CN1713967B - Liquid medicine supply device - Google Patents
Liquid medicine supply device Download PDFInfo
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- CN1713967B CN1713967B CN038255790A CN03825579A CN1713967B CN 1713967 B CN1713967 B CN 1713967B CN 038255790 A CN038255790 A CN 038255790A CN 03825579 A CN03825579 A CN 03825579A CN 1713967 B CN1713967 B CN 1713967B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/80—Forming a predetermined ratio of the substances to be mixed
- B01F35/83—Forming a predetermined ratio of the substances to be mixed by controlling the ratio of two or more flows, e.g. using flow sensing or flow controlling devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
- B01F25/50—Circulation mixers, e.g. wherein at least part of the mixture is discharged from and reintroduced into a receptacle
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Abstract
Description
技术领域technical field
本发明涉及药液供给装置,特别是涉及在半导体制造装置或者平板显示器(FDP)制造装置等电子器件的制造装置中供给按规定的比例混合多种成分的药液的药液供给装置。The present invention relates to a chemical solution supply device, and more particularly, to a chemical solution supply device for supplying a chemical solution mixed with a plurality of components at a predetermined ratio in a manufacturing device of electronic devices such as a semiconductor manufacturing device or a flat panel display (FDP) manufacturing device.
背景技术Background technique
近年来,在半导体制造装置或者FDP制造装置等电子器件制造装置中,大量并且频繁地使用各种药液,例如,使用将多种原液混合制造的混合药液。例如,在制造工序中,在所谓CMP(化学机械抛光)工序中,使用各种各样的浆液作为研磨液。浆液是把多种原液混合起来调配而成,以短时间进行沉降、凝聚。因此,要求以规定的浓度稳定地供给浆液类的混合药液。In recent years, in electronic device manufacturing apparatuses such as semiconductor manufacturing apparatuses and FDP manufacturing apparatuses, various chemical solutions are frequently used in large quantities, for example, mixed chemical solutions produced by mixing a plurality of stock solutions are used. For example, in a manufacturing process, various slurries are used as a polishing liquid in a so-called CMP (Chemical Mechanical Polishing) process. The slurry is prepared by mixing various original liquids, and settles and coagulates in a short time. Therefore, it is required to stably supply a slurry-type mixed chemical solution at a predetermined concentration.
现有的药液供给装置称量各原液后供给贮存罐,在贮存罐内将原液混合起来调配混合药液,将调配好的混合药液供给电子器件制造装置。通过检测贮存罐内的药液的体积和重量并计算出混合比,来控制混合药液的浓度,有时也利用浓度检测装置直接测定贮存罐内的混合药液的浓度。用氮气等惰性气体或泵把在贮存罐内被调整到规定浓度的药液混合调匀,然后供给电子器件制造装置。The existing liquid medicine supply device weighs each raw liquid and supplies it to a storage tank, mixes the raw liquids in the storage tank to prepare a mixed liquid, and supplies the prepared mixed liquid to an electronic device manufacturing device. The concentration of the mixed drug solution is controlled by detecting the volume and weight of the drug solution in the storage tank and calculating the mixing ratio, and sometimes the concentration of the mixed drug solution in the storage tank is directly measured by a concentration detection device. Mix and mix the chemical solution adjusted to the specified concentration in the storage tank with inert gas such as nitrogen or a pump, and then supply it to the electronic device manufacturing device.
例如,为了提高硅晶片表面的平坦度,在晶片精研磨工序中使用由药液供给装置调配的浆液。利用涂布在研磨垫和晶片之间的浆液的机械应力和化学作用来研磨晶片表面。For example, in order to improve the flatness of the surface of a silicon wafer, a slurry prepared by a chemical solution supply device is used in the wafer finish polishing process. The surface of the wafer is ground by mechanical stress and chemical action of the slurry coated between the polishing pad and the wafer.
包含在浆液中的磨粒等未溶解物质随时间的推移凝聚沉降下来,在电子器件的制造中,这种凝聚和沉降成为问题。例如,一旦凝聚的浆液被涂布到晶片上,就会在晶片表面形成细微擦痕,从而降低晶片的成品率。Undissolved substances such as abrasive grains contained in the slurry coagulate and settle over time, and such coagulation and sedimentation become a problem in the manufacture of electronic devices. For example, once the condensed slurry is coated on the wafer, it can form fine scratches on the surface of the wafer, thereby reducing the yield of the wafer.
浆液中的未溶解物质的凝聚、沉降,使混合药液的浓度发生变化。当浆液中的未溶解物质在配液管内沉降时,向电子器件制造装置的浆液供给就不稳定。另外,为了防止凝聚、沉降下来的未溶解物质堵塞配液管,要进行清除凝 聚、沉降的未溶解物质的作业,这种清除作业会延迟向电子器件制造装置的浆液供给。Coagulation and sedimentation of undissolved substances in the slurry change the concentration of the mixed liquid medicine. When undissolved substances in the slurry settle in the liquid distribution pipe, the supply of the slurry to the electronic device manufacturing apparatus becomes unstable. In addition, in order to prevent clogging of the dispensing pipe by undissolved substances that have aggregated or settled, it is necessary to remove the undissolved substances that have aggregated and settled, and this cleaning operation will delay the supply of slurry to the electronic device manufacturing equipment.
