CN205542882U - Encapsulation body of LED - Google Patents

Abstract

The utility model relates to a light-emitting diode package, comprising: a substrate; more than one light-emitting diode chip mounted on the substrate; a phosphor plate, which is arranged on the one or more light-emitting diode chips, wavelength conversion of the light emitted by the light-emitting diode chips; and a wall portion, which is arranged on the substrate and surrounds the one or more light-emitting diode chips; the phosphor plate covers the entire upper surface of the one or more light-emitting diode chips , the width of the phosphor plate is greater than the width of the one or more LED chips. According to the utility model, since the width of the phosphor plate is larger than that of the LED chip, the light emitted by the LED chip can pass through the phosphor plate and be released to the outside, which has the effect of preventing the chromatic aberration of the light emitted by the LED package.

Description

LED package

technical field

The utility model relates to a light-emitting diode package, and in more detail, relates to a light-emitting diode package that does not cause chromatic aberration of light released to the outside.

Background technique

Light-emitting diodes are inorganic semiconductor elements that emit light generated by recombination of electrons and holes, and are currently being used in various fields including display devices, automobile lamps, and general lighting. This LED has the advantages of long life, low power consumption, and fast response. Therefore, the light emitting device utilizing the light emitting diode is expected to replace the original light source.

LED chips using LEDs are classified into horizontal LED chips, flip-chip LED chips, and vertical LED chips according to the position and structure of the electrodes. , so it has the advantage that it can be directly mounted on the substrate. Furthermore, the flip-chip type light emitting diode chip fully generates current dispersion in the horizontal direction, has the advantage of good heat dissipation efficiency, and is widely used in high-power light emitting devices.

Furthermore, in order to use the above-mentioned light-emitting diode chip for a light-emitting device emitting white light or light of other wavelengths, a phosphor may be disposed on the top of the light-emitting diode chip. At this time, conventionally, a method of applying a phosphor to the upper portion of the LED chip or injecting a resin containing the phosphor into the reflective cup surrounding the LED chip has been mainly used.

However, in the case where the resin containing phosphor is coated on the upper part of the LED chip as described above, the phosphor cannot be uniformly distributed in the resin due to precipitation of the phosphor during the curing of the resin. Therefore, when the light emitted by the light-emitting diode chip excites the phosphor and is released to the outside, there is a problem of color difference between the area where the specific gravity of the phosphor is high and the area where the specific gravity is low.

Utility model content

technical problem

The problem to be solved by the utility model is to provide a light-emitting diode package, when the light generated by the light-emitting diode chip is excited by the phosphor, no color difference will occur.

Technical solutions

The utility model provides a light-emitting diode package, comprising: a substrate; more than one light-emitting diode chip mounted on the substrate; a phosphor plate, which is configured on the one or more light-emitting diode chips, and The light emitted by one or more light emitting diode chips undergoes wavelength conversion; and the wall part is arranged on the substrate and surrounds the one or more light emitting diode chips; the phosphor plate covers the surface of the one or more light emitting diode chips Throughout the above, the width of the phosphor plate is greater than the width of the one or more LED chips.

technical effect

According to the utility model, since the width of the phosphor plate is larger than that of the LED chip, all the light emitted by the LED chip can be released to the outside through the phosphor plate, which has the effect of preventing the chromatic aberration of the light emitted by the LED package.

Furthermore, the phosphor plate mounted on the upper part of the LED chip is formed to be larger than the width of the LED chip. When the phosphor plate is mounted on the upper part of the LED chip, even if the alignment with the LED chip is inaccurate, it will not emit light. The light emitted by the diode can also be released to the outside through the phosphor plate.

In addition, as the phosphor plate is formed larger than the LED chip, a space is formed between the wall surrounding the LED chip, and the light emitted from the LED chip is reflected on the wall and reflected toward the upper side of the LED chip. The effect of improving the light efficiency of the light emitting diode package.

Description of drawings

Fig. 1 is a perspective view illustrating an LED package according to an embodiment of the present invention;

Fig. 2 is a cross-sectional view illustrating an LED package according to an embodiment of the present invention;

FIG. 3 is a diagram for explaining a state of attaching a phosphor plate to a light-emitting diode chip of the light-emitting diode package according to an embodiment of the present invention.

