CN204515727U - Display module - Google Patents

Abstract

The utility model discloses a display module, which includes a glass substrate and a flexible printed circuit board, the glass substrate includes a test board, the test board includes a plurality of test strips, and the flexible printed circuit board includes a plurality of The conductive strips opposite to the test boards, each of the test boards and the corresponding conductive strips respectively form a plurality of test groups, the conductive strips on the flexible printed circuit board are electrically connected to the test strips on the glass substrate, and each test The sum of the test strips of the group and the horizontal contact portion of the opposite conductive strip is the contact length, at least one of the plurality of test groups is an offset test group, and the maximum contact length of the offset test group is smaller than at least one other test group the maximum contact length. Combined with the test platform, the structure can detect the deviation of the bonding (bonding) from the whole, and the display module has a simple structure and is easy to operate.

Description

a display module

technical field

The utility model relates to the manufacturing field of display modules, in particular to a display module capable of automatically detecting the pressing and offset conditions between a flexible printed circuit board and glass.

Background technique

In the traditional magnifying glass inspection, it is not easy to see the broken state of the gold ball of the Anisotropic Conductive Film (Anisotropic Conductive Film), but the efficiency of the professional microscope inspection is relatively low, and it is time-consuming, which is not conducive to the 100% inspection of the product. For products with special structures, it is impossible to accurately judge. For example: the special structure of the flexible printed circuit board of the single-layer on-cell touch screen, the distribution of the gold ball particles and the indentation of the Anisotropic Conductive Film (Anisotropic Conductive Film) cannot be seen clearly on the front and back sides, so the lamination cannot be accurately judged Offset condition.

Existing problems: 1. The current detection technology can only roughly judge the degree of unilateral deviation, and cannot detect products with poor bonding. 2. The current detection technology cannot effectively intercept products with weak bonding. 3. Production line testing is difficult, and automatic detection cannot be realized.

Utility model content

In order to solve the above technical problems, the utility model provides a display module that can automatically detect the pressing and offset status between the flexible printed circuit board and the glass substrate. The display module includes a glass substrate and a flexible printed circuit board. The glass substrate includes a test board, the test board includes a plurality of test strips, the flexible printed circuit board includes a plurality of conductive strips opposite to the test board, and each test board and its opposite conductive strips respectively form a plurality of Test groups, the conductive strips on the flexible printed circuit board are electrically connected to the test strips on the glass substrate, the sum of the horizontal contact parts between the test strips of each test group and the relative conductive strips is the contact length, and the multiple At least one of the three test groups is a deviation test group, and the maximum contact length of the deviation test group is smaller than the maximum contact length of the other at least one test group.

Optionally, the maximum contact length of at least one of the offset test groups is smaller than the maximum contact length of any other test group.

Optionally, at least one of the conductive strips opposite to the test strips of at least one set of offset test groups has a width smaller than the other test strips or conductive strips.

Optionally, at least one of the test strips opposite to the conductive strips of at least one set of offset test groups has a width smaller than the other test strips or conductive strips.

Optionally, the distance between two adjacent test strips of at least one offset test group and the distance between two opposite conductive strips are not equal.

Optionally, the test board is U-shaped.

Optionally, the test board is integrally formed.

Optionally, the number of said test strips is at least 2.

Optionally, the conductive strips on the flexible printed circuit board are connected in series with the test strips on the glass substrate.

Optionally, the conductive strip and the test strip are made of conductive material.

Optionally, the conductive material is indium tin oxide (ITO) or metal.

The utility model also provides a display device, comprising the display module described in any one of the foregoing.

Therefore, combined with the test platform, the deviation of the bonding (bonding) can be detected from the whole, and the display module has a simple structure and is easy to operate.