为了防止浆液的凝聚、沉降,考虑对浆液一直进行搅拌。但是,浆液的搅拌会增高未溶解物质彼此间的碰撞频度,反而可能促进凝聚。In order to prevent the coagulation and settlement of the slurry, it is considered to keep stirring the slurry. However, the stirring of the slurry will increase the collision frequency of undissolved substances with each other, which may promote coagulation instead.
在某种混合药液中,从其制造到使用的时间,被限制在短时间内。在贮存罐内制造这种混合药液的情况下,存在得到问题是在直到供给电子器件制造装置为止的期间内药液会凝聚及沉降。In a certain mixed liquid medicine, the time from its manufacture to its use is limited to a short time. When such a mixed chemical solution is produced in a storage tank, there is a problem that the chemical solution aggregates and settles until it is supplied to an electronic device manufacturing apparatus.
发明的公开disclosure of invention
本发明的目的在于提供一种能够稳定地供给容易凝聚或沉降的混合药液的药液供给装置。An object of the present invention is to provide a chemical solution supply device capable of stably supplying a mixed chemical solution that is prone to coagulation or sedimentation.
按照本发明的第一种方式,提供一种将贮存在贮存罐中的药液供给外部装置的药液供给装置。该装置包括:使所述药液以规定的流量流经其中的供给路径;和在停止向所述外部装置供给所述药液时使所述药液从所述供给路径回流到所述贮存罐中的回流路径。According to a first aspect of the present invention, there is provided a chemical solution supply device for supplying a chemical solution stored in a storage tank to an external device. The device includes: a supply path through which the medical fluid flows at a prescribed flow rate; and returning the medical fluid from the supply path to the storage tank when the supply of the medical fluid to the external device is stopped. in the return path.
按照本发明的第二种方式,提供一种将分别贮存在多个贮存罐中的多种原液混合而生成混合药液并将所述混合药液供给外部装置的药液供给装置该装置包括:使所述多种原液分别以规定的流量流经其中的多条供给路径;和在停止向所述外部装置供给所述混合药液时使所述多种原液分别从所述多条供给路径回流到所述多个贮存罐中的多条回流路径。According to a second aspect of the present invention, there is provided a medical solution supply device that mixes a plurality of stock solutions respectively stored in a plurality of storage tanks to generate a mixed medical solution and supplies the mixed medical solution to an external device. The device includes: causing the plurality of stock solutions to flow through the plurality of supply paths at predetermined flow rates; and causing the plurality of stock solutions to respectively flow back from the plurality of supply paths when the supply of the mixed chemical solution to the external device is stopped. A plurality of return flow paths into the plurality of storage tanks.
按照本发明的第三种方式,提供一种将浆液供给外部装置的药液供给装置。该装置包括:使包含为调配所述浆液而使用的磨粒的第一液体以规定的流量流经其中的第一供给路径;使为调配所述浆液而与所述第一液体混合的第二液体以规定的流量流经其中的第二供给路径;和连接在所述第一供给路径上的回流路径,该回流路径在停止向所述外部装置供给所述浆液时,使所述第一液体从所述第一供给路径回流到所述第一贮存罐。According to a third aspect of the present invention, there is provided a chemical solution supply device for supplying slurry to an external device. The device includes: a first supply path through which a first liquid containing abrasive grains used for preparing the slurry flows at a prescribed flow rate; a second supply path for mixing with the first liquid for preparing the slurry; a second supply path through which the liquid flows at a prescribed flow rate; and a return path connected to the first supply path, which makes the first liquid flow when the supply of the slurry to the external device is stopped. Return flow from the first supply path to the first storage tank.