Explanation of reference signs

100: LED package 110: Substrate

111: Substrate 112: First lead

113: Second Lead 114: First Substrate Pad

115: second substrate pad 116: first through hole

117: Second through hole 118: Thermal pad

120: LED chip 130: Phosphor plate

140: wall portion 140a: reflective surface

150: Lens 152: Plate

154: Domed top G: Gap

A: Alignment point

detailed description

The light-emitting diode package in one embodiment of the present invention may include: a substrate; more than one light-emitting diode chip mounted on the substrate; a phosphor plate configured on the one or more light-emitting diode chips, for all The light emitted by the one or more light emitting diode chips undergoes wavelength conversion; and the wall is configured on the substrate to surround the one or more light emitting diode chips; the phosphor plate can cover the one or more light emitting diodes On the entire upper surface of the chip, the width of the phosphor plate may be greater than the width of the one or more LED chips.

In this case, the wall portion may cover a part of at least one side surface of the one or more light emitting diode chips.

In addition, the wall part may cover a part of at least one of the side faces of the phosphor plate, and the wall part may cover a part of at least one of the side faces of the light emitting diode chip, so that the phosphor plate, The light emitting diode chip and the gap surrounded by the wall. At this time, the gap may surround at least a part of the outer peripheral surface of the light emitting diode chip.

Wherein, the inner surface of the wall portion surrounding the gap may be a reflective surface, and the reflective surface may be formed in a shape protruding toward the light emitting diode chip.

In addition, the phosphor plate may contain one or more kinds of phosphors.

Also, the center of the phosphor plate may coincide with the center of the light emitting diode chip, or the center of the phosphor plate may deviate from the center of the light emitting diode chip.

In addition, the substrate may include alignment points for aligning the phosphor plates.

Moreover, the substrate may include: a base; a first lead and a second lead formed on the base and electrically connected to the one or more light-emitting diode chips; and a first substrate pad and a second substrate pad. It is formed under the base and electrically connected with the first lead and the second lead respectively.

At this time, the substrate may further include a first through hole and a second through hole, the first through hole and the second through hole penetrate through the base, so that the first lead and the second lead are connected to the first lead respectively. A substrate pad is electrically connected to the second substrate pad; a heat dissipation pad for dissipating heat generated by the light-emitting diode chip may be included under the base.

In addition, a lens may be further included, the lens covers the light emitting diode chip on the upper part of the substrate, and the light emitted by the light emitting diode chip is emitted, and the lens may include: a plate part, which covers the light emitting diode chip; and a dome portion formed on the upper portion of the plate portion to emit light emitted by the light emitting diode chip to the outside. At this time, the width of the wall portion may be greater than the width of the dome portion.

The preferred embodiments of the present utility model are described in more detail with reference to the accompanying drawings.

FIG. 1 is a perspective view illustrating an LED package according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view illustrating an LED package according to an embodiment of the present invention.

As shown in FIGS. 1 and 2 , an LED package 100 according to an embodiment of the present invention includes a substrate 110 , an LED chip 120 , a phosphor plate 130 , a wall portion 140 and a lens 150 .

The substrate 110 can be mounted on the top of the LED chip 120 , and is equipped for transmitting power supplied from the outside to the LED chip 120 . In addition, heat generated by the light emitting diode chip 120 may also be dissipated. To this end, the substrate 110 includes a base 111 , a first lead 112 and a second lead 113 , a first substrate pad 114 and a second substrate pad 115 , a first through hole 116 and a second through hole 117 , and a heat dissipation pad 118 .

The base 111 may be formed of an insulating substance including a polymer substance or a ceramic substance, or a conductive substance including a metal or the like. The shape of the base 111 is as shown in the figure, and it is formed in a plate shape with a predetermined thickness. The first lead 112 and the second lead 113 are formed on the upper surface, and the first substrate pad may be formed on the lower surface of the back surface of the upper surface. 114 and the second substrate pad 115 and heat dissipation pad 118 .

The first lead 112 and the second lead 113 are arranged on the upper surface of the base 111 and may be arranged in a state of being electrically insulated from each other. Moreover, the first lead 112 and the second lead 113 can be electrically connected to the LED chip 120 , therefore, the first lead 112 and the second lead 113 can respectively include conductive substances such as metal.

The first substrate pad 114 and the second substrate pad 115 are disposed on the lower surface of the base 111 and may be disposed in a state of being electrically insulating and separated from each other. At this time, unlike the first lead 112 and the second lead 113, the first substrate pad 114 and the second substrate pad 115 may not be formed on the entire lower surface of the base 111, but may be biased to one side and the other side, with a predetermined area formed. In this embodiment, the first substrate pad 114 and the second substrate pad 115 may be formed to have a predetermined length along the length direction of the two sides in a state adjacent to two opposite sides of the lower surface of the base 111 formed in a quadrangular shape. . At this time, the shapes and positions of the first substrate pad 114 and the second substrate pad 115 may vary according to the shape of the external terminal.

