend the overlap distance at the perimeter or edge beyond the perimeter or edge of the electrode channel 855BB to provide for the various types of energy flux fields (located at the various portions shown) If not for the common electrode 800/800-IM-, 810F, these energy flux fields would have normally attempted to escape or extend beyond the electrode edge 803 of the electrode channel 855BB to connect to a "sacrificial" conductive channel (not fully shown).

The electrostatic shielding effect produced by the combination of these common electrode channels that are energized, consisting of a set of Faraday cage systems, results in a differential electrode channel in almost any internally located, such as a typically nearby 875BB (not shown) reduction or minimization of near-field coupling between It can be said that the horizontal electrode insertion distance 806 ranges from approximately greater than 0 to 20+ times the vertical distance or electrode insertion distance or 814C, as an approximate measure of the insertion spacing for a differential to a common electrode shield insertion 806, which is in the electrode channel 855BB There is a certain distance relationship with the common conduction channel 800/800-IM. This is based on standard manufacturing methods and distances.

In other words, the size of the major surface electrode conducting region, the smaller extension (if used), or the size of the conducting plane of any adjacent differential electrode channel, will almost always be smaller than any adjacent and parallel common The size of the corresponding major surface electrode conduction area of the conductive shield channel, the smaller extension (if used), or the size of the conduction plane of any adjacent differential electrode channel, regardless of another differential electrode (such as a separate Almost anything other than an electrode pair) separates the two adjacent invention elements. This means that despite the dielectric material 801 or separate differential electrode collocation, the next adjacent common conductive shield electrode channel will almost always be at least larger in coverage size and will be seen as shielding the same adjacent differential electrode channel. moving electrodes.

There is one size exception to the general rule, which applies only to the externally encased differential electrode channels of the 865BB and 865BT as shown in FIG. 3 . The conduction area size, conductive material coverage, or conduction plane size of these special externally encased differential electrode channels can be larger or smaller than its adjacent shared conductive shield electrode channels, and, as shown in Figure 3, the externally encased differential The moving electrode channels of these 865BB and 865BT are not necessarily equal in size to each other, as there are other inventive point functional variant configurations.

Therefore, unless the overall corresponding conductive main electrode surface area size, covered or conductive plane size of the main electrode conductive material of any paired set of differential electrode channels is the same as that of any next adjacent common conductive shield electrode main electrode surface or channel Likewise, variations of this principle are considered inventive embodiments possessing portions of the disclosed energy conditioning functionality.

The electrical embedding distance 806 can be optimized for a particular application, but the perimeter distance of the common/differential electrode stack 806, the distance of each contained differential electrode from the common shield electrode channel pair 814, 806A and 814C and the stack The relationship is ideally approximately the same throughout an inventive embodiment, as manufacturing tolerances allow.

In addition, internal differential conduction electrode channels such as 855BB sandwiched within two common conduction channels of FIG. 3 such as 800/800-IM and 810B (not shown), at the electrode edge 803 maintain a distance relationship 806 that will be relative to the peripheral electrode 805 of the differential conductive electrode 800/800-IM such that the electrode edge 805 has an exposed or "protruding" perimeter of the electrode edge 803 at a distance of at least The vertical isolation distance 814C shown in Figure 7A of the specification, which shows a relative dielectric thickness, which allows a distance or zone embedding is a rule related to the relative lateral distance of 806, which is added to the differential relative to 800E The result of the three-dimensional distance 806 measured from the common conductive shield electrode edge 805 by the electrode channel electrode edge 803 such that the outer electrode edge 803 of the differential conductive channel electrode 855BB is embedded and sandwiched between the common conductive channel 800/800-IM and Common electrode edge perimeter 805 of 810B (not shown) overlaps, covering a distance or area 806 along nearly the entire distance of 805 and 803 located on and attributed to 800/800-IM, 810B , while differentially conducting energy with respect to the sandwiched electrode channel 855BB or equivalent. Small differences in the distances between channels collectively or individually 806, 814, and 814C are not critical so long as they do not impair the general Faraday shield with stacked conductive layered steps comprising pairs of electrically reversed differential conductive channels The electrostatic shielding function of the architecture (not shown).

Common conductive shield electrode channels such as 805F/850F-IM, 840F, 830F, 820F, 810F, 800/800-IM, 810B, 820B, 830B, 840B, and 850B/850B-IM shown in Figures 1 and 2, and A series such as that shown in FIG. 3 is generally preferably each nearly identically sized common conductive shield electrode channel material 799G to the finished embodiment of the type desired by the user and as normal manufacturing constraints permit, to ensure that various Almost any combination of adjacent shared conduction channels has a homogeneous area size relationship. This applies to the size relationship of each member of the common conductive channel, each grouped by a shield electrode, in almost any generic inventive embodiment configuration. So any differential conduction channel that is sandwiched inside, either singly or with its counterpart of the same size, will almost always be shielded by at least two larger but shared conduction shield electrode channels of the same size relative to each other Physically fully shielded, the two channels will almost always have a larger shielded conductive electrode area than the shielded conductive electrode area of the differential electrodes they shield. This same-sized common conductive shielding electrode principle is suitable for differential conductive channels or electrodes (such as those shown in FIG. 2 and partially shown in FIG. Size relationship of regions of conductive material of common electrode energy channel elements of at least the same size or larger for 800A, 800B, 800C, 800D, 800E, 800F, 800G, and 800H (each collectively referred to as 800 "X")).

It should also be noted that the sum of the top and bottom conductive material areas that almost any one of the sandwiched common conductive channels will almost always be greater than the sum of the separate top and bottom total conductive material areas of any one of the sandwiched differential conductive channels . Any one of the sandwiched differential conductive channels will almost always be almost completely physically shielded by the common conductive shield electrode material to form a typical stacked conductive layered step with pairs of electrically opposite differential conductive channels. Advanced general-purpose Faraday shield architecture.

All conduction common conduction channels shown in Figures 1 and 2, including common conduction shield electrode channels 805F/850F-IM, 840F, 830F, 820F, 810F, 800/800-IM, 810B, 820B, 830B, 840B, and 850B /850B-IM is generally embedded a predetermined three-dimensional distance 814 from the outer edge 817 of the embodiment 9905 (not shown), which can be seen in detail at 800E in FIG. 1 .

It should be noted that element 813 is a dynamic representation of the central axis point showing the three-dimensional energy regulation function occurring within an inventive embodiment (not shown), relative to the final size, shape and position of the embodiment in the energized circuit.

So, paired and identically sized electrically reversed differential paired channels, together with larger double-tethered shared conductive channels 800/800-IM and 810B as shown in Figure 2, are grouped within the same species of each other's species Packets (shared or differential), will each be almost always the same size, as the associated fabrication energy allows. This principle of same-sized conduction channel electrode species is valid for almost all conduction channel species groupings in almost all general configurations including almost new invention embodiments.

Continuing with FIG. 1, the differential conduction electrode channel 855BB may contain a deposited, doped, chemically generated or placed, or simply shielded region 799 of conduction electrode material, any differential conduction channel will almost always be at the total conduction The region is smaller in size than any one common conductive shield electrode material region 799G, and when calculating the ratio of the total conductive electrode material 2 region, it is almost always relative to any given encased common conductive channel, such as 800 /800-IM and 810B, conductive electrode channel material 799 area. (It should be noted that, for purposes of this specification, 799 and 799G are generally the same conductive material type, although in other embodiments they may be different material types, which are the same type here but labeled differently , which is to explain the embodiments as thoroughly as possible.).

These 805F/850F-IM, 840F, 830F, 820F, 810F, 800/800-IM, 810B, 820B, 830B, 840B and 850B/850B-IM shown in FIG. 800D, 800E, 800F, 800G, and 800H, all the way down to wrapping differential pairs to form a container like a pair of conductive shields 800X, these wrapping functions will again largely help in performing common conduction against external attachment region or the energy propagation portion of the common energy channel and will also facilitate the generation of voltage image reference aids for circuits contained within embodiments of the invention.

It should be noted that the same number of shielded electrode container structures 800 "X" forming part of the inventive embodiment, are balanced within the embodiment structure according to the predetermined stacking sequence followed, erroneously or intentionally added during the manufacturing process Almost any additional single common conductive shield channel layer will not be sufficient to impede or affect energy conditioning operation. The addition of an additional common conductive electrode layer can actually expose potential cost savings in a manufacturing process where almost any automated layer processing may incorporate an additional outer layer or layers, or indeed exclude such One of two common conductive shield electrodes. These manufacturing errors, whether deliberate or accidental, are not fundamentally detrimental to the balance of the inventive embodiment comprising the common conductive shield electrode container 800X stacked in the correct order, as discussed, and applicants fully consider got to the point. However, this principle does not hold in the presence of pairs of identically sized electrically reversed differential conduction channels with additional external spacing. In this case, the same number of shielded electrode container structures 800"X" forming part of the inventive embodiment must be balanced within the embodiment structure according to the predetermined stacking sequence to be followed. No additional single common conductive shielding channel layer should be placed before the application of additional outer separated pairs of identically sized electrically opposite differential conductive channels. Thus, virtually any additional single layer of common conductive shielding vias that is mistakenly or intentionally added during fabrication prior to placement of additional externally separated pairs of identically sized electrically reversed differential conductive vias will not Impair or affect energy conditioning operation. The number of pairs of identically sized electrically reversed differential conduction channels in almost any variant of an inventive embodiment must show an even number.

Looking further at Figure 2, it can be seen that the shared conductive shield electrode channels 850F/850F-IM, 840F, 830F, 820F, 810F, 800/800-IM, 810B, 820B, 830B, 840B, and 850B/850B-IM When deployed, it is also surrounded by the dielectric material 801 providing support and the housing of the inventive embodiment. Common conductive connection material or structure, labeled 798-"X", applied to said common shielding channel at electrode edge 805 of common channel electrode material 799G contained within structure 9900 on at least both ends shown for this configuration An elongated adjacent portion of electrode extension 79-GNDA, as shown in FIG. 2, and as shown in detail for common electrode energy channel 800/800-IM in FIG. Note the number of common shield channel electrode extensions 79-GNDA at any electrode edge 805 .

Various dielectric materials 801 also enable predetermined electrical modulation functions to operate on portions of propagating energy transmitted along various combinations of electrically oppositely paired differentially conductive energy paths within or using an embodiment AOC of an embodiment AOC .

Further inspection of Figure 2 reveals that component type 798-GND "X" shared conductive add-on, electrode or termination structure will allow shared conductive shield electrode channels 850F/850F-IM, 840F, 830F, 820F, 810F, 800/800-IM , 810B, 820B, 830B, 840B, and 850B/850B-IM are electrically and physically connected to each other, respectively, and are electrically conductive with the same external common conduction channel or external common conduction energy channel or area 6803 as shown in FIG. 3 connection or physical connection.

The general multifunctional shared conductive shielding structure 9900 comprises a plurality of stacked, shared conductive cage structures 900A, 900B and 900C as shown, which in turn includes a plurality of stacked, shared conductive cage structures 800A, 800B in generally parallel relationship and 800C (each collectively referred to as 800X). Each common electrode shielding cage structure 800X includes at least one common conductive channel electrode 850F/850F-IM, 840F, 830F, 820F, 810F, 800/800-IM, 810B, 820B, 830B, 840B, and 850B/850B-IM . The number of stacked, shared conductive cage structures 800X is not limited to the number shown here, and can be almost any even integer. Therefore, the number of stacked, shared conductive cage structures 900X is not limited to the number shown here, and can be almost any even or odd integer.

Although not shown, in other applications, each pair of shared conductive cage structures 800X encloses at least one conductive electrode channel, as previously described in connection with FIG. 1 . The common conductive cage structures 800X are shown separated in the figures to emphasize that they are paired together, and virtually any type of paired conductive channels can be inserted into each common conductive cage structure 800X. So, the shared conductive cage 800X has a general application, when paired together, to generate the larger shared conductive cage 900X, described as 900B, 900A and 900C respectively, which can be combined with paired conductive Channels are grouped together for discrete or non-discrete configurations such as, but not limited to, embedded within silicone or as part of a PCB, discrete component network, or the like.

As already described in FIG. 2, dielectric material 801 will share conductive channel electrodes 850F/850F-IM, 840F, 830F, 820F, 810F, 800/800-IM, 810B, 820B, 830B, 840B, and 850B/850B- The IM is insulated from the sandwiched pair of identically sized electrically reversed differential conduction electrode channels or conduction channel electrodes (not shown), and also insulates and shields the outer at least one pair of identically sized electrically reversed conductive electrode channels or conduction channel electrodes (not shown). to the differential conduction channel.

