CN204495740U - Inspection device for connection structure for secondary battery - Google Patents

Abstract

The utility model provides an inspection device for a connection structure for a secondary battery capable of appropriately inspecting the bonding state of pole plates. An inspection device (40) for a connected structure for a secondary battery for inspecting the joint state of a positive electrode plate (15) and a positive electrode current collector plate (12) and a joint state of a negative electrode plate (16) and a negative electrode current collector plate (13) is equipped with an imaging device. part (47), the imaging part (47) is used to connect the joint surface (20) of the positive electrode collector plate (12) of the structure (11) and the joint part of the positive electrode plate (15) and the joint of the positive electrode collector plate (12) The surface (20) is set so that the unjoined portion is included in the imaging range, and a three-dimensional image of the joined portion and the unjoined portion is produced.

Description

Inspection device for connection structure for secondary battery

technical field

The utility model relates to an inspection device for inspecting a connection structure for a secondary battery with a plurality of pole plates joined on a collector plate.

Background technique

Secondary batteries such as nickel-metal hydride batteries sometimes include a structure in which a plurality of positive electrode plates joined to a current collector plate on the positive electrode side and a plurality of negative electrode plates joined to a current collector plate on the negative electrode side are separated by an insulating material. The partitions are stacked on top of each other.

An example of such a bonded structure is shown in FIG. 8 . The bonded structure 11 includes a positive electrode current collector 12 and a negative electrode current collector 13 arranged in parallel. A plurality of positive electrode plates 15 and negative electrode plates 16 are alternately arranged between the positive electrode current collector plate 12 and the negative electrode current collector plate 13 with separators 24 interposed therebetween. Joining end 17 , which is an end of positive electrode plate 15 , vertically butts against joint surface 20 of positive electrode collector plate 12 , and is joined to positive electrode collector plate 12 by brazing, welding, or the like. In addition, the negative electrode plate 16 is also vertically abutted against the joint surface 21 of the negative electrode current collector plate 13 with the joint end portion 18 as its end portion, and is joined to the negative electrode current collector plate 13 by brazing, welding, or the like. The positive electrode current collector plate 12 and the negative electrode current collector plate 13 respectively have flange portions 22 , 23 formed by bending both ends thereof toward the bonding surfaces 20 , 21 sides.

Between the joining end portions 17 of adjacent positive electrode plates 15 is formed a fillet 30 which is a metal solidified portion formed by brazing, welding, or the like. In addition, a fillet 30 is similarly formed between the joint end portions 18 of adjacent negative electrode plates 16 .

Regarding the bonded structure 11 having such a configuration, before the bonded structure 11 is accommodated in the battery case, the bonded state of the positive electrode plate 15 and the positive electrode current collector plate 12 and the bonded state of the negative electrode plate 16 and the negative electrode current collector plate 13 are performed. examine. Conventionally, as an inspection device for inspecting a bonded state, a device that takes an image of the bonded structure 11 and analyzes the imaged image is known (for example, refer to Patent Document 1).

As shown in FIG. 9 , in the inspection device described in Patent Document 1, the welding fillet 30 provided between the plurality of positive electrode plates 15 and the welding fillet 30 provided between the plurality of negative electrode plates 16 are analyzed using the imaging device 100 . The image obtained is taken, and the shape, height, etc. of the fillets 30 are judged, thereby evaluating the joining state of the positive electrode plate 15 and the negative electrode plate 16 . The illuminance between a plurality of positive electrode plates 15 and between a plurality of negative electrode plates 16 is insufficient. Therefore, when imaging, at least one of the rear illuminator 101 that illuminates the bonded structure 11 from the back and the front illuminator 102 that illuminates the bonded structure 11 from the front is used. One side irradiates the bonded structure 11 .

Also, for example, when detecting the height of the fillet 30 , the height from the joint surface 20 of the positive electrode plate 15 and the joint surface 21 of the negative electrode plate 16 should be detected originally. However, even if the connected structure 11 is irradiated with at least one of the rear lighting device 101 and the front lighting device 102, it is difficult to detect the bonding surfaces 20, 21 of the image processing due to the shadows formed by the positive electrode plate 15, the negative electrode plate 16, or the fillet 30. . Therefore, in the above inspection device, the top end of the flange portion 22 of the positive electrode current collector plate 12 and the top end of the flange portion 23 of the negative electrode current collector plate 13 are detected, and the detected top ends of the flange portions 22, 23 are used as an image. Parsed benchmarks. Then, the height of the fillet 30 is calculated using the reference of the image analysis and the set value of the height of the flange portions 22 and 23 .

