CN204490180U - One covers brilliant film adhering device - Google Patents

Abstract

The utility model relates to a chip-on-chip film attaching device, which belongs to the field of display technology and comprises: a base; a turntable; a first drive device for driving the turntable to rotate around its axis; The TCP side adhesive mechanism for attaching conductive adhesive to the chip-on-film film; the PCB side adhesive mechanism for attaching conductive adhesive to the chip-on-film film on the carrier located in the PCB adhesive area; for the carrier located in the pre-pressing area A pre-pressing mechanism for pre-pressing the conductive adhesive attached to the chip-on-chip film. When the turntable rotates, it is in the first station, the second station, the third station and the fourth station in sequence. When the turntable is in any station, the disassembly and assembly area, TCP glue area and PCB paste area provided on the base There is a carrier in both the glue area and the pre-press area. When the above-mentioned chip-on-film attaching device attaches the chip-on-film film, it adopts a parallel operating mode in which multiple chip-on-film films are carried out simultaneously and continuously, thereby improving the attaching efficiency of the chip-on-film film.

Description

A chip-on-film attaching device

technical field

The utility model relates to the field of display technology, in particular to a chip-on-chip film attaching device.

Background technique

In the display screen reuse project in the field of display technology, it is necessary to replace the chip-on-film (COF) in the display screen.

When replacing the chip-on-chip film, the operation process mainly includes attaching anisotropic conductive adhesive (ACF) on the side of the chip-on-chip film connected to the transmission control protocol module (TCP), and connecting the chip-on-chip film to the printed circuit board (PCB). ) in four steps: conductive adhesive on one side, conductive adhesive pre-press on the TCP side, and conductive adhesive pre-press on the PCB side.

The chip-on-film attaching device adopted in the prior art can only perform serial operations on a single COF, the waiting time in continuous operation is long, and the chip-on-film attaching efficiency is low.

Utility model content

The utility model provides a chip-on-film attaching device, which can improve the working efficiency of the chip-on-chip film attaching.

In order to achieve the above object, the utility model provides the following technical solutions:

A chip-on-film attaching device, comprising:

The base is provided with a disassembly area, a transmission control protocol module TCP glue area, a circuit board PCB glue area, and a pre-press area;

A turntable mounted on the base rotatably around its axis, the turntable is provided with a first stage, a second stage, a third stage, and a fourth stage; wherein:

When the turntable is at the first station, the first stage is located in the disassembly area, the second stage is located in the TCP glue area, the third stage is located in the PCB glue area, and the fourth stage is located in the pre-pressing area. area;

When the turntable is at the second station, the fourth carrier is located in the disassembly area, the first carrier is located in the TCP glue area, the second carrier is located in the PCB glue area, and the third carrier is located in the pre-pressing area. area;

When the turntable is at the third station, the third stage is located in the disassembly area, the fourth stage is located in the TCP glue area, the first stage is located in the PCB glue area, and the second stage is located in the pre-pressing area. area;

When the turntable is at the fourth station, the second stage is located in the disassembly area, the third stage is located in the TCP glue area, the fourth stage is located in the PCB glue area, and the first stage is located in the pre-pressing area. area;

a first drive device installed on the base to drive the turntable to rotate around its axis;

Installed on the base to attach a conductive glue to the chip-on-chip film on the carrier located in the TCP glue area;

A PCB side gluing mechanism installed on the base to attach conductive glue to the chip-on-chip film on the carrier located in the PCB gluing area;

The pre-pressing mechanism is installed on the base to pre-press the conductive glue attached to the chip-on-film on the stage in the pre-pressing area.

In the above chip-on-film attaching device, when the turntable rotates around its axis, it is in the first station, the second station, the third station and the fourth station in sequence, and when the above-mentioned turntable is in any station, There is a carrier in the disassembly and assembly area, TCP glue area, PCB glue area and pre-pressing area provided by the base.