Furthermore, as described in conjunction with Figures 1 and 2, a minimum of two cages (e.g., 800E and 800D forming larger cage 900A) are required to form a multifunctional cage for nearly all layered embodiments of the present invention. line adjustment structure. Accordingly, as shown in FIG. 2, each of 900A, 900B, and 900C requires at least two shared conductive embroidered structures 800X, respectively. Any sequence of very basic shared conductive via fabrication results (other than dielectric materials, etc.) shall manifest as a shielded electrode embodiment structure comprising a minimum of three stacked common shielded electrode vias shared conductively interconnected, and further comprising at least Two pairs of electrically reversed differential electrode energy channels, one paired set within the stacked common shield electrode channels of the minimum three common conductive interconnects and one paired set within the minimum three common conductive interconnects They can be connected and energized such that it contains at least a portion of the operational circuitry when energized.

In summary, when a single larger Faraday cage structure 900 "X" is attached to a larger outer conductive region (not shown), the combination facilitates simultaneous performance of Energized line conditioning and filtering functions for energy propagation of various pairs of electrically reversed differentially conductive electrode channel groupings (not shown) within the cage structure 900 "X", and insulation of at least one pair located externally (with the exception of these particular electrodes) electrically reversed differential conduction channels of roughly the same size.

Almost all variants of the common Faraday shield structure with stacked conductive layered steps are used in the form of interconnected shield structures containing various individually layered shield electrodes that share a common conductive connection , to connect with each other, and to connect the energy channels which are located outside, which are not the differential conduction channels.

The conductive common connection of the internally located shield electrodes to each other, and to the external energy channel, which is not a differential conductive channel, allows this third channel to be used simultaneously as a single energy channel, which can contribute to the various energy channels contained within the inventive embodiments. Some circuits provide reference voltages. The third energy path for the grouped electrode shielding paths also facilitates the creation of a predetermined low impedance for the portions of energy propagated by the differential paths.

The differential propagation of energy through inventive embodiments facilitates the creation of devices or embodiments within an inventive embodiment AOC that provide portions of energy to utilize portions of inventive embodiments in a complementary and balanced manner to facilitate circuit system efficiency outperforms the efficiency of similar prior art circuits. This separate and often shared third channel, due to its actual physical and circuit location in the often larger energized circuit, does not merely act as a voltage divider for the energy found in the intended energized circuit. This physical and electrical location, most appropriately during energized operation, is between at least one set of internal, paired and counter-cooperating differentially conducted energy pathways and at least one pair of externally located, approximately the same size (these special Exceptions are the shield electrodes between the electrically reversed differential conduction channels and the electrically common position between the shield electrodes.

This separate third channel also becomes used and shared as a common voltage reference node, not only for the operation of circuits within the inventive embodiment and/or its 813AOC (not shown), but also for At least one set of paired and oppositely cooperating differentially conductive energy pathways during energized operation and at least one pair of externally located, substantially identically sized (with the exception of these special electrodes) electrically opposite differentially conductive pathways of the same circuit In terms of.

The present invention will also minimize or eliminate the mutual interference of unwanted energy parasitics originating respectively from any of the paired and counter-cooperating differentially conducted energy paths connected to the circuit, the various parts within the AOC of the inventive embodiment Spreading circuit energy circuit or voltage balance. The invention will also minimize detrimental and unwanted energy parasitics, releasing subsequent conduction pathways back into the circuitry for escape in the form of shared mode energy or the like to interfere with circuits outside of the AOC's influence.

Referring now to FIG. 3 , the overall structure 9905 can be broken down into smaller pairs of cage-like conductive structure portions to reveal, for example, smaller groupings of various overlapping conductive shield structures as small as 900A further comprising common conductive shield electrode channels 810F-, 800/800-IM, 810B-, individual shielded category groups will almost always be conductively combined and attached together with external common conductive material 6805 or industry standard connection means (not shown) to allow the use of Externally located common conductive areas or channels 6803, which are not among the various external electrically reverse differentially conductive energy channels that can be found attached to or conductively connected to typically applied inventive embodiments of this new invention.

As seen in Fig. 3, in order to regulate the energy path of the paired electrical reverse differential conduction bypass mode such as the inner 855BB and the inner 855BT and the paired electrical reverse differential conduction bypass of the outer 865BB and the outer 865BT as shown in Fig. 3 Through mode energy channels, the larger container 800 "X" stack will contain common conductive universal shield electrode structures 9905 or equivalent in such a manner that various common conductive channel shield electrodes can be added in a predetermined manner to form pairs of 900 "X" structure, which in turn forms a larger overall shield electrode structure similar to that shown in Figure 2.

As long as the common conductive connection material connection 798-GNDA can maintain some physical contact with the common channel electrode edge 805 by extension of the collectively designated electrode extensions as shown in FIG. or electrical contacts, a fully configured embodiment of the invention should work correctly.

In Fig. 3, each of the paired electrical reverse differential conduction bypass mode energy paths as shown in inner 855BB and inner 855BT of Fig. 3 are considered to respectively enclose each common interconnection conduction path, such as common paired electrode shielding Various combinations of electrode channels 810F, 800/800-IM, 810B which sandwich the 855BB and 855BT differential conduction channels which themselves are set back in approximately equal 806 positioning (FIG. 1). In addition, each pair of electrical reverse differential conduction bypass mode energy channels such as external 865BB and external 865BT is also laminated and electrically insulated. Under these conditions, the conductive circuit, when energized, will perform the functions of embodiments of the present invention, such as noise or energy fields in a complementary and shared manner to the just-discussed common conductive shield electrodes and material regions or deposits located internally. Eliminate or minimize, filter and eliminate electrical shock. As seen in FIG. 3, each container 800D and 800E can accommodate an equal number of identically sized differential electrodes, such as inner 855BB and inner 855BT, which are somewhat physically connected to each other within the larger structure 900A. Reverse, however they are oriented, will operate in a generally physically and electrically parallel manner respectively, which allows various energy regulation functions to be maintained.

The larger conductive Faraday common conductive shielding structure 900A with cooperating 800D and 800E each having a cap-shaped structure, when energized within the circuit, is passed through an externally applied common conductive shield connected to an electrical connection attached to the common conductive region 6803. The electrode extension 79-GNDA of conductive electrode material, when attached to the same external common conductive channel area 6803, becomes an electrical(...) which is made of conductive solder material 6805 or other common connection means for conductive attachment or Known industrial methods such as resistance setting, or various known welding methods (not shown) and extending the 79-GNDA by use of internal electrodes, and virtually any generally accepted industrial attachment method (located at the shown) Such as refill soldering, conductive epoxy and adhesives (but not shown) are done.

Thus, any fabrication sequence would be as follows: (excluding dielectric materials, etc.) a differential conduction channel 865BB, then a common conduction channel 810B, then an inner differential conduction channel 855BB, then central and shared common conduction channels Channel electrodes 800/800-IM, then inner differential conduction channel 855BT, then common conduction channel 810F, then outer electrically reversed differential conduction channel 865BT. When the complete structure of this example in Figure 3 is powered on, a voltage reference channel will be generated.

Referring again to FIG. 3 , the portion comprising 810F, 800/800-IM, 810B is now shown comprising a portion of embodiment 9905 of FIG. 3 . Certain common shield electrodes set up as shield electrodes comprising two 798-GNDA electrode extensions (shown in detail in Figure 1), and in turn combined with other elements of the 9905 embodiment, will almost always be placed in combinations , to form an embodiment with two pairs of electrically reversed differential conduction bypass energy channels comprising two subsets of paired energy channels respectively inner 855BT and outer 865BT and inner 855BB and outer 865BB, And are also considered pairs of bypass conductive channel elements that share a common shield electrode energy channel or structure 900A.

Figure 3 shows various elements of an attached cutout version of embodiment 9905, shown in a cutaway view. The concept of a generalized Faraday shield architecture 900A with stacked conduction layered steps containing independent circuits for propagating energy along pairs of electrically differential channels utilizing independent modes of operation bypassing energy propagation is the structure shown 9905 , which comprises a stacked common conductive cage structure 900A as shown, which in turn is made up of a plurality of stacked common conductive cage structures or containers 800D and 800E (each collectively referred to as 800X) that share conductive Cage structures or containers 800D and 800E are in generally parallel but interconnected conductive shielding relationship. Each common conductive container 800 stack 800E includes at least two common conductive channel electrodes 810F, 800/800-IM, 810B. The number of stacked common conductive interconnection shielding electrode cage structures 800X is usually an even integer. Therefore, the number of stacked shared conductive cage structures 900X is not limited to the number shown here, and is usually an even or odd integer.

It is also shown in Fig. 3 that each pair of shared conductive cage structure 800X encloses at least one conductive differential bypass mode channel electrode, which contains two pairs of independently operating electrically opposite conductive differential bypass channels of the same size. mode channel electrodes. The stacked common conductive interconnection shield electrode embroidered structure 800X can almost always be used in combination with independent but paired external differential paired energy channels in discrete or non-discrete arrangements such as but not limited to discrete stand-alone components as shown in Figures 3 and 7A, or other components not shown; such as but not limited to component assemblies, discrete or non-discrete inlays, interposers, modules, substrates or PCBs within silicon integrated circuits local, energy regulation network, etc.

Common conductive channel electrodes 810F, 800/800-IM, 810B are all conductively interconnected as shown at 79-GNDA(s) by solder material 6805 or any other known in the art Other attachment means provide conductive interconnect points that share the conductive energy channel or region 6803 with the outside. Each common conductive channel electrode 810F, 800/800-IM, 810B is formed on dielectric material 801 with the exposed side bands consisting only of dielectric material 801 and not conductive electrode material 799G.

It should also be noted that, as shown in FIG. 3 , the paired sets of electrically reversed differential energy pathways shown are paired, co-sized, and nearly completely overlap each other's main electrode surface area, albeit by a larger The common shield electrode is separated from the 801 dielectric material. They are complementary pairs to conductive appendages that operate electrically in reverse (when energized). These co-sized, complementary pairs of electrically differential (in operation) conductive electrodes or energy channels are always physically separated from each other and located at electrically opposite ends, between the two main conductive portions of the common conductive shield electrode energy channel One charges relative to each other. Since all of these electrodes are planar in shape and appearance, respectively arranged in groups of their own kind, there is symmetry on many levels within the portion effectively utilized by the various parts of energy propagation.

The combined common conduction sandwich multiple common shield electrode channels 810F, 800/800-IM, 810B each conductively connected to a common centrally located common conduction channel 800/800-IM will almost always become like FIG. 3 The same as the external common conduction element or external common conduction energy channel 6803 shown in . Multiple common shield electrode channels 810F, 800/800-IM, 810B will almost always be interposed in such a multi-parallel fashion, providing enveloping of the differential electrode conductors inner 855BT and inner 855BB, while themselves being located The outer 865BB is sandwiched by the inner 855BT, while also maintaining the condition that the common shield electrode channel 810F, 800/800-IM, 810B will pair the complementary pair of electrically reversed differential electrodes 855BB, 865BB of the dielectric body 801 And 855BT and 865BT have a minimum 814C distance separation or "loop zone".

The external conductive elements of 798-GNDA as shown in FIG. 3 will aid in the performance of the electrostatic shielding (not shown) function performed by the common shielding electrode channel 810F, 800/800-IM, 810B, etc. This configuration also facilitates the galvanic connection assembly as just described, which will allow reinforcement of the external common conductive energy pathway or region 6803 to aid in the interconnection of common shield electrodes within embodiment 9905 to assist the different electrode conductors 855BB, 865BB of the assembly 9905 Provides efficient, simultaneous regulation of the energy propagation of each part on the 855BT and 865BT. The energy pathways that are part of these conductive pathways within 9905 are connected externally by conductive connection extensions 812A and 812B structures attached to conductive connection means 890B and 891B. The combined interconnected common shield electrodes 810F, 800/800-IM, 810B of the inner and outer parallel device groupings will also help cancel or eliminate the possibility of escaping through the AOC or into the conduction pathways containing the energy by each part respectively along these disclosures Unwanted parasitic and electromagnetic radiation propagating to portions of the inner pair of differential electrodes 855BB and 855BT and portions of the outer pair of differential electrodes 865BB and 865BT used in active group loads (not shown). The common shielding electrode structure will also facilitate obtaining the same type of propagating circuit energy (not shown) as the physical shielding electrode structure 9905 in FIG. not shown) and a reference image (not shown) to work harmoniously.