Patent Document 1: JP-A-2014-110090

However, the actual heights of the flange portions 22 and 23 deviate from the set values. Therefore, in an inspection device that sets a reference for image analysis on the tips of the flange portions 22 , 23 , the fillet height is calculated without removing the influence of variations in the flange portions 22 , 23 . In addition, when the determination of good and bad products is performed based on the fillet height calculated in this way, good products may be judged as defective, or non-defective products may be judged as good. Therefore, another process for confirming the determination result, for example, is required. In addition, such a problem is not limited to the case of judging the height of the fillet at the joint end portions 17 and 18 , and is generally common when inspecting other items such as the bending of the electrode plate and the shape of the fillet.

Utility model content

This invention is made|formed in view of the said actual situation, It aims at providing the inspection apparatus of the connection structure for secondary batteries which can inspect the junction state of an electrode plate and a collector plate suitably.

Next, an inspection device for a connected structure for a secondary battery that solves the above-mentioned problems is a connected structure for a secondary battery in which a plurality of electrode plates are joined to a collector plate. In the connected structure for a secondary battery in which fillets are formed, the bonding state of the electrode plate and the current collector plate is inspected. The gist is that the inspection device includes an imaging device that captures the joint surface of the current collector plate and the joint portion of the electrode plate and the joint surface of the current collector plate of the connection structure for secondary batteries. A three-dimensional image of the joined portion and the unjoined portion is created.

According to the above configuration, a three-dimensional image including the joint surface of the current collector plate, the joint portion of the electrode plate, and the portion of the joint surface that is not bonded to the electrode plate can be created. Therefore, a cross-sectional image or an end surface image of a portion not bonded to the electrode plate among the bonded surfaces of the three-dimensional image can be created. Therefore, the joint surface of the current collector can be detected from the cross-sectional image or the end surface image. That is, the position of the joint surface can be used as a reference for judging the electrode plate and judging the fillet. In the past, the joint surface could not be used as a criterion for judgment, so flange portions formed by bending both ends of the current collector plate were used as a criterion for judgment. However, the joint state of the electrode plates can be appropriately judged by this.

In this inspection device for a connected structure for a secondary battery, it is preferable that the imaging device includes an imaging element for connecting the electrode plate, the current collector plate, and the solder leg to a secondary battery that is made of metal. The structure emits infrared rays, and detects disturbance fringes of light reflected from the connection structure for a secondary battery.

According to the above configuration, since the infrared rays having a high reflectance with respect to the metal are emitted from the imaging device, the detection accuracy of the imaging element is improved. As a result, a three-dimensional image in which the collector plate, the electrode plate, and the fillet can be clearly displayed can be produced, so that the inspection of the electrode plate and the inspection of the fillet can be appropriately performed.

According to the present invention, it is possible to appropriately determine the state of the junction.

Description of drawings

FIG. 1 is a block diagram showing a schematic configuration of an embodiment of an inspection device for a connected structure for a secondary battery according to the present invention.

FIG. 2 is a perspective view illustrating a scanning direction of an imaging device with respect to the bonded structure of the above-mentioned embodiment.

Fig. 3 is a schematic view showing cross-sectional positions of an end surface image of a bonded structure produced in the above embodiment.

FIG. 4 is a diagram showing an end surface image at one cross-sectional position 110 in FIG. 3 .

FIG. 5 is a diagram showing an end surface image at the other cross-sectional position 111 in FIG. 3 .

FIG. 6 is a flowchart showing the procedure of inspection using the inspection device in the above embodiment.

Fig. 7 shows a part of the inspection process of the above-mentioned embodiment, (a) and (b) show the case of pole plate judgment, (c) and (d) show the case of fillet judgment.

FIG. 8 is a cross-sectional view showing an example of a bonded structure.