The first through hole 116 and the second through hole 117 can be respectively formed through the substrate 111. The first through hole 116 is electrically connected to the first lead 112 and the first substrate pad 114, and the second through hole 117 is electrically connected to the second lead 113 and the second lead 113. Two substrate pads 115 . Wherein, the first through hole 116 and the second through hole 117 may be formed of the same conductive material as the first lead 112 and the second lead 113 or the first substrate pad 114 and the second substrate pad 115 .

Moreover, a heat dissipation pad 118 may be disposed in the area between the first substrate pad 114 and the second substrate pad 115 . The heat dissipation pad 118 may be arranged in a state of being in contact with the lower surface of the base 111 while being electrically insulatingly separated from the first substrate pad 114 and the second substrate pad 115 . Therefore, the heat dissipation pad 118 may be disposed in a region including the center of the lower surface of the base 111 .

That is, the heat dissipation pad 118 may be disposed on the lower surface corresponding to the upper position where the LED chip 120 is mounted. In addition, the heat dissipation pad 118 may have a larger area than the LED chip 120 . Therefore, the heat generated by the light emitting diode chip 120 can be quickly released to the outside, and the influence of the heat generated by the light emitting diode chip 120 on the phosphor plate 130 can be minimized.

In one embodiment of the present utility model, the case where the base 111 is formed of an insulating material is described, so the first lead 112 and the second lead 113 and the first substrate pad 114 and the second substrate pad 115 directly contact the base The situation of the upper surface and the lower surface of 111 will be described. However, when the base 111 is formed of a conductive material, between the first lead 112 and the second lead 113 and the base 111, and between the first substrate pad 114 and the second substrate pad 115 and the base 111, there may be interposed Insulation.

The light emitting diode chip 120 is mounted on the upper part of the substrate 110 , and is mounted in electrical contact with the first lead 112 and the second lead 113 respectively. Moreover, in this embodiment, the light-emitting diode chip 120 can emit blue light or ultraviolet light. The situation of mounting one light-emitting diode chip 120 on the substrate 110 is illustrated in the drawings, but as required, multiple light-emitting diode chips 120 can be mounted. Diode chip 120 .

In this embodiment, the light emitting diode chip 120 includes an n-type semiconductor layer and a p-type semiconductor layer, and has a structure capable of releasing light due to the recombination of holes and electrons with the help of supplied power. For this purpose, an active layer may be interposed between the n-type semiconductor layer and the p-type semiconductor layer. The light emitting diode chip 120 having such a structure may have a structure such as a horizontal type, a vertical type, or a flip chip type. In this embodiment, the case of using a flip chip type light emitting diode chip 120 will be described.

Moreover, in this embodiment, although not shown separately, on the lower surface of the light-emitting diode chip 120, first electrode pads and second electrodes for electrically contacting the first lead 112 and the second lead 113 respectively can be formed. pad. Accordingly, the first electrode pad may be in electrical contact with the first lead 112 , and the second electrode pad may be in electrical contact with the second lead 113 . That is, the LED chip 120 can be directly flip-chip soldered to the first lead 112 and the second lead 113 of the substrate 110 , or electrically connected by SMT (surface mount technology).

The light emitting diode chip 120 can be attached to a predetermined position on the upper surface of the substrate 110 , and in this embodiment, a situation in which one light emitting diode chip 120 is attached to the center of the upper surface of the substrate 110 is described. The light emitting diode chip 120 is mounted on the upper part of the substrate 110 in this way, and the heat dissipation pad 118 may be disposed on the lower surface of the substrate 110 . Therefore, the heat generated by the LED chip 120 can be directly transferred to the heat dissipation pad 118 through the substrate 110 , which can improve the heat dissipation efficiency of the LED package 100 of the present invention.

The phosphor sheet 130 includes a plurality of phosphors and resin. As for the plurality of phosphors, phosphor plate 130 may contain at least one of various types of phosphors, for example, garnet phosphors, aluminate phosphors, sulfide phosphors, oxygen phosphors, etc. Nitride phosphors, nitride phosphors, fluoride phosphors, silicate phosphors, and the like. Furthermore, wavelength conversion can be carried out by means of a plurality of phosphors as described above, and the light emitted by the LED chip 120 can be converted into monochromatic light or white light.