At one instant, simultaneously at the same time, the energy of each part of the energy propagation circuit will almost always be provided with an instantaneous high impedance energy blocking function for the AOC with respect to the very same third energy channel and reference pattern Some other inverse and shielding separation of the energy propagation contained within each part, while at the very same instant this high impedance transformation phenomenon is also occurring in a radially opposite manner, at the same instant, and in a complementary manner to Energy propagation occurs with respect to parts located opposite each other, but in an electrically harmonious manner along opposite sides of the same shared larger common shield electrode structure.

This would include a number of generally planar layers such as the kind represented in Figures 2 and 3 of embodiment 9905. The generally planar layers in FIG. 3 include, for example, ceramic dielectric material 801, a 799G conductive electrode material applied or deposited during fabrication. The main electrode surface of each of the common shield electrode layers (of which there are many) lies approximately parallel to the main dielectric material 805 surface of the embodiment layer 9905 (both not shown in FIG. 3 ).

As shown in Figure 3, to facilitate the best possible magnetic field coupling cancellation between the various reverse differential energy channels within a generic Faraday shield structure with stacked conduction level steps, the general rule is that pair and only a minimum distance from each other should operatively isolate the reverse differential conductors. Certain exceptions may apply. However, by operating in a generally opposite or out-of-phase manner, the mutual coupling of oppositely positioned energy channel pairs 855BB and 865BB, along with 855BT and 865BT, enhances mutual cancellation of their respective opposing magnetic fields, while simultaneously cooperating with each other, The electrostatic or Faraday shielding effects that also occur on portions of the energy propagation of the various circuit portions along the same oppositely positioned pair of energy pathways within the inventive embodiment AOC are exploited.

It should also be noted that by placing the two differential conduction channels just described at approximately equal intervals of deposited or applied dielectric material with predetermined elements of a common shield electrode architecture, the resulting inventive embodiments will produce Beneficial energy conditioning of portions of circuit energy on differential conduction channels within the just described AOC. The pairs of reverse differential conduction channels just mentioned also maintain an energized relationship, and they are electrically complementary to each other, and at the same time, they are also electrically reversed, no matter along each pair of differential energy channels 855BB and 865BB And what is the general direction in which the parts residing on the 855BT and 865BT spread the energy.

Such an arrangement as shown in Fig. 3 comprising, for example, 855BB and 865BB and 855BT and 865BT would produce one of two corresponding differential energy channels 855BT and 865BT respectively electrically positioned as energy channels, in this example, Energy channels are electrically positioned between an energy source and an energy-using load separated by the 800-IM central common conductive shield element and other elements, while the remaining individual differential energy channels 855BB and 865BB will also be considered for the energy channels The form is positioned electrically between a load using energy connected back to its source of energy initiator which in some form activates through the parts of the energy transmission with a defined circuit defining the circuit can be considered as a source from energy propagation starting at the initial time of energization of the circuit. That is, two corresponding, adjacent but shielded and separated differential energy channels or differential electrodes - such as one of 855BB and 865BB, are energized in mutual co-active relationship to each other, but physically and electrically shielded architectures, however the actual physical separation maintained ranges from less than 50 mm to a smaller but greater than or equal to zero number, as long as each processes a fraction of the circuit energy relative to the other Spread.

The combined common conduction and conductive connection of the encapsulated multiple common shield energies respectively to the common, centrally located common conduction channel 800 "X"-IM will almost always become like that of the outer conduction element 6803 shown, for example, in FIG. extensions, and will almost always be inserted in multiple parallel fashions, such that the common conducting element will almost always be separated by a distance or "loop region" of a few microns with respect to the complementary, phase-differential electrode, which itself is enclosed by folder. But separated from the extension of the external conductive energy channel or region 6803 such as shown in FIG. 3 by a distance including a dielectric medium.

This enables the electrical or conductive extension of the external conductive energy channel or region 6803 shown in FIG. Efficient and simultaneous regulation of energy propagation on the outer differential conductors 865BB and 865BT of ) 900A. The combined inner and outer parallel arrangement groupings of the common conduction 900A will almost always also cancel or eliminate the possibility of energy escaping or entering the active group bulk load (Fig. not shown) unwanted parasites and electromagnetic radiation from portions of the differential conductors 855BT and 855BB used.

Therefore, an inventive embodiment similarly constructed or fabricated by standard methods for a standard, single, paired wire circuit situation and having a dielectric differential as the only significant change between identically configured inventive embodiments Almost all embodiments and variants of , will almost always produce an insertion loss performance measurement in unexpected and unobvious ways, given the respective known dielectric material responses of the prior art. Comparison of similar inventive units (other than the dielectric material) clearly and definitively reveals the main reason for this result, the circuit performance is a function of the units within the example, the larger shared conductive shielding structure and the conductive connection of the shared external conductive unit Balanced, shared external conduction elements work in combination, using static elimination, physical shielding to effect regulation of energy propagating within circuitry employing various inventive embodiments. Users of various inventive embodiments can use all types of industry standard connection methods and/or conductive materials or structures to conductively connect all common conductive energy channels to each other and/or to the same channel that is generally separated from the differential paired channels. Conductive energy channels located on the outside.

The critical nature of a fully balanced connection of all existing common conductive electrode channels located at or accessible by external conductive energy channel connections, has been disclosed in past papers, in terms of enabling simultaneous performance of multiple and different energy conditioning functions, is considered Crucially, these energy conditioning functions are, for example, power and signal decoupling, filtering, power balancing utilizing electrical positioning opposite to "0". The voltage reference generated on the opposite side of a single centrally located common and shared conductive electrode channel and the principles disclosed in those documents are embodied in an inventive embodiment.

Inventive connection to the same common conductive outer area or path for all common and conductively connected common electrode elements when connected to a separate return path, intrinsic ground, chassis ground or low impedance path that is not a differential conductive path , will almost always allow the energy propagated by the AOC to operate in parallel with the source and load electrical, as well as electrically parallel with other common conductive structures, not only with respect to each other, but with respect to almost any common conductive structure located in the main circuit. With the USS placed or attached in the energized circuit as described, the disclosed shared conduction energy path in parallel with the inner and outer differential energy paths will almost always thereby again enhance or reduce the third conduction/commonization within the AOC The impedance of the conduction channel to allow the propagated energy - the return path can use some of the energy originating from a source.

It should be noted though that usually both the outer and inner differential electrode energy pathways are balanced once the invention is placed on the common conduction area. The addition of externally located common conduction channels, adding back conduction energy channels balances and shifts the self-resonance noted in similar types of inventions. As shown in Figures 2 and 3, those additionally placed common conduction energy paths, labeled (#-IM), attached to the intrinsic central shared image "0" voltage reference plane, will almost always There are several ways to increase the shielding effect of embodiments of the invention. These additionally placed, externally located, shared conduction energy pathways sandwiching their immediate internally located neighbors are for greater capacitance addition to the USS embodiment. These additionally placed common conductive energy channels are placed prior to any application of at least one set of outer differential electrode pairs.

The hysteresis effect within the inventive embodiments is significantly reduced to near zero due to the complementary stresses placed on the material arriving in an almost 180 degree manner that is simultaneously opposite and out of phase on the opposite side of the interposed common conductive energy channel role. These stress management techniques as disclosed are difficult to replicate with prior art components. This is especially true for prior art components configured in feedthrough propagation schemes and applications. The 795"X" used as a conductive electrode extension allows part of the propagating energy to flow through the internally located differential conductive electrode from an external conductive connection structure (not shown) attached according to standard industry devices and methods.

The composition of the new inventive embodiment like 9210 shown in FIGS. 7A and 7B may be that the branch electrodes 7300C and 7300D are direct feed-through versions, which are closely positioned and spaced relative to each other in such a way that the branches of the conductive electrode material 799 Each set of differential electrode planes typically appears as a single in a complete 9210, with the same or slightly smaller volume than that of prior art mechanisms.

However, this is used within a single homogeneous electrode grouping (differential electrodes only or common electrodes only) or two groups (differential electrodes and The small but important branch differential electrode configuration of the common electrode) facilitates more energy transmission and energy propagation capabilities of each group of branch differential electrode planes utilizing the conductive electrode material 799, and facilitates more by occupying a smaller area. Fewer, any single shared or differential electrode originally required layers, which facilitates more circuit conduction connections, while simultaneously handling the additional capacity regulation requirements of multiple normal electrode energy channels, and its energy handling capacity, compared with the number of different The branch differential feedthrough conduction differential electrode of the same size or the same size of the prior art device of the common shielding electrode can handle the capability more efficiently and powerfully.

Prior art devices using these closely spaced branched electrode pairs like 7300C and 7300D shown in Figure 5 will still not be as efficient or energy efficient as the new invention.

For example, when only branched differential electrodes are provided, simply because of the architecture of grouping various branched or non-branched electrodes into a predetermined location, one results in a prior art stack using similar layering and arrangement. Less branched level devices or embodiments of the total electrode.

In e.g. a differential three-channel circuit attachment scheme, prior art devices effectively have double the number of current-carrying electrodes for increasing their energy handling capabilities, newer devices with fewer equal number of branch electrode channels The invention will be able to handle more energy than the prior art due to the predetermined arrangement of both branched and non-branched common and differential conductive electrode energy transfer channels.

So, 7300C and 7300D, i.e. branch differential electrodes 7300C and 7300D together, are defined as at least two single, equally sized energy channels separated by at least one larger third common conductive shield electrode or inner energy channel, The latter is placed in an inset so as to be shared by both the 7300C and 7300D for energy regulation, while still using the same voltage reference as used for the non-branched pair for the circuit reference function in embodiment 9210. They still contain a set of electrically reversed, paired, identically sized conductive electrode main regions 797 "X" for each set of placed electrode material 799 and an energy conditioning embodiment using a common voltage reference as a circuit reference function The planar area that is part of the many variants. This is common in inventions with branched electrode configurations. The two co-sized conductive material or electrode energy channeling regions 7300C and 7300D are still smaller than the common shield electrodes 810F-1 and 2, 800/800-IM-1 and 2, 810B-1 and 2, which together Consists of a set of four distinct but closely spaced pairs, each pair has two units, each thin conductive electrodes 797SF1-A, 797SF1-B, 797SF2-A, and 797SF2-B, respectively in parallel relationship, consisting of a thin Layers of dielectric cover material 801 space them therebetween.

Referring to Figure 7A, it should be noted that, similarly, each common shield electrode energy channel need not consist of a corresponding pair of closely spaced thin common shield electrode energy channel elements, as it is not necessary in all cases to have these The common shielded electrode energy channeling unit has double the total electrode surface area due to the use of this setup, contains a larger common common conductive shielded electrode structure architecture with stacked hierarchical steps the common shielded electrode structure elements do not process energy, Main input or output energy propagation channel functions like those of the prior art. Instead, in most cases, the common shield electrode structural element is used in the like of inventive embodiment 9210 as a third additional energy transfer channel that is not an external differential energy channel (not shown).

Referring now to FIG. 7B, the 9210 stack shown in FIG. 7A is now shown as a fabricated energy conditioning component. Six external conductive connection electrodes, labeled 798-"X" and each specifically identified by their corresponding external conductive connection structures or electrodes, surround the 9210 body. The energy conditioning component 910 includes two external common conduction connection electrodes 798-GNDA and 798-GNDB for all internally located GNDG shield electrodes to an external common conduction that is not any differential external energy path or circuit (not shown). Common conductive connections for energy channels (not shown). Four jumper feedthrough external conductive connection electrodes 798FA, 798FD, 798FC, and 798DB for conductively connecting external differential conductive circuit channels (not shown), and two external common conductive connection electrodes 798-GNDA and 798-GNDB , for conductive connection with a third differential conductive circuit channel (not shown).

In order to further improve and simplify the elements involved in the description, the invention as shown in Figure 7A discloses a single circuit, high-low voltage processing capability within the same energy conditioning embodiment to allow low voltage energy conditioning when required Functions are used to energize circuits as intended, but at the same time act on circuits using high voltage energy pathways, as well as allow regulation functions within the very same multi-layered invention.

Therefore, some other embodiments (not shown) of FIG. 7A suitable for circuit systems that include both low-voltage and high-voltage circuit applications will almost always provide excellent reliability by utilizing a balanced electrode-equipped architecture that Using pairs and smaller (relative to the common shield energized electrodes) electrodes, also using conductive and electrically counter electrodes of the same size and paired differential direct feedthrough configurations and paired differential feedthrough arrangements, For example as shown in Figure 5.