When the turntable is at the first station, the first stage is located in the disassembly area, the second stage is located in the TCP glue area, the third stage is located in the PCB glue area, and the fourth stage is located in the pre-pressing area. At this time: The operator can remove the chip-on-film that has been glued on the first stage, and load the unglued chip-on-film onto the first stage; The chip-on-chip film on the second carrier is used to attach anisotropic conductive adhesive to the side connecting to the TCP; the PCB side adhesive mechanism is used to connect the chip-on-chip film on the third carrier located in the PCB glue area to connect the PCB Anisotropic conductive adhesive is pasted on one side; the pre-pressing mechanism pre-presses the anisotropic conductive adhesive attached to the chip-on-chip film on the fourth carrier located in the pre-pressing area;

Then the turntable rotates around its axis to its second station. At this time, the fourth carrier is located in the disassembly area, the first carrier is located in the TCP adhesive area, the second carrier is located in the PCB adhesive area, and the third carrier is located in the disassembly area. The stage is located in the pre-pressing area; at this time: the operator can remove the chip-on-film that has been glued on the fourth stage, and load the unglued chip-on-film onto the fourth stage; glue on the TCP side The mechanism attaches anisotropic conductive adhesive to the side of the chip-on-chip film on the first carrier located in the TCP adhesive area to connect to the TCP; the PCB side adhesive mechanism attaches the second carrier located in the PCB adhesive area The chip-on-chip film on the top is used to attach anisotropic conductive adhesive to one side of the PCB; the pre-pressing mechanism pre-presses the anisotropic conductive adhesive attached to the chip-on-chip film on the third carrier located in the pre-pressing area ;

Then the turntable rotates around its axis to its third station. At this time, the third carrier is located in the disassembly area, the fourth carrier is located in the TCP adhesive area, the first carrier is located in the PCB adhesive area, and the second carrier is located in the PCB adhesive area. The stage is located in the pre-pressing area; at this time: the operator can remove the chip-on-film that has been glued on the third stage, and load the unglued chip-on-film onto the third stage; glue on the TCP side The mechanism attaches anisotropic conductive adhesive to the side of the chip-on-chip film on the fourth carrier located in the TCP adhesive area to connect to the TCP; the PCB side adhesive mechanism attaches the first carrier located in the PCB adhesive area The chip-on-chip film on the top is used to attach anisotropic conductive adhesive to one side of the PCB; the pre-pressing mechanism pre-presses the anisotropic conductive adhesive attached to the chip-on-chip film on the second carrier located in the pre-pressing area ;

Then the turntable rotates around its axis to its fourth station. At this time, the second stage is located in the disassembly area, the third stage is located in the TCP glue area, the fourth stage is located in the PCB glue area, and the first stage is located in the PCB glue area. The stage is located in the pre-pressing area; at this time: the operator can remove the chip-on-film that has been glued on the second carrier, and load the unglued chip-on-film onto the second carrier; the TCP side is glued The mechanism attaches anisotropic conductive adhesive to the side of the chip-on-chip film on the third carrier located in the TCP adhesive area to connect to the TCP; the PCB side adhesive mechanism attaches to the fourth carrier located in the PCB adhesive area The chip-on-chip film on the top is used to attach anisotropic conductive adhesive to one side of the PCB; the pre-pressing mechanism pre-presses the anisotropic conductive adhesive attached to the chip-on-chip film on the first carrier located in the pre-pressing area ;

Then the turntable continues to rotate to the first station, and the above operations are repeated.

Therefore, when the chip-on-film attaching device is used to attach the chip-on-film film, it is a parallel operation mode in which multiple chip-on-film films are carried out synchronously and continuously, thereby reducing the waiting time for continuous operations and improving production efficiency.

Preferably, the first driving device is a servo motor.

