CN205788076U - A kind of heat-radiating device for main - Google Patents

Abstract

The utility model relates to the technical field of computer heat dissipation, and discloses a computer motherboard heat dissipation device, comprising: a horizontal heat conduction pad, a fan, a plurality of heat dissipation fins, an annular heat dissipation bottom plate, a heat pipe heat exchanger, a mainboard shell, and an air intake and exhaust device , the horizontal heat conduction pad is installed on the mainboard CPU, and it fits with the mainboard CPU. The fan is fixed on the horizontal heat conduction pad, located directly above the mainboard CPU. The annular heat dissipation bottom plate is installed on the outer periphery of the mainboard CPU. The radial direction is evenly arranged on the annular heat dissipation bottom plate. One end of the heat pipe heat exchanger is connected to a horizontal heat conduction pad, and the other end of the heat pipe heat exchanger runs through multiple heat dissipation fins. The air intake and exhaust device includes an air inlet, an air outlet and an exhaust fan. The heat dissipation device for the mainboard of the computer has high heat dissipation efficiency, is suitable for heat dissipation of the mainboard of a high-frequency and high-speed CPU, and improves the service life of the mainboard of the computer.

Description

A cooling device for a computer motherboard

technical field

The utility model relates to the technical field of computer heat dissipation, in particular to a computer motherboard heat dissipation device.

Background technique

With the advancement of science and technology, computers equipped with high-frequency CPUs and graphics cards exceeding 1Ghz have become the mainstream of the market, and the heat dissipation of the hardware has become a top priority. If the heat dissipation is not enough, it will cause computer failures or even Crash, burn.

At present, the heat dissipation of the computer motherboard is mainly to dissipate heat from the CPU through the heat sink and the fan. The heat sink is installed on the CPU, and the fan is installed on the heat sink. , This heat dissipation method has low heat dissipation efficiency and is not suitable for heat dissipation of high-frequency and high-speed CPU motherboards.

How to improve the heat dissipation efficiency of the computer motherboard becomes the key to improving the life of the computer motherboard.

Utility model content

The utility model provides a heat dissipation device for a computer mainboard, which has high heat dissipation efficiency, is suitable for the heat dissipation of the mainboard of a high-frequency and high-speed CPU, and simultaneously improves the service life of the computer mainboard.

The utility model provides a heat dissipation device for a computer motherboard, comprising: a horizontal heat conduction pad, a fan, a plurality of heat dissipation fins, an annular heat dissipation bottom plate, a heat pipe heat exchanger, a main board shell, and an air intake and exhaust device. The horizontal heat conduction pad is installed on the On the CPU of the main board, it is attached to the CPU of the main board. The fan is fixed on the horizontal thermal pad, which is located directly above the CPU of the main board. The annular heat dissipation bottom plate is installed on the outer periphery of the CPU of the main board. On the heat dissipation base plate, one end of the heat pipe heat exchanger is connected to a horizontal heat conduction pad, and the other end of the heat pipe heat exchanger runs through a plurality of heat dissipation fins. It is arranged on the main board shell, the air inlet is provided with an air filter, and the exhaust fan is arranged at the air outlet, and the fan and the exhaust fan are respectively connected to the power module on the main board.

Further, both the heat pipe heat exchanger and the horizontal heat conduction pad are made of pure copper.

Further, the plurality of heat dissipation fins and the annular heat dissipation bottom plate are all made of pure aluminum.

Further, the heights of the plurality of cooling fins are equal to the heights of the fans.

Compared with the prior art, the utility model has the beneficial effects of:

The utility model quickly transfers the heat generated by the CPU of the main board to the cooling fins through the horizontal heat conduction pad, and the fan draws the heat from the horizontal heat conduction pad and radiates it from the top of the fan, which is beneficial to the rapid cooling of the horizontal heat conduction pad and makes the heat generated by the CPU of the main board quickly Conducted out, at the same time, the heat is discharged along the gaps in the middle of multiple heat dissipation fins, and the heat on the multiple heat dissipation fins is taken away at the same time, to dissipate heat from the CPU of the motherboard, and the heat dissipation effect is good. In addition, the external cold air enters the motherboard shell from the air inlet , Air dust is removed through the air filter, and the hot air in the motherboard shell is drawn out by the exhaust fan through the air outlet, and the heat dissipation effect of the motherboard is improved through active ventilation, which is suitable for the heat dissipation of the motherboard with high-frequency and high-speed CPU, and at the same time improves the use of the computer motherboard life.

Description of drawings

Fig. 1 is a structural schematic diagram of a cooling device for a computer motherboard provided by the utility model.

Fig. 2 is a schematic cross-sectional structure diagram of a cooling device for a computer motherboard provided by the utility model.

