CN204669721U - Circuit board and liquid crystal indicator - Google Patents

Abstract

The utility model provides a kind of circuit board, described circuit board is used for fitting with matching disc to be fit, described circuit board comprises the first circuitous pattern and fit-state test zone, described matching disc comprises the second circuit figure matched with circuit board, wherein, described fit-state test zone also comprises tertiary circuit figure.The utility model also provides a kind of liquid crystal indicator.When after circuit board and matching disc laminating, by detecting the deformation state of conductive particle in the vacant district of diverse location, can fit-state comparatively accurately between decision circuitry plate and matching disc.

Description

Circuit board and liquid crystal display device

technical field

The utility model relates to the field of electronic circuits, in particular to a circuit board and a circuit board assembly comprising the circuit board.

Background technique

In the field of electronic circuits, there are circuit boards and matching boards that are bonded to each other. For example, a liquid crystal display device includes the above-mentioned circuit board and matching board bonded to each other. Wherein, the circuit board 2 shown in FIG. 2 is the external circuit terminal area (PAD) on the edge of the array substrate in the liquid crystal display panel, and the matching board 1 shown in FIG. 1 is the circuit shown in FIG. 2 A flexible printed circuit board (FPC) in which the board 2 is bonded, and the matching board 1 and the circuit board 2 are bonded and electrically connected through conductive particle glue.

Generally, the circuit board 2 includes a first circuit pattern 21 and a bonding state inspection area 23 , where conductive particles are disposed. Correspondingly, the matching board 1 includes a second circuit pattern 11 corresponding to the circuit board 2 . The second circuit pattern 11 has the same shape as the first circuit pattern 21, that is, has the same circuit structure. When the circuit board 2 and the matching board 1 are bonded by matching the alignment mark 12 and the circuit board alignment mark 22, the second circuit pattern on the matching board 1 is in contact with the conductive particles, and passes through the pasting state inspection area 23 Observe the deformation of the conductive particles to judge the bonding state between the matching board 1 and the circuit board 2 .

The pressure applied to the matching board 1 and the circuit board 2 by the pressure head of the equipment for bonding the matching board 1 and the circuit board 2 is a predetermined pressure, which can ensure that the circuit between the first circuit pattern 21 and the second circuit pattern 11 All conductive particles in the direction of the length of the circuit are pressed open. Since there is a height difference between the bonding state inspection area 23 and the adjacent circuit pattern in the length direction of the circuit board, there is a large accommodating space in the bonding state inspection area 23 to accommodate conductive particles, so that the bonding state inspection area cannot be guaranteed. The conductive particles of 23 are in the pressed-open state along the length of the entire circuit, so the checked state of pressing at a certain position along the length of the circuit board deviates from the real state by a large amount.

Therefore, how to accurately judge the lamination state between the circuit board and the matching board has become an urgent technical problem in this field.

Utility model content

The purpose of this utility model is to provide a circuit board and a circuit board assembly including the circuit board. When the circuit board and the corresponding matching board are bonded together, the bonding between the circuit board and the matching board can be accurately judged. state.

In order to achieve the above purpose, as one aspect of the present invention, a circuit board is provided, which is used to be bonded to the matching board to be bonded, and the circuit board includes a first circuit pattern and a bonded state inspection area, the matching board includes a second circuit pattern that matches the circuit board, wherein the bonding state inspection area further includes a third circuit pattern.

Preferably, the first circuit pattern and the third circuit pattern have the same height and same material.

Preferably, the third circuit pattern includes a plurality of sub-parts distributed in the bonding state inspection area, and the sub-parts do not overlap with each other in the length direction of the bonding state inspection area.

Preferably, the third circuit pattern includes a plurality of sub-parts distributed in the bonding state inspection area, wherein one sub-part overlaps with other sub-parts in the length direction of the bonding state inspection area.

Preferably, two lamination state inspection areas are set on the circuit board, and the two lamination state inspection areas are respectively located on two sides of the first circuit pattern.

