CN204143460U - Fingerprint identification device and terminal device - Google Patents

Abstract

The utility model discloses a fingerprint identification device and terminal equipment. The fingerprint identification device includes: a fingerprint identification component, including: a flexible circuit film and a sensor and a control chip formed on the flexible circuit film, wherein the sensor and the control chip are electrically connected; a support member is identified by the fingerprint The component is at least partially wrapped; a protective layer is formed on at least part of the fingerprint recognition component and is located above the sensor; and a base ring has a top opening, and the fingerprint recognition component is at least partially accommodated in the base within the ring; wherein the protective layer is exposed through the top opening of the base ring.

Description

Fingerprint identification device and terminal equipment

technical field

The utility model relates to the field of biological identification, in particular to a fingerprint identification device and terminal equipment including the same. the

Background technique

In recent years, with the development of storage technology, terminal devices such as smart phones and tablet computers store a large amount of personal information and other important data, and its security has become more important. At present, passwords, graphics and other forms are often used to realize the password protection of its terminal equipment. the

However, for encryption methods such as passwords and graphics, users need to remember the set passwords and/or graphics; in addition, there is a danger of password disclosure in public places. In order to improve security, it is often necessary to increase the complexity of passwords and graphics, which undoubtedly further increases the difficulty of user memory, causing conflicts between security and ease of use. the

Fingerprints are composed of uneven skin lines on the surface of fingers, which are unique features of the human body, and their complexity can provide sufficient features for identification. Fingerprint recognition is to use the uniqueness and stability of fingerprints to realize identity recognition without user memory. the

The capacitive fingerprint recognition sensor forms a conductive circuit on the base substrate. When the finger touches the sensor, it detects and forms a fingerprint pattern through the different capacitance values generated by the protrusions of the fingerprint ridges and the depressions of the fingerprint valleys. the

However, as the fingerprint identification technology is widely used, some problems are encountered, mainly the size and height of the fingerprint identification device used in electronic equipment. With the widespread use of handheld electronic devices, designers or engineers of electronic devices are constantly pursuing the maximum integration and ease of use of electronic devices, and on the other hand, they need to reduce the size of integrated components in electronic devices and reduce the its cost. Typically, these electronic devices contain only the input/output elements necessary for core functionality, such as a screen, and limited buttons. the

Therefore, it is necessary to implement a packaging of a fingerprint identification device that can be integrated into a handheld electronic device, so as to overcome the problems in the prior art. the

Utility model content

In view of this, the utility model provides a fingerprint identification device which can be integrated in a terminal device and a terminal device including it. the

Additional aspects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. the

The utility model discloses a fingerprint identification device on the one hand, comprising: a fingerprint identification component, including: a flexible circuit film and a sensor and a control chip formed on the flexible circuit film, wherein the sensor and the control chip are electrically connected a support member at least partially wrapped by the fingerprint recognition component; a protective layer formed on at least part of the fingerprint recognition component and above the sensor; and a base ring with a top opening, the fingerprint recognition component At least partially housed within the base ring; wherein the protective layer is exposed through the top opening of the base ring. the

In one embodiment, the sensor and the control chip are separately disposed on the same side of the flexible circuit film, and are respectively electrically connected to the flexible circuit film. the

In another embodiment, the sensor and the control chip are respectively disposed on opposite sides of the supporting member. the

In yet another embodiment, the control chip is electrically connected to the flexible circuit film in a flip-chip manner. the

In yet another embodiment, the center of the support and the center of the sensor are in the same plane perpendicular to the top surface of the support. the

In yet another embodiment, one end of the fingerprint recognition component is attached to a part of one surface of the support member. the

In yet another embodiment, the fingerprint recognition component wraps four sides of the support. the

In yet another embodiment, the fingerprint recognition component wraps three surfaces of the support. the

In yet another embodiment, the supporting member has a groove for accommodating the control chip. the

In yet another embodiment, the depth of the groove is greater than the thickness of the control chip. the

In yet another embodiment, the fingerprint recognition component wraps two surfaces of the support. the

In yet another embodiment, the top surface of the base ring is higher than the top surface of the protection layer. the

In yet another embodiment, the top surface of the base ring has a chamfer toward the center, or the top surface of the base ring is arc-shaped toward the center. the

In yet another embodiment, the base ring includes a side portion and a protrusion connected to the side portion, the bottom surface of the protrusion contacts the protective layer. the

In yet another embodiment, the height difference between the top surface of the base ring and the top surface of the protective layer is H, the shortest distance between the base ring and the sensing area of the sensor is L, and H/L is 1/5～2/3. the

In yet another embodiment, H/L is 1/4˜1/2. the

In yet another embodiment, the top surface of the base ring is flush with the top surface of the protection layer. the

In yet another embodiment, the support member is at least partially bonded to the flexible circuit film by an adhesive. the

In yet another embodiment, the adhesive includes PSA glue and thermosetting glue. the

In yet another embodiment, the fingerprint identification device further includes: a color layer coated above the sensor and located between the protective layer and the fingerprint identification component. the

In yet another embodiment, the color layer includes an ink layer. the

In yet another embodiment, the protective layer material includes glass, ceramics, sapphire, quartz, resin hard layer or diamond-like material coating. the