按照本发明的第四种方式,提供一种将混合液供给外部装置的供液装置,该供液装置分别与贮存第一液体的第一贮存罐和贮存第二液体的第二贮存罐连接,将所述第一液体和所述第二液体混合来调配所述混合液。该供液装置包括:使所述第一液体流经其中的第一供给路径;使所述第二液体流经其中的第二供给路径;与所述第一供给路径和所述第二路径连接而用来混合所述第一液体和所述第二液体的混合器;设置在所述第一供给路径上用来有选择地切断向所述混合器供给所述第一液体的第一断流阀;在所述第一供给路径上连接所述第一断流阀的上游位置和所述第一贮存罐的第一回流路径;设置在所述第一回流路径的中途的第一回流阀;以及控制装置,该控制装置在停止向所述外部装置供给所述混合液时,关闭所述第一断流阀而开启所述第一回流阀,以便维持所述第一供给路径中的所述第一液体的流动,同时使所述第一液体经由所述第一回流路径返回到所述第一贮存罐中。According to a fourth aspect of the present invention, there is provided a liquid supply device for supplying the mixed liquid to an external device, the liquid supply device is respectively connected to a first storage tank for storing the first liquid and a second storage tank for storing the second liquid, The first liquid and the second liquid are mixed to prepare the mixed liquid. The liquid supply device includes: a first supply path through which the first liquid flows; a second supply path through which the second liquid flows; connected to the first supply path and the second path and a mixer for mixing the first liquid and the second liquid; a first cut-off flow provided on the first supply path for selectively cutting off the supply of the first liquid to the mixer a valve; a first return path connecting an upstream position of the first stop valve and the first storage tank on the first supply path; a first return valve disposed in the middle of the first return path; and a control device that closes the first shutoff valve and opens the first return valve when the supply of the mixed liquid to the external device is stopped, so as to maintain the The flow of the first liquid simultaneously returns the first liquid to the first storage tank via the first return path.
另外,本发明还提供一种药液供给装置,是将分别贮存在第一以及第二贮存罐中的第一以及第二原液混合而生成混合药液,并将所述混合药液供给到外部装置的药液供给装置,其特征在于包括:第一以及第二供给路径,所述第一以及第二原液分别以规定的流量在所述第一以及第二供给路径中流动;第一以及第二流量调节装置,其分别设置在所述第一以及第二供给路径上,调节所述第一以及第二供给路径的流量,;第一以及第二回流路径,其分别连接在所述第一以及第二供给路径上的所述第一以及第二流量调节装置与所述外部装置之间的位置处,在停止向所述外部装置供给所述混合药液时,使所述第一以及第二原液分别从所述第一以及第二供给路径回流到所述第一以及第二贮存罐中,并且将停止向所述外部装置供给所述混合药液时所述第一以及第二供给路径中的所述第一以及第二原液的流量维持为与正在供给所述混合药液时的流量相同的流量。In addition, the present invention also provides a medical solution supply device which mixes the first and second stock solutions respectively stored in the first and second storage tanks to generate a mixed drug solution, and supplies the mixed drug solution to the outside The medical solution supply device of the device is characterized by comprising: first and second supply paths, the first and second raw liquids respectively flow in the first and second supply paths at predetermined flow rates; the first and second Two flow regulating devices, which are respectively arranged on the first and second supply paths to adjust the flow of the first and second supply paths; first and second return paths, which are respectively connected to the first and at a position between the first and second flow rate regulators and the external device on the second supply path, when the supply of the mixed chemical solution to the external device is stopped, the first and second The two raw liquids flow back from the first and second supply paths into the first and second storage tanks respectively, and the first and second supply paths will stop supplying the mixed liquid to the external device. The flow rates of the first and second raw liquids in the feed are maintained at the same flow rates as the flow rates when the mixed medical solution is being supplied.
另外,本发明还提供一种药液供给装置,是将分别贮存在第一以及第二贮存罐中的第一液体以及第二液体混合而成浆液,把浆液供给到外部装置的药液供给装置,其特征在于包括:第一供给路径,包含用于调配所述浆液的磨粒的所述第一液体以规定的流量在其中流动;第二供给路径,为调配所述浆液而与所述第一液体混合的所述第二液体以规定的流量在其中流动;第一以及第二流量调节装置,其分别设置在所述第一以及第二供给路径上,用于控制在所述第一以及第二供给路径中流动的所述第一液体以及第二液体的流量;第一以及第二回流路径,其分别连接在所述第一以及第二供给路径上的所述第一以及第二流量调节装置与所述外部装置之间的位置处,在停止向所述外部装置供给所述浆液时,使所述第一液体以及第二液体分别从所述第一以及第二供给路径回流到所述第一以及第二贮存罐,并且将停止向所述外部装置供给所述浆液时所述第一以及第二供给路径中的所述第一液体以及第二液体的流量维持为与正在向所述外部装置供给所述浆液时的流量相同的流量。In addition, the present invention also provides a medical solution supply device that mixes the first liquid and the second liquid respectively stored in the first and second storage tanks to form a slurry, and supplies the slurry to an external device. , characterized by comprising: a first supply path, in which the first liquid containing abrasive grains for preparing the slurry flows at a prescribed flow rate; a second supply path, which is connected with the first liquid for preparing the slurry The second liquid mixed with a liquid flows in it at a specified flow rate; first and second flow regulating devices are respectively arranged on the first and second supply paths, and are used to control the The flow rates of the first liquid and the second liquid flowing in the second supply path; first and second return paths, which are respectively connected to the first and second flow rates on the first and second supply paths At a position between the adjustment device and the external device, when the supply of the slurry to the external device is stopped, the first liquid and the second liquid are respectively returned from the first and second supply paths to the the first and second storage tanks, and when the supply of the slurry to the external device is stopped, the flow rates of the first liquid and the second liquid in the first and second supply paths are maintained to be the same as those being supplied to the external device. The flow rate is the same as the flow rate when the external device supplies the slurry.