It is desirable to minimize the spacing between branch conductive electrode element pairs 797F4A, 797F4B and 797F3A, 797F3B and 797F1A, 797F1B and 797F2A, 797F2B, generally less than 1.0 mil, but greater than 0, depending on the manufacturing tolerances presently available. The electrode material energy handling characteristics will almost always be conducive to the desired effect, and the dielectric distance 814C between the differential and common energy channel electrodes inserted, eg, 797F1B and 810B-1 and 2 and 797F2A and 810B-1 and 2 Substantially greater than the distance separated by 814-B.

It should be noted that the conduction area size of each paired and branched conducting electrode channel is substantially similar, but preferably the same as its branched pair, therefore, the paired plates 797F4A, 797F4B and 797F1A, 797F1B are only 797F3A, 797F3B and 797F1B respectively. The reverse conductive electrode material mirror image of 797F2A, 797F2B. However, the electrically reversed differential electrode pairs 797F3A, 797F3B and 797F2A, 797F2B will almost always be generally considered to be 797F4A, 797F4B and 797F1A, 797F1B respectively, each almost always relative to its position within embodiment 9210.

A practical embodiment 9210 fabrication sequence for creating one of these specific energy conducting channel structures for one of the discrete variants in FIG. 7 will now be generally described. First, a deposition or placement of dielectric material 801 is made, then a layer of electrode material 799G is placed and positioned to form differential conduction channels 797F2B, then a thin, spaced layer of dielectric material 801 is made 814B, followed by a A layer of electrode material 799 for forming differential conductive channels 797F2A is then placed 814C of application of dielectric material 801, then a layer of electrode material 799G is positioned for forming common conductive shield electrode channels 810B-1 and 2, followed by a A layer 814C of dielectric material 801, followed by a layer of electrode material 799, is used to form the differential conduction channel 797F2B using a very thin layer spaced at the distance of dielectric material 801, followed by another layer of electrode material 799, with For forming differential conductive channel 797F1A, then a layer 814C of dielectric material 801, followed by a layer of electrode material 799G for forming common conductive shield electrode channels 800/800-IM-1 and 2, which is also of embodiment 9210 common conductive cage shared, central shield electrode structure balance point and central common channel point, then a layer 814C of dielectric material 801, then a layer of electrode material 799 to form a differential jumper feedthrough electrode channel 797F3B, This is followed by a deposition 814B of dielectric material 801, followed by a layer of electrode material 799 to form the differential crossover feedthrough electrode channel 797F3A, followed by a deposition 814B of dielectric material 801, followed by a layer of electrode material 799G for Common conductive shield electrode channels 810F-1 and 2 are formed, followed by a layer 814C of dielectric material 801, and then a layer of electrode material 799 to form differential jumper feedthrough electrode channels 797F4B, followed by 814B of dielectric material 801 Deposition followed by a layer of electrode material 799 to form the differential cross-over feedthrough electrode channel 797F4A; finally applied 814 dielectric material 801 to contain some of the main hierarchy and support elements of the physical stack consisting of 9210.

Although the current transfer capability of the branched electrode 7300C and 7300D configuration can approximately double the combined energy of a single paired energy channel, this differential electrode feature will almost always allow for almost any inventive For the voltage dividing function of the embodiment, the crossover type differential conductive electrode further utilizes the circuit voltage dividing architecture of the embodiment of the invention to increase the overall current handling capacity of the embodiment of the invention, while reducing the volume, it is still for the implementation of the invention. Examples of the various 799 electrode material elements of the various 799 electrode material elements maintain a less stressful energy conditioning environment.

Therefore, the new invention is also suitable for electrical systems containing both low voltage and high voltage circuit applications by utilizing a balanced shielded electrode architecture comprising pairs and small (as opposed to common shielded channel electrodes) differential channel electrodes And provide good reliability. In addition, inventive embodiments can also be combined with point systems including various low and high current circuit applications and adapted to such electrical systems. It should also be noted that heterogeneous combinations, whether both of equal size or mixed pairs of differential bypasses and pairs of differential feedthrough energy paths provided for electrically reversed pair operation, can Laminate vertically or horizontally, or in combination of mixed and paired differential circuit channels in the vertical and horizontal directions, using the various energy propagation modes described.

So almost all of the embodiments of the invention that are similarly constructed or manufactured from standard devices and used in standard, paired line circuit situations and have dielectric differential as the only significant change from similarly arranged inventive embodiments The embodiments and variants will almost always result in an insertion loss performance measurement in a manner that was unexpected and unobvious heretofore examining the response of each known dielectric material in the prior art.

This comparison of a similar type of inventive unit (rather than the dielectric material) clearly and definitively reveals a larger cause or factor leading to this result, circuit performance is the use of electrostatic shielding for parasitic elimination, physical shielding and for influence New common conductive shield structure and external conductive connection unit working in combination for regulation of energy propagated within a circuit system employing said invention. Therefore, discrete or non-discrete embodiments using the disclosed common conductive shield structure and external conductive connection elements and using dielectrics that have been classified primarily for certain electrical adjustment functions or results will almost always be found to be Elements of inventive embodiments constructed with equivalent elements will almost always achieve more unexpected beneficial properties than previously limited knowledge of the use of the electrode materials used. This includes virtually any possible layered application using non-discrete capacitive or inductive structures capable of incorporating variations of inventive embodiments within, for example, fabricated discrete silicon chips, or supercapacitor applications, or even atomic-scale energy-regulating structures .

Returning to FIG. 7A , separation distances 806A, 806, 814, 814A, 814B, 814C, and 814D (not all shown) of dielectric material 801 or separation equivalents (not shown) are almost always device dependent. . Looking at the cross-section in Figure 7A, other important longitudinal and lateral distance separation relationships (not all shown) can be noticed, namely the predetermined electrode and conductive channel stack arrangement shown (not all shown).

Note that almost all separation distances for components within a device such as the 9210 are relative to the various electrode channel configurations contained within the device, although for many circuit energy conditioning applications it is important to maintain control of the balance within a particular system circuit It is not strictly necessary that these material distance relationships should be uniform in the embodiment spacing considerations and distributions. Large differences or inconsistencies in material volume or distance between these pairs have been tested to be detrimental to circuit balance for most general electrical applications of the invention.

For example in FIG. 7 , various isolation distances 814 "X" result in an application-dependent, predetermined, three-dimensional distance or spacer filled with 801 material, such as stacking 800E with various differentials in common electrode energy path container 800, respectively. as measured between moving electrodes, branch electrodes, or other electrodes.

Separation distance 814A (not shown) is between multiple adjacent common electrode material channels, such as common electrode channels, and, for example, a spacer containing thin dielectric material 801 or a spacer equivalent (not all shown) or other type of spacer ( Not shown) common electrode channel image shields 800/800-IM- have generally small parallel adjacent regions with three-dimensional separation distances between them.

Separation distance 814C is the longitudinal separation there is between each common electrode channel, such as a common electrode channel, and each differential electrode channel, such as a differential electrode channel. Separation distance 814B is the longitudinal separation between branch differential electrode channels, such as branch differential conductive channels 797F1-A and 797F1-B and 797F2-A and 797F2-B.

These unique combinations of dynamic and static forces (not shown) occur simultaneously within the container of the shielded electrode structure and, due to its use as a conduit, act on a third energy channel, distinct from the differential channel. Thus, by using and combining various physical element distances and energy field separations between conductive energy channels, dielectric materials, non-conductive materials, and dynamic energy relationships occurring within energized circuit channels are provided within the scope of energy regulation capabilities .

Unbalanced circuits in prior art energy conditioners that do not operate in a reverse differential environment will almost always produce various degrees of hysteresis effects, material memory effects, angular stresses, Thermal stress-induced non-uniform expansion of various materials, their effective pressure-dividing capabilities are all reduced by the mutually inverse complementary energy propagation that occurs within embodiments of the present invention.

Referring now to Figures 4 and 5, various configurations of pairs of dielectric/electrode layers or pairs of electrode layers can be seen. For Figures 4 and 5, these electrode pairs or electrode layer pairs each have at least two portions of differential electrode channels and dielectric material 801 (not shown).

The differences between some of these structures are well represented in FIG. 4 . Figure 4 is a top view of two adjacent, top-to-top stacks 7200A and 7200B with different feed-through differential electrode channels 799F1A, 799F2A and 799F1B, 799F2B. The setups collectively referred to as 7200A and 7200B are collectively referred to as the cross-feedthrough differential electrode channels 799F1A, 799F2A and 799F1B, 799F2B because energy propagation through each channel must cross energy propagation through the other, but intervening between this action In between is a common shield electrode channel, this third energy channel (not shown) type, not these electrical reverse bridge feed-through differential electrode channels 799F1A, 799F2A and 799F1B, 799F2B, which are all located in the invention 813AOC ( not shown) so that the general invention (not shown) can provide and utilize a portion of energy regulation from this positioning and energy flow effect.

The relative spacing dimension 814-"X" of the pair's bridging portions or cross-sections and fast kinks for energy propagation (not shown) has a positive effect on reducing or minimizing the circuit section impedance within 813AOC (FIG. 7A), And due to the concentration effect of propagating energy on each other along the cross-feed-through differential electrode channels (not shown) 799F1A, 799F2A and 799F1B, 799F2B pairs result in a unity impedance, thus, unlike the feed-through pair propagating The individual kink effects that occur with propagation in the opposite direction and in the same direction somehow enhance the interaction with the cancellation effect compared to the method. Kinked or jumper electrically reversed differential electrode channel pairs take advantage of the very short distance (defined by industry function ) (not shown) and allow them to take full advantage of this beneficial electrical modulation effect for every circuit (not shown) using the technology within almost any of the new inventive embodiment variants.

The two side-by-side stack configurations, broadly designated 7300A and 7300B, generally contain so-called electrical inverse feed-through differential electrode channels, the latter being represented here by 799SF1A, 799SF2A (not shown, but below 799SF1A) and 799SF2B, 799SF1B (not shown, but below 799SF2B) represent that because the electrical reverse feed-through differential electrode channel has entry/exit points for each energy portion, they line up with each other and join just described The 79SF1A, 79SF2A and 79SF2B, 79SF1B conductive electrode extension pairs. The energy passing through each of the differential electrode channels 799SF1A, 799SF2A and 799SF1B, 799SF2B propagates into a larger area of the differential electrode channels 799SF1A, 799SF2A and 799SF1B, 799SF2B such that in opposite directions through the differential electrode channels 799SF1A, 799SF2A and 799SF1B, The energy spreading section of the 799SF2B provides various simultaneous energy conditioning effects on the energy spreading to various sections within the AOC.

In the past, passive components containing layered structures have been fabricated by forming relatively thin sheets of dielectric material. During its more flexible or "green" state prior to firing, the dielectric sheets are silk-screened with refractory or conductive metal or metal deposits to define thin conductive electrodes in selected areas . Lamination of multiples of these dielectric-based sheets with conductive electrodes on them, followed by firing, forms the sheets into a rigid and dense, essentially monolithic shell structure with embedded differential and common The conduction electrode has a predetermined dielectric interval with the predetermined layered sequence of the already formed differential common conduction electrodes. In feedthrough operation using current flowing through a common plate electrode, the inherent resistance of the thin electrode plates results in at least some loss of energy in the form of heat, although in such conditions as with the shortened to outer conductive region of the present invention or other types of The bypass configuration of the attached common conductive plate can be considered to be minimal. Plate power losses, and the resulting plate heating in feedthrough type operations, are a function of electrical energy. If the plate energy is high enough, even for short periods of time, plate heating sufficient to cause electrode/plate failure can occur, especially localized destruction of thin electrode plates and/or their connections to conductive terminal parts. Prior art filter capacitors used in pacemaker and shock generator applications often experience relatively high pulses in peak currents and are thus susceptible to overheating and related failure, which is a good illustration of the problem. example of. One way to solve this problem is to increase the thickness of the electrode plate layers within the layered structure of the multilayer circuit regulation assembly. However, a significant increase in layer thickness is not beneficial, or impractical with existing electrode plate-making and wire-mesh isolation techniques. Excessively thick layers or boards lead to delamination and associated reliability issues. In this regard, it is important for electrode plates to have a thin, continuous structure, with selected dielectric particle growth penetrating and integrating the entire structure into a rugged monolithic structure. Another approach is to increase the total surface area of the conductive electrode plates, but this concept requires a significant increase in the physical size of the structure, which is incompatible with many circuit applications.