In yet another embodiment, the fingerprint identification device further includes: a flexible circuit board; wherein the flexible circuit film is electrically connected to the flexible circuit board through ACF glue. the

In yet another embodiment, the fingerprint identification device further includes: at least one passive element formed on the flexible circuit board. the

In yet another embodiment, the base ring is integrated with the support, the fingerprint recognition component wraps three sides of the support, or the fingerprint recognition component wraps two sides of the support. the

In yet another embodiment, the fingerprint identification device further includes: a base plate; wherein the fingerprint identification component wrapped with the supporting member is formed on the base plate, and the plane where the sensor is located is away from the base plate. the

In yet another embodiment, the base plate has a through hole, or the side of the base plate has a gap, so that a connecting portion of the flexible circuit film passes through the base plate. the

In yet another embodiment, the base frame is integrated with the bottom plate. the

In yet another embodiment, the base plate has a through hole for passing a connecting portion of the flexible circuit film out of the base plate. the

In yet another embodiment, the bottom plate has a groove for accommodating the control chip. the

Another aspect of the utility model discloses a terminal device, which includes any one of the above-mentioned fingerprint identification devices. the

In one embodiment, the terminal device further includes a pressure sensitive element disposed below the fingerprint recognition device. the

The fingerprint identification device 1 provided by the embodiment of the utility model has a simple packaging process and a small structure, which can meet the needs of the terminal equipment for the thinning and thinning of its integrated components, and is easy to install in the terminal equipment, effectively improving the production efficiency. rate and efficiency. the

Description of drawings

The above and other features and advantages of the present invention will become more apparent by describing in detail example embodiments thereof with reference to the accompanying drawings. the

FIG. 1 is a schematic structural diagram of a fingerprint identification device according to an embodiment of the present invention. the

2A to 2C are exploded views of the fingerprint identification device according to the embodiment of the present invention. the

Fig. 3A and Fig. 3B are exploded schematic diagrams of the fingerprint identification module according to Embodiment 1 of the present invention, taken along A-A' in Fig. 1 . the

Fig. 3C is a schematic diagram of the positional relationship between the support and the sensor in the embodiment of the present invention. the

3D is a schematic diagram of the connection between the fingerprint identification module and the flexible circuit board in the fingerprint identification device according to the embodiment of the present invention. the

Fig. 4 is an exploded schematic view of the fingerprint identification module according to the second embodiment of the present invention along A-A' in Fig. 1 . the

Fig. 5 is an exploded schematic view of the fingerprint recognition module according to the third embodiment of the present invention, cut along A-A' in Fig. 1 . the

Fig. 6 is an exploded schematic view of the fingerprint identification module according to Embodiment 4 of the present invention, taken along A-A' in Fig. 1 . the

Fig. 7 is an exploded schematic view of the fingerprint identification module according to the fifth embodiment of the present invention, cut along A-A' in Fig. 1 . the

8A-8E are schematic diagrams of various base ring structures in the embodiment of the present invention. the

FIG. 9 is an exploded view of a terminal device according to an embodiment of the present invention. the

Detailed ways

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully incorporate the concepts of example embodiments. communicated to those skilled in the art. The same reference numbers in the figures indicate the same or similar structures. the

The described features or structures may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided in order to give a thorough understanding of embodiments of the invention. However, those skilled in the art should appreciate that the technical solutions of the present invention can also be practiced without one or more of the specific details, or with other structures, components, and the like. In other instances, well-known structures or operations are not shown or described in detail to avoid obscuring the invention. the

Terminal equipment is usually configured to include: display screen, touch screen, cover glass, storage, system on chip (system on chip), CPU, GPU, memory, Wi-Fi connection, Bluetooth connection, USB connection, battery, external power supply, computer Readable media and software, etc. the

In addition, the terminal device or the display screen of the terminal device may be configured to include a button or a physical form factor for user interaction (eg power on/off, volume adjustment, etc.). The button can be integrated in the shell of the terminal device, or included in the screen of the terminal device. The size of the physical shape can be less than or equal to 900mm ² , can be less than or equal to 400mm ² , can be less than or equal to 225mm ² , can be less than or equal to 100mm ² , can be less than or equal to 75mm ² , can be less than or equal to 50mm ² , can be less than or equal to 25mm ² , may be less than or equal to 10mm ² , or may be less than or equal to 5mm ² . In some embodiments, the thickness of the physical shape is less than or equal to 2 mm, preferably less than or equal to 1.5 mm, and further, less than or equal to 1 mm.

The fingerprint recognition device may include, for example, a fingerprint sensor, a speed sensor, and a control circuit electrically connected to the fingerprint sensor and the speed sensor. Electrodes of the fingerprint sensor and the speed sensor are formed on the top surface of the substrate by etching or the like. A protective layer is formed on the fingerprint sensor and the speed sensor to provide electrical isolation and mechanical protection for the sensors. Optionally, the electrodes of the fingerprint sensor can also be formed on the bottom surface of the substrate, wherein the substrate can be used as a protective layer, and further a hard coating is formed on the top surface of the substrate. the