FIG. 9 is a schematic diagram showing a schematic configuration of a conventional inspection device for a bonded structure.

Detailed ways

One embodiment of an inspection device for a connected structure for a secondary battery will be described below.

The bonded structure for secondary batteries (hereinafter, bonded structure) to be inspected has the same structure as the conventional bonded structure 11 shown in FIG. 8 . That is, the bonded structure 11 is a positive-side structure with a plurality of positive plates 15 joined to the positive current collector 12 and a negative-side structure with a plurality of negative plates 16 joined to the negative current collector 13. The positive electrode plates 15 and the negative electrode plates 16 are combined in such a manner that the separators 24 are alternately arranged. The positive electrode plate 15 and the negative electrode plate 16 and the positive electrode current collector plate 12 and the negative electrode current collector plate 13 are made of a metal material. In addition, fillets 30 are formed between joint end portions 17 of the plurality of positive electrode plates 15 , and fillets 30 are metal solidified portions formed by brazing, welding, or the like. In addition, fillets 30 are similarly formed between the joint end portions 18 of the plurality of negative electrode plates 16 . Solder fillets 30 are formed at a plurality of positions in the joint end portion 17 of one piece of positive electrode plate 15 . Also, solder fillets 30 are formed at a plurality of positions in the joint end portion 18 of one negative electrode plate 16 .

As shown in FIG. 1 , the inspection device 40 of the bonded structure 11 includes an imaging unit 47 that captures a three-dimensional image of the bonded structure 11 installed at a predetermined position such as a mounting table 46 . The imaging unit 47 includes: a light source that emits infrared rays; an optical system that divides emitted light from the light source; and an imaging element 48 that detects a noise pattern of light. The emitted light from the light source is split into reference light and measurement light reflected by the bonded structure 11 by an optical system, and the imaging element 48 detects the interference pattern of the measurement light and the reference light. Infrared light has a high reflectance with respect to metal, and therefore, the detection accuracy is improved by making the bonded structure 11 the object of imaging. In addition, the imaging part 47 is not limited to this structure, The 3D scanner which scans a laser beam etc. can also be used.

The imaging device 41 includes an image processing device 42 . The image processing device 42 analyzes the signal input from the imaging unit 47 to create a three-dimensional image. In addition, the image processing device 42 is connected to an input operation unit 43 operated by an operator performing an inspection, and a display 44 displaying an image created by the image processing device 42 . The image processing device 42 creates a three-dimensional image of the connected structure 11 based on the signal input from the imaging unit 47 and displays it on the display 44 . In addition, the image processing device 42 forms a cross-sectional image or an end surface image of a three-dimensional image at a cross-sectional position instructed by the operator through the input operation unit 43 , and displays it on the display 44 .

In addition, the imaging unit 47 is connected to the drive unit 45 . The driving unit 45 has a circuit for driving the optical system of the imaging unit 47 and the like, and scans the measurement light emitted from the imaging unit 47 .

In the case of inspecting the joint state of the positive electrode plate 15 and the positive electrode current collector plate 12, the imaging unit 47 detects the welding fillet 30 closest to the imaging unit 47 among the plurality of welding fillets 30 formed on the joint end portion 17 of the positive electrode plate 15. The portion of the joint surface 20 with the positive electrode current collector 12 that is in front of the fillet 30 is arranged so as to be accommodated in the imaging range. In the case of checking the bonding state of the negative electrode plate 16, the bonding surface of the welding leg 30 closest to the imaging part 47 among the plurality of solder fillets 30 formed at the joint end portion 18 of the negative electrode plate 16 and the negative electrode current collector plate 13 is 21, the part forward of the fillet 30 is arranged so as to be accommodated in the imaging range.