One method of fabricating a bypass or feedthrough device similar to an embodiment of a multilayer industrial-sized cell is the same as conventional methods of fabricating multilayer ceramic capacitors. Since this method is familiar to those skilled in the art, it will only be briefly described. Dielectric components are constructed by casting a thin layer of a fine dielectric constituent material such as barium titanate suspended in a matrix including a binder. The "green" ceramic surface is patterned with the desired shape using electrodes that constitute pigments. The pigment usually contains a metal such as palladium. The patterned green ceramics are stacked to provide the desired number of layers, coordinating the patterns of adjacent layers to achieve the desired overlapping conditions. The stacked layers are separated into individual cells to expose the base portions on opposite ends of the burn-in chip. The separated units are then joined by firing at a first temperature and then sintered into a monolith at a higher temperature. Connect the end fittings to the exposed base portion at one end and the base portion at the other end, respectively. Terminations are formed by various known methods, including vapor deposition methods to provide electrical and mechanical bonding to the exposed electrode bases on opposite ends of the monolith, followed by the application of one or more metals in the sputtered layer. layer so that it can be soldered to the motherboard. The end connector can be extended to the end edge when surface mounting is required.

Alternative termination methods include applying an outer layer of silver followed by carbon, with or without a metal layer between the carbon and silver layers. Layer material elements are also compatible with available and future processing technologies. The present invention overcomes the problems and disadvantages encountered in the prior art because the present invention provides an improved circuit conditioning capability with built-in electrode layer/plate patterns capable of handling significantly higher RF levels in certain intended applications. Spread sections without adding significant volume.

Ideally, the common conductive electrode layer shares multiple points or conductive channels of a common connection, which are interconnected or connected to the same external conductive region or external common conductive channel when energy is conducted in parallel or affects the common element. The invention of electrification, as a whole composed of units of each layer, has multiple complementary dynamic energy channels of different densities or degrees, and these complementary dynamic energy channels can be seen as three-dimensional and multi-dimensional in terms of simultaneous energy transmission directions. direction.

The movement of energy through the whole of the present invention is different relative to the energy transmission channels or movement channels of the single layered units of the present invention, but the occurrence of the two types of movement or influence is complementary, dynamic, and simultaneously through There are two energy transfer channels, non-parallel and parallel. As these parallel and non-parallel energy transfer movements occur simultaneously within the present invention, they affect circuit function. These moves are always dynamic and affect some or all layered elements simultaneously.

For example, when used as a capacitive energy conditioner and placed in a differential application and attached to three independent energy channels or placed in a circuit where a common electrode channel is attached to an independent common conductive channel, The current load carried by each energy conditioner electrode layer is a function of the number of layers used in the capacitive energy conditioner.

That is, using twice the number of electrode layers reduces the current carried by each layer in a given circuit application by half. So, by doubling the number of electrode layers, the electricity that must be dissipated as heat by each layer is reduced by three quarters.

Correspondingly, a capacitive energy conditioner with twice the number of electrode layers is capable of much greater current handling capability without damage due to heat, based solely on power dissipation. In the past, however, doubling the number of energy modifier layers required a corresponding increase in the volume of the capacitive capacity modifier, and the required volume was not suitable for some operating environments.

The present invention recognizes that the number of electrode layers in a capacitive energy conditioner can be effectively doubled to provide significantly improved current handling capabilities, but in high voltage applications the required dielectric spacing is thicker and if used only for common With the discrete layer technology of the conductive electrodes, there is only a small increase in the physical size of the capacitive energy regulator. The same goes for the physical size of the capacitive energy regulator if using discrete layer technology for only differentially conductive electrodes. The same goes for the physical size of the capacitive energy regulator if separate layer technologies for the common conductive electrodes and for the differential conductive electrodes are used together.

Turning to FIG. 6, the electrodes 800/800-IM in FIG. 1 are taken as a common close paired symmetrical electrode assembly or separated by a very thin layer 814B of the same size, in this example consisting of dielectric material 801 The 800/800-IM-1 and 800/800-IM-2 electrodes are each half a discrete pair of 800/800-IM placed into the double-layer unit 800/800-IM-1 and 800/800-IM as described above IM-2 electrode. This is achieved by subdividing, for example, the 800/800-IM electrode hierarchy, whether differential electrodes (not shown) into closely paired symmetrical electrodes and identically sized very thin layers 814B of dielectric material 801 for isolation unit, the dielectric material may be different from the material 801 depending on the properties of the 814B thin layer, which needs to preserve not only the ability of the electrode element as a whole itself, but also the ability and reliability of the entire energy regulator to resist electric fields or energization Operational energy in and out, including anomalies such as voltage pulses and electrical shocks. The distance between discrete electrodes is generally greater than the range of zero to 25% of the separation distance, which is either pre-planned, or the normal distance between any two discrete electrodes, or any two Normal electrode spacing between discrete pairs of a differential electrode set and a common electrode set isolated from each other.

In this configuration, each active layer element 800/800-IM-1 and 2 as a whole is placed in the desired normal dielectric spacing relationship, with a corresponding differential electrode (not shown).

For a given number of common electrode layers such as 800/800-IM-1 and 2 or 800"X"-1 and 2, the only increase in the overall size of the energy conditioner involves using 800 /800-IM- Minimum thickness separation 814B between specific dielectric material like 801 or other dielectric material between 1 and 2.

Referring now to the various elements shown in FIG. 5 . U.S. Patent No. 5,978,204 discloses a layered capacitor architecture comprising multiple active ground electrode plates stacked and built into a dielectric housing such as ceramic, each active ground electrode plate Bounded by a pair of closely spaced conductive plate elements, this significantly increases the total area of each electrode plate and thereby correspondingly increases the current handling capability of prior art capacitors.

Before further explaining how to further improve and simplify certain elements of the cited patent number 5,978,204, a portion of the new invention embodiments as shown in FIG. High-low voltage handling capabilities, these embodiments are not shown in Figure 7, nor are they shown as 9210 in Figure 7, they are provided in the form of varying but basic shield electrode energy conditioning embodiments or structures Yes, allowing the low voltage energy conditioning function to be used both for the intended energized circuit and for the circuit using the high voltage energy path, and allowing the conditioning function within the same multi-layered invention if desired.

Figure 5 shows electrically inverted differential electrode pair 7300C and 7300D. Each fully differential electrode 7300C and 7300D contains discrete electrodes 797SF1-A and 797SF1-B and 797SF2-A and 797SF2-B respectively, which make up 7300C and 7300D, which are grouped and paired, but electrically fed directly through the differential electrode energy The channels are structurally similar to the electrically inverted differential electrode pairs that comprise part of the embodiment 9210 of Figure 7A. Each of the discrete differential electrodes of the parent 797SF2 and 797SF1 are located in such close proximity within the inventive embodiment that the discrete differential electrode pairs 797SF1-A and 797SF1-B and 797SF2-A and 797SF2-B, when electrically defined, each respectively As a single capacitor plate 7300C and 7300D. 79-SF1 and 79-SF2 of FIG. 5 are simple extensions of the constructed electrode shape and are used to represent conductive electrode extensions that allow external conductive connection structures (not shown) to be attached by standard industry devices and methods. The portions of propagating energy arriving at (shown) flow through the internally located differential conduction electrodes.

These two-plate elements 797SF1-A and 797SF1-B and 797SF2-A and 797SF2-B cooperatively define two differential conduction channel electrode parent 7300C and 7300D electrode elements. The electrode surface area will always result in a corresponding increase in the circuit handling capability of the energized circuit without significantly increasing the overall volume of the overall energy regulating structure (not shown).

In order to further define the current state improvement over the prior art, an inventive embodiment (not shown) allows the use of these differential electrode pairs 797SF1-A and 797SF1-B and 797SF2-A and 797SF2-B, which are placed between The location of the 814B separations, only a few microns apart from each other, will therefore always allow some of the propagating energy to pass through these differential conduction channels to take advantage of the closely positioned discrete pairs 797SF1-A and 797SF1-B and 797SF2-A and 797SF2-B, in In an electrical circuit (not shown), each set of discrete electrodes will appear as a single differential conductive electrode, and this does not require the provision of an additional common conductive shield electrode. The advantage of using pairs of discrete electrodes is that the additional area obtained by using the additional electrodes is comparable to that of a non-discrete paired set of electrically reversed differential conduction channels 7300E and 7300E (not shown) that would not have this feature. The current handling capability of the two electrically reversed differential conduction channels 797SF1-A and 797SF1-B and 797SF2-A and 797SF2-B electrode elements will always be significantly increased compared to the current carrying capability.

Although the configuration of discrete electrodes 7300C and 7300D approximately doubles the current carrying capacity of a single paired energy channel grouping, this differential electrode feature will almost always also allow almost any The voltage dividing function of the inventive embodiment, which has a bridge-type differential conductive electrode, further utilizes the voltage dividing architecture of the circuit of the inventive embodiment to increase the overall current handling capability of the inventive embodiment itself, while still containing the inventive embodiment The various 799 electrode material elements maintain a less stressful energy conditioning environment.

Turning to FIG. 7A, the dielectric material 801 spaces, or spacer equivalents (not fully shown), identified as 806A, 806, 814, 814A, 814B, 814C, and 814D (not fully shown) are almost always separated by device dependent. Looking at the cross-section of Figure 7A, the observer will notice other important longitudinal distances and longitudinal separation relationships (not fully shown) of the predetermined electrode and conductive channel stack arrangements (not fully shown) shown.

Note that all spacing distances of components within a device such as the 9210 are relative to the various electrode channel configurations contained within the device, although not strictly necessary for many energy conditioning applications, in order to maintain balance within a particular system circuit Controlling, these material distance relationships should be uniform in embodiment spacing considerations and distributions. Experiments with large variations or inconsistencies in these paired amounts or distances of material have shown that they are detrimental to circuit balance for most general electrical applications of the invention. The use and versatility of shielding structures with discrete electrodes can be envisaged, for example in FIG. 2 . In FIG. 2, the separation distance 814 shown in FIG. 3 can be used for one application—relative, required separation or separation as measured between common shield electrode energy channel vessels 800C, 800D, 800E, 800F, respectively. A predetermined three-dimensional distance or area. FIG. 2 can also contain one or a set of discrete differential electrodes, such as 800F including common shields 810B-1 and 2 and 820F-1 and 2 and including differential conductive channel 797SF2 shown in FIG. Adjacent regions on the surface or "skin" of conductive material that affect the movement of the parts that propagate energy, such as in 810F-1 and 2 and 820F-1 and 2 or containing 810B-1 and 2 and 820B1 in one example and 2—in 800F-1 and 2—and containing differential bypass electrode channels 865BT as shown in FIG. Or adjacent regions on the "skin" which affect the movement of parts of the energy propagation which can also be found in such defined regions in the energized state in other examples (not shown).

Separation distance 814 is the three-dimensional separation distance of the spacing between adjacent channels of common electrode material or adjacent very small parallel adjacent regions, such as common electrode channel 820B and common electrode channel pattern shield 850B/850B-IM-containing Thin dielectric material 801 or spacer equivalent (not fully shown) or other type of spacer (not shown).

Separation distance 814C is the longitudinal separation between a common electrode channel, such as common electrode channel 820B-, and a differential electrode channel, such as differential electrode channel 865BT. Separation distance 814B is the longitudinal separation between discrete differential conductive channels, such as discrete differential conductive channels 797SF1-A and 797SF1-B.

The unique combination of these dynamic and static forces (not shown) occurs simultaneously within the confines of the shield electrode structure and, due to its use as a conduit, to a third energy channel distinct from the differential channel. Thus by using and combining various rules of physical element distance and conduction energy pathways, dielectric materials, energy field spacing between nonconductive materials, and dynamic energy relationships that occur in energized circuit pathways, a novel and practical circuit is provided Energy regulation ability.

Internally, unbalanced circuits in prior art energy conditioners that do not operate in a reverse differential environment will almost always produce various degrees of hysteresis effects, material memory effects, angular stresses, The expansion caused by the various thermally stressed materials, and their ability to divide pressure are all reduced from the mutual counter energy propagation that occurs omnidirectionally in the inventive embodiments, in contrast.

Thus, within an inventive embodiment, the hysteresis effect is significantly reduced to near zero due to the complementary stress placed on the other side of the common electrode energy channel energy placed in between after the material arrives at almost 180 degrees role. These disclosed stress management techniques are very difficult to replicate with prior art components, if any. This is especially true for prior art components and applications configured in feedthrough propagation. The 79S "X" used as the designation for the conductive electrode extensions allows the sections to propagate energy flow through the internally located differential conductive electrodes from the external conductive connection structures (not fully shown) attached by standard industry devices or techniques .