The fingerprint identification device disclosed in the utility model is integrated in the screen or the shell of the terminal equipment, and is located on the top surface of the screen or the shell of the terminal equipment, so that when the user's finger touches the top surface of the terminal equipment, the fingerprint sensor and the finger will The distance is within 300 μm. In an at least partial configuration, the fingerprint identification device may be configured such that when the user's finger touches the top surface of the terminal device, the distance between the fingerprint sensor and the finger is within 200 μm, preferably within 150 μm, more preferably within 100 μm , even within 50 μm. the

In some embodiments, a single chip may be provided to control the functions of at least one of the display screen, touch screen and fingerprint recognition device. In addition, the top surface of the terminal device including the fingerprint sensor in the present invention is smooth or substantially smooth. The display screen and the fingerprint recognition device are configured to be integrated and have the same operation mode, or configured as a single component included in the terminal device. the

FIG. 1 is a schematic structural diagram of a fingerprint identification device of the present invention. The fingerprint identification device 1 shown in FIG. 1 can be applied to mobile terminals such as smart phones and tablet computers, and can also be applied to bank terminal equipment such as ATM machines, etc., but the present invention is not limited thereto. the

An area for fingerprint identification is provided on the top surface of the fingerprint identification device 1 for the user, and the user can read his/her fingerprint image by scratching on this area or placing a finger on this area. the

The fingerprint recognition device 1 shown in FIG. 1 is a user interface casing of a terminal device, such as a button in the terminal device, and is integrated in the terminal device, such as a smart phone. Its size can be adaptively designed due to different terminal equipment. The adapted two-dimensional size, such as a square or a rectangle, can be 4mm×1mm, 4mm×4mm, 5mm×15mm, 10mm×10mm or 10mm×15mm, etc. The suitable diameter is, for example, circular or elliptical, and may be 4mm, 5mm, 6mm, 7mm, 8mm, 9mm or 10mm. The above-mentioned dimensions enumerated are only examples, and the utility model is not limited thereto. In addition, the size of the fingerprint identification device 1 is also related to whether the sensor therein is a one-dimensional sensor or a two-dimensional sensor. the

The shape of the fingerprint identification device 1 can be any physical shape, including: circle, ellipse, square, rectangle, trapezoid, triangle, etc., and the present invention is not limited thereto. A smartphone or tablet usually uses a high-gloss substrate as its cover. These covers are typically made of glass, tempered glass, clear plastic, sapphire, ceramic, or any material with a high-gloss surface. In order to fit into such a terminal device, the top surface of the housing of the fingerprint identification device 1 also needs to have a high-gloss surface to match the surrounding surfaces. The material of the top surface of the housing of the fingerprint identification device 1, for example, can be glass, plastic, pottery, resin coating, sapphire, etc. the

In at least some configurations, the fingerprint identification device 1 can obtain the same appearance and touch as the casing of the terminal device. And because of the protective layer 40 placed on the fingerprint identification module 10, the sensor and the color layer 30 in the fingerprint identification module 10 will not directly contact the user's finger, thereby making the fingerprint identification device 1 durable. the

In some embodiments, the fingerprint sensor in the fingerprint identification device 1 can also work in cooperation with the touch sensor (touch sensor) of the terminal device. Use the same control chip to control the touch sensor circuit and the fingerprint sensor circuit. The dual-function controller can be integrated in the fingerprint identification device 1, or be electrically connected with the fingerprint identification device 1 through a flexible circuit board. the

FIG. 2A is an exploded view of the fingerprint identification device of the present invention. As shown in FIG. 1 and FIG. 2A , the fingerprint identification device 1 includes: a fingerprint identification module 10 and a protective layer 40 . the

The protective layer 40 is formed above the fingerprint identification module 10 to protect the fingerprint identification module 10 , especially the sensor 1002 . The protection layer 40 is formed by spraying technology, printing technology or vacuum evaporation technology, and its material includes, for example, a hard resin layer or diamond-like carbon (Diamond-like Carbon, DLC), wherein DLC forms the protection layer by coating. In some embodiments, the protective layer 40 can also be formed of glass, ceramics, sapphire, quartz or other durable materials, such as polymethyl methacrylate (PMMA), polyethylene terephthalate (PET) , polyimide (PI), etc. The protection layer 40 is, for example, a hard coating. In addition, the protective layer 40 may also directly be a cover plate of a terminal device (such as glass or ceramics, etc.). the

In some embodiments, the fingerprint identification device 1 further includes a color layer 30 formed between the fingerprint identification module 10 and the protective layer 40 to ensure that the fingerprint identification module 10 under it is invisible to the user and beautify the fingerprint identification device; In addition, it also has the function of synchronizing with the shell appearance of the terminal equipment. For example, if the terminal equipment it belongs to is white, the fingerprint identification device 1 can be made to appear white through the color layer 30, and if the terminal equipment it belongs to is black, then the fingerprint recognition device 1 can be made to appear white through the color layer 30. The color layer 30 makes the fingerprint identification device 1 appear black. The color layer 30 is, for example, an ink layer, or a plating layer formed by a deposition technique or other special techniques. Generally, the color layer 30 can be displayed as white, black, etc., but the present invention is not limited thereto. In addition, other layers may be included under the protective layer 40 or under the protective layer 40 and the color layer 30 , and the present invention is not limited thereto. the

In some embodiments, the fingerprint identification device 1 further includes a bottom plate 50 . Wherein, the fingerprint identification module 10 is bonded on the bottom plate 50, for example, by pressure-sensitive adhesive (Pressure-Sensitive Adhesive, PSA) for bonding. the