As shown in FIG. 2 , the imaging unit 47 takes an image of the joint surface 20 of the positive electrode current collector 12 from a position on the negative electrode current collector 13 side when inspecting the bonding state of the positive electrode plate 15 and the positive electrode current collector 12 . That is, imaging is taken from obliquely above the bonding surface 20 of the positive electrode current collector plate 12 . In addition, the connecting piece 51 provided at the end of the positive electrode collector plate 12 and having the electrical contact 50 may also be included in the imaging range. The driving unit 45 drives the imaging unit 47 so that the measurement light scans in the arrangement direction 120 of the positive electrode plates 15 indicated by arrows in FIG. 2 . That is, the imaging unit 47 takes an image from the positive electrode plate 15 disposed at one end to the positive electrode plate 15 disposed at the other end. When the imaging for checking the bonded state of the positive electrode plate 15 and the positive electrode current collector plate 12 ends, the connection structure 11 is turned upside down in such a way that the weld fillet 30 of the negative electrode plate 16 and a part of the negative electrode current collector plate 13 are accommodated in the imaging range. Next, as with the positive electrode plate 15 , an image is taken of the fillet 30 of the negative electrode plate 16 and a part of the negative electrode current collector plate 13 . In addition, instead of inverting the bonded structure 11 , the direction of the imaging unit 47 may be changed so that the fillet 30 of the negative electrode plate 16 and part of the negative electrode current collector plate 13 are accommodated in the imaging range.

As shown in FIG. 3 , the image processing device 42 creates a three-dimensional image based on the signal input from the imaging unit 47 . In FIG. 3 , the portion to be imaged is indicated by a solid line, and the portion not to be imaged is indicated by a dashed-two dotted line, but the imaging range is not limited to the portion shown by the solid line. Image processing device 42 creates an end surface image of bonding position 121 where fillet 30 is formed and an end surface image of non-joining position 122 where fillet 30 is not formed, based on the input operation from the operator using the created three-dimensional image. A plurality of solder fillets 30 are formed on the joint end portion 17 of the positive electrode plate 15 , but the joint position 121 is preferably a position passing the solder fillet 30 closest to the imaging unit 47 . In addition, it is preferable that the disjoint position 122 is closer to the imaging unit 47 than the position of the joined position 121 . In addition, an end surface image is created here, but a cross-sectional image may also be created if the joint surface 20 of the positive electrode current collector 12 can be detected. In addition, in FIG. 3 , the number of positive electrode plates 15 is set to five, but the number of positive electrode plates 15 is not limited to five. When inspecting the bonding state of the negative electrode plate 16 and the negative electrode current collector plate 13 , an end surface image is formed in the same manner as in the case of inspecting the bonding state of the positive electrode plate 15 and the positive electrode current collector plate 12 .

As shown in FIG. 4 , when the weld fillet 30 of the positive electrode plate 15 and a part of the positive electrode current collector plate 12 are photographed, the positive electrode plate 15, the positive electrode current collector plate 12 and the The end face of the solder pin 30. However, at the bonding position 121, the fillet 30 sometimes covers the bonding surface 20 of the positive electrode collector plate 12 so that the measurement light from the imaging unit 47 is not reflected on the bonding surface 20. Therefore, it is difficult to identify the positive electrode in the end surface image 125. The position of the junction surface 20 of the collector plate 12 .

On the other hand, at the non-joint position 122 , no fillet 30 is formed between the positive electrode plates 15 . Therefore, as shown in FIG. 5 , no weld fillets 30 appear in the end surface image 126 obtained at the non-joint position 122, and the junction surface 20 between the positive electrode plate 15 and the positive electrode current collector plate 12 clearly appears, so the positive electrode current collector plate can be detected. The position of the joint surface 20 of 12. By setting the position of the joint surface 20 of the positive electrode current collector plate 12 detected in this way as the reference line 130 , the height of the fillet 30 from the reference line 130 can be detected. In addition, in FIG. 4 and FIG. 5 , the portion to be imaged is indicated by a solid line, and the portion not to be imaged is indicated by a two-dot chain line, but the imaging range is not limited to the solid line portion shown in the drawings.

Next, the flow of the inspection procedure will be described with reference to FIG. 6 . In addition, although the inspection of the bonding state of the positive electrode plate 15 is described here, it is assumed that the negative electrode plate 16 is also inspected in the same procedure as the inspection of the bonding state of the positive electrode plate 15 .

First, as a preparatory stage, the connection structure 11 is placed at a predetermined position on the mounting table 46, and the fillet 30 formed on the joint end portion 17 of the positive electrode plate 15 and the portion of the positive electrode current collector 12 are accommodated within the imaging range of the imaging unit 47. part. In addition, the connection structure 11 may be provided on a frame or the like that holds the connection structure 11 from both sides, and the method of aligning the connection structure 11 does not matter.