Preferably, the TCP side gluing mechanism includes:

a riser mounted on the base;

An adhesive tape roll installation shaft installed on the vertical board;

a guide shaft mounted on the vertical plate;

Conductive rubber claws that are installed on the vertical board and hold the conductive glue during action;

A conductive adhesive cutter that is installed on the vertical board and cuts the conductive adhesive during action;

A second driving device that drives the action of the conductive rubber claw;

A third driving device for driving the conductive glue cutter to move.

Preferably, the second driving device is an air cylinder.

Preferably, the third driving device is an air cylinder.

Preferably, the PCB side adhesive mechanism includes:

a riser mounted on the base;

An adhesive tape roll installation shaft installed on the vertical board;

a guide shaft mounted on the vertical plate;

Conductive rubber claws that are installed on the vertical board and hold the conductive glue during action;

A conductive adhesive cutter that is installed on the vertical board and cuts the conductive adhesive during action;

A fourth driving device that drives the action of the conductive rubber claw;

A fifth drive device for driving the conductive glue cutter to move.

Preferably, the fourth driving device is an air cylinder.

Preferably, the fifth driving device is an air cylinder.

Preferably, the preloading mechanism includes:

a vertical plate fixed on the base, and a supporting plate is arranged on the vertical plate;

An indenter that is slidably installed on the support plate and can pre-press the conductive adhesive attached to the TCP side and the conductive adhesive attached to the PCB side on the chip-on-film on the carrier in the pre-pressing area during operation mechanism;

A sixth driving device that cooperates with the press head mechanism to drive the action of the press head mechanism.

Preferably, the sixth driving device is an air cylinder.

Preferably, each said carrier includes:

fixed to the base of the turntable;

a first slider mounted on the base slidably in a first direction relative to the base;

a second slider slidably mounted on the first slider relative to the first slider in a second direction, the second direction being perpendicular to the first direction;

a first adjusting device for adjusting the relative positional relationship between the first slider and the base;

A second adjustment device for adjusting the relative positional relationship between the second slider and the first slider.

Preferably, the first adjusting device has a micrometer structure, and/or, the second adjusting device has a micrometer structure.

Description of drawings

Fig. 1 is a schematic structural view of a chip-on-film attaching device provided by an embodiment of the present invention;

Fig. 2 is a schematic structural view of the pre-pressing mechanism in the chip-on-film attaching device provided by an embodiment of the present invention;

Fig. 3 is a schematic diagram of the cooperative structure between the turntable and the carrier of the chip-on-film attachment device provided by an embodiment of the present invention;

FIG. 4 is a schematic diagram of the cooperative structure between the turntable and the carrier of the chip-on-film attaching device provided by another embodiment of the present invention.

detailed description

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

Please refer to Figure 1, the chip-on-film attachment device provided by the embodiment of the present invention includes:

Base 1, base 1 is equipped with disassembly area, TCP glue area, PCB glue area, pre-press area;

The turntable 2 installed on the base 1 rotatably around its axis line is provided with a first stage 21, a second stage 22, a third stage 23, and a fourth stage 24 on the turntable 2; When its axis rotates, it is in the first station, the second station, the third station and the fourth station in sequence, wherein:

When the turntable 2 is at the first station, the first stage 21 is located in the disassembly area, the second stage 22 is located in the TCP glue area, the third stage 23 is located in the PCB glue area, and the fourth stage 24 is located in the pre-pressing area ;

When the turntable 2 is at the second station, the fourth carrier 24 is located in the disassembly area, the first carrier 21 is located in the TCP glue area, the second carrier 22 is located in the PCB glue area, and the third carrier 23 is located in the pre-pressing area ;

When the turntable 2 is at the third station, the third stage 23 is located in the disassembly area, the fourth stage 24 is located in the TCP glue area, the first stage 21 is located in the PCB glue area, and the second stage 22 is located in the pre-pressing area ;

When the turntable 2 is at the fourth station, the second carrier 22 is located in the disassembly area, the third carrier 23 is located in the TCP glue area, the fourth carrier 24 is located in the PCB glue area, and the first carrier 21 is located in the pre-pressing area ;