As shown in FIG. 1 and FIG. 2A , the fingerprint recognition module 10 includes a connecting portion E for electrically connecting the fingerprint recognition module 10 with a flexible circuit board (FPC). During packaging, as shown in FIG. 2B, a through hole H can be formed on the base plate 50 by means of a hole, and the connecting portion E can be passed through the bottom of the base plate 50; or, as shown in FIG. 2C, A small piece is cut off from the side of the bottom plate 50 to form a slit B to pass through the connecting portion E from the bottom of the bottom plate 50 . It should be noted that the position, size, and shape of the through hole H in FIG. 2B and the notch B in FIG. 2C are for illustrative purposes only, and are not intended to limit the present invention. the

In some embodiments, the fingerprint identification device 1 further includes a bezel 20 . The base ring 20 has a top opening, covers the fingerprint identification module 10 formed with the protective layer 40 or the color layer 30 and the protective layer 40, at least partially places the fingerprint identification module 10 therein, and is used to form a fingerprint identification module 10. Outline of device 1. The material of the base ring 20 is, for example, metal, plastic or PEEK (polyetheretherketone, polyether ether ketone resin) material, which has the characteristics of wear resistance, high temperature resistance, corrosion resistance and the like. The shape of the base ring 20 depends on the overall shape of the fingerprint identification device 1, and may be a circular ring, an elliptical ring, a square ring, and the like. the

In some embodiments, when the sensor used to sense the user's fingerprint in the fingerprint identification module 10 adopts an active fingerprint identification sensor, the base ring 20 is also used to modulate the voltage of the user's finger to provide better capacitance and improve Sensing accuracy. In addition, the base ring 20 can also be used to shield against electromagnetic effects, with the effect of providing capacitive isolation or other electromagnetic isolation. the

In some other embodiments, the base ring 20 may also be used only for decoration. the

The top surface of the base ring 20 can be flush with the top surface of the protection layer 40 , or as shown in FIGS. 8A to 8E , the top surface of the base ring 20 is higher than the protection layer 40 . As shown in FIG. 8A, the base ring 20 can have a right angle toward its center, that is, the top angle toward the fingerprint identification module 10; or, as shown in FIG. The chamfer of the identification module 10; or, as shown in FIG. 8C, the base ring 20 is arc-shaped towards its center, that is, the top corner towards the fingerprint identification module 10; or, as shown in FIG. 8D, the base ring 20 includes The side part and the protruding part connected to the side part, the bottom surface of the protruding part is in contact with the protective layer 40; or, as shown in FIG. 10 chamfers; in addition, the vertex of the protruding part toward its center can also be arc-shaped, and the utility model is not limited thereto. As shown in Figure 8A or Figure 8D, the top surface of the base ring 20 is higher than the top surface of the protective layer 40, for example, the height difference between the two is H, when the user's finger performs fingerprint recognition, if the fingerprint recognition component 100 When the distance L between the sensing area and the base ring is 0, the finger will not touch the fingerprint recognition component 100 near the base ring 20 , so the fingerprint of the user's finger cannot be accurately recognized. the

As shown in FIG. 8B, FIG. 8C or FIG. 8E, although the base ring 20 has a chamfer or the apex toward the central part is arc-shaped, the area where the finger cannot touch the fingerprint recognition component 100 is smaller than that shown in FIG. 8A or FIG. 8D shows the case where the apex angle toward the central part is a right angle, but L is also required to be greater than 0 to ensure accurate fingerprint recognition. the

It is found in the research that there is a certain proportional relationship between the distance L and the height H. When the ratio of H to L, that is, H/L, is 1/5 to 2/3, accurate fingerprint identification can be ensured. Preferably, H/L is 1/4˜1/2. Based on this, when setting the sensing area of the fingerprint sensor, try to avoid setting the sensing area within the blind area (that is, the area that cannot be touched by fingers). the

In Fig. 1 and Fig. 2A, the protruding upper part of the base ring 20 is shown as an example of a rectangle, and it can also be a square, a circle, an oval, etc., depending on the design requirements of the terminal equipment. This is the limit. Furthermore, in some embodiments, the base ring may also only include the protruding upper portion of the base ring 20 shown in FIG. 2A . the

Fig. 3A is an exploded schematic view of the fingerprint recognition module according to Embodiment 1 of the present invention, taken along A-A' in Fig. 1 . It should be noted that this figure is an exploded schematic view of the structure of the fingerprint identification module. In order to more clearly illustrate the structure of the fingerprint identification module, the components in the figure are not directly connected, and it cannot be used to limit the fingerprint identification of the utility model. Identify the connections between the various components of the module; in addition, in order to simplify the drawings, the base ring 20 in the figure is a structure that only includes the upper part of the base ring 20 in FIG. 2A . The above description is also applicable to FIG. 3B and FIGS. 4 to 7 . the

As shown in FIG. 3A , the fingerprint recognition module 10 includes: a fingerprint recognition component 100 and a support 102 . The fingerprint recognition component 100 includes: a flexible circuit film 1000 and a sensor 1002 and a control chip 1004 formed on the flexible circuit film 1000 . the