The resin plays the role of a bearing part that supports many phosphors. In this embodiment, the case where the resin is used as the bearing part has been described, but materials such as glass or ceramics can be used, and in the case of resin, it can also be Utilize polymer resins. In addition, in the present embodiment, the phosphor plate 130 can be manufactured into a plate shape of a predetermined size and used in a state where transparent resin and a large number of phosphors are stirred.

At this time, the phosphor plate 130 may include glass, and at this time, many phosphors and glass beads may be mixed with each other and condensed and hardened. As the phosphor plate 130 is manufactured using glass in this way, many phosphors included in the phosphor plate 130 can be uniformly distributed in the phosphor plate 130 .

In addition, in this embodiment, the LED chip 120 is surrounded by the wall portion 140 described later when mounted on the substrate 110 , so the LED chip 120 as a heat source may have a sealed structure. At this time, when a high current is connected to the LED chip 120 , in order to prevent the deformation of the phosphor plate 130 due to heat generated in the LED chip 120 , the phosphor plate 130 may be made of glass having good heat resistance.

That is, in this embodiment, the phosphor plate 130 is not formed by coating on the light emitting diode chip 120 and then cured, but can be manufactured separately for use. At this time, in order to dispose the phosphor plate 130 on the light emitting diode chip 120, another adhesive member may be used. The adhesive member is preferably made of a material with excellent heat resistance like the phosphor plate 130 .

Also, in the present embodiment, the phosphor plate 130 may be formed to have a width greater than that of the light emitting diode chip 120 . A detailed description of this will be described later.

Phosphor plate 130 is mounted on light emitting diode chip 120 in a state formed to be larger than the width of light emitting diode chip 120 in this way.

The wall portion 140 is formed to surround the light emitting diode chip 120 on which the phosphor plate 130 is mounted, and to cover the upper portion of the substrate 110 . The wall portion 140 may be formed of opaque silicon or the like, and may be formed of white in this embodiment. In addition, the wall portion 140 is formed to surround the side surface of the LED chip 120 , and thus may include particles capable of reflecting light emitted from the LED chip 120 .

At this time, the wall portion 140 may be formed to surround a part of the side surface of the phosphor plate 130 in order to prevent the phosphor plate 130 mounted on the light emitting diode chip 120 from being separated from the light emitting diode chip 120 . That is, the wall portion 140 may be formed in a state where the phosphor plate 130 is attached to the light emitting diode chip 120 .

Wherein, in the process of forming the wall portion 140 in the state where the width of the phosphor plate 130 is larger than that of the LED chip 120, a gap G (gap) may be formed between the phosphor plate 130, the LED chip 120, and the wall portion 140. ). As shown in FIG. 2 , the gap G may be formed at the lower portion of the phosphor plate 130 beyond the outside of the LED chip 120 when the phosphor plate 130 is mounted on the upper portion of the LED chip 120 . That is, the wall portion 140 is formed to surround the side surface of the light-emitting diode chip 120 including a part of the phosphor plate 130, and the wall portion 140 is not filled to the boundary between the phosphor plate 130 and the light-emitting diode chip 120, so that a gap can be formed. g. Therefore, the gap G may be formed in a shape surrounding at least a part of the outer peripheral surface of the light emitting diode chip 120 .

With the gap G formed between the phosphor plate 130, the LED chip 120, and the wall portion 140 in this way, the light emitted by the LED chip 120 can be released into the gap G formed on the side surface of the LED chip 120, and released into the gap G. The light reflected by the wall portion 140 may be reflected toward the phosphor plate 130 side (that is, the upper portion of the light emitting diode package 100 ). That is, the surface of the wall portion 140 surrounding the gap G may be the reflective surface 140a.

In addition, the gap G is formed to surround at least a part of the outer peripheral surface of the light emitting diode chip 120. As described above, the gap G is formed as an empty space, so light is emitted from the light emitting diode chip 120 to the side of the gap G and simultaneously The medium changes and refracts. Therefore, the power of light at the reflective surface 140a can be increased due to the difference in refractive index.

Further, the bonding member used to bond the phosphor plate 130 to the LED chip 120 is made of a transparent material, so by means of the refractive index of the bonding member and the refractive index of the gap G, the reflection on the reflective surface 140a can be improved. the power of light.