Description of drawings

Fig. 1 is a schematic structural diagram of a display module provided by Embodiment 1 of the present invention;

Fig. 2 is a schematic structural diagram of a display module provided by Embodiment 2 of the present invention;

Fig. 3 is a schematic structural diagram of a display module provided by Embodiment 3 of the present invention;

FIG. 4 is a schematic structural diagram of a display module provided by Embodiment 4 of the present invention.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

Embodiment one

Figure 1 shows a display module provided by Embodiment 1 of the present utility model, including a glass substrate terminal (Chip on Glass) 1, a flexible printed circuit board terminal (Film on Glass) 2, a test group 3, and an offset test Group 4. Wherein, the test group 3 includes a test board 3A and a conductive strip 3B opposite to it. The test board 3A is U-shaped and includes two test strips 3a and a connecting portion 3b. The 3a and 3b are integrally formed. The deviation test group 4 includes a deviation test board 4A and a conductive strip 4B opposite to it. The deviation test board 4A is U-shaped and includes two deviation test strips 4a and a connecting part 4b. The 4a and 4b are integrally formed for the deviation test. The width of the strip 4a is smaller than the width of the offset conductive strip 4B opposite to it, and the width of the offset conductive strip 4B is equal to the width of the conductive strip 3B. The conductive strip at the end of the flexible printed circuit board is connected in series with the test strip at the end of the glass substrate, and the horizontal contact portion of each test strip with its opposite conductive strip is the contact length. The maximum contact length of the offset test group 4, that is, the length when the offset conductive strip 4B is fully in contact with the offset test strip 4a, is less than the maximum contact length of the test group 3, that is, the length when the conductive strip 3B is in full contact with the test strip 3a length. The test plate 3A and the offset test plate 4A are made of aluminum, molybdenum and a laminated material of molybdenum, aluminum, and molybdenum, and the material of the conductive strip 3B and the offset conductive strip 4B is aluminum.

Optionally, the material of the test board 3A and the offset test board 4A is a laminated material of aluminum and molybdenum or a laminated structure of aluminum, molybdenum, and aluminum, or may be indium tin oxide (ITO) material alone, which is not limited here. All materials are sufficient as long as they are conductive materials.

Optionally, the test board 3A and the deviation test board 4A can be non-integral structures, that is, the test strip 3a and the conductive strip 3B can be a spliced structure, and similarly, the deviation test strip 4a and the conductive strip 4B can be a spliced structure.

Optionally, the number of test strips 3 a and/or deviation test strips 4 a may be greater than two.

Optionally, the number of deviation test groups 4 may be multiple, and it is not limited here, as long as it is greater than or equal to one.

Optionally, in the deviation test group 4, the width of the conductive strip 4B can be less than the width of the test strip 4a, and the width is not limited at this, as long as the maximum contact length of the deviation test group 4 is less than the maximum length of the test group 3 That's it.

Therefore, during the test, the resistance of the series circuit after bonding is measured in combination with the test platform. Assuming that the bonding (bonding) offset value that the production line can tolerate is 50% of the bonding (bonding) offset, then the width of the offset test strip 4a can be designed to be 50% of the width of the offset conductive strip 4B opposite it. %, in this way, the maximum contact length of the deviation test group 4 is less than the maximum contact length of the test group 3, when the bonding (bonding) deviation occurs, the deviation of the bonding (bonding) can be judged according to the resistance. When the bonding (bonding) deviation is 50%, the entire string of test circuits is in an open state, so that it is known that the bonding (bonding) deviation has exceeded the tolerance value of the production line, and preventive measures can be taken in advance.

At the same time, the structure of the display module is easy to operate. It is only necessary to change the width of the offset conductive strip or the offset test strip in the offset test group during design, and the bonding (bonding) can be detected from the bonding (bonding) as a whole during the test. ) status, effectively intercept products with weak bonding, and improve the efficiency of bonding detection on the production line.

Embodiment two

As shown in FIG. 2 , it is a display module provided by Embodiment 2 of the present invention. Parts in this embodiment that are the same as those in the foregoing embodiments will not be repeated, and only different parts will be described. Different from the aforementioned embodiments, in this embodiment, the width of the offset test strip 4a is equal to the width of the offset conductive strip 4B, and the width of the offset test strip 4a and the offset conductive strip 4B is smaller than that of the test strip 3a and the conductive strip 4B. The width of bar 3B.