Preferably, the circuit board further includes at least one circuit board alignment mark, and each of the circuit board alignment marks includes at least two sub-alignment marks arranged at intervals.

Preferably, the position of the horizontal direction of the alignment mark of the circuit board is entirely in the middle of the bonding state inspection area.

Preferably, the height of the alignment mark on the circuit board is the same as that of the first circuit pattern and the material is the same.

Preferably, the circuit board is a part of a display panel.

As another aspect of the present invention, a liquid crystal display device is provided, including a matching board and a circuit board attached to the matching board, wherein the circuit board is the above-mentioned circuit board provided by the present invention.

Preferably, the matching board is a flexible printed circuit board.

There are conductive particles in the area where the third circuit pattern is not provided in the bonding state inspection area of the circuit board. When the circuit board and the matching board are bonded together, due to the segmented structure of the third circuit pattern on the circuit length, the pressure on the conductive particles in different regions along the length of the circuit board is similar to that of the first circuit pattern and the second circuit pattern. The pressure on the conductive particles when the graphics are pasted. Therefore, by detecting the deformation state of the conductive particles in the vacant areas at different positions, the bonding state between the circuit board and the matching board can be judged more accurately.

Description of drawings

The accompanying drawings are used to provide a further understanding of the utility model, and constitute a part of the description, together with the following specific embodiments, are used to explain the utility model, but do not constitute a limitation to the utility model. In the attached picture:

Fig. 1 is a schematic diagram of a matching board in the prior art;

Fig. 2 is the schematic diagram of circuit board in the prior art;

Fig. 3 is the schematic diagram of the first embodiment of the circuit board provided by the utility model;

Figure 4 is a schematic diagram of a matching board matched with the circuit board shown in Figure 3;

Fig. 5 is a schematic diagram of a circuit board assembly formed after the circuit board shown in Fig. 3 and the matching board shown in Fig. 4 are correctly aligned;

Fig. 6 is a schematic diagram of the first misalignment situation of the circuit board shown in Fig. 3 and the matching board shown in Fig. 4;

Fig. 7 is a schematic diagram of the second misalignment situation of the circuit board shown in Fig. 3 and the matching board shown in Fig. 4;

Fig. 8 is a schematic diagram of a second embodiment of the circuit board provided by the present invention;

Fig. 9 is a schematic diagram of a third embodiment of the circuit board provided by the present invention.

Explanation of reference signs

1: Matching board 11: Second circuit pattern

12: Match alignment mark 2: Circuit board

21: The first circuit pattern 22: Circuit board alignment mark

23: Fitting status inspection area 22a: Sub-alignment mark

22b: Sub alignment mark 23a: Third circuit graphic

23b: Vacant area

Detailed ways

The specific embodiment of the utility model will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the utility model, and are not intended to limit the utility model.

As shown in Fig. 3, Fig. 8 and Fig. 9, as an aspect of the present invention, a kind of circuit board 2 is provided, and this circuit board 2 is used for matching with the matching board 1 (as shown in Fig. 4 ) to be bonded. Bonding, the circuit board 2 includes a first circuit pattern 21 and a bonding state inspection area 23, and the matching board 1 includes a second circuit pattern 11 that matches the circuit board 2, wherein the bonding state inspection area 23 also includes a third Circuit pattern 23a.

As mentioned above, since the second circuit pattern 11 on the matching board 1 matches the circuit board 2, the second circuit pattern 11 includes a part matching the first circuit pattern 21 and the first circuit pattern in the pasting state inspection area. The part where the three circuit patterns 23a match. For ease of description, the part matching the first circuit pattern in the second circuit pattern 11 is called a matching pattern, and the shape of the matching pattern is the same as that of the first circuit pattern 21 arranged on the circuit board 2, that is, The matching pattern has the same circuit structure as the first circuit pattern. Correspondingly, the part of the second circuit pattern that matches the bonding state inspection area is called the detection pattern (in FIG. 4, the part filled with oblique lines in the dotted line box is the detection pattern). When the circuit board 2 and the matching board 1 are attached, the matching pattern on the matching board 1 is attached to the first circuit pattern 21 on the circuit board 2, and a part of the detection pattern on the matching board 1 is connected to the circuit board 2. The third circuit pattern fits together.