A first driving device installed on the base 1 and driving the turntable 2 to rotate around its axis;

Installed on the base 1 to attach a conductive adhesive to the chip-on-chip film on the carrier located in the TCP adhesive area 3;

A PCB side adhesive mechanism 4 installed on the base 1 to attach conductive adhesive to the chip-on-chip film on the carrier located in the PCB adhesive area;

A pre-pressing mechanism 5 installed on the base 1 to pre-press the conductive glue attached to the chip-on-film on the carrier located in the pre-pressing area.

In the above chip-on-chip attaching device, when the turntable 2 rotates around its axis, it is in the first station, the second station, the third station and the fourth station in sequence, and the above-mentioned turntable 2 is in any one of the stations. , there is a carrier in the disassembly area, TCP glue area, PCB glue area and pre-pressing area provided on the base 1.

When the turntable 2 is in the first station, as shown in Figure 1, the first carrier 21 is located in the disassembly area, the second carrier 22 is located in the TCP glue-sticking area, the third carrier 23 is located in the PCB glue-sticking area, and the second carrier 22 is located in the PCB glue-sticking area. The fourth stage 24 is located in the pre-pressing area. At this time: the operator can remove the chip-on-film that has been glued on the first stage 21, and load the unglued chip-on-film onto the first stage 21 ; 3 pairs of TCP side glue sticking mechanisms are used to attach anisotropic conductive glue to the side of the TCP on the second carrier 22 located in the TCP glue sticking area; 4 pairs of PCB side glue sticking mechanisms are located on the PCB sticking The chip-on-film on the third stage 23 in the glue area is used to attach anisotropic conductive glue to one side of the PCB; The attached anisotropic conductive adhesive is pre-pressed;

Then the turntable 2 rotates clockwise around its axis to set the angle to its second station. At this time, the fourth carrier 24 is located in the dismounting area, the first carrier 21 is located in the TCP gluing area, and the second carrier 22 Located in the PCB bonding area, the third carrier 23 is located in the pre-pressing area; at this time: the operator can remove the chip-on-film that has been bonded on the fourth carrier 24, and load the un-glued chip-on-film On the fourth stage 24 of the road; the TCP side adhesive mechanism 3 is used to attach anisotropic conductive adhesive to the side of the TCP on the first carrier 21 located in the TCP adhesive area; The adhesive mechanism 4 is used to attach anisotropic conductive adhesive to the side of the PCB on the second carrier 22 located in the PCB adhesive area; the pre-pressing mechanism 5 is located in the pre-pressing area. The anisotropic conductive adhesive attached to the COF on stage 23 is pre-pressed;

Then turntable 2 rotates clockwise around its axis to set the angle to its third station. At this time, the third carrier 23 is located in the disassembly area, the fourth carrier 24 is located in the TCP glue area, and the first carrier 21 Located in the PCB bonding area, the second carrier 22 is located in the pre-pressing area; at this time: the operator can remove the chip-on-film that has been glued on the third carrier 23, and load the un-glued chip-on-film On the third stage 23; the TCP side adhesive mechanism 3 is used to attach anisotropic conductive adhesive to the side of the TCP connected to the chip-on-chip film on the fourth carrier 24 in the TCP adhesive area; PCB side adhesive The glue mechanism 4 is used to attach anisotropic conductive glue to the chip-on-chip film on the first carrier 21 located in the PCB adhesive area to connect the side of the PCB; The anisotropic conductive adhesive attached to the COF on the platform 22 is pre-pressed;