Therefore, during the test, the resistance of the series circuit after bonding is measured in combination with the test platform. Assuming that the tolerable bonding deviation value of the production line is 50% of the bonding deviation, the width of the deviation test strip 4a and the deviation conductive strip 4B can be designed as the width of the test strip 3a and the conductive strip 50% of the width of 3B. In this way, the maximum contact length of the deviation test group 4 is less than the maximum contact length of the test group 3. When the bonding (bonding) deviation occurs, the deviation of the bonding (bonding) can be judged according to the resistance . When the bonding (bonding) deviates by 50%, the entire string of test circuits is in an open state, so it is known that the bonding (bonding) deviation has exceeded the tolerance value of the production line, and preventive measures can be taken in advance.

At the same time, the structure of the display module is easy to operate, and the width of the offset conductive strip and the offset test strip can be adjusted at the same time only in the design of the offset test group, which improves the accuracy of the test. During the test, the bonding (bonding ) Overall detection of bonding (bonding) status, effectively intercepting products with weak bonding (bonding), and improving the efficiency of production line bonding (bonding) detection.

Embodiment three

As shown in FIG. 3 , it is a display module provided by Embodiment 3 of the present invention. Parts in this embodiment that are the same as those in the foregoing embodiments will not be repeated, and only different parts will be described. Different from the previous embodiments, the width of the offset test strip 4a is equal to the width of the offset conductive strip 4B, but the distance between the two offset test strips 4a is greater than the distance between the two offset conductive strips 4B.

Optionally, when the width of the offset test strip 4a is equal to the width of its opposite offset conductive strip 4B, the spacing of the two offset test strips 4a can be set to be less than the spacing of the two offset conductive strips 4B, where It is not limited, as long as the maximum contact length of the offset test group 4 is greater than the maximum contact length of the test group 3 .

Therefore, during the test, the resistance of the series circuit after bonding is measured in combination with the test platform. Assuming that the bonding (bonding) offset value that the production line can tolerate is 50% of the bonding (bonding) offset, and the width of the offset test strip 4a is equal to the width of the offset conductive strip 4B that is opposite to it, set two The spacing of strip offset test strip 4a is less than/greater than the spacing of two offset conductive strips 4B, so that the maximum contact length of offset test strip 4a and offset conductive strip 4B is 50% of test strip 3a and conductive strip 3B, when The bonding (bonding) is biased, and the bonding (bonding) bias can be judged according to the resistance. When the bonding (bonding) deviates by 50%, the entire string of test circuits is in an open state, so it is known that the bonding (bonding) deviation has exceeded the tolerance value of the production line, and preventive measures can be taken in advance.

At the same time, since the display module structure increases the distance between the test strips or conductive strips per unit area, the number of test strips or conductive strips per unit area is reduced, which reduces the production cost, and can be used from bonding during testing. ) Overall detection of bonding (bonding) status, effectively intercepting products with weak bonding (bonding), and improving the efficiency of production line bonding (bonding) detection.

Embodiment four

As shown in FIG. 4 , it is a display module provided by Embodiment 4 of the present invention. Parts in this embodiment that are the same as those in the foregoing embodiments will not be repeated, and only different parts will be described. Different from the previous embodiments, the width of the offset test strip 4a is smaller than the width of its opposite offset conductive strip 4B, and the distance between the two offset test strips 4a is greater than the distance between the two offset conductive strips 4B.

Optionally, the width of the offset test strip 4a may be smaller than the width of its opposite offset conductive strip 4B, and the distance between the two offset test strips 4a is smaller than the distance between the two offset conductive strips 4B.

Optionally, the width of the offset test strip 4a may be greater than the width of its opposite offset conductive strip 4B, and the distance between the two offset test strips 4a is smaller than the distance between the two offset conductive strips 4B.