Explanation of reference signs:

1-heat pipe heat exchanger, 2-fan, 3-radiating fins, 4-circular cooling bottom plate, 5-mainboard CPU, 6-horizontal thermal pad.

detailed description

A specific embodiment of the present invention will be described in detail below in conjunction with the accompanying drawings, but it should be understood that the protection scope of the present invention is not limited by the specific embodiment.

As shown in Figure 1 and Figure 2, a computer motherboard heat dissipation device provided by the embodiment of the utility model includes: a horizontal heat conduction pad 6, a fan 2, a plurality of heat dissipation fins 3, an annular heat dissipation bottom plate 4, and a heat pipe heat exchanger 1 , the motherboard shell and the air intake and exhaust device, the horizontal heat conduction pad 6 is installed on the motherboard CPU 5, and is attached to the motherboard CPU, the fan 2 is fixed on the horizontal heat conduction pad 6, and is located directly above the motherboard CPU 5, and the annular heat dissipation bottom plate 4 Installed on the outer periphery of the motherboard CPU 5, a plurality of cooling fins 3 are evenly arranged on the annular cooling base plate 4 in the radial direction of the annular cooling base plate 4, and one end of the heat pipe heat exchanger 1 is connected to a horizontal heat conduction pad 6, and the heat pipe heat exchanger 1 The other end runs through a plurality of heat dissipation fins 3, and the air inlet and exhaust device includes an air inlet, an air outlet and an exhaust fan, the air inlet and the air outlet are all arranged on the main board shell, the air inlet is provided with an air filter, and the exhaust fan is set At the air outlet, the fan and exhaust fan are respectively connected to the power module on the main board.

The heat generated by the mainboard CPU 5 is quickly transferred to the heat dissipation fins 3 through the horizontal heat conduction pad 6, and the fan 2 draws the heat from the horizontal heat conduction pad and dissipates it from the top of the fan 2, which is conducive to the rapid cooling of the horizontal heat conduction pad 6, so that the main board CPU 5 The generated heat is quickly conducted out, and at the same time, the heat is discharged along the gaps in the middle of the plurality of heat dissipation fins 3, and the heat on the plurality of heat dissipation fins 3 is taken away to dissipate heat from the CPU 5 of the motherboard, and the heat dissipation effect is good. In addition, the external cold air From the air inlet into the main board case, air dust is removed through the air filter, and the hot air in the main board case is drawn out by the exhaust fan through the air outlet, and the heat dissipation effect of the main board is improved through active ventilation.

Further, both the heat pipe heat exchanger 1 and the horizontal heat conduction pad 6 are made of pure copper.

Pure copper has good thermal conductivity and fast heat conduction.

Further, the plurality of heat dissipation fins 3 and the annular heat dissipation bottom plate 4 are all made of pure aluminum.

Pure aluminum, good heat dissipation.

Further, the height of the plurality of cooling fins 3 is equal to the height of the fan 2 .

The cooling fins 3 are not superimposed on the fan 2, and are at the same height as the fan 2, which increases the cooling area, improves the cooling effect, and reduces the overall thickness of the computer motherboard.

The above disclosures are only a few specific embodiments of the present invention, but the embodiments of the present invention are not limited thereto, and any changes conceivable by those skilled in the art should fall within the scope of protection of the present invention.

Claims (4)

1. a heat-radiating device for main, it is characterised in that including: horizontal heat conductive pad, fan, Multiple radiating fins, circular radiating base plate, heat exchange of heat pipe, mainboard housing and air intake and extractor fan, Horizontal heat conductive pad is arranged on mainboard CPU, fits with mainboard CPU, and fan is fixed on horizontal heat conductive pad, Being positioned at the surface of mainboard CPU, circular radiating base plate is arranged on the periphery of mainboard CPU, multiple radiating fins Sheet is uniformly arranged on circular radiating base plate with the radial direction of circular radiating base plate, one end of heat exchange of heat pipe Connecting horizontal heat conductive pad, the other end of heat exchange of heat pipe runs through multiple radiating fin, air intake and extractor fan bag Include air inlet, air outlet and air exhauster, air inlet and air outlet to be arranged on mainboard housing, on air inlet Being provided with air filter screen, air exhauster is arranged at air outlet, fan and air exhauster respectively with the power supply on mainboard Module connects.

2. heat-radiating device for main as claimed in claim 1, it is characterised in that described heat pipe changes Hot device and horizontal heat conductive pad are fine copper material.

3. heat-radiating device for main as claimed in claim 1, it is characterised in that the plurality of scattered Hot fin and circular radiating base plate are fine aluminium material.

4. heat-radiating device for main as claimed in claim 1, it is characterised in that the plurality of scattered The height of hot fin is concordant with the height of fan.