The turntable 2 rotates clockwise around its axis to set the angle to its fourth station. At this time, the second carrier 22 is located in the disassembly area, the third carrier 23 is located in the TCP glue area, and the fourth carrier 24 is located in the In the PCB adhesive area, the first carrier 21 is located in the pre-pressing area; at this time: the operator can remove the chip-on-film that has been glued on the second carrier 22, and load the un-glued chip-on-film to the On the second carrier 22; the TCP side adhesive mechanism 3 is used to attach anisotropic conductive adhesive to the side of the TCP on the chip-on-chip film on the third carrier 23 located in the TCP adhesive area; PCB side adhesive Mechanism 4 attaches anisotropic conductive adhesive to the chip-on-chip film on the fourth stage 24 located in the PCB adhesive area for connecting the side of the PCB; pre-pressing mechanism 5 pairs the first stage located in the pre-pressing area The anisotropic conductive adhesive attached to the chip-on-chip film on 21 is pre-pressed;

Then the turntable 2 continues to rotate clockwise to the first station, and the above operations are repeated.

Therefore, when the chip-on-film attaching device is used to attach the chip-on-film film, it is a parallel operation mode in which multiple chip-on-film films are carried out synchronously and continuously, thereby reducing the waiting time for continuous operations and improving production efficiency.

Specifically, the first driving device that drives the turntable 2 to rotate around the axis of the turntable 2 relative to the base 1 is a servo motor. The servo motor can precisely control the rotation angle of the turntable 2 .

As shown in Figure 1, in a specific implementation manner, the TCP side glue application mechanism 3 includes:

Installed on the vertical plate 31 of the base 1;

Installed on the tape roll installation shaft 32 of the vertical plate 31, the tape roll 311 is installed on the tape roll installation shaft 32;

The guide shaft 35 installed on the vertical plate 31;

Anisotropic conductive adhesive claws 34 installed on the vertical plate 31 to hold the anisotropic conductive adhesive during action;

The anisotropic conductive adhesive cutter 33 installed on the vertical plate 31 and cutting the anisotropic conductive adhesive during operation;

A second driving device that drives the action of the anisotropic conductive rubber claw pliers 34;

A third driving device for driving the anisotropic conductive glue cutter 33 to act.

In the chip-on-film attaching device with the above structure, the anisotropic conductive adhesive is detoured from the tape roll 311 and guided by the guide shaft 35, and then grasped and transported by the anisotropic conductive adhesive claw pliers 34, which has good stability and is not easy to fall off; and then The anisotropic conductive adhesive is cut to an appropriate size by the anisotropic conductive adhesive cutter 33 , and attached to the side of the chip-on-film for connecting to the TCP by the anisotropic conductive adhesive claw pliers 34 .

Specifically, the above-mentioned second driving device for driving the action of the anisotropic conductive rubber claw 34 may specifically be an air cylinder.

Of course, the third driving device for driving the anisotropic conductive adhesive cutter 33 to move can also be an air cylinder.

In a preferred embodiment, as shown in Figure 1, the above-mentioned PCB side adhesive mechanism 4 includes:

Installed on the vertical plate 41 of the base 1;

The tape roll installation shaft 42 installed on the vertical plate 41, the tape roll 411 wrapped with anisotropic conductive adhesive 412 is installed on the tape roll installation shaft 42;

The guide shaft 45 installed on the vertical plate 41;

Anisotropic conductive adhesive claws 44 installed on the vertical plate 41 to hold the anisotropic conductive adhesive during action;

The anisotropic conductive adhesive cutter 43 installed on the vertical plate 41 and cutting the anisotropic conductive adhesive during operation;

The fourth driving device that drives the action of the anisotropic conductive rubber claw clamp 44;

The fifth driving device that drives the anisotropic conductive glue cutter 43 to move.

In the chip-on-film attaching device with the above structure, the anisotropic conductive adhesive 412 is detoured from the tape roll 411 and then guided by the guide shaft 45, then grasped and transported by the anisotropic conductive adhesive claw pliers 44, which has good stability and is not easy to fall off; Then, the anisotropic conductive adhesive 412 is cut to an appropriate size by the anisotropic conductive adhesive cutter 43 , and attached to the side of the COF for connecting to the PCB by the anisotropic conductive adhesive claw 44 .