The shape of the gap G is formed with the formation of the wall portion 140 , and the size and shape of the gap G vary depending on the extent to which the wall portion 140 surrounds the side surface of the LED chip 120 while covering a part of the side surface of the phosphor plate 130 . The reflective surface 140 a that is the surface of the wall portion 140 surrounding the gap G may be formed in a shape that protrudes toward the light emitting diode chip 120 as shown in FIG. 2 . Of course, in this embodiment, although it is shown that the reflective surface 140a is formed in a convex shape, the shape of the reflective surface 140a may be deformed as required.

As an example, when the LED package 100 of this embodiment is applied to an automobile headlight, the automobile headlight is manufactured according to regulations on light distribution, so the LED package 100 also needs to be manufactured accordingly. The light-emitting diode package 100 of this embodiment is just as described above, the side surface of the light-emitting diode chip 120 is formed to be surrounded by the wall portion 140, and the gap G surrounds the outer peripheral surface of the light-emitting diode chip 120, so the light emitted by the light-emitting diode chip 120 can only go to The upper part of the LED chip 120 is released. Therefore, as shown in this embodiment, the light emitted by the light emitting diode package 100 is released only to the upper part, which can facilitate the design of optical elements so as to meet the light distribution requirements of automobile headlights.

A lens 150 may be formed on an upper portion of the substrate 110 . The shape of the lens 150 can be formed in various shapes according to needs. In the present embodiment, the lens 150 can include: a plate portion 152 formed in a quadrangular shape with the same width as the substrate 110; 152 The upper part, like the dome shape, is shaped to form part of a ball. Accordingly, the lens 150 may be formed to cover the phosphor plate 130 and the wall part 140 formed on the upper portion of the substrate 110 .

At this time, the dome portion 154 of the lens 150 may be formed only on the upper portion of the phosphor plate 130 , and the width of the dome portion 154 may be larger than that of the phosphor plate 130 as needed. The plate portion 152 may be formed to cover the entire substrate 110 , but in this embodiment, the plate portion 152 may also be formed to cover an upper part of the wall portion 140 formed to cover the upper portion of the substrate 110 .

Therefore, the light emitted by the light emitting diode chip 120 through the phosphor plate 130 can be mostly released to the outside through the emission surface of the dome 154, but depending on the situation, there may be reflection from the inside of the emission surface of the dome 154 to the substrate 110 side. Light. The wall portion 140 may be formed to cover the entire substrate 110 in order to reflect the light reflected in this way to the exit surface side of the dome portion 154 again. In this case, the wall portion 140 may be formed to be larger than the width of the dome portion 154 without covering the entire substrate 110 , and the light rereflected from the wall portion 140 may be emitted to the outside through the dome portion 154 . Alternatively, the wall portion 140 may be formed larger than the plate portion 152 so that the wall portion 140 is exposed to the outside of the plate 152 .

Wherein, the plate portion 152 and the dome portion 154 included in the lens 150 may be integrally formed.

FIG. 3 is a diagram for explaining a state of attaching a phosphor plate to a light-emitting diode chip of the light-emitting diode package according to an embodiment of the present invention.

In this embodiment, the LED package 100 is as described above, in the state where the LED chip 120 is mounted on the upper portion of the substrate 110 , the phosphor plate 130 can be mounted on the upper portion of the LED chip 120 . At this time, the phosphor plate 130 should be formed so as to cover the entire light emitting diode chip 120 .

Therefore, when attaching the phosphor plate 130 manufactured separately on the top of the LED chip 120, if the phosphor plate 130 and the LED chip 120 have the same width, it is necessary to accurately arrange the phosphor plate 130 on the LED chip 120. Mounting is performed on the top of the chip 120 . However, since it is not easy to accurately arrange and mount the phosphor plates 130 on the top of the LED chips 120 , the width of the phosphor plates 130 must be larger than that of the LED chips 120 .

Therefore, as shown in (a) of FIG. 3 , the fluorescent plate can be mounted on the upper part of the LED chip 120 based on the alignment point A formed on the substrate 110 . At this time, in the state where the light-emitting diode chip 120 is mounted on the correct position of the substrate 110, if the phosphor plate 130 is mounted, as shown in FIG. The center of 130 coincides.