The new invention of 9210 in Figures 7A and 7B can be constructed of direct feedthrough versions of branch electrodes 7300C and 7300D positioned close to each other and spaced apart so that the differential electrode planes of each component of conductive electrode material 799 generally appear to contain A complete 9210 with the same or slightly smaller volume than prior art structures, but with higher energy handling capabilities than prior art devices of the same size containing different numbers of branched differential feedthrough conductive differential electrodes of the same size The energy-handling function is more efficient or greater.

The difference is that the new invention uses fewer layers and occupies a smaller area, but allows more energy transmission or energy propagation capabilities, allows more circuit connections, and simultaneously handles the energy regulation needs of multiple energy channels. This small but important setting within the new invention configuration is 9210 in Figure 7A and so on.

Due to the electrode positioning architecture, prior art devices utilizing these closely located branch electrodes to energy condition 7300C and 7300D are not as efficient or energy efficient as a similarly layered prior art stack with approximately 1/3 less A new invention of the branching hierarchy of the central electrode. While prior art devices would effectively have double the number of current-carrying electrodes to increase their energy handling capabilities, the new invention with about 25-30% fewer branched electrode channels would be able to process more energy than prior art devices. More energy is due to the predetermined arrangement of both common and differential conduction electrode energy transfer channels, branched and non-branched.

Thus, 7300C and 7300D together are defined as at least two single, equally sized energy channels separated by at least one larger third common conductive shield electrode energy channel located in an intermediate position between 7300C and 7300D Or shared, for energy regulation and for the voltage reference used in the circuit reference function in the embodiment.

Branched differential electrodes 7300C and 7300D comprise a set of electrically opposed, paired, similarly sized regions of conductive material for use as part of many variations of energy conditioning embodiments using a common voltage reference for circuit reference functionality. These two similarly sized conductive material or electrode energy regions 7300C and 7300D are still smaller than common shield electrodes 810F-1&2, 800/800-IM-1&2, and 797SF2-A and 797SF2-B, which all collectively consist of four pairs of different The closely spaced thin conductive electrode elements 797SF1-A, 797SF1-B, 797SF2-A, 797SF2-B, each containing two units, are in a roughly parallel relationship and are respectively composed of a thin dielectric shell Material 801 spacer (see Figure 7A, replace 797SF1-A, 797SF1-B, 797SF2-A, 797SF2-B with 797F1-A, 797F1-B, 797F2-A, 797F2-B respectively)

Referring to Figure 7A, it should be noted that, similarly, each common shield electrode energy channel also contains a corresponding pair of closely spaced thin common shield electrode energy channels, since in some configurations the common shield electrode structures of these shield electrodes It is advantageous for the element to have double the total electrode surface area. As a result of using this configuration, in some subsidiary configurations, architectures comprising a larger common common conductive shield electrode structure with stacked layered steps will also handle the primary input or output energy propagation channel function. The common shield electrode structural element is in most cases used as an energy transmission channel (not shown) for a third additional non-external differential energy channel in inventive embodiments 9210 and the like.

Turning to Figure 8, the shown embodiment 9915, is a new concept of opposite element symmetric balanced electrode pairing, used for various balanced and paired and same size electrically reversed differential conduction channel concepts, however in the opposite element Balance pairing status.

Symmetrically balanced electrode pairs with respect to the elements are suitable for larger sandwiched shared conduction channels as well as differential conduction channels, involving the continued improvement of a new series of discrete multifunctional energy regulators, which are different from the complementary types mentioned above. The size principle will now relate to another variant concept of this new series of discrete multifunctional energy conditioners.

Fundamentally, the present invention forms various internal electrode patterns 799 and 799G such that the main electrode area (not including e.g. extension 79-GNDA or 812A) is for multiple grouped and individual and paired internal electrodes In positions relative to each other, their positions gradually (or gradually) decrease from the center portion of the surface of the dielectric body 1 along the lamination direction of the ceramic sheets. Alternatively, the internal electrode pattern (excluding e.g. extension 79-GNDA or 812A) is formed such that the area occupied by the conductive major surface regions (not shown above) of the plurality of internal electrodes is separated from the central The position of the common shield electrode tapers (or steps) symmetrically in two outward directions. The pairing in this case is between splits 800-1 and 2/800-IM-1 and 2 central common shield electrodes.

In larger stacks of inventive embodiments (combined 5 common and differential energy channel stacks), such as 9915 of FIG. Surface and observe a pair of electrical reverse differential conduction channels 855BB, 855BT, 865BB, 865BT, 875BB, 875BT, 885BB, 885BT (they may all be branch electrodes), and a difference can be observed (for the sake of concept simplicity, -9915 The other material elements are omitted in this part of the description), the difference is that there is a first pair of electrical reversed Differential conduction channels 855BB and 855BT.

It can be seen that a third and fourth reduced or third and fourth enlarged next set of electrically reversed differential conduction channels can be placed, such as 865BB and 865BT, which are then placed to sandwich the entire previously arranged central Common shared electrode channel 800/800-IM, first pair of identically sized electrically reversed differential conductive channels 855BB and 855BT, and first and second common conductive shield energy channels 810F-1 and 2/810B-1 and 2.

Thus, the device or embodiment is proportionally and symmetrically balanced with proportionally smaller or larger third and fourth differential conduction channels 865BB and 865BT of the same size, as can be seen, they are still flat, but most Fortunately, the fourth and fifth shared conduction-shielding energy channels 820B-1 and 2/820F-1 and 2 etc. of the subsequent double-teaming retreat 40, 41, 42, 43. An additional inventive variant 9915 is provided which still follows the partial use of a common multifunctional shared conductive shield structure with a layered conduction layer stepping Faraday shield structure plus two electrically reversed differential energy channels (855BT and 855BB in 9915) general principle.

This concept can also be used to include simultaneous energy transfer along paired and electrically differential channels 855BB, 855BT, 865BB, 865BT, 875BB, 875BT, 885BB, 885BT using bypass or feedthrough (not shown) energy conduction (not shown). A common multifunctional shared conductive shielding structure (not shown) for circuits propagating.

Therefore, symmetrically matched, identically sized pairs of differential conductive channels 855BB, 855BT, 865BB, 865BT, 875BB, 875BT, 885BB, 885BT of a predetermined pattern, physically parallel to each other and positioned relative to each other, are located in the central common conductive channel. Shielded Energy Channels 800/800-IM-1 and 2 are reversed and can be placed together with e.g. fallback schemes 40, 41, 42, 43 so that 855BB, 855BT, 865BB, 865BT, 875BB, 875BT, 885BB, 885BT do not have to be Corresponding adjacent differential electrodes (eg 885BT and 875BT) placed in front of it are matched. The disclosed principle concept of relative pairing is that these matched, physically parallel, identically sized pairs of differential conduction channels 855BB, 855BT, 865BB, 865BT, 875BB, 875BT, 885BB, 885BT differ primarily in size. matched relative to each other (855BB to 855BT, 865BB to 865BT, 875BB to 875BT, 885BB to 885BT), but not necessarily matched in size to adjacent ones (e.g., 855BB to 865BB and 875BB and 885BB), in contrast, need not be relative to previously deposited conductive channel neighbors (by at least one common conductive shielding energy channel 830F-1 and 2, 820F-1 and 2, 810F-1 and 2, 800/800 -IM-1 and 2, 810B-1 and 2, 820B-1 and 2, 830B-1 and 2 separated).

So a relative pairing concept and fallback scheme is even extended to common channel electrodes 830F-1 and 2, 820F-1 and 2, 810F-1 and 2, 800 including shield electrode structural elements as fallback schemes 44, 45, 46, 47 /800-IM-1 and 2, 810B-1 and 2, 820B-1 and 2, 830B-1 and 2, as long as each inventive embodiment variant can contain a certain part of various other materials and methods like 801 materials Place conceptual elements, 814-"X" relative to setbacks (814A, 814b, 814C, 814D, etc., if desired) or various discrete forms of connection elements like 798-GND "X" (e.g. although not always are used in non-discrete form), they are deposited at fabrication in the critical, self-explanatory common shared electrode channel 800/800-IM (800/800-IM is always at the starting point relative to any subsequent layering or deposition works, but doesn't have to be a manufacturing origin).

As long as the various relative pairs of complementary reverse adjustments are matched and symmetrically paired and other distance relationships and setbacks in relative paired or relative balanced symmetric relationships are maintained, the inventive embodiment variants will be electrically adjusted in a predetermined manner Operate various energy adjustments required by users. This relative balance, relative "double pair" or relative "mirror" element matching or pair balance, is a novel improvement over previous embodiments such as the 9905, and is a structural improvement that will produce many unexpected results as long as A general Faraday shielding architecture with stacked conduction level steps comprising pairs of electrically reversed differential conduction channels would be feasible without compromising the electrostatic shielding function (not shown). This relative pairing concept is also applicable to embodiments of the invention described in other commonly-owned and co-pending applications that do not use external, paired electrically reversed differential conduction channels. It should be noted that 9915 may be a tapered inversion of back-off schemes 40, 41, 42, 43, 44, 45, 46, 47 or any possible back-off variant, and is fully contemplated by the applicant.

When energized, the combination of the external trace paths, conduction channels and conductors, etc. of the previously predetermined branch electrode layering device with one of the many embodiments fully described or not in this document can construct a complete inventive configuration . Without limiting the invention, an example of an assembly according to the invention is shown below in FIG. 9 .

The circuit and electrodes in Fig. 9 simply and schematically represent a dual channel, as shown in the figure, it consists of a predetermined conductive material attachment (not shown) positioned outside the predetermined device and various branch electrodes constituting an embodiment of the invention consist of. These conductive circuit attachments can be made regardless of the packaging of the embodiments, since the discrete or non-discrete embodiments of the predetermined conductors themselves are not actually layers attached to the external structural channels utilizing the inventive connection stub electrode portions. The parts involved in the circuit are listed below:

The 300 branch electrode channels, the differential electrode layers for the common power supply, and the branch electrode shields for the common connection and common load source, are combined into an overall circuit consisting of energized and The attached configuration is generated.

301 "Power In" Schematic representation of the conduction energy channel or Vcc.

302 Schematic representation of a highlighted area of a dynamic function.

303 Schematic representation of the attachment point and/or structure of a non-common, differentially conductive branch electrode to an external conductor having approximately 1/2 the energy fraction from a single external power path (into "A" and "A" B" branch of the energy portion of the differential branch electrode) is delivered such that this portion of energy enters the layered electrode arrangement from 303 and 309 in opposite directions.

304 Schematic representation of the energy conditioner formed between the differential branch electrodes and the common return branch electrodes/channels.

305 represents a schematic representation of the "0" voltage circuit reference of two differential branch electrodes with respect to shielding branch electrodes or return branch electrodes 329, 330, 331 and the resulting shielding effect.

306 Schematic representation of the branch points where the energy path enters the branch electrodes 313 , 314 .

307 Schematic representation of the inherent inductance of the common differential conduction stub electrodes.

308 is a schematic representation of the intrinsic resistance of the common differential conduction branch electrodes.

309 Schematic representation of the attachment point and/or structure of a common, differentially conductive branch electrode to an outer conductor having approximately 1/2 the energy fraction from a single external power path (into "A" and "B") The branch of the energy portion of the "differential branch electrode") is delivered such that this portion of energy enters the layered electrode arrangement from 303 and 309 in opposite directions.

310 represents the same attachment point of the differential conduction branch electrodes and/or the highlighting of the dynamic function of the structure 309 .

311 forms a group of layered differential branch electrodes and common branch electrode shielding elements.

312 In order to explain the layering in the circuit part, the layering invention with the branch electrode setting removed on one side.

313 Differential branch electrode "A".

314 Differential branch electrode "B".

315 Representation of the connections of the circuit with the recombination points of the branched parts of the energy transfer.

316 Representation of the connection of the circuit to the (optional) recombination point of the branching portion of the energy transfer.

317 receives loads that are partially used by energy.

318 A representation of the intrinsic resistance of the conduction stub electrodes.

319 is a representation of the inherent inductance of the conductive stub electrodes eliminated.

Highlighted areas of dynamic functions within 320 305 areas.

321 is a representation of the line-to-line capacitive element formed during power-up.

322 conducts energy back to path VSS.

323 represents the dynamic function area in the invention area 312 .

324 Portions of energy are returned from the feedthrough common conduction branch electrodes and loads to the exit point of the source.

325 share the inherent resistance of the differential conduction branch electrodes.

326 A feed-through return portion of the energy returns from the load entering the common conduction stub electrode back to the entry point of the source.

327 Lines formed during energization to common stub electrodes - energy conditioners.

328 represents the same attachment points and/or structures of (1) conductive branch electrodes 303 .