Specifically, the fourth driving device for driving the action of the anisotropic conductive rubber claw 44 may be an air cylinder.

Similarly, the fifth driving device for driving the anisotropic conductive adhesive cutter 43 to move can also be an air cylinder.

In a preferred embodiment, as shown in Figure 2, the pre-pressing mechanism 5 in the above-mentioned chip-on-film attaching device includes:

The vertical plate 51 fixed on the base 1 is provided with a support plate 52 on the vertical plate 51;

It can be slidably installed on the support plate 52, and the anisotropic conductive adhesive attached to the TCP side and the anisotropic conductive adhesive attached to the PCB side on the chip-on-film on the carrier in the pre-pressing area can be slidably Preloaded pressure head mechanism 53;

A sixth driving device that cooperates with the pressure head mechanism 53 to drive the pressure head mechanism to act.

Specifically, the pressure head mechanism 53 can be slidably installed on the support plate 52 through the slide rail 54 and the slide groove that are slidingly fitted.

More specifically, the sixth driving device for driving the action of the pressing head mechanism 53 may be a driving handle 55 provided on the pressing head mechanism 53.

Of course, the above-mentioned sixth driving device may also be a cylinder.

In a preferred embodiment, the first carrier 21, the second carrier 22, the third carrier 23 and the fourth carrier 24 provided on the turntable 2 have the same structure, wherein, the first carrier shown in FIG. Taking the carrier 21 as an example, the first carrier 21 includes:

fixed on the base 211 of the turntable 2;

A first slider 212 mounted on the base 211 slidably relative to the base 211 along a first direction;

A second slider 213 slidably mounted on the first slider 212 relative to the first slider 212 along a second direction, the second direction being perpendicular to the first direction;

a first adjusting device 214 for adjusting the relative positional relationship between the first slider 212 and the base 211;

A second adjustment device 215 for adjusting the relative positional relationship between the second slider 213 and the first slider 212 .

In the aforementioned chip-on-film attaching device, the alignment of the chip-on-film placed on the first stage 21 can be realized by adjusting the positions of the first slider 212 and the second slider 213 .

In a preferred implementation manner, in order to improve the accuracy of the position adjustment of the first slider 212 by the first adjusting device 214, the above-mentioned first adjusting device 214 may have a micrometer structure.

Similarly, in order to improve the accuracy of the position adjustment of the second slider 213 by the second adjusting device 215 , the second adjusting device 215 has a micrometer structure.

In another embodiment, as shown in FIG. 4 , the above-mentioned first stage 21 includes a base 216, a base 217, and a tray 219 for holding the chip-on-chip film; wherein the base 217 is fixed on the turntable 2 through the base 216, The tray 219 is slidably mounted on the base 217; the base 217 is provided with a position adjusting device 2181 that adjusts the relative positional relationship between the tray 219 and the base 217 along the first direction, and adjusts the position between the tray 219 and the base 217 along the second direction. A device 2182 for adjusting relative positional relationship; wherein, the first direction is perpendicular to the second direction. The above-mentioned first stage 21 can adjust the position of the tray 219 through the adjustment device 2181 and the adjustment device 2182 , and then adjust the position of the COF placed on the tray 219 .

Apparently, those skilled in the art can make various changes and modifications to the embodiments of the utility model without departing from the spirit and scope of the utility model. In this way, if these modifications and variations of the utility model fall within the scope of the claims of the utility model and equivalent technologies thereof, the utility model is also intended to include these modifications and variations.