另外,本发明还提供一种将混合液供给外部装置的供液装置,该供液装置分别与贮存第一液体的第一贮存罐和贮存第二液体的第二贮存罐连接,将所述第一液体和所述第二液体混合来调配所述混合液;其特征在于包括:使所述第一液体以规定的流量流经其中的第一供给路径;使所述第二液体以规定的流量流经其中的第二供给路径;与所述第一供给路径和所述第二路径连接而用来混合所述第一液体和所述第二液体的混合器;设置在所述第一供给路径上用来有选择地切断向所述混合器供给所述第一液体的第一断流阀;设置在所述第二供给路径上用来有选择地切断向所述混合器供给所述第二液体的第二断流阀;分别设置在所述第一以及第二供给路径上的所述第一以及第二断流阀的上游位置处,用于控制在所述第一以及第二供给路径中流动的所述第一液体以及第二液体的流量的第一以及第二流量调节装置;第一回流路径,其将所述第一供给路径上的位于所述第一断流阀的上游且处于所述第一流量调节装置的下游的位置与所述第一贮存罐连接在一起,在停止向所述外部装置供给所述混合液时,将与所述第二液体混合之前的所述第一供给路径中的所述第一液体的流量维持为与正在向所述外部装置供给时的流量相同的流量;设置在所述第一回流路径的中途的第一回流阀;以及控制装置,该控制装置在停止向所述外部装置供给所述混合液时,关闭所述第一断流阀并开启所述第一回流阀,以便将所述第一供给路径中的所述第一液体的流量维持为与正在向所述外部装置供给时的流量相同的流量,并且使所述第一供给路径中的所述第一液体经由所述第一回流路径返回到所述第一贮存罐。In addition, the present invention also provides a liquid supply device for supplying the mixed liquid to an external device, the liquid supply device is respectively connected with a first storage tank for storing the first liquid and a second storage tank for storing the second liquid, and the first A liquid is mixed with the second liquid to prepare the mixed liquid; it is characterized in that it includes: making the first liquid flow through the first supply path at a prescribed flow rate; making the second liquid flow at a prescribed flow rate a second supply path flowing therethrough; a mixer connected to the first supply path and the second path for mixing the first liquid and the second liquid; disposed on the first supply path The first shut-off valve used to selectively cut off the supply of the first liquid to the mixer; the first shut-off valve provided on the second supply path to selectively cut off the supply of the second liquid to the mixer A second cut-off valve for liquid; respectively arranged at upstream positions of the first and second cut-off valves on the first and second supply paths, for controlling The first and second flow regulating devices for the flow of the first liquid and the second liquid flowing in the medium; the first return path, which is located on the first supply path upstream of the first shut-off valve and The position downstream of the first flow regulating device is connected to the first storage tank, and when the supply of the mixed liquid to the external device is stopped, the first flow rate before mixing with the second liquid is removed. A flow rate of the first liquid in a supply path is maintained at the same flow rate as when it is being supplied to the external device; a first return valve provided in the middle of the first return path; and a control device, the When the control device stops supplying the mixed liquid to the external device, it closes the first stop valve and opens the first return valve, so that the flow rate of the first liquid in the first supply path The same flow rate as the flow rate when being supplied to the external device is maintained, and the first liquid in the first supply path is returned to the first storage tank via the first return path.
附图的简单说明A brief description of the drawings
图1是本发明的第一实施方式的药液供给装置的略图。FIG. 1 is a schematic diagram of a chemical solution supply device according to a first embodiment of the present invention.
图2是调整恒压阀的空气压力与阻尼孔的流量的关系曲线图。Fig. 2 is a graph showing the relationship between the air pressure of the constant pressure valve and the flow rate of the orifice.
图3是在开始供给磨粒时的阻尼孔的流量的现有技术例的曲线图。Fig. 3 is a graph of a conventional example of the flow rate of the orifice when the supply of abrasive grains is started.
图4是第一实施方式的开始供给磨粒时的阻尼孔的流量的说明图。4 is an explanatory diagram of the flow rate of the orifice when the supply of abrasive grains is started according to the first embodiment.
图5是本发明的第二实施方式的药液供给装置的略图。5 is a schematic diagram of a chemical solution supply device according to a second embodiment of the present invention.
图6是本发明的第三实施方式的药液供给装置的略图。6 is a schematic diagram of a chemical solution supply device according to a third embodiment of the present invention.
图7是本发明的第四实施方式的药液供给装置的略图。Fig. 7 is a schematic diagram of a chemical solution supply device according to a fourth embodiment of the present invention.