There are conductive particles in the area where the third circuit pattern 23a is not provided (ie, the vacant area 23b ) in the bonding state inspection area 23 of the circuit board 2 . Those skilled in the art should understand that the function of the conductive particles is to electrically connect the circuits in the first circuit pattern 21 of the bonded circuit board 2 and the second circuit pattern of the matching board 1 . Since the third circuit pattern 23a has a plurality of sub-parts, when the circuit board 2 and the matching board 1 are bonded, a part of the detection pattern is bonded to the third circuit pattern 23a, while other parts on the detection pattern are bonded to the blank area 23b. conductive particles in contact. In this case, the segmented structure of the third circuit pattern 23a on the circuit length makes the pressure on the conductive particles in different regions in the length direction of the circuit board approximate to that of the first circuit pattern 21 and the second circuit pattern 11. Therefore, the bonding state between the circuit board 2 and the matching board 1 can be judged more accurately by detecting the deformation state of the conductive particles in the vacant area 23b at different positions.

In the present invention, there is no special limitation on the specific structure of the third circuit pattern 23a, and the structure of the third circuit pattern 23a can be determined according to the structure of the matching pattern.

The third circuit pattern includes a plurality of sub-parts distributed in the bonding state inspection area, and the sub-parts do not overlap with each other in the length direction of the bonding state inspection area. For example, when the matching pattern is two parallel strip electrodes, the shape of the third circuit pattern 23a may be as shown in FIG. 3 , including three sub-parts. One subsection is formed as an upper section of the strip electrode, one subsection is formed as a middle section of the strip electrode, and one subsection is formed as a middle section of the strip electrode. These three sub-sections have no overlapping area with each other in the length direction. Alternatively, as shown in FIG. 8, the third circuit pattern 23a includes two subsections. One of the subsections is the lower half of the strip electrode, and the other subsection is the upper half of the strip electrode, and these two subsections do not overlap each other in the length direction. It should be explained that "there is no mutual overlap in the length direction" here means that when the sub-sections are projected onto the strip-shaped electrodes, the projections of the sub-sections on the strip-shaped electrodes do not overlap.

The third circuit pattern includes a plurality of sub-parts distributed in the bonding state inspection area, and one of the sub-parts overlaps with other sub-parts in the length direction of the bonding state inspection area. For example, when the matching pattern is three parallel strip electrodes, the shape of the third circuit pattern 23a can be as shown in FIG. The sub-section is the lower part of the strip-shaped electrode, and the shape of another sub-section is the same as that of the strip-shaped electrode, and the shape of another sub-section is the middle part of the strip-shaped electrode. The subsection with the same shape as the strip electrode is located in the middle of the bonding state inspection area 23 , and the other subsections are respectively located on both sides of the subsection with the same shape as the strip electrode. The subsections located on both sides can form projections on the subsection located in the middle. Therefore, the subsection located in the middle and the three subsections located on both sides have overlapping areas in the length direction of the bonding state inspection area.

Here, "the longitudinal direction of the bonding state inspection area" means the up-down direction in drawing.

In the present invention, there is no special limitation on the arrangement of the third circuit pattern 23a. The third circuit pattern 23a can be formed after the first circuit pattern 21 is formed. In order to simplify the manufacturing process, preferably, it can be The first circuit pattern 21 and the third circuit pattern 23a are formed in one patterning process, so that the height of the third circuit pattern 23a is the same as that of the first circuit pattern 21 and the material is the same.

One bonding state inspection area 23 may be set on the circuit board 2 , or two bonding state inspection areas 23 may be set on the circuit board 2 . When the circuit board 2 is provided with a bonding state inspection area 23, correspondingly, a detection pattern should also be provided on the matching board 1; when the circuit board 2 is provided with two bonding state inspection areas 23, correspondingly, Two detection patterns should also be set on the matching board 1 .

