CN205003690U - Fingerprint recognition sensor encapsulation structure - Google Patents

Abstract

An embodiment of the utility model provides a fingerprint recognition sensor encapsulation structure, including the base plate, set up in the sensor NULL of the upper surface of base plate and set up in the apron of sensor NULL's upper surface, sensor NULL's upper surface through solid -state glue with cover connection. The embodiment of the utility model provides an in, use solid -state gluey liquid glue the that substitute, at the not gassing of in -process of laminating to and can keep even solid -state gluey thickness, thereby can not influence the fingerprint identification effect.

Description

Fingerprint recognition sensor packaging structure

technical field

The utility model relates to a fingerprint recognition sensor, in particular to a packaging structure of a fingerprint recognition sensor.

Background technique

Currently, fingerprint recognition sensors are increasingly used in portable devices, such as smart phones, tablet computers, and the like. The packaging structure of the fingerprint identification sensor usually includes a chip body and a cover plate bonded to the chip body. At present, liquid glue is mainly used to attach the cover plate to the chip body. The use of liquid glue usually has two control difficulties: 1. Bubbles are easy to generate during the dispensing and laminating process, and the generated bubbles will directly affect the effect of fingerprint recognition; 2. The uniformity of the thickness of the glue is difficult to control, and the uneven thickness of the glue will affect Fingerprint recognition effect.

Utility model content

The embodiment of the utility model provides a packaging structure of a fingerprint identification sensor to solve the above technical problems.

The fingerprint recognition sensor packaging structure provided by the embodiment of the present invention includes a substrate, a sensor integrated chip arranged on the upper surface of the substrate, and a cover plate arranged on the upper surface of the sensor integrated chip, and the upper surface of the sensor integrated chip The surface is connected with the cover plate through solid glue.

Wherein, the packaging structure of the fingerprint recognition sensor further includes a packaging element disposed on the upper surface of the substrate and wrapping the sensor integrated chip.

Wherein, the upper surface of the sensor integrated chip is horizontal to the upper surface of the packaging element.

Wherein, the upper surface of the sensor integrated chip is higher than the upper surface of the packaging element.

Wherein, the upper surface of the packaging component is connected to the cover plate through the solid glue.

Wherein, the solid glue is a solid optical glue.

Wherein, the packaging structure of the fingerprint recognition sensor is a fingerprint recognition sensor packaging structure with a metal ring.

Wherein, the packaging structure of the fingerprint recognition sensor is a fingerprint recognition sensor packaging structure without a metal ring.

Wherein, the cover plate is a ceramic cover plate, a glass cover plate or a sapphire cover plate.

In the embodiment of the present invention, the solid glue is used instead of the liquid glue, no air bubbles are generated during the bonding process, and a uniform thickness of the solid glue can be maintained, so that the fingerprint recognition effect will not be affected.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the utility model more clearly, the accompanying drawings required in the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the utility model , for those skilled in the art, other drawings can also be obtained according to these drawings on the premise of not paying creative work.

Fig. 1 is a schematic cross-sectional structure diagram of the package structure of the fingerprint identification sensor in the first embodiment of the present invention.

Fig. 2 is a schematic cross-sectional structure diagram of the packaging structure of the fingerprint identification sensor in the second embodiment of the present invention.

Fig. 3 is a schematic cross-sectional structure diagram of the packaging structure of the fingerprint identification sensor in the third embodiment of the present invention.

detailed description

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

Referring to FIG. 1 , the first embodiment of the present invention provides a fingerprint identification sensor packaging structure 100, including a substrate 11, a sensor integrated chip 12 arranged on the upper surface 111 of the substrate 11, and a sensor integrated chip arranged on the upper surface 121 of the sensor integrated chip. cover plate 13. The upper surface 121 of the sensor integrated chip 12 is connected to the cover plate 13 through the solid glue 14 . The cover plate 13 can be a ceramic cover plate, a glass cover plate or a sapphire cover plate. The solid glue 14 can be glue used for bonding the full screen of the mobile phone, and can include but not limited to solid optical glue. On the upper surface 121 of the sensor integrated chip 12, the solid glue 14 can be a thin film.

In this embodiment, the solid glue 14 is used instead of the liquid glue, so that no air bubbles are generated during the bonding process, and a uniform thickness of the solid glue can be maintained, so that the fingerprint identification effect will not be affected.