实施发明的最佳方式The best way to practice the invention
如图1所示,本发明的第一实施方式的药液供给装置100由分别贮存在第一贮存罐1和第二贮存罐2中的药品调配药液;然后将调配好的药液供给电子 器件制造装置7。As shown in Figure 1, the medical solution supply device 100 of the first embodiment of the present invention prepares the medical solution from the medicines respectively stored in the first storage tank 1 and the second storage tank 2; Device manufacturing device 7 .
用第一泵3汲出贮存在第一贮存罐1中的第一药品(例如,磨粒悬浊液那样的浆液原液),并压送到药液混合装置4。为了在第一贮存罐1内搅拌第一药品,使由第一泵3压送来的第一药品的一部分返回到第一贮存罐1内。The first medicine stored in the first storage tank 1 (for example, a slurry stock solution such as abrasive particle suspension) is pumped out by the first pump 3 and sent to the medicine-liquid mixing device 4 by pressure. In order to stir the first chemical in the first storage tank 1 , a part of the first chemical pumped by the first pump 3 is returned to the first storage tank 1 .
用第二泵5汲出贮存在第二贮存罐2内的第二药品(例如,与磨粒悬浊液混合来调配浆液用的稀释用分散介质),并压送到药液混合装置4。为了在第二贮存罐2中搅拌第二药品,使由第二泵5压送来的第二药品的一部分返回到第二贮存罐2内。The second chemical stored in the second storage tank 2 (for example, a dilution dispersion medium for mixing with the abrasive suspension to prepare a slurry) is pumped out by the
药液混合装置4包含:将第一药品供给混合器6的第一供给路径A和将第二药品供给混合器6的第二供给路径B。混合器6将第一及第二药品适当混合,然后供给电子器件制造装置7。混合器6例如是静态混合器。The chemical solution mixing device 4 includes a first supply path A for supplying the first chemical to the
第一供给路径A包含:上游阀8、下游阀9、上游压力计10、下游压力计11、第一恒压阀12、由针阀构成的第一节流孔(流量调节机构)13以及第一流量计14;由控制药液混合装置4的控制装置15控制第一供给路径A。The first supply path A includes: an
在上游阀8被开启时,将第一泵3压送来的第一药品供给上游压力计10;上游压力计10测定由上游阀8供给的第一药品的压力,然后将第一药品供给第一恒压阀12。将上游压力计10的测定值供给控制装置15。When the
第一恒压阀12将第一泵3压送来的第一药品的压力降压到规定的压力之后,将第一药品供给下游压力计11。The first
下游压力计11测定由第一恒压阀12供给的第一药品的压力,并将第一药品供给第一节流孔13。把下游压力计11的测定值提供给控制装置15。The
为了将供给第一节流孔13的第一药品的压力维持在规定值,控制装置15根据上游和下游压力计10、11的测定值调整用来控制第一恒压阀12的空气压力。In order to maintain the pressure of the first medicine supplied to the
第一节流孔13在调整由下游压力计11供给的第一药品的流量之后,将第一药品供给第一流量计14。第一流量计14检测出由第一节流孔13供给的第一药品的流量,将该检测值提供给控制装置15。The
在调配容易发生磨粒的沉降及凝聚的铈浆液的情况下,即,在第一药品包含氧化铈那样的磨粒的悬浊液的情况下,最好把第一泵13的排出流量设定为0~10L/min,把第一恒压阀12的排出压力设定为0~0.5MPa,把第一节流孔13处的流速设定为0~0.5L/min。In the case of preparing a cerium slurry that is prone to sedimentation and aggregation of abrasive grains, that is, when the first chemical contains a suspension of abrasive grains such as cerium oxide, it is preferable to set the discharge flow rate of the
第一流量计14将由第一节流孔13供给的第一药品供给下游阀9。当开启下游阀9时,第一药品被供给混合器6。当关闭下游阀9时,切断第一药品向混合器6的供给。The
图2的曲线图表示用来调整第一恒压阀12的空气压力(横轴)与流经第一节流孔13的药品流量(纵轴)的关系。空气压力和流量的关系随第一节流孔13的开启度而变。例如,直线X表示第一节流孔13全部开启时的关系,直 线Y表示将第一节流孔13的开启度缩小到一半时的关系,直线Z表示将第一节流孔13的流量进一步缩小时的关系。The graph in FIG. 2 shows the relationship between the air pressure (horizontal axis) used to adjust the first
如图2所示,当操作第一恒压阀12来调整第一药品的压力时,第一节流孔13的开启度越大,伴随着压力的增大,流量的变化越大。As shown in FIG. 2 , when the first
在第一供给路径A的途中连接有使流经第一供给路径A的第一药品回流到第一贮存罐1中的第一回流路径C。即,第一回流路径C将第一流量计14的输出侧(下游位置)和贮存罐1连接起来。控制装置15控制设置在第一回流路径C的途中的回流阀16,在下游阀9关闭时将其开启。从而,在下游阀9关闭时,流经第一供给路径A的第一药品经过第一回流路径C之后,回流到第一贮存罐1内。In the middle of the first supply path A, a first return path C for returning the first medicine flowing through the first supply path A to the first storage tank 1 is connected. That is, the first return path C connects the output side (downstream position) of the