Preferably, two bonding state inspection areas 23 are set on the circuit board 2 , so as to judge the bonding state of the circuit board 2 and the matching board 1 more accurately. In order not to hinder the normal operation of the circuit patterns in the first circuit pattern 21 , preferably, two bonding state inspection areas 23 may be respectively set on two sides of the first circuit pattern 21 .

In order to ensure accurate alignment between the circuit board 2 and the matching board 1 , a circuit board alignment mark and a matching alignment mark can be respectively set on the circuit board 2 and the matching board 1 . Before bonding the circuit board 2 and the matching board 1 , the circuit board 2 and the matching board 1 are firstly aligned through the circuit board alignment mark on the circuit board 2 and the matching alignment mark on the matching board 1 .

In the present invention, there is no special requirement on the specific shape of the alignment mark on the circuit board. For example, the circuit board alignment mark provided on the circuit board provided by the utility model can be identical with the circuit board alignment mark 22 provided on the circuit board in Fig. 2, and correspondingly, the alignment mark on the matching board 1 can be the same as The matching plate alignment marks 12 shown in FIG. 1 are the same.

As a preferred embodiment of the present utility model, the circuit board 2 can also include at least one circuit board alignment mark 22, and each circuit board alignment mark 22 includes at least two sub-alignment marks arranged at intervals, as shown in Fig. 3, In FIG. 8 and FIG. 9 , the two sub-alignment marks are respectively a sub-alignment mark 22 a and a sub-alignment mark 22 b. The matching board alignment mark 12 on the matching board 1 is matched with the circuit board alignment mark 22 on the circuit board 2 . The alignment mark 12 of the matching board is formed with a horizontal portion matching the interval between the sub-alignment mark 22a and the sub-alignment mark 22b. The width of this horizontal portion is the same as the space width between the sub-alignment mark 22a and the sub-alignment mark 22b.

As a specific embodiment of the present invention, in a circuit board alignment mark 22, the sub-alignment mark 22a is in the shape of a "T", and the sub-alignment mark 22b is in the shape of an "inverted T", or, on a circuit board In the alignment mark 22, the sub-alignment mark 22a and the sub-alignment mark 22b are both in the shape of a "cross". Correspondingly, the matching board alignment mark 12 on the matching board 1 may be in the shape of a "cross".

What is shown in Fig. 5 is the situation where the circuit board 2 in Fig. 3 is correctly aligned with the matching board 1 in Fig. 4, in this case, the horizontal part on the alignment mark 12 of the matching board is just at the sub-alignment mark 22a and the sub-alignment mark 22b in the interval. Areas A, B, C, D, E, and F among Fig. 5 are all the areas corresponding to the vacant area 23b on the circuit board 2, by observing the state of the conductive particles in the areas A, B, C, D, E, F can be Determine whether the circuit board 2 and the matching board 1 are properly bonded.

What is shown in FIG. 6 is a situation where the circuit board 2 and the matching board 1 are misaligned. By observing the state of the gap in the alignment mark 22 of the circuit board, it can be known that the position of the circuit board 2 is too high. At this time, the bonding state can still be determined by observing the state of the conductive particles in the upper part of the bonding state inspection area.

What is shown in FIG. 7 is another situation where the circuit board 2 and the matching board 1 are misaligned. By observing the state of the gap in the alignment mark, it can be known that the position of the circuit board 2 is too low. At this time, the quality of the bonding state can still be determined by observing the state of the conductive particles in the lower part of the bonding state inspection area.

It can be seen that, when the third circuit pattern is set to have a plurality of sub-parts, even if the circuit board and the matching board are not precisely aligned in the length direction of the circuit board 2 (that is, the left-right direction in FIGS. 6 and 7 ) , the checking of the mate status can still be done through its subsections. At the same time, when the circuit board alignment mark 22 includes two sub-alignment marks, it is only necessary to observe whether the space between the sub-alignment marks is filled by the horizontal part of the matching board alignment mark on the matching board 1 or is filled by other parts When it is filled, it can be judged whether the circuit board and the matching board are attached in the correct position, without complicated measurement, which simplifies the bonding process and saves time and cost.