329 shared conduction branch electrodes.

330 common conduction branch electrodes.

331 common conduction branch electrodes.

The circuits and functions in the two-wire circuit shown in Figure 9 do not have the third channel connection selected. The inventive circuit and device function shown in FIG. 9 functions like capacitive and inductive cancellation in smaller and larger groupings of two independently operating groupings of stacked, branched electrodes 329, 330, 331 and 313 and 314 in a predetermined arrangement. works like a shielded transition regulator. These two sets of branch electrodes are still shared, and in this example, they are only differentially driven by the sense of direction of the characters. Therefore, a large ideal energy regulating circuit between Vdd and Vss is produced, with the return shielded by the common branch electrode of the circuit of the present invention, so that some components of the main circuit have dual functions, both as a part of the energy return, and as There is a voltage pattern shielding the central common electrode 330 .

In order to optimize decoupling performance, the inventive circuit and devices should be placed as close as possible to the load 317, which will make the floating inductance and resistance (not shown) associated with the internal electrode portions 314, 313 of the circuit traces 301, 322 ) is minimized, thereby fully exploiting the performance of the inventive circuits and devices, regulated by their propagation by the portions of the energy path occupied therein. In this example, the portions of the energy in the circuit will work in a bypass propagation mode with respect to all processing of the respective physical differential bypass branch electrodes 313 and 314, and will be in a feedthrough relationship, where the device pass is now also The central common branch electrode 330 and the sandwiching branch electrodes 329, 331 used as part of the energy return 322 work entirely through the device as they return to the source (not shown). It is also possible for the shielding branch electrodes of the attached configuration to bypass energy pathways (not shown) which may be connected through 325 and 326 termination structures or connection points 325 and 326 between the source (not shown) and the load 317 The propagating energy on , establishes an alternative third channel and one of lower impedance and resistance, and lets the undesired portion of the energy flow back to the source from the common branch electrode that is now also part of the energy return 322 (not shown out).

It should also be noted that the current path of the energy portion under regulation will work in bypass mode with respect to all processing of the respective physical differential bypass branch electrodes 313 and 314, and will be in feed-through relationship as it passes through the current The filter 300 of the central common branch electrode which is also fully used as an energy return and shielding branch electrode works in one attachment arrangement possibility.

The number of layers in 312 is not limited, however, the number of common electrode shield electrodes in the cell used needs to be an odd integer. This facilitates the balancing of the shield electrodes 329 and 331 in this case so that they can be evenly distributed on each side of the relative central shield electrode 330, since identically layered components can be used, although each circuit is quite different.

The inventive components, when combined into a larger electrical system and energized by industry standard insertion or attachment methods, form electrical circuits with intended attachment to external differential branch electrodes or paths and with common conductive structures, regions or The difference in the intended attachment of the path.

Capabilities obtained include, but are not limited to, simultaneous, differential mode and common mode filtering, electrical shock protection and decoupling, mutual flux cancellation for certain types of electromagnetic energy field propagation, various spurious emissions, with minimal part Energy degradation, which is not generally present in existing embodiments that do not contain elements as previously described.

It should be noted that the use of both discrete and non-discrete variations of the inventive embodiment with the disclosed common external conducting element and the use of various dielectrics classified primarily by a certain electrical modulation function or result will almost always be found, as New uses of inventive component configurations will almost always take on unexpected and intentional features that add to previous limited knowledge of the use of the particular dielectric material used. This includes virtually any possible layered application, or supercapacitor application, or even atomic scale energy regulating structures using non-discrete capacitive or inductive structures that can employ variations of the inventive embodiments within, for example, fabricated discrete silicon chips.

Thus, nearly all similarly constructed or manufactured embodiments of the invention that are used in standard multiple paired wire-circuit situations and have one dielectric difference as the only significant difference between identically configured inventive embodiments and variants, given the respective known dielectric material responses of the prior art, will almost always produce an insertion loss performance measurement in unexpected and non-obvious ways. This comparison of similar types of inventive units (other than dielectric materials) clearly and definitively reveals the main cause or factors leading to this result, circuit performance is the components within the embodiment, a larger shared conductive shielding structure and the use of static elimination, physical shielding to The balance of conductive attachments of the collectively operating common external conductive elements affects regulation of energy propagated within circuit systems employing various inventive embodiments.

Inventive attachment to the same common conductive outer zone or channel for all common and conductively attached common electrode elements will almost always allow AOC (zone or sink) propagated energy to work in parallel with source and load electrical, and work in parallel with other common conductive structures, including not only mutually positioned common conductive structures, but also relatively nearly any connection to a separate return path, intrinsic ground, case ground Or common conductive structure for the location of the main circuit of the low impedance path. After placing and attaching a USS (Universal Shielding Structure) as described, behind an energized circuit, a common conducted energy path as disclosed parallel to the inner and outer differential energy paths will almost always increase or decrease the AOC Impedance of the third conduction/common conduction path in the inner so that the propagated energy has a possible return path that can be used by a portion of the energy originating from one source.

It should be noted that although both the outer and inner differential electrode energy pathways are generally complementary, once the invention is placed on a common conduction area, such as may be created by weld material placed during testing, A slight but insignificant imbalance is then created between the common conductive plates. The addition of externally located common conduction channels, adding back conduction energy channels balances and counteracts self-oscillations at higher frequencies than detected in similar types of inventions. The disclosure shown in Figures 2 and 3, the additional placement of a shared conduction energy path, labeled (#-IM) with the intrinsic central shared pattern "0" voltage reference plane will almost always increase the shielding effectiveness of the inventive embodiments. sex. These are additionally placed externally located common conduction energy pathways sandwiched next to their adjacent internally located neighbors for the purpose of adding capacitance to the USS embodiment. These additionally placed common conductive energy channels are placed prior to any eventual application of the at least one set of outer differential electrode pairs.

The sandwiching function of these external pairs of differential conductive channels between the basic grouping of pairs of conductive shield-like containers 800X will almost always be helpful with respect to the externally attached common conductive area and/or the first common conductive area of a common conductive area. Energy propagation of three energy channels.

The sandwiching and inlet function of these external pairs of differential conductive channels between the basic grouping of pairs of conductive shield-like containers 800X will almost always help again with respect to externally attached common conductive areas and/or a common Energy propagation of the third energy channel in the conduction zone. It should be noted that the "X" container structures making up shield 800 should be balanced in the stacking order described.

In almost any variation of an inventive embodiment, there will almost always be at least three different simultaneous Energy regulation function. These functions can be broken down into at least three circuit shields that occur simultaneously within an embodiment of the invention.

Physical Faraday cage effect or electrostatic shielding effect features charge containment of internally generated energy parasites shielded from active differentially conducted energy channels and provides protection against externally generated energy connected to the same active differentially conducted energy channels Physical protection of parasites and minimization of energy parasites due to the use of an almost total energization and physical shielding enclosure of embedded active energy channels within the zone footprint enclosing the shared charging shield energy channels.

The superposition of physically conductive material and dielectric shielding functions allows for small separation distances of oppositely charged active differentially conductive energy channels contained within common energy channels that interact in an electrically and magnetically controlled manner.

Mutual energy flux field cancellation of energy propagating along portions of pairs of electrically counter-complementary electrodes or conductive energy pathways along with cancellation of dissipated energy parasitic complementary charging and physical shielding and electrical shielding containment effects are features of embodiments of the invention. main reason.

Because the magnetic flux lines run counterclockwise within a transmission line or line conductor or layer, if the RF return channel is parallel to and adjacent to its corresponding source track, the return channel (counterclockwise field) is observed to be the same as the source channel ( clockwise field) will almost always be in the opposite direction. If the clockwise field is combined with the counterclockwise field, the elimination or minimization effect can be observed. The closer the channels are, the better the cancellation effect will be.

Use of a "0" voltage reference generated by a centrally located shared common shield energy channel electrode, complementary charging sections of two different common common conductive shield structures. Parallel shifting shielding effect (as opposed to serial shifting effect using most energy parts of the AOC) where each power part works on one end of the central common and shared conduction energy channel, in electrically complementary charging and/or magnetic operation, this This effect will almost always have a parallel, non-reinforcing but complementary charged counterpart operating simultaneously in roughly the opposite type of elimination or in a complementary manner.

The present invention will also use the sandwiched electrostatic shielding function to perform simultaneous complementary charge elimination within the predetermined electrode area bounded by the common electrode edge relative to the differential electrode edge so that the common conductive shield structure as described in this specification interact with each other or within.

All or nearly all of the conductive layered electrodes or internal energy channels are simultaneously used by the propagated energy located in each part, the energy-critical common conductive energy channel electrode in the center and the "0" voltage reference plane (including #-IM's Additional non-discretely defined common electrode covers) on opposite ends.

A device that is electrically parallel to the conduction energy channel is used partly by propagating energy from an operating source, propagating to the AOC, then being propagated further to the source that uses the energy, and then part of the energy is used from the using energy The source propagates to the AOC, then, partly through the AOC back to the source channel, or partly through the low-impedance channel augmented by a third set of conduction channels shared within the AOC to a shared conduction external channel located outside. As noted above, a properly attached invention, whether discrete or non-discrete, will almost always facilitate the ability to perform multiple different energy conditioning functions simultaneously, such as by utilizing parallel Decoupling, filtering, voltage equalization performed by electrical positioning principles, implementing circuits almost always with respect to the energy source, pairs of conducted energy paths, loads using energy, and conducted energy paths back to the source to complete the circuit.

This also includes the reverse but electrically cancelled, and complementary positioning of the parts propagating energies in a balanced manner on opposite ends of the "0" voltage reference simultaneously generated with the critical centrally located common and shared conducting electrode channels Acts on the conduction energy channel. This almost always parallel energy distribution scheme allows the materials made up of all fabricated inventive elements to co-operate more efficiently with the load and source channels located within the circuit. By operating in a complementary manner, material stresses are significantly reduced compared to the prior art. Thus, phenomena such as elastic material memory or hysteresis effects are minimized.

Piezoelectric effects on the materials making up the various parts of the inventive embodiments are also substantially minimized so energy is not detoured or used inefficiently within the AOC and is automatically available to the load, greatly improving standard and common medium The ability of electrical materials to perform AOC and in-circuit functions is more versatile and less restrictive, thus reducing costs while allowing performance levels beyond existing technologies. In the energized state, the minimization of hysteresis effects on dielectric and conductive material pressure and piezoelectric control effects within the AOC of inventive embodiments corresponds to increased performance levels for applications such as SSO states, decoupled power systems. The faster utilization of passive components by active components is also a direct result of these stress reductions and allows the use of propagating energy in a complementary manner to exploit the invention.

A combination of centrally positioned conduction energy channels around a shared central conduction energy channel or additional shared conduction energy channels around a set of central conduction energy channels and differential conduction electrodes can then be applied to provide an increased intrinsic and optimized Faraday cage function and The electrical shock dissipating zone and the low impedance effect of adding or enhancing the common conductive path and connection structures not considered part of the differential conductive path as described in all embodiments.

Furthermore, an embodiment of the invention, although not shown, could easily be fabricated in silicon and used directly in an integrated circuit, microprocessor circuit or chip. Integrated circuits are always manufactured with capacitors etched in silicon or semiconductor dies or silicon substrates, which allows the architecture of the present invention to be readily adapted to today's available technology.

Finally, note that prior art energy conditioning devices are typically connected in a wire-to-wire-in-place scheme between paired and external electrical back-differential energy channels to extract power from other needed existing energy used elsewhere in the circuit. Technology Energy Conditioning The energy conditioning function is improved in devices to handle the high input impedance (Z) developed for the line-to-line portion of the circuit used to propagate the circuit energy. So, a wire-to-wire-in-place solution, while indeed having improved energy conditioning capabilities, will almost always require at least two additional, prior art energy conditioning devices placed separately wire-to-ground on the same external electrical inverse. Each of the differential energy channels is connected between and to a ground. This additional placement is needed to regulate the energy propagated by parts that still require energy regulation to maintain normal operation of the circuit just described. This need is partly due to the inherently generated internal inductive circuit elements that are developed within each of the various prior art energy conditioning devices when operating within the energized circuit, and almost always occur in conjunction with their use.

These three elements provide a minimum of simultaneous cancellation and elimination of energy conditioning (and therefore very effective filtering) for the propagating circuit energy of the internal parts so that the propagating circuit energy within the AOC circuit portion of the layered inventive device does not develop, in this part There is also no need for any inductive circuit elements ("L") within the energization circuit. Therefore, almost all variations of the new energy conditioning invention embodiments will almost always provide an exponentially wider bandwidth filtering function than prior art capacitors or prior art energy conditioning devices of the same size and capacitance value.