The flexible circuit film 1000 can be, for example, a polyimide film (Polyimide film, PI film), as shown in the figure, it can be composed of two layers of polyimide resin (Polyimide resin, PI resin); PI substrate, the other layer is a protective layer resin of other materials, the utility model is not limited thereto. the

The sensor 1002 is formed on the flexible circuit film 1000 . At least one sensing element is included to sense the ridges and valleys of the user's finger to identify the user's fingerprint. The sensor 1002 can be a single-layer (i.e. one-dimensional) structure or a double-layer (i.e. two-dimensional) structure, and the present invention is not limited thereto. the

The sensor 1002 in the present invention may be a scratching sensor distributed in strips, or a push sensor distributed in an array, and the present invention is not limited thereto. Additionally, the sensor 1002 may also operate in conjunction or in combination with elements that perform optical sensing, infrared sensing, or other sensing of the user's fingerprint, which may themselves be coupled to the epidermis of the user's finger, the subcutaneous portion of the user's finger, Or some other feature representing the user's fingerprint. the

The control chip 1004 is electrically connected to the flexible circuit film 1000 through, for example, flip chip technology. The front of the control chip 1004 faces the flexible circuit film 1000 without wire bonding, and a certain number of metal balls (such as solder balls) are used to electrically and mechanically connect the control chip 1004 to the flexible circuit film 1000 . Using flip-chip technology, because it does not require wire bonding, it can form the shortest circuit and reduce resistance; in addition, by using metal ball connections, the package size is reduced and the electrical performance is improved. the

The control chip 1004 and the sensor 1002 are not packaged in the same chip as an integrated packaging structure, but are independently and separately disposed on the same side of the flexible circuit film 1000 , and are electrically connected to the flexible circuit film 1000 respectively. The control chip 1004 is electrically connected to the sensor 1002 through the flexible circuit film 1000, so that the signal of the sensor 1002 is transmitted to the control chip 1004 for processing. the

As shown in FIG. 3A , the support member 102 is wrapped by the fingerprint recognition component 100 , and the flexible circuit film 1000 in the fingerprint recognition component 100 wraps four sides of the support member 102 . The flexible circuit film 1000 can wrap the support member 102 in a closed manner, that is, the two ends of the flexible circuit film 1000 can leave no gap at the interface, or can wrap the support member 102 in an unclosed manner, that is, as shown in the figure, the flexible circuit film 1000 There is a gap at the interface at both ends, and the utility model is not limited thereto. the

FIG. 3B is another schematic diagram of the wrapping relationship between the flexible circuit film 1000 and the support member 102 in the first embodiment. As shown in FIG. 3B , the two ends of the flexible circuit film 1000 partially overlap at the interface, and the inner edge partially wraps one side of the supporting member 102 . the

During production, one end of the flexible circuit film 1000 is first attached to a part of one surface of the support member 102, and then after wrapping the adjacent surface of the surface, the support member 102 and the sensor 1002 are on a horizontal plane as shown in FIG. 3C. The central axis of symmetry AA' of the long side of the support 102 passes through the center of the sensor 102, so that after the flexible circuit film 1000 wraps the support 102, the center of the long side of the support 102 and the center of the sensor 102 are perpendicular to the support In the plane of the top surface of the member 102; then completely wrap the support member 102 face by face so that the other end overlaps the first end. the

The supporting member 102 may be a cuboid, a cube, etc., and the present invention is not limited thereto. the

The flexible circuit film 1000 and the supporting member 102 are bonded at least partially by setting an adhesive to fix the fingerprint recognition component 100 and the supporting member 102 . For example, as shown in the figure, adhesive can be used only on the horizontal plane (shown in black part in the figure) to join, and adhesive can also be used to join on any surface where the support member 102 is in contact with the fingerprint identification component 100, The utility model is not limited thereto. The adhesive is, for example, a pressure sensitive adhesive (PSA). the

In order to accommodate the control chip 1004 , a part is dug out on one surface of the support member 102 to form a groove for accommodating the control chip 1004 . In some embodiments, in order to avoid the phenomenon that the control chip 1004 is damaged due to the user's finger pressing the fingerprint recognition device 1, the height of the cut-out part on the support member 102 can be slightly higher than the control chip 1004, so that the support member 102 The control chip will not be touched, thereby avoiding damage to the control chip 1004 . the

The base ring 20 is covered on the fingerprint identification component 100 formed with the protective layer 40 or the color layer 30 and the protective layer 40 , the fingerprint identification component 100 is placed therein, and. the

The protective layer 40 is formed on at least a part of the fingerprint identification component 100 and located on the sensor 1002 . The top opening of the base ring 20 exposes the protection layer 40 . the

Color layer 30 is applied over sensor 1002 between protective layer 40 and flexible circuit film 1000 . the

In order to better fix the base ring 20 and the fingerprint identification module 10, the base ring 20 and the fingerprint identification module 10 can also be joined by, for example, pressure-sensitive adhesive (not shown in the figure), but the utility model does not limit. the

In addition, as shown in FIG. 3D , the fingerprint identification device 1 further includes: a flexible circuit board 60 , and the fingerprint identification module 10 is bonded to the flexible circuit board 60 through the connection part E on the flexible circuit film 1000 . The flexible circuit film 1000 and the flexible circuit board 60 are electrically connected by laminating ACF (anisotropic conductive adhesive or anisotropic conductive adhesive) on the connecting portion E, and then bonding with the flexible circuit board 60 . the