Optionally, the width of the offset test strip 4a may be greater than the width of its opposite offset conductive strip 4B, and the distance between the two offset test strips 4a is greater than the distance between the two offset conductive strips 4B.

What needs to be explained here again is that the width and spacing of the offset test strip 4a and the offset conductive strip 4B are not limited here, as long as the maximum contact length between the offset test strip 4a and the offset conductive strip 4B is guaranteed, that is, the offset The horizontal length when the test strip 4a and the offset conductive strip 4B are in full contact is greater than the maximum contact length between the test strip 3a and the conductive strip 3B, that is, the horizontal length when the test strip 3a is in full contact with the conductive strip 3B.

Therefore, during the test, the resistance of the series circuit after bonding is measured in combination with the test platform. Assuming that the bonding (bonding) offset value that the production line can tolerate is 50% of the bonding (bonding) offset, then by adjusting the width of the offset test strip 4a or the offset conductive strip 4B, and making the two offset test strips The distance between the strip 4a and its opposite two offset conductive strips 4B is not equal, so that the maximum contact length between the offset test strip 4a and the offset conductive strip 4B is 50% of the test strip 3a and the conductive strip 3B, when binding (bonding) deviation occurs, according to the size of the resistance, to judge the binding (bonding) deviation status. When the bonding (bonding) deviates by 50%, the entire string of test circuits is in an open state, so it is known that the bonding (bonding) deviation has exceeded the tolerance value of the production line, and preventive measures can be taken in advance.

At the same time, the structure of the display module increases the flexibility of module design, and the offset test groups required by different display modules can be designed according to the different situations of different display modules, and the test can be carried out from the bonding (bonding) as a whole. Detect the bonding status, effectively intercept products with weak bonding, and improve the efficiency of production line bonding detection.

Finally, it should be noted that those skilled in the art can make various changes and modifications to the utility model without departing from the spirit and scope of the utility model. In this way, if these modifications and variations of the utility model fall within the scope of the claims of the utility model and equivalent technologies thereof, the utility model is also intended to include these modifications and variations.

Claims (11)

1. A display module, characterized in that: the display module includes a glass substrate and a flexible printed circuit board, the glass substrate includes a test board, the test board includes a plurality of test strips, and the test strips are connected , the flexible printed circuit board includes a plurality of conductive strips opposite to the test board, each of the test boards and its opposite conductive strips respectively form a plurality of test groups, The conductive strips on the flexible printed circuit board are electrically connected to the test strips on the glass substrate, the sum of the horizontal contact portions between the test strips of each test group and the relative conductive strips is the contact length, and the plurality of test groups At least one of them is a deviation test group, and the maximum contact length of the deviation test group is smaller than the maximum contact length of the other at least one test group. 2. The display module according to claim 1, wherein the maximum contact length of at least one offset test group is smaller than the maximum contact length of any other test group. 3. The display module according to claim 1, wherein at least one of the test strips opposite to the conductive strips of at least one set of offset test groups has a width smaller than that of the other test strips. test strips or conductive strips described above. 4. The display module according to claim 1, wherein at least one of the conductive strips opposite to the test strips of at least one set of offset test groups has a width smaller than that of the other conductive strips. test strips or conductive strips described above. 5. The display module according to claim 1, wherein the distance between two adjacent test strips of at least one offset test group and the distance between two opposite conductive strips are different. 6. The display module according to any one of claims 1-5, wherein the test board is U-shaped. 7. The display module according to claim 6, wherein the test board is integrally formed. 8. The display module according to claim 7, wherein there are at least two test strips. 9. The display module according to claim 8, wherein the conductive strips on the flexible printed circuit board are connected in series with the test strips on the glass substrate. 10. The display module according to claim 9, wherein the material of the conductive strip and the test strip is conductive material. 11. The display module according to claim 10, wherein the conductive material is indium tin oxide (ITO) or metal.