第一供给路径A被旁通路径D旁路。详细地说,旁通路径D将上游阀8的输入侧(上游位置)和第一回流阀16的输出侧(下游位置)旁路。在下游阀9关闭时,设置在旁通路径D的途中的旁通阀17被开启,或者保持在常开状态。调整旁通阀17的开启度,使第一节流孔13处的流速保持在0~5L/min。The first supply path A is bypassed by the bypass path D. In detail, the bypass path D bypasses the input side (upstream position) of the
第二供给路径B包含有:上游阀18、下游阀19、上游压力计20、下游压力计21、第二恒压阀22、第二节流孔(流量调节机构)23和第二流量计24;控制药液混合装置4的控制装置15控制该第二供给路径B。The second supply path B includes: an
在调配铈浆液的情况下,最好将第二恒压阀22的排出压力设定为0~0.5MPa,将流经第二节流孔23的第二药品的流量设定为0~0.5L/min。In the case of preparing cerium slurry, it is best to set the discharge pressure of the second
在第二供给路径B的途中,连接有与第一回流路径C类似的第二回流路径E。在第二回流路径E的途中,设置有在下游阀19关闭时开启的第二回流阀25。On the way of the second supply path B, a second return path E similar to the first return path C is connected. On the way of the second return path E, a second return valve 25 that opens when the
下面,说明药液供给装置100的动作。Next, the operation of the chemical solution supply device 100 will be described.
在将混合药液供给电子器件制造装置7时,控制装置15开启上游阀8、19及下游阀9、19。于是,第一药品从就第一贮存罐1经由第一泵3及第一供给路径A被送到混合器6;第一恒压阀12及第一节流孔13将第一药品的压力及流量控制在规定值。The
另外,第二药品从第二贮存罐2经由第二泵5及第一供给路径B被送到混合器6;第二恒压阀22及第二节流孔23将第二药品的压力及流量控制在规定值。In addition, the second medicine is sent from the second storage tank 2 to the
混合器6将第一药品及第二药品混合后,送到电子器件制造装置7。控制装置15根据第一和第二流量计14、24检测到的流量来控制该混合药液的混合比。The
另一方面,当停止向电子器件制造装置7供给混合药液时,关闭下游阀9、19,同时开启第一和第二回流阀16、25。这样,流经第一供给路径A的第一药品就经第一回流路径C回流到第一贮存罐1。换言之,第一药品在由第一贮存罐1、第一供给路径A和第一回流路径C构成的循环路径中持续流动。同样地,流经第二供给路径B的第二药品经过第二回流路径E回流到第二贮存罐2中。换言之,第二药品在由第二贮存罐2、第一供给路径B及第二回流路径E构成的循环路径中持续流动。On the other hand, when the supply of the mixed chemical solution to the electronic device manufacturing apparatus 7 is stopped, the
由于在第一供给路径A内,始终维持第一药品流动,所以防止了第一药品的凝聚及沉降。另外,在第二供给路径B中,防止了第二药品的凝聚及沉降。Since the flow of the first chemical is always maintained in the first supply path A, aggregation and sedimentation of the first chemical are prevented. In addition, in the second supply path B, aggregation and sedimentation of the second chemical are prevented.
铈悬浊液中的铈磨粒容易凝聚及沉降,因此,当仅将流经第一供给路径A的铈悬浊液的一部分供给第一回流路径C时,由于第一回流路径C中的流量不足,在第一回流路径C内,有可能发生铈磨粒的凝聚或沉降。在第一种实施方式中,经由旁通路径D将铈悬浊液供给第一回流路径C。从而,增大第一回流路径C的流量,防止了第一回流路径C内的铈磨粒的凝聚或沉降的发生。The cerium abrasive grains in the cerium suspension are easy to coagulate and settle. Therefore, when only a part of the cerium suspension flowing through the first supply path A is supplied to the first return path C, due to the flow rate in the first return path C Insufficient, in the first return path C, the aggregation or sedimentation of cerium abrasive grains may occur. In a first embodiment, the cerium suspension is supplied to the first return path C via the bypass path D. Therefore, the flow rate of the first return path C is increased, and the occurrence of aggregation or sedimentation of the cerium abrasive grains in the first return path C is prevented.
按照第一种实施方式,获得以下的效果。According to the first embodiment, the following effects are obtained.