In addition to the alignment function, the circuit board alignment mark can also play an auxiliary flat role, further ensuring that the detection pattern is in a non-suspending state.

As a specific implementation manner of the present invention, preferably, the horizontal position of the alignment mark of the circuit board is generally in the middle of the pasting state inspection area.

The circuit board alignment mark can be formed after the first circuit pattern is formed, or the circuit board alignment mark can be formed at the same time as the first circuit pattern is formed. In order to simplify the manufacturing process, preferably, the circuit board alignment mark is formed while the first circuit pattern is being formed, so that the height of the circuit board alignment mark is the same as that of the first circuit pattern and the material is the same.

Preferably, the circuit board 2 provided by the present invention can be a part of the display panel. For example, the circuit board 2 may be an external circuit terminal area on the edge of the array substrate of the display panel.

As another aspect of the present invention, a liquid crystal display device is provided, which includes a circuit board 2 and a matching board 1 attached to the circuit board 2, wherein the circuit board 2 is provided by the present invention above circuit board.

After the matching board 1 and the circuit board 2 are bonded together, the bonding state between the circuit board 2 and the matching board 1 can be judged more accurately by detecting the deformation state of the conductive particles in the vacant areas 23b at different positions, so that the bonding state between the circuit board 2 and the matching board 1 can be accurately judged. To judge whether the liquid crystal display device is good or not.

The circuit board 2 may be a rigid circuit board, and correspondingly, the matching board 1 may be a flexible printed circuit board. Specifically, the circuit board 2 may be an external circuit terminal area on the edge of the array substrate of the display panel, and the matching board 1 is a flexible printed circuit board attached to the circuit board 2 .

It can be understood that, the above embodiments are only exemplary embodiments adopted to illustrate the principles of the present invention, but the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present utility model, and these variations and improvements are also regarded as the protection scope of the present utility model.

Claims (11)

1. a circuit board, described circuit board is used for fitting with matching disc to be fit, described circuit board comprises the first circuitous pattern and fit-state test zone, described matching disc comprises the second circuit figure matched with circuit board, it is characterized in that, described fit-state test zone also comprises tertiary circuit figure.

2. circuit board according to claim 1, is characterized in that, described first circuitous pattern is identical with tertiary circuit pattern height and material is identical.

3. circuit board according to claim 2, is characterized in that, described tertiary circuit figure comprises the multiple subdivisions being distributed in fit-state test zone, and each subdivision does not have overlapping region with each other on the length direction of fit-state test zone.

4. circuit board according to claim 2, it is characterized in that, described tertiary circuit figure comprises the multiple subdivisions being distributed in fit-state test zone, and one of them subdivision and other subdivision all have overlapping region on the length direction of fit-state test zone.

5. circuit board as claimed in any of claims 1 to 4, is characterized in that, described circuit board is provided with two described fit-state test zones, these two described fit-state test zones lay respectively at the both sides of described first circuitous pattern.

6. circuit board as claimed in any of claims 1 to 4, is characterized in that, described circuit board also comprises at least one circuit board alignment mark, and each described circuit board alignment mark includes spaced at least two sub-alignment marks.

7. circuit board according to claim 6, is characterized in that, the position entirety of the horizontal direction of described circuit board alignment mark is in the middle part of described fit-state test zone.

8. circuit board according to claim 7, is characterized in that, the height of described circuit board alignment mark is identical with described first circuitous pattern height and material is identical.

9. circuit board according to claim 1, is characterized in that, described circuit board is a part for display floater.

10. a liquid crystal indicator, the circuit board comprising matching disc and fit with described matching disc, is characterized in that, described circuit board is the circuit board in claim 1 to 9 described in any one.

11. liquid crystal indicators according to claim 10, is characterized in that, described matching disc is flexible printed circuit board.