The fingerprint identification device 1 is electrically connected to an external circuit (for example, a processing circuit of a smart phone or a tablet computer) through a flexible circuit board 60 . the

In addition, the flexible circuit board 60 also includes at least one passive element 610, such as a resistor or a capacitor. the

Fig. 4 is an exploded schematic view of the fingerprint identification module according to the second embodiment of the present invention along A-A' in Fig. 1 . The difference between the fingerprint recognition module 11 of the second embodiment shown in FIG. 4 and the fingerprint recognition module 10 of the first embodiment shown in FIG. the way of packing. the

As shown in FIG. 4 , the fingerprint identification component 100 in the fingerprint identification module 11 only covers three sides of the support member 102 , thereby simplifying the structure of the fingerprint identification module 11 and saving the material of the flexible circuit film 1000 . the

The content in the second embodiment that is the same as that in the first embodiment will not be repeated here. the

Fig. 5 is an exploded schematic view of the fingerprint recognition module according to the third embodiment of the present invention, cut along A-A' in Fig. 1 . The difference between the fingerprint recognition module 12 of the third embodiment shown in FIG. 5 and the fingerprint recognition module 10 of the first embodiment shown in FIG. The way of wrapping between them, and the shape of the support 102'. the

As shown in Fig. 5, the fingerprint identification component 100 in the fingerprint identification module 12 only wraps the two sides of the support member 102', which further simplifies the structure of the fingerprint identification module 12 and saves the material of the flexible circuit film. the

In the third embodiment, since the fingerprint identification component 100 only wraps the two sides of the support 102', the support 102' does not need to accommodate the control chip 1004 on the flexible circuit film 1000, so the support 102' can be a cube, for example , without digging a portion of the bottom surface. the

In addition, when attaching the fingerprint recognition module 12 to the bottom plate 50 (not shown in the figure), for example, the flexible circuit film 1000 formed with the control chip 1004 can be bent 90 degrees toward the base ring 20 on the right side of the figure. , and then dig out a corresponding area at a corresponding position on the top surface of the bottom plate 50 to form a groove for accommodating the control chip 1004 . In addition, it is also possible to perforate the bottom plate 50 so that the control chip 1004 passes through the bottom plate 50, then bends 90 degrees, and digs out a corresponding area on the bottom surface of the bottom plate 50 to form a groove for accommodating the control chip 1004. Chip 1004. the

The content in the third embodiment is the same as that in the first embodiment, which will not be repeated here. the

Fig. 6 is an exploded schematic view of the fingerprint identification module according to Embodiment 4 of the present invention, taken along A-A' in Fig. 1 . The difference between the fingerprint recognition module 13 of the fourth embodiment shown in FIG. 6 and the fingerprint recognition module 10 of the first embodiment shown in FIG. 3A is that the base ring 20' in the fingerprint recognition module 13 includes a bottom plate 50', namely The base ring 20' and the base plate 50' are integrally designed. In order to pass the connecting part E (not shown) of the fingerprint identification module 13 from the bottom plate 50', a through hole (not shown) needs to be formed on the bottom plate 50', and can refer to the bottom plate in Fig. 2B The through hole H on the 50, so that the connecting part E passes through the through hole. the

Although the fourth embodiment shown in FIG. 6 takes the fingerprint recognition module 10 in the first embodiment as an example, that is, the fingerprint recognition module 100 wraps the four sides of the support member 102, this embodiment is also applicable to the second embodiment The fingerprint identification module 11 in and the fingerprint identification module 12 in the third embodiment. When this embodiment is implemented in the fingerprint identification module 12 in the third embodiment, it is also necessary to perforate the bottom plate 50', so that the control chip 1004 passes through the bottom plate 50, then bends 90 degrees, and places it on the bottom of the bottom plate 50'. A corresponding area is dug out from a corresponding position on the surface to form a groove for accommodating the control chip 1004 . Alternatively, bend 90 degrees directly to the base ring 20' on the right side of the figure. the

It should be noted that, unlike Embodiments 1 to 3, the base ring 20 in Embodiments 1 to 3 is formed from the top surface of the fingerprint recognition module (which also includes at least the base and the protective layer) top surface) downwards, and because the base ring and the base in Embodiment 4 are designed in one piece, the base ring in Embodiment 4 is set on the fingerprint from the bottom surface of the fingerprint identification module (including at least the protective layer) upwards. On the identification module (also including at least the protective layer). the

The content in the fourth embodiment is the same as that in the first embodiment, which will not be repeated here. the

Fig. 7 is an exploded schematic view of the fingerprint identification module according to the fifth embodiment of the present invention, cut along A-A' in Fig. 1 . The difference between the fingerprint recognition module 14 of the fifth embodiment shown in Figure 7 and the fingerprint recognition module 10 of the first embodiment shown in Figure 3A is that the base ring 20" in the fingerprint recognition module 14 is different from the fingerprint The support 102 in the identification module 10 is integrated, that is, the base ring 20" also realizes the function of the support. In addition, because the base ring 20" and the support are designed as one, the fingerprint recognition module 100 only wraps three parts of the base ring 20". surface, and the bottom surface of the part wrapped by the fingerprint identification component 100 in the base ring 20″ is also hollowed out a corresponding area to form a groove to accommodate the control chip 1004.