(1)按照药品供给装置100,以规定的流量向混合器6供给磨粒悬浊液和分散介质并将其混合起来调配成浆液。所调配好的浆液被直接送到电子器件制造装置7,所以能够防止浆液的沉降和凝聚,可以将质量稳定的浆液供给电子器件制造装置。(1) According to the chemical supply device 100 , the abrasive suspension and the dispersion medium are supplied to the
(2)当不向电子器件制造装置7供给浆液时,借助经由第一回流路径C的回流在第一供给路径A中将磨粒悬浊液的液流保持在与正在向电子器件制造装置7供给浆液时的流量相同的流量。因此,能够防止在第一供给路径A中的磨粒的沉降及凝聚,同时,在再次开始供给浆液时,可以迅速地向电子器件制造装置7供给质量稳定的浆液。另外,在第二供给路径B中,可以利用第二回流路径E来防止第二药品的沉降及凝聚。(2) When the slurry is not being supplied to the electronic device manufacturing apparatus 7, the flow of the abrasive grain suspension is maintained in the first supply path A by the return flow through the first return flow path C and is being supplied to the electronic device manufacturing apparatus 7. The flow rate is the same as the flow rate when the slurry is supplied. Therefore, the sedimentation and aggregation of the abrasive grains in the first supply path A can be prevented, and at the same time, when the slurry supply is restarted, the slurry with stable quality can be quickly supplied to the electronic device manufacturing apparatus 7 . In addition, in the second supply path B, the second return path E can be used to prevent sedimentation and aggregation of the second chemical.
(3)在第一回流路径C的流量少的情况下,经由旁通路径D向第一回流路径C供给磨粒悬浊液。从而,可以防止第一回流路径C内的磨粒的沉降及凝 聚。(3) When the flow rate of the first return passage C is small, the abrasive suspension is supplied to the first return passage C via the bypass passage D. Thereby, the settling and aggregation of the abrasive grains in the first return path C can be prevented.
(4)在不向电子器件制造装置7供给浆液时,借助第一及第二回流路径C、E的回流,将第一及第二供给路径A、B中的磨粒悬浊液及分散介质的液流保持在与正在向电子器件制造装置7供给浆液时的流量相同的流量。从而,当再次开始供给浆液时,能够缩短从开启下游阀9及下游阀19到使供给到混合器6的磨粒悬浊液及分散介质的流量达到稳定为止的时间。下面,参照图3、图4说明这种再次开始时间的缩短。(4) When the slurry is not being supplied to the electronic device manufacturing apparatus 7, the abrasive grain suspension and the dispersion medium in the first and second supply paths A, B are reflowed by means of the first and second return paths C, E. The liquid flow is kept at the same flow rate as the flow rate when the slurry is being supplied to the electronic device manufacturing apparatus 7 . Therefore, when the slurry supply is restarted, the time from opening the downstream valve 9 and the
图3的曲线图所表示的是一个比较例,表示在第一及第二供给路径A、B中因使第一及第二药品的液流停止而停止向电子器件7供给浆液的状态到再次开始供给浆液时的流量的变化。图4表示的是从在第一及第二供给路径A、B中保持第一及第二药品的液流维持不变而停止向电子器件制造装置7供给浆液的状态到再次开始供给浆液时的流量的变化。What the graph of FIG. 3 shows is a comparative example, showing the state of stopping the supply of the slurry to the electronic device 7 due to stopping the liquid flow of the first and second chemicals in the first and second supply paths A, B, and then continuing. Changes in the flow rate at the start of slurry supply. FIG. 4 shows the flow from the state where the slurry supply to the electronic device manufacturing apparatus 7 is stopped while the flow of the first and second chemicals is maintained in the first and second supply paths A and B to when the slurry supply is resumed. changes in traffic.
在图3的比较例的情况下,达到供给流量稳定所需的时间,例如,当将来自第一供给路径A的供给流量设定为200mL/min时,从再次供给开始到将供给流量的误差缩小到±10mL/min所需的时间约为11秒。该时间用于在供给再次开始后根据压力计及流量计的检测值调整恒压阀及节流孔,来调整流量。In the case of the comparative example in Fig. 3, the time required to reach the supply flow rate stabilization, for example, when the supply flow rate from the first supply path A is set to 200mL/min, the error from the start of re-supply to the supply flow rate The time required to shrink to ±10mL/min is about 11 seconds. This time is used to adjust the flow rate by adjusting the constant pressure valve and the orifice according to the detection values of the pressure gauge and the flowmeter after the supply restarts.
相对于此,在本实施方式中,如图4所示,从再次开始供给起约2秒钟流量便稳定化。这是因为维持第一及第二供给路径A、B中的液流的缘故。On the other hand, in the present embodiment, as shown in FIG. 4 , the flow rate is stabilized in about 2 seconds from the resumption of supply. This is because the liquid flow in the first and second supply paths A and B is maintained.