When the bonded structure 11 is installed, the imaging unit 47 is driven by the drive unit 45 to take an image of the solder fillets 30 and a part of the positive electrode collector plate 12 of the bonded structure 11 (step S1 ). The image processing device 42 creates a three-dimensional image in which the fillet 30 of the connection structure 11 and a part of the positive electrode current collector 12 are captured based on the signal input from the imaging unit 47 .

When creating a three-dimensional image, the image processing device 42 creates the end surface image 126 at the non-joining position 122 based on an input operation by the operator (step S2 ). In addition, the image processing device 42 detects the joint surface 20 of the positive electrode current collector plate 12 from the end surface image 126 at the non-joint position 122 (step S3 ).

When the bonding surface 20 of the positive electrode current collector plate 12 is detected, the image processing device 42 performs plate determination for determining the state of the positive electrode plate 15 (step S4 ). In this step, confirmation of the number of positive electrode plates 15, confirmation of contact between the positive electrode plates 15, confirmation of whether the positive electrode plates 15 have straddled the flange portion 22, joint end portion 17 of the positive electrode plate 15 and positive electrode collector plate are carried out. Confirmation of the relative distance of the bonding surface 20 of 12, etc.

The image processing device 42 creates the end surface image 125 on the joining position 121 (step S5). In addition, the image processing device 42 uses the created end face image 125 at the joining position 121 to search for the contact point between the solder fillet 30 and the side surface of the positive electrode plate 15 (step S6 ). Then, as a result of the search by the image processing device 42, the state of the fillet 30 is determined from the obtained fillet contact point (step S7). In this step, the height of the fillet 30 itself and the height of the contact between the fillet 30 and the positive electrode plate 15 are determined.

When the electrode plate determination and fillet determination are completed in this way, it is comprehensively determined whether the bonding state of the positive electrode plate 15 is good or not based on the determination results of these determinations (step S8). The steps related to the fillet determination in steps S6 and S7 may be performed before the plate determination in step S4, and the order of these determinations does not matter. In addition, the preparation of the end surface image 126 at the non-joint position 122 (step S2) should be performed at least before the determination of the electrode plate, and the production of the end surface image 125 at the joint position 121 (step S5) should be performed at least before the determination of the fillet. That's it.

Next, the electrode plate determination and fillet determination using the reference line 130 will be described in detail with reference to FIG. 7 . In FIG. 7 , the captured portion is indicated by a solid line, and the portion not captured is indicated by a dashed-two dotted line, but the imaging range is not limited to the solid line portion shown in the figure.

FIG. 7( a ) shows a state where the joint surface 20 of the positive electrode current collector plate 12 is detected in step S3 . The image processing device 42 can detect the joint surface 20 of the positive electrode current collector plate 12 as the reference line 130 by performing known image processing such as edge detection on the end surface image 126 at the non-joint position 122 . In addition, the joint end portion 17 of the positive electrode plate 15 and the upper end 19 of the positive electrode plate 15 in the end face image 126 are detected.

As shown in FIG. 7( b), in the pole plate determination in step S4, the image processing device 42 detects the number of joint end portions 17 and the number of upper ends 19 of the positive electrode plate 15 in the end face image 126 on the non-joint position 122, Determine whether the number of plates is correct. At this time, the image processing device 42 judges whether or not the number of joint end portions 17 and the number of upper ends 19 of the positive electrode plate 15 are the same. In addition, since the number of positive electrode plates 15 is determined in advance, it is judged whether the number of joint end portions 17 and the number of upper ends 19 of the positive electrode plate 15 match the determined number of plates. In addition, when the number of joint end portions 17 and the number of upper ends 19 of positive electrode plate 15 match and these numbers match the determined number, it is determined that the number of positive electrode plates 15 is appropriate.