Claims (12)

1. A chip-on-film attachment device, characterized in that, comprising: The base is provided with a disassembly area, a transmission control protocol module TCP glue area, a circuit board PCB glue area, and a pre-press area; A turntable mounted on the base rotatably around its axis, the turntable is provided with a first stage, a second stage, a third stage, and a fourth stage; wherein: When the turntable is at the first station, the first stage is located in the disassembly area, the second stage is located in the TCP glue area, the third stage is located in the PCB glue area, and the fourth stage is located in the pre-pressing area. area; When the turntable is at the second station, the fourth carrier is located in the disassembly area, the first carrier is located in the TCP glue area, the second carrier is located in the PCB glue area, and the third carrier is located in the pre-pressing area. area; When the turntable is at the third station, the third stage is located in the disassembly area, the fourth stage is located in the TCP glue area, the first stage is located in the PCB glue area, and the second stage is located in the pre-pressing area. area; When the turntable is at the fourth station, the second stage is located in the disassembly area, the third stage is located in the TCP glue area, the fourth stage is located in the PCB glue area, and the first stage is located in the pre-pressing area. area; a first drive device installed on the base to drive the turntable to rotate around its axis; Installed on the base to attach a conductive glue to the chip-on-chip film on the carrier located in the TCP glue area; A PCB side gluing mechanism installed on the base to attach conductive glue to the chip-on-chip film on the carrier located in the PCB gluing area; The pre-pressing mechanism is installed on the base to pre-press the conductive glue attached to the chip-on-film on the stage in the pre-pressing area. 2. The chip-on-film attaching device according to claim 1, wherein the first driving device is a servo motor. 3. The chip-on-film attaching device according to claim 1, wherein the TCP side adhesive mechanism comprises: a riser mounted on the base; An adhesive tape roll installation shaft installed on the vertical board; a guide shaft mounted on the vertical plate; Conductive rubber claws that are installed on the vertical board and hold the conductive glue during action; A conductive adhesive cutter that is installed on the vertical board and cuts the conductive adhesive during action; A second driving device that drives the action of the conductive rubber claw; A third driving device for driving the conductive glue cutter to move. 4. The chip-on-film attaching device according to claim 3, wherein the second driving device is an air cylinder. 5 . The COF attaching device according to claim 3 , wherein the third driving device is an air cylinder. 6. The chip-on-film attaching device according to claim 1, wherein the PCB side adhesive mechanism comprises: a riser mounted on the base; An adhesive tape roll installation shaft installed on the vertical board; a guide shaft mounted on the vertical plate; Conductive rubber claws that are installed on the vertical board and hold the conductive glue during action; A conductive adhesive cutter that is installed on the vertical board and cuts the conductive adhesive during action; A fourth driving device that drives the action of the conductive rubber claw; A fifth drive device for driving the conductive glue cutter to move. 7. The chip-on-film attaching device according to claim 6, wherein the fourth driving device is an air cylinder. 8 . The COF attaching device according to claim 6 , wherein the fifth driving device is an air cylinder. 9. The chip-on-film attaching device according to claim 1, wherein the pre-pressing mechanism comprises: a vertical plate fixed on the base, and a supporting plate is arranged on the vertical plate; An indenter that is slidably installed on the support plate and can pre-press the conductive adhesive attached to the TCP side and the conductive adhesive attached to the PCB side on the chip-on-film on the carrier in the pre-pressing area during operation mechanism; A sixth driving device that cooperates with the press head mechanism to drive the action of the press head mechanism. 10. The chip-on-film attaching device according to claim 9, wherein the sixth driving device is an air cylinder. 11. The chip-on-film attaching device according to any one of claims 1-10, wherein each of the stages includes: fixed to the base of the turntable; a first slider mounted on the base slidably in a first direction relative to the base; a second slider slidably mounted on the first slider relative to the first slider in a second direction, the second direction being perpendicular to the first direction; a first adjusting device for adjusting the relative positional relationship between the first slider and the base; A second adjustment device for adjusting the relative positional relationship between the second slider and the first slider. 12 . The chip-on-film attaching device according to claim 11 , wherein the first adjustment device has a micrometer structure, and/or the second adjustment device has a micrometer structure. 13 .