Finally, it is evident from the numerous embodiments that the shape, thickness or size may vary depending on the electrical application derived from the arrangement and attachment structure of the common conductive shield electrode channel to form at least two paired containers, which Subsequent creation of at least one larger single ground conductive and homogeneous Faraday cage shielding structure or inventive section which in turn can contain at least one or more differential pairs of sections operating in discrete or non-discrete modes within one or more energized circuits Conductive electrodes or paired energy channels.

While the principles, best embodiment and best operation of the invention have been described in detail herein, it is not meant to be limited to the specific exemplary forms disclosed. Thus, it will be apparent to those skilled in the art that various modifications can be made in the preferred embodiment without departing from the spirit and scope of the defined inventive embodiments.

Claims (23)

1. A passive multilayer energy conditioner for passively regulating the energy portion of a conductive connection between an energy source, an energy load and a third independent conductive channel, comprising: A plurality of shielded common electrodes, wherein the plurality of shielded common electrodes include at least one first shielded common electrode, a second shielded common electrode, and a third shielded common electrode, wherein the plurality of shielded common electrodes are conductively connected to each other, each are approximately the same size and shape; At least one pair of discrete differential electrodes having a first discrete differential electrode and a second discrete differential electrode, said at least one pair of discrete differential electrodes being substantially the same size and shape, wherein said at least one pair of discrete differential electrodes each discrete differential electrode of is positioned complementary to each other; Wherein the first discrete differential electrode is laminated above the first shielded common electrode, and the second discrete differential electrode is laminated below the first shielded common electrode, wherein the second shielded common electrode is laminated On top of the first discrete differential electrodes, the third shielded common electrode is stacked below the second discrete differential electrodes, wherein the at least one pair of discrete differential electrodes is larger than the plurality of shielded common electrodes small, such that the at least one pair of discrete differential electrodes is located at an inset of the plurality of shielded common electrodes; A material having predetermined electrical properties, wherein said material is operable to partially package, uniformly support, and separate said plurality of shielded common electrodes and said at least one pair of discrete differential electrodes to prevent said plurality of shielded common electrodes from and a direct electrical connection between said at least one pair of discrete differential electrodes; and The plurality of shielded common electrodes and the at least one pair of discrete differential electrodes in the passive multi-layer energy for passively regulating the energy portion of the conductive connection between the energy source, the energy load, and the third independent conductive path A plurality of passive capacitive energy adjustment elements are formed in the regulator. 2. A passive multilayer energy conditioner for passively regulating the energy portion of a conductive connection between an energy source, an energy load and a third independent conductive channel, comprising: at least one pair of common shielding electrode structures, wherein each common shielding electrode structure of said at least one pair of common shielding electrode structures is mutually aligned, complementary and stacked in parallel; wherein each common shielded electrode structure of said at least one pair of common shielded electrode structures comprises at least two discrete differential electrodes, at least two shielded common electrodes and a material having predetermined electrical properties that can be used in groups or individually supporting and separating said at least two shielded common electrodes and said discrete differential electrodes, said material preventing direct electrical connection between any one of said at least two shielded common electrodes and said discrete differential electrodes; wherein the discrete differential electrodes are sandwiched between at least two shielded common electrodes, the discrete differential electrodes are smaller and embedded from the at least two shielded common electrodes; wherein said discrete differential electrode comprises at least one electrode portion extending outwardly a predetermined distance from edges of said at least two shielded common electrodes; wherein said at least two shielded common electrodes are electrically connected to each other, to each other shielded common electrode of said energy conditioner, and are substantially the same size and shape; Wherein between the at least one pair of common shielding electrode structures, at least one shielding common electrode portion of the at least one pair of common shielding electrodes in each of the at least one pair of common shielding electrode structures can serve as the at least one pair of operating with at least one common central shielding common electrode portion of each of the common shielding electrode structures; and Wherein the discrete differential electrodes of the at least one pair of common shielding electrode structures form at least one pair of differential electrodes, which may have a complementary energy regulation function, and are used for passive regulation of the energy source, the energy load and the The differential portion of the energy propagation between the third independent conduction channels. 3. A passive multilayer energy circuit regulating electronic assembly for passively regulating an energy portion electrically connected between an energy source, an energy load and a third independent conduction channel, comprising: at least first and second conductive channels for connection between said energy source and a load using energy; An energy conditioning component comprising a plurality of shielded common electrodes, at least one pair of differential electrodes, and a material having predetermined electrical properties, wherein said retainer is between said plurality of shielded common electrodes and said at least one pair of differential electrodes prevent direct electrical connection between the plurality of shielded common electrodes and the at least one pair of differential electrodes; The plurality of shielded common electrodes includes at least a first shielded common electrode, a second shielded common electrode, and a third shielded common electrode, wherein the plurality of shielded common electrodes are conductively connected to each other, each being approximately the same size and identical shape; The at least one pair of discrete differential electrodes includes a first discrete differential electrode and a second discrete differential electrode, each of the at least one pair of discrete differential electrodes being approximately the same size; The first discrete differential electrode is stacked above the first shielded common electrode, and the second discrete differential electrode is stacked below the first shielded common electrode, wherein the second shielded common electrode is stacked on Above the first discrete differential electrodes, the third shielded common electrode is stacked below the second discrete differential electrodes, wherein the at least one pair of discrete differential electrodes is smaller than the plurality of shielded common electrodes , so that the at least one pair of discrete differential electrodes is located at the embedding of the plurality of shielded common electrodes; wherein at least one of the combination of said at least one pair of differential electrodes and said plurality of shielded common electrodes is a discrete differential electrode; and Wherein the plurality of shielded common electrodes are connected to the first conductive channel, and the at least one pair of differential electrodes is connected to the second conductive channel, forming a passive regulation between the energy source, the energy load and the third independent A passive multilayer energy circuit that conducts the energy portion of the electrical connection between the channels modulates the plurality of energy conditioning elements of the electronic assembly. 4. The passive multilayer energy conditioner for passively regulating an energy portion of a conductive connection between an energy source, an energy load, and a third independent conductive channel of claim 1, wherein said material having predetermined electrical properties comprises a dielectric electrical properties. 5. The passive multilayer energy conditioner for passively regulating the energy portion of a conductive connection between an energy source, an energy load, and a third independent conductive path of claim 1 , wherein said at least one pair of discrete differential electrodes has Mutually equal and mutually balanced properties resulting in the line-to-earth capacitance of said passive multilayer energy conditioner for passively regulating the energy portion of the conductive connection between the energy source, the energy load and the third independent conducting path value of approximately half the line-to-line capacitance. 6. The passive multilayer energy conditioner for passively regulating an energy portion of a conductive connection between an energy source, an energy load, and a third independent conductive path of claim 1 , wherein said plurality of shielded common electrodes and said At least one pair of discrete differential electrodes constituting a plurality of passive capacitive energy within said passive multilayer energy conditioner for passively regulating an energy portion of a conductive connection between an energy source, an energy load, and a third independent conductive path A conditioning element comprising one of said plurality of passive capacitive energy conditioning elements for passively regulating the energy portion of said conductive connection between an energy source, an energy load, and a third independent conductive channel. The at least one pair of discrete differential electrodes of the layer energy conditioner is a passive capacitive energy adjustment element that inductively complements each other and eliminates the interaction of mutual inductive coupling. 7. The passive multilayer energy conditioner for passively regulating the energy portion of the conductive connection between the energy source, the energy load, and the third independent conductive channel of claim 1, further comprising a plurality of External conductive discrete differential electrodes of electrically interacting conductive major surfaces. 8. The passive multilayer energy conditioner for passively regulating the energy portion of the conductive connection between the energy source, the energy load, and the third independent conductive path of claim 1 , further comprising a first conductive electrode termination strip, a second conductive electrode termination strip and a common electrode termination strip, wherein said first conductive electrode termination electrode is connected to said first conductive electrode termination strip, wherein said first conductive electrode termination electrode is connected to said first conductive electrode termination strip, wherein said plurality of common electrodes are connected to said common electrode termination strip, creating at least one energy conditioning element between said first and second conductive electrode termination strips and at least two electrodes one between the first conductive electrode termination strip and the common electrode termination strip and one between the second conductive electrode termination strip and the common electrode termination strip. an energy regulating element. 9. The passive multilayer energy conditioner for passively regulating the energy portion of a conductive connection between an energy source, an energy load, and a third independent conductive path of claim 1 , operable as an array of feedthrough capacitors. 10. The passive multilayer energy conditioner of claim 1 for passively regulating the energy portion of a conductive connection between an energy source, an energy load and a third independent conductive path, usable as a cross-connected feedthrough capacitor array. 11. The passive multilayer energy conditioner for passively regulating the energy portion of the conductive connection between the energy source, the energy load and the third independent conductive channel of claim 1, usable as a bypass capacitor array. 12. The passive multilayer energy conditioner for passively regulating the energy portion of the conductive connection between the energy source, the energy load and the third independent conducting channel of claim 1, usable as a bypass capacitor. 13. The passive multilayer energy conditioner for passively regulating the energy portion of a conductive connection between an energy source, an energy load, and a third independent conductive path of claim 1, wherein said material having predetermined electrical properties comprises a dielectric Attributes. 14. The passive multilayer energy conditioner for passively regulating an energy portion of a conductive connection between an energy source, an energy load, and a third independent conductive path of claim 2, wherein said at least one pair of discrete differential electrodes has Mutually equal and mutually balanced properties resulting in the line-to-earth capacitance of said passive multilayer energy conditioner for passively regulating the energy portion of the conductive connection between the energy source, the energy load and the third independent conducting path value of approximately half the line-to-line capacitance. 15. The passive multilayer energy conditioner for passively regulating an energy portion of a conductive connection between an energy source, an energy load, and a third independent conductive channel of claim 2, wherein said plurality of shielded common electrodes and said At least one pair of discrete differential electrodes constituting a plurality of passive capacitive energy within said passive multilayer energy conditioner for passively regulating an energy portion of a conductive connection between an energy source, an energy load, and a third independent conductive path A conditioning element comprising one of said plurality of passive capacitive energy conditioning elements for passively regulating the energy portion of said conductive connection between an energy source, an energy load, and a third independent conductive channel. The at least one pair of discrete differential electrodes of the layer energy conditioner is a passive capacitive energy adjustment element that inductively complements each other and eliminates the interaction of mutual inductive coupling. 16. The passive multilayer energy conditioner for passively regulating the energy portion of the conductive connection between the energy source, the energy load, and the third independent conductive channel of claim 2, further comprising a plurality of External conductive discrete differential electrodes of electrically interacting conductive major surfaces. 17. The passive multilayer energy conditioner for passively regulating the energy portion of a conductive connection between an energy source, an energy load, and a third independent conductive path of claim 2, further comprising a first conductive electrode termination strip, a second conductive electrode termination strip and a common electrode termination strip, wherein said first conductive electrode termination electrode is connected to said first conductive electrode termination strip, wherein said first conductive electrode termination electrode is connected to said first conductive electrode termination strip, wherein said plurality of common electrodes are connected to said common electrode termination strip, creating at least one energy conditioning element between said first and second conductive electrode termination strips and at least two electrodes one between the first conductive electrode termination strip and the common electrode termination strip and one between the second conductive electrode termination strip and the common electrode termination strip. an energy regulating element. 18. The passive multilayer energy conditioner for passively regulating the energy portion of the conductive connection between the energy source, the energy load and the third independent conductive path of claim 2, operable as an array of feedthrough capacitors. 19. The passive multilayer energy conditioner of claim 2 for passively regulating the energy portion of a conductive connection between an energy source, an energy load, and a third independent conductive path, usable as an array of across feedthrough capacitors. 20. The passive multilayer energy conditioner for passively regulating the energy portion of the conductive connection between the energy source, the energy load and the third independent conductive path of claim 2, usable as a bypass capacitor array. 21. The passive multilayer energy conditioner for passively regulating the energy portion of the conductive connection between the energy source, the energy load and the third independent conductive channel of claim 2, usable as a bypass capacitor. 22. The passive multilayer energy circuit conditioning electronic assembly of claim 3 for passive conditioning of an energy portion electrically connected between an energy source, an energy load and a third independent conduction path, usable as a differential bypass circuit. 23. Passive multilayer energy circuit conditioning electronic assembly for passive conditioning of an energy portion electrically connected between an energy source, an energy load and a third independent conduction path, usable as a differential feedthrough circuit.

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