However, even if the light-emitting diode chip 120 is not mounted on the correct position of the substrate 110, but is slightly staggered, as shown in FIG. . At this time, the light emitting diode chip 120 may be arranged in a state where the centers of the phosphor plate 130 do not coincide with each other. In addition, even if the LED chip 120 is mounted at the correct position, if the phosphor plate 130 is not mounted at the correct position, the centers of the light emitting diode chip 120 and the phosphor plate 130 will not coincide. However, phosphor plate 130 may be formed larger than light emitting diode chip 120 , and may be mounted so as to cover entire light emitting diode chip 120 .

Here, instead of manufacturing one phosphor plate 130 independently according to the size used in the light emitting diode package 100 , the phosphor plate 130 produced relatively large can be cut and manufactured. Therefore, a predetermined tolerance occurs in the width of the truncated phosphor plate 130 . In addition, for the light emitting diode chip 120 , the width may not be fixed due to predetermined tolerances. Therefore, as described above, the width of the phosphor plate 130 is made relatively larger than the width of the light emitting diode chip 120 so that the phosphor plate 130 can cover the entire upper surface of the light emitting diode chip 120 . Therefore, it is possible to prevent the light emitted from the light emitting diode chip 120 from being released to the outside without passing through the phosphor plate 130 .

In addition, above, the case where the phosphor plate 130 is arranged on the top of the light emitting diode chip 120 in the state where the light emitting diode chip 120 is first mounted on the substrate 110 has been described. In this state, the LED chip 120 can also be mounted on the substrate 110 . This is because the manufacturing process may vary according to the manufacturing process of the light emitting diode package 100 of this embodiment.

As described above, according to the embodiment with reference to the accompanying drawings, the utility model has been specifically described, but the embodiment is only a preferred example of the utility model for illustration, so it should not be understood that the utility model is limited to The embodiments and the scope of rights of the present utility model should be understood as technical solutions and their equivalent concepts.

Claims (17)

1. A light-emitting diode package, characterized in that, comprising: Substrate; More than one LED chip mounted on the substrate; A phosphor plate, which is arranged on the one or more light-emitting diode chips, and performs wavelength conversion on the light emitted by the one or more light-emitting diode chips; and a wall portion, which is disposed on the substrate and surrounds the one or more light emitting diode chips; The phosphor plate covers the entire upper surface of the one or more LED chips, The width of the phosphor plate is greater than the width of the one or more LED chips. 2. The LED package according to claim 1, characterized in that: The wall portion covers a part of at least one of side surfaces of the one or more light emitting diode chips. 3. The LED package according to claim 1, characterized in that: The wall part covers a part of at least one of the sides of the phosphor plate. 4. The LED package according to claim 3, characterized in that: The wall portion covers a part of at least one side surface of the LED chip so as to form a gap surrounded by the phosphor plate, the LED chip, and the wall portion. 5. The LED package according to claim 4, characterized in that: The gap surrounds at least a part of the outer peripheral surface of the LED chip. 6. The LED package according to claim 4, characterized in that: The inner surface of the wall surrounding the gap is a reflective surface. 7. The LED package according to claim 6, characterized in that: The reflective surface has a shape protruding toward the direction of the LED chip. 8. The LED package according to claim 1, characterized in that: The phosphor plate contains one or more phosphors. 9. The LED package according to claim 1, characterized in that: The center of the phosphor plate coincides with the center of the LED chip. 10. The LED package according to claim 1, characterized in that: The center of the phosphor plate deviates from the center of the LED chip. 11. The LED package according to claim 1, characterized in that: The substrate includes alignment points for aligning the phosphor panels. 12. The LED package according to claim 1, wherein the substrate comprises: base; a first lead and a second lead formed on the substrate and electrically connected to the one or more LED chips; and The first substrate pad and the second substrate pad are formed under the base and are electrically connected to the first lead and the second lead respectively. 13. The LED package according to claim 12, characterized in that: The substrate also includes a first through hole and a second through hole, the first through hole and the second through hole penetrate the base, so that the first lead and the second lead are connected to the first substrate pad and the second lead respectively. The second substrate pads are electrically connected. 14. The LED package according to claim 12, characterized in that: The substrate further includes a heat dissipation pad for dissipating heat generated by the light emitting diode chip under the base. 15. The LED package according to claim 1, further comprising: The lens covers the light-emitting diode chip on the upper part of the substrate, and emits the light emitted by the light-emitting diode chip. 16. The LED package according to claim 15, wherein the lens comprises: a plate portion covering the light emitting diode chip; and The dome portion is formed on the upper portion of the plate portion, and emits the light emitted by the light emitting diode chip to the outside. 17. The LED package according to claim 16, characterized in that: The width of the wall portion is greater than the width of the dome.