In addition, the image processing device 42 performs a merge determination to determine whether or not the positive electrode plates 15 adjacent to each other are in contact. In this merge determination, the width W between the edge of the side surface 15a of the detected positive electrode plate 15 and the edge of the adjacent positive electrode plate 15 is calculated, and it is determined whether the width W is equal to or smaller than a predetermined value or “0”. Then, the image processing device 42 detects the flange portion 22 of the positive electrode current collector plate 12 and performs a step-on determination to determine whether the joint end portion 17 of the positive electrode plate 15 protrudes outward from the edge of the inner surface 22 a of the flange portion 22 . Specifically, the edge line of the inner surface 22 a in the end surface image 126 is extended upward in FIG. 7( b ). In addition, at least a part of at least one positive electrode plate 15 of a pair of positive electrode plates 15 provided at one end and the other end of the plurality of positive electrode plates 15 is located outside the line extending the edge line of the inner surface 22a when viewed from the imaging unit 47. In the case of , it is judged to have stepped on. In addition, the image processing device 42 determines the relative distance L between the joint end portion 17 of the positive electrode current collector plate 12 and the joint surface 20 of the positive electrode current collector plate 12 . If the relative distance L is equal to or less than the predetermined value, it is determined that the relative distance L is appropriate, and if the relative distance L is greater than the predetermined value, it is determined that there is an abnormality such as bending of the positive electrode plate 15 .

FIG. 7( c ) shows the detection of the contact 60 between the fillet 30 and the side surface 15 a of the positive electrode plate 15 in step S6 . When detecting the contact point 60 between the solder fillet 30 and the side surface 15 a of the positive electrode plate 15 , the surface of the solder fillet 30 is detected as an edge in the end surface image 125 of the bonding position 121 . In addition, the side surface 15 a of the positive electrode plate 15 is detected as an edge, and the intersection point of the edge of the surface of the fillet 30 and the edge of the side surface of the positive electrode plate 15 is obtained as a contact point 60 .

FIG. 7( d) shows that the fillet height H1 and the joint end of the fillet 30 from the joint surface 20 of the positive electrode collector plate 12 to the contact point 60 of the fillet 30 and the side surface 15 a of the positive electrode plate 15 are detected in step S7. In the case of the fillet contact height H2 from portion 17 to contact 60 between fillet 30 and the side surface of positive electrode plate 15 . A height reference value is set for the fillet height H1, and a contact height reference value is set for the fillet contact height H2. When at least one of the fillet height H1 being equal to or greater than the height reference value and the fillet contact height H2 being equal to or greater than the contact height reference value is satisfied, it is determined that the fillet 30 can be properly formed. That is, even in a state where the joint end 17 of the positive electrode plate 15 is lifted from the joint surface 20 of the positive electrode current collector 12, if a fillet 30 having an appropriate height is formed on the joint end 17 of the positive electrode 15, it is determined that The joining strength of the positive electrode plate 15 to the positive electrode collector plate 12 can be ensured.

When such electrode plate determination and fillet determination are performed, conventionally, the positive electrode current collector plate 12 and the negative electrode current collector plate 13 may become shadows and the fillet 30 cannot be clearly imaged. Therefore, in order to ensure the illuminance, the positive electrode current collector 12 , the connecting piece 51 of the negative electrode current collector 13 , and the like may be opened to the side opposite to the bonding surface 20 for imaging.

In contrast, the inspection device 40 creates a three-dimensional image by imaging the fillet 30 and part of the positive electrode current collector 12 or part of the negative electrode current collector 13 by an imaging unit 47 capable of creating a three-dimensional image. Therefore, a cross-sectional image or an end surface image of an arbitrary position where the fillet 30 is formed on the joint surface 20 of the positive electrode current collector plate 12 or the joint surface 21 of the negative electrode current collector plate 13 can be produced. Therefore, inspection can be performed without opening the positive electrode current collector plate 12 and the negative electrode current collector plate 13 to the side opposite to the joining surface 20 .

As described above, according to the above-described embodiment, the effects listed below can be obtained.