In order for the fingerprint recognition component 100 to wrap part of the bottom surface of the base ring 20", it is necessary to form a through hole 210 between the left and right parts of the base ring 20" as shown in FIG. The hole wraps 20" of the bottom surface of the base ring.

In addition, although in the fifth embodiment, the three faces of the fingerprint identification component 100 wrapping the base ring 20" are taken as an example, the implementation in the fifth embodiment is also applicable to the fingerprint identification module 12 of the third embodiment shown in FIG. 5, That is, as shown in Figure 5, the fingerprint recognition assembly 100 wraps the upper surface and the side surface of the supporting part of the base ring 20", then directly passes through the through hole 210 in Figure 7, and then goes to the base ring on the right side of the figure. Ring 20" bent 90 degrees.

The content in the fifth embodiment is the same as that in the first embodiment, which will not be repeated here. the

The thickness of the protective layer 40 in the fingerprint identification device 1 of the embodiment of the present utility model is, for example, 0.015 mm, the thickness of the color layer 30 is, for example, 0.01 mm, and the thickness of the adhesive between the color layer 30 and the fingerprint identification module 10 is, for example, The thickness of the flexible circuit film 1000 formed with the sensor 1002 and the control chip 1004 is, for example, 0.05 mm. Therefore, the fingerprint identification device 1 of the embodiment of the present invention can provide a very thin thickness to meet the demand of terminal equipment for thinning and thinning its integrated components. The above-mentioned dimensions are for example only, and do not limit the present invention. the

Taking Embodiment 1 as an example, the manufacturing process of the fingerprint identification device 1 according to the embodiment of the present utility model generally includes: firstly, the flexible circuit film 1000 cut into individual pieces and formed with the sensor 1002 and the control chip 1004 is pressed together with the supporting member 102 , the lamination sequence is sensor 1002 lamination, control chip 1004 lamination, and edge lamination. During lamination, the flexible circuit film 1000 and the support member 102 are at least partially bonded by an adhesive to fix the flexible circuit film 1000. The circuit film 1000 and the support member 102; then, the flexible circuit film 1000 wrapping the support member 102 is attached to the base plate 50, for example, by pressure-sensitive adhesive (PSA), and in addition, the base plate 50 needs to be perforated to Form a through hole (as shown in FIG. 2B ) or cut off a small piece of the edge to form a gap (as shown in FIG. 2C ), the connection part E on the flexible circuit film 1000 will pass through the bottom plate 50, so as to connect with the flexible circuit board 60 electrical connection; after that, after the assembly of the bottom plate is completed, curing (Base Post Cure); coloring (Color Coating) on the sensor 1002 to form a color layer 30; after coloring, baking and curing (Post Color Cure) Afterwards, UV glue is applied to form the protective layer 40, and curing (UV Cure) is carried out again; then, the base ring 20 is bonded by PSA; the assembly after the base ring 20 is added is baked again Post Housing Cure; after curing, perform plasma cleaning, mainly for the cleaning of the connection part E, so as to bond the flexible circuit board 60 with ACF glue; after plasma cleaning, paste at the position of the connection part E ACF glue, and ACF bonding (ACF bonding), so that the flexible circuit film 1000 and the flexible circuit board 60 are electrically connected, the ACF particles in the ACF glue will break when high temperature bonding, and the electrical conduction, and the position where the bonding is not Then there will be no electrical conduction; finally, if necessary, perform a manual test on the fingerprint identification device. the

In addition, the manufacturing process can also be: first paint the sensing area corresponding to the sensor 1002 that is in contact with the finger, apply UV glue, and then attach it to the support member 102; after that, attach it to the bottom plate 50, and Extend the connection part E out of the bottom plate 50; then cover the base ring 20; finally use the ACF to attach the connection part E to the flexible circuit board 60 for electrical connection. the

Alternatively, it may also be: first attach the flexible circuit film 1000 to the support member 102; then, paint and apply UV glue to the sensing area corresponding to the sensor 1002 in contact with the finger; then attach the flexible circuit film 1000 to the base plate 50, and The connection part E protrudes from the base plate; then the base ring 20 is covered; finally, the connection part E is bonded to the flexible circuit board 60 by using the ACF for electrical connection. the

FIG. 9 is an exploded view of a terminal device according to an embodiment of the present invention. The fingerprint recognition device 22 of the embodiment of the present utility model can be integrated into a touch screen or a casing of a terminal device 2 such as a smart phone or a tablet computer. For example, it can be used in combination with a control button or switch element of the terminal device 2 , or can be directly embedded into the cover glass or housing of the terminal device 2 and used alone. In short, adaptive adjustments can be made according to the conditions of the terminal device 2 to facilitate the use of the user. As shown in Figure 9, when the fingerprint recognition device 22 is used in combination with the control button or switch element of the terminal device 2, the fingerprint recognition device 22 is installed in the button hole 210 on the cover glass 20 of the terminal device 2, and the fingerprint recognition device A pressure sensitive element 24 also needs to be provided below the 22 to sense the pressing operation of the user when operating the control button or switch element. It should be noted that the shape of the pressure sensitive element 24 shown in the figure is only for illustrative purposes, and does not limit the utility model. the