其次,参照图5说明本发明的第二实施方式的药液供给装置200。第二实施方式与第一实施方式的不同点在于在混合器6与电子器件制造装置7之间设置有第三泵26。第三泵26最好是能够适当地调整排出流量的泵。Next, a chemical solution supply device 200 according to a second embodiment of the present invention will be described with reference to FIG. 5 . The second embodiment differs from the first embodiment in that a third pump 26 is provided between the
借助第三泵26,在从混合器6到电子器件制造装置7的距离长的情况下,可以用第三泵26以稳定的压力供给浆液。With the third pump 26, in the case where the distance from the
其次,参照图6说明本发明的第三实施方式的药液供给装置300。第三实施方形式与第一实施方式不同点在于附加有第一及第二清洗用阀27、28。Next, a chemical
清洗用阀27、28可以清洗第一供给路径A。即,关闭阀8、9、16,开启清洗阀27、28。在这种状态下,经由第一清洗用阀27向第一供给路径A供给纯水或适当的清洗液,经由第二清洗用阀28排水。这样,可以很容易清洗用来供给容易发生沉降和凝聚的磨粒悬浊液的第一供给路径A。The cleaning
如果关闭第二清洗用阀28而开启下游阀9,也可以进行混合器6及电子器件制造装置7的清洗。When the
从第二清洗用阀28向第一清洗用阀27供给清洗液,使清洗液沿着与磨粒悬浊液的液流相反方向流动,可以进一步提高清洗效果。The washing liquid is supplied from the
下面,参照图7说明本发明的第四实施方式的药液供给装置400。第四实施方式是并列地设置两条供给路径A1、A2,来代替第一实施方式的供给路径A。与第三实施方式一样,在两条供给路径A1、A2上,设置清洗用阀29~32。Next, a medical solution supply device 400 according to a fourth embodiment of the present invention will be described with reference to FIG. 7 . In the fourth embodiment, two supply paths A1 and A2 are arranged in parallel instead of the supply path A of the first embodiment. As in the third embodiment, cleaning
在第四实施方式中,可以用两条供给路径A1、A2之一向电子器件制造装置7供给磨粒悬浊液,同时进行另一条路径的清洗。由于每隔规定时间清洗两条供给路径A1、A2,所以,可以连续地进行磨粒悬浊液的供给动作。另外,即使在供给路径A1、A2内发生磨粒的沉降及凝聚的情况下,也可以定期地清除凝聚的磨粒,能够连续地将浆液供给电子器件制造装置7。In the fourth embodiment, one of the two supply paths A1 and A2 can be used to supply the abrasive suspension to the electronic device manufacturing apparatus 7 while cleaning the other path. Since the two supply paths A1 and A2 are cleaned every predetermined time, the supply operation of the abrasive suspension can be continuously performed. In addition, even when sedimentation and aggregation of abrasive grains occur in the supply paths A1 and A2 , the aggregated abrasive grains can be periodically removed, and the slurry can be continuously supplied to the electronic device manufacturing apparatus 7 .
第一至第四实施方式也可以进行如下的变更。The first to fourth embodiments may also be modified as follows.
在流过第二供给路径B的第二药品是纯水等不沉降及凝聚的均匀的流体的情况下,也可以省略第二回流路径E。When the second chemical flowing through the second supply path B is a uniform fluid such as pure water that does not settle or aggregate, the second return path E may be omitted.
在流经第二供给路径B的第二药品是容易沉降及凝聚的不均匀流体的情况下,也可以在第二供给路径B上设置旁通路径。When the second chemical flowing through the second supply path B is an inhomogeneous fluid that is prone to sedimentation and aggregation, a bypass path may be provided on the second supply path B.
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| US6280300B1 (en) * | 1998-11-25 | 2001-08-28 | Ebara Corporation | Filter apparatus |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000218107A (en) * | 1998-11-25 | 2000-08-08 | Ebara Corp | Filter and grinding liquid supply apparatus |
| JP3179064B2 (en) * | 1999-01-18 | 2001-06-25 | 株式会社東京精密 | Slurry supply equipment |
| JP3778747B2 (en) * | 1999-11-29 | 2006-05-24 | 株式会社荏原製作所 | Abrasive fluid supply device |
| JP2001345296A (en) * | 2000-06-02 | 2001-12-14 | Reiton:Kk | Chemical supply system |
-
2003
- 2003-06-20 WO PCT/JP2003/007858 patent/WO2004113023A1/en not_active Ceased
- 2003-06-20 JP JP2005500911A patent/JP4362473B2/en not_active Expired - Fee Related
- 2003-06-20 CN CN038255790A patent/CN1713967B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6280300B1 (en) * | 1998-11-25 | 2001-08-28 | Ebara Corporation | Filter apparatus |
Non-Patent Citations (2)
| Title |
|---|
| JP特开-2000202774A 2000.07.25 |
| JP特开2001-150347A 2001.06.05 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2004113023A1 (en) | 2004-12-29 |
| CN1713967A (en) | 2005-12-28 |
| JPWO2004113023A1 (en) | 2006-07-20 |
| JP4362473B2 (en) | 2009-11-11 |
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