(1) The imaging device 41 takes an image of the joint portion of the joint surface 20 of the positive electrode current collector plate 12 and the positive electrode plate 15 and the portion of the joint surface 20 that is not joined to the positive electrode plate 15 to create a three-dimensional image. In addition, the imaging device 41 creates a three-dimensional image including the bonded portion of the bonded surface 21 of the negative electrode current collector plate 13 and the negative electrode plate 16 and the portion of the bonded surface 21 that is not bonded to the negative electrode plate 16 . Therefore, a cross-sectional image or an end surface image of a portion of the bonding surface 20 not bonded to the positive electrode plate 15 and a portion of the bonding surface 21 not bonded to the negative electrode plate 16 can be created from the created three-dimensional image. Therefore, the joint surface 20 of the positive electrode current collector 12 and the joint surface 21 of the negative electrode current collector 13 can be detected from these cross-sectional images or end surface images, so the positions of the joint surfaces 20, 21 can be used as a reference for the positive electrode plate 15 and the negative electrode plate. 16, and the criteria for judging the solder fillet 30. Thus, the flange portions 22 , 23 and the like need not be used as judgment references as in the conventional case, so the joining state of the positive electrode plate 15 and the joining state of the negative electrode plate 16 can be appropriately judged. Especially useful for checking leg height, leg contact height.

(2) When the imaging unit 47 inspects the positive electrode plates 15 , it scans in the direction in which the positive electrode plates 15 are arranged. In addition, when the negative electrode plate 1 is inspected, scanning is performed in the direction in which the negative electrode plates 16 are arranged. Therefore, even when the number of positive electrode plates 15 and the number of negative electrode plates 16 are large, all positive electrode plates 15 and negative electrode plates 16 can be inspected.

(3) Infrared rays with high reflectivity to metals are emitted from the imaging unit 47, so the detection accuracy of the positive electrode plate 15, negative electrode plate 16, positive electrode current collector plate 12, negative electrode current collector plate 13, and solder fillets 30 made of metal materials improve. As a result, these clearly displayed three-dimensional images can be created, so that the electrode plate judgment and fillet judgment can be appropriately performed.

In addition, each of the above-mentioned embodiments can also be appropriately modified as follows and implemented.

In the above-mentioned embodiment, the imaging unit 47 starts imaging from the obliquely above (or obliquely below) the joint surface 20 of the positive electrode current collector plate 12 and the joint surface 21 of the negative electrode current collector plate 13, but it may be taken from the joint surface 20 and the negative electrode current collector plate 13. , 21 and start shooting at the same height.

・The judgment items of plate judgment and fillet judgment can be changed appropriately. For example, the determination of the fillet shape may be performed in addition to or instead of the determination of the fillet height.

In the above-mentioned embodiment, the imaging unit 47 is scanned in the direction in which the positive electrode plates 15 are arranged and the direction in which the negative electrode plates 16 are arranged. When the joint end portion 18 of the plate 16 is housed within the imaging range, the imaging unit 47 is not scanned.

- In the said embodiment, although the imaging part 47 scanned the connection structure 11, you may move the connection structure 11.

- The connection structure 11 may be a structure other than the structure shown in FIG. 1, FIG. 2, and FIG.

Explanation of reference signs

11: Connection structure, 12: Positive electrode collector plate, 13: Negative electrode collector plate, 15: Positive electrode plate, 16: Negative electrode plate, 17, 18: Joint end, 20, 21: Joint surface, 22, 23: Convex Edge, 30: solder fillet, 40: inspection device, 41: imaging device, 42: analyzing device, 43: input operation unit, 44: display, 45: driving unit, 47: imaging unit, 48: imaging element.

Claims (2)

1. An inspection device for a connection structure for a secondary battery, a connection for a secondary battery in which a plurality of pole plates are joined to a current collector plate, and fillets are formed at the junction between the pole plates and the current collector plate The structural body inspects the bonding state of the electrode plate and the collector plate, and is characterized in that The inspection device of the connection structure for secondary batteries includes an imaging device that captures the connection surface of the current collector plate and the connection portion of the electrode plate of the connection structure for secondary batteries, and the A portion of the joint surface of the collector plate that is not bonded to the electrode plate is included in the imaging range, and a three-dimensional image of the bonded portion and the portion not bonded to the electrode plate is created. 2. The inspection device for a connected structure for a secondary battery according to claim 1, wherein: The imaging device includes an imaging element that emits infrared rays toward a connection structure for a secondary battery in which the electrode plate, the current collector plate, and the solder fillets are made of metal, and detects a connection structure from the connection for the secondary battery. Interference fringes of light reflected by structures.