The fingerprint identification device 1 provided by the embodiment of the utility model has a simple packaging process and a small structure, which can meet the needs of the terminal equipment for the thinning and thinning of its integrated components, and is easy to install in the terminal equipment, effectively improving the production efficiency. rate and efficiency. the

Exemplary embodiments of the present utility model have been specifically shown and described above. It should be understood that the invention is not limited to the disclosed embodiments, but on the contrary, the invention is intended to cover various modifications and equivalents included within the scope of the appended claims. the

Claims (31)

1. A fingerprint identification device, characterized in that, comprising: A fingerprint identification component, including: a flexible circuit film and a sensor and a control chip formed on the flexible circuit film, wherein the sensor is electrically connected to the control chip; a support member at least partially wrapped by said fingerprint identification assembly; a protective layer formed on at least part of the fingerprint recognition component and located above the sensor; and a base ring having a top opening, the fingerprint identification assembly is at least partially accommodated within the base ring; Wherein, the protection layer is exposed through the top opening of the base ring. the 2 . The fingerprint recognition device according to claim 1 , wherein the sensor and the control chip are separately disposed on the same side of the flexible circuit film, and are respectively electrically connected to the flexible circuit film. 3 . the 3 . The fingerprint identification device according to claim 2 , wherein the sensor and the control chip are respectively arranged on two opposite sides of the supporting member. 4 . the 4. The fingerprint identification device according to claim 2, wherein the control chip is electrically connected to the flexible circuit film in a flip-chip manner. the 5 . The fingerprint identification device according to claim 1 , wherein the center of the support member and the center of the sensor are in the same plane perpendicular to the top surface of the support member. the 6 . The fingerprint identification device according to claim 1 , wherein one end of the fingerprint identification component is attached to a part of one surface of the support member. 7 . the 7. The fingerprint recognition device according to claim 1, wherein the fingerprint recognition component wraps four sides of the support member. the 8. The fingerprint recognition device according to claim 1, wherein the fingerprint recognition component wraps three sides of the support member. the 9. The fingerprint identification device according to claim 7 or 8, characterized in that, the support member has a groove for accommodating the control chip. the 10. The fingerprint identification device according to claim 9, wherein the depth of the groove is greater than the thickness of the control chip. the 11. The fingerprint recognition device according to claim 1, wherein the fingerprint recognition component wraps two surfaces of the support member. the 12. The fingerprint recognition device according to claim 1, wherein the top surface of the base ring is higher than the top surface of the protective layer. the 13 . The fingerprint identification device according to claim 12 , wherein the top surface of the base ring has a chamfer toward the center, or the top surface of the base ring is arc-shaped toward the center. 14 . the 14. The fingerprint identification device according to claim 12, wherein the base ring comprises a side portion and a protrusion connected to the side portion, the bottom surface of the protrusion contacts the protective layer. the 15. The fingerprint identification device according to claim 12, wherein the height difference between the top surface of the base ring and the top surface of the protective layer is H, and the distance between the base ring and the sensing area of the sensor is H. The shortest distance is L, and H/L is 1/5～2/3. the 16. The fingerprint identification device according to claim 15, characterized in that H/L is 1/4˜1/2. the 17. The fingerprint identification device according to claim 1, wherein the top surface of the base ring is flush with the top surface of the protective layer. the 18. The fingerprint recognition device according to claim 1, wherein the support member is at least partially bonded to the flexible circuit film through an adhesive. the 19. The fingerprint identification device according to claim 1, further comprising: a color layer coated above the sensor and located between the protective layer and the fingerprint identification component. the 20. The fingerprint recognition device according to claim 19, wherein the color layer comprises an ink layer. the 21. The fingerprint recognition device according to claim 1, wherein the protective layer comprises glass, ceramics, sapphire, quartz, a hard resin layer or a diamond-like material coating. the 22. The fingerprint identification device according to claim 1, further comprising: a flexible circuit board; wherein the flexible circuit film is electrically connected to the flexible circuit board through ACF glue. the 23. The fingerprint recognition device according to claim 22, further comprising: at least one passive component formed on the flexible circuit board. the 24. The fingerprint identification device according to claim 1, wherein the base ring is integrated with the support, the fingerprint identification component wraps three sides of the support, or the fingerprint identification component Wrap both sides of the support. the 25. The fingerprint identification device according to claim 1, further comprising: a base plate; wherein the fingerprint identification component wrapped with the supporting member is formed on the base plate, and the plane where the sensor is located away from the floor. the 26. The fingerprint identification device according to claim 25, wherein the base plate has a through hole, or the side of the base plate has a gap, so that a connecting portion of the flexible circuit film passes through the base plate . the 27. The fingerprint identification device according to claim 25, wherein the base ring is integrated with the bottom plate. the 28 . The fingerprint recognition device according to claim 27 , wherein the base plate has a through hole for passing a connection portion of the flexible circuit film out of the base plate. the 29. The fingerprint identification device according to claim 25 or 27, wherein the bottom plate has a groove for accommodating the control chip. the 30. A terminal device, comprising the fingerprint identification device according to any one of claims 1-29. the 31. The terminal device according to claim 30, further comprising a pressure-sensitive element disposed below the fingerprint identification device. the