The fingerprint recognition sensor package structure 100 further includes a package component 15 disposed on the upper surface 111 of the substrate 11 . The package component 15 can be connected to the upper surface 111 of the substrate 11 by soldering or pasting technology. The packaging component 15 wraps the sensor integrated chip 12 to protect the sensor integrated chip 12 . The upper surface 151 of the packaging component 15 can be connected to the cover plate 13 through the solid glue 14 .

In this embodiment, the upper surface 121 of the sensor integrated chip 12 is horizontal to the upper surface 151 of the package component 15 . In this way, the sensor integrated chip 12 can fully contact the cover plate 13 through the solid glue 14, thereby ensuring the accuracy of fingerprint identification.

In this embodiment, the fingerprint recognition sensor packaging structure 100 is a fingerprint recognition sensor packaging structure without a metal ring.

Referring to FIG. 2 , the second embodiment of the present invention provides another package structure 200 of a fingerprint identification sensor. Similar to the first embodiment, in this embodiment, the fingerprint recognition sensor packaging structure 200 includes a substrate 21, a sensor integrated chip 22 disposed on the upper surface 211 of the substrate 21, and a cover plate disposed on the upper surface 221 of the sensor integrated chip 22 twenty three. The upper surface 221 of the sensor integrated chip 22 is connected to the cover plate 23 through the solid glue 24 . The solid glue 24 can be glue used for bonding the full screen of the mobile phone, and can include but not limited to solid optical glue. On the upper surface 221 of the sensor integrated chip 22 , the solid glue 24 can be a thin film. The fingerprint recognition sensor package structure 200 further includes a package component 25 disposed on the upper surface 211 of the substrate 21 . The package component 25 can be connected to the upper surface 211 of the substrate 21 by soldering or pasting technology. The packaging component 25 wraps the sensor integrated chip 22 to protect the sensor integrated chip 22 . The upper surface 251 of the packaging component 25 can be connected to the cover plate 23 through the solid glue 24 .

The difference from the first embodiment is that in this embodiment, the upper surface 221 of the sensor integrated chip 22 is slightly higher than the upper surface 251 of the package component 25 . Preferably, the height difference between the two is not greater than 0.5mm. In this way, the sensor integrated chip 22 can fully contact the cover plate 23 through the solid glue 24, thereby ensuring the accuracy of fingerprint identification.

Referring to FIG. 3 , the third embodiment of the present invention provides another package structure 300 of a fingerprint recognition sensor. The difference from the first embodiment is that in this embodiment, the fingerprint recognition sensor packaging structure 300 is a fingerprint recognition sensor packaging structure with a metal ring 36 .

It should be noted that in the present utility model, regardless of whether the packaging structure of the fingerprint identification sensor has a metal ring, the sensor integrated chip and the cover are connected by solid glue.

The above is a preferred embodiment of the present utility model, it should be pointed out that for those of ordinary skill in the art, without departing from the principle of the present utility model, some improvements and modifications can also be made, these improvements and modifications It is also regarded as the protection scope of the present utility model.

Claims (9)

1. A fingerprint identification sensor packaging structure, comprising a substrate, a sensor integrated chip arranged on the upper surface of the substrate and a cover plate arranged on the upper surface of the sensor integrated chip, characterized in that, the sensor integrated chip The upper surface is connected with the cover plate through solid glue. 2 . The fingerprint recognition sensor package structure according to claim 1 , wherein the fingerprint recognition sensor package structure further comprises a package component disposed on the upper surface of the substrate and wrapping the sensor integrated chip. 3 . 3. The packaging structure of the fingerprint identification sensor according to claim 2, wherein the upper surface of the sensor integrated chip is horizontal to the upper surface of the packaging component. 4. The packaging structure of the fingerprint identification sensor according to claim 2, wherein the upper surface of the sensor integrated chip is higher than the upper surface of the packaging component. 5. The package structure of fingerprint recognition sensor according to claim 2, wherein the upper surface of the package component is connected to the cover plate through the solid glue. 6. The packaging structure of a fingerprint recognition sensor according to any one of claims 1 to 5, wherein the solid glue is a solid optical glue. 7. The fingerprint recognition sensor packaging structure according to any one of claims 1 to 5, characterized in that, the fingerprint recognition sensor packaging structure is a fingerprint recognition sensor packaging structure with a metal ring. 8. The fingerprint recognition sensor packaging structure according to any one of claims 1 to 5, characterized in that, the fingerprint recognition sensor packaging structure is a fingerprint recognition sensor packaging structure without a metal ring. 9. The package structure of a fingerprint recognition sensor according to any one of claims 1 to 5, wherein the cover is a ceramic cover, a glass cover